BGA solder ball coplanarity measuring device

Abstract

The invention provides a BGA solder ball coplanarity measuring device, which comprises a fixing unit and a detection unit, and is characterized in that the fixing unit comprises an adjusting assembly and a fixing assembly which is rotatably connected to the adjusting assembly around a first axis, the adjusting assembly is rotatably connected to a workbench around a second axis, and the fixing assembly is used for fixing a to-be-measured workpiece; the detection unit comprises a displacement assembly and a detection assembly connected to the displacement assembly, the displacement assembly comprises a first driving mechanism arranged on the workbench, a second driving mechanism connected to the first driving mechanism and a third driving mechanism connected to the second driving mechanism, and the detection assembly is connected to the third driving mechanism; the detection assembly is used for detecting the solder ball height of the to-be-detected workpiece. The invention provides a BGA (Ball Grid Array) solder ball coplanarity measuring device, and aims to solve the problem that the accuracy of a detection result is insufficient due to the fact that BGA solder ball coplanarity detection depends on an illumination projection or reflection mode and is greatly influenced by illumination intensity, solder ball spacing and density of scanning contour points in the prior art.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic packaging, and more specifically, relates to a BGA solder ball coplanarity measuring device. Background Art

[0002] With the rapid development of chip integration technology, BGA packaging has become a mainstream electronic packaging technology that has developed rapidly in recent years. BGA packaging technology is widely used in the manufacture of modern electronic products. It uses spherical solder joints to connect chips and printed circuit boards. It has high density, reliability and good heat dissipation performance. Compared with traditional packaging methods, BGA packaging is more suitable for chips with high integration and high power consumption, and the importance of corresponding welding quality detection technology is becoming increasingly prominent. However, the property that has the greatest impact on the quality of BGA packaged products and is also the most difficult to detect is the coplanarity of BGA solder balls, that is, the height difference between the spherical solder joints placed on the substrate.

[0003] Pin coplanarity is one of the most important indicators for testing whether a device is qualified. During surface mounting, the solder balls and solder paste will be re-melted after reflow to form solder joints, thus achieving the connection between the chip and the chip substrate, thereby overcoming the coplanarity problem caused by solder balls of different heights. However, if the coplanarity of the solder ball pins of the device exceeds the standard, individual solder balls will have poor contact with the board during installation, which will lead to missed connections and false connections.

[0004] At present, the structured light projection method is often used for BGA solder ball coplanarity testing, but this method has the following two main problems: First, the surface of the BGA solder ball has a mirror reflection property, and the base of the BGA solder ball is generally a dark material. When the structured light is projected onto these two surfaces, the contrast is poor and the light source intensity is difficult to adjust; second, the spacing of the BGA solder ball array is very small, and they will block each other during projection, and the common defects on the BGA solder balls will also cause the projection of the structured light to be missing. The laser reflection method is prone to distortion points when testing the coplanarity of BGA solder balls. The scanning of the 3D contour needs to be combined with the 3D cloud map. The measurement accuracy is limited by the density of the scanned contour points. The low density makes it easy to miss the highest point, and the 3D contour cloud map capture point requires cumbersome data processing technology to achieve. Summary of the invention

[0005] The purpose of the present invention is to provide a BGA solder ball coplanarity measurement device, aiming to solve the problem that the BGA solder ball coplanarity detection in the prior art relies on light projection or reflection, which is greatly affected by light intensity, solder ball spacing, and density of scanning contour points, resulting in insufficient detection result accuracy.

[0006] To achieve the above object, the technical solution adopted by the present invention is: In a first aspect, a BGA solder ball coplanarity measurement device is provided, comprising: A fixing unit, comprising an adjusting component and a fixing component rotatably connected to the adjusting component around a first axis, the adjusting component rotatably connected to the workbench around a second axis, the first axis being perpendicular to the second axis, and the first axis and the second axis both forming an angle with the up-down direction, the fixing component being used to fix the workpiece to be measured; and The detection unit includes a displacement component and a detection component connected to the displacement component, the displacement component includes a first driving mechanism arranged on a workbench, a second driving mechanism connected to the first driving mechanism and a third driving mechanism connected to the second driving mechanism, the detection component is connected to the third driving mechanism, the first driving mechanism drives the second driving mechanism to move along the first axis, the second driving mechanism drives the third driving mechanism to move in the up and down directions, the third driving mechanism drives the detection component to move along the second axis, and the detection component is used to detect the height of the solder ball of the workpiece to be measured.

[0007] In a possible implementation, the BGA solder ball coplanarity measuring device further includes a control unit, and the adjusting component, the fixing component, the displacement component and the detecting component are respectively communicatively connected to the control unit.

[0008] In a possible implementation, the detection component includes: a first detector connected to the third driving mechanism, the first detector being used to detect an angle between the substrate of the workpiece to be measured and the first detector; and The second detector is connected to the third driving mechanism and is located on the same mounting surface of the third driving mechanism as the first detector. The second detector is used to detect the height of the solder ball of the workpiece to be tested.

[0009] In a possible implementation, the detection component further includes a position detector connected to the third drive mechanism, and the position detector, the first drive mechanism, the second drive mechanism, and the third drive mechanism are respectively communicatively connected to a controller.

[0010] In a possible implementation, the first driving mechanism includes: First Drive; A first screw rod is connected to the first driver, the axis of the first screw rod is parallel to the first axis, and the first driver controls the first screw rod to rotate around its own axis; A first guide rod, arranged parallel to one side of the first screw rod; and The first mounting seat is threadedly connected to the first screw rod and slidably connected to the first guide rod along the first axis. The second driving mechanism is connected to the first mounting seat.

[0011] In a possible implementation, the second driving mechanism includes: Second drive; A second screw, one end of which is connected to the second driver, and the other end of which is connected to a bearing, the bearing being connected to the first mounting seat, the axis of the second screw being parallel to the up and down direction, and the second driver controlling the second screw to rotate around its own axis; A second guide rod, arranged parallel to one side of the second screw rod; and The second mounting seat is connected to the second screw rod, and is slidably connected to the second guide rod along the up-down direction. The third driving mechanism is connected to the second mounting seat.

[0012] In a possible implementation, the third driving mechanism includes: Third Drive; A third screw, one end of which is connected to the third driver, and the other end of which is connected to a bearing, the bearing being connected to the second mounting seat, the axis of the third screw being parallel to the second axis, and the third driver controlling the third screw to rotate around its own axis; a third guide rod, arranged parallel to one side of the third screw rod; and A third mounting seat, a screw rod is connected to the third screw rod and is slidably connected to the third guide rod along the second axis, and the detection component is connected to the third mounting seat.

[0013] In a possible implementation, the BGA solder ball coplanarity measurement device further includes a display unit, and the display unit and the detection component are respectively communicatively connected to a controller.

[0014] In a possible implementation, the fixing component includes: A fixed seat, rotatably connected to the adjustment assembly about the first axis; A clamping driver, disposed on the fixing seat; and The clamp is slidably connected to the fixing seat along the first axis and is connected to the clamping driver. The clamping driver controls the clamp to clamp the workpiece to be measured along the first axis.

[0015] In a possible implementation, the adjustment component includes: an adjustment drive, disposed on the workbench; and The adjusting member is connected to the adjusting driver and is connected to the workbench so as to rotate around the second axis. The adjusting driver controls the adjusting member to rotate around the second axis.

[0016] The beneficial effect of the BGA solder ball coplanarity measuring device provided by the present invention is that: compared with the prior art, the fixed component of the BGA solder ball coplanarity measuring device of the present invention fixes the workpiece to be measured, and the displacement component controls the detection component to move to the top of the detection workpiece. The fixed component rotates around the second axis, and the adjustment component rotates around the first axis until the detection component is perpendicular to the substrate of the workpiece to be measured, and then the detection component gradually moves downward until the detection component contacts the solder ball of the workpiece to be measured, thereby measuring the height of the solder ball to be measured. In the above manner, the heights of all solder balls on the workpiece to be measured are measured one by one, and a reference plane is established according to the highest point fitting of all solder balls, and the maximum height difference of the reference plane is obtained to obtain the coplanarity to be measured. The present invention adopts a contact scheme to measure the height of the solder ball to be measured. Compared with the non-contact detection methods such as projection or laser reflection in the prior art, it is not affected by the light intensity, solder ball spacing and scanning profile point density, and can accurately measure the height of each BGA solder ball, thereby improving the accuracy of the monitoring results. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of the structure of a BGA solder ball coplanarity measurement device provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of the BGA solder ball coplanarity measurement device provided by an embodiment of the present invention when detecting the substrate angle of a workpiece to be measured; Figure 3 A schematic diagram of the structure of the BGA solder ball coplanarity measuring device provided by an embodiment of the present invention when detecting the position of a workpiece to be measured; Figure 4 A schematic structural diagram of a BGA solder ball coplanarity measurement device provided by an embodiment of the present invention when detecting the height of a solder ball to be measured.

[0019] In the figure: 1. first driving mechanism; 101. first driver; 102. first screw; 103. first guide rod; 104. first mounting seat; 2. second driving mechanism; 201. second driver; 202. second screw; 203. second guide rod; 204. second mounting seat; 3. third driving mechanism; 301. third driver; 302. third screw; 303. third guide rod; 304. third mounting seat; 4. adjusting assembly; 401. adjusting member; 402. adjusting driver; 5. fixing assembly; 501. fixing seat; 502. clamp; 503. clamping driver; 6. detecting assembly; 601. first detector; 602. position detector; 603. second detector; 7. workpiece to be detected; 701. solder ball; 702. substrate; 8. workbench. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0021] In the claims, specification and the above drawings of the present invention, unless otherwise clearly defined, the terms "first", "second" or "third" are used to distinguish different objects, rather than to describe a specific order. Unless otherwise specified, other directional words, such as "vertical", "clockwise", "counterclockwise", etc., indicating directions or positional relationships are based on the directions and positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, so it cannot be understood as limiting the specific protection scope of the present invention. In the claims, specification and the above drawings of the present invention, unless otherwise clearly defined, the terms "fixed connection" or "fixed connection" should be understood in a broad sense, that is, any connection method without a displacement relationship and relative rotation relationship between the two, that is, including non-detachable fixed connection, detachable fixed connection, integrated connection and fixed connection through other devices or elements. In the claims, specification and the above drawings of the present invention, the terms "including", "having" and their variations are used, and the intention is to "include but not limited to".

[0022] Please also read Figures 1 to 4, the BGA solder ball coplanarity measuring device provided by the present invention is now described. The BGA solder ball coplanarity measuring device comprises a fixing unit and a detection unit, the fixing unit comprises an adjustment component 4 and a fixing component 5 rotatably connected to the adjustment component 4 around a first axis, the adjustment component 4 is rotatably connected to a workbench 8 around a second axis, the first axis is perpendicular to the second axis, and the first axis and the second axis are both at an angle to the up-down direction, the fixing component 5 is used to fix the workpiece 7 to be measured; the detection unit comprises a displacement component and a detection component 6 connected to the displacement component, the displacement component comprises a first driving mechanism 1 provided on the workbench 8, a second driving mechanism 2 connected to the first driving mechanism 1, and a third driving mechanism 3 connected to the second driving mechanism 2, the detection component 6 is connected to the third driving mechanism 3, the first driving mechanism 1 drives the second driving mechanism 2 to move along the first axis, the second driving mechanism 2 drives the third driving mechanism 3 to move along the up-down direction, the third driving mechanism 3 drives the detection component 6 to move along the second axis, and the detection component 6 is used to detect the height of the solder ball 701 of the workpiece 7 to be measured.

[0023] Compared with the prior art, the BGA solder ball coplanarity measuring device provided by the present invention has a fixed component 5 that fixes the workpiece 7 to be measured, and a displacement component that controls the detection component 6 to move to the top of the workpiece to be measured. The fixed component 5 rotates around the second axis, and the adjustment component 4 rotates around the first axis until the detection component 6 is perpendicular to the substrate 702 of the workpiece 7 to be measured, and then the detection component 6 gradually moves downward until the detection component 6 contacts the solder ball 701 of the workpiece 7 to be measured, thereby measuring the height of the solder ball 701 to be measured. By adopting the above method, the heights of all solder balls 701 on the workpiece 7 to be measured are measured one by one, and a reference plane is established according to the highest point fitting of all solder balls 701, and the maximum height difference of the reference plane is obtained, so as to obtain the coplanarity to be measured. The present invention adopts a contact scheme to measure the height of the solder ball 701 to be measured. Compared with the non-contact detection methods such as projection or laser reflection used in the prior art, it is not affected by the light intensity, the spacing between the solder balls 701 and the density of the scanning contour points. It can accurately measure the height of each BGA solder ball 701, thereby improving the accuracy of the monitoring results.

[0024] It should be noted that the workpiece 7 to be tested includes a substrate 702 to be tested and a plurality of solder balls 701 to be tested disposed on the substrate 702 .

[0025] Optionally, the first drive mechanism 1, the second drive mechanism 2 and the third drive mechanism 3 are all telescopic components, such as hydraulic or pneumatic telescopic components, wherein the second drive mechanism 2 is connected to the telescopic end of the first drive mechanism 1, and the third drive mechanism 3 is connected to the telescopic end of the second drive mechanism 2.

[0026] Optionally, the adjustment component 4 is rotatably connected to the workbench 8 via a rotating shaft, so that the adjustment component 4 can stay at any angle. For example, the adjustment component 4 can be fastened by bolts to fix the adjustment component 4 at a specified angle of the workbench 8. The adjustment component 4 can also be connected to a motor, and the motor drives the adjustment component 4 to rotate around the second axis, so that the adjustment component 4 is fixed at a specified angle.

[0027] Optionally, the fixing assembly 5 is rotatably connected to the adjusting assembly 4 via a rotating shaft, so that the fixing assembly 5 can stay at any angle. For example, the fixing assembly 5 can be fastened by bolts to fix the fixing assembly 5 at a specified angle of the adjusting assembly 4. The fixing assembly 5 can also be connected to a motor, and the motor drives the fixing assembly 5 to rotate around the first axis, so that the fixing assembly 5 is fixed at a specified angle.

[0028] Optionally, the detection component 6 includes a contact block and a scale. When the contact block moves downward to contact the solder ball 701, the scale measures the distance between the substrate 702 of the workpiece 7 to be tested and the contact block, which is the height of the solder ball 701. The scale can be arranged on the workbench 8 in the up-down direction, and the contact block is connected to the third driving mechanism 3. When the contact block contacts the third driving mechanism 3, the reading is directly read through the scale. The scale can also be slidably connected to the third driving mechanism 3 in the up-down direction. When the contact block contacts the solder ball 701, the scale moves downward to contact the substrate 702, thereby obtaining the height of the solder ball 701. For example, the scale is connected to the third driving mechanism 3 through a screw rod or a telescopic member.

[0029] In some embodiments, see Figures 1 to 4 The BGA solder ball coplanarity measuring device also includes a control unit, and the adjustment component 4, the fixing component 5, the displacement component and the detection component 6 are respectively connected to the control unit for communication.

[0030] After the workpiece 7 to be tested is fixed to the fixing assembly 5, the displacement assembly controls the detection assembly 6 to move to the top of the workpiece 7 to be tested. The detection assembly 6 detects the angle between the substrate 702 to be tested and the detection assembly 6, and generates an adjustment signal. The control unit controls the adjustment assembly 4 and the fixing assembly 5 to rotate according to the adjustment signal until the substrate 702 to be tested is perpendicular to the detection assembly 6. When the substrate 702 to be tested is perpendicular to the detection assembly 6, a detection signal is generated. The control unit controls the displacement assembly to start according to the detection signal, so that the detection assembly 6 moves to contact the solder ball 701 to be tested in the up and down directions. At this time, the detection assembly 6 measures the height of the solder ball 701 to be tested.

[0031] Optionally, the control unit is also connected to an operation terminal, which can be a mobile phone, a computer or other components, and can input and output commands. The staff obtains the height of the solder ball 701 to be measured according to the operation terminal.

[0032] Optionally, the detection component 6 may be a distance sensor, such as an optical distance sensor, an infrared distance sensor, an ultrasonic distance sensor, etc., and the detection result may be transmitted to the outside, such as by voice broadcast or display on a display screen.

[0033] In some embodiments, see Figures 1 to 4 The detection component 6 includes a first detector 601 and a second detector 603. The first detector 601 is connected to the third driving mechanism 3, and the first detector 601 is used to detect the angle between the substrate 702 of the workpiece 7 to be measured and the first detector 601; the second detector 603 is connected to the third driving mechanism 3 and is located on the same mounting surface of the third driving mechanism 3 as the first detector 601, and the second detector 603 is used to detect the height of the solder ball 701 of the workpiece 7 to be measured. The first detector 601 detects the angle between itself and the substrate 702 of the workpiece 7 to be measured, and after ensuring that the first detector 601 is perpendicular to the substrate 702, the second detector 603 is used to detect the height of the solder balls 701 to be measured, so as to avoid inaccurate height detection of all solder balls 701 to be measured due to the second detector 603 not being perpendicular to the substrate 702, thereby affecting the coplanarity detection.

[0034] Optionally, the first detector 601 is an angle sensor with a display module, which can output the detection result. The operator obtains the angle between the first detector 601 and the substrate 702 of the workpiece 7 to be measured according to the display module, and then adjusts the angles of the adjustment component 4 and the fixing component 5 until the first detector 601 is perpendicular to the substrate 702 of the workpiece 7 to be measured.

[0035] In some embodiments, see Figures 1 to 4 The detection component 6 also includes a position detector 602 connected to the third driving mechanism 3. The position detector 602, the first driving mechanism 1, the second driving mechanism 2 and the third driving mechanism 3 are respectively communicatively connected to the controller. The position detector 602 can detect the position of the workpiece 7 to be measured and generate a position signal. The controller controls the first drive mechanism 1, the second drive mechanism 2 and the third drive mechanism 3 to start according to the position signal until the detection component 6 is located directly above the workpiece 7 to be measured, and after the detection component 6 is perpendicular to the workpiece 7 to be measured, the detection component 6 is controlled to contact the workpiece 7 to be measured along the up and down direction. In this embodiment, there is no need to manually control the movement of the detection component 6. The position detector 602 can accurately move the detection component 6 to the specified position, which not only improves the detection efficiency, but also makes the moving position of the detection component 6 more accurate.

[0036] Optionally, the position detector 602 can be a GIS geographic location system, which is a technical system that collects, stores, manages, calculates, analyzes, displays and describes geographic distribution data in the whole or part of the space under the support of computer hardware and software systems. It can also be an image acquisition device that can obtain image information of the position of the workpiece 7 to determine its specific position.

[0037] In some embodiments, see Figures 1 to 4 The first driving mechanism 1 includes a first driver 101, a first screw 102, a first guide rod 103 and a first mounting seat 104. The first screw 102 is connected to the first driver 101. The axis of the first screw 102 is parallel to the first axis. The first driver 101 controls the first screw 102 to rotate around its own axis; the first guide rod 103 is arranged parallel to one side of the first screw 102; the first mounting seat 104 is threadedly connected to the first screw 102 and is slidably connected to the first guide rod 103 along the first axis. The second driving mechanism 2 is connected to the first mounting seat 104.

[0038] The first driver 101 controls the first screw 102 to rotate around its own axis, and the first mounting seat 104 moves along the axis of the first screw 102 under the limiting action of the first guide rod 103, thereby controlling the second drive mechanism 2 to move along the axis (first axis) of the first screw 102. Compared with the solution of controlling the movement of the second drive mechanism 2 along the first axis by air pressure or hydraulic expansion, the solution in this embodiment has higher precision and can ensure the stability of the second drive mechanism 2 during movement.

[0039] Optionally, the first driver 101 is a motor.

[0040] In some embodiments, see Figures 1 to 4 The second driving mechanism 2 includes a second driver 201, a second screw 202, a second guide rod 203 and a second mounting seat 204. One end of the second screw 202 is connected to the second driver 201, and the other end is connected to a bearing, and the bearing is connected to the first mounting seat 104. The axis of the second screw 202 is parallel to the up and down directions. The second driver 201 controls the second screw 202 to rotate around its own axis; the second guide rod 203 is arranged parallel to one side of the second screw 202; the second mounting seat 204 is screw-connected to the second screw 202, and is slidably connected to the second guide rod 203 along the up and down directions. The third driving mechanism 3 is connected to the second mounting seat 204.

[0041] The second driver 201 controls the second screw rod 202 to rotate around its own axis, and the second mounting seat 204 moves along the axis (up and down direction) of the second screw rod 202 under the limiting action of the second guide rod 203. Compared with the solution of controlling the third driving mechanism 3 to move in the up and down direction by air pressure or hydraulic expansion and contraction, the solution in this embodiment has higher precision and can ensure the stability of the third driving mechanism 3 during the movement.

[0042] Optionally, the second driver 201 is a motor.

[0043] In some embodiments, see Figures 1 to 4 The third driving mechanism 3 includes a third driver 301, a third screw 302, a third guide rod 303 and a third mounting seat 304; one end of the third screw 302 is connected to the third driver 301, and the other end is connected to a bearing, and the bearing is connected to the second mounting seat 204. The axis of the third screw 302 is parallel to the second axis, and the third driver 301 controls the third screw 302 to rotate around its own axis; the third guide rod 303 is arranged parallel to one side of the third screw 302; the third mounting seat 304 is screw-connected to the third screw 302, and is slidably connected to the third guide rod 303 along the second axis, and the detection component 6 is connected to the third mounting seat 304.

[0044] The third driver 301 controls the third screw rod 302 to rotate around its own axis, and the third mounting seat 304 moves along the axis (the second axis direction) of the third screw rod 302 under the limiting action of the third guide rod 303. Compared with the solution of controlling the movement of the detection component 6 along the second axis by air pressure or hydraulic expansion, the solution in this embodiment has higher accuracy and can ensure the stability of the detection component 6 during the movement.

[0045] Optionally, the third driving mechanism 3 is a motor. In some embodiments, see Figures 1 to 4 The BGA solder ball coplanarity measuring device also includes a display unit, and the display unit and the detection component 6 are respectively connected to the controller for communication. After the detection component 6 detects the height of the solder ball 701 to be tested, it transmits the detection result to the controller. The controller analyzes and processes the heights of all the solder balls 701 to be tested, fits the highest points of all the solder balls 701 to be tested to form a reference plane to be tested, obtains the maximum height difference of all the solder balls 701 to be tested, and then obtains the coplanarity of the reference plane to be tested, and displays it externally through the display unit.

[0046] Optionally, the display unit may be a display screen, and the display screen may be provided separately or may be provided on the detection component 6 .

[0047] In some embodiments, see Figures 1 to 4The fixing assembly 5 includes a fixing seat 501, a clamping driver 503 and a clamp 502. The fixing seat 501 is connected to the adjusting assembly 4 by rotation around the first axis; the clamping driver 503 is arranged on the fixing seat 501; the clamp 502 is connected to the fixing seat 501 by sliding along the first axis and is connected to the clamping driver 503. The clamping driver 503 controls the clamp 502 to clamp the workpiece 7 to be measured along the first axis.

[0048] The clamping driver 503 controls the clamp 502 to move along the first axis, thereby clamping or releasing the workpiece 7 to be measured. The solution in this embodiment uses a clamping and fixing method to fix the workpiece 7 to be measured (clamping substrate 702), which can be adapted to workpieces 7 to be measured of different sizes, has a wide range of applications, and is convenient for taking and placing the workpiece 7 to be measured. In addition, the angle of the clamp 502 is adjusted by rotating the fixing seat 501, thereby adjusting the angle of the workpiece 7 to be measured.

[0049] Optionally, the fixing seat 501 is connected to a motor, and the motor controls the fixing seat 501 to rotate around the first axis. The clamping driver 503 may be a motor.

[0050] Optionally, the clamp 502 includes two clamps, and the clamping driver 503 controls the two clamps to move toward or away from each other, thereby clamping or releasing the workpiece 7 to be measured.

[0051] Optionally, the fixing component 5 may be a fixing plate, which is provided with a fixing groove adapted to fit the substrate 702 of the workpiece 7 to be measured, and the substrate 702 is inserted into the fixing groove.

[0052] In some embodiments, see Figures 1 to 4 The adjusting assembly 4 includes an adjusting driver 402 and an adjusting member 401. The adjusting driver 402 is disposed on the workbench 8. The adjusting member 401 is connected to the adjusting driver 402 and is rotatably connected to the workbench 8 around a second axis. The adjusting driver 402 controls the adjusting member 401 to rotate around the second axis. The adjusting driver 402 controls the adjusting member 401 to rotate around the second axis, thereby controlling the rotation angle of the adjusting member 401 to facilitate the verticality of the substrate 702 and the detection assembly 6 .

[0053] Optionally, the adjustment driver 402 is a motor.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. BGA solder ball coplanarity measurement device, characterized in that: include: A fixing unit, comprising an adjusting component and a fixing component rotatably connected to the adjusting component around a first axis, the adjusting component rotatably connected to the workbench around a second axis, the first axis being perpendicular to the second axis, and the first axis and the second axis both forming an angle with the up-down direction, the fixing component being used to fix the workpiece to be measured; as well as The detection unit includes a displacement component and a detection component connected to the displacement component, the displacement component includes a first driving mechanism arranged on a workbench, a second driving mechanism connected to the first driving mechanism and a third driving mechanism connected to the second driving mechanism, the detection component is connected to the third driving mechanism, the first driving mechanism drives the second driving mechanism to move along the first axis, the second driving mechanism drives the third driving mechanism to move in the up and down directions, the third driving mechanism drives the detection component to move along the second axis, and the detection component is used to detect the height of the solder ball of the workpiece to be measured.

2. The BGA solder ball coplanarity measuring device according to claim 1, characterized in that: The BGA solder ball coplanarity measuring device also includes a control unit, and the adjustment component, the fixing component, the displacement component and the detection component are respectively connected to the control unit for communication.

3. The BGA solder ball coplanarity measuring device according to claim 1, characterized in that: The detection component comprises: a first detector connected to the third driving mechanism, the first detector being used to detect an angle between the substrate of the workpiece to be measured and the first detector; and The second detector is connected to the third driving mechanism and is located on the same mounting surface of the third driving mechanism as the first detector. The second detector is used to detect the height of the solder ball of the workpiece to be tested.

4. The BGA solder ball coplanarity measuring device according to claim 3, characterized in that: The detection component also includes a position detector connected to the third driving mechanism, and the position detector, the first driving mechanism, the second driving mechanism and the third driving mechanism are respectively communicatively connected to a controller.

5. The BGA solder ball coplanarity measuring device according to claim 1, characterized in that: The first driving mechanism comprises: First Drive; A first screw rod is connected to the first driver, the axis of the first screw rod is parallel to the first axis, and the first driver controls the first screw rod to rotate around its own axis; A first guide rod, arranged parallel to one side of the first screw rod; and The first mounting seat is threadedly connected to the first screw rod and slidably connected to the first guide rod along the first axis. The second driving mechanism is connected to the first mounting seat.

6. The BGA solder ball coplanarity measuring device according to claim 5, characterized in that: The second driving mechanism comprises: Second drive; A second screw, one end of which is connected to the second driver, and the other end of which is connected to a bearing, the bearing being connected to the first mounting seat, the axis of the second screw being parallel to the up and down direction, and the second driver controlling the second screw to rotate around its own axis; A second guide rod, arranged parallel to one side of the second screw rod; and The second mounting seat is connected to the second screw rod, and is slidably connected to the second guide rod along the up-down direction. The third driving mechanism is connected to the second mounting seat.

7. The BGA solder ball coplanarity measuring device according to claim 6, characterized in that: The third driving mechanism comprises: Third Drive; A third screw, one end of which is connected to the third driver, and the other end of which is connected to a bearing, the bearing being connected to the second mounting seat, the axis of the third screw being parallel to the second axis, and the third driver controlling the third screw to rotate around its own axis; a third guide rod, arranged parallel to one side of the third screw rod; and A third mounting seat, a screw rod is connected to the third screw rod and is slidably connected to the third guide rod along the second axis, and the detection component is connected to the third mounting seat.

8. The BGA solder ball coplanarity measuring device according to claim 1, characterized in that: The BGA solder ball coplanarity measuring device also includes a display unit, and the display unit and the detection component are respectively connected to the controller for communication.

9. The BGA solder ball coplanarity measuring device according to claim 1, characterized in that: The fixing assembly comprises: A fixed seat, rotatably connected to the adjustment assembly about the first axis; A clamping driver, disposed on the fixing seat; and The clamp is slidably connected to the fixing seat along the first axis and is connected to the clamping driver. The clamping driver controls the clamp to clamp the workpiece to be measured along the first axis.

10. The BGA solder ball coplanarity measuring device according to claim 1, characterized in that: The adjustment component comprises: An adjustment drive, located on the workbench; and The adjusting member is connected to the adjusting driver and is connected to the workbench so as to rotate around the second axis. The adjusting driver controls the adjusting member to rotate around the second axis.

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