Manifold fluid module

Abstract

The invention relates to a manifold fluid module. A manifold fluid module according to an embodiment of the present invention integrates at least one of heat exchangers, at least one of valves, and an expansion valve into one in a thermal management system consisting of a compressor, a plurality of heat exchangers, a plurality of valves, and an expansion valve, and includes: a manifold plate having a plurality of fluid channels formed therein; a cryogenic fluid passage among the plurality of fluid passages through which the heat-exchanged cryogenic fluid moves, and to which a plurality of fluid inlets and a fluid outlet are connected; and an evaporator inlet port via which one of the plurality of fluid inlets is connected to the evaporator outlet, where the evaporator inlet port may be disposed on the cryogenic fluid passage.

Description

Technical Field

[0001] The present invention relates to a manifold fluid module, and more particularly to a manifold fluid module that modularizes components such as a heat exchanger and a valve into a single unit. Background Art

[0002] In an atmosphere of increasing emphasis on environmentally friendly industrial development and the pursuit of energy to replace fossil fuels, electric vehicles and hybrid vehicles have become the most prominent areas of interest in the automotive industry. Both electric vehicles and hybrid vehicles are equipped with batteries to provide driving force, and in addition to driving operations, these batteries are also used for heating and cooling purposes.

[0003] In vehicles that rely on batteries for propulsion, using the batteries as a heat source for heating and cooling inevitably leads to a reduction in driving range; to address this problem, it has been proposed to integrate heat pump systems, which have been widely used in residential heating and cooling systems, into automobiles.

[0004] Basically, a heat pump operates by absorbing low temperature heat and transferring it to a higher temperature. For example, a heat pump cycle involves a liquid fluid evaporating in an evaporator, absorbing heat from its surroundings and becoming a gas, then releasing heat to its surroundings through a condenser and becoming a liquid again. Applying this principle to electric or hybrid vehicles offers the advantage of providing a supplemental heat source that is not present in conventional air conditioning systems.

[0005] Current electric vehicle heat pump systems use a partially modular approach, where key components (valves, reservoirs, coolers, condensers, internal heat exchangers, sensors, etc.) are connected by piping, which requires separate fittings and connectors for these connections and results in necessary spacing between components. These factors lead to disadvantages in packaging, cost, and processability.

[0006] To solve this problem, technology for modularizing the manifold is being developed, but there is a problem of performance degradation due to thermal interference between the high-temperature fluid and the low-temperature fluid during the modularization process. Summary of the invention

[0007] Technical issues

[0008] Embodiments of the present invention are directed to providing a manifold fluid module capable of minimizing thermal interference between refrigerants and improving heat pump performance by separating high temperature and low temperature regions of the fluid.

[0009] Technical Solution

[0010] According to an embodiment of the present invention, a manifold fluid module is provided, which integrates at least one heat exchanger, at least one valve and at least one expansion valve into a single unit for a thermal management system including a compressor, multiple heat exchangers, multiple valves and an expansion valve, and the manifold fluid module may include: a manifold plate, the manifold plate including multiple fluid channels formed inside, wherein the fluid channels may include low-temperature fluid channels, through which low-temperature fluid for heat exchange flows, and a fluid outlet and multiple fluid inlets are connected to the low-temperature fluid channels, wherein the fluid inlet includes an evaporator inlet port connected to the outlet of an evaporator, and the evaporator inlet port is arranged on the low-temperature fluid channel.

[0011] The at least one heat exchanger may include: a first heat exchanger coupled to the manifold plate, the first heat exchanger exchanging heat between a first fluid and a second fluid; and a second heat exchanger coupled to the manifold plate, the second heat exchanger exchanging heat between the second fluid and the first fluid discharged from the first heat exchanger.

[0012] The evaporator inlet port may be disposed adjacent to a first inlet port through which the first fluid enters the second heat exchanger.

[0013] The first fluid entering through the first inlet port may be discharged through a first outlet port, and the evaporator inlet port may be disposed between the first inlet port and the first outlet port.

[0014] The fluid outlet may be a reservoir port through which the first fluid is discharged to a reservoir, and the evaporator inlet port may be disposed adjacent to the reservoir port.

[0015] A distance between the evaporator inlet port and the reservoir port may be equal to or shorter than a distance between the first outlet port and the reservoir port.

[0016] The manifold fluid module may further include: a heat transfer barrier formed between the high temperature fluid channel and the low temperature fluid channel to prevent heat transfer from the high temperature fluid channel to the low temperature fluid channel; and a connecting member connecting the high temperature fluid channel and the low temperature fluid channel.

[0017] The connection member may connect the manifold plates separated by the heat transfer barrier, thereby allowing fluid to flow through the connection member.

[0018] The connection member may allow fluid flow during a heating mode of the thermal management system, but no fluid flow during a cooling mode.

[0019] The manifold plate may include a main plate including a fluid channel formed inside; and a bottom plate coupled to one side of the main plate to cover the fluid channel.

[0020] The main board may include: a first main board through which the high-temperature first fluid flows after passing through the first heat exchanger; and a second main board through which the low-temperature first fluid flows after passing through the second heat exchanger, wherein the heat transfer barrier may be formed between the first main board and the second main board.

[0021] The base plate may include: a first base plate coupled to cover at least one side of the first main board; and a second base plate coupled to cover at least one side of the second main board, wherein the heat transfer barrier may be formed between the first base plate and the second base plate.

[0022] The first bottom plate and the second bottom plate may be connected at one side by the connection member.

[0023] The connection member may be formed in a tubular shape.

[0024] The manifold fluid module may also include: a first expansion valve, which is configured to expand the first fluid entering the first heat exchanger; and a second expansion valve, which is configured to expand the first fluid entering the second heat exchanger, wherein the first expansion valve can be arranged above the first heat exchanger, the second expansion valve can be arranged above the second heat exchanger, and the first fluid entering the first heat exchanger and the second heat exchanger can flow from top to bottom.

[0025] The manifold fluid module may also include a first reversing valve and a second reversing valve, wherein the first reversing valve and the second reversing valve are configured to control the direction of the first fluid discharged from the first heat exchanger, wherein the first reversing valve may be arranged below the second heat exchanger and the second reversing valve may be arranged above the second heat exchanger.

[0026] The second main plate may include a reservoir port through which the first fluid is discharged to a reservoir, and the connection member may be configured to provide communication between the second reversing valve and the reservoir port.

[0027] The connecting member may be disposed between the second reversing valve and the second heat exchanger.

[0028] The manifold plate may include an opening formed in a portion where the second heat exchanger is located, and the heat transfer barrier may include a first heat transfer barrier and a second heat transfer barrier formed above and below the opening, respectively.

[0029] The manifold plate may include an opening formed in a portion where the second heat exchanger is located, and the heat transfer barrier may include a first heat transfer barrier and a second heat transfer barrier formed above and below the opening, respectively, wherein the first heat transfer barrier may be configured to cut off between the second expansion valve and the first reversing valve, and the second heat transfer barrier may be configured to cut off between the second heat exchanger and the first reversing valve.

[0030] Beneficial Effects

[0031] The manifold fluid module according to an embodiment of the present invention is advantageous in improving the performance of a heat pump by adopting a structure capable of blocking heat conduction between a high-temperature fluid and a low-temperature fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a diagram showing the front of a manifold fluid module according to an embodiment of the present invention;

[0033] Figure 2 is a diagram showing the rear portion of a main board of a manifold fluid module according to an embodiment of the present invention;

[0034] Figure 3 is a diagram illustrating discharge of refrigerant through a reservoir port in a manifold fluid module according to an embodiment of the present invention;

[0035] Figure 4 is shown with Figure 2 A diagram of a base plate combined with a main board shown;

[0036] Figure 5 is a graph showing the amount of heat transfer before a cutting structure is applied to a manifold fluid module according to an embodiment of the present invention; and

[0037] Figure 6 is a graph showing the amount of heat transfer after applying a cutting structure to a manifold fluid module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0038] Although the present invention allows various modifications, for the sake of clarity, the following detailed description and the accompanying drawings focus on preferred embodiments. However, such embodiments are not intended to limit the present invention, and it should be understood that the embodiments are included in all modifications, equivalents and substitutes within the spirit and scope of the present invention. Detailed descriptions of known techniques may be omitted to avoid blurring the subject matter of the present invention.

[0039] Terms such as "first", "second", etc. may be used to describe various components, but the components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0040] The terms used in this application are only used to describe specific embodiments and are not intended to limit the scope of the present invention. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In this application, terms such as "including" or "having" indicate the existence of the features, quantities, steps, operations, components or parts listed in the specification, without excluding the existence or possibility of one or more other features, quantities, steps, operations, components or parts or their combination.

[0041] Throughout the specification, the term “connected” not only means direct connection between two or more components but also includes indirect connection via intermediate components, electrical connection, and the case where components are referred to by different names based on their positions or functions but are considered as a whole.

[0042] Hereinafter, a manifold fluid module according to an embodiment of the present invention is described with reference to the accompanying drawings, wherein the same or corresponding components are assigned the same reference numerals and repeated descriptions are omitted.

[0043] Figure 1 is a diagram showing the front of a manifold fluid module according to an embodiment of the present invention, Figure 2 is a diagram showing the rear portion of a main board of a manifold fluid module according to an embodiment of the present invention, Figure 3 is a diagram illustrating discharge of refrigerant through a reservoir port in a manifold fluid module according to an embodiment of the present invention, and Figure 4 is shown with Figure 2 A diagram showing the motherboard combined with the base plate.

[0044] As shown in the figure, the manifold fluid module according to an embodiment of the present invention includes: manifold plates 1 and 100, which have a plurality of fluid channels formed inside, and fluids of different temperatures flow through the plurality of fluid channels; heat transfer barriers 90 and 92, which are formed between the high-temperature fluid channel and the low-temperature fluid channel to prevent heat from being transferred from the high-temperature fluid channel to the low-temperature fluid channel; and a connecting member 130, which connects the high-temperature fluid channel and the low-temperature fluid channel.

[0045] The manifold plates 1 and 100 include an assembly consisting of a main plate 1 and a bottom plate 100, and can be manufactured using methods such as brazing, structural adhesives, and gaskets. The material used for the manifold plates 1 and 100 can vary depending on the application and function, such as aluminum, thermoplastic materials, or stainless steel selected according to specific needs.

[0046] The main board 1 is generally formed with a fluid channel recessed in its interior and has a plate shape of a predetermined thickness. The main board 1 can be modularized by combining the first heat exchanger 20, the second heat exchanger 60, the expansion valves 30 and 70, and the reversing valves 40 and 50 of the heat pump system, thereby reducing the number of manufacturing steps and assembly line steps of the vehicle. In addition, the main board 1 can reduce costs and improve workability by performing the functions of pipes, accessories, and housings at the same time. That is, in a thermal management system consisting of a compressor, a plurality of heat exchangers, a plurality of valves, and an expansion valve, the manifold plates 1 and 100 can accommodate at least one heat exchanger 20 and 60, at least one reversing valve 40 and 50, and at least one expansion valve 30 and 70.

[0047] Reference Figure 2 The fluid inlet port 6 is provided on the back of the main board 1, into which the high-temperature and high-pressure gaseous fluid discharged from the compressor or the internal condenser is introduced. A fluid channel may be formed on the back of the main board 1 to guide the movement of the fluid for heat exchange, expansion, inflow and discharge.

[0048] In addition, various fluid ports for inflow and discharge of fluids may also be provided on the back side of the main board 1. In this embodiment, an external heat exchanger discharge port 8 through which a first fluid is discharged to an external heat exchanger (air-cooled condenser) and an external heat exchanger inlet port 10 are provided, and a first fluid is introduced from the external heat exchanger through the external heat exchanger discharge port 8. In addition, an evaporator discharge port 12 through which the first fluid is discharged to an evaporator (not shown) and an evaporator inlet port 14 through which the first fluid is introduced from the evaporator are provided. The arrangement of the evaporator inlet port 14 will be described later. In addition, there is a reservoir port 18 through which the first fluid discharged from the second heat exchanger 60 is guided to a reservoir (not shown).

[0049] Return to reference Figure 1 The manifold plates 1 and 100 integrate the first heat exchanger 20 and the second heat exchanger 60 into a heat exchanging device. The first heat exchanger 20 and the second heat exchanger 60 allow the first fluid and the second fluid to pass therethrough to exchange heat therebetween.

[0050] In the present embodiment, the first heat exchanger 20 may be a water-cooled condenser, and the second heat exchanger 60 may be a chiller. The water-cooled condenser is used to exchange heat between a high-temperature and high-pressure gaseous fluid (refrigerant) discharged from a compressor or an internal condenser and an external heat source, thereby condensing the fluid into a high-pressure liquid. The chiller is a device for heat exchange between a low-temperature and low-pressure fluid supplied thereto and a fluid (coolant) circulating in a coolant circulation line (not shown), and the cooled coolant produced by the heat exchange in the chiller circulates through the coolant circulation line and is then used to exchange heat with the battery.

[0051] Although various fluids such as a refrigerant and a coolant may be used as the first fluid and the second fluid, this embodiment employs a refrigerant as the first fluid and employs a coolant as the second fluid.

[0052] The first heat exchanger 20 is equipped with first fluid ports for inlet and outlet of the first fluid. The first fluid ports include a first inlet port 21 and a first outlet port 22 respectively provided at the top and bottom of the first heat exchanger 20. The first inlet port 21 serves as an entry point for the first fluid to pass through the first expansion valve 30, and the first outlet port 22 serves as an exit point for the first fluid after heat exchange in the first heat exchanger 20. The first inlet port 21 and the first outlet port 22 may be formed at the top and bottom of the first heat exchanger 20 in the form of holes.

[0053] In this case, in consideration of thermal interference, the first inlet port 21 may be formed on a side close to the first expansion valve 30, and the first outlet port 22 may be formed on an opposite side away from the first expansion valve 30. In more detail, the first inlet port 21 may be positioned closer to the first expansion valve 30 relative to the first outlet port 22. That is, the distance from the first expansion valve 30 to the first inlet port 21 may be shorter than the distance from the first expansion valve 30 to the first outlet port 22.

[0054] The first heat exchanger 20 is also equipped with a second fluid port for the inlet and outlet of the second fluid. The second fluid port includes a second inlet port 23 and a second outlet port 24 respectively arranged at the bottom and the top of the first heat exchanger 20. The second inlet port 23 serves as an entry point for the second fluid, while the second outlet port 24 serves as an exit point for the second fluid after heat exchange with the first fluid. Compared with the first fluid, the second fluid flows in the opposite direction (bottom to top) while undergoing heat exchange with the first fluid.

[0055] As described above, the separation between the first fluid port and the second fluid port can improve the assembly efficiency of the first fluid conduit and the second fluid conduit.

[0056] The first expansion valve 30 regulates the expansion of the refrigerant entering the first heat exchanger 20. The first expansion valve 30 may be positioned at the top of the first heat exchanger 20, and may control the expansion or passage of the first fluid entering through the fluid inlet port 6. The first fluid entering through the first expansion valve 30 may pass through the first heat exchanger 20, undergo heat exchange, or continue to move to an external heat exchanger.

[0057] The first fluid discharged through the first outlet port 22 of the first heat exchanger 20 flows into the first reversing valve 40. The first reversing valve 40 controls the direction of the first fluid discharged from the first heat exchanger 20. In the cooling mode, the first reversing valve 40 allows the first fluid to be discharged to the external heat exchanger (air-cooled condenser) through the external heat exchanger discharge port 8, and in the heat pump mode, the first reversing valve 40 redirects the first fluid to the reservoir port 18, thereby allowing the first fluid to be discharged to the reservoir. The first fluid flows into the low-temperature fluid channel 84 through the first fluid inlet 42 formed in the manifold plates 1 and 100.

[0058] The first fluid entering through the first expansion valve 30 may move to the evaporator after passing through the second switching valve 50 in the dehumidification mode.

[0059] The second heat exchanger 60 is supplied with a low-temperature, low-pressure fluid for heat exchange with the coolant circulating in the coolant circulation line (not shown). The cooled coolant that has undergone heat exchange in the second heat exchanger 60 can circulate through the coolant circulation line to exchange heat with the battery. The first fluid flows into the second expansion valve 70 after undergoing heat exchange with the external heat exchanger, and flows into the second heat exchanger 60 after expansion in the second expansion valve 70. The first fluid passes through the bottom discharge after undergoing heat exchange in the second heat exchanger 60 and flows into the reservoir (not shown).

[0060] To facilitate this process, the second heat exchanger 60 is equipped with first fluid ports for inlet and outlet of the first fluid. The first fluid ports include a first inlet port 61 and a first outlet port 62, which are respectively provided at the top and bottom of the second heat exchanger 60. The first inlet port 61 serves as an entry point for the first fluid, and the first outlet port 62 serves as an exit point for the first fluid after heat exchange in the second heat exchanger 60. The first inlet port 61 and the first outlet port 62 may be formed at the top and bottom of the second heat exchanger 60 in the form of holes.

[0061] In this case, considering thermal interference, the first inlet port 61 of the second heat exchanger 60 may be formed on a side close to the second expansion valve 70, and the first outlet port 62 may be formed on an opposite side away from the second expansion valve 70. In more detail, the first inlet port 61 may be located closer to the second expansion valve 70 relative to the first outlet port 62. That is, the distance from the second expansion valve 70 to the first inlet port 61 may be shorter than the distance from the second expansion valve 70 to the first outlet port 62.

[0062] The second heat exchanger 60 is also equipped with a second fluid port for the inlet and outlet of the second fluid. The second fluid port includes a second inlet port 63 and a second outlet port 64 respectively arranged at the bottom and the top of the second heat exchanger 60. The second inlet port 63 serves as an entry point for the second fluid, while the second outlet port 64 serves as an exit point for the second fluid after heat exchange with the first fluid. Compared with the first fluid, the second fluid flows in the opposite direction (bottom to top) while undergoing heat exchange with the first fluid.

[0063] Return to reference Figure 1 In this embodiment, the first expansion valve 30, the second reversing valve 50, and the second expansion valve 70 may be arranged on the upper portion of the manifold plates 1 and 100, the first heat exchanger 20 may be arranged on one side of the lower portion of the manifold plates 1 and 100, and the second heat exchanger 60 and the first reversing valve 40 may be arranged on the other side of the lower portion of the manifold plates 1 and 100. Here, the first reversing valve 40 may be positioned below the second heat exchanger 60, and the second reversing valve 50 may be placed above the second heat exchanger 60.

[0064] That is, arranging the above-described components on manifold plates 1 and 100 allows for optimal placement of components in a minimum space, thereby maximizing space efficiency, and the overall top-to-bottom formation of fluid flow also optimizes fluid flow.

[0065] In particular, the first heat exchanger 20 may be vertically arranged on one side of the lower portion of the manifold plates 1 and 100, and the second heat exchanger 60 may be horizontally arranged on the other side of the lower portion of the manifold plates 1 and 100, thereby optimizing the fluid module packaging. That is, the second heat exchanger 60 is arranged laterally relative to the first heat exchanger 20, thereby improving space efficiency. In addition, the first expansion valve 30 is positioned above the first heat exchanger 20, and the second expansion valve 70 is positioned above the second heat exchanger 60, thereby allowing the flow of the first fluid to be naturally formed from top to bottom.

[0066] An imaginary reference line L on the manifold plates 1 and 100 facilitates the arrangement of the first heat exchanger 20, the first expansion valve 30, the first reversing valve 40 and the second reversing valve 50 on one side, while the second heat exchanger 60 and the second expansion valve 70 may be placed on the other side.

[0067] In more detail, the imaginary reference line L divides the manifold plate into a high temperature zone for the high temperature first fluid to flow and a low temperature zone for the low temperature first fluid during the cooling mode. In the high temperature zone, a high temperature fluid channel 82 through which the high temperature first fluid flows is formed, and in the low temperature zone, a low temperature fluid channel 84 through which the low temperature first fluid flows is formed. Components for moving the high temperature first fluid can be arranged in the high temperature zone, and components for moving the low temperature first fluid can be arranged in the low temperature zone. This configuration can minimize thermal interference between the first fluid under high temperature conditions and low temperature conditions, and improve the performance of the heat pump system. In the accompanying drawings, the high temperature zone can include a left section and a bottom section, and the low temperature zone can include a right section excluding the lower right portion.

[0068] Reference Figures 2 to 4 The main board 1 may include a first main board 2 through which the high-temperature first fluid passing through the first heat exchanger 20 flows, and a second main board 4 through which the low-temperature first fluid passing through the second heat exchanger 60 flows. Here, the first main board 2 and the second main board 4 may be physically separated by cutting.

[0069] Since the first main board 2 and the second main board 4 are separated by the cutting structure, the direct heat transfer path between the high temperature area and the low temperature area is blocked, thereby improving the performance of the heat pump.

[0070] The cutting structure between the first main board 2 and the second main board 4 can be implemented in various ways. As shown in the figure, heat transfer barriers 90 and 92 are formed between the first main board 2 and the second main board 4. These heat transfer barriers 90 and 92 can be formed in two parts to effectively block the heat transfer between the high temperature area and the low temperature area.

[0071] In the case where the second heat exchanger 60 is arranged on the manifold plates 1 and 100, the opening 80 may be formed to be open frontward and rearward over a considerable area. The opening 80 is formed to prevent interference with the second inlet port 63 and the second outlet port 64 of the second heat exchanger 60 and to maximize separation between the high temperature zone and the low temperature zone in the manifold plates 1 and 100.

[0072] The heat transfer barriers 90 and 92 may be formed above and below the opening 80, respectively, wherein the first heat transfer barrier 90 is formed substantially above the opening 80 in the vertical direction, and the second heat transfer barrier 92 is formed substantially on one side below the opening 80 in the horizontal direction. Of course, the positions of the heat transfer barriers 90 and 92 are not limited to those shown in the drawings, and may be placed at any position capable of separating the high temperature zone and the low temperature zone.

[0073] That is, since the heat transfer barriers 90 and 92 are formed above and below the opening 80 located in the central portion of the manifold plates 1 and 100 , a high temperature area on the left and a low temperature area on the right can be separated.

[0074] Meanwhile, the heat transfer barriers 90 and 92 may be formed with respect to the positions of the components arranged on the manifold plates 1 and 100. The first heat transfer barrier 90 may be formed to be cut off between the second expansion valve 70 and the first reversing valve 40, and the second heat transfer barrier 92 may be formed to be cut off between the second heat exchanger 60 and the first reversing valve 40. This ensures that the heat transfer barriers 90 and 92 block the heat transfer path by cutting off between the components through which the high-temperature first fluid and the low-temperature first fluid flow.

[0075] In addition, in order to minimize the heat transfer path between the high temperature zone and the low temperature zone, the evaporator inlet port 14 can be arranged as follows. The evaporator inlet port 14 is positioned on the low temperature fluid channel 84, allowing the low temperature first fluid entering through the evaporator inlet port 14 to move downward and pass through the reservoir port 18 to be discharged to the outside. Here, as the length of the flow path for the first fluid increases, the possibility of heat transfer from the high temperature first fluid is greater. Therefore, in this embodiment, the evaporator inlet port 14 is positioned as close as possible to the reservoir port 18 to minimize the flow path of the low temperature first fluid.

[0076] The low temperature fluid passage 84 is connected to a plurality of fluid inlets, which may include the first fluid inlet 42, the first outlet port 62 of the second heat exchanger 60, and the evaporator inlet port 14. Among them, the evaporator inlet port 14 is connected to the outlet of the evaporator, allowing the first fluid that has undergone heat exchange in the evaporator to flow in.

[0077] The evaporator inlet port 14 may be positioned on the low-temperature first fluid flowing second main plate 4. The evaporator inlet port 14 may be positioned adjacent to the first inlet port 61 of the second heat exchanger 60, and more specifically, between the first inlet port 61 and the first outlet port 62 of the second heat exchanger 60. That is, by being positioned close to the second heat exchanger 60, the first fluid entering the evaporator inlet port 14 may minimize heat transfer at a location where the low-temperature first fluid undergoes heat exchange.

[0078] The distance (D1) between the evaporator inlet port 14 and the reservoir port 18 may be equal to or shorter than the distance (D2) between the first outlet port 62 of the second heat exchanger 60 and the reservoir port 18. This arrangement is intended to minimize heat transfer from the first fluid discharged from the second heat exchanger 60 to the first fluid entering the evaporator inlet port 14.

[0079] refer to Figure 4, the bottom plate 100 is attached to one side, particularly the rear side, of the main board 1 to cover the fluid channel. The bottom plate 100 may include a first bottom plate 110 coupled to cover at least one side of the first main board 2 and a second bottom plate 120 coupled to cover at least one side of the second main board 4. As shown in the figure, the first bottom plate 110 and the second bottom plate 120 may be coupled to cover most of one side of the first main board 2 and the second main board 4.

[0080] In this case, one side of the first bottom plate 110 and the second bottom plate 120 may be connected by a connecting member 130. Since the main board 1 is separated by the heat transfer barriers 90 and 92, the bottom plate 100 attached to the main board 1 may also be separated, which in turn blocks the flow path of the first fluid from the first reversing valve 40 to the reservoir port 18 during the heat pump mode. Therefore, in this embodiment, the connecting member 130 is provided to connect the first bottom plate 110 and the second bottom plate 120 to ensure the flow path of the first fluid.

[0081] The connection member 130 allows the first fluid to flow during a heating mode of the thermal management system when the temperature difference between the high temperature fluid path and the low temperature fluid path is small, but prevents the first fluid from flowing during a cooling mode when the temperature difference is large.

[0082] The connection member 130 is formed in a tubular shape as shown to ensure a flow path for the first fluid inside. Alternatively, the connection member 130 may connect one side of the first bottom plate 110 and the second bottom plate 120 in a plate shape while forming a flow path inside.

[0083] The connection member 130 not only serves as a flow path but also enhances the durability of the manifold plates 1 and 100. In more detail, since the manifold plates 1 and 100 are divided into two parts in this embodiment, the connection structure is maintained only by the components coupled to the manifold plates 1 and 100, which may make the manifold plates 1 and 100 less rigid and vulnerable to external impact. Therefore, the connection member 130 connects the two separated parts of the manifold plates 1 and 100, thereby allowing a stronger connection structure.

[0084] Although the manifold plates 1 and 100 are shown as being formed by combining the main plate 1 and the bottom plate 100, and the connection member 130 is provided in the bottom plate 100, this is not limitative. For example, the connection member 130 may be provided in the main plate 1, or the manifold plates 1 and 100 may be made of a single plate in which the connection member 130 is included.

[0085] Figure 5 is a graph showing the amount of heat transfer before a cutting structure is applied to a manifold fluid module according to an embodiment of the present invention, and Figure 6is a graph showing the amount of heat transfer after applying a cutting structure to a manifold fluid module according to an embodiment of the present invention.

[0086] Reference Figure 5 and Figure 6 Before the cutting structure is applied to the manifold fluid module, the temperature of the section where the low-temperature first fluid flows in the manifold plates 1 and 100 is relatively high.

[0087] However, after applying the cutting structure to the manifold fluid module, it can be confirmed that the temperature of the section where the low-temperature first fluid flows in the manifold plates 1 and 100 is relatively low. This is because the cutting structure effectively blocks the heat transfer from the high-temperature first fluid to the low-temperature first fluid. In addition, minimizing the flow path of the low-temperature first fluid entering the evaporator inlet port 14 can further reduce heat transfer.

[0088] While the foregoing description focuses on specific embodiments of the present invention, it should be understood that various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

[0089] [Explanation of Reference Numerals]

[0090] 1: Main board, 2: First main board

[0091] 4: Second main board, 6: Fluid inlet

[0092] 8: External heat exchanger discharge port, 10: External heat exchanger inlet port

[0093] 12: Evaporator discharge port, 14: Evaporator inlet port

[0094] 18: Liquid reservoir port, 20: First heat exchanger

[0095] 21: First inlet port, 22: First outlet port

[0096] 23: Second inlet port, 24: Second outlet port

[0097] 30: First expansion valve, 40: First reversing valve

[0098] 50: second reversing valve, 60: second heat exchanger

[0099] 61: First inlet port, 62: First outlet port

[0100] 63: Second inlet port, 64: Second outlet port

[0101] 70: second expansion valve, 80: opening

[0102] 82: High temperature fluid channel, 84: Low temperature fluid channel

[0103] 90: first heat transfer barrier, 92: second heat transfer barrier

[0104] 100: bottom plate, 110: first bottom plate

[0105] 120: second bottom plate, 130: connecting member

Claims

1. A manifold fluid module, the manifold fluid module integrating at least one heat exchanger, at least one valve and at least one expansion valve into a single unit for a thermal management system including a compressor, a plurality of heat exchangers, a plurality of valves and an expansion valve, the manifold fluid module comprising: a manifold plate including a plurality of fluid channels formed therein, Wherein, the fluid channel includes a low-temperature fluid channel, through which the low-temperature fluid for heat exchange flows, and a fluid outlet and a plurality of fluid inlets are connected through the low-temperature fluid channel, wherein the fluid inlet includes an evaporator inlet port connected to the outlet of the evaporator, and the evaporator inlet port is arranged on the low-temperature fluid channel.

2. The manifold fluid module according to claim 1, wherein: The at least one heat exchanger comprises: a first heat exchanger coupled to the manifold plate, the first heat exchanger exchanging heat between a first fluid and a second fluid; and A second heat exchanger is coupled to the manifold plate, the second heat exchanger exchanging heat between the first fluid discharged from the first heat exchanger and the second fluid.

3. The manifold fluid module according to claim 2, wherein: The evaporator inlet port is disposed adjacent to a first inlet port through which the first fluid enters the second heat exchanger.

4. The manifold fluid module according to claim 3, wherein: The first fluid entering through the first inlet port is discharged through a first outlet port, and the evaporator inlet port is disposed between the first inlet port and the first outlet port.

5. The manifold fluid module of claim 4, wherein: The fluid outlet is a reservoir port through which the first fluid is discharged to a reservoir, and the evaporator inlet port is disposed adjacent to the reservoir port.

6. The manifold fluid module of claim 5, wherein: A distance between the evaporator inlet port and the reservoir port is equal to or shorter than a distance between the first outlet port and the reservoir port.

7. The manifold fluid module of claim 2, further comprising: a heat transfer barrier formed between a high temperature fluid passage and the low temperature fluid passage to prevent heat transfer from the high temperature fluid passage to the low temperature fluid passage; as well as A connecting member connects the high temperature fluid channel and the low temperature fluid channel.

8. The manifold fluid module of claim 7, wherein: The connection member connects the manifold plates separated by the heat transfer barrier, thereby allowing fluid to flow through the connection member.

9. The manifold fluid module of claim 8, wherein: The connection member allows fluid to flow during a heating mode of the thermal management system and no fluid to flow during a cooling mode.

10. The manifold fluid module of claim 7, wherein: The manifold plate comprises: a main plate including a fluid channel formed therein; and A bottom plate is coupled to one side of the main plate to cover the fluid channel.

11. The manifold fluid module of claim 10, wherein: The main board comprises: a first main plate through which the high-temperature first fluid flows after passing through the first heat exchanger; and a second main board, through which the low-temperature first fluid flows after passing through the second heat exchanger, Wherein, the heat transfer barrier is formed between the first main board and the second main board.

12. The manifold fluid module of claim 11, wherein: The bottom plate comprises: a first bottom plate, the first bottom plate being coupled to cover at least one side of the first main board; and a second bottom plate, the second bottom plate being connected to cover at least one side of the second main board, Wherein, the heat transfer barrier is formed between the first bottom plate and the second bottom plate.

13. The manifold fluid module of claim 12, wherein: The first bottom plate and the second bottom plate are connected at one side by the connection member.

14. The manifold fluid module of claim 13, wherein: The connecting member is formed in a tubular shape.

15. The manifold fluid module of claim 13, further comprising: a first expansion valve configured to expand a first fluid entering the first heat exchanger; as well as a second expansion valve configured to expand the first fluid entering the second heat exchanger, The first expansion valve is arranged above the first heat exchanger, and the second expansion valve is arranged above the second heat exchanger, thereby allowing the first fluid entering the first heat exchanger and the second heat exchanger to flow from top to bottom.

16. The manifold fluid module of claim 15, further comprising a first reversing valve and a second reversing valve, wherein the first reversing valve and the second reversing valve are configured to control a direction of the first fluid discharged from the first heat exchanger, in, The first reversing valve is arranged below the second heat exchanger, and the second reversing valve is arranged above the second heat exchanger.

17. The manifold fluid module of claim 16, wherein: The second main plate includes a reservoir port through which the first fluid is discharged to a reservoir, and the connecting member is configured to provide communication between the second reversing valve and the reservoir port.

18. The manifold fluid module of claim 16, wherein: The connecting member is arranged between the second reversing valve and the second heat exchanger.

19. A manifold fluid module according to any one of claims 7 to 18, wherein: The manifold plate includes an opening formed in a portion where the second heat exchanger is located, and the heat transfer barrier includes a first heat transfer barrier and a second heat transfer barrier formed above and below the opening, respectively.

20. The manifold fluid module of claim 16, wherein: The manifold plate includes an opening formed in a portion where the second heat exchanger is located, and the heat transfer barrier includes a first heat transfer barrier and a second heat transfer barrier formed above and below the opening, respectively, The first heat transfer barrier is configured to cut off between the second expansion valve and the first reversing valve, and the second heat transfer barrier is configured to cut off between the second heat exchanger and the first reversing valve.

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