Chip-on-film packaging structure

Abstract

The invention provides a chip-on-film packaging structure which comprises a flexible circuit carrier plate, a chip and an elastic reinforcing piece. The flexible circuit carrier has a first surface and a second surface opposite to each other, and a chip setting region defined on the first surface. The chip is arranged in the chip setting area and is electrically connected with the flexible circuit carrier plate. The elastic reinforcing member is disposed on the first surface or the second surface of the flexible circuit board and corresponds to the chip setting area. The elastic reinforcing piece comprises two first telescopic side wall parts which are opposite to each other and an upper cover part which is connected with the two first telescopic side wall parts. The orthographic projections of the two first telescopic side wall parts on the flexible circuit carrier plate respectively correspond to the two first edges of the chip setting area and are located outside the chip setting area. A variable distance is arranged between the upper cover part and the flexible circuit carrier plate. The chip-on-film packaging structure provided by the invention is provided with the elastic reinforcing piece, so that the bad influence on the chip caused by the vibration of the mechanism after the chip-on-film packaging structure is assembled on the mechanism can be avoided.

Description

Technical Field

[0001] The invention relates to a packaging structure, in particular to a chip-on-film packaging structure. Background Art

[0002] Some current chip-on-film packaging structures require the addition of a reinforcement plate on the surface where the chip is located (IC surface) or the bottom surface of the flexible substrate (PI surface) in response to specific product requirements. The reinforcement plate is usually attached in direct contact with the chip or the flexible substrate to protect the chip and reinforce the strength of the structure. However, after the chip-on-film packaging structure with a reinforcement plate is assembled in a mechanism such as a display panel, the reinforcement plate may directly contact the mechanism. When the mechanism is actuated or operated and generates vibration, the vibration may be transmitted to the chip through the reinforcement plate, thereby causing adverse effects on the chip. In addition, during assembly, there is a space limitation between the mechanism and the chip-on-film packaging structure, which also limits the thickness selection of the reinforcement plate. Summary of the invention

[0003] The present invention is directed to a chip-on-film packaging structure, which has an elastic reinforcing piece to prevent the chip from being adversely affected by the vibration of the mechanism after the chip-on-film packaging structure is assembled in the mechanism.

[0004] According to an embodiment of the present invention, a thin film chip package structure includes a flexible circuit carrier, a chip and an elastic reinforcement. The flexible circuit carrier has a first surface and a second surface opposite to each other and a chip setting area defined on the first surface. The chip setting area has two opposite first edges. The chip is arranged in the chip setting area and is electrically connected to the flexible circuit carrier. The elastic reinforcement is arranged on the first surface or the second surface of the flexible circuit carrier and corresponds to the chip setting area. The elastic reinforcement includes two first retractable side wall portions opposite to each other and an upper cover portion connecting the two first retractable side wall portions. The orthographic projections of the two first retractable side wall portions on the flexible circuit carrier correspond to the two first edges of the chip setting area respectively and are located outside the chip setting area. The upper cover portion and the flexible circuit carrier are spaced at a variable distance.

[0005] In the chip-on-film package structure according to an embodiment of the present invention, the elastic reinforcing member is disposed on the first surface of the flexible circuit carrier, the elastic reinforcing member covers the chip, and a buffer space is provided between the upper cover and the chip.

[0006] In the chip-on-film packaging structure according to the embodiment of the present invention, the variable distance is not less than the height from the back surface of the chip to the flexible circuit carrier.

[0007] In the chip-on-film package structure according to the embodiment of the present invention, the two first edges of the chip placement area are two long sides, and the two first retractable sidewall portions are parallel to the two first edges.

[0008] In the chip-on-film package structure according to the embodiment of the present invention, the orthographic projection of the upper cover on the flexible circuit substrate completely covers the orthographic projection of the chip on the flexible circuit substrate.

[0009] In the chip-on-film package structure according to the embodiment of the present invention, the orthographic projection of the upper cover on the flexible circuit substrate partially covers the orthographic projection of the chip on the flexible circuit substrate.

[0010] In the thin film chip-on-chip packaging structure according to an embodiment of the present invention, the above-mentioned chip setting area also has two opposite second edges, and the elastic reinforcement member also includes at least one second retractable side wall portion connected to the upper cover portion, and the orthographic projection of the at least one second retractable side wall portion on the flexible circuit carrier corresponds to at least one of the two second edges and is located outside the chip setting area.

[0011] In the chip-on-film packaging structure according to the embodiment of the present invention, a cross-section of each of the first retractable sidewall portions has at least one bend.

[0012] In the chip-on-film packaging structure according to the embodiment of the present invention, the at least one bend is in an arc shape, a sharp sawtooth shape or a square sawtooth shape.

[0013] In the chip-on-film packaging structure according to the embodiment of the present invention, the two first retractable sidewalls and the upper cover are integrally formed.

[0014] Based on the above, in the design of the thin film flip chip packaging structure of the present invention, the elastic reinforcement member arranged in the corresponding chip setting area has two first retractable side wall portions, which respectively correspond to the two first edges of the chip setting area, and the two first retractable side wall portions such as spring structures or bellows structures make the upper cover portion connecting the two first retractable side wall portions and the flexible circuit carrier have a variable distance. With this design, when the thin film flip chip packaging structure is assembled in a mechanism such as a display panel, if the mechanism generates vibration due to actuation or operation, the vibration force can be absorbed and slowed down by the elastic reinforcement member, and will not be directly transmitted to the chip, thereby avoiding the adverse effects of the vibration on the chip. In addition, since the elastic reinforcement member is elastic, its height has a certain range of variability, so it can be applied to the specification requirements of various accommodating spaces, and has a wider compatibility in application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1A is a schematic diagram of a chip-on-film packaging structure according to an embodiment of the present invention;

[0016] Figure 1B yes Figure 1A A schematic diagram of a chip-on-film packaging structure assembled on a display panel;

[0017] Figure 2is a schematic diagram of a chip-on-film packaging structure according to another embodiment of the present invention;

[0018] Figure 3 is a schematic diagram of a chip-on-film packaging structure according to another embodiment of the present invention;

[0019] Figure 4 FIG. 4 is a schematic diagram of a chip-on-film packaging structure according to another embodiment of the present invention.

[0020] Description of Reference Numerals

[0021] 1: Display panel;

[0022] 10: glass substrate;

[0023] 20: backlight module;

[0024] 30: circuit board;

[0025] 40:frame;

[0026] 100a, 100b, 100c, 100d: chip-on-film packaging structure;

[0027] 110: flexible circuit carrier;

[0028] 110a: first surface;

[0029] 110b: second surface;

[0030] 111: chip setting area;

[0031] 111a: first edge;

[0032] 111b: second edge;

[0033] 112: pin;

[0034] 114: solder mask;

[0035] 120: chip;

[0036] 121: back;

[0037] 130a, 130b, 130c, 130d: elastic reinforcement parts;

[0038] 132a, 132b, 132c, 132d: first retractable side wall portion;

[0039] 134a, 134b, 134c, 134d: upper cover portion;

[0040] 136c: second retractable side wall portion;

[0041] 138c: horizontal stripes;

[0042] 140: encapsulation colloid;

[0043] G: buffer space;

[0044] H: height;

[0045] S: Variable distance. DETAILED DESCRIPTION

[0046] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0047] The present invention is more fully described with reference to the accompanying drawings of the present embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thickness, size or size of the layers or regions in the accompanying drawings may be exaggerated for clarity.

[0048] Figure 1A FIG. 4 is a schematic diagram of a chip-on-film packaging structure according to an embodiment of the present invention. Figure 1B yes Figure 1A Schematic diagram of the chip-on-film packaging structure assembled on the display panel. Please refer to Figure 1A In this embodiment, the film flip chip package structure 100a includes a flexible circuit carrier 110, a chip 120 and an elastic reinforcement member 130a. The flexible circuit carrier 110 has a first surface 110a and a second surface 110b opposite to each other and a chip setting area 111 defined on the first surface 110a. The chip setting area 111 has two opposite first edges 111a and two opposite second edges 111b. Here, the chip setting area 111 is an approximately rectangular area, wherein the two first edges 111a are two long sides and the two second edges 111b are two short sides. The chip 120 is disposed in the chip setting area 111 and is electrically connected to the flexible circuit carrier 110. In detail, the flexible circuit carrier 110 also includes a plurality of pins 112 and a solder mask 114 located on the first surface 110a. The solder mask 114 partially covers the pins 112 and has an opening, which defines a chip setting area 111 to expose parts of the pins 112. The chip 120 can be configured in the chip setting area 111 in a flip-chip manner and electrically connected to parts of the pins 112 located in the chip setting area 111. In addition, the thin film flip chip packaging structure 100a may further include a packaging colloid 140, which is at least filled between the chip 120 and the flexible circuit carrier 110 to protect the electrical contacts between the two. In the present embodiment, the packaging colloid 140 is, for example, an underfill material. Figure 1AAs shown, the encapsulation colloid 140 can also cover the four side walls of the chip 120. It should be noted that Figure 1A Only the portion of the encapsulant 140 that is not covered by the elastic reinforcing member 130 a is schematically depicted, and the encapsulant 140 is shown in a perspective manner to facilitate presentation of the components covered by the encapsulant 140 .

[0049] The elastic reinforcing member 130a is disposed on the first surface 110a or the second surface 110b of the flexible circuit carrier 110 and corresponds to the chip setting area 111. The elastic reinforcing member 130a includes two first retractable side wall portions 132a opposite to each other and an upper cover portion 134a connecting the two first retractable side wall portions 132a. The orthographic projections of the two first retractable side wall portions 132a on the flexible circuit carrier 110 correspond to the two first edges 111a of the chip setting area 111 and are located outside the chip setting area 111. A variable distance S is spaced between the upper cover portion 134a and the flexible circuit carrier 110.

[0050] In detail, Figure 1A As shown, the elastic reinforcing member 130a of the present embodiment is disposed on the first surface 110a of the flexible circuit carrier 110, wherein the elastic reinforcing member 130a covers the chip 120, and a buffer space G is provided between the upper cover portion 134a and the chip 120. Here, the orthographic projection of the upper cover portion 134a on the flexible circuit carrier 110 completely covers the orthographic projection of the chip 120 on the flexible circuit carrier 110. The variable distance S between the upper cover portion 134a and the flexible circuit carrier 110 is not less than (i.e., greater than or equal to) the height H from the back surface 121 of the chip 120 to the flexible circuit carrier 110. The two first retractable sidewall portions 132a are parallel to the two first edges 111a of the chip setting area 111, wherein the cross section of each first retractable sidewall portion 132a has at least one bend, and here, the bend is specifically embodied as an arc, but is not limited thereto. In other embodiments, the bend may also be a sharp sawtooth shape, a square sawtooth shape, or other suitable shapes. In other words, the first retractable side wall portion 132a is similar to a spring structure or a bellows structure. In one embodiment, the two first retractable side wall portions 132a and the upper cover portion 134a may be integrally formed. The material of the elastic reinforcement member 130a may include a synthetic polymer material, such as polyethylene terephthalate (PET), or a metal material, such as copper foil.

[0051] Please refer to Figure 1A as well as Figure 1BThe display panel 1 includes a glass substrate 10, a backlight module 20, a circuit board 30 and a frame 40, wherein the backlight module 20 is located between the glass substrate 10 and the circuit board 30, and the frame 40 is fixed to the glass substrate 10 and surrounds the upper surface and side surface of the glass substrate 10, the backlight module 20 and the circuit board 30. When the thin film chip package structure 100a is assembled on the display panel 1, the flexible circuit carrier 110 is located in the accommodation space between the glass substrate 10, the side surface of the backlight module 20 and the circuit board 30 and the frame 40. The flexible circuit carrier 110 is respectively bonded to the glass substrate 10 and the circuit board 30, and is bent so that the circuit board 30 is arranged parallel to the back of the glass substrate 10. In this embodiment, after the flexible circuit carrier 110 is bent, the chip 120 and the elastic reinforcing member 130a are located between the glass substrate 10, the side surface of the backlight module 20 and the circuit board 30 and the flexible circuit carrier 110. However, in other embodiments, after the flexible circuit carrier 110 is bent, the chip 120 and the elastic reinforcement member 130a may also be located between the frame 40 and the flexible circuit carrier 110, and the present invention is not limited thereto. Since the cross-section of the first retractable side wall portion 132a of the elastic reinforcement member 130a has an arc-shaped bend such as a spring structure or an accordion structure, a variable distance S is formed between the upper cover portion 134a and the flexible circuit carrier 110, that is, a buffer space G is formed between the elastic reinforcement member 130a and the chip 120. Therefore, when the thin film chip package structure 100a assembled in a mechanism such as a display panel 1 generates vibration due to actuation or operation, the vibration force can be absorbed and slowed down by the elastic reinforcement member 130a, and will not be directly transmitted to the chip 120, thereby preventing the vibration from having an adverse effect on the chip 120. In addition, the spaces for accommodating the flexible circuit carrier 110 formed by different mechanism designs are not the same. Since the elastic reinforcing member 130a is elastic, its height has a certain range of variability, so it can be applied to various accommodating space specification requirements and has a wider compatibility in application.

[0052] It must be noted that the following embodiments use the same component numbers and some contents of the previous embodiments, wherein the same number is used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can refer to the previous embodiments, and the following embodiments will not be repeated.

[0053] Figure 2 is a schematic diagram of a chip-on-film packaging structure according to another embodiment of the present invention. Figure 1A and Figure 2The TFT chip package structure 100b of the present embodiment is similar to the TFT chip package structure 100a described above, and the difference between the two is that: in the present embodiment, the elastic reinforcing member 130b is disposed on the second surface 110b of the flexible circuit substrate 110 and corresponds to the chip setting area 111. The orthographic projections of the two first retractable sidewall portions 132b on the flexible circuit substrate 110 correspond to the two first edges 111a of the chip setting area 111 and are located outside the chip setting area 111. The orthographic projection of the upper cover portion 134b on the flexible circuit substrate 110 completely covers the orthographic projection of the chip 120 on the flexible circuit substrate 110. Here, the cross-section of the first retractable sidewall portion 132b has a sharp sawtooth bend, but is not limited thereto.

[0054] Figure 3 is a schematic diagram of a chip-on-film packaging structure according to another embodiment of the present invention. Figure 1A and Figure 3 The chip-on-film package structure 100c of the present embodiment is similar to the chip-on-film package structure 100a described above, and the difference between the two is that: in the present embodiment, the elastic reinforcing member 130c further includes at least one second retractable side wall portion 136c, which connects the upper cover portion 134c and the two first retractable side wall portions 132c, and the orthographic projection of the second retractable side wall portion 136c on the flexible circuit carrier 110 corresponds to at least one of the two second edges 111b and is located outside the chip setting area 111. In the present embodiment, the number of the second retractable side wall portion 136c is one, and corresponds to one of the two second edges 111b. In addition, the elastic reinforcing member 130c may further include a horizontal bar 138c, which connects the bottoms of the two first retractable side wall portions 132c, and the orthographic projection of the horizontal bar 138c on the flexible circuit carrier 110 corresponds to the other of the two second edges 111b and is located outside the chip setting area 111. The horizontal bar 138c can increase the contact area between the elastic reinforcing member 130c and the flexible circuit carrier 110, thereby improving the bonding strength of the elastic reinforcing member 130c on the flexible circuit carrier 110. However, the horizontal bar 138c is selectively disposed between the two first retractable side wall portions 132c. In other embodiments, the elastic reinforcing member 130c may not have the horizontal bar 138c. Furthermore, in other embodiments, the number of the second retractable side wall portions 136c may be two, respectively connected to the upper cover portion 134c. The orthographic projections of the two second retractable side wall portions 136c on the flexible circuit carrier 110 correspond to the two second edges 111b respectively and are located outside the chip setting area 111.

[0055] Figure 4 is a schematic diagram of a chip-on-film packaging structure according to another embodiment of the present invention. Figure 1A and Figure 4The film chip package structure 100d of this embodiment is similar to the film chip package structure 100a described above, and the difference between the two is that: in this embodiment, the orthographic projection of the upper cover portion 134d of the elastic reinforcing member 130d on the flexible circuit substrate 110 partially covers the orthographic projection of the chip 120 on the flexible circuit substrate 110. In detail, the orthographic projection of the upper cover portion 134d on the flexible circuit substrate 110 does not completely cover the chip 120, but exposes the two ends of the chip 120 near the two second edges 111b. The two first retractable sidewall portions 132d expose parts of the two sidewalls of the chip 120 parallel to the two first edges 111a.

[0056] In summary, in the design of the thin film flip chip packaging structure of the present invention, the elastic reinforcement member arranged in the corresponding chip setting area has two first retractable side wall portions, which respectively correspond to the two first edges of the chip setting area, and the two first retractable side wall portions such as spring structures or bellows structures make the upper cover portion connecting the two first retractable side wall portions and the flexible circuit carrier have a variable distance. With this design, when the thin film flip chip packaging structure is assembled in a mechanism such as a display panel, if the mechanism generates vibration due to actuation or operation, the vibration force can be absorbed and slowed down by the elastic reinforcement member, and will not be directly transmitted to the chip, thereby avoiding the adverse effects of the vibration on the chip. In addition, since the elastic reinforcement member is elastic, its height has a certain range of variability, so it can be applied to the specification requirements of various accommodating spaces, and has a wider compatibility in application.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip-on-film packaging structure, It is characterized in that include: A flexible circuit carrier having a first surface and a second surface opposite to each other and a chip setting area defined on the first surface, wherein the chip setting area has two opposite first edges; A chip is disposed in the chip placement area and electrically connected to the flexible circuit carrier; and An elastic reinforcing member is disposed on the first surface or the second surface of the flexible circuit carrier and corresponds to the chip setting area. The elastic reinforcing member includes two first retractable side wall portions opposite to each other and an upper cover portion connecting the two first retractable side wall portions. The orthographic projections of the two first retractable side wall portions on the flexible circuit carrier respectively correspond to the two first edges of the chip setting area and are located outside the chip setting area. The upper cover portion is spaced a variable distance from the flexible circuit carrier.

2. The chip-on-film packaging structure according to claim 1, It is characterized in that The elastic reinforcing member is disposed on the first surface of the flexible circuit carrier, the elastic reinforcing member covers the chip, and a buffer space is provided between the upper cover and the chip.

3. The chip-on-film packaging structure according to claim 2, It is characterized in that The variable distance is not less than the height from the back surface of the chip to the flexible circuit carrier.

4. The chip-on-film packaging structure according to claim 1, It is characterized in that The two first edges of the chip arrangement area are two long sides, and the two first retractable side wall portions are parallel to the two first edges.

5. The chip-on-film packaging structure according to claim 1, It is characterized in that The orthographic projection of the upper cover on the flexible circuit carrier completely covers the orthographic projection of the chip on the flexible circuit carrier.

6. The chip-on-film packaging structure according to claim 1, It is characterized in that The orthographic projection of the upper cover on the flexible circuit carrier partially covers the orthographic projection of the chip on the flexible circuit carrier.

7. The chip-on-film packaging structure according to claim 1, It is characterized in that The chip setting area also has two opposite second edges, and the elastic reinforcement piece also includes at least one second retractable side wall portion connected to the upper cover portion, and the orthographic projection of the at least one second retractable side wall portion on the flexible circuit carrier corresponds to at least one of the two second edges and is located outside the chip setting area.

8. The chip-on-film packaging structure according to claim 1, It is characterized in that The cross section of each of the two first retractable side wall portions has at least one bend.

9. The chip-on-film packaging structure according to claim 8, It is characterized in that The at least one bend is in an arc shape, a sharp sawtooth shape or a square sawtooth shape.

10. The chip-on-film packaging structure according to claim 1, It is characterized in that The two first retractable side wall portions and the upper cover portion are formed in one piece.

Images