Miniature light emitting diode device packaging structure, packaging method and display device

Abstract

The invention provides a miniature light-emitting diode device packaging structure, a packaging method and a display device. A miniature light-emitting diode device of the packaging structure comprises a miniature light-emitting diode chip and a driving chip which are in bonding connection. The blocking structure is arranged on one surface, deviating from the driving chip, of the micro light-emitting diode chip and protrudes out of the micro light-emitting diode chip; the packaging substrate is arranged on the face, away from the micro light-emitting diode chip, of the driving chip in a stacked mode, and a blocking step is arranged on the periphery of the packaging substrate. The packaging glue wraps the outer peripheries of the micro light-emitting diode chip and the driving chip, and covers the blocking structure and at least part of the blocking step. On the basis, the micro light-emitting diode device packaging structure and the display device have excellent packaging airtightness and reliability.

Description

Technical Field

[0001] The present application relates to the field of semiconductor light emitting technology, and in particular to a micro light emitting diode device packaging structure, a packaging method and a display device. Background Art

[0002] Micro-LED (Micro-Light Emitting Diode) display technology is a display technology that miniaturizes and arrays the traditional LED (Light Emitting Diode) structure and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to make driving circuits to achieve addressing control and individual drive of each pixel.

[0003] Among them, due to the small size of the solder joint structure of Micro-LED, which is only 1 / 10 to 1 / 100 of the traditional LED solder joint structure, the ability of Micro-LED to resist water and oxygen corrosion is greatly weakened, and the reliability of Micro-LED is greatly reduced; at the same time, the driving circuit is not suitable for a long-term water and oxygen environment. Therefore, improving the airtightness and reliability of Micro-LED packaging has become an urgent problem to be solved. Summary of the invention

[0004] The purpose of the present application is to provide a micro light emitting diode device packaging structure, packaging method and display device.

[0005] In order to solve the above problems, in a first aspect, the present application provides a micro light emitting diode device packaging structure, comprising:

[0006] A micro light emitting diode device, comprising a micro light emitting diode chip and a driver chip bonded together;

[0007] A blocking structure is disposed on a side of the micro-LED chip facing away from the driving chip and protrudes from the micro-LED chip;

[0008] A packaging substrate, stacked on a side of the driver chip away from the micro-LED chip, with a blocking step provided on the periphery of the packaging substrate; and

[0009] The packaging glue wraps the outer periphery of the micro-LED chip and the driving chip, and covers the blocking structure and at least a part of the blocking step.

[0010] Optionally, the micro light emitting diode chip includes a display area and a non-display area, the blocking structure is arranged and protrudes from the non-display area, and the outer periphery of the blocking structure is aligned with the outer periphery of the non-display area.

[0011] Optionally, the blocking structure is a ring-shaped structure, and the display area is located inside the blocking structure.

[0012] Optionally, the micro light emitting diode device packaging structure further includes:

[0013] A circuit board is electrically connected to the driving chip through an electrical connector, wherein a first end of the circuit board is disposed on the blocking step, and a second end of the circuit board is disposed outside the packaging substrate;

[0014] Wherein, the packaging glue also wraps part of the circuit board and the electrical connector.

[0015] Optionally, the blocking step includes a first step surface, a connecting surface and a second step surface connected in sequence, the second step surface is located between the driving chip and the first step surface, and the circuit board is arranged on the first step surface; wherein,

[0016] The thickness of the circuit board is smaller than the height of the connection surface, and the spacing distance between the first end of the circuit board and the connection surface is between 50 micrometers and 150 micrometers.

[0017] Optionally, the packaging substrate is a heat dissipation substrate.

[0018] In a second aspect, the present application also provides a packaging method, comprising:

[0019] A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driving chip which are bonded to each other;

[0020] A blocking structure protruding from the micro-light emitting diode chip is provided on a side of the micro-light emitting diode chip away from the driving chip;

[0021] A packaging substrate stacked and connected with the driver chip is arranged on a side of the driver chip away from the micro light emitting diode chip, and a blocking step is provided at the periphery of the packaging substrate;

[0022] Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro-LED chip and the driving chip, and cover the blocking structure and at least part of the blocking step, so as to obtain a micro-LED device packaging structure.

[0023] Optionally, the micro-LED chip includes a display area and a non-display area; the step of providing a blocking structure protruding from the micro-LED chip on a side of the micro-LED chip away from the driving chip comprises:

[0024] A blocking structure protruding from the non-display area is disposed in the non-display area, and an outer periphery of the blocking structure is aligned with an outer periphery of the non-display area.

[0025] Optionally, the step of providing a packaging substrate stacked and connected to the driver chip on a side of the driver chip away from the micro-LED chip, and providing a blocking step on the periphery of the packaging substrate includes:

[0026] Provide packaging substrates and circuit boards;

[0027] A blocking step is provided on the periphery of the packaging substrate, so that the first end of the circuit board is disposed on the blocking step, and the second end of the circuit board extends out of the packaging substrate;

[0028] The micro-LED device is stacked and connected with the packaging substrate, and the driving chip is located between the packaging substrate and the micro-LED chip;

[0029] The circuit board is electrically connected to the driving chip through an electrical connector;

[0030] The step of providing packaging glue and making the packaging glue wrap the outer periphery of the micro-LED chip and the driver chip and cover the blocking structure and at least part of the blocking step includes:

[0031] Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro light emitting diode chip and the driving chip, and cover the blocking structure, at least part of the blocking step, part of the circuit board and the electrical connector.

[0032] In a third aspect, the present application also provides a display device, comprising the micro-light emitting diode device packaging structure as described above; or, comprising the micro-light emitting diode device packaging structure prepared by the packaging method as described above.

[0033] Based on the above technical scheme, the blocking structure of the micro-LED device packaging structure of the present application is arranged on the side of the micro-LED chip away from the driver chip and protrudes from the micro-LED chip, and the protruding blocking structure can block the flow of liquids such as moisture entering the packaging glue from the bonding interface between the micro-LED chip and the packaging glue; at the same time, a blocking step is provided on the periphery of the packaging substrate, and the blocking step can block the flow of liquids such as moisture entering the packaging glue from the bonding interface between the packaging substrate and the packaging glue; thus, the blocking structure and the blocking step can both change the flow path of liquids such as moisture, and liquids such as moisture need to bypass the blocking structure and the blocking step to enter deep into the packaging glue. The blocking structure and the blocking step increase the difficulty of liquids such as moisture flowing deep into the packaging glue, making it difficult for liquids such as moisture to enter the packaging glue, especially difficult to enter the bonding area between the micro-LED chip and the driver chip, thereby greatly improving the packaging airtightness of the micro-LED device packaging structure, and the reliability of the micro-LED device packaging structure is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution in this application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0035] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0036] Figure 1 A schematic diagram of a top view of a micro light emitting diode device packaging structure provided in an embodiment of the present application;

[0037] Figure 2 A cross-sectional view of a micro light emitting diode device packaging structure along one direction of an embodiment of the present application;

[0038] Figure 3 A cross-sectional view of the micro light emitting diode device packaging structure of an embodiment of the present application along another direction;

[0039] Figure 4 For moisture to enter Figure 2 A schematic diagram of the path of the micro light emitting diode device packaging structure shown;

[0040] Figure 5 For moisture to enter Figure 3 A schematic diagram of the path of the micro light emitting diode device packaging structure shown;

[0041] Figure 6A schematic diagram of a top view of the micro light emitting diode device packaging structure of the embodiment of the present application when no blocking member is provided;

[0042] Figure 7 for Figure 6 A cross-sectional view of the micro light emitting diode device packaging structure along one direction;

[0043] Figure 8 for Figure 6 A cross-sectional view of the micro light emitting diode device package structure shown along another direction;

[0044] Fig. 9 A schematic diagram of a top view of a micro light emitting diode chip, a driver chip and a blocking structure according to an embodiment of the present application;

[0045] Fig.10 for Fig. 9 A schematic cross-sectional view of the structure shown;

[0046] Fig.11 A schematic diagram of a top view structure of a packaging substrate provided in an embodiment of the present application;

[0047] Fig.12 for Fig.11 A cross-sectional view of the structure shown along one direction;

[0048] Fig.13 for Fig.11 A cross-sectional view of the structure shown along another direction;

[0049] Fig.14 A schematic diagram of the structure of a micro light emitting diode chip provided in an embodiment of the present application;

[0050] Fig.15 A schematic diagram of the structure of a driver chip provided in an embodiment of the present application;

[0051] Fig.16 A schematic diagram of a first process flow of a packaging method provided in an embodiment of the present application;

[0052] Fig.17 A second schematic flow chart of the packaging method provided in the embodiment of the present application;

[0053] Fig.18 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0054] The reference numerals are as follows:

[0055] 10. Micro-LED device packaging structure; 20. Display device; 101. Micro-LED device; 100. Micro-LED chip; 200. Driver chip; 300. Package substrate; 400. Package glue; 600. Circuit board; 700. Electrical connector; 110. Display area; 120. Non-display area; 210. Second substrate; 220. Driver circuit; 230. Driver pad; 240. Electrical connection part; 250. Second passivation layer; 260. Second bonding surface; 310. Bearing area; 51 0, blocking structure; 520, blocking step; 530, groove structure; 610, first end; 620, second end; 131, first substrate; 132, buffer layer; 133, first semiconductor layer; 134, light-emitting layer; 135, second semiconductor layer; 136, current diffusion layer; 137, first electrode layer; 138, second electrode layer; 139, solder joint structure; 141, first passivation layer; 142, light-emitting table; 143, first bonding surface; 521, first step surface; 522, connection surface; 523, second step surface. DETAILED DESCRIPTION

[0056] The following will be combined with the appendix of this application Figure 1 To Attachment Fig.18 The technical solutions in this application are clearly and completely described in the following embodiments. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0057] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0058] The following is a detailed description with reference to specific embodiments. It should be noted that the embodiments of the present application can be presented in various forms, some examples of which will be described below.

[0059] Please refer to Figures 1 to 3 , Figure 1 A schematic diagram of a top view of a micro light emitting diode device packaging structure 10 provided in an embodiment of the present application, Figure 2 is a cross-sectional view of the micro light emitting diode device package structure 10 along one direction of an embodiment of the present application, Figure 3The cross-sectional view of the micro-LED device packaging structure 10 according to the embodiment of the present application along another direction is shown. The micro-LED device packaging structure 10 includes a micro-LED device 101 , a packaging substrate 300 , packaging glue 400 and a blocking structure 510 .

[0060] The micro-LED device 101 includes a micro-LED chip 100 and a driver chip 200 that are bonded together. A blocking structure 510 is disposed on a side of the micro-LED chip 100 that is away from the driver chip 200, and the blocking structure 510 protrudes from the micro-LED chip 100. The packaging substrate 300 is disposed on a side of the driver chip 200 that is away from the micro-LED chip 100, and the packaging substrate 300 and the driver chip 200 are stacked and connected, and a blocking step 520 is provided on the periphery of the packaging substrate 300. The packaging glue 400 wraps the outer periphery of the micro-LED chip 100 and the driver chip 200, and the packaging glue 400 also covers the blocking structure 510 and the blocking step 520.

[0061] It can be understood that the micro-LED chip 100 includes a display area 110 and a non-display area 120. The non-display area 120 can be arranged around the outer periphery of the display area 110, and the display area 110 is located on the inner side of the non-display area 120. Among them, the non-display area 120 can be the electrode and wiring area of ​​the micro-LED chip 100, and the display area 110 can be the light-emitting area of ​​the micro-LED chip 100. The display area 110 includes a plurality of pixel units so that the display area 110 can emit light. It should be noted that in the present application, the display area 110 includes the light-emitting surface of the micro-LED chip 100 and the layered structure below the light-emitting surface, and the non-display area 120 includes the non-light-emitting surface of the micro-LED chip 100 and the layered structure below the light-emitting surface.

[0062] It is understandable that the driver chip 200 is located between the micro-LED chip 100 and the packaging substrate 300. The driver chip 200 is bonded to the micro-LED chip 100, and the driver chip 200 can control the pixel unit of the micro-LED chip 100 to emit light. Figures 1 to 3 As shown, the size of the driver chip 200 can be larger than that of the micro-LED chip 100, the orthographic projection of the micro-LED chip 100 on the driver chip 200 can be located inside the driver chip 200, and the driver chip 200 and the micro-LED chip 100 are stacked to form a step structure.

[0063] It is understandable that the packaging substrate 300 is used to carry the driver chip 200, the micro-LED chip 100 and the packaging glue 400 thereon. Figures 1 to 3As shown, the size of the package substrate 300 is larger than that of the driver chip 200. The package substrate 300 has a bearing area 310 not covered by the driver chip 200 and an overlap area overlapped with the driver chip 200. The package substrate 300 and the driver chip 200 can form a step structure.

[0064] It is understandable that the packaging glue 400 can bond the micro-LED chip 100, the driver chip 200 and the packaging substrate 300 together, and the packaging glue 400 serves as a protective glue for the micro-LED device packaging structure 10. Figures 1 to 3 As shown, the encapsulation glue 400 is located at least partially in the bearing area 310 of the encapsulation substrate 300 and the space above it, part of the encapsulation glue 400 can cover the sidewall edges of the micro-LED chip 100 and the driver chip 200, and part of the encapsulation glue 400 can be located above at least partially in the non-display area 120 of the micro-LED chip 100 and cover the non-display area 120. The encapsulation glue 400 can wrap the outer periphery of the micro-LED chip 100 and the driver chip 200, and cover at least partially (including all and part) the non-display area 120 and at least partially in the bearing area 310. The encapsulation glue 400 can reduce the moisture and other liquids that enter the bonding area of ​​the micro-LED chip 100 and the driver chip 200. Among them, the encapsulation glue 400 can be implemented using a molding process (molding process) or a dispensing process.

[0065] It can be understood that the blocking structure 510 and the blocking step 520 are both located in the packaging glue 400 and are wrapped by the packaging glue 400. In some examples, the blocking structure 510 can be set in the non-display area 120 of the micro-LED chip 100 and protrude from the non-display area 120. In some examples, the blocking step 520 is set in the supporting area 310 of the packaging substrate 300 and protrudes from the supporting area 310. The blocking structure 510 and the blocking step 520 together form a blocking member of the micro-LED device packaging structure 10, and the blocking structure 510 and the blocking step 520 can prevent external moisture from entering the packaging glue 400 and affecting the performance of the micro-LED device 101.

[0066] Please combine Figures 1 to 3 Please also refer to Figure 4 and Figure 5 , Figure 4 For moisture to enter Figure 2 The schematic diagram of the path of the micro light emitting diode device packaging structure 10 is shown. Figure 5 For moisture to enter Figure 3The schematic diagram of the path of the micro-LED device packaging structure 10 is shown. Since the blocking structure 510 protrudes from the non-display area 120, when the liquid S1 such as moisture enters the packaging glue 400 from the non-display area 120, the protruding blocking structure 510 can block the flow of the liquid such as moisture; similarly, due to the blocking effect of the blocking step 520, when the liquid S2 such as moisture enters the packaging glue 400 from the bearing area 310, the blocking step 520 can block the flow of the liquid such as moisture; the liquid such as moisture needs to bypass the blocking structure 510 and the blocking step 520 to enter the deep inside of the packaging glue 400. The blocking structure 510 and the blocking step 520 change the flow path of the liquid such as moisture, making it difficult for the liquid such as moisture to enter the packaging glue 400, especially difficult to enter the bonding area of ​​the micro-LED chip 100 and the driver chip 200.

[0067] In contrast, Figures 6 to 8 As shown, Figure 6 1 is a schematic diagram of a top view of the micro light emitting diode device packaging structure 10 according to an embodiment of the present application when the blocking member 500 is not provided. Figure 7 for Figure 6 The cross-sectional view of the micro light emitting diode device package structure 10 along one direction is shown. Figure 8 for Figure 6 The cross-sectional view of the micro-LED device packaging structure 10 along another direction is shown. Since the material of the packaging glue 400 is different from that of the micro-LED chip 100, the driver chip 200 and the packaging substrate 300, the bonding interface between the packaging glue 400 and the micro-LED chip 100 and the bonding interface between the packaging glue 400 and the packaging substrate 300 is easy to enter moisture and other liquids. Figure 7 and Figure 8 As shown, when the blocking structure 510 and the blocking step 520 are not provided, liquid S1 such as moisture can directly enter the packaging glue 400 from the bonding interface between the packaging glue 400 and the micro-LED chip 100, and liquid S2 such as moisture can directly enter the packaging glue 400 from the bonding interface between the packaging glue 400 and the packaging substrate 300. Liquids such as moisture can easily enter the bonding area between the micro-LED chip 100 and the driving chip 200, thereby seriously affecting the performance and service life of the micro-LED device packaging structure 10, and greatly reducing the reliability of the micro-LED device packaging structure 10.

[0068] Based on this, the blocking structure 510 of the micro-LED device packaging structure 10 of the embodiment of the present application is arranged on the side of the micro-LED chip 100 away from the driving chip 200 and protrudes from the micro-LED chip 100. The protruding blocking structure 510 can block the flow of liquid S1 such as moisture entering the packaging glue 400 from the bonding interface between the micro-LED chip 100 and the packaging glue 400; at the same time, a blocking step 520 is provided on the periphery of the packaging substrate 300, and the blocking step 520 can block the flow of liquid S2 such as moisture entering the packaging glue 400 from the bonding interface between the packaging substrate 300 and the packaging glue 400; Thus, the blocking structure 510 and the blocking step 520 can change the flow path of liquids such as moisture. Liquids such as moisture need to bypass the blocking structure 510 and the blocking step 520 to enter deep inside the packaging glue 400. The blocking structure 510 and the blocking step 520 increase the difficulty for liquids such as moisture to flow deep inside the packaging glue 400, making it difficult for liquids such as moisture to enter the packaging glue 400, especially difficult to enter the bonding area of ​​the micro light emitting diode chip 100 and the driver chip 200, thereby greatly improving the packaging airtightness of the micro light emitting diode device packaging structure 10, and the reliability of the micro light emitting diode device packaging structure 10 is better.

[0069] Please refer again to Figures 1 to 5 Please also refer to Fig. 9 and Fig.10 , Fig. 9 1 is a schematic diagram of a top view of the micro light emitting diode chip 100, the driving chip 200 and the blocking structure 510 according to an embodiment of the present application. Fig.10 for Fig. 9 A cross-sectional schematic diagram of the structure shown. In some examples, the outer periphery of the blocking structure 510 is aligned with the outer periphery of the micro-LED chip 100. Further, the outer periphery of the blocking structure 510 can be aligned with the outer periphery of the non-display area 120 of the micro-LED chip 100. At this time, the non-display area 120 of the micro-LED chip 100 can carry the blocking structure 510. On the one hand, the connection between the blocking structure 510 and the micro-LED chip 100 is more secure. On the other hand, the blocking structure 510 fully carried by the micro-LED chip 100 is also easier to produce in terms of production process.

[0070] It can be understood that, in some examples, the blocking structure 510 of the present application is an annular structure. In the top view, the annular structure is located outside the display area 110, and the display area 110 is located inside the blocking structure 510. The annular structure and the display area 110 can form a concentric ring structure. Among them, the blocking structure 510 can be a rectangular ring structure, a circular ring structure, etc. The blocking structure 510 of the annular structure of the present application can enclose the entire display area 110, and the blocking structure 510 can block the flow of liquids such as moisture in a larger range, so that the blocking structure 510 of the annular structure can further improve the packaging airtightness and reliability of the micro-light emitting diode device packaging structure 10.

[0071] It is understood that, in some examples, the barrier structure 510 of the present application is a metal structure. The barrier structure 510 of the metal structure can be formed in the non-display area 120 by an evaporation process and a photolithography process. The barrier structure 510 of the metal structure of the embodiment of the present application has excellent corrosion resistance, which can further improve the packaging airtightness and reliability of the micro-LED device packaging structure 10.

[0072] In some examples, please refer to Figures 1 to 5 Please also refer to Figures 11 to 13 , Fig.11 A schematic diagram of a top view of a packaging substrate 300 provided in an embodiment of the present application is shown in FIG. Fig.12 for Fig.11 The structure shown is a cross-sectional view along one direction, Fig.13 for Fig.11 The structure shown is a cross-sectional view along another direction. The blocking step 520 includes a first step surface 521, a connecting surface 522 and a second step surface 523 connected in sequence, the second step surface 523 is located between the driving chip 200 and the first step surface 521, the second step surface 523 is located above the first step surface 521, and there is a height difference between the second step surface 523 and the first step surface 521.

[0073] When liquid S2 such as moisture enters the packaging glue 400 from the bonding interface between the packaging glue 400 and the packaging substrate 300, the liquid S2 such as moisture enters the first step surface 521 and encounters the vertically upward connection surface 522. The connection surface 522 can block the flow of liquid such as moisture, making it difficult for liquid S2 such as moisture to flow to the second step surface 523, and then the liquid S2 such as moisture is not easy to enter the bonding area of ​​the micro-LED chip 100 and the driver chip 200 from the bonding interface between the packaging glue 400 and the packaging substrate 300, which greatly improves the packaging airtightness of the micro-LED device packaging structure 10, and the reliability of the micro-LED device packaging structure 10 is better. In addition, the blocking step 520 of the present application is a part of the packaging substrate 300, and the micro-LED device packaging structure 10 does not need to be provided with an additional structure, which can simplify the structure of the blocking member 500.

[0074] It can be understood that, in some examples, the outer edge of the first step surface 521 of the blocking step 520 can be aligned with the outer edge of the packaging substrate 300, and the blocking step 520 can be formed on the outer periphery of the packaging substrate 300. In this way, in the production process, the blocking step 520 can be formed on the packaging substrate 300 by cutting the step at the edge, so that the blocking step 520 of the present application is easier to process and form.

[0075] It can be understood that, in some examples, the blocking step 520 is an annular structure, and the projection of the driver chip 200 on the packaging substrate 300 is located on the inner side of the blocking step 520. Among them, the blocking step 520 can be a rectangular ring structure, a circular ring structure, etc. The blocking step 520 of the annular structure of the present application can enclose the entire driver chip 200, and the blocking step 520 can block the flow of liquids such as moisture in a larger range, so that the blocking step 520 of the annular structure can further improve the packaging airtightness and reliability of the micro-light emitting diode device packaging structure 10.

[0076] In some examples, please refer to Figures 1 to 13 , the micro-light emitting diode device packaging structure 10 also includes a circuit board 600. The packaging substrate 300 is used to carry the circuit board 600, and the packaging substrate 300 and the circuit board 600 can be connected as a whole. Among them, the circuit board 600 includes a first end 610 and a second end 620 that are arranged opposite to each other, the first end 610 is arranged on the blocking step 520, and the first end 610 is arranged on the first step surface 521 and is spaced apart from the driver chip 200. The second end 620 is arranged outside the packaging substrate 300, and the second end 620 can be electrically connected to an external circuit. Among them, the circuit board 600 is electrically connected to the driver chip 200 through an electrical connector 700, and the external circuit provides electrical signals and control signals to the driver chip 200 through the circuit board 600.

[0077] It is understandable that the packaging glue 400 also wraps part of the circuit board 600 and the electrical connector 700. In the present application, the first end 610 of the circuit board 600 and the electrical connector 700 are arranged in the packaging glue 400, which can reduce the corrosion of the electrical connection between the first end 610 and the driver chip 200 by liquids such as moisture as much as possible, thereby improving the airtight layer and reliability of the micro-LED device packaging structure 10.

[0078] It is understood that, in some embodiments, the maximum distance between the circuit board 600 and the first step surface 521 is less than the maximum distance between the connection surface 522 and the first step surface 521, and the thickness of the circuit board 600 is less than the height of the connection surface 522, so that there is a height difference between the circuit board 600 and the driver chip 200. Among them, the spacing distance L0 between the first end 610 of the circuit board 600 and the connection surface 522 is between 50 microns and 150 microns, for example, the spacing distance L0 is 50 microns, 80 microns, 100 microns, 120 microns or 150 microns. Further, the spacing distance L0 is between 80 microns and 120 microns. Further, the spacing distance L0 is about 100 microns.

[0079] The embodiment of the present application designs the thickness of the circuit board 600 and the spacing distance L0 between the circuit board 600 and the connecting surface 522 as described above. A sunken groove structure 530 (the groove structure 530 can also be considered as a part of the blocking step 520) can be formed between the first end 610 of the circuit board 600 and the connecting surface 522. Moisture or other liquids entering from the connecting interface between the circuit board 600 and the packaging glue 400 will change their flow path and flow toward the bottom of the groove after encountering the groove. Moisture or other liquids flowing to the bottom of the groove will find it difficult to flow upward along the side wall of the groove to the surface of the driver chip 200 again. Therefore, the groove structure 530 can further improve the packaging airtightness and reliability of the micro light emitting diode device packaging structure 10. Furthermore, the spacing distance L0 between the first end 610 of the circuit board 600 and the connecting surface 522 is between 50 microns and 150 microns, and the width of the groove structure 530 is in a moderate range. The groove structure 530 is neither too wide nor too narrow to allow liquids such as moisture to flow directly to the connecting surface 522 of the blocking step 520, thereby rendering the groove structure 530 ineffective.

[0080] It is understandable that, in some embodiments, the packaging substrate 300 can be a heat dissipation substrate, and further, the packaging substrate 300 can be a heat dissipation substrate with a step design. Among them, the packaging substrate 300 can be prepared using a metal or non-metallic thermal conductive material. The packaging substrate 300 of the embodiment of the present application is a heat dissipation substrate, and the packaging substrate 300 can better transfer the heat generated by the driver chip 200 to the outside world, which can improve the heating phenomenon of the micro-light emitting diode device packaging structure 10.

[0081] Based on the above description of the micro light emitting diode device packaging structure 10, please refer to Fig.14 , Fig.14 A schematic diagram of the structure of a micro-LED chip 100 provided in an embodiment of the present application. The micro-LED chip 100 includes a first substrate 131, and a buffer layer 132, a first semiconductor layer 133, a light-emitting layer 134, a second semiconductor layer 135, a current diffusion layer 136, a first electrode layer 137, a second electrode layer 138, a solder joint structure 139, a first passivation layer 141, etc. formed on the first substrate 131.

[0082] It can be understood that the first substrate 131 is used to support the film layer structure thereon, and the first substrate 131 is a sapphire substrate, a silicon substrate or a silicon carbide substrate, etc. The buffer layer 132 can relieve the stress generated by the lattice mismatch and the thermal expansion coefficient mismatch between the film layer thereon and the first substrate 131, and the buffer layer 132 can be, but is not limited to, silicon nitride, silicon oxide layer, gallium nitride layer or aluminum nitride layer. The light-emitting layer 134 is a quantum well layer, for example, the light-emitting layer 134 is an indium gallium nitride quantum well layer, or an indium gallium nitride / gallium nitride multi-quantum well layer. The first semiconductor layer 133 is one of an N-type semiconductor layer and a P-type semiconductor layer, and the second semiconductor layer 135 is the other of an N-type semiconductor layer and a P-type semiconductor layer, wherein the N-type semiconductor layer is an N-type gallium nitride layer or an N-type gallium arsenide layer, and the P-type semiconductor layer is a P-type gallium nitride layer or a P-type aluminum gallium nitride layer. The first electrode layer 137 is disposed on the side of the second semiconductor layer 135 away from the light emitting layer 134 and is electrically connected to the second semiconductor layer 135. The second electrode layer 138 is disposed in the exposed area of ​​the first semiconductor layer 133 and is electrically connected to the first semiconductor layer 133. The first electrode layer 137 and the second electrode layer 138 are used to be electrically connected to the driver chip 200. The current diffusion layer 136 can evenly distribute the current to the entire first semiconductor layer 133, thereby effectively improving the luminous efficiency of the micro light emitting diode chip 100. The solder joint structure 139 is connected to the first electrode layer 137 and the second electrode layer 138. The solder joint structure 139 can be made of, but not limited to, metals such as indium (In), aluminum (Al), tin (Sn), silver (Ag), gold (Au), gold-tin alloy, and nickel-gold alloy. The solder joint structure 139 is used to be bonded to the driver chip 200. The first passivation layer 141 is used to wrap the buffer layer 132 and the layered structure thereon and expose the solder joint structure 139 . The first passivation layer 141 is used to protect the micro light emitting diode chip 100 .

[0083] It is understandable that if Fig.14As shown, the first semiconductor layer 133, the light-emitting layer 134, the second semiconductor layer 135, the current diffusion layer 136, the first electrode layer 137 and the solder joint structure 139 connected thereto can form a plurality of light-emitting mesas 142 arranged at intervals, each light-emitting mesas 142 being a pixel unit, and the region formed by the plurality of light-emitting mesas 142 together is the display region 110 in the aforementioned embodiment, and the region where the second electrode layer 138 and the solder joint structure 139 connected thereto are located outside the first substrate 131 is the non-display region 120 in the aforementioned embodiment. When the first electrode layer 137 is a P electrode or a positive electrode and the second electrode layer 138 is an N electrode or a negative electrode, the display region 110 is a positive region and the non-display region 120 is a negative region; when the first electrode layer 137 is an N electrode or a negative electrode and the second electrode layer 138 is a P electrode or a positive electrode, the display region 110 is a negative region and the non-display region 120 is a positive region.

[0084] It is understandable that if Fig.14 As shown, the micro-LED chip 100 of the present application can be a common electrode chip structure; in some other examples, the micro-LED chip 100 of the present application can also be a single micro-LED chip 100 structure.

[0085] Based on the above description, please refer to Fig.15 , Fig.15 A schematic diagram of the structure of a driver chip 200 provided in an embodiment of the present application. The driver chip 200 includes a second substrate 210, a driver circuit 220 formed on the second substrate 210, and one or more driver pads 230. The driver circuit 220 may be, but is not limited to, a CMOS circuit structure or a TFT circuit structure. The driver pad 230 may be, but is not limited to, made of metals such as In, Al, Sn, Ag, Au, gold-tin alloy, and nickel-gold alloy. One or more driver pads 230 are used to be arranged in a one-to-one correspondence with one or more solder joint structures 139 of the micro light-emitting diode chip 100 and bonded in a one-to-one correspondence. Among them, the driver chip 200 also includes an electrical connection portion 240 electrically connected to the circuit board 600, and a second passivation layer 250 covering and exposing the driver pad 230.

[0086] Understandably, please refer to Fig.14 and Fig.15The micro-LED chip 100 further includes a first bonding surface 143, and the solder joint structure 139 of the micro-LED chip 100 is exposed on the first bonding surface 143, and the first bonding surface 143 is also the side of the micro-LED chip 100 facing the driver chip 200. The driver chip 200 includes a second bonding surface 260, and the driving pad 230 of the driver chip 200 is exposed on the second bonding surface 260, and the second bonding surface 260 is also the side of the driver chip 200 facing the micro-LED chip 100. Among them, the solder joint structure 139 of the micro-LED chip 100 is bonded to the driving pad 230 of the driver chip 200, and the area between the first bonding surface 143 and the second bonding surface 260 is the bonding area between the micro-LED chip 100 and the driver chip 200.

[0087] The micro-LED device packaging structure 10 of the embodiment of the present application forms an additional blocking structure 510 with an annular metal step structure in the non-display area 120 of the micro-LED chip 100 through processes such as photolithography and evaporation. The blocking structure 510 is easier to implement in process production. At the same time, the packaging substrate 300 is designed with steps around it to form a blocking step 520. In this way, the path of moisture and other liquids entering the bonding area between the micro-LED chip 100 and the driver chip 200 will change. Moisture and other liquids need to bypass the blocking structure 510 and the blocking step 520 to enter the bonding area. The path difficulty of moisture and other liquids is increased, and moisture and other liquids are not easy to enter the bonding area, thereby greatly improving the packaging airtightness and reliability of the micro-LED chip 100.

[0088] Based on the above description, the embodiment of the present application further provides a packaging method. Fig.16 A first schematic flow chart of a packaging method provided in an embodiment of the present application, the packaging method comprising:

[0089] S110 , providing a micro light emitting diode device 101 , wherein the micro light emitting diode device 101 comprises a micro light emitting diode chip 100 and a driving chip 200 that are bonded to each other.

[0090] The micro-LED chip 100 includes a display area 110 and a non-display area 120. The non-display area 120 can be arranged around the outer periphery of the display area 110. The non-display area 120 is the electrode and wiring area of ​​the micro-LED chip 100, and the display area 110 is the light-emitting area of ​​the micro-LED chip 100. The driver chip 200 is bonded to the micro-LED chip 100, and the driver chip 200 can control the pixel unit of the micro-LED chip 100 to emit light.

[0091] S120 , disposing a blocking structure 510 protruding from the micro-LED chip 100 on a side of the micro-LED chip 100 facing away from the driver chip 200 .

[0092] The blocking structure 510 is disposed in the non-display area 120 of the micro-LED chip 100 and protrudes from the non-display area 120. In some examples, the outer periphery of the blocking structure 510 is aligned with the outer periphery of the micro-LED chip 100. Further, the outer periphery of the blocking structure 510 is aligned with the outer periphery of the non-display area 120 of the micro-LED chip 100. In some examples, the blocking structure 510 is an annular structure, the annular structure is located outside the display area 110, the display area 110 is located inside the blocking structure 510, and the annular structure and the display area 110 can form a concentric ring structure. In some examples, the blocking structure 510 is a metal structure.

[0093] S130 , disposing a packaging substrate 300 stacked and connected with the driver chip 200 on a side of the driver chip 200 away from the micro-LED chip 100 , and providing a blocking step 520 on the periphery of the packaging substrate 300 .

[0094] The packaging substrate 300 is used to carry the driver chip 200 and the micro light emitting diode chip 100 thereon. The driver chip 200 is located between the micro light emitting diode chip 100 and the packaging substrate 300. The packaging substrate 300 and the driver chip 200 can form a step structure.

[0095] It is understandable that the blocking step 520 can be formed on the packaging substrate 300 by edge cutting steps, the outer edge of the blocking step 520 can be aligned with the outer edge of the packaging substrate 300, and the blocking step 520 can be formed on the outer periphery of the packaging substrate 300.

[0096] S140 , providing packaging glue 400 , and making the packaging glue 400 wrap the outer periphery of the micro-LED chip 100 and the driving chip 200 , and cover the blocking structure 510 and at least part of the blocking step 520 , and obtain the micro-LED device packaging structure 10 .

[0097] The packaging glue 400 can bond the micro-LED chip 100, the driver chip 200 and the packaging substrate 300 together, and the blocking structure 510 and the blocking step 520 are both located in the packaging glue 400 and wrapped by the packaging glue 400. The blocking structure 510 and the blocking step 520 can prevent external moisture from entering the packaging glue 400 and affecting the performance of the micro-LED device 101.

[0098] In the packaging method of the embodiment of the present application, a blocking structure 510 is arranged on a side of the micro-LED chip 100 away from the driver chip 200 and protrudes from the micro-LED chip 100. The protruding blocking structure 510 can block the flow of liquid S1 such as moisture entering the packaging glue 400 from the bonding interface between the micro-LED chip 100 and the packaging glue 400; at the same time, a blocking step 520 is arranged on the periphery of the packaging substrate 300. The blocking step 520 can block the flow of liquid S2 such as moisture entering the packaging glue 400 from the bonding interface between the packaging substrate 300 and the packaging glue 400; thereby, the blocking structure 510 can prevent the micro-LED chip 100 from being blocked from the bonding interface between the micro-LED chip 100 and the packaging glue 400. The blocking structure 510 and the blocking step 520 can change the flow path of liquids such as moisture. Liquids such as moisture need to bypass the blocking structure 510 and the blocking step 520 to enter deep inside the packaging glue 400. The blocking structure 510 and the blocking step 520 increase the difficulty for liquids such as moisture to flow deep inside the packaging glue 400, making it difficult for liquids such as moisture to enter the packaging glue 400, especially difficult to enter the bonding area of ​​the micro light emitting diode chip 100 and the driver chip 200, thereby greatly improving the packaging airtightness of the micro light emitting diode device packaging structure 10, and the reliability of the micro light emitting diode device packaging structure 10 is better.

[0099] In some examples, the step of providing a blocking structure 510 protruding from the micro-LED chip 100 on the side of the micro-LED chip 100 away from the driver chip 200 includes: providing a blocking structure 510 protruding from the micro-LED chip 100 on the side of the micro-LED chip 100 away from the driver chip 200, and aligning the outer periphery of the blocking structure 510 with the outer periphery of the micro-LED chip 100. Further, the micro-LED chip 100 includes a display area 110 and a non-display area 120, and the step also includes: providing a blocking structure 510 protruding from the non-display area 120 in the non-display area 120, and aligning the outer periphery of the blocking structure 510 with the outer periphery of the non-display area 120. At this time, the blocking structure 510 can be fully supported by the micro-LED chip 100, the connection between the blocking structure 510 and the micro-LED chip 100 is more firm, and the blocking structure 510 is also easier to produce in terms of production process.

[0100] In some examples, the step of providing a blocking structure 510 protruding from the micro-LED chip 100 on the side of the micro-LED chip 100 away from the driver chip 200 includes: forming a ring-shaped blocking structure 510 protruding from the micro-LED chip 100 on the outer periphery of the side of the micro-LED chip 100 away from the driver chip 200 through photolithography and evaporation processes, and aligning the outer periphery of the blocking structure 510 with the outer periphery of the micro-LED chip 100. At this time, a blocking structure 510 with an annular metal step structure can be additionally formed through photolithography, evaporation and other processes, and the blocking structure 510 is easier to realize in process production; and the blocking structure 510 with an annular structure can enclose the entire display area 110, and the blocking structure 510 with an annular structure can further improve the packaging airtightness and reliability of the micro-LED device packaging structure 10.

[0101] In some examples, a packaging substrate 300 stacked and connected with the driver chip 200 is provided on a side of the driver chip 200 away from the micro-LED chip 100, and a blocking step 520 is opened on the periphery of the packaging substrate 300, including: providing a packaging substrate 300 and a circuit board 600; opening a blocking step 520 on the periphery of the packaging substrate 300, so that the first end 610 of the circuit board 600 is set on the blocking step 520, and the second end 620 of the circuit board 600 extends outside the packaging substrate 300; stacking and connecting the micro-LED device 101 with the packaging substrate 300, and positioning the driver chip 200 between the packaging substrate 300 and the micro-LED chip 100; and electrically connecting the circuit board 600 to the driver chip 200 through an electrical connector 700. The step of providing packaging glue 400 and making the packaging glue 400 wrap the outer periphery of the micro-light-emitting diode chip 100 and the driver chip 200, and cover the blocking structure 510 and at least part of the blocking step 520 includes: providing packaging glue 400, and making the packaging glue 400 wrap the outer periphery of the micro-light-emitting diode chip 100 and the driver chip 200, and cover the blocking structure 510, at least part of the blocking step 520, part of the circuit board 600 and the electrical connector 700.

[0102] Based on the above description, please refer to Fig.17 , Fig.17 A second flow chart of the packaging method provided in the embodiment of the present application. The packaging method of the present application includes:

[0103] In S210 , a packaging substrate 300 is provided.

[0104] In S220 , a ring-shaped blocking step 520 is formed on the periphery of the packaging substrate 300 by a cutting process. The blocking step 520 includes a first step surface 521 , a connecting surface 522 , and a second step surface 523 that are sequentially connected.

[0105] The packaging substrate 300 is used to carry the driver chip 200, the micro-LED chip 100 and the packaging glue 400. The packaging substrate 300 can be a heat dissipation substrate. The blocking step 520 is formed on the outer periphery of the packaging substrate 300, and the outer edge of the first step surface 521 of the blocking step 520 can be aligned with the outer edge of the packaging substrate 300. The present application forms the blocking step 520 on the packaging substrate 300 by means of edge cutting steps, and the blocking step 520 is easier to process and form.

[0106] In S230 , a circuit board 600 is provided.

[0107] In S240 , the first end 610 of the circuit board 600 is disposed on the blocking step 520 , the second end 620 of the circuit board 600 is disposed outside the package substrate 300 , and the spacing distance L0 between the first end 610 and the connection surface 522 of the blocking step 520 is between 50 μm and 150 μm.

[0108] The maximum distance between the circuit board 600 and the first step surface 521 is smaller than the maximum distance between the connection surface 522 and the first step surface 521, and the thickness of the circuit board 600 is smaller than the height of the connection surface 522, so that there is a height difference between the circuit board 600 and the driver chip 200. When the spacing distance L0 between the first end 610 of the circuit board 600 and the connection surface 522 of the blocking step 520 is between 50 microns and 150 microns, a sunken groove structure 530 can be formed between the first end 610 and the connection surface 522, and liquids such as moisture entering from the connection interface of the circuit board 600 and the packaging glue 400 will change the flow path after encountering the groove structure 530 and flow toward the bottom of the groove structure 530, so that the groove structure 530 can further improve the packaging airtightness and reliability of the micro light emitting diode device packaging structure 10.

[0109] In S250 , a micro light emitting diode device 101 is provided. The micro light emitting diode device 101 includes a micro light emitting diode chip 100 and a driving chip 200 that are bonded to each other.

[0110] In S260 , the driving chip 200 is connected to the second step surface 523 of the package substrate 300 , and the driving chip 200 is electrically connected to the circuit board 600 through the electrical connection member 700 .

[0111] The external circuit provides electrical signals and control signals to the driving chip 200 through the circuit board 600 , and the driving chip 200 can control the pixel units of the micro light emitting diode chip 100 to emit light.

[0112] In S270 , a ring-shaped blocking structure 510 protruding from the micro-LED chip 100 is formed on the outer periphery of the side of the micro-LED chip 100 facing away from the driving chip 200 by photolithography and evaporation processes.

[0113] In this step, an additional ring-shaped metal step-structured blocking structure 510 can be formed in the non-display area 120 of the micro-LED chip 100 through processes such as photolithography and evaporation. The blocking structure 510 is easier to realize in process production.

[0114] In S280, packaging glue 400 is provided, and the packaging glue 400 wraps the outer periphery of the micro-LED chip 100 and the driver chip 200, and covers the blocking structure 510, at least part of the blocking step 520, part of the circuit board 600 and the electrical connector 700, and obtains the micro-LED device packaging structure 10.

[0115] The packaging glue 400 can bond the micro-LED chip 100, the driver chip 200 and the packaging substrate 300 together, and cover the blocking structure 510, all or part of the blocking step 520, part of the circuit board 600 and the electrical connector 700. The packaging glue 400 serves as a protective glue for the micro-LED device packaging structure 10. The packaging glue 400 can reduce the moisture and other liquids that enter the bonding area of ​​the micro-LED chip 100 and the driver chip 200.

[0116] In the packaging method of the embodiment of the present application, a blocking structure 510 with an annular metal step structure is additionally formed in the non-display area 120 of the micro-LED chip 100 through processes such as photolithography and evaporation. The blocking structure 510 is easier to implement in process production; at the same time, steps are designed around the packaging substrate 300 to form a blocking step 520, and the path of moisture and other liquids entering the bonding area of ​​the micro-LED chip 100 and the driver chip 200 will change. Moisture and other liquids need to bypass the blocking structure 510 and the blocking step 520 to enter the bonding area. The path difficulty of moisture and other liquids is increased, and moisture and other liquids are not easy to enter the bonding area, thereby greatly improving the packaging airtightness and reliability of the micro-LED device packaging structure 10.

[0117] Based on the above description, the present application embodiment further provides a display device 20, please refer to Fig.18 , Fig.18A structural schematic diagram of a display device 20 provided in an embodiment of the present application. The display device 20 can be applied to electronic devices to realize extended reality (Extended Reality, XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). In implementation, the display device 20 can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the display device 20 can also be the display part of an electronic device, for example, the electronic device can include: any device with a display screen, such as a smart phone, a smart watch, a laptop computer, a tablet computer, a driving recorder, a navigator, a head-mounted device, etc.; for another example, the display device 20 can also be the lighting part of an electronic device, for example, the electronic device can include: any device with a lighting component, such as a vehicle, a street lamp, etc.

[0118] It can be understood that the display device 20 of the embodiment of the present application includes the micro-light emitting diode device packaging structure 10 of any of the aforementioned embodiments, so that the micro-light emitting diode device packaging structure 10 of the display device 20 of the present application has better packaging airtightness and better reliability.

[0119] It should be noted that the micro-LED device packaging structure 10, packaging method, and display device 20 of the embodiments of the present application are different subjects under the same inventive concept. Features not described in detail in each embodiment can be found in the description of other embodiments.

[0120] It should be noted that the "multiple" mentioned in this application generally refers to two or more. Moreover, the directional terms mentioned in the embodiments of the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the embodiments of the present application, rather than to limit the embodiments of the present application. In the various drawings, units with similar structures are represented by the same figure numbers. For clarity, the various parts in the drawings are not drawn to scale. In addition, certain related parts may not be shown in the drawings.

[0121] It should be understood that, in the description of this application, terms such as "first", "second", etc. are only used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0122] It is understandable that those skilled in the art can combine various implementations in the above embodiments under the guidance of the above embodiments to obtain technical solutions of multiple implementations. The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0123] The above is a detailed introduction to the micro-LED device packaging structure, packaging method and display device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A micro light emitting diode device packaging structure, characterized in that: include: A micro light emitting diode device, comprising a micro light emitting diode chip and a driver chip bonded together; A blocking structure is disposed on a side of the micro-LED chip facing away from the driving chip and protrudes from the micro-LED chip; A packaging substrate, stacked on a side of the driver chip away from the micro-LED chip, with a blocking step provided on the periphery of the packaging substrate; and The packaging glue wraps the outer periphery of the micro-LED chip and the driver chip, and covers the blocking structure and at least a part of the blocking step.

2. The micro light emitting diode device packaging structure according to claim 1, characterized in that: The micro light emitting diode chip comprises a display area and a non-display area, the blocking structure is arranged and protrudes from the non-display area, and the outer periphery of the blocking structure is aligned with the outer periphery of the non-display area.

3. The micro light emitting diode device packaging structure according to claim 2, characterized in that: The blocking structure is a ring-shaped structure, and the display area is located inside the blocking structure.

4. The micro light emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that: The micro light emitting diode device packaging structure further includes: A circuit board is electrically connected to the driving chip through an electrical connector, wherein a first end of the circuit board is disposed on the blocking step, and a second end of the circuit board is disposed outside the packaging substrate; Wherein, the packaging glue also wraps part of the circuit board and the electrical connector.

5. The micro light emitting diode device packaging structure according to claim 4, characterized in that: The blocking step includes a first step surface, a connecting surface, and a second step surface connected in sequence, the second step surface is located between the driving chip and the first step surface, and the circuit board is arranged on the first step surface; wherein, The thickness of the circuit board is smaller than the height of the connection surface, and the spacing distance between the first end of the circuit board and the connection surface is between 50 micrometers and 150 micrometers.

6. The micro light emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that: The packaging substrate is a heat dissipation substrate.

7. A packaging method, characterized in that: include: A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driving chip which are bonded to each other; A blocking structure protruding from the micro-light emitting diode chip is provided on a side of the micro-light emitting diode chip away from the driving chip; A packaging substrate stacked and connected with the driver chip is arranged on a side of the driver chip away from the micro light emitting diode chip, and a blocking step is provided at the periphery of the packaging substrate; Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro-LED chip and the driving chip, and cover the blocking structure and at least part of the blocking step, so as to obtain a micro-LED device packaging structure.

8. The packaging method according to claim 7, characterized in that: The micro-LED chip comprises a display area and a non-display area; the step of providing a blocking structure protruding from the micro-LED chip on a side of the micro-LED chip away from the driving chip comprises: A blocking structure protruding from the non-display area is disposed in the non-display area, and an outer periphery of the blocking structure is aligned with an outer periphery of the non-display area.

9. The packaging method according to claim 7, characterized in that: The step of arranging a packaging substrate stacked and connected with the driver chip on a side of the driver chip away from the micro light emitting diode chip, and providing a blocking step at the periphery of the packaging substrate comprises: Provide packaging substrates and circuit boards; A blocking step is provided on the periphery of the packaging substrate, so that the first end of the circuit board is disposed on the blocking step, and the second end of the circuit board extends out of the packaging substrate; The micro-LED device is stacked and connected with the packaging substrate, and the driving chip is located between the packaging substrate and the micro-LED chip; The circuit board is electrically connected to the driving chip through an electrical connector; The step of providing packaging glue and making the packaging glue wrap the outer periphery of the micro-LED chip and the driver chip and cover the blocking structure and at least part of the blocking step includes: Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro light emitting diode chip and the driving chip, and cover the blocking structure, at least part of the blocking step, part of the circuit board and the electrical connector.

10. A display device, characterized in that: It comprises a micro-light emitting diode device packaging structure as described in any one of claims 1 to 6; or, it comprises a micro-light emitting diode device packaging structure prepared by the packaging method as described in any one of claims 7 to 9.

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