Display module and display equipment

Abstract

The invention discloses a display module and a display device, and relates to the technical field of display, the display module comprises an OLED assembly and a heat dissipation structure, the heat dissipation structure comprises a cooling fin and at least one heat pipe, an evaporation section of the heat pipe is in thermal conduction connection with the OLED assembly, and a condensation section of the heat pipe is in thermal conduction connection with the cooling fin. According to the technical scheme, the evaporation section of the heat pipe is connected with the OLED assembly in a heat conduction mode, heat generated by working of the OLED assembly is transmitted to the evaporation section of the heat pipe, then transmitted to the condensation section of the heat pipe and then dissipated into air through the cooling fins, and therefore the heat of the OLED assembly is taken away, and the heat dissipation efficiency of the OLED assembly is improved. Due to the arrangement of the heat pipes and the cooling fins and the arrangement of high cooling efficiency, the display module is light in weight, an aluminum plate or an iron plate does not need to be arranged for cooling, and the weight of the display module can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Due to the material problems of OLED itself, when the screen displays a static image for a long time, these organic materials will accelerate the aging speed due to continuous light emission, reduce the brightness, and leave afterimages on the screen. In order to reduce the aging speed and improve reliability, it is necessary to have a good heat dissipation design for the OLED module to avoid damage to the light-emitting unit due to high temperature caused by poor heat dissipation. The heat dissipation method in related technologies is usually to add a separate aluminum plate or iron plate between the OLED unit and the backplane for heat dissipation, but this method has low heat dissipation efficiency and will cause the overall OLED module to be heavier. Summary of the invention

[0003] The main purpose of the present invention is to propose a display module and a display device, aiming to at least solve the technical problem in the related art that a separate aluminum plate or iron plate is added between the OLED unit and the back panel for heat dissipation, but this method has low heat dissipation efficiency and will cause the overall OLED module to be heavy.

[0004] To achieve the above object, the present invention provides a display module, comprising:

[0005] OLED components; and,

[0006] The heat dissipation structure comprises a heat sink and at least one heat pipe, wherein the evaporation section of the heat pipe is thermally connected to the OLED component, and the condensation section of the heat pipe is thermally connected to the heat sink.

[0007] In one embodiment, the OLED assembly comprises:

[0008] an OLED display unit; and,

[0009] A back plate, arranged on one side of the OLED display unit in the thickness direction;

[0010] Wherein, the heat pipe is attached to a side of the OLED display unit facing the back plate.

[0011] In one embodiment, the back plate is provided with a first through hole for the heat sink and the heat dissipation fan to pass through the back plate.

[0012] In one embodiment, the display module further includes a control board and a flat cable, wherein the control board is disposed on a side of the back plate away from the OLED display unit, and the flat cable connects the OLED display unit and the control board;

[0013] The back plate is provided with a second via hole for the flat cable to pass through the back plate.

[0014] In one embodiment, the heat pipe is fixed to a side of the OLED display unit facing the back plate through a thermally conductive adhesive strip or thermally conductive glue.

[0015] In one embodiment, the heat dissipation structure further includes a heat dissipation fan disposed adjacent to the heat sink.

[0016] In one embodiment, the heat sink includes a plurality of fins spaced apart in a direction;

[0017] The airflow direction of the heat dissipation fan is opposite to the gaps between the plurality of fins.

[0018] In one embodiment, the plurality of fins are arranged along the thickness direction of the OLED display unit;

[0019] The heat dissipation fan includes a vortex fan disposed at one end of the plurality of fins, and a rotation axis of the vortex fan extends along a thickness direction of the OLED display unit.

[0020] In one embodiment, the heat sink includes a plurality of fins, and the condensation section of the heat pipe passes through the plurality of fins.

[0021] The present invention further provides a display device, the display device comprising a display module, the display module comprising:

[0022] OLED components; and,

[0023] The heat dissipation structure comprises a heat sink and at least one heat pipe, wherein the evaporation section of the heat pipe is thermally connected to the OLED component, and the condensation section of the heat pipe is thermally connected to the heat sink.

[0024] In the technical solution of the present invention, the evaporation section of the heat pipe is thermally connected to the OLED component, and the heat generated by the operation of the OLED component is transferred to the evaporation section of the heat pipe, and then to the condensation section of the heat pipe, and then dissipated into the air through the heat sink, thereby taking away the heat of the OLED component. The arrangement of the heat pipe and the heat sink has a high heat dissipation efficiency and is light in weight. There is no need to arrange an aluminum plate or an iron plate for heat dissipation, and the weight of the display module can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of a three-dimensional exploded structure of an embodiment of a display module provided by the present invention;

[0027] Figure 2 for Figure 1 Structural schematic diagram of the heat dissipation structure;

[0028] Figure 3 for Figure 2 A schematic diagram of the structure of the heat dissipation structure viewed from above;

[0029] Figure 4 for Figure 1 The schematic diagram of the planar structure of the display module is shown in FIG.

[0030] Figure 5 for Figure 4 Schematic diagram of the structure of the mid-back plate.

[0031] Description of Figure Numbers:

[0032] 100. Display module; 1. OLED component; 11. OLED display unit; 12. Back panel; 121. First via hole; 122. Second via hole; 2. Heat dissipation structure; 21. Heat sink; 22. Heat pipe; 23. Cooling fan; 3. Control board; 4. Cable.

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] Due to the material problems of OLED itself, when the screen displays a static image for a long time, these organic materials will accelerate the aging speed due to continuous light emission, reduce the brightness, and leave afterimages on the screen. In order to reduce the aging speed and improve reliability, it is necessary to have a good heat dissipation design for the OLED module to avoid damage to the light-emitting unit due to high temperature caused by poor heat dissipation. The heat dissipation method in related technologies is usually to add a separate aluminum plate or iron plate between the OLED unit and the backplane for heat dissipation, but this method has low heat dissipation efficiency and will cause the overall weight of the OLED module to be heavier.

[0038] The present invention proposes a display module and a display device, aiming to at least solve the technical problem in the related art that a separate aluminum plate or iron plate is added between the OLED unit and the back plate for heat dissipation, but this method has low heat dissipation efficiency and will cause the overall OLED module to be heavy.

[0039] See also Figure 1 and Figure 2 In one embodiment of the present invention, the display module 100 includes an OLED component and a heat dissipation structure 2, the heat dissipation structure 2 includes a heat sink 21 and at least one heat pipe 22, the evaporation section of the heat pipe 22 is thermally connected to the OLED component, and the condensation section of the heat pipe 22 is thermally connected to the heat sink 21.

[0040] In the technical solution of the present invention, the evaporation section of the heat pipe 22 is thermally connected to the OLED component, and the heat generated by the operation of the OLED component is transferred to the evaporation section of the heat pipe 22, and then transferred to the condensation section of the heat pipe 22, and then dissipated into the air through the heat sink 21, thereby taking away the heat of the OLED component. The arrangement of the heat pipe 22 and the heat sink 21 has a high heat dissipation efficiency and is light in weight. There is no need to arrange an aluminum plate or an iron plate for heat dissipation, and the weight of the display module 100 can be reduced.

[0041] The present design does not limit the specific number of the heat pipe 22, which is at least one. In some embodiments, Figure 1 , Figure 2 and Figure 3 The heat pipe 22 may be set to two or more. It is understandable that the more the heat pipes 22 are, the better the heat dissipation effect of the OLED component will be, but the corresponding cost will be higher and the weight of the display module 100 will be greater. Therefore, in actual production, it can be selected according to the heat dissipation requirements of different OLED components.

[0042] There are many ways to thermally connect the heat pipe 22 and the heat sink 21. In one embodiment, the heat pipe 22 is fixed to the outermost fin of the heat sink 21, that is, it is thermally connected to only one fin. Although it is more convenient to install, the heat dissipation effect is poor. In the embodiment of the present invention, please refer to Figure 2 and Figure 3 The heat sink 21 includes a plurality of fins, and the condensing section of the heat pipe 22 is penetrated by the plurality of fins. In this way, the condensing section of the heat pipe 22 and the plurality of fins are thermally connected, which can effectively improve the heat dissipation efficiency.

[0043] When the heat pipe 22 and the heat sink 21 are fixed, the plurality of fins may be directly welded on the heat pipe 22 , or the plurality of fins may be sleeved on the heat pipe 22 by using interference fit.

[0044] There are many ways to thermally connect the heat pipe 22 to the OLED component. In an embodiment of the present invention, the OLED component includes an OLED display unit and a back plate 12, wherein the back plate 12 is arranged on one side of the OLED display unit in the thickness direction, and the heat pipe 22 is attached to the side of the OLED display unit facing the back plate 12; wherein the OLED display unit is used to display images, and the back plate 12 is used to support the OLED display unit. In this way, the heat pipe 22 is directly thermally connected to the OLED display unit, and the heat dissipation efficiency is higher. In another embodiment, the heat pipe 22 can also be attached to the side of the back plate 12 away from the OLED display unit, and the OLED display unit is directly fixed to the back plate 12, that is, the heat pipe 22 is indirectly thermally connected to the OLED display unit through the back plate 12. Although it can also play a role in cooling the OLED display unit, after all, the heat dissipation efficiency will be relatively worse across the back plate 12, but the overall structure will be easier to produce.

[0045] Specifically, the heat pipe 22 is attached to the OLED-Encap, ie, the encapsulation layer, of the OLED display unit.

[0046] Since the heat pipe 22 is arranged between the OLED display unit and the back panel 12, there will be a certain distance between the OLED display unit and the back panel 12. In order to fix the OLED display unit and the back panel 12, they can be fixed by means of adhesive strips; of course, the fixing method is not limited to this, and a receiving groove can be opened on the back panel 12 to accommodate the heat pipe 22, thereby reducing the distance between the OLED display unit and the back panel 12, and then the OLED display unit and the back panel 12 can be fixed by glue.

[0047] There are many ways to fix the heat pipe 22 and the OLED display unit. The heat pipe 22 and the OLED display unit may be fixed by the thermal conductive adhesive strip or by the thermal conductive adhesive.

[0048] In actual production, the heat pipe 22 is first fixed to the OLED display unit, and then the OLED display unit is fixed to the back plate 12 .

[0049] Since the heat dissipation structure 2 also includes the heat sink 21, if the heat sink 21 is arranged between the OLED display unit and the back plate 12 like the heat pipe 22, the thickness of the heat sink 21 itself will cause a large gap between the OLED display unit and the back plate 12, that is, the overall display module 100 will be very large in thickness, which is not conducive to the thin and light setting of the display device. Therefore, in the embodiment of the present invention, please continue to refer to Figure 4and Figure 5 The back plate 12 is provided with a first via hole 121 for the heat sink 21 to pass through the back plate 12; with this arrangement, the heat sink 21 does not need to be arranged between the OLED display unit and the back plate 12, but can pass through the first via hole 121 to the side of the back plate 12 away from the OLED display unit, thereby greatly reducing the thickness of the entire display module 100, which is conducive to the lightweight and thin setting of the display device.

[0050] In addition to supporting the OLED display unit, the back panel 12 is usually provided with a T-CON (Timming Controller, i.e., a control panel 3) to control the operation of the OLED display unit. The OLED display unit and the control panel 3 are connected via a flat cable 4. The flat cable 4 can directly cross the side of the back panel 12 to connect to the OLED display unit, but this will result in the required flat cable 4 being longer and the routing being more confusing. In the embodiments of the present invention, please refer to Figure 1 , Figure 4 and Figure 5 The display module 100 also includes a control board 3 and a cable 4. The control board 3 is arranged on a side of the back plate 12 away from the OLED display unit. The cable 4 connects the OLED display unit and the control board 3. The back plate 12 is provided with a second via hole 122 for the cable 4 to pass through the back plate 12. With this arrangement, since the heat pipe 22 is arranged between the OLED display unit and the back plate 12, there is a gap between the two, and the gap between the OLED display unit and the back plate 12 can be fully utilized for routing. Therefore, the second via hole 122 is provided on the back plate 12, so that the cable 4 can pass through the second via hole 122 to connect the OLED display unit and the control board 3, and the routing is more concealed.

[0051] The thermal conductivity of the heat pipe 22 is relatively high, which can reach more than 1500W / mK, while the thermal conductivity of the aluminum plate in the conventional technical means is 200W / mK. Although the thermal conductivity of the heat pipe 22 is much higher than that of the aluminum plate, the heat dissipation capacity of the overall heat dissipation structure 2 is still insufficient only through the passive heat exchange between the heat sink 21 and the air. Therefore, in the embodiment of the present invention, please refer to Figure 1 , Figure 2 and Figure 3 The heat dissipation structure 2 also includes a heat dissipation fan 23 disposed adjacent to the heat dissipation fin 21; thus, by disposing the heat dissipation fan 23, an active heat dissipation method is adopted to accelerate the heat exchange efficiency between the heat dissipation fin 21 and the air, thereby improving the heat dissipation capacity of the overall heat dissipation structure 2.

[0052] It is understandable that the heat sink 21 usually includes a plurality of fins. When the airflow of the cooling fan 23 faces the gaps between the plurality of fins, the heat dissipation effect will be better. Therefore, in an embodiment of the present invention, the heat sink 21 includes a plurality of fins spaced apart in one direction; the airflow direction of the cooling fan 23 is opposite to the gaps between the plurality of fins.

[0053] In order to make the airflow direction of the cooling fan 23 opposite to the gap between the multiple fins, the cooling fan 23 and the heat sink 21 are arranged in a variety of ways. In one embodiment, when the arrangement direction of the multiple fins of the heat sink 21 is not along the thickness direction of the OLED display unit, that is, when they are arranged along the width or length direction, it is necessary to ensure that the airflow direction of the cooling fan 23 is along the thickness direction. At this time, no matter whether the heat dissipation fan 23 adopts an axial flow fan or a vortex fan, the heat dissipation fan 23 needs to be arranged at the end of the heat sink 21 away from the OLED display unit, that is, the heat sink 21 and the heat dissipation fan 23 are arranged along the thickness direction of the OLED display unit; in this way, if the first via hole 121 is not provided on the back plate 12, the gap between the OLED display unit and the back plate 12 will be too large, resulting in the thickness of the overall display module 100 being too large, which is not conducive to the lightweight setting of the display device. Even if the first via hole 121 is provided on the back plate 12 for the heat sink 21 to pass through to the side of the back plate 12 away from the OLED display unit, the heat dissipation fan 23 will be very protruding from the back plate 12, and the overall structural layout will be not compact. At the same time, when the back plate 12 needs to be installed with the shell later, it will also be limited by the heat dissipation fan 23, resulting in very low space utilization.

[0054] In the embodiments of the present invention, please refer to Figure 2 and Figure 3The multiple fins are arranged along the thickness direction of the OLED display unit, and the heat dissipation fan 23 includes a vortex fan arranged at one end of the multiple fins, and the rotation axis of the vortex fan extends along the thickness direction of the OLED display unit. In this way, the multiple fins of the heat sink 21 are arranged along the thickness direction of the OLED display unit. If it is necessary to make the airflow direction of the heat dissipation fan 23 opposite to the gap between the multiple fins, no matter the heat dissipation fan 23 adopts an axial flow fan or a vortex fan, the heat dissipation fan 23 can be arranged in the width or length direction of the heat sink 21, which has little effect on the thickness of the overall display module 100; further, for the heat dissipation fan 23, its axial size is usually much smaller than its radial size. When the heat dissipation fan 23 adopts the vortex fan, the direction of its rotation axis is the same as the thickness direction of the OLED display unit, which has little effect on the thickness of the overall display module 100. At the same time, its radial air outlet direction can also face the gap between the multiple fins. While ensuring the heat dissipation effect, the overall structure makes more reasonable use of space and has a more compact layout.

[0055] The present invention also proposes a display device, which includes a display module 100. The specific structure of the display module 100 refers to the above embodiment. Since the display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0056] In the technical solution of the present invention, the evaporation section of the heat pipe 22 is thermally connected to the OLED component, and the heat generated by the operation of the OLED component is transferred to the evaporation section of the heat pipe 22, and then transferred to the condensation section of the heat pipe 22, and then dissipated into the air through the heat sink 21, thereby taking away the heat of the OLED component. The arrangement of the heat pipe 22 and the heat sink 21 has a high heat dissipation efficiency and is light in weight. There is no need to arrange an aluminum plate or an iron plate for heat dissipation, and the weight of the display module 100 can be reduced.

[0057] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A display module, characterized in that: include: OLED components; as well as, The heat dissipation structure comprises a heat sink and at least one heat pipe, wherein the evaporation section of the heat pipe is thermally connected to the OLED component, and the condensation section of the heat pipe is thermally connected to the heat sink.

2. The display module according to claim 1, wherein: The OLED assembly comprises: an OLED display unit; and, A back plate, arranged on one side of the OLED display unit in the thickness direction; Wherein, the heat pipe is attached to a side of the OLED display unit facing the back plate.

3. The display module according to claim 2, wherein: The back plate is provided with a first through hole for the heat sink to pass through the back plate.

4. The display module according to claim 2, wherein: The display module further includes a control board and a flat cable, wherein the control board is arranged on a side of the back plate away from the OLED display unit, and the flat cable connects the OLED display unit and the control board; The back plate is provided with a second via hole for the flat cable to pass through the back plate.

5. The display module according to claim 2, wherein: The heat pipe is fixed to a side of the OLED display unit facing the back plate through a heat-conducting adhesive strip or heat-conducting glue.

6. The display module according to any one of claims 1 to 5, characterized in that: The heat dissipation structure also includes a heat dissipation fan arranged adjacent to the heat sink.

7. The display module according to claim 6, wherein: The heat sink comprises a plurality of fins spaced apart in one direction; The airflow direction of the heat dissipation fan is opposite to the gaps between the plurality of fins.

8. The display module according to claim 7, wherein: The plurality of fins are arranged along the thickness direction of the OLED display unit; The heat dissipation fan includes a vortex fan disposed at one end of the plurality of fins, and a rotation axis of the vortex fan extends along a thickness direction of the OLED display unit.

9. The display module according to claim 1, wherein: The heat sink includes a plurality of fins, and the condensation section of the heat pipe is penetrated by the plurality of fins.

10. A display device, characterized in that: Comprising the display module as claimed in any one of claims 1 to 9.

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