Preparation method of clean anti-static functional resin

Abstract

The invention provides a preparation method of clean anti-static functional resin, and relates to the technical field of IC component auxiliary equipment, the resin is prepared from the following materials: an anti-static material, an additive and substrate resin, and the mass ratio of the anti-static material to the additive to the substrate resin is (10-18): (4-12): (70-86). According to the preparation method, various antistatic agents are combined and applied, so that the antistatic agents are uniformly distributed in the resin, a special and uniform three-dimensional conductive path is formed in the product after injection molding, and the dust falling of the product is reduced to be lower while the anti-static function is met.

Description

Technical Field

[0001] The invention relates to the technical field of IC component auxiliary equipment, and in particular to a method for preparing a clean antistatic functional resin. Background Art

[0002] IC TRAY is a packaging tray used for chip (IC) packaging and testing. It is formed by BGA, QFP and other packages. It is a tray for storing integrated circuit chips to protect the chips from static electricity, mechanical damage and environmental pollution. Its standards mainly include the following aspects:

[0003] 1. Dimension standards: The dimensions of the IC Tray should comply with international standards. Common dimension standards include JESD625B and EIA-481D. JESD625B specifies the requirements for the IC Tray's external dimensions, internal space dimensions, chip placement and quantity.

[0004] 2. Material standards: The materials of IC Tray should meet environmental protection requirements. Commonly used materials include polypropylene.

[0005] (PP), polycarbonate (PC), polyphenylene ether (PPO), etc. These materials have good heat resistance, corrosion resistance and mechanical strength, and can protect the chip from mechanical damage.

[0006] 3. Electrostatic protection standards: IC Tray should have good electrostatic protection performance to prevent the chip from being damaged by static electricity. Common protection standards include ANSI / ESD S20.20 and JEDECJESD625B. These standards specify the requirements for the electrostatic protection performance of IC Tray, such as surface resistance, volume resistance, electrostatic discharge, etc.

[0007] 4. Labeling standards: IC Trays should have clear labels for easy identification and management. Common labeling contents include chip model, quantity, production date, tray number, etc. These labels should comply with international standards such as ISO / IEC 15415 and ISO / IEC 15418.

[0008] 5. Packaging standards: IC Tray should comply with international packaging standards for easy transportation and storage. Common packaging standards include ISO9001 and ISO14001. These standards specify the packaging requirements of IC Tray, such as packaging materials, packaging methods, transportation conditions, etc.

[0009] In short, the standards of IC Tray involve dimensions, materials, electrostatic protection, identification and packaging. The formulation and implementation of these standards can ensure the quality and reliability of IC Tray, thereby protecting the chips from damage.

[0010] In the prior art, in order to improve the electrostatic dissipation performance of resin materials, antistatic materials are usually added during the material production process to achieve its electrostatic protection function. However, IC Tray products produced by traditional modified antistatic materials are often accompanied by a certain amount of powder shedding during use, causing the chip (IC) to be contaminated and affecting the stability of its subsequent performance. Summary of the invention

[0011] The purpose of the present invention is to solve the technical problem that during the use of the IC Tray product prepared in the prior art, a certain amount of powder often falls off, causing the chip (IC) to be contaminated and affecting the stability of its subsequent performance.

[0012] In order to achieve the above object, the present invention adopts the following technical solutions:

[0013] A method for preparing a clean antistatic functional resin. The resin is prepared from the following materials: an antistatic material, an additive and a base resin. The mass ratio of the antistatic material, the additive and the base resin is 10-18:4-12:70-86.

[0014] Preferably, the antistatic material includes carbon fiber and carbon black.

[0015] Preferably, the additive is a combination of a monovalent antioxidant and polyethylene or a divalent antioxidant and polyethylene.

[0016] Preferably, the monovalent antioxidant is a conventional phenolic compound.

[0017] Preferably, the binary antioxidant is a conventional amine compound.

[0018] Preferably, the base resin is polyphenylene ether having an intrinsic viscosity of 0.3 to 0.45, 0.45 to 0.6, used alone or in combination.

[0019] Preferably, the preparation method comprises the following specific steps:

[0020] S1: Use a high-speed mixer to pre-mix and disperse the antistatic material;

[0021] S2: uniformly mixing the antistatic substance, the additive and the base resin to obtain a mixture;

[0022] S3: adding the mixed material into an extruder for mixing to obtain a mixed material;

[0023] S4: The mixed material is pressed into a hole die for shaping, and then pelletized by a pelletizer to obtain a modified resin with uniform particle size.

[0024] The present application also provides a clean antistatic functional resin, which is characterized by being prepared using the above-mentioned preparation method.

[0025] The present application also provides an application of a clean antistatic functional resin in preparing a packaging tray for chip packaging testing, wherein the resin is prepared using the above-mentioned preparation method.

[0026] The preparation method described above uses a combination of multiple antistatic agents so that each component of the antistatic agent is evenly distributed in the resin, so that after injection molding, a special and uniform three-dimensional conductive path is formed inside the product, which not only meets the antistatic function but also reduces the dust shedding of the product to a minimum. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with specific embodiments.

[0028] A method for preparing a clean antistatic functional resin. The resin is prepared from the following materials: an antistatic material, an additive and a base resin. The mass ratio of the antistatic material, the additive and the base resin is 10-18:4-12:70-86.

[0029] In one embodiment, the antistatic material includes carbon fiber and carbon black; the additive is a combination of a monovalent antioxidant and polyethylene or a divalent antioxidant and polyethylene, preferably, the monovalent antioxidant is a conventional hindered phenol antioxidant, specifically, the monovalent antioxidant is methylene-(3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionic acid tetramethane, the divalent antioxidant is a conventional amine antioxidant, in one embodiment, the divalent antioxidant is diphenyl paraphenylenediamine. By using an antioxidant, oxidative cracking is prevented during processing; the base resin is polyphenylene ether, in one embodiment, the base resin is used alone or in combination with polyphenylene ether having an inherent viscosity of 0.3 to 0.45, 0.45 to 0.6.

[0030] The specific steps of the preparation method are as follows:

[0031] S1: Use a high-speed mixer to pre-mix and disperse the antistatic material;

[0032] S2: uniformly mixing the antistatic substance, the additive and the base resin to obtain a mixture;

[0033] S3: adding the mixed material into an extruder for mixing to obtain a mixed material;

[0034] S4: The mixed material is pressed into a hole die for shaping, and then pelletized by a pelletizer to obtain a modified resin with uniform particle size.

[0035] The present application also provides the use of a clean antistatic functional resin in preparing a packaging tray for chip packaging testing.

[0036] The above contents are described below in conjunction with specific embodiments:

[0037] Embodiment 1:

[0038] Material preparation: The mass ratio of antistatic material, additive and base resin is 10:4:86, among which the antistatic material is carbon fiber and carbon black, and the mass ratio of carbon fiber to carbon black is 6:4.

[0039] The additive is a combination of a monovalent antioxidant and polyethylene, and the mass ratio of the monovalent antioxidant to the polyethylene is 1:3.

[0040] The base resin is polyphenylene ether with an inherent viscosity of 0.3 to 0.45;

[0041] The above materials are used to prepare a modified resin 1 using the above preparation method, and a packaging tray 1 is prepared by the modified resin 1;

[0042] Embodiment 2:

[0043] In this embodiment, the mass ratio of the antistatic material, the additive and the base resin is 18:5:77, wherein the mass ratio of the carbon fiber to the carbon black in the antistatic material is 15:3.

[0044] The additive is a combination of a monovalent antioxidant and polyethylene, and the mass ratio of the monovalent antioxidant to the polyethylene is 1.5:3.5.

[0045] The base resin is polyphenylene ether with an inherent viscosity of 0.45 to 0.6;

[0046] A modified resin 2 is obtained by preparing the above materials, and a packaging tray 2 is obtained by the modified resin 2;

[0047] Embodiment 3:

[0048] In this embodiment, the mass ratio of the antistatic material, the additive and the base resin is 14:8:78, wherein the mass ratio of the carbon fiber to the carbon black in the antistatic material is 10:4.

[0049] The additive is a combination of a binary antioxidant and polyethylene, and the mass ratio of the binary antioxidant to the polyethylene is 1.5:6.5.

[0050] The base resin is a combination of polyphenylene ether with an inherent viscosity of 0.3 to 0.45 and polyphenylene ether with an inherent viscosity of 0.45 to 0.6, and the mass ratio of the polyphenylene ether with an inherent viscosity of 0.3 to 0.45 to the polyphenylene ether with an inherent viscosity of 0.45 to 0.6 is:

[0051] A modified resin 3 is obtained by preparing the above materials, and a packaging tray 3 is obtained by the modified resin 3;

[0052] Comparative Example:

[0053] The comparative example of this application adopts a packaging pallet prepared by a friendly company.

[0054] The following is a specific verification experiment:

[0055] Verification experiment 1: physical performance comparison:

[0056] Table 1: Comparison of physical properties of various examples

[0057] Test items unit Specification range Example 1 Example 2 Example 3 Comparative Example 1 (Company A) Heat Deflection Temperature HDT ℃ 160-180 high middle middle Low proportion <![CDATA[g / cm 2 ]]> 1.13-1.30 Low middle Low high Tensile Strength <![CDATA[kgf / cm 2 ]]> 900-1600 high middle middle Low Elongation at break ％ 2-8 middle middle middle Low Bending Strength <![CDATA[kgf / cm 2 ]]> 1200-1700 high middle high Low Flexural modulus <![CDATA[kgf / cm 2 ]]> 60000-100000 high high middle middle IZOD Impact Strength kg-cm / cm 4.5-10 high middle high Low

[0058] As shown in Table 1, it can be seen that among the packaging pallets prepared by the above embodiments, the physical performance parameters of Embodiment 1 are the best, and the physical performance of the three embodiments of the present application are all better than the packaging pallets prepared by friendly manufacturers in the prior art.

[0059] Verification experiment 2: strength comparison:

[0060] Table 2: Strength comparison of various embodiments

[0061]

[0062]

[0063] The higher the flexural strength, the better the wear resistance, and the less likely it is to chip due to friction during use. As shown in Table 2, the flexural strength in this embodiment is higher than that in the comparative example.

[0064] Verification experiment three: Comparison of specific gravity of packaging pallets:

[0065] Table 3: Product specific gravity test table

[0066] Material Specific Gravity 1 Specific Gravity 2 Specific Gravity 3 average value Example 1 1.166 1.163 1.168 1.166 Example 2 1.199 1.197 1.217 1.204 Example 3 1.201 1.203 1.208 1.204 Comparative Example 1 (Company A) 1.286 1.283 1.284 1.284 Comparative Example 2 (Company B) 1.202 1.206 1.223 1.210 Comparative Example 3 (Company C) 1.183 1.204 1.188 1.191

[0067] The lower the specific gravity, the less inorganic matter is added, and the chip shedding performance during use will be better. Combined with Table 3, it can be seen that the product prepared in Example 1 of the present application has a better specific gravity than that prepared by competitors.

[0068] Verification experiment 4: Vibration chip drop comparison:

[0069] This application adopts the simulated vibration test method and judgment criteria shown in the following table:

[0070] Table 4: Vibration test methods and criteria

[0071]

[0072] The following table is a comparison of vibration chip removal experiments on different packaging trays (empty trays):

[0073] Table 5: Comparison of empty plate vibration chip drop test

[0074]

[0075] In summary, the present application provides a method for preparing a clean antistatic functional resin. Due to the combined use of multiple antistatic agents, each component of the antistatic agent is evenly distributed in the resin, so that after injection molding, a special and uniform three-dimensional conductive path is formed inside the product, which not only meets the antistatic function, but also reduces the dust shedding of the product to a lower level.

Claims

1. A method for preparing a clean antistatic functional resin, characterized in that: The resin is prepared from the following materials: an antistatic material, an additive and a base resin, and the mass ratio of the antistatic material, the additive and the base resin is 10-18:4-12:70-86.

2. The method for preparing a clean antistatic functional resin according to claim 1, characterized in that: The antistatic material includes carbon fiber and carbon black.

3. The method for preparing a clean antistatic functional resin according to claim 1, characterized in that: The additive is a combination of a monovalent antioxidant and polyethylene or a divalent antioxidant and polyethylene.

4. The method for preparing a clean antistatic functional resin according to claim 3, characterized in that: The monovalent antioxidant is a conventional phenolic compound.

5. The method for preparing a clean antistatic functional resin according to claim 3, characterized in that: The binary antioxidant is a conventional amine compound.

6. The method for preparing a clean antistatic functional resin according to claim 1, characterized in that: The base resin is polyphenylene ether with an intrinsic viscosity of 0.3-0.45, 0.45-0.6, used alone or in combination.

7. The method for preparing a clean antistatic functional resin according to claim 1, characterized in that: The specific steps of the preparation method are as follows: S1: Use a high-speed mixer to pre-mix and disperse the antistatic material; S2: uniformly mixing the antistatic substance, the additive and the base resin to obtain a mixture; S3: adding the mixed material into an extruder for mixing to obtain a mixed material; S4: The mixed material is pressed into a hole die for shaping, and then pelletized by a pelletizer to obtain a modified resin with uniform particle size.

8. A clean antistatic functional resin, characterized in that: The method is prepared by any one of claims 1 to 7.

9. Application of a clean antistatic functional resin in preparing a packaging tray for chip packaging testing, characterized in that: The resin is prepared using any one of the preparation methods of claims 1-7.

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