Screen printing detection method, device, equipment and medium

Abstract

The invention discloses a screen printing detection method, device and equipment and a medium. The method comprises the following steps: acquiring a front image and a back image of a detected chip substrate, and performing image correction processing on the front image and the back image to obtain a target front image and a target back image; determining coordinates of vertexes of all chip front image areas in the target front image; determining coordinates of vertexes of each chip reverse image area in the target reverse image, and determining a rectangular frame of each chip reverse image area; and determining the coordinates of the silk-screen marking graph in the reverse image area of each chip, and determining a silk-screen detection result according to the distance between the silk-screen marking graph in the reverse image area of each chip and the rectangular frame of the reverse image of each chip. According to the embodiment of the invention, whether the silk screen on each chip arranged on the chip substrate is located in the specified range on the packaging surface of the chip can be automatically determined based on the front image and the back image of the chip substrate.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a silk screen detection method, device, equipment and medium. Background Art

[0002] A plurality of chips are usually arranged on a chip substrate. The front area of ​​each chip can be seen from the front of the chip substrate. The front area of ​​the chip is the package surface of the chip that can be seen from the front of the chip substrate. The front area of ​​the chip includes the pins on the chip. The back area of ​​each chip can be seen from the back of the chip substrate. The back area of ​​the chip is the package surface of the chip that can be seen from the back of the chip substrate. The back area of ​​the chip includes the silk screen on the chip. The silk screen on the chip is the chip identification information engraved on the package surface of the chip. Before the chip substrate is put into use, it is necessary to detect the silk screen on each chip set on the chip substrate to determine whether the silk screen is within the specified range on the package surface of the chip.

[0003] In the related art, the commonly used silk screen detection scheme is that the technician detects the silk screen on each chip set on the chip substrate to determine whether the silk screen is located within the specified range on the chip packaging surface. The silk screen detection scheme in the related art requires manual operation to determine whether the silk screen on each chip set on the chip substrate is located within the specified range on the chip packaging surface. The detection efficiency is low, the labor cost and time cost are high, and the accuracy is difficult to guarantee. Summary of the invention

[0004] The present invention provides a silk screen detection method, device, equipment and medium to solve the problem that the silk screen detection scheme in the related art needs to be manually operated to determine whether the silk screen on each chip set on the chip substrate is located within a specified range on the chip packaging surface, the detection efficiency is low, the labor cost and time cost are high, and the accuracy is difficult to guarantee.

[0005] According to one aspect of the present invention, there is provided a silk screen detection method, comprising:

[0006] Acquire a front image and a back image of the substrate of the chip under test, and perform image correction processing on the front image and the back image to obtain a target front image and a target back image;

[0007] Determine the coordinates of the vertices of each chip front image region in the target front image;

[0008] According to the coordinates of the vertices of the front image regions of each chip in the target front image, the coordinates of the vertices of the back image regions of each chip in the target back image are determined, and the rectangular frames of the back image regions of each chip are determined;

[0009] The coordinates of the silk-screen mark pattern in the back image area of ​​each chip are determined, and the silk-screen detection result of the tested chip substrate is determined according to the distance between the silk-screen mark pattern in the back image area of ​​each chip and the rectangular frame of each chip back image.

[0010] According to another aspect of the present invention, there is provided a screen printing detection device, comprising:

[0011] An image acquisition module is used to acquire a front image and a back image of the substrate of the chip under test, and perform image correction processing on the front image and the back image to obtain a target front image and a target back image;

[0012] A first determination module, used to determine the coordinates of the vertices of each chip front image region in the target front image;

[0013] A second determination module is used to determine the coordinates of the vertices of the back image regions of each chip in the target back image according to the coordinates of the vertices of the front image regions of each chip in the target front image, and determine the rectangular frame of each chip back image region;

[0014] The result determination module is used to determine the coordinates of the silk-screen mark pattern in the back image area of ​​each chip, and determine the silk-screen detection result of the tested chip substrate according to the distance between the silk-screen mark pattern in the back image area of ​​each chip and the rectangular frame of each chip back image.

[0015] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0016] at least one processor;

[0017] and a memory communicatively coupled to the at least one processor;

[0018] The memory stores a computer program executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the silk screen detection method described in any embodiment of the present invention.

[0019] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the silk screen detection method described in any embodiment of the present invention when executed.

[0020] The technical solution of the embodiment of the present invention obtains the front image and the back image of the substrate of the chip to be tested, performs image correction processing on the front image and the back image, and obtains the target front image and the target back image; then determines the coordinates of the vertices of the front image area of ​​each chip in the target front image; according to the coordinates of the vertices of the front image area of ​​each chip in the target front image, determines the coordinates of the vertices of the back image area of ​​each chip in the target back image, and determines the rectangular frame of the back image area of ​​each chip; finally, determines the coordinates of the silk-screen mark graphics in the back image area of ​​each chip, and determines the coordinates of the silk-screen mark graphics in the back image area of ​​each chip according to the coordinates of the silk-screen mark graphics in the back image area of ​​each chip. The distance between the rectangular frames of the back image is used to determine the silk screen detection result of the chip substrate under test, which solves the problem that the silk screen detection scheme in the related technology needs to be manually operated to determine whether the silk screens on each chip set on the chip substrate are located within the specified range on the chip packaging surface, the detection efficiency is low, the labor cost and time cost are high, and the accuracy is difficult to guarantee. It can automatically determine whether the silk screens on each chip set on the chip substrate are located within the specified range on the chip packaging surface based on the front image and the back image of the chip substrate, which reduces the labor cost and time cost of the silk screen detection process and improves the efficiency and accuracy of the silk screen detection process.

[0021] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 The present invention provides a flowchart of a screen printing detection method according to the first embodiment of the present invention.

[0024] Figure 2 A schematic diagram of a front image of a target provided in Embodiment 1 of the present invention.

[0025] Figure 3 A schematic diagram of a reverse side image of a target provided in Embodiment 1 of the present invention.

[0026] Figure 4 This is a flow chart of a silk screen detection method provided in Embodiment 2 of the present invention.

[0027] Figure 5This is a structural schematic diagram of a silk screen detection device provided in Embodiment 3 of the present invention.

[0028] Figure 6 A schematic diagram of the structure of an electronic device for implementing the screen printing detection method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0030] It should be noted that the terms "target", "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprise", "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] Embodiment 1

[0032] Figure 1 A flowchart of a silk screen detection method provided in the first embodiment of the present invention. This embodiment can be applied to the case of determining whether the silk screen on each chip set on the chip substrate is located within a specified range on the chip packaging surface. The method can be executed by a silk screen detection device, which can be implemented in the form of hardware and / or software, and the silk screen detection device can be configured in an electronic device. The electronic device is used to determine whether the silk screen on each chip set on the chip substrate is located within a specified range on the chip packaging surface. Figure 1 As shown, the method includes:

[0033] Step 101: Acquire a front image and a back image of a substrate of a chip under test, and perform image correction processing on the front image and the back image to obtain a target front image and a target back image.

[0034] Optionally, before the chip substrate is put into use, it is necessary to detect the silk screen on each chip set on the chip substrate to determine whether the silk screen is located within a specified range on the chip packaging surface. The chip substrate to be tested is the chip substrate to be tested. A plurality of chips are arranged on the chip substrate to be tested. The front area of ​​each chip can be seen from the front of the chip substrate to be tested. The front area of ​​the chip is the packaging surface of the chip that can be seen from the front of the chip substrate to be tested. The front area of ​​the chip includes the pins on each chip. The back area of ​​each chip can be seen from the back of the chip substrate to be tested. The back area of ​​the chip is the packaging surface of the chip that can be seen from the back of the chip substrate to be tested. The back area of ​​the chip includes the silk screen on the chip. The silk screen on the chip is the chip identification information engraved on the packaging surface of the chip. The chip identification information may include the chip model, production date, production serial number and silk screen mark graphic. The silk screen mark graphic may be a circle of a preset size. The size of the front area of ​​the chip is the same as the size of the back area of ​​the chip.

[0035] Optionally, the front image of the chip substrate under test is an image of the chip substrate under test taken from the front side of the chip substrate under test. The front image of the chip substrate under test is an image of the chip substrate under test taken from the back side of the chip substrate under test. The size of the front image of the chip substrate under test is the same as the size of the back image of the chip substrate under test.

[0036] Optionally, obtaining the front image and the back image of the chip substrate under test includes: obtaining the front image and the back image of the chip substrate under test sent by the shooting component. The shooting component is a component used to shoot the chip substrate under test to obtain the front image and the back image of the chip substrate under test. The shooting component can be an industrial camera used to shoot the chip substrate under test to obtain the front image and the back image of the chip substrate under test. After shooting the chip substrate under test to obtain the front image and the back image of the chip substrate under test, the shooting component can send the front image and the back image of the chip substrate under test to the electronic device.

[0037] Optionally, the target front image is a front image of the substrate of the chip under test that has been subjected to image correction processing. The target back image is a back image of the substrate of the chip under test that has been subjected to image correction processing. Image correction processing includes binarization processing and / or rotation correction processing. Binarization processing of an image may refer to setting the pixel values ​​of all pixels in the image whose pixel values ​​are less than a preset pixel value to 0, and setting the pixel values ​​of all pixels in the image whose pixel values ​​are greater than or equal to a preset pixel value to 255. Rotation correction processing of an image may refer to determining a deflection angle of the image, and rotationally correcting the image according to the deflection angle of the image.

[0038] Optionally, performing image correction processing on the front image and the back image to obtain a target front image and a target back image includes: performing image correction processing on the front image to obtain a target front image; performing image correction processing on the back image to obtain a target back image.

[0039] Optionally, the image correction process includes binarization and rotation correction. The target front image is a front image of the substrate of the chip under test that has been binarized and rotated. The image correction process is performed on the front image to obtain the target front image, including: binarizing the front image according to a binarization algorithm to obtain a binarized image; and rotating the binarized image according to a rotation correction algorithm to obtain the target front image. The binarization algorithm is an algorithm set in an electronic device for binarizing an image. The electronic device can binarize the image according to the binarization algorithm to obtain a binarized image. The binarized image is an image that has been binarized. The rotation correction algorithm is an algorithm set in an electronic device for determining the deflection angle of the image and performing rotation correction on the image according to the deflection angle of the image. The electronic device can perform rotation correction on the image according to the rotation correction algorithm. The electronic device can first binarize the front image according to the binarization algorithm to obtain a binarized front image, that is, to obtain a binarized image. Then the electronic device continues to perform rotation correction processing on the obtained binary image according to the rotation correction algorithm to obtain a front image of the substrate of the chip under test after the binarization processing and the rotation correction processing, that is, to obtain a target front image.

[0040] Optionally, the image correction process includes binarization and rotation correction. The target reverse image is a reverse image of the substrate of the chip under test that has been binarized and rotated. The reverse image is subjected to image correction to obtain the target reverse image, including: binarizing the reverse image according to a binarization algorithm to obtain a binarized image; and rotating the binarized image according to a rotation correction algorithm to obtain the target reverse image. The binarization algorithm is an algorithm set in an electronic device for binarizing an image. The electronic device can binarize the image according to the binarization algorithm to obtain a binarized image. The binarized image is an image that has been binarized. The rotation correction algorithm is an algorithm set in an electronic device for determining the deflection angle of an image and performing rotation correction on the image according to the deflection angle of the image. The electronic device can perform rotation correction on the image according to the rotation correction algorithm. The electronic device can first binarize the reverse image according to the binarization algorithm to obtain a binarized reverse image, that is, to obtain a binarized image. Then the electronic device continues to perform rotation correction processing on the obtained binary image according to the rotation correction algorithm to obtain the reverse side image of the substrate of the chip under test after the binarization processing and the rotation correction processing, that is, to obtain the target reverse side image.

[0041] Step 102: determine the coordinates of the vertices of each chip front image region in the target front image.

[0042] Optionally, each chip front image area is an image area in the target front image that includes the front area of ​​each chip. A plurality of chips are arranged on the substrate of the chip under test. The front area of ​​each chip can be seen from the front of the substrate of the chip under test. The target front image includes a plurality of chip front image areas. Each chip front image area includes the front area of ​​one chip.

[0043] Optionally, the chip front image area can be an image area with a rectangular shape. The vertices of the chip front image area include a pixel located at the upper left corner of the chip front image area, a pixel located at the upper right corner of the chip front image area, a pixel located at the lower right corner of the chip front image area, and a pixel located at the lower left corner of the chip front image area. The coordinates of the vertices of the chip front image area include the coordinates of the pixel located at the upper left corner of the chip front image area, the coordinates of the pixel located at the upper right corner of the chip front image area, the coordinates of the pixel located at the lower right corner of the chip front image area, and the coordinates of the pixel located at the lower left corner of the chip front image area. The coordinates of the pixel points can be the coordinates of the pixel points in the image coordinate system of the target front image.

[0044] Optionally, the target front image is an image with a rectangular shape. The image coordinate system of the target front image takes the pixel point in the upper left corner of the target front image as the origin, the straight line passing through the pixel point in the upper left corner of the target front image and the pixel point in the upper right corner of the target front image as the horizontal axis, and the straight line passing through the pixel point in the upper left corner of the target front image and the pixel point in the lower left corner of the target front image as the vertical axis. The coordinates of the pixel point include the horizontal coordinate and the vertical coordinate of the pixel point in the image coordinate system of the target front image. The horizontal coordinate of the pixel point in the image coordinate system of the target front image is the distance between the pixel point and the vertical axis. The vertical coordinate of the pixel point in the image coordinate system of the target front image is the distance between the pixel point and the horizontal axis.

[0045] Optionally, determining the coordinates of the vertices of each chip front image area in the target front image includes: identifying the vertices of each chip front image area in the target front image according to a vertex template, and determining the coordinates of the vertices of each chip front image area in the target front image.

[0046] Optionally, the vertices of each chip front image area in the target front image are identified according to a vertex template to determine the coordinates of the vertices of each chip front image area in the target front image, including: inputting the target front image into a pre-trained image recognition model to obtain pixel point information of each chip front image area in the target front image output by the image recognition model; for each chip front image area in the target front image, the vertices of the chip front image area are identified according to the vertex template and the pixel point information of the chip front image area to determine the coordinates of the vertices of the chip front image area.

[0047] Optionally, a pre-trained image recognition model is provided in the electronic device. The pre-trained image recognition model is used to perform image recognition on the target front image of the chip substrate to obtain pixel information of each chip front image area in the target front image. The input of the image recognition model is the target front image, and the output of the image recognition model is the pixel information of each chip front image area in the target front image. The pixel information of each chip front image area includes the coordinates and pixel values ​​of each pixel in the chip front image area. The electronic device inputs the target front image into the pre-trained image recognition model, and the pre-trained image recognition model analyzes the target front image, determines the pixel information of each chip front image area in the target front image, and then outputs the pixel information of each chip front image area in the target front image. The pre-trained image recognition model can be set in the electronic device by a technician.

[0048] Optionally, a vertex template is stored in the electronic device. The vertex template includes surrounding pixel information of a pixel located at the upper left corner of the chip front image area, surrounding pixel information of a pixel located at the upper right corner of the chip front image area, surrounding pixel information of a pixel located at the lower right corner of the chip front image area, and surrounding pixel information of a pixel located at the lower left corner of the chip front image area.

[0049] Optionally, the surrounding pixel information of a pixel point includes pixel values ​​of eight pixels adjacent to the pixel point. The eight pixels adjacent to the pixel point include a pixel adjacent to the pixel point and located to the left of the pixel point, a pixel adjacent to the pixel point and located to the upper left of the pixel point, a pixel adjacent to the pixel point and located above the pixel point, a pixel adjacent to the pixel point and located to the upper right of the pixel point, a pixel adjacent to the pixel point and located to the right of the pixel point, a pixel adjacent to the pixel point and located to the lower right of the pixel point, a pixel adjacent to the pixel point and located below the pixel point, and a pixel adjacent to the pixel point and located to the lower left of the pixel point. The surrounding pixel information of a pixel point includes pixel values ​​of eight pixels adjacent to the pixel point. The pixel values ​​of the eight pixels adjacent to the pixel point include the pixel value of the pixel adjacent to the pixel point and located to the left of the pixel point, the pixel value of the pixel adjacent to the pixel point and located to the upper left of the pixel point, the pixel value of the pixel adjacent to the pixel point and located above the pixel point, the pixel value of the pixel adjacent to the pixel point and located to the upper right of the pixel point, the pixel value of the pixel adjacent to the pixel point and located to the right of the pixel point, the pixel value of the pixel adjacent to the pixel point and located to the lower right of the pixel point, the pixel value of the pixel adjacent to the pixel point and located below the pixel point, and the pixel value of the pixel adjacent to the pixel point and located to the lower left of the pixel point.

[0050] Optionally, for each chip front image area in the target front image, the vertices of the chip front image area are identified according to the vertex template and the pixel point information of the chip front image area, and the coordinates of the vertices of the chip front image area are determined, including: performing the following operations for each chip front image area in the target front image: detecting whether the surrounding pixel information of each pixel point in the chip front image area is the same as the surrounding pixel information of the pixel point located at the upper left corner of the chip front image area, the surrounding pixel information of the pixel point located at the upper right corner of the chip front image area, the surrounding pixel information of the pixel point located at the lower right corner of the chip front image area, and the surrounding pixel information of the pixel point located at the lower left corner of the chip front image area in the vertex template; determining the pixel point whose surrounding pixel information is the same as the surrounding pixel information of the pixel point located at the upper left corner of the chip front image area in the vertex template as the pixel point located at the upper left corner of the chip front image area, and determining the coordinates of the pixel point whose surrounding pixel information is the same as the surrounding pixel information of the pixel point located at the upper left corner of the chip front image area in the vertex template as the coordinates of the pixel point located at the upper left corner of the chip front image area; comparing the surrounding pixel information with the vertex template The pixel point whose surrounding pixel information is the same as the pixel point located at the upper right corner of the chip front image area in the vertex template is determined as the pixel point located at the upper right corner of the chip front image area, and the coordinates of the pixel point whose surrounding pixel information is the same as the pixel point located at the upper right corner of the chip front image area in the vertex template are determined as the coordinates of the pixel point located at the upper right corner of the chip front image area; the pixel point whose surrounding pixel information is the same as the pixel point located at the lower right corner of the chip front image area in the vertex template is determined as the pixel point located at the lower right corner of the chip front image area, and the coordinates of the pixel point whose surrounding pixel information is the same as the pixel point located at the lower right corner of the chip front image area in the vertex template are determined as the coordinates of the pixel point located at the lower right corner of the chip front image area; the pixel point whose surrounding pixel information is the same as the pixel point located at the lower left corner of the chip front image area in the vertex template is determined as the pixel point located at the lower left corner of the chip front image area, and the coordinates of the pixel point whose surrounding pixel information is the same as the pixel point located at the lower left corner of the chip front image area in the vertex template are determined as the coordinates of the pixel point located at the lower left corner of the chip front image area. Thus, the coordinates of the vertices of each chip front side image region in the target front side image are determined.

[0051] Step 103 , determining the coordinates of the vertices of the respective chip front image regions in the target front image, and determining the rectangular frame of the respective chip back image regions.

[0052] Optionally, the target back image is an image with a rectangular shape. The image coordinate system of the target back image takes the pixel point in the upper left corner of the target back image as the origin, the straight line passing through the pixel point in the upper left corner of the target back image and the pixel point in the upper right corner of the target back image as the horizontal axis, and the straight line passing through the pixel point in the upper left corner of the target back image and the pixel point in the lower left corner of the target back image as the vertical axis. The coordinates of the pixel point include the horizontal coordinate and the vertical coordinate of the pixel point in the image coordinate system of the target back image. The horizontal coordinate of the pixel point in the image coordinate system of the target back image is the distance between the pixel point and the vertical axis. The vertical coordinate of the pixel point in the image coordinate system of the target back image is the distance between the pixel point and the horizontal axis.

[0053] Optionally, each chip front image area in the target front image has a corresponding chip back image area in the target back image. The chip back image area corresponding to the chip front image area is the image area of ​​the back area of ​​the chip to which the chip front image area contained in the target back image belongs. The size of the chip front image area is the same as the size of the chip back image area corresponding to the chip front image area. Normally, the coordinates of the vertices of the chip front image area are the same as the coordinates of the vertices of the corresponding chip back image area. Therefore, for each chip front image area in each target front image, the pixel points whose coordinates in the target back image are the same as the coordinates of the vertices of the chip front image area are the vertices of the chip back image area corresponding to the chip front image area in the target back image, and the coordinates of the pixel points whose coordinates in the target back image are the same as the coordinates of the vertices of the chip front image area are the coordinates of the vertices of the chip back image area corresponding to the chip front image area in the target back image.

[0054] Optionally, according to the coordinates of the vertices of each chip front image area in the target front image, the coordinates of the vertices of each chip back image area in the target back image are determined, including: performing the following operations for each chip front image area in the target front image: determining the pixel points whose coordinates in the target back image are the same as the coordinates of the vertices of the chip front image area as the vertices of the chip back image area in the target back image corresponding to the chip front image area, and determining the pixel points whose coordinates in the target back image are the same as the coordinates of the vertices of the chip front image area as the coordinates of the vertices of the chip back image area in the target back image corresponding to the chip front image area. Thus, the coordinates of the vertices of each chip back image area in the target back image are determined.

[0055] Optionally, the vertices of the chip front image area include a pixel located at the upper left corner of the chip front image area, a pixel located at the upper right corner of the chip front image area, a pixel located at the lower right corner of the chip front image area, and a pixel located at the lower left corner of the chip front image area. The vertices of the chip back image area include a pixel located at the upper left corner of the chip back image area, a pixel located at the upper right corner of the chip back image area, a pixel located at the lower right corner of the chip back image area, and a pixel located at the lower left corner of the chip back image area. The pixel point whose coordinates in the target back image are the same as the pixel point located at the upper left corner of the chip front image area is determined as the pixel point located at the upper left corner of the chip back image area corresponding to the chip front image area in the target back image, and the pixel point whose coordinates in the target back image are the same as the pixel point located at the upper left corner of the chip front image area is determined as the pixel point located at the upper left corner of the chip back image area corresponding to the chip front image area in the target back image. The pixel point whose coordinates in the target reverse image are the same as the pixel point located at the upper right corner of the chip front image area is determined as the pixel point located at the upper right corner of the chip reverse image area corresponding to the chip front image area in the target reverse image, and the pixel point whose coordinates in the target reverse image are the same as the pixel point located at the upper right corner of the chip front image area is determined as the pixel point located at the upper right corner of the chip reverse image area corresponding to the chip front image area in the target reverse image. The pixel point whose coordinates in the target reverse image are the same as the pixel point located at the lower right corner of the chip front image area is determined as the pixel point located at the lower right corner of the chip reverse image area corresponding to the chip front image area in the target reverse image, and the pixel point whose coordinates in the target reverse image are the same as the pixel point located at the lower right corner of the chip front image area is determined as the pixel point located at the lower right corner of the chip reverse image area corresponding to the chip front image area in the target reverse image. The pixel point whose coordinates in the target reverse image are the same as the pixel point located at the lower left corner of the chip front image area is determined as the pixel point located at the lower left corner of the chip reverse image area corresponding to the chip front image area in the target reverse image, and the pixel point whose coordinates in the target reverse image are the same as the pixel point located at the lower left corner of the chip front image area is determined as the pixel point located at the lower left corner of the chip reverse image area corresponding to the chip front image area in the target reverse image.

[0056] Optionally, determining the rectangular frame of each chip back image area includes: connecting the vertices of each chip back image area to obtain the rectangular frame of each chip back image area. The rectangular frame of the chip back image area is a rectangular frame obtained by connecting the vertices of the chip back image area. The rectangular frame of the chip back image area is composed of four sides. The four sides of the rectangular frame of the chip back image area are a first side, a second side, a third side and a fourth side. The first side is a line between a pixel point located at the upper left corner of the chip back image area and a pixel point located at the lower left corner of the chip back image area. The second side is a line between a pixel point located at the lower left corner of the chip back image area and a pixel point located at the lower right corner of the chip back image area. The third side is a line between a pixel point located at the lower right corner of the chip back image area and a pixel point located at the upper right corner of the chip back image area. The fourth side is a line between a pixel point located at the upper right corner of the chip back image area and a pixel point located at the upper left corner of the chip back image area.

[0057] Optionally, connecting the vertices of each chip back image area to obtain a rectangular frame of each chip back image area, including: performing the following operations for each chip back image area in the target back image: connecting the pixel point located at the upper left corner of the chip back image area and the pixel point located at the lower left corner of the chip back image area; connecting the pixel point located at the lower left corner of the chip back image area and the pixel point located at the lower right corner of the chip back image area; connecting the pixel point located at the lower right corner of the chip back image area and the pixel point located at the upper right corner of the chip back image area; connecting the pixel point located at the upper right corner of the chip back image area and the pixel point located at the upper left corner of the chip back image area.

[0058] Step 104 , determining the coordinates of the silk-screen mark pattern in each chip back image region, and determining the silk-screen inspection result of the tested chip substrate according to the distance between the silk-screen mark pattern in each chip back image region and the rectangular frame of each chip back image.

[0059] Optionally, determining the coordinates of the silk-screen mark graphics in the back image area of ​​each chip includes: identifying the silk-screen mark graphics in the back image area of ​​each chip according to the silk-screen mark graphic template, and determining the coordinates of the silk-screen mark graphics in the back image area of ​​each chip.

[0060] Optionally, the silk-screen mark pattern may be a circle of a preset size. The coordinates of the silk-screen mark pattern may be the coordinates of a pixel point located at the center of the silk-screen mark pattern. A silk-screen mark pattern template is stored in the electronic device. The silk-screen mark pattern template includes pixel information surrounding the pixel point located at the center of the silk-screen mark pattern in the chip reverse image area.

[0061] Optionally, the silk-screen mark graphics in each chip back image area are identified according to the silk-screen mark graphic template, and the coordinates of the silk-screen mark graphics in each chip back image area are determined, including: performing the following operations for each chip back image area in the target back image: detecting whether the surrounding pixel information of each pixel point located in the rectangular frame of the chip back image area is the same as the surrounding pixel information of the pixel point located at the center of the silk-screen mark graphic in the silk-screen mark graphic template in the chip back image area; determining the coordinates of the pixel point whose surrounding pixel information is the same as the surrounding pixel information of the pixel point located at the center of the silk-screen mark graphic in the silk-screen mark graphic template in the chip back image area as the coordinates of the silk-screen mark graphic in the chip back image area. Thus, the coordinates of the silk-screen mark graphic in each chip back image area in the target back image are determined.

[0062] Optionally, the distance between the silk-screen mark pattern in each chip back image area and the rectangular frame of each chip back image may include: the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area.

[0063] Optionally, the silk screen detection result of the chip substrate under test is determined according to the distance between the silk screen mark pattern in the back image area of ​​each chip and the rectangular frame of each chip back image, including: determining the distance between the silk screen mark pattern in the back image area of ​​each chip and the first side of the rectangular frame of each chip back image area; determining the distance between the silk screen mark pattern in the back image area of ​​each chip and the second side of the rectangular frame of each chip back image area; detecting whether the distance between the silk screen mark pattern in the back image area of ​​each chip and the first side of the rectangular frame of each chip back image area, and the distance between the silk screen mark pattern in the back image area of ​​each chip and the second side of the rectangular frame of each chip back image area are within a preset numerical range; if it is detected that the distance between the silk screen mark pattern in the back image area of ​​each chip and the first side of the rectangular frame of each chip back image area, and the distance between the silk screen mark pattern in the back image area of ​​each chip and the second side of the rectangular frame of each chip back image area are both within the preset numerical range, then the silk screen detection result of the chip substrate under test is determined to be qualified.

[0064] Optionally, the distance between the silk-screen mark pattern in the chip back image area and the first side of the rectangular frame of the chip back image area may refer to the distance between the pixel point at the center of the silk-screen mark pattern in the chip back image area and the first side of the rectangular frame of the chip back image area. The first side is a line between the pixel point at the upper left corner of the chip back image area and the pixel point at the lower left corner of the chip back image area. The chip back image area is an image area with a rectangular shape. The horizontal coordinate of the pixel point at the upper left corner of the chip back image area and the horizontal coordinate of the pixel point at the lower left corner of the chip back image area are the same. The first side is parallel to the longitudinal axis of the image coordinate system of the target back image. The difference between the horizontal coordinate of the pixel point at the center of the silk-screen mark pattern in the chip back image area and the horizontal coordinate of the pixel point at the upper left corner of the chip back image area is the distance between the pixel point at the center of the silk-screen mark pattern in the chip back image area and the first side of the rectangular frame of the chip back image area.

[0065] Optionally, determining the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area includes: performing the following operation for each chip back image area: calculating the difference between the horizontal coordinate of the pixel point at the center of the silk-screen mark pattern in the chip back image area and the horizontal coordinate of the pixel point at the upper left corner of the chip back image area, and determining the difference as the distance between the silk-screen mark pattern in the chip back image area and the first side of the rectangular frame of the chip back image area.

[0066] Optionally, the distance between the silk-screen mark pattern in the chip back image area and the second side of the rectangular frame of the chip back image area may refer to the distance between the pixel point at the center of the silk-screen mark pattern in the chip back image area and the second side of the rectangular frame of the chip back image area. The second side is a line between the pixel point at the lower left corner of the chip back image area and the pixel point at the lower right corner of the chip back image area. The chip back image area is an image area with a rectangular shape. The ordinate of the pixel point at the lower left corner of the chip back image area and the ordinate of the pixel point at the lower right corner of the chip back image area are the same. The second side is parallel to the horizontal axis of the image coordinate system of the target back image. The difference between the ordinate of the pixel point at the lower left corner of the chip back image area and the ordinate of the pixel point at the center of the silk-screen mark pattern in the chip back image area is the distance between the pixel point at the center of the silk-screen mark pattern in the chip back image area and the second side of the rectangular frame of the chip back image area.

[0067] Optionally, determining the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area includes: performing the following operation for each chip back image area: calculating the difference between the longitudinal coordinate of the pixel point at the lower left corner of the chip back image area and the longitudinal coordinate of the pixel point at the center of the silk-screen mark pattern in the chip back image area, and determining the difference as the distance between the silk-screen mark pattern in the chip back image area and the second side of the rectangular frame of the chip back image area.

[0068] Optionally, the preset numerical range is a pre-set numerical range. Normally, if the silk screen on the chip is located within the specified range on the chip packaging surface, the distance between the silk screen mark pattern in the chip back image area and the first side of the rectangular frame of the chip back image area and the distance between the silk screen mark pattern in the chip back image area and the second side of the rectangular frame of the chip back image area will be within the preset numerical range. If the silk screen on the chip is not located within the specified range on the chip packaging surface, the silk screen on the chip is offset, and the distance between the silk screen mark pattern in the chip back image area and the first side of the rectangular frame of the chip back image area or the distance between the silk screen mark pattern in the chip back image area and the second side of the rectangular frame of the chip back image area will not be within the preset numerical range. Exemplarily, the preset numerical range can be greater than 1.6 mm and less than 1.8 mm.

[0069] Optionally, the silk screen inspection result of the chip substrate under test is information used to characterize whether the silk screens on each chip set on the chip substrate under test are all located within a specified range on the chip packaging surface. The silk screen inspection result of the chip substrate under test is qualified or unqualified. If the silk screen inspection result of the chip substrate under test is qualified, it indicates that the silk screens on each chip set on the chip substrate under test are all located within a specified range on the chip packaging surface. If the silk screen inspection result of the chip substrate under test is unqualified, it indicates that the silk screens on one or more chips set on the chip substrate under test are not located within a specified range on the chip packaging surface.

[0070] Optionally, it is detected whether the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are within a preset value range. If it is detected that the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are both within the preset value range, indicating that the silk-screen on each chip set on the chip substrate under test is within the specified range on the chip packaging surface, and the silk-screen detection result of the chip substrate under test can be determined to be qualified.

[0071] Optionally, after detecting whether the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are within a preset numerical range, it also includes: if it is detected that the distance between the silk-screen mark pattern in the target chip back image area and the first side of the rectangular frame of the target chip back image area, or the distance between the silk-screen mark pattern in the target chip back image area and the second side of the rectangular frame of the target chip back image area is not within the preset numerical range, then determining that the silk-screen inspection result of the chip substrate under test is unqualified.

[0072] Optionally, the target chip back image area is one or more chip back image areas in each chip back image area. If it is detected that the distance between the silk-screen mark pattern in the target chip back image area and the first side of the rectangular frame of the target chip back image area or the distance between the silk-screen mark pattern in the target chip back image area and the second side of the rectangular frame of the target chip back image area is not within a preset value range, it indicates that the silk-screen on the chip to which the target chip back image area belongs is not within a specified range on the chip packaging surface, the silk-screen on one or more chips set on the chip substrate under test is not within a specified range on the chip packaging surface, and the silk-screen on the chip is offset, then it can be determined that the silk-screen detection result of the chip substrate under test is unqualified.

[0073] Optionally, after determining the silk screen inspection result of the tested chip substrate according to the distance between the silk screen mark graphic in the back image area of ​​each chip and the rectangular frame of the back image of each chip, it also includes: providing the silk screen inspection result of the tested chip substrate to the target user through the inspection management page.

[0074] Optionally, the detection management page is a page set in the electronic device for interacting with the target user and providing the target user with information related to the substrate of the chip under test. The target user may be a technician responsible for managing the substrate of the chip under test. Providing the silk screen detection result of the substrate of the chip under test to the target user through the detection management page includes: displaying the silk screen detection result of the substrate of the chip under test on the detection management page, thereby providing the silk screen detection result of the substrate of the chip under test to the target user.

[0075] Optionally, in a specific example, Figure 2 A schematic diagram of a front image of a target provided in Embodiment 1 of the present invention. Figure 3 Schematic diagram of a target reverse image provided by Embodiment 1 of the present invention. Figure 2 As shown, the target front image 111 of the chip substrate under test includes 48 chip front image areas 112. Figure 3 As shown, the target back surface image 113 of the chip substrate under test includes 48 chip back surface image areas 114 .

[0076] The technical solution of the embodiment of the present invention obtains the front image and the back image of the substrate of the chip to be tested, performs image correction processing on the front image and the back image, and obtains the target front image and the target back image; then determines the coordinates of the vertices of the front image area of ​​each chip in the target front image; according to the coordinates of the vertices of the front image area of ​​each chip in the target front image, determines the coordinates of the vertices of the back image area of ​​each chip in the target back image, and determines the rectangular frame of the back image area of ​​each chip; finally, determines the coordinates of the silk-screen mark graphics in the back image area of ​​each chip, and determines the coordinates of the silk-screen mark graphics in the back image area of ​​each chip according to the coordinates of the silk-screen mark graphics in the back image area of ​​each chip. The distance between the rectangular frames of the back image is used to determine the silk screen detection result of the chip substrate under test, which solves the problem that the silk screen detection scheme in the related technology needs to be manually operated to determine whether the silk screens on each chip set on the chip substrate are located within the specified range on the chip packaging surface, the detection efficiency is low, the labor cost and time cost are high, and the accuracy is difficult to guarantee. It can automatically determine whether the silk screens on each chip set on the chip substrate are located within the specified range on the chip packaging surface based on the front image and the back image of the chip substrate, which reduces the labor cost and time cost of the silk screen detection process and improves the efficiency and accuracy of the silk screen detection process.

[0077] Embodiment 2

[0078] Figure 4 The flowchart of a screen printing detection method provided in the second embodiment of the present invention. The embodiment of the present invention can be combined with each optional solution in one or more of the above embodiments. Figure 4 As shown, the method includes:

[0079] Step 201 : Acquire a front image and a back image of a substrate of a chip under test, and perform image correction processing on the front image and the back image to obtain a target front image and a target back image.

[0080] Step 202: Identify the vertices of each chip front image region in the target front image according to the vertex template, and determine the coordinates of the vertices of each chip front image region in the target front image.

[0081] Step 203, determine the coordinates of the vertices of the back image areas of each chip in the target back image according to the coordinates of the vertices of the front image areas of each chip in the target front image, and connect the vertices of the back image areas of each chip to obtain a rectangular frame of each chip back image area.

[0082] Step 204 : Identify the silk-screen mark pattern in the back image region of each chip according to the silk-screen mark pattern template, and determine the coordinates of the silk-screen mark pattern in the back image region of each chip.

[0083] Step 205 : Determine the distance between the silk-screen mark pattern in the back image region of each chip and the first side of the rectangular frame of the back image region of each chip.

[0084] Step 206 : Determine the distance between the silk-screen mark pattern in the back image region of each chip and the second side of the rectangular frame of the back image region of each chip.

[0085] Step 207, detect whether the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are within a preset value range.

[0086] Step 208: If it is detected that the distance between the silk-screen mark pattern in the back image area of ​​each chip and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in the back image area of ​​each chip and the second side of the rectangular frame of each chip back image area are both within a preset value range, it is determined that the silk-screen inspection result of the chip substrate under test is qualified.

[0087] The technical solution of the embodiment of the present invention can automatically perform image correction processing on the front image and the back image of the chip substrate to obtain the target front image and the target back image. According to the chip front image area in the target front image and the chip front image area in the target back image, it can be determined whether the silk screen on each chip set on the chip substrate is located within a specified range on the chip packaging surface, thereby reducing the manpower cost and time cost of the silk screen detection process and improving the efficiency and accuracy of the silk screen detection process.

[0088] Embodiment 3

[0089] Figure 5 This is a schematic diagram of the structure of a screen printing detection device provided in Embodiment 3 of the present invention. The device can be configured in an electronic device. Figure 5 As shown, the device includes: an image acquisition module 301 , a first determination module 302 , a second determination module 303 and a result determination module 304 .

[0090] Among them, the image acquisition module 301 is used to acquire the front image and the back image of the chip substrate under test, and perform image correction processing on the front image and the back image to obtain the target front image and the target back image; the first determination module 302 is used to determine the coordinates of the vertices of the front image area of ​​each chip in the target front image; the second determination module 303 is used to determine the coordinates of the vertices of the back image area of ​​each chip in the target back image according to the coordinates of the vertices of the front image area of ​​each chip in the target front image, and determine the rectangular frame of each chip back image area; the result determination module 304 is used to determine the coordinates of the silk screen mark graphics in the back image area of ​​each chip, and determine the silk screen detection result of the chip substrate under test according to the distance between the silk screen mark graphics in the back image area of ​​each chip and the rectangular frame of each chip back image.

[0091] The technical solution of the embodiment of the present invention obtains the front image and the back image of the substrate of the chip to be tested, performs image correction processing on the front image and the back image, and obtains the target front image and the target back image; then determines the coordinates of the vertices of the front image area of ​​each chip in the target front image; according to the coordinates of the vertices of the front image area of ​​each chip in the target front image, determines the coordinates of the vertices of the back image area of ​​each chip in the target back image, and determines the rectangular frame of the back image area of ​​each chip; finally, determines the coordinates of the silk-screen mark graphics in the back image area of ​​each chip, and determines the coordinates of the silk-screen mark graphics in the back image area of ​​each chip according to the coordinates of the silk-screen mark graphics in the back image area of ​​each chip. The distance between the rectangular frames of the back image is used to determine the silk screen detection result of the chip substrate under test, which solves the problem that the silk screen detection scheme in the related technology needs to be manually operated to determine whether the silk screens on each chip set on the chip substrate are located within the specified range on the chip packaging surface, the detection efficiency is low, the labor cost and time cost are high, and the accuracy is difficult to guarantee. It can automatically determine whether the silk screens on each chip set on the chip substrate are located within the specified range on the chip packaging surface based on the front image and the back image of the chip substrate, which reduces the labor cost and time cost of the silk screen detection process and improves the efficiency and accuracy of the silk screen detection process.

[0092] In an optional implementation of an embodiment of the present invention, optionally, the first determination module 302 is specifically used to: identify the vertices of each chip front image area in the target front image according to a vertex template, and determine the coordinates of the vertices of each chip front image area in the target front image.

[0093] In an optional implementation of an embodiment of the present invention, optionally, when performing the operation of determining the rectangular frame of each chip back image area, the second determination module 303 is specifically used to: connect the vertices of each chip back image area to obtain the rectangular frame of each chip back image area.

[0094] In an optional implementation of an embodiment of the present invention, optionally, when the result determination module 304 performs the operation of determining the coordinates of the silk-screen mark graphics in the back image area of ​​each chip, it is specifically used to: identify the silk-screen mark graphics in the back image area of ​​each chip according to the silk-screen mark graphic template, and determine the coordinates of the silk-screen mark graphics in the back image area of ​​each chip.

[0095] In an optional implementation of the embodiment of the present invention, optionally, when the result determination module 304 performs the operation of determining the silk screen detection result of the chip substrate under test according to the distance between the silk screen mark pattern in each chip back image area and the rectangular frame of each chip back image, it is specifically used to: determine the distance between the silk screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area; determine the distance between the silk screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area; detect whether the distance between the silk screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are within a preset value range; if it is detected that the distance between the silk screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are both within the preset value range, then determine that the silk screen detection result of the chip substrate under test is qualified.

[0096] In an optional implementation of an embodiment of the present invention, optionally, the result determination module 304 is also used for: if it is detected that the distance between the silk-screen mark pattern in the back image area of ​​the target chip and the first side of the rectangular frame of the back image area of ​​the target chip or the distance between the silk-screen mark pattern in the back image area of ​​the target chip and the second side of the rectangular frame of the back image area of ​​the target chip is not within a preset numerical range, then the silk-screen inspection result of the chip substrate under test is determined to be unqualified.

[0097] In an optional implementation manner of the embodiment of the present invention, optionally, the silk screen detection device further includes: a result providing module, which is used to provide the silk screen detection result of the tested chip substrate to a target user through a detection management page.

[0098] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0099] The above-mentioned silk screen detection device can execute the silk screen detection method provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the silk screen detection method.

[0100] Embodiment 4

[0101] Figure 6The components, their connections and relationships, and their functions shown herein are merely examples and are not intended to limit the implementation of the invention described and / or claimed herein.

[0102] like Figure 6 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program built from the storage unit 18 to the random access memory (RAM) 13. In the random access memory (RAM) 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the read-only memory (ROM) 12 and the random access memory (RAM) 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0103] A number of components in the electronic device 10 are connected to an input / output (I / O) interface 15, including an input unit 16, such as a keyboard, a mouse, etc., an output unit 17, such as various types of displays, speakers, etc., a storage unit 18, such as a disk, an optical disk, etc., and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0104] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a silk screen detection method.

[0105] In some embodiments, the silk screen detection method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via a read-only memory (ROM) 12 and / or a communication unit 19. When the computer program is built into a random access memory (RAM) 13 and executed by the processor 11, one or more steps of the silk screen detection method described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to perform the silk screen detection method in any other appropriate manner (for example, by means of firmware).

[0106] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0107] The computer program for implementing the silk screen inspection method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program can be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0108] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0109] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0110] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0111] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0112] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0113] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A screen printing detection method, characterized in that: include: Acquire a front image and a back image of the substrate of the chip under test, and perform image correction processing on the front image and the back image to obtain a target front image and a target back image; Determine the coordinates of the vertices of each chip front image region in the target front image; According to the coordinates of the vertices of the front image regions of each chip in the target front image, the coordinates of the vertices of the back image regions of each chip in the target back image are determined, and the rectangular frames of the back image regions of each chip are determined; The coordinates of the silk-screen mark pattern in the back image area of ​​each chip are determined, and the silk-screen detection result of the tested chip substrate is determined according to the distance between the silk-screen mark pattern in the back image area of ​​each chip and the rectangular frame of each chip back image.

2. The screen printing detection method according to claim 1, characterized in that: Determining the coordinates of the vertices of each chip front image region in the target front image includes: The vertices of each chip front image region in the target front image are identified according to the vertex template, and the coordinates of the vertices of each chip front image region in the target front image are determined.

3. The screen printing detection method according to claim 1, characterized in that: Determine the rectangular frame of the back image area of ​​each chip, including: The vertices of the back image area of ​​each chip are connected to obtain a rectangular frame of the back image area of ​​each chip.

4. The screen printing detection method according to claim 1, characterized in that: Determine the coordinates of the silkscreen marking pattern in the reverse image area of ​​each chip, including: The silk-screen mark pattern in the reverse image region of each chip is identified according to the silk-screen mark pattern template, and the coordinates of the silk-screen mark pattern in the reverse image region of each chip are determined.

5. The screen printing detection method according to claim 1, characterized in that: Determining the silk screen inspection result of the substrate of the chip under test according to the distance between the silk screen mark pattern in the back image area of ​​each chip and the rectangular frame of the back image of each chip, including: Determine the distance between the silk screen mark pattern in the back image area of ​​each chip and the first side of the rectangular frame of the back image area of ​​each chip; Determine the distance between the silk-screen mark pattern in the back image area of ​​each chip and the second side of the rectangular frame of the back image area of ​​each chip; Detect whether the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are within a preset value range; If it is detected that the distance between the silk-screen mark pattern in the back image area of ​​each chip and the first side of the rectangular frame of each chip back image area, and the distance between the silk-screen mark pattern in the back image area of ​​each chip and the second side of the rectangular frame of each chip back image area are both within the preset numerical range, then the silk-screen inspection result of the chip substrate under test is determined to be qualified.

6. The screen printing detection method according to claim 5, characterized in that: After detecting whether the distance between the silk-screen mark pattern in each chip back image area and the first side of the rectangular frame of each chip back image area and the distance between the silk-screen mark pattern in each chip back image area and the second side of the rectangular frame of each chip back image area are within a preset value range, the method further includes: If it is detected that the distance between the silk-screen mark pattern in the back image area of ​​the target chip and the first side of the rectangular frame of the back image area of ​​the target chip or the distance between the silk-screen mark pattern in the back image area of ​​the target chip and the second side of the rectangular frame of the back image area of ​​the target chip is not within the preset numerical range, the silk-screen inspection result of the chip substrate under test is determined to be unqualified.

7. The screen printing detection method according to claim 1, characterized in that: After determining the silk screen inspection result of the tested chip substrate according to the distance between the silk screen mark pattern in the back image area of ​​each chip and the rectangular frame of the back image of each chip, the method further includes: The silk screen inspection result of the tested chip substrate is provided to the target user through the inspection management page.

8. A screen printing detection device, characterized in that: include: An image acquisition module is used to acquire a front image and a back image of the substrate of the chip under test, and perform image correction processing on the front image and the back image to obtain a target front image and a target back image; A first determination module, used to determine the coordinates of the vertices of each chip front image region in the target front image; A second determination module is used to determine the coordinates of the vertices of the back image regions of each chip in the target back image according to the coordinates of the vertices of the front image regions of each chip in the target front image, and determine the rectangular frame of each chip back image region; The result determination module is used to determine the coordinates of the silk-screen mark pattern in the back image area of ​​each chip, and determine the silk-screen detection result of the tested chip substrate according to the distance between the silk-screen mark pattern in the back image area of ​​each chip and the rectangular frame of each chip back image.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively coupled to the at least one processor; The memory stores a computer program executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the silk screen detection method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the silk screen detection method according to any one of claims 1 to 7 when executed.

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