Device and method for measuring thickness of epitaxial layer of epitaxial wafer

Abstract

The present invention discloses a device for measuring the thickness of an epitaxial layer of an epitaxial wafer and a measuring method thereof, which relates to the field of epitaxial wafers, including a detection component, a sample to be detected, a storage table, a switching component, a grabbing component and a storage component, wherein the storage component includes a storage rack and a guide rod, and one side of the grabbing component is fixedly connected with a guide component, which is placed between two of the storage racks and is used to drive the storage racks to receive the sample to be detected. The present invention also discloses a method for measuring the thickness of an epitaxial layer of an epitaxial wafer, which includes the following steps: preparation, material loading detection, detection, result judgment, sample transfer, cyclic detection and sample classification. The present invention changes the placement position of the epitaxial wafer after detection by judging the detection result to avoid confusion of the epitaxial wafer after detection. The picking and stacking methods of the epitaxial wafers are changed to avoid damage to the epitaxial layer caused by friction of the epitaxial wafers, while increasing the damping effect during stacking to ensure the quality of the sample to be detected.

Description

Technical Field

[0001] The invention relates to the field of epitaxial wafer film thickness, and in particular to a device for measuring the thickness of an epitaxial layer of an epitaxial wafer and a measuring method thereof. Background Art

[0002] Epitaxial wafer is a material used in semiconductor manufacturing, usually refers to a single crystal thin film grown on a substrate material. The grown single crystal thin film is usually called an epitaxial layer. The thickness of the epitaxial layer is generally in the micron level. The new epitaxial layer will replicate the crystal structure of the silicon wafer. The epitaxial layer can adjust its electronic and optical properties as needed to adapt to applications in different fields, such as high-frequency devices, photodetectors, and solar cells. The measurement of epitaxial layer thickness is crucial to the quality control of semiconductor materials, which directly affects the performance of the final device.

[0003] For example, the Chinese patent with application number 202410223349.5 discloses a test fixture for testing the film thickness of epitaxial wafers, which relates to the technical field of epitaxial wafer film thickness, including a base plate, a support column and a support leg, wherein the support column is fixedly mounted on the upper side of the base plate, the support leg is fixedly mounted on the upper side of the base plate, a frame is fixedly mounted on the upper side of the base plate, a transmission mechanism is arranged between the support column and the support leg, a slide groove is provided on the upper side of the frame, a slider is slidably mounted in the slide groove, a bidirectional motor is fixedly mounted on one side of the frame, a threaded rod is fixedly mounted on the output end of the bidirectional motor, the slider is threadedly mounted on the circumference of the threaded rod, and an infrared spectrometer is fixedly mounted on the lower side of the slider. The bidirectional motor, the threaded rod and the infrared spectrometer can be used to detect the film thickness of the epitaxial wafer.

[0004] There are some problems in the use of the above technical solution. The technical solution cannot effectively ensure the quality of epitaxial wafers when classifying epitaxial wafers. The classification process may easily cause damage to the epitaxial wafers. When the epitaxial wafers are placed continuously, the position of the epitaxial wafers placed multiple times cannot be guaranteed to be accurate, which may easily affect the detection results. The epitaxial wafers are stored together after the detection is completed, which may easily cause friction between each other and damage the epitaxial layer.

[0005] Therefore, it is necessary to invent a device for measuring the thickness of the epitaxial layer of an epitaxial wafer and a measuring method thereof to solve the above-mentioned problem. Summary of the invention

[0006] The object of the present invention is to provide a device for measuring the thickness of an epitaxial layer of an epitaxial wafer and a measuring method thereof, so as to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for measuring the thickness of an epitaxial layer of an epitaxial wafer, comprising a detection component, a sample to be detected and a storage table, and also comprising a switching component, which is placed at the lower end of the storage table and is used to shift the position of the sample to be detected; a grabbing component, which is placed above a placement slot and does not correspond to the detection component, and is used to grab the sample to be detected after the detection is completed; the storage components, which are in two groups and are symmetrically arranged, and the storage components include a storage rack and a guide rod, and the storage rack is sleeved on the outside of the guide rod; each of the storage components also includes a fixed plate, which is fixedly connected to the lower end of the guide rod, and the guide rods are arranged in two groups. There are multiple guide rings, which are evenly arranged relative to the axis of the fixed plate; a guide ring, which is fixedly connected to the outer side of the corresponding guide rod, and is provided with a guide groove and a disassembly groove on the outer side, the guide groove is used to guide the rack to flip and fall, and the disassembly groove is used to dismantle the rack; the guide groove includes a falling groove and a flipping groove; a buffer washer, which is slidably sleeved on the outer side of the corresponding guide rod, and a support spring is fixedly connected to the lower end of the support spring, and the lower end of the support spring is fixedly connected to the fixed plate, and is used to support the rack that falls to the extreme position; a drive motor, whose output shaft is fixedly connected to the axial center position of the fixed plate, and is placed at the lower end of the fixed plate, and is used to switch the position of the rack;

[0008] A guide assembly is fixedly connected to one side of the grabbing assembly. The guide assembly is placed between the two racks and is used to drive the racks to receive the inspection samples.

[0009] Preferably, at least two placement slots are provided on the storage table, the samples to be tested are placed in the corresponding placement slots, and the detection component is arranged vertically and horizontally with one of the placement slots.

[0010] Preferably, each of the storage racks includes a guide sleeve, which is sleeved on the outer side of the guide rod; a plurality of receiving plates, which are evenly arranged along the axial direction of the guide sleeve, the receiving plates are fixedly connected to the guide sleeve, and the upper end of each receiving plate is fixedly connected to a limiting ring for limiting the position of the sample to be tested; a limiting boss, which is fixedly connected to the inner side of the guide sleeve and can slide along the guide groove and the disassembly groove; the number of the limiting bosses corresponds to the receiving plates, the limiting bosses are evenly arranged along the axial direction of the guide sleeve, and the spacing between two limiting bosses is the same as the spacing between two receiving plates; a pushing groove, which is opened on the outer side of the guide sleeve and arranged along the axial direction of the guide sleeve.

[0011] Preferably, a damping pad is fixedly connected in the drop groove to slow down the falling speed of the limiting boss.

[0012] Preferably, the guide assembly includes a guide frame, which is fixedly connected to the grab assembly and is provided with an arc-shaped slide groove corresponding to the direction of each of the storage components; a push slider, which is respectively arranged in the arc-shaped slide groove and can slide along the corresponding arc-shaped slide groove, and the end of each push slider is placed in the corresponding push groove; an arc-shaped spring leaf, which is arranged in the arc-shaped slide groove and the end of which is fixedly connected to the corresponding push slider; a sliding frame, which is arranged in the guide frame and can slide along the guide frame, and the middle part of the sliding frame is slidably connected with an insertion rod, and a side of the insertion rod away from the storage table is fixedly connected with a return spring; a positioning hole, which is opened on the outer side of the storage table, and the end of the insertion rod away from the return spring can enter the positioning hole; a pull rope, which passes through the arc-shaped slide groove respectively and is fixedly connected to the push slider, and the other end of each pull rope is fixedly connected to the sliding frame.

[0013] Preferably, a plurality of positioning grooves are provided on the top of the storage table, and the positioning grooves are coaxially arranged with the corresponding placement grooves; a guide ring is provided on the top of the storage table, and the lower end of the guide ring can be inserted into the corresponding positioning groove; and a plurality of supporting rollers are rotatably connected to the bottom of the storage table.

[0014] Preferably, the switching assembly includes an annular guide rail, the support roller is placed in the annular guide rail and can slide along the annular guide rail; there are multiple linear push rods, which are evenly distributed at the lower end of the annular guide rail, and the output end of each linear push rod is connected to the annular guide rail by a ball joint, so as to push the annular guide rail to move up and down; a driven gear, which is slidably mounted on the lower end of the storage table; a stepper motor, which is placed at the lower end of the storage table, and the outer side of the output shaft is fixedly connected with a driving gear, and the driving gear is meshed with the driven gear; a support plate, which is placed below the annular guide rail, the fixed end of the linear push rod and the stepper motor are fixedly connected to the support plate, and the driven gear is rotatably connected to the support plate.

[0015] Preferably, the grabbing assembly includes a support frame, a bottom of which passes through the middle of the storage table and is used to guide the sliding direction of the storage table; a plurality of flip hooks, which are evenly arranged in a circle, and the flip hooks correspond to the vertical direction of the positioning grooves; a swing rod, which is fixedly connected to the outer side of the corresponding flip hook, and the upper end is placed in the support frame; an L-shaped rod, which is rotatably connected to the inner side of the support frame, a through hole is opened in the middle of each L-shaped rod, the corresponding swing rod passes through the corresponding through hole, and the upper end of the L-shaped rod passes through the support frame; a drive ring, which is rotatably connected to the upper end of the support frame, and the end of each L-shaped rod is meshed with the drive ring; a servo, whose output shaft is meshed with the drive ring, and the servo is fixedly installed on the upper end of the support frame for adjusting the rotation angle of the flip hook.

[0016] Preferably, it also includes a shell, and the detection component, the support plate and the guide ring are all fixedly connected to the shell.

[0017] The present invention also discloses a method for measuring the thickness of an epitaxial layer of an epitaxial wafer, comprising the following steps:

[0018] S1. Preparation: Set the test parameters according to the test needs and pre-set the test standards;

[0019] S2, loading inspection: Place the sample to be inspected at the inspection position through the previous process;

[0020] S3, detection: The detection component detects multiple positions of the sample to be inspected and compares them with the detection standard set in S1;

[0021] S4, result judgment: determine whether the current sample to be tested is qualified according to the comparison result;

[0022] S5. Transfer samples: transfer the samples to be tested after the test to a non-testing position;

[0023] S6, loop detection: loop S2-S3, detect the next sample to be tested, and grab the tested sample to be tested;

[0024] S7, sample classification: loop S4-S5, and place the grabbed samples to be tested in the corresponding collection rack according to the test results of the grabbed samples to be tested.

[0025] Technical effects and advantages of the present invention:

[0026] 1. The present invention sets a guide component and multiple groups of storage components. When the storage table rotates counterclockwise to make the insertion rod and the sliding frame slide to the right, the pull rope drives the storage rack on the left to flip, and flips the corresponding receiving plate to the bottom of the grabbing component. The grabbing component places the tested sample on the receiving plate, and the storage table continues to rotate to separate the positioning hole from the insertion rod. The arc-shaped spring pushes the storage rack to reset. When it is necessary to place it on the storage component on the other side, the storage table can be rotated clockwise. During use, the quality of the sample to be tested is judged to determine the rotation direction of the storage table, and then the placement position of the sample to be tested is selected, thereby effectively achieving the purpose of classified placement of qualified and unqualified epitaxial wafers.

[0027] 2. The present invention arranges a grabbing assembly on a storage table. During the inspection and transfer of the sample to be inspected, the sample to be inspected is placed in a storage slot on the storage table to prevent the displacement of the sample to be inspected from affecting the inspection result. After the inspection is completed, the sample to be inspected reaches the bottom of the grabbing assembly through the rotation of the storage table. Multiple flip hooks rotate synchronously to fix the sample to be inspected above the flip hooks. During the rotation of the flip hooks, they do not contact the upper end surface of the sample to be inspected at any time to avoid damage to the epitaxial layer.

[0028] 3. The present invention sets a storage rack and a guide groove, and the arc-shaped spring sheet quickly pushes the storage rack to reset, and the limit boss slides into the drop groove, so that the storage rack slides downward, and the corresponding limit boss on the upper side enters the flip groove, completing the drop adjustment of the storage rack, preparing for the next acceptance of the inspection sample, achieving the function of automatic stacking, and avoiding damage to the epitaxial layer caused by friction of the inspection sample.

[0029] 4. The present invention arranges a damping pad in the drop groove so that when the rack falls, the limiting boss rubs against the damping pad, which reduces the falling speed of the rack, improves the safety of the samples to be tested, and reduces the risk of damage to the samples to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0031] Figure 2 It is a schematic diagram of the position of the detection component in the present invention.

[0032] Figure 3 It is a structural schematic diagram of the storage component in the present invention.

[0033] Figure 4 It is a schematic diagram of the structure of the guide ring in the present invention.

[0034] Figure 5 It is a schematic diagram of the expansion of the guide ring in the present invention.

[0035] Figure 6 It is a schematic diagram of the matching state of the storage rack and the guide rod in the present invention.

[0036] Figure 7 It is a schematic diagram of the matching state of the guide assembly and the storage rack in the present invention.

[0037] Figure 8 It is a schematic diagram of the structure of the guide component in the present invention.

[0038] Fig. 9 For the present invention Figure 8 A partial enlarged schematic diagram of the inner A area.

[0039] Fig.10 It is a structural schematic diagram of the switching component in the present invention.

[0040] Fig.11 It is a schematic diagram of the structure of the grabbing component in the present invention.

[0041] Fig.12 It is a schematic diagram of the coordination state of the storage component and the grabbing component in the present invention.

[0042] In the figure: 1, detection component; 2, sample to be tested; 3, storage table; 4, placement slot; 5, switching component; 6, grabbing component; 7, storage component; 8, guide component; 9, damping pad; 10, positioning slot; 11, guide ring; 12, support roller; 13, housing; 50, annular guide rail; 51, linear push rod; 52, driven gear; 53, stepping motor; 54, driving gear; 55, support plate; 60, support frame; 61, flip hook; 62, swing rod; 63, L-shaped rod; 64, through hole; 65, drive ring; 66, servo; 70, Storage rack; 701, guide sleeve; 702, receiving plate; 703, limit ring; 704, limit boss; 705, push groove; 71, guide rod; 72, fixed plate; 73, guide sleeve; 74, guide groove; 741, drop groove; 742, flip groove; 75, disassembly groove; 76, buffer washer; 77, support spring; 78, drive motor; 80, guide frame; 81, arc-shaped slide groove; 82, push slider; 83, arc-shaped spring leaf; 84, sliding frame; 85, insertion rod; 86, reset spring; 87, positioning hole; 88, pull rope. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Embodiment 1, the present invention provides as follows Figure 1-Figure 12The device for measuring the thickness of the epitaxial layer of an epitaxial wafer shown in the figure comprises a detection component 1, a sample to be detected 2 and a storage table 3. The detection component 1 is a prior art and will not be described in detail here. At least two placement slots 4 are provided on the storage table 3, and the sample to be detected 2 is placed in the corresponding placement slots 4. The detection component 1 and one of the placement slots 4 are arranged vertically and horizontally, and comprises a switching component 5, which is placed at the lower end of the storage table 3 and is used to transfer the position of the sample to be detected 2, and can transfer the sample to be detected 2 after detection to the classification position. The grabbing component 6 is placed above the placement slot 4 and does not correspond to the detection component 1, and is used to grab the sample to be detected 2 after detection, and place the sample to be detected 2 after detection in the corresponding position. The storage components 7 are divided into two groups and symmetrically arranged for placing qualified or unqualified samples 2 to be inspected. The samples 2 to be inspected after inspection are placed on different storage components 7 respectively. The storage components 7 include a storage rack 70 and a guide rod 71. The storage rack 70 is mounted on the outside of the guide rod 71. The storage rack 70 can rotate relative to the guide rod 71 and can slide relative to the guide rod 71.

[0045] Specifically, a guide assembly 8 is fixedly connected to one side of the grabbing assembly 6, and the guide assembly 8 is placed between two racks 70, and is used to drive the racks 70 to receive the inspection sample 2. The guide assembly 8 can flip the racks 70 to the bottom of the grabbing assembly 6, and reset after receiving the inspection sample 2.

[0046] More specifically, each storage assembly 7 also includes a fixed plate 72, which is fixedly connected to the lower end of the guide rod 71. There are multiple guide rods 71, and they are evenly arranged relative to the axis of the fixed plate 72. The arrangement of multiple guide rods 71 ​​allows the rack 70 to be pre-installed during the detection process, so that the rack 70 does not need to be stopped midway to replace, thereby improving the detection efficiency. The guide collar 73 is fixedly connected to the outer side of the corresponding guide rod 71, and a guide groove 74 and a disassembly groove 75 are opened on the outer side. The guide groove 74 is used to guide the rack 70 to flip and fall, and the disassembly groove 75 is used to dismantle the rack 70. It should be pointed out that the guide groove 74 includes a falling groove 741 and a flipping groove 742. The buffer washer 76 is slidably mounted on the outer side of the corresponding guide rod 71, and the lower end is fixedly connected with a support spring 77. The lower end of the support spring 77 is fixedly connected with the fixed plate 72, and is used to support the rack 70 that has fallen to the limit position, reduce the impact force inertia after the rack 70 falls, and prevent the sample 2 to be tested from being damaged by vibration. The buffer washer 76, the support spring 77 and the guide rod 71 correspond to each other. The drive motor 78, whose output shaft is fixedly connected with the axis position of the fixed plate 72 and is placed at the lower end of the fixed plate 72, is used to switch the position of the rack 70. The drive motor 78 is electrically connected with a controller and a power supply. When a rack 70 falls to the limit position, the drive motor 78 rotates the fixed plate 72, switches out the rack 70 that has been carrying the sample 2 to be tested, and switches the rack 70 that does not carry the sample 2 to be tested to the corresponding position, so as to achieve the purpose of not stopping the detection when replacing the rack 70.

[0047] Specifically, each rack 70 includes a guide sleeve 701, which is sleeved on the outside of the guide rod 71. There are multiple receiving trays 702, which are evenly arranged along the axial direction of the guide sleeve 701. The receiving trays 702 are fixedly connected to the guide sleeve 701. The upper end of each receiving tray 702 is fixedly connected to a limiting ring 703 for limiting the position of the sample 2 to be inspected. The grabbing component 6 places the sample 2 to be inspected after inspection in the limiting ring 703 to prevent the sample 2 to be inspected from moving and causing damage during transportation. The limiting boss 704 is fixedly connected to the inner side of the guide sleeve 701 and can slide along the guide groove 74 and the disassembly groove 75. It should be noted that the number of limiting bosses 704 corresponds to the receiving trays 702, and the limiting bosses 704 are evenly arranged along the axial direction of the guide sleeve 701. The distance between the two limiting bosses 704 is the same as the distance between the two receiving trays 702. The push groove 705 is opened on the outer side of the guide sleeve 701 and is arranged along the axial direction of the guide sleeve 701. The push groove 705 is acted upon by the guide assembly 8 to cause the guide sleeve 701 to rotate.

[0048] More specifically, the guide assembly 8 includes a guide frame 80, which is fixedly connected to the grab assembly 6, and an arc-shaped slide groove 81 is opened in the direction corresponding to each storage assembly 7, and the guide sleeve 701 is in contact with the outer wall of the arc-shaped slide groove 81. Pushing sliders 82 are respectively arranged in the arc-shaped slide grooves 81 and can slide along the corresponding arc-shaped slide grooves 81. The end of each pushing slider 82 is placed in the corresponding pushing groove 705. After the storage rack 70 falls to the limit position, the pushing groove 705 is separated from the pushing slider 82. The width of the pushing groove 705 is greater than the width of the pushing slider 82, so that the storage rack 70 can be slightly flipped relative to the pushing slider 82. When the fixed plate 72 pushes the storage rack 70 without the sample 2 to be tested, the pushing slider 82 can also accurately enter the pushing groove 705. The arc-shaped spring 83 is arranged in the arc-shaped slide groove 81, and the end is fixedly connected to the corresponding pushing slider 82, which is used to reset the pushing slider 82. The sliding frame 84 is arranged in the guide frame 80 and can slide along the guide frame 80. The middle part of the sliding frame 84 is slidably connected with an insertion rod 85. The side of the insertion rod 85 away from the storage table 3 is fixedly connected with a return spring 86. The positioning hole 87 is opened on the outside of the storage table 3, that is, the position that can contact the insertion rod 85. The end of the insertion rod 85 away from the return spring 86 can enter the positioning hole 87. The pull ropes 88 respectively pass through the arc-shaped slide grooves 81 and are fixedly connected to the push slider 82. The other end of each pull rope 88 is fixedly connected to the sliding frame 84.

[0049] It should be noted that during use, the storage table 3 descends, so that the end of the insertion rod 85 enters the positioning hole 87, and then the storage table 3 rotates counterclockwise to make the insertion rod 85 and the sliding frame 84 slide to the right, and the left push slide block 82 is slid along the arc-shaped slide groove 81 through the left pull rope 88, driving the left storage rack 70 to flip, and flip the receiving plate 702 to the lower end of the grabbing assembly 6; the storage table 3 continues to rotate to separate the positioning hole 87 from the insertion rod 85, at this time the arc-shaped spring leaf 83 quickly pushes the storage rack 70 to reset, and under the influence of inertia, the limiting boss 704 slides into the falling groove 741, causing the storage rack 70 to slide downward, and the corresponding limiting boss 704 on the upper side enters the flipping groove 742.

[0050] Specifically, a plurality of positioning grooves 10 are provided above the storage table 3. The positioning grooves 10 are coaxially arranged with the corresponding placement grooves 4, and the positioning grooves 10 are evenly provided at the gap positions on the sides of the placement grooves 4. A guide ring 11 is provided above the storage table 3, and the lower end of the guide ring 11 can be inserted into the corresponding positioning groove 10. The guide ring 11 can make the sample 2 to be tested fall accurately into the placement groove 4, thereby improving the accuracy of placing the sample 2 to be tested. A plurality of supporting rollers 12 are rotatably connected below the storage table 3, so that the storage table 3 can rotate stably. When in use, the sample 2 to be tested is placed in the guide ring through the previous process, and the sample 2 to be tested falls into the placement groove 4 along the guide ring 11 for testing. When the testing is completed, the storage table 3 descends, so that the guide ring 11 is separated from the storage table 3, and the storage table 3 can be flipped at this time.

[0051] More specifically, the switching assembly 5 includes an annular guide rail 50, and the supporting roller 12 is placed in the annular guide rail 50 and can slide along the annular guide rail 50, and the annular guide rail 50 is an annular structure with an opening facing upward. There are multiple linear push rods 51, which are evenly arranged at the lower end of the annular guide rail 50. The linear push rods 51 are electrically connected to a controller and a power supply. The output end of each linear push rod 51 is connected to the annular guide rail 50 by a ball joint, and is used to push the annular guide rail 50 up and down. Through the cooperation of multiple linear push rods 51, the height and inclination angle of the annular guide rail 50 can be adjusted. The linear push rods 51 are prior art and will not be described in detail here. The driven gear 52 is slidably mounted on the lower end of the storage table 3. The stepping motor 53 is placed at the lower end of the storage table 3, and the outer side of the output shaft is fixedly connected to a driving gear 54, and the driving gear 54 is meshed with the driven gear 52. The stepping motor 53 is electrically connected to a controller and a power supply. The stepping motor 53 is prior art and will not be described in detail here. The support plate 55 is placed below the annular guide rail 50. The fixed end of the linear push rod 51 and the stepper motor 53 are fixedly connected to the support plate 55. The driven gear 52 is rotatably connected to the support plate 55. During use, the height of the storage table 3 is adjusted by the linear push rod 51 and the annular guide rail 50, and the storage table 3 is rotated by the stepper motor 53.

[0052] Specifically, the grab assembly 6 includes a support frame 60, the bottom of which passes through the middle of the storage platform 3 and is used to guide the sliding direction of the storage platform 3. The bottom of the support frame 60 is fixedly connected to the support plate 55. There are multiple flip hooks 61, which are evenly arranged in a circle. The flip hooks 61 correspond to the vertical direction of the positioning groove 10, and the flip hooks 61 can rotate in the positioning groove 10. The swing rod 62 is fixedly connected to the outer side of the corresponding flip hook 61, and the upper end is placed in the support frame 60. The support frame 60 is provided with a avoidance hole corresponding to the moving position of the swing rod 62, so that the swing rod 62 can rotate relative to the support plate 55. The L-shaped rod 63 is rotatably connected to the inner side of the support frame 60. The middle part of each L-shaped rod 63 is provided with a through hole 64. The corresponding swing rod 62 passes through the corresponding through hole 64. The inner diameter of the through hole 64 is larger than the outer diameter of the swing rod 62, so that the swing rod 62 is pushed to flip during the swinging process of the L-shaped rod 63. The upper end of the L-shaped rod 63 passes through the support frame 60. The driving ring 65 is rotatably connected to the upper end of the support frame 60, and the end of each L-shaped rod 63 is engaged with the driving ring 65. The driving ring 65 rotates to rotate the L-shaped rod 63 relative to the support frame 60. At the same time, the flip hook 61 rotates so that its lower end can flip to the lower end of the sample 2 to be tested, avoiding contact with the sample 2 to be tested and causing damage. The servo motor 66, whose output shaft is meshed with the drive ring 65, is fixedly mounted on the upper end of the support frame 60 and is used to adjust the rotation angle of the flip hook 61. The servo motor 66 is electrically connected to the controller and the power supply. The servo motor 66 is a prior art and will not be described in detail herein. During use, when there is a sample piece 2 to be inspected after inspection below the support frame 60, the servo motor 66 rotates and the multiple L-shaped rods 63 rotate synchronously when passing through the drive ring 65. At this time, the swing rod 62 is affected by the through hole 64 to rotate the flip hook 61 in the positioning groove 10, and the sample piece 2 to be inspected is fixed between the multiple flip hooks 61. When the receiving plate 702 is below the support frame 60, the servo motor 66 rotates in the opposite direction to slowly reset the multiple flip hooks 61, and the sample piece 2 to be inspected falls under the influence of gravity until it falls into the limit ring 703.

[0053] More specifically, it also includes a shell 13 , and the detection component 1 , the support plate 55 and the guide ring 11 are all fixedly connected to the shell 13 .

[0054] In summary, when it is necessary to detect the thickness of the epitaxial layer, first set the detection standard and the number of detection times, then place the sample 2 to be detected in the placement slot 4 through the previous process, and detect it through the detection component 1. After the detection is completed, the placement table 3 is lowered by the switching component 5, and then the placement table 3 is rotated 180 degrees, and then the placement table 3 is raised and reset by the switching component 5, and another sample 2 to be detected is placed through the previous process, and the detected sample 2 to be detected is fixed between multiple flip hooks 61 through the grabbing component 6. After the next sample 2 to be detected is completed, the placement table 3 is lowered again. At this time, the end of the insertion rod 85 enters the positioning hole 87, and the rotation direction of the placement table 3 is determined by the detection result of the sample 2 to be detected between the current flip hooks 61. If the detection is qualified, the placement table 3 is rotated counterclockwise to rotate left and right. The pull rope 88 on the side causes the pushing slide block 82 on the left to slide along the arc-shaped slide groove 81, driving the left storage rack 70 to flip over and flip the corresponding receiving plate 702 to the lower end of the grab assembly 6. At this time, the storage table 3 stops rotating, and then the flip hook 61 is reset to place the sample 2 to be inspected on the flip hook 61 in the limiting ring 703, and then the storage table 3 continues to rotate, the positioning hole 87 is separated from the insertion rod 85, and the arc-shaped spring leaf 83 quickly pushes the storage rack 70 to reset, and the limiting boss 704 slides into the falling groove 741, so that the storage rack 70 slides downward, and the corresponding limiting boss 704 on the upper side enters the flip groove 742, completing the falling adjustment of the storage rack 70, and preparing for the next receiving sample 2 to be inspected; when the test is unqualified, the storage table 3 is rotated clockwise, and the storage rack 70 on the other side is used to collect the sample 2 to be inspected after the test.

[0055] When the rack 70 falls to the limit position, the uppermost limiting boss 704 slides out of the falling groove 741, the bottom of the rack 70 contacts the buffer washer 76, and the support spring 77 is compressed and contracted, and then the motor 78 is driven to rotate the fixed plate 72, and the rack 70 that has been carrying the sample 2 to be tested is switched out, and the rack 70 that does not carry the sample 2 to be tested is switched to the corresponding position, and then the rack 70 is manually rotated to make the limiting boss 704 correspond to the removal groove 75, and the rack 70 is manually lifted upward to take out the rack 70, and then the rack 70 that does not carry the sample 2 to be tested is put on the outside of the guide rod 71, and the limiting boss 704 on the lower side is adjusted to be placed in the flip groove 742 to prepare for the next replacement.

[0056] Embodiment 2: In the above embodiment, when the rack 70 receives the sample piece 2 to be tested after the test, the rack 70 may fall down due to excessive speed or inertia, causing the sample piece 2 to be tested to fall out of the limit ring 703, thereby damaging the sample piece 2 to be tested after the test. At the same time, the excessively fast falling speed may also reduce the stability of the falling of the rack 70. Therefore, based on the above problems, the scheme of the present invention is further improved to reduce the falling speed of the sample piece 2 to be tested, thereby reducing the damage to the sample piece 2 to be tested due to inertia.

[0057] Specifically, Figure 5 As shown, a damping pad 9 is fixedly connected in the falling groove 741. The damping pad 9 is made of rubber material or metal material with relatively high roughness, and is used to slow down the falling speed of the limiting boss 704. During the falling process of the storage rack 70, the limiting boss 704 rubs against the damping pad 9, so that the falling speed of the storage rack 70 is reduced, thereby improving the safety of the sample 2 to be inspected.

[0058] Embodiment 3, the present invention also provides a method for measuring the thickness of an epitaxial layer of an epitaxial wafer, comprising the following steps:

[0059] S1. Preparation: Set the test parameters according to the test needs and pre-set the test standards. Specifically, adjust the test times and set the test positions as needed.

[0060] S2, material loading inspection: the sample 2 to be inspected is placed at the inspection position through the previous process. Specifically, the sample 2 to be inspected is placed at the inspection position through the manipulator or other transfer equipment of the previous equipment, and the placement position of the sample 2 to be inspected is accurate.

[0061] S3, testing: the testing component 1 performs multiple position tests on the sample piece 2 to be tested, and compares the results with the test standard set in S1. Specifically, the testing component 1 is used to test the sample piece 2 to be tested according to the set test standard.

[0062] S4, result judgment: judge whether the current sample 2 to be tested is qualified according to the comparison result. Specifically, compare the test result of S3 with the test standard set in S1, judge whether the sample 2 to be tested is qualified, and record the test result.

[0063] S5, sample transfer: transfer the sample 2 to a non-testing position after the test is completed. Specifically, transfer the sample 2 to a classification area after the test to wait for classification and placement.

[0064] S6, loop detection: loop S2-S3, detect the next sample 2 to be detected, and grab the detected sample 2 to be detected. Specifically, place the next sample 2 to be detected again, so as to achieve the purpose of continuous detection.

[0065] S7, sample classification: loop S4-S5, place the grabbed sample 2 to be tested in the corresponding collection rack according to the test result of the grabbed sample 2 to be tested. Specifically, the tested sample 2 is placed in different collection racks according to the test results, and the height of the collection rack is automatically adjusted.

[0066] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for measuring the thickness of an epitaxial layer of an epitaxial wafer, comprising a detection component, a sample wafer to be tested and a storage table, characterized in that: Also includes: A switching component, which is placed at the lower end of the storage table and is used to shift the position of the sample to be inspected; The storage table is provided with at least two placement slots, the sample to be tested is placed in the corresponding placement slot, and the detection component is arranged vertically and horizontally with one of the placement slots; A grabbing component, which is placed above the placement slot and does not correspond to the detection component; The storage components are two in number and are symmetrically arranged. The storage components include a storage rack and a guide rod, and the storage rack is sleeved on the outside of the guide rod; each storage component also includes a fixed plate, which is fixedly connected to the lower end of the guide rod. The guide rods are multiple in number and are evenly arranged relative to the axis of the fixed plate; A guide collar, which is fixedly connected to the outer side of the corresponding guide rod and has a guide groove and a disassembly groove on the outer side, wherein the guide groove is used to guide the rack to flip and fall, and the disassembly groove is used to disassemble the rack; The guide groove includes a falling groove and a turning groove; A buffer washer, which is slidably mounted on the outer side of the corresponding guide rod, and a support spring is fixedly connected to the lower end thereof, and the lower end of the support spring is fixedly connected to the fixed plate, and is used to support the shelf that falls to the extreme position; A driving motor, whose output shaft is fixedly connected to the axis of the fixed plate and is disposed at the lower end of the fixed plate, and is used to switch the position of the storage rack; A guide assembly is fixedly connected to one side of the grabbing assembly. The guide assembly is placed between the two racks and is used to drive the racks to receive the inspection samples.

2. The device for measuring the thickness of an epitaxial layer of an epitaxial wafer according to claim 1, characterized in that: Each of the storage racks comprises a guide sleeve which is sleeved on the outside of the guide rod; There are multiple receiving plates, which are evenly arranged along the axial direction of the guide sleeve. The receiving plates are fixedly connected to the guide sleeve, and the upper end of each receiving plate is fixedly connected to a limiting ring for limiting the position of the sample to be tested; A limiting boss, which is fixedly connected to the inner side of the guide sleeve and can slide along the guide groove and the disassembly groove; The number of the limiting bosses corresponds to the receiving plates one by one, the limiting bosses are evenly arranged along the axial direction of the guide sleeve, and the distance between the two limiting bosses is the same as the distance between the two receiving plates; The pushing groove is opened on the outer side of the guide sleeve and is arranged along the axial direction of the guide sleeve.

3. The device for measuring the thickness of an epitaxial layer of an epitaxial wafer according to claim 2, characterized in that: A damping pad is fixedly connected in the falling groove to slow down the falling speed of the limiting boss.

4. The device for measuring the thickness of an epitaxial layer of an epitaxial wafer according to claim 3, characterized in that: The guide assembly includes a guide frame, which is fixedly connected to the grab assembly and has an arc-shaped slide groove corresponding to the direction of each storage assembly; Pushing slide blocks are respectively arranged in the arc-shaped slide grooves and can slide along the corresponding arc-shaped slide grooves, and the end of each pushing slide block is placed in the corresponding pushing groove; An arc-shaped spring sheet, which is arranged in the arc-shaped slide groove, and an end portion of which is fixedly connected to the corresponding pushing slider; A sliding frame, which is arranged in the guide frame and can slide along the guide frame, the middle part of the sliding frame is slidably connected with an insertion rod, and a side of the insertion rod away from the storage table is fixedly connected with a return spring; A positioning hole is provided on the outer side of the storage platform, and an end of the insertion rod away from the return spring can enter the positioning hole; The pull ropes respectively pass through the arc-shaped slide grooves and are fixedly connected to the push sliders, and the other end of each pull rope is fixedly connected to the slide frame.

5. The device for measuring the thickness of an epitaxial layer of an epitaxial wafer according to claim 1, characterized in that: A plurality of positioning grooves are provided on the top of the storage table, and the positioning grooves are coaxially arranged with the corresponding placement grooves; A guide ring is provided above the storage table, and the lower end of the guide ring can be inserted into the corresponding positioning groove; A plurality of supporting rollers are rotatably connected below the storage table.

6. The device for measuring the thickness of an epitaxial layer of an epitaxial wafer according to claim 5, characterized in that: The switching assembly comprises an annular guide rail, and the supporting roller is disposed in the annular guide rail and can slide along the annular guide rail; There are multiple linear push rods, which are evenly arranged at the lower end of the annular guide rail. The output end of each linear push rod is connected to the annular guide rail by a ball joint, so as to push the annular guide rail to move up and down. A driven gear, which is slidably mounted on the lower end of the storage platform; A stepper motor is placed at the lower end of the storage platform, and a driving gear is fixedly connected to the outer side of the output shaft, and the driving gear is meshed with the driven gear; A support plate is placed below the annular guide rail, the fixed end of the linear push rod and the stepper motor are fixedly connected to the support plate, and the driven gear is rotatably connected to the support plate.

7. The device for measuring the thickness of an epitaxial layer of an epitaxial wafer according to claim 5, characterized in that: The grab assembly includes a support frame, the bottom of which passes through the middle of the storage platform and is used to guide the sliding direction of the storage platform; There are multiple flip hooks, which are evenly arranged around the circumference, and the flip hooks correspond to the positioning grooves in the vertical direction; A swing rod, which is fixedly connected to the outer side of the corresponding flip hook, and the upper end of which is placed in the support frame; An L-shaped rod, which is rotatably connected to the inner side of the support frame, a through hole is opened in the middle of each L-shaped rod, the corresponding swing rod passes through the corresponding through hole, and the upper end of the L-shaped rod passes through the support frame; a drive ring rotatably connected to the upper end of the support frame, and an end of each of the L-shaped rods is engaged with the drive ring; A servo, whose output shaft is meshed with the drive ring, is fixedly mounted on the upper end of the support frame and is used to adjust the rotation angle of the flip hook.

8. The device for measuring the thickness of an epitaxial layer of an epitaxial wafer according to claim 6, characterized in that: It also includes a shell, and the detection component, the support plate and the guide ring are all fixedly connected to the shell.

9. A method for measuring the thickness of an epitaxial layer of an epitaxial wafer, applied to a device for measuring the thickness of an epitaxial layer of an epitaxial wafer as claimed in any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Preparation: Set the test parameters according to the test needs and pre-set the test standards; S2, loading inspection: Place the sample to be inspected at the inspection position through the previous process; S3, detection: The detection component detects multiple positions of the sample to be inspected and compares them with the detection standard set in S1; S4, result judgment: determine whether the current sample to be tested is qualified according to the comparison result; S5. Transfer samples: transfer the samples to be tested after the test to a non-testing position; S6, loop detection: loop S2-S3, detect the next sample to be tested, and grab the tested sample to be tested; S7, sample classification: loop S4-S5, and place the grabbed samples to be tested in the corresponding collection rack according to the test results of the grabbed samples to be tested.

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