Photo-thermal distributed testing method and system

Abstract

The invention discloses a photo-thermal distributed testing method and system, and the method comprises the steps: defining the optical parameters of a to-be-tested photoelectric product according to a plurality of light distribution characteristics in a light distribution space; in the heat distribution space, thermal parameters of the to-be-tested photoelectric product are defined according to a plurality of thermo-optical distribution characteristics, optical parameters and the thermal parameters are introduced, and targeted management and control are carried out in the optical distribution space and the heat distribution space; meanwhile, the effect grade of the photoelectric product to be tested is defined according to the test grade, the optical parameters and the thermal parameters of the photoelectric product to be tested; according to the spatial position of the to-be-tested photoelectric product relative to the test space, the effect grade of the to-be-tested photoelectric product and the service life of the to-be-tested photoelectric product, the overall quality parameter of the to-be-tested photoelectric product is defined, and the corresponding quality grade is matched, so that the quality grade of the to-be-tested photoelectric product is presented. Therefore, the overall quality of the photoelectric product to be tested is evaluated.

Description

Technical Field

[0001] The present invention relates to the technical field of photothermal distributed testing systems, and in particular to a photothermal distributed testing method and system. Background Art

[0002] With the development of science and technology, optoelectronic products need to undergo various tests before leaving the factory. At this time, optoelectronic products are tested by testing equipment. In the existing technology, the testing equipment tests the optoelectronic products and controls the optical parameters of the optoelectronic products separately, without fully considering the influence of thermal parameters, and it is impossible to achieve an overall evaluation of the optical and thermal parameters of the optoelectronic products to be tested. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a method and system for photothermal distributed testing, which locates the optoelectronic product to be tested and collects the position of the optoelectronic product to be tested; triggers positioning detection based on the position of the optoelectronic product to be tested, and outputs the light distribution space and the heat distribution space based on the positioning detection of the optoelectronic product to be tested; in the light distribution space, the optical parameters of the optoelectronic product to be tested are defined according to multiple light distribution characteristics; in the heat distribution space, the thermal parameters of the optoelectronic product to be tested are defined according to multiple thermal-light distribution characteristics. At this time, optical parameters and thermal parameters are introduced, and targeted management and control are carried out in the light distribution space and the heat distribution space.

[0004] At the same time, the effect level of the optoelectronic product to be tested is defined according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested; the overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality levels are matched to present the quality level of the optoelectronic product to be tested, thereby evaluating the overall quality of the optoelectronic product to be tested and achieving overall evaluation of the optical parameters and thermal parameters of the optoelectronic product to be tested.

[0005] In order to solve the above technical problems, an embodiment of the present invention provides a method for photothermal distributed testing, which is applied to the scenario of photothermal distributed testing;

[0006] The method for photothermal distributed testing includes:

[0007] Locate the optoelectronic product to be tested and collect the position of the optoelectronic product to be tested;

[0008] triggering a positioning detection based on the position of the optoelectronic product to be tested, and outputting a light distribution space and a heat distribution space based on the positioning detection of the optoelectronic product to be tested;

[0009] In the light distribution space, optical parameters of the optoelectronic product to be tested are defined according to a plurality of light distribution characteristics;

[0010] In the thermal distribution space, thermal parameters of the photovoltaic product to be tested are defined according to a plurality of thermal and optical distribution characteristics;

[0011] Associating optical parameters with thermal parameters, and defining the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested;

[0012] The overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality level is matched.

[0013] Optionally, the locating the optoelectronic product to be tested and collecting the position of the optoelectronic product to be tested includes:

[0014] Collect the model of the optoelectronic product to be tested;

[0015] Match the corresponding test scenario according to the model and test type of the optoelectronic product to be tested;

[0016] In the test scenario, the optoelectronic product to be tested is positioned;

[0017] Associating the optoelectronic products to be tested and the test space;

[0018] Defining a spatial position of the optoelectronic product to be tested relative to the test space according to the optoelectronic product to be tested and the test space;

[0019] The position of the optoelectronic product to be tested is defined based on its spatial position relative to the test space, its posture during the test, and its dynamic test nodes, and the position of the optoelectronic product to be tested is collected.

[0020] Optionally, triggering positioning detection based on the position of the optoelectronic product to be tested, and outputting the light distribution space and the heat distribution space based on the positioning detection of the optoelectronic product to be tested, includes:

[0021] Freeze the position of the optoelectronic product to be tested;

[0022] defining a surrounding environment based on detecting a location of an optoelectronic product to be tested;

[0023] Collect corresponding environmental parameters based on the surrounding environment, and define environmental characteristics based on multiple environmental parameters;

[0024] Triggering positioning detection according to the location of the optoelectronic product to be tested and the environmental characteristics;

[0025] In the positioning detection of the optoelectronic product to be tested, marking the optical test space and the thermal test space based on the positioning detection of the optoelectronic product to be tested;

[0026] Define the light distribution space according to the light test space and the lighting parameters in the surrounding environment;

[0027] The heat distribution space is defined according to the heat parameters in the thermal test space and the surrounding environment. At this time, the heat distribution space and the light distribution space are two different distribution spaces and are independently controlled.

[0028] Optionally, in the light distribution space, defining the optical parameters of the optoelectronic product to be tested according to a plurality of light distribution characteristics includes:

[0029] In the light distribution space, collecting a light distribution diagram of the optoelectronic product to be tested;

[0030] defining a plurality of annular profiles based on the light distribution map;

[0031] Matching corresponding light distribution areas based on the plurality of annular contours to define a plurality of light distribution areas;

[0032] Collect the number of light distribution areas and define the relative positions of each light distribution area;

[0033] defining a first parameter based on the number of light distribution areas and the relative positions of the light distribution areas;

[0034] Matching a corresponding light distribution feature according to the first parameter and a region parameter of the light distribution region;

[0035] The optical parameters of the optoelectronic product to be tested are defined according to a plurality of light distribution characteristics and an optical parameter matching table.

[0036] Optionally, in the heat distribution space, defining the thermal parameters of the optoelectronic product to be tested according to a plurality of thermal and optical distribution characteristics includes:

[0037] In the thermal distribution space, a thermal distribution map of the optoelectronic product to be tested is collected;

[0038] defining a plurality of closed-loop contours based on the heat map;

[0039] Matching corresponding heat distribution areas based on a plurality of closed-loop contours to define a plurality of heat distribution areas;

[0040] Collect the number of heat distribution areas and define the relative positions of each heat distribution area;

[0041] defining a second parameter based on the number of heat distribution regions and the relative positions of the heat distribution regions;

[0042] matching a corresponding heat distribution feature according to the second parameter and a regional parameter of the heat distribution region;

[0043] Thermal parameters of the optoelectronic product to be tested are defined according to a plurality of thermal distribution characteristics and a thermal parameter matching table.

[0044] Optionally, the associating optical parameters and thermal parameters to define the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested includes:

[0045] Freeze optical parameters and thermal parameters; correlate optical parameters and thermal parameters;

[0046] Defining correlation coefficients based on optical parameters and thermal parameters;

[0047] Collecting the test level of the optoelectronic product to be tested, and defining the level coefficient according to the test level of the optoelectronic product to be tested;

[0048] The grade coefficient and the correlation coefficient are associated, and the balance coefficient is defined based on the grade coefficient and the correlation coefficient.

[0049] Optionally, the associating optical parameters and thermal parameters, defining the effect level of the optoelectronic product to be tested according to the test level of the optoelectronic product to be tested, the optical parameters and the thermal parameters, further includes:

[0050] If the balance coefficient is greater than a preset balance coefficient threshold, the association of the test level, optical parameters and thermal parameters of the optoelectronic product to be tested is triggered;

[0051] The effect level of the optoelectronic product to be tested is defined according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested.

[0052] Optionally, defining the overall quality parameters of the optoelectronic product to be tested according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested, and the service life of the optoelectronic product to be tested, and matching the corresponding quality level, includes:

[0053] Freeze the spatial position of the optoelectronic product to be tested relative to the test space;

[0054] Define spatial coefficients and environmental coefficients based on spatial location;

[0055] Correlate the effect level, space factor and environmental factor of the optoelectronic product to be tested;

[0056] A first quality factor is defined based on an effect level, a space factor, and an environmental factor of the optoelectronic product to be tested.

[0057] Optionally, the step of defining the overall quality parameters of the optoelectronic product to be tested according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested, and the service life of the optoelectronic product to be tested, and matching the corresponding quality level, further includes:

[0058] Collect the service life of the optoelectronic products to be tested;

[0059] defining a second quality factor based on the service life of the optoelectronic product to be tested and the model of the optoelectronic product to be tested;

[0060] defining an overall quality parameter of the optoelectronic product to be tested according to the second quality coefficient and the first quality coefficient;

[0061] Match the corresponding quality grade according to the overall quality parameters of the optoelectronic products and the quality grade comparison table, and mark the quality grade.

[0062] In addition, an embodiment of the present invention further provides a system for photothermal distributed testing, the system for photothermal distributed testing comprising:

[0063] A collection module, used for locating the optoelectronic product to be tested and collecting the position of the optoelectronic product to be tested;

[0064] A distribution space module, used to trigger a positioning detection based on the position of the optoelectronic product to be tested, and output a light distribution space and a heat distribution space based on the positioning detection of the optoelectronic product to be tested;

[0065] An optical parameter module, used to define optical parameters of the optoelectronic product to be tested according to a plurality of light distribution characteristics in the light distribution space;

[0066] A thermal parameter module, used to define the thermal parameters of the photovoltaic product to be tested according to a plurality of thermal and optical distribution characteristics in a thermal distribution space;

[0067] An effect level module, used to associate optical parameters with thermal parameters, and define the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested;

[0068] The quality grade module is used to define the overall quality parameters of the optoelectronic product to be tested and match the corresponding quality grade according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect grade of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested.

[0069] In an embodiment of the present invention, the optoelectronic product to be tested is located and the position of the optoelectronic product to be tested is collected through the method in the embodiment of the present invention; positioning detection is triggered based on the position of the optoelectronic product to be tested, and the light distribution space and the heat distribution space are output based on the positioning detection of the optoelectronic product to be tested; in the light distribution space, the optical parameters of the optoelectronic product to be tested are defined according to multiple light distribution characteristics; in the heat distribution space, the thermal parameters of the optoelectronic product to be tested are defined according to multiple thermal-light distribution characteristics. At this time, optical parameters and thermal parameters are introduced, and targeted management and control are carried out in the light distribution space and the heat distribution space.

[0070] At the same time, the effect level of the optoelectronic product to be tested is defined according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested; the overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality levels are matched to present the quality level of the optoelectronic product to be tested, thereby evaluating the overall quality of the optoelectronic product to be tested and achieving overall evaluation of the optical parameters and thermal parameters of the optoelectronic product to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0072] Figure 1 is a schematic flow chart of a method for photothermal distributed testing in an embodiment of the present invention;

[0073] Figure 2 is a schematic flow chart of S11 in the method for distributed photothermal testing in an embodiment of the present invention;

[0074] Figure 3 is a flow chart of S12 in the method for photothermal distributed testing in an embodiment of the present invention;

[0075] Figure 4 is a flow chart of S13 in the method for photothermal distributed testing in an embodiment of the present invention;

[0076] Figure 5 is a schematic flow chart of S14 in the method for distributed photothermal testing in an embodiment of the present invention;

[0077] Figure 6is a flow chart of S15 in the method for photothermal distributed testing in an embodiment of the present invention;

[0078] Figure 7 is a flow chart of S16 in the method for photothermal distributed testing in an embodiment of the present invention;

[0079] Figure 8 Schematic diagram of the structure of the system for photothermal distributed testing in an embodiment of the present invention;

[0080] Fig. 9 The figure is a hardware diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0081] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0082] Method Embodiment

[0083] See also Figures 1 to 9 , a method for photothermal distributed testing is applied to the scenario of photothermal distributed testing; the method for photothermal distributed testing includes:

[0084] Step S11: locating the optoelectronic product to be tested, and collecting the position of the optoelectronic product to be tested;

[0085] Step S12: triggering a positioning detection based on the position of the optoelectronic product to be tested, and outputting a light distribution space and a heat distribution space based on the positioning detection of the optoelectronic product to be tested;

[0086] Step S13: in the light distribution space, defining optical parameters of the optoelectronic product to be tested according to a plurality of light distribution characteristics;

[0087] Step S14: in the thermal distribution space, defining the thermal parameters of the optoelectronic product to be tested according to a plurality of thermal and optical distribution characteristics;

[0088] Step S15: Correlate the optical parameters and the thermal parameters, and define the effect level of the optoelectronic product to be tested according to the test level, the optical parameters and the thermal parameters of the optoelectronic product to be tested;

[0089] Step S16: define the overall quality parameters of the optoelectronic product to be tested according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and match the corresponding quality level.

[0090] In an embodiment of the present invention, the optoelectronic product to be tested is located and the position of the optoelectronic product to be tested is collected through the method in the embodiment of the present invention; positioning detection is triggered based on the position of the optoelectronic product to be tested, and the light distribution space and the heat distribution space are output based on the positioning detection of the optoelectronic product to be tested; in the light distribution space, the optical parameters of the optoelectronic product to be tested are defined according to multiple light distribution characteristics; in the heat distribution space, the thermal parameters of the optoelectronic product to be tested are defined according to multiple thermal-light distribution characteristics. At this time, optical parameters and thermal parameters are introduced, and targeted management and control are carried out in the light distribution space and the heat distribution space.

[0091] At the same time, the effect level of the optoelectronic product to be tested is defined according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested; the overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality levels are matched to present the quality level of the optoelectronic product to be tested, thereby evaluating the overall quality of the optoelectronic product to be tested and achieving overall evaluation of the optical parameters and thermal parameters of the optoelectronic product to be tested.

[0092] refer to Figure 2 , in step S11, the optoelectronic product to be tested is located, and the position of the optoelectronic product to be tested is collected;

[0093] In the specific implementation process of the present invention, the specific steps may be:

[0094] S111: Collect the model of the optoelectronic product to be tested;

[0095] S112: matching a corresponding test scenario according to the model and test type of the optoelectronic product to be tested;

[0096] S113: In the test scenario, locate the optoelectronic product to be tested;

[0097] S114: Associating the optoelectronic product to be tested with the test space;

[0098] S115: defining a spatial position of the optoelectronic product to be tested relative to the test space according to the optoelectronic product to be tested and the test space;

[0099] S116: define the position of the optoelectronic product to be tested based on the spatial position of the optoelectronic product to be tested relative to the test space, the posture of the optoelectronic product to be tested during the test, and the dynamic test nodes of the optoelectronic product to be tested, and collect the position of the optoelectronic product to be tested.

[0100] In an embodiment of the present application, the model of the optoelectronic product to be tested is collected, and the test type of the optoelectronic product to be tested is introduced, so as to associate the model and test type of the optoelectronic product to be tested, and then match the corresponding test scene according to the model and test type of the optoelectronic product to be tested, so as to freeze the test scene, realize the determination of the test scene, ensure the accuracy of the test scene corresponding to the optoelectronic product to be tested, and further control the test scene.

[0101] In this test scenario, the optoelectronic product to be tested is located, and the optoelectronic product to be tested is managed and controlled, so as to associate the optoelectronic product to be tested and the test space, so as to facilitate processing of the optoelectronic product to be tested and the test space. At this time, the spatial position of the optoelectronic product to be tested relative to the test space is defined according to the optoelectronic product to be tested and the test space, so as to control the spatial position based on the optoelectronic product to be tested and the test space, and then define the spatial position of the optoelectronic product to be tested relative to the test space in multiple dimensions, thereby ensuring the accuracy of the spatial position of the optoelectronic product to be tested relative to the test space.

[0102] Furthermore, the position of the optoelectronic product to be tested is defined based on the spatial position of the optoelectronic product to be tested relative to the test space, the posture of the optoelectronic product to be tested during the test and the dynamic test nodes of the optoelectronic product to be tested, and the position of the optoelectronic product to be tested is collected. At this time, the spatial position of the optoelectronic product to be tested relative to the test space, the posture of the optoelectronic product to be tested during the test and the dynamic test nodes of the optoelectronic product to be tested are introduced, and the spatial position of the optoelectronic product to be tested relative to the test space, the posture of the optoelectronic product to be tested during the test and the dynamic test nodes of the optoelectronic product to be tested are controlled as a whole, thereby ensuring the accuracy of the position of the optoelectronic product to be tested.

[0103] refer to Figure 3 , in step S12, triggering positioning detection based on the position of the optoelectronic product to be tested, and outputting the light distribution space and the heat distribution space based on the positioning detection of the optoelectronic product to be tested;

[0104] In the specific implementation process of the present invention, the specific steps may be:

[0105] S121: freeze the position of the optoelectronic product to be tested;

[0106] S122: defining a surrounding environment based on the detection of the position of the optoelectronic product to be tested;

[0107] S123: collecting corresponding environmental parameters based on the surrounding environment, and defining environmental characteristics according to the multiple environmental parameters;

[0108] S124: triggering positioning detection according to the location of the optoelectronic product to be tested and environmental characteristics;

[0109] S125: in the positioning detection of the optoelectronic product to be tested, marking the optical test space and the thermal test space based on the positioning detection of the optoelectronic product to be tested; defining the light distribution space according to the illumination parameters in the optical test space and the surrounding environment;

[0110] S126: defining a heat distribution space according to heat parameters in the heat test space and the surrounding environment. At this time, the heat distribution space and the light distribution space are two different distribution spaces and are independently controlled.

[0111] In an embodiment of the present application, the position of the optoelectronic product to be tested is frozen, and the position of the optoelectronic product to be tested is controlled, so that the surrounding environment is defined based on the detection of the position of the optoelectronic product to be tested, so as to introduce the surrounding environment, thereby further controlling the surrounding environment of the optoelectronic product to be tested.

[0112] At this time, corresponding environmental parameters are collected based on the surrounding environment, and environmental features are defined according to multiple environmental parameters, so as to introduce multiple environmental features, thereby triggering positioning detection according to the position and environmental characteristics of the optoelectronic product to be tested, which is compatible with the overall consideration of the position and environmental characteristics of the optoelectronic product to be tested, and ensures the positioning detection of the optoelectronic product to be tested.

[0113] Therefore, in the positioning detection of the optoelectronic product to be tested, the light test space and the thermal test space are marked based on the positioning detection of the optoelectronic product to be tested; the light distribution space is defined according to the lighting parameters in the light test space and the surrounding environment, and the thermal distribution space is defined according to the heat parameters in the thermal test space and the surrounding environment, so as to introduce the thermal test space and the light distribution space. At this time, the thermal distribution space and the light distribution space are two different distribution spaces, and are independently controlled by each other.

[0114] refer to Figure 4 , in step S13, in the light distribution space, optical parameters of the optoelectronic product to be tested are defined according to a plurality of light distribution characteristics;

[0115] In the specific implementation process of the present invention, the specific steps may be:

[0116] S131: collecting a light distribution diagram of the optoelectronic product to be tested in the light distribution space;

[0117] S132: defining a plurality of annular contours based on the light distribution diagram; matching corresponding light distribution areas based on the plurality of annular contours to define a plurality of light distribution areas;

[0118] S133: Collect the number of light distribution areas and define the relative position of each light distribution area;

[0119] S134: defining a first parameter based on the number of light distribution areas and the relative positions of the light distribution areas;

[0120] S135: Matching corresponding light distribution characteristics according to the first parameter and the regional parameter of the light distribution area; defining optical parameters of the optoelectronic product to be tested according to the multiple light distribution characteristics and the optical parameter matching table.

[0121] In an embodiment of the present application, in the light distribution space, the light distribution map of the optoelectronic product to be tested is collected to facilitate the management and control of the light distribution map of the optoelectronic product to be tested. At this time, multiple annular contours are defined based on the light distribution map; corresponding light distribution areas are matched based on the multiple annular contours to define multiple light distribution areas, thereby locating the multiple light distribution areas, and then the multiple light distribution areas are controlled as a whole.

[0122] At this time, the number of light distribution areas is collected, and the relative position of each light distribution area is defined, so as to introduce the number of light distribution areas and the relative position of each light distribution area, and then define the first parameter based on the number of light distribution areas and the relative position of each light distribution area, so as to facilitate overall control in the number of light distribution areas and the relative position of each light distribution area, thereby ensuring the accuracy of the first parameter.

[0123] Furthermore, the corresponding light distribution characteristics are matched according to the first parameter and the regional parameters of the light distribution area, so that the first parameter and the regional parameters of the light distribution area are considered as a whole to ensure the accuracy of the light distribution characteristics. At this time, the optical parameters of the optoelectronic product to be tested are defined according to multiple light distribution characteristics and the optical parameter matching table, so as to introduce the optical parameters of the optoelectronic product to be tested, so as to further control the optical parameters of the optoelectronic product to be tested.

[0124] refer to Figure 5 , S14: in the thermal distribution space, defining thermal parameters of the optoelectronic product to be tested according to a plurality of thermal and optical distribution characteristics;

[0125] In the specific implementation process of the present invention, the specific steps may be:

[0126] S141: collecting a thermal distribution map of the optoelectronic product to be tested in the thermal distribution space;

[0127] S142: defining a plurality of closed-loop contours based on the thermal distribution map;

[0128] S143: Matching corresponding heat distribution areas based on the multiple closed-loop contours to define multiple heat distribution areas;

[0129] S144: collecting the number of heat distribution areas and defining the relative position of each heat distribution area;

[0130] S145: defining a second parameter based on the number of heat distribution regions and the relative positions of the heat distribution regions;

[0131] S146: matching corresponding heat distribution features according to the second parameter and the regional parameter of the heat distribution area;

[0132] S147: Define thermal parameters of the optoelectronic product to be tested according to the plurality of thermal distribution characteristics and the thermal parameter matching table.

[0133] In an embodiment of the present application, in the thermal distribution space, a thermal distribution map of the optoelectronic product to be tested is collected to facilitate further processing of the thermal distribution map of the optoelectronic product to be tested. At this time, multiple closed-loop contours are defined based on the thermal distribution map, and corresponding thermal distribution areas are matched based on the multiple closed-loop contours to define multiple thermal distribution areas, so as to introduce multiple thermal distribution areas, thereby performing overall control of the multiple thermal distribution areas.

[0134] At this time, the number of heat distribution areas is collected, and the relative positions of each heat distribution area are defined. The number of heat distribution areas and the relative positions of each heat distribution area are controlled in multiple dimensions to facilitate associating the number of heat distribution areas and the relative positions of each heat distribution area, and then defining the second parameter based on the number of heat distribution areas and the relative positions of each heat distribution area, thereby ensuring the accuracy of the second parameter.

[0135] Furthermore, the corresponding thermal distribution characteristics are matched according to the second parameter and the regional parameters of the heat distribution area; the thermal parameters of the optoelectronic product to be tested are defined according to multiple thermal distribution characteristics and a thermal parameter matching table, so as to introduce the thermal parameters of the optoelectronic product to be tested, thereby further controlling the thermal parameters of the optoelectronic product to be tested.

[0136] Therefore, the optoelectronic product to be tested is located, and the position of the optoelectronic product to be tested is collected; positioning detection is triggered based on the position of the optoelectronic product to be tested, and the light distribution space and the thermal distribution space are output based on the positioning detection of the optoelectronic product to be tested; in the light distribution space, the optical parameters of the optoelectronic product to be tested are defined according to a plurality of light distribution characteristics; in the thermal distribution space, the thermal parameters of the optoelectronic product to be tested are defined according to a plurality of thermal-light distribution characteristics. At this time, optical parameters and thermal parameters are introduced, and targeted management and control are carried out in the light distribution space and the thermal distribution space.

[0137] refer to Figure 6, S15: Associating optical parameters and thermal parameters, and defining the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested;

[0138] In the specific implementation process of the present invention, the specific steps may be:

[0139] S151: fixing the optical parameters and the thermal parameters; associating the optical parameters and the thermal parameters;

[0140] S152: defining a correlation coefficient based on optical parameters and thermal parameters;

[0141] S153: collecting the test level of the optoelectronic product to be tested, and defining a level coefficient according to the test level of the optoelectronic product to be tested;

[0142] S154: Associating the grade coefficient and the correlation coefficient, and defining a balance coefficient according to the grade coefficient and the correlation coefficient;

[0143] S155: If the balance coefficient is greater than a preset balance coefficient threshold, triggering the association of the test level, optical parameters, and thermal parameters of the optoelectronic product to be tested;

[0144] S156: defining the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested.

[0145] In an embodiment of the present application, the optical parameters and the thermal parameters are fixed; the optical parameters and the thermal parameters are associated, a correlation coefficient is defined based on the optical parameters and the thermal parameters, so as to introduce the correlation coefficient, and the degree of correlation between the optical parameters and the thermal parameters is presented according to the correlation coefficient.

[0146] At this time, the test level of the optoelectronic product to be tested is collected, and the level coefficient is defined according to the test level of the optoelectronic product to be tested, so as to introduce the level coefficient and the correlation coefficient, thereby correlating the level coefficient and the correlation coefficient.

[0147] Furthermore, the level coefficient and the correlation coefficient are associated, and the balance coefficient is defined based on the level coefficient and the correlation coefficient, so as to facilitate the definition of the balance coefficient, and the balance degree between the level coefficient and the correlation coefficient is defined based on the balance coefficient, thereby ensuring the matching of the level coefficient defined by the balance coefficient.

[0148] Therefore, the balance coefficient is compared with the preset balance coefficient threshold. If the balance coefficient is greater than the preset balance coefficient threshold, the association of the test level, optical parameters and thermal parameters of the optoelectronic product to be tested is triggered, so as to facilitate the overall control of the test level, optical parameters and thermal parameters of the optoelectronic product to be tested, thereby defining the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested, and then controlling the effect level of the optoelectronic product to be tested in multiple dimensions, thereby ensuring the accuracy of the effect level of the optoelectronic product to be tested.

[0149] refer to Figure 7 , S16: defining the overall quality parameters of the optoelectronic product to be tested according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested, and the service life of the optoelectronic product to be tested, and matching the corresponding quality level;

[0150] In the specific implementation process of the present invention, the specific steps may be:

[0151] S161: Freeze the spatial position of the optoelectronic product to be tested relative to the test space;

[0152] S162: defining a spatial coefficient and an environmental coefficient based on a spatial position;

[0153] S163: Associating the effect level, space factor and environmental factor of the optoelectronic product to be tested;

[0154] S164: defining a first quality coefficient based on the effect level, space coefficient, and environment coefficient of the optoelectronic product to be tested;

[0155] S165: collecting the service life of the optoelectronic product to be tested; defining a second quality coefficient based on the service life of the optoelectronic product to be tested and the model of the optoelectronic product to be tested;

[0156] S166: defining an overall quality parameter of the optoelectronic product to be tested according to the second quality coefficient and the first quality coefficient;

[0157] S167: Match the corresponding quality grade according to the overall quality parameters of the optoelectronic product and the quality grade comparison table, and mark the quality grade.

[0158] In the specific implementation process of the present invention, the effect level of the optoelectronic product to be tested is defined according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested; the overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality levels are matched to present the quality level of the optoelectronic product to be tested, thereby evaluating the overall quality of the optoelectronic product to be tested and achieving an overall evaluation of the optical parameters and thermal parameters of the optoelectronic product to be tested.

[0159] At this time, the spatial position of the optoelectronic product to be tested relative to the test space is fixed, and the spatial position of the optoelectronic product to be tested relative to the test space is considered as a whole, so as to define the spatial coefficient and the environmental coefficient based on the spatial position, thereby introducing the spatial coefficient and the environmental coefficient, and realizing the overall control of the spatial coefficient and the environmental coefficient.

[0160] Furthermore, the effect level, space coefficient and environmental coefficient of the optoelectronic product to be tested are associated; a first quality coefficient is defined based on the effect level, space coefficient and environmental coefficient of the optoelectronic product to be tested, so as to facilitate control over the effect level, space coefficient and environmental coefficient of the optoelectronic product to be tested, thereby defining the first quality coefficient in multiple dimensions and ensuring the accuracy of the first quality coefficient.

[0161] Therefore, the service life of the optoelectronic product to be tested is collected; the second quality coefficient is defined based on the service life of the optoelectronic product to be tested and the model of the optoelectronic product to be tested, so as to facilitate overall control based on the service life of the optoelectronic product to be tested and the model of the optoelectronic product to be tested, thereby ensuring the accuracy of the second quality coefficient.

[0162] A second quality coefficient and a first quality coefficient are introduced, and the overall quality parameters of the optoelectronic product to be tested are defined according to the second quality coefficient and the first quality coefficient, so as to facilitate overall control based on the second quality coefficient and the first quality coefficient, thereby controlling the overall quality parameters of the optoelectronic product to be tested in multiple dimensions, so as to match the corresponding quality grades according to the overall quality parameters of the optoelectronic product and the quality grade comparison table, and mark the quality grades.

[0163] Therefore, the overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality levels are matched to present the quality levels of the optoelectronic products to be tested, thereby evaluating the overall quality of the optoelectronic products to be tested and achieving an overall evaluation of the optical parameters and thermal parameters of the optoelectronic products to be tested.

[0164] In an embodiment of the present invention, the optoelectronic product to be tested is located and the position of the optoelectronic product to be tested is collected through the method in the embodiment of the present invention; positioning detection is triggered based on the position of the optoelectronic product to be tested, and the light distribution space and the heat distribution space are output based on the positioning detection of the optoelectronic product to be tested; in the light distribution space, the optical parameters of the optoelectronic product to be tested are defined according to multiple light distribution characteristics; in the heat distribution space, the thermal parameters of the optoelectronic product to be tested are defined according to multiple thermal-light distribution characteristics. At this time, optical parameters and thermal parameters are introduced, and targeted management and control are carried out in the light distribution space and the heat distribution space.

[0165] At the same time, the effect level of the optoelectronic product to be tested is defined according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested; the overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality levels are matched to present the quality level of the optoelectronic product to be tested, thereby evaluating the overall quality of the optoelectronic product to be tested and achieving overall evaluation of the optical parameters and thermal parameters of the optoelectronic product to be tested.

[0166] System Example

[0167] See also Figure 8 , Figure 8 Schematic diagram of the structure of the system for photothermal distributed testing in an embodiment of the present invention.

[0168] like Figure 8 As shown, a system for photothermal distributed testing, the system for photothermal distributed testing includes:

[0169] The acquisition module 21 is used to locate the optoelectronic product to be tested and acquire the position of the optoelectronic product to be tested;

[0170] A distribution space module 22, used to trigger a positioning detection based on the position of the optoelectronic product to be tested, and output a light distribution space and a heat distribution space based on the positioning detection of the optoelectronic product to be tested;

[0171] An optical parameter module 23, used to define optical parameters of the optoelectronic product to be tested according to a plurality of light distribution characteristics in the light distribution space;

[0172] Thermodynamic parameter module 24, used to define the thermodynamic parameters of the optoelectronic product to be tested according to a plurality of thermo-optical distribution characteristics in the thermal distribution space;

[0173] The effect level module 25 is used to associate the optical parameters and the thermal parameters, and define the effect level of the optoelectronic product to be tested according to the test level, the optical parameters and the thermal parameters of the optoelectronic product to be tested;

[0174] The quality grade module 26 is used to define the overall quality parameters of the optoelectronic product to be tested according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect grade of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and match the corresponding quality grade.

[0175] Example

[0176] See also Fig. 9 , refer to the following Fig. 9 The electronic device 40 according to this embodiment of the present invention will be described. Fig. 9 The electronic device 40 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0177] like Fig. 9 As shown, the electronic device 40 is in the form of a general computing device. The components of the electronic device 40 may include but are not limited to: at least one processing unit 41, at least one storage unit 42, and a bus 43 connecting different system components (including the storage unit 42 and the processing unit 41).

[0178] The storage unit stores program codes, which can be executed by the processing unit 41, so that the processing unit 41 executes the steps according to various exemplary embodiments of the present invention described in the above “Embodiment Method” section of this specification.

[0179] The storage unit 42 may include a readable medium in the form of a volatile storage unit, such as a random access memory unit (RAM) 421 and / or a cache memory unit 422 , and may further include a read-only memory unit (ROM) 423 .

[0180] The storage unit 42 may also include a program / utility 424 having a set (at least one) of quality level modules 425, such quality level modules 425 including but not limited to: an operating system, one or more application programs, other quality level modules, and program data, each of which or some combination may include an implementation of a network environment.

[0181] Bus 43 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0182] The electronic device 40 may also communicate with one or more external devices (e.g., keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable a user to interact with the electronic device 40, and / or any device that enables the electronic device 40 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface 44. Furthermore, the electronic device 40 may also communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) via a network adapter 45. Fig. 9 As shown, the network adapter 45 communicates with other modules of the electronic device 40 via the bus 43. It should be understood that although Fig. 9 Not shown, other hardware and / or software modules may be used in conjunction with the electronic device 40, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup planning systems.

[0183] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0184] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium can include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc. In addition, it stores computer program instructions, and when the computer program instructions are executed by a computer, the computer executes the above method.

[0185] In addition, the above method and system for photothermal distributed testing provided by the embodiments of the present invention are introduced in detail. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for distributed photothermal testing, characterized in that: Applicable to scenarios of distributed photothermal testing; The method for photothermal distributed testing includes: Locate the optoelectronic product to be tested and collect the position of the optoelectronic product to be tested; triggering a positioning detection based on the position of the optoelectronic product to be tested, and outputting a light distribution space and a heat distribution space based on the positioning detection of the optoelectronic product to be tested; In the light distribution space, optical parameters of the optoelectronic product to be tested are defined according to a plurality of light distribution characteristics; In the thermal distribution space, thermal parameters of the photovoltaic product to be tested are defined according to a plurality of thermal and optical distribution characteristics; Associating optical parameters with thermal parameters, and defining the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested; The overall quality parameters of the optoelectronic product to be tested are defined according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested, and the corresponding quality level is matched.

2. The method for distributed photothermal testing according to claim 1, characterized in that: The step of locating the optoelectronic product to be tested and collecting the position of the optoelectronic product to be tested includes: Collect the model of the optoelectronic product to be tested; Match the corresponding test scenario according to the model and test type of the optoelectronic product to be tested; In the test scenario, the optoelectronic product to be tested is positioned; Associating the optoelectronic products to be tested and the test space; Defining a spatial position of the optoelectronic product to be tested relative to the test space according to the optoelectronic product to be tested and the test space; The position of the optoelectronic product to be tested is defined based on its spatial position relative to the test space, its posture during the test, and its dynamic test nodes, and the position of the optoelectronic product to be tested is collected.

3. The method for distributed photothermal testing according to claim 2, characterized in that: The triggering of positioning detection based on the position of the optoelectronic product to be tested, and outputting the light distribution space and the heat distribution space based on the positioning detection of the optoelectronic product to be tested, include: Freeze the position of the optoelectronic product to be tested; defining a surrounding environment based on detecting a location of an optoelectronic product to be tested; Collect corresponding environmental parameters based on the surrounding environment, and define environmental characteristics based on multiple environmental parameters; Triggering positioning detection according to the location of the optoelectronic product to be tested and the environmental characteristics; In the positioning detection of the optoelectronic product to be tested, marking the optical test space and the thermal test space based on the positioning detection of the optoelectronic product to be tested; defining the light distribution space according to the light parameters in the optical test space and the surrounding environment; The heat distribution space is defined according to the heat parameters in the thermal test space and the surrounding environment. At this time, the heat distribution space and the light distribution space are two different distribution spaces and are independently controlled.

4. The method for distributed photothermal testing according to claim 1, characterized in that: Defining the optical parameters of the optoelectronic product to be tested in the light distribution space according to a plurality of light distribution characteristics includes: In the light distribution space, collecting a light distribution diagram of the optoelectronic product to be tested; Defining a plurality of annular contours based on the light distribution diagram; matching corresponding light distribution areas based on the plurality of annular contours to define a plurality of light distribution areas; Collect the number of light distribution areas and define the relative positions of each light distribution area; defining a first parameter based on the number of light distribution areas and the relative positions of the light distribution areas; The corresponding light distribution feature is matched according to the first parameter and the regional parameter of the light distribution area; and the optical parameters of the optoelectronic product to be tested are defined according to the multiple light distribution features and the optical parameter matching table.

5. The method for distributed photothermal testing according to claim 1, characterized in that: In the heat distribution space, the thermal parameters of the optoelectronic product to be tested are defined according to a plurality of heat and light distribution characteristics, including: In the thermal distribution space, a thermal distribution map of the optoelectronic product to be tested is collected; defining a plurality of closed-loop contours based on the heat map; Matching corresponding heat distribution areas based on a plurality of closed-loop contours to define a plurality of heat distribution areas; Collect the number of heat distribution areas and define the relative positions of each heat distribution area; defining a second parameter based on the number of heat distribution regions and the relative positions of the heat distribution regions; matching a corresponding heat distribution feature according to the second parameter and a regional parameter of the heat distribution region; Thermal parameters of the optoelectronic product to be tested are defined according to a plurality of thermal distribution characteristics and a thermal parameter matching table.

6. The method for distributed photothermal testing according to claim 5, characterized in that: The associating optical parameters and thermal parameters, and defining the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested, includes: Freeze optical parameters and thermal parameters; correlate optical parameters and thermal parameters; Defining correlation coefficients based on optical parameters and thermal parameters; Collecting the test level of the optoelectronic product to be tested, and defining the level coefficient according to the test level of the optoelectronic product to be tested; The grade coefficient and the correlation coefficient are associated, and the balance coefficient is defined based on the grade coefficient and the correlation coefficient.

7. The method for distributed photothermal testing according to claim 6, characterized in that: The associating optical parameters and thermal parameters, defining the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested, also includes: If the balance coefficient is greater than a preset balance coefficient threshold, the association of the test level, optical parameters and thermal parameters of the optoelectronic product to be tested is triggered; The effect level of the optoelectronic product to be tested is defined according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested.

8. The method for distributed photothermal testing according to claim 7, characterized in that: Defining the overall quality parameters of the optoelectronic product to be tested according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested, and the service life of the optoelectronic product to be tested, and matching the corresponding quality level, includes: Freeze the spatial position of the optoelectronic product to be tested relative to the test space; Define spatial coefficients and environmental coefficients based on spatial location; Correlate the effect level, space factor and environmental factor of the optoelectronic product to be tested; A first quality factor is defined based on an effect level, a space factor, and an environmental factor of the optoelectronic product to be tested.

9. The method for distributed photothermal testing according to claim 8, characterized in that: The method further includes defining the overall quality parameters of the optoelectronic product to be tested according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect level of the optoelectronic product to be tested, and the service life of the optoelectronic product to be tested, and matching the corresponding quality level. Collecting the service life of the optoelectronic product to be tested; defining a second quality coefficient based on the service life of the optoelectronic product to be tested and the model of the optoelectronic product to be tested; defining an overall quality parameter of the optoelectronic product to be tested according to the second quality coefficient and the first quality coefficient; Match the corresponding quality grade according to the overall quality parameters of the optoelectronic products and the quality grade comparison table, and mark the quality grade.

10. A system for distributed photothermal testing, characterized in that: The system for photothermal distributed testing is applied to the method for photothermal distributed testing as claimed in any one of claims 1 to 9, and the system for photothermal distributed testing includes: A collection module, used for locating the optoelectronic product to be tested and collecting the position of the optoelectronic product to be tested; A distribution space module, used to trigger a positioning detection based on the position of the optoelectronic product to be tested, and output a light distribution space and a heat distribution space based on the positioning detection of the optoelectronic product to be tested; An optical parameter module, used to define optical parameters of the optoelectronic product to be tested according to a plurality of light distribution characteristics in the light distribution space; A thermal parameter module, used to define the thermal parameters of the photovoltaic product to be tested according to a plurality of thermal and optical distribution characteristics in a thermal distribution space; An effect level module, used to associate optical parameters with thermal parameters, and define the effect level of the optoelectronic product to be tested according to the test level, optical parameters and thermal parameters of the optoelectronic product to be tested; The quality grade module is used to define the overall quality parameters of the optoelectronic product to be tested and match the corresponding quality grade according to the spatial position of the optoelectronic product to be tested relative to the test space, the effect grade of the optoelectronic product to be tested and the service life of the optoelectronic product to be tested.

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