Double-sided exposure device and method for high-order density circuit board

Abstract

The invention discloses a double-sided exposure device and method for a high-order density circuit board, the double-sided exposure device comprises a workbench and a rack fixed on the workbench, the upper surface of the workbench is provided with an X-axis moving mechanism, the X-axis moving mechanism comprises two grooves which are arranged on the upper surface of the workbench and are parallel to each other, and the two grooves are arranged in the workbench. An X-axis linear module is arranged in each groove, and a fixing plate is arranged on a sliding table of each X-axis linear module; a circuit board rotating assembly and a Y-axis moving mechanism are arranged on the upper surface of the fixing plate. According to the invention, the double-sided exposure of the high-order density circuit board can be realized, after the front surface of the circuit board is exposed, the back surface of the circuit board can be exposed without taking down the circuit board and driving the circuit board to turn over, and the circuit board can be quickly supported and fixed by the circuit board fixing frame. The mask plate is quickly mounted by the mask plate fixing frame, so that the working efficiency of circuit board exposure is improved, and the whole exposure equipment is not complicated in structure and low in manufacturing cost.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a double-sided exposure device and method for a high-density circuit board. Background Art

[0002] Exposure is an important step in the production process of printed circuit boards. Its principle is to use lighting technology to transfer the designed circuit pattern to the photosensitive material to prepare for the subsequent etching process. High-density circuit boards, namely HDI circuit boards, are becoming more and more widely used. They are a type of circuit board with a relatively high distribution density using micro-blind buried hole technology. For the exposure of high-density circuit boards, it is mainly to coat a layer of photosensitive film on the front and back of the high-density circuit board, place the designed circuit pattern on the photosensitive film, and use exposure equipment to irradiate light onto the photosensitive film to expose the circuit pattern on the surface of the high-density circuit board. After exposure, the high-density circuit board removes the unexposed part of the photosensitive film through processes such as development and etching, and the remaining part is the designed circuit pattern. The carrier of the designed circuit pattern is called a mask plate, and the mask plate has a lot of holes on it. After the circuit pattern is exposed, it is exposed on the surface of the circuit board. There are three ways to place the mask plate and the high-density circuit board: the first is contact exposure, such as soft contact, hard contact and vacuum contact. The disadvantage is that the closer the contact, the greater the damage to the mask plate and the material; the second is proximity exposure, that is, a tiny gap is retained between the mask plate and the photosensitive film to avoid damage caused by direct contact between the mask plate and the photosensitive film, and the service life of the mask plate can be increased, and the circuit pattern exposure defects are small; the third is projection exposure, which refers to the use of an optical system to focus the light beam between the mask plate and the photosensitive film to achieve exposure. The disadvantage is that the equipment is more complicated and expensive.

[0003] Existing equipment can only perform single-sided exposure on high-density circuit boards. When exposing the other side of a high-density circuit board, the circuit board needs to be removed, turned over, repositioned, and then exposed. This results in low exposure efficiency and cannot meet the production needs of continuous exposure. Exposure equipment is generally complex and difficult to maintain, and the equipment cost is expensive and needs to be solved urgently. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a double-sided exposure device and method for a high-density circuit board to solve the problems existing in the prior art double-sided exposure device for circuit boards.

[0005] The objective of the present invention is achieved through the following technical solutions: A double-sided exposure device for a high-density circuit board, comprising a workbench and a frame fixed on the workbench, wherein an X-axis moving mechanism is arranged on the upper surface of the workbench, wherein the X-axis moving mechanism comprises two grooves which are opened on the upper surface of the workbench and are parallel to each other, wherein an X-axis linear module is arranged in each of the grooves, and a fixed plate is arranged on the slide of each of the X-axis linear modules; a circuit board rotating assembly and a Y-axis moving mechanism are arranged on the upper surface of the fixed plate, wherein the Y-axis moving mechanism comprises a Y-axis linear module and a fixing frame for fixing the Y-axis linear module, wherein the circuit board rotating assembly comprises an L-shaped fixed plate, a rotating motor fixed to the vertical direction portion of the L-shaped fixed plate, and a circuit board fixing frame fixedly connected to the output shaft of the rotating motor, wherein the vertical direction portion of the L-shaped fixed plate is fixedly connected to the slide of the Y-axis linear module; The circuit board fixing frame is a hollow rectangular frame, and telescopic reels are provided on both inner side walls of the circuit board fixing frame. A net roll for supporting the circuit board is installed in the telescopic reel, and the front end of the net roll is buckled with the circuit board fixing frame; a distance measuring sensor is provided on the upper surface of the circuit board fixing frame; The frame is provided with a mask plate assembly, which includes an L-shaped fixing frame fixed on the frame, a fixing column connected to the L-shaped fixing frame, and a mask plate fixing frame movably connected to the fixing column. The mask plate fixing frame is a hollow rectangular frame composed of four right-angle blocks and two straight-line blocks. A spring is provided between one end of each right-angle block and an adjacent right-angle block, and a spring is provided between the other end of each right-angle block and an adjacent straight-line block. Each of the right-angle blocks and the straight-line block is provided with steps of equal height, and a fixing pin for fixing the mask plate is provided on the step. An exposure light source is arranged on the top of the frame, and the mask plate fixing frame is located directly below the exposure light source.

[0006] The X-axis linear module is a ball screw linear module.

[0007] The Y-axis linear module is a synchronous belt linear module.

[0008] The opening direction of one of the telescopic reels is upward, and the opening direction of the other telescopic reel is downward.

[0009] The material of the mesh roll is carbon wire.

[0010] The fixing column and the mask plate fixing frame are connected by a movable pin.

[0011] The spring is a compression spring.

[0012] A CCD positioning camera is arranged on the fixing plate.

[0013] A double-sided exposure method for a high-density circuit board, based on the double-sided exposure device described above, comprises the following steps: S1. Provide a high-density circuit board, pull open the mesh roll in the retractable reel with the opening direction opening downward and buckle it on the circuit board fixing frame, place the high-density circuit board on the pulled open mesh roll, pull open the mesh roll in the retractable reel with the opening direction opening upward and buckle it on the circuit board fixing frame, and the upper and lower layers of mesh rolls realize the support and fixation of the high-density circuit board; S2. Place the mask plate with through holes at the four corners in the mask plate holder. According to the size of the mask plate, pull the four right-angle blocks to fit the through holes of the mask plate onto the fixing pins to complete the fixing of the mask plate. S3. The X-axis linear module drives the high-density circuit board to move along the X-axis direction, and the CCD positioning camera identifies the position of the high-density circuit board and controls the high-density circuit board to reach the preset position; S4. The Y-axis linear module drives the high-density circuit board to move upward along the Y-axis direction, and the distance sensor detects the distance between the circuit board fixing frame and the mask plate fixing frame. The distance between the circuit board fixing frame and the mask plate fixing frame is controlled between 200 and 400 microns; S5. Turn on the exposure light source to expose the front side of the high-density circuit board; S6. After the high-density circuit board is exposed on the front side, the Y-axis linear module drives the circuit board to move downward along the Y-axis direction, and the rotary motor drives the circuit board holder to rotate 180 degrees. Repeat step S4, turn on the exposure light source, and expose the back side of the high-density circuit board; S7. After the exposure of the front and back sides of the high-density PCB is completed, the X-axis linear module drives the high-density PCB to move along the X-axis direction, pushing one of the web rolls, and the telescopic reel drives the web roll to retract, and the high-density PCB is removed.

[0014] The beneficial effects of the present invention are: The present invention can realize double-sided exposure of high-density circuit boards. After the front side of the circuit board is exposed, the circuit board does not need to be removed. Under the action of a rotating motor, the circuit board is driven to flip, and the exposure of the back side of the circuit board can be realized. The structure is simple and easy to operate, and the circuit board fixing frame can realize the rapid support and fixation of the circuit board. The present invention adopts a mask plate and a circuit board for close exposure. The mask plate fixing frame can realize the clamping and fixing of mask plates of different sizes. It is suitable for mask plates of different sizes. The mask plate is quickly installed in the mask plate fixing frame, which improves the working efficiency of circuit board exposure. The circuit board is driven by the Y-axis linear module and adopts a distance measuring sensor to accurately control the distance between the circuit board and the mask plate. The entire exposure equipment structure is not complicated and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a front view of the double-sided exposure device of the present invention; Figure 3 It is a side view of the double-sided exposure device of the present invention; Figure 4 It is a structural schematic diagram of the circuit board rotating assembly in the present invention; Figure 5 It is a structural schematic diagram of the mask plate fixing frame of the present invention; In the figure, 1-workbench, 2-frame, 3-groove, 4-X-axial linear module, 5-fixed plate, 6-Y-axial linear module, 7-fixed frame, 8-L-type fixed plate, 9-rotating motor, 10-circuit board fixing frame, 11-telescopic reel, 12-L-type fixing frame, 13-fixed column, 14-mask plate fixing frame, 15-right angle block, 16-straight line block, 17-spring, 18-step, 19-fixed pin, 20-exposure light source. DETAILED DESCRIPTION

[0016] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0017] like Figures 1 to 5 As shown, a double-sided exposure device for a high-density circuit board comprises a workbench 1 and a frame 2 fixed on the workbench 1, an upper surface of the workbench 1 is provided with an X-axis moving mechanism, the X-axis moving mechanism comprises two grooves 3 opened on the upper surface of the workbench 1 and parallel to each other, each of the grooves 3 is provided with an X-axis linear module 4, and a fixed plate 5 is provided on the slide of each of the X-axis linear modules 4; a circuit board rotating assembly and a Y-axis moving mechanism are provided on the upper surface of the fixed plate 5, the Y-axis moving mechanism comprises a Y-axis linear module 6 and a fixing frame 7 for fixing the Y-axis linear module 6, the circuit board rotating assembly comprises an L-shaped fixing plate 8, a rotating motor 9 fixed to the vertical part of the L-shaped fixing plate 8 and a circuit board fixing frame 10 fixedly connected to the output shaft of the rotating motor 9, and the vertical part of the L-shaped fixing plate 8 is fixedly connected to the slide of the Y-axis linear module 6.

[0018] The circuit board fixing frame 10 is a hollow rectangular frame, and telescopic reels 11 are provided on both inner side walls of the circuit board fixing frame 10. A mesh roll for supporting the circuit board is installed in the telescopic reel 11, and the front end of the mesh roll is buckled with the circuit board fixing frame 10; a distance measuring sensor is provided on the upper surface of the circuit board fixing frame 10.

[0019] A mask plate assembly is arranged on the frame 2, and the mask plate assembly includes an L-shaped fixing frame 12 fixed on the frame 2, a fixing column 13 connected to the L-shaped fixing frame 12, and a mask plate fixing frame 14 movably connected to the fixing column 13. The mask plate fixing frame 14 is a hollow rectangular frame composed of four right-angle blocks 15 and two straight-line blocks 16. A spring 17 is arranged between one end of each right-angle block 15 and an adjacent right-angle block 15, and a spring 17 is also arranged between the other end of each right-angle block 15 and an adjacent straight-line block 16; each of the right-angle blocks 15 and the straight-line blocks 16 is provided with a step 18 of the same height, and a fixing pin 19 for fixing the mask plate is arranged on the step 18.

[0020] An exposure light source 20 is disposed on the top of the frame 2 , and the mask fixing frame 14 is located directly below the exposure light source 20 .

[0021] The X-axis linear module 4 is a ball screw linear module.

[0022] The Y-axis linear module 6 is a synchronous belt linear module.

[0023] The opening direction of one of the telescopic reels 11 is upward, and the opening direction of the other telescopic reel 11 is downward.

[0024] The material of the mesh roll is carbon wire.

[0025] The fixing column 13 and the mask plate fixing frame 14 are connected by a movable pin.

[0026] The spring 17 is a compression spring.

[0027] The fixing plate 5 is provided with a CCD positioning camera.

[0028] A double-sided exposure method for a high-density circuit board, based on the double-sided exposure device described above, comprises the following steps: S1. Provide a high-density circuit board, pull open the mesh roll in the telescopic reel with the opening direction as downward opening and buckle it on the circuit board fixing frame, place the high-density circuit board on the pulled open mesh roll, pull open the mesh roll in the telescopic reel with the opening direction as upward opening and buckle it on the circuit board fixing frame, and the upper and lower layers of mesh rolls realize the support and fixation of the high-density circuit board.

[0029] S2. Place the mask plate with through holes at the four corners in the mask plate fixing frame. According to the size of the mask plate, pull the four right-angle blocks to fit the through holes of the mask plate onto the fixing pins to complete the fixing of the mask plate.

[0030] S3. The X-axis linear module drives the high-density circuit board to move along the X-axis direction. The CCD positioning camera identifies the position of the high-density circuit board and controls the high-density circuit board to reach the preset position.

[0031] S4. The Y-axis linear module drives the high-density circuit board to move upward along the Y-axis direction. The distance sensor detects the distance between the circuit board fixture and the mask plate fixture. The distance between the circuit board fixture and the mask plate fixture is controlled between 200 and 400 microns.

[0032] S5. Turn on the exposure light source to expose the front side of the high-density circuit board.

[0033] S6. After the front exposure of the high-density circuit board is completed, the Y-axis linear module drives the circuit board to move downward along the Y-axis direction, and the rotary motor drives the circuit board fixing frame to rotate 180 degrees. Repeat step S4, turn on the exposure light source, and expose the back of the high-density circuit board.

[0034] S7. After the exposure of the front and back sides of the high-density PCB is completed, the X-axis linear module drives the high-density PCB to move along the X-axis direction, pushing one of the web rolls, and the telescopic reel drives the web roll to retract, and the high-density PCB is removed.

[0035] The present invention can realize double-sided exposure of high-density circuit boards. After the front side of the circuit board is exposed, the circuit board does not need to be removed. Under the action of a rotating motor, the circuit board is driven to flip, and the exposure of the back side of the circuit board can be realized. The structure is simple and easy to operate, and the circuit board fixing frame can realize the rapid support and fixation of the circuit board. The present invention adopts a mask plate and a circuit board for close exposure. The mask plate fixing frame can realize the clamping and fixing of mask plates of different sizes. It is suitable for mask plates of different sizes. The mask plate is quickly installed in the mask plate fixing frame, which improves the working efficiency of circuit board exposure. The circuit board is driven by the Y-axis linear module and adopts a distance measuring sensor to accurately control the distance between the circuit board and the mask plate. The entire exposure equipment structure is not complicated and the cost is low.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A double-sided exposure device for high-density circuit boards, characterized in that: The invention comprises a workbench (1) and a frame (2) fixed on the workbench (1); an X-axis moving mechanism is arranged on the upper surface of the workbench (1); the X-axis moving mechanism comprises two grooves (3) opened on the upper surface of the workbench (1) and parallel to each other; an X-axis linear module (4) is arranged in each of the grooves (3); a fixed plate (5) is arranged on the slide of each of the X-axis linear modules (4); a circuit board rotating assembly and a Y-axis moving mechanism are arranged on the upper surface of the fixed plate (5); the Y-axis moving mechanism comprises a Y-axis linear module (6) and a fixed frame (7) for fixing the Y-axis linear module (6); the circuit board rotating assembly comprises an L-shaped fixed plate (8), a rotating motor (9) fixed to the vertical part of the L-shaped fixed plate (8), and a circuit board fixing frame (10) fixedly connected to the output shaft of the rotating motor (9); the vertical part of the L-shaped fixed plate (8) is fixedly connected to the slide of the Y-axis linear module (6); The circuit board fixing frame (10) is a hollow rectangular frame, and telescopic reels (11) are provided on both inner side walls of the circuit board fixing frame (10), a mesh roll for supporting the circuit board is installed in the telescopic reel (11), and the front end of the mesh roll is buckled with the circuit board fixing frame (10); a distance measuring sensor is provided on the upper surface of the circuit board fixing frame (10); The frame (2) is provided with a mask plate assembly, the mask plate assembly comprising an L-shaped fixing frame (12) fixed on the frame (2), a fixing column (13) connected to the L-shaped fixing frame (12), and a mask plate fixing frame (14) movably connected to the fixing column (13); the mask plate fixing frame (14) is a hollow rectangular frame composed of four right-angle blocks (15) and two straight-line blocks (16); a spring (17) is provided between one end of each right-angle block (15) and an adjacent right-angle block (15); and a spring (17) is also provided between the other end of each right-angle block (15) and an adjacent straight-line block (16); each right-angle block (15) and straight-line block (16) is provided with a step (18) of the same height, and a fixing pin (19) for fixing the mask plate is provided on the step (18); An exposure light source (20) is arranged on the top of the frame (2), and the mask plate fixing frame (14) is located directly below the exposure light source (20).

2. The double-sided exposure device for high-density circuit boards according to claim 1, characterized in that: The X-axis linear module (4) is a ball screw linear module.

3. The double-sided exposure device for high-density circuit boards according to claim 1, characterized in that: The Y-axis linear module (6) is a synchronous belt linear module.

4. The double-sided exposure device for high-density circuit boards according to claim 1, characterized in that: The opening direction of one of the telescopic reels (11) is upward, and the opening direction of the other telescopic reel (11) is downward.

5. The double-sided exposure device for high-density circuit boards according to claim 1, characterized in that: The material of the mesh roll is carbon wire.

6. The double-sided exposure device for high-density circuit boards according to claim 1, characterized in that: The fixing column (13) and the mask plate fixing frame (14) are connected by a movable pin.

7. The double-sided exposure device for high-density circuit boards according to claim 1, characterized in that: The spring (17) is a compression spring.

8. The double-sided exposure device for high-density circuit boards according to claim 1, characterized in that: A CCD positioning camera is arranged on the fixing plate (5).

9. A double-sided exposure method for high-density circuit boards, based on the double-sided exposure device of claims 1 to 8, characterized in that: The following steps are involved: S1. Provide a high-density circuit board, pull open the mesh roll in the retractable reel with the opening direction opening downward and buckle it on the circuit board fixing frame, place the high-density circuit board on the pulled open mesh roll, pull open the mesh roll in the retractable reel with the opening direction opening upward and buckle it on the circuit board fixing frame, and the upper and lower layers of mesh rolls realize the support and fixation of the high-density circuit board; S2. Place the mask plate with through holes at the four corners in the mask plate holder. According to the size of the mask plate, pull the four right-angle blocks to fit the through holes of the mask plate onto the fixing pins to complete the fixing of the mask plate. S3. The X-axis linear module drives the high-density circuit board to move along the X-axis direction, and the CCD positioning camera identifies the position of the high-density circuit board and controls the high-density circuit board to reach the preset position; S4. The Y-axis linear module drives the high-density circuit board to move upward along the Y-axis direction, and the distance sensor detects the distance between the circuit board fixing frame and the mask plate fixing frame. The distance between the circuit board fixing frame and the mask plate fixing frame is controlled between 200 and 400 microns; S5. Turn on the exposure light source to expose the front side of the high-density circuit board; S6. After the high-density circuit board is exposed on the front side, the Y-axis linear module drives the circuit board to move downward along the Y-axis direction, and the rotary motor drives the circuit board holder to rotate 180 degrees. Repeat step S4, turn on the exposure light source, and expose the back side of the high-density circuit board; S7. After the exposure of the front and back sides of the high-density PCB is completed, the X-axis linear module drives the high-density PCB to move along the X-axis direction, pushing one of the web rolls, and the telescopic reel drives the web roll to retract, and the high-density PCB is removed.

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