Semiconductor laser COS automatic detection cutting device and operation method

Abstract

The invention provides a semiconductor laser COS automatic detection and cutting device, and relates to the technical field of semiconductor lasers. The semiconductor laser COS automatic detection and cutting device comprises a main frame body and a cross-shaped sliding table, and a feeding table is arranged on the cross-shaped sliding table. An identifying and positioning unit, a pricking and detecting unit and a cutting unit are arranged on the main frame body and located above the cross-shaped sliding table, and a detecting unit is arranged on the main frame body and located on one side of the pricking and detecting unit. The identifying and positioning unit comprises a first industrial camera. The pricking and measuring unit comprises a first sliding frame in sliding connection with the main frame body and a first driving part used for driving the first sliding frame to slide up and down, and a first pricking and measuring needle and a second pricking and measuring needle are arranged on the bottom face of the first sliding frame. The cutting unit comprises a second sliding frame slidably connected with the main frame body and a second driving part used for driving the second sliding frame to slide up and down, and a cutting blade is arranged on the bottom face of the second sliding frame. According to the semiconductor laser COS automatic detection cutting device, the consistency of pricking detection cutting can be improved, pollution is reduced, and the working efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor lasers, in particular to a semiconductor laser COS automatic detection and cutting device and an operation method. Background Art

[0002] With the progress of society and science and technology, the status of semiconductor lasers has become more and more prominent and their applications have become more and more extensive. In particular, due to its many advantages such as wide wavelength range, small size, light weight, and long life, it has been widely used in lighting, projection, medical, military, and scientific research. However, the waste heat generated by the tube core when the semiconductor laser is working needs to be discharged in a timely and effective manner, otherwise it will cause the temperature of the laser tube core to be too high, reduce the luminous efficiency of the device and induce the failure of the laser. The currently widely used technical solution is to sinter the semiconductor laser tube core to a heat sink block with strong heat dissipation capacity, and effectively evacuate the heat generated by the tube core when it is working through the heat sink block. The combination of the tube core and the heat sink sintered together is called COS.

[0003] One of the commonly used packaging processes is the indium process. The heat sink block used is generally in the form of a heat sink sheet, which is evaporated with indium, bonded, and alloyed. After completion, the performance of a single COS needs to be tested and separated from the heat sink sheet. Currently, the performance test is mostly to place the heat sink sheet on a sliding platform, manually control the puncture needle to perform the test and determine whether the light spot or wavelength is qualified; the heat sink block separation is to bond the heat sink sheet to a multilayer film and then use scissors to cut it. The above are mainly due to the problems of poor judgment consistency and easy contamination of the tube core caused by manual operation, and the work efficiency is low. Summary of the invention

[0004] In response to the above problems, the present application provides a semiconductor laser COS automatic detection and cutting device that can improve the consistency of piercing and cutting, reduce pollution, and improve work efficiency.

[0005] The technical solution adopted by the present invention to solve the technical problem is:

[0006] A semiconductor laser COS automatic detection and cutting device comprises a main frame and a cross slide arranged on the main frame, wherein the cross slide is provided with a loading platform;

[0007] The main frame is provided with an identification and positioning unit, a piercing and measuring unit and a cutting unit above the cross slide, and the main frame is provided with a detection unit on one side of the piercing and measuring unit;

[0008] The identification and positioning unit includes a first industrial camera;

[0009] The piercing unit comprises a first slide slidably connected to the main frame, a first driving component for driving the first slide to slide up and down is arranged between the first slide and the main frame, a first piercing needle and a second piercing needle are arranged on the bottom surface of the first slide, when the first piercing needle and the second piercing needle of the piercing unit are in contact with the tube core and the heat sink block of the COS respectively, and current is passed through the first piercing needle and the second piercing needle, the detection unit can detect the light emitted by the COS;

[0010] The cutting unit includes a second slide slidably connected to the main frame, a second driving component for driving the second slide to slide up and down is arranged between the second slide and the main frame, and a cutting blade is arranged on the bottom surface of the second slide.

[0011] Furthermore, the detection unit includes a mounting seat, on which an integrating sphere or a light collecting plate is detachably mounted, and a second industrial camera is arranged on the first slide, and the second industrial camera faces one side of the detection unit.

[0012] Furthermore, studs are respectively provided on both sides of the mounting seat, and connecting seat plates are provided at the lower ends of the integrating sphere and the light receiving plate. The connecting seat plates include a seat plate, and vertical plates are respectively provided at both ends of the seat plate. Positioning grooves for accommodating the studs are provided on the vertical plates, and locking nuts are provided on the studs on the outer side of the vertical plates.

[0013] Furthermore, the identification and positioning unit, the piercing and measuring unit and the cutting unit are arranged in a line along one direction, and the arrangement direction of the identification and positioning unit, the piercing and measuring unit and the cutting unit is parallel to a sliding direction of the cross slide.

[0014] Furthermore, the main frame includes a support frame and a support plate arranged on the support frame, the support frame includes two upright frames, the inner side surfaces of the upright frames are provided with a support plate for supporting the support plate, a cross beam is provided between the two upright frames and above the support plate, the cross slide and the detection unit are provided on the support plate, and the identification and positioning unit, the piercing unit and the cutting unit are provided on the cross beam.

[0015] Furthermore, the cross slide includes two first linear modules, the power input shafts of the two first linear modules are connected through a synchronous rotating shaft, the power input shaft of one of the first linear modules is connected to the power output shaft of the first drive motor, a second linear module is arranged between the two first linear modules, the mounting seats at both ends of the second linear module are respectively connected to the sliding tables of the two first linear modules, the power input shaft of the second linear module is connected to the power output shaft of the second drive motor, and the loading table is arranged on the sliding table of the second linear module.

[0016] Furthermore, the loading platform is a hollow structure, and a plurality of adsorption holes connected to the internal space of the loading platform are arranged on the upper side of the loading platform, and the air outlet of the loading platform is connected to the vacuum equipment through a pipeline.

[0017] Furthermore, a turntable is arranged between the loading platform and the cross slide.

[0018] Furthermore, the turntable includes a horizontal plate, a slewing support is arranged on the horizontal plate, the inner ring of the slewing support is connected to the horizontal plate, the outer ring of the slewing support is connected to the loading platform, a slewing motor is arranged on the horizontal plate, and the power output shaft of the slewing motor is connected to the outer ring of the slewing support through a third transmission mechanism.

[0019] An operating method of a semiconductor laser COS automatic detection and cutting device comprises the following steps:

[0020] S1. Bond the heat sink to the UV film, expand the blue film using a collapse ring, and then bond the UV film bonded with the heat sink to the blue film to form a heat sink assembly;

[0021] S2. Place the heat sink assembly on the loading platform and turn on the vacuum device to firmly adsorb it;

[0022] S3, the cross slide drives the loading platform to move to the bottom of the identification and positioning unit, and identifies the positions of the heat sink block, the tube core and the heat sink neck cutting line of the first row COS of the heat sink assembly through the first industrial camera;

[0023] S4, according to the result of recognition in step S3, the cross slide moves to align the heat sink neck cutting line of the first row of COS with the cutting blade of the cutting unit, and the heat sink block and the tube core of the first row of COS are aligned with the first piercing needle and the second piercing needle respectively;

[0024] S5, the cross slide drives the loading platform to move, so that the first COS in the first row moves to the piercing position just below the piercing unit;

[0025] S6, the first driving component drives the first slide to move downward until the first probe and the second probe contact the tube core and the heat sink of the first COS in the first row respectively, and then the set current is passed through the first probe and the second probe to test the parameters of the first COS in the first row. After the test is completed, the first driving component drives the first slide to move upward and reset;

[0026] S7, repeat the operations of steps S5-S6 to test other COSs in the first row in turn;

[0027] S8, the cross slide drives the loading table to move so that the hot sink neck cutting line of the first row of COS is aligned with the cutting blade;

[0028] S9, the second driving component drives the second slide to move downward to cut the first row of COS. After the cutting is completed, the second driving component drives the second slide to move upward and reset;

[0029] S10, repeat the operations of steps S3-S9 to test and cut the COS of other rows in turn.

[0030] The beneficial effects of the present invention are:

[0031] The embodiment of the present application provides a semiconductor laser COS automatic detection and cutting device and operation method, which can replace traditional manual operation, and can complete the automatic detection of COS wavelength, light spot, etc. and the automatic cutting of heat sink at one time. Compared with the traditional manual operation method, it can effectively improve the accuracy of detection and the consistency of cutting. At the same time, it can also avoid human contamination in the cutting process, and effectively improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of the three-dimensional structure of a semiconductor laser COS automatic detection and cutting device provided in an embodiment of the present application Figure 1 ;

[0033] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of part A;

[0034] Figure 3 for Figure 1 A schematic diagram of the enlarged structure of part B;

[0035] Figure 4 A schematic diagram of the three-dimensional structure of a semiconductor laser COS automatic detection and cutting device provided in an embodiment of the present application Figure 2 ;

[0036] Figure 5 A top view of a semiconductor laser COS automatic detection and cutting device provided in an embodiment of the present application;

[0037] Figure 6 A side view of a semiconductor laser COS automatic detection and cutting device provided in an embodiment of the present application;

[0038] Figure 7 is a schematic diagram of the three-dimensional structure of the support frame;

[0039] Figure 8 This is the exploded view of the turntable;

[0040] Fig. 9 This is a cross-sectional view of the loading platform;

[0041] Fig.10 An exploded view of a heat sink assembly;

[0042] Fig.11 for Fig.10 A schematic diagram of the enlarged structure of the middle C part;

[0043] Fig.12 Schematic diagram of the three-dimensional structure of the piercing unit;

[0044] Fig.13 This is a schematic diagram of the piercing test operation;

[0045] Fig.14 is a schematic diagram of the three-dimensional structure of the cutting unit;

[0046] Fig.15 It is a schematic diagram of cutting operation;

[0047] Fig.16 This is a schematic diagram of the installation structure of the integrating sphere;

[0048] Fig.17 Exploded view of the mounting structure for the integrating sphere;

[0049] Fig.18 Schematic diagram of the installation structure of the light receiving board.

[0050] In the figure: 11, support frame; 111, stand; 1111, middle vertical beam; 1112, side vertical beam; 1113, connecting beam; 1114, support plate; 1115, first rib plate; 112, cross beam; 12, support plate;

[0051] 211, first linear module; 212, synchronous rotating shaft; 213, first driving motor; 221, second linear module; 222, second driving motor;

[0052] 3. Loading platform; 31. Adsorption hole; 32. Air outlet;

[0053] 4. Identification and positioning unit; 41. First industrial camera; 42. Mounting bracket;

[0054] 5. Piercing unit; 511. first upper connecting plate; 512. first lower connecting plate; 513. first guide column; 514. first guide slide; 521. first lead screw; 522. first motor; 523. first screw nut; 524. first motor seat; 531. first mounting plate; 5311. first connecting column; 532. first piercing probe; 533. second piercing probe; 54. second industrial camera;

[0055] 6. Cutting unit; 611. Second upper connecting plate; 612. Second lower connecting plate; 613. Second guide column; 614. Second guide slide; 621. Second lead screw; 622. Second motor; 623. Second nut; 624. Second motor seat; 631. Second mounting plate; 6311. Second connecting column; 632. Cutting blade;

[0056] 7. Detection unit; 71. Mounting seat; 711. Two legs; 712. Stud; 7121. Locking nut; 721. Integrating sphere; 722. Light collecting plate; 723. Connecting seat plate; 7231. Positioning groove;

[0057] 8. Rotary table; 81. Horizontal plate; 82. Rotary support; 83. Rotary motor; 831. Driving gear;

[0058] 9. Heat sink assembly; 91. Heat sink; 9111. Outer frame; 9112. Cross frame; 912. COS; 9121. Tube core; 9122. Heat sink block; 913. Heat sink neck; 914. Cutting line; 92. UV film; 93. Blue film; 94. Collapse circle. DETAILED DESCRIPTION

[0059] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described in detail below in conjunction with the drawings in the embodiments of the present application, and the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by those skilled in the art without creative work on the basis of the embodiments of the present application shall belong to the protection scope of the present application.

[0060] For the convenience of description, the coordinate system is defined as Figure 1 As shown, the left-right direction is the horizontal direction, the front-back direction is the longitudinal direction, and the up-down direction is the vertical direction.

[0061] like Figure 1 , Figure 4 , Figure 5 and Figure 6As shown, a semiconductor laser COS automatic detection and cutting device includes a main frame and a cross slide arranged on the main frame, and a loading platform 3 is arranged on the cross slide. The loading platform 3 can move in the working plane driven by the cross slide. An identification and positioning unit 4, a piercing unit 5 and a cutting unit 6 are arranged on the main frame above the cross slide, and a detection unit 7 cooperating with the piercing unit 5 is arranged on one side of the piercing unit 5 on the main frame. When the first piercing needle 532 and the second piercing needle 533 of the piercing unit 5 are in contact with the tube core 9121 and the heat sink block 9122 of COS912 respectively, the detection unit 7 can detect the light emitted by COS912.

[0062] Furthermore, in order to simplify the control program and improve the positioning accuracy, Figure 1 As shown, the identification and positioning unit 4, the piercing and measuring unit 5 and the cutting unit 6 are arranged in a straight line along one direction, and the arrangement direction of the identification and positioning unit 4, the piercing and measuring unit 5 and the cutting unit 6 is parallel to a sliding direction of the cross slide. Figure 1 As shown in the coordinate system, the cross slide includes two sliding directions, one sliding direction is longitudinal and the other sliding direction is transverse. The identification and positioning unit 4, the piercing unit 5 and the cutting unit 6 are arranged in a line along the transverse direction.

[0063] As a specific implementation method, Figure 1 and Figure 4 As shown, the main frame described in this embodiment includes a support frame 11 and a support plate 12 arranged on the support frame 11. The support frame 11 includes two vertical frames 111 with the same structure and symmetrical arrangement. At least two support plates 1114 for supporting the support plate 12 are arranged on the inner side surface of the vertical frame 111 (the side opposite to the two vertical frames 111 is the inner side). The support plate 12 is fixedly connected to the support plate 1114 by screws, and a first rib plate 1115 is arranged between the support plate 1114 and the vertical frame 111. A crossbeam 112 is arranged above the support plate 12 between the two vertical frames 111, one end of the crossbeam 112 is fixedly connected to one side of the vertical frame 111 by welding, and the other end of the crossbeam 112 is fixedly connected to the other side of the vertical frame 111 by welding. The cross slide and the detection unit 7 are arranged on the support plate 12, and the identification and positioning unit 4, the piercing unit 5 and the cutting unit 6 are arranged on the crossbeam 112.

[0064] As a specific implementation method, Figure 7As shown, the stand 111 described in this embodiment includes a middle vertical beam 1111 and side vertical beams 1112 located at the front and rear sides of the middle vertical beam 1111, and the two side vertical beams 1112 are connected to the middle vertical beam 1111 through connecting beams 1113. One end of the connecting beam 1113 is fixedly connected to the side vertical beam 1112 by welding, and the other end of the connecting beam 1113 is fixedly connected to the middle vertical beam 1111 by welding. Support plates 1114 are provided on the middle vertical beam 1111 and the side vertical beams 1112, a first anchor plate is provided at the lower end of the middle vertical beam 1111, a second rib plate is provided between the middle vertical beam 1111 and the first anchor plate, a second anchor plate is provided at the lower end of the side vertical beam 1112, and a third rib plate is provided between the side vertical beam 1112 and the second anchor plate. The cross beam 112 is located between the two middle vertical beams 1111, one end of the cross beam 112 is fixedly connected to the middle vertical beam 1111 of one side frame 111 by welding, and the other end of the cross beam 112 is fixedly connected to the middle vertical beam 1111 of the other side frame 111 by welding. Preferably, the upper end surface of the middle vertical beam 1111 is fixedly connected to the lower side surface of the cross beam 112 by welding, and the end surface of the cross beam 112 is fixedly connected to the outer side surface of the middle vertical beam 1111 (the side opposite to the two frames 111 is the inner side).

[0065] As a specific implementation method, Figure 1 and Figure 5As shown, the cross slide described in this embodiment includes two first linear modules 211 extending in the longitudinal direction, and the mounting seat 71 of the first linear module 211 is fixedly connected to the support plate 12 by screws. A synchronous shaft 212 is arranged between the two first linear modules 211, and the two ends of the synchronous shaft 212 are respectively connected to the power input shaft of the first linear module 211 through a coupling, and the power input shaft of one of the first linear modules 211 is directly or through a first transmission mechanism connected to the power output shaft of the first drive motor 213. Exemplarily, the power input shaft of one of the first linear modules 211 is connected to the power output shaft of the first drive motor 213 through a first transmission mechanism, and the first transmission mechanism adopts a synchronous belt drive. A second linear module 221 extending in the transverse direction is arranged above the two first linear modules 211, and the mounting seats 71 at the two ends of the second linear module 221 are respectively fixedly connected to the sliding tables of the two first linear modules 211 by screws. The power input shaft of the second linear module 221 is directly or through a second transmission mechanism connected to the power output shaft of the second drive motor 222. Exemplarily, the power input shaft of the second linear module 221 is connected to the power output shaft of the second drive motor 222 through a second transmission mechanism, and the second transmission mechanism adopts synchronous belt transmission.

[0066] like Figure 4 and Figure 6 As shown, the identification and positioning unit 4 includes a first industrial camera 41 , and the first industrial camera 41 is fixedly disposed on the beam 112 in a detachable manner.

[0067] As a specific implementation, the first industrial camera 41 described in this embodiment is fixedly arranged on the crossbeam 112 through a mounting bracket 42. The mounting bracket 42 includes a web, and the two ends of the web are respectively provided with wing plates extending upward perpendicular to the web, and the web and the wing plates together form a U-shaped structure with an opening facing upward, and the crossbeam 112 is located between the two wing plates and fixedly connected to the two wing plates through a bolt assembly. The first industrial camera 41 is fixedly arranged on the lower side of the web by screws.

[0068] like Figure 1 , Figure 2 and Fig.12 As shown, the puncture detection unit 5 includes a first slide slidably connected to the cross beam 112, and a first driving component for driving the first slide to slide up and down relative to the cross beam 112 is arranged between the first slide and the cross beam 112. A first puncture detection needle 532 and a second puncture detection needle 533 extending downward are arranged on the bottom surface of the first slide. Fig.13As shown, when the COS 912 moves to the bottom of the probe unit 5, the first probe needle 532 is located above the tube core 9121, and the second probe needle 533 is located above the heat sink block 9122. When the first slide moves downward under the drive of the first driving component, the first probe needle 532 contacts the tube core 9121, and the second probe needle 533 contacts the heat sink block 9122. Figure 4 As shown, a second industrial camera 54 is disposed on the first slide, and the second industrial camera 54 faces one side of the detection unit 7 .

[0069] As a specific implementation, the first slide described in this embodiment includes a first upper connecting plate 511 and a first lower connecting plate 512 respectively located on the upper and lower sides of the crossbeam 112, and two first guide posts 513 are arranged between the first upper connecting plate 511 and the first lower connecting plate 512. The upper end of the first guide post 513 is fixedly connected to the first upper connecting plate 511 in a detachable manner, and the lower end of the first guide post 513 is fixedly connected to the first lower connecting plate 512 in a detachable manner. A first guide slide 514 matched with the first guide post 513 is arranged on the crossbeam 112. The first driving component includes a first lead screw 521 located between the two first guide posts 513 and a first motor 522 for driving the first lead screw 521 to rotate, and a first nut 523 matched with the first lead screw 521 is fixedly arranged on the crossbeam 112 in a detachable manner. The upper end of the first lead screw 521 is rotatably connected to the first upper connecting plate 511 through a bearing assembly, and the lower end of the first lead screw 521 is rotatably connected to the first lower connecting plate 512 through a bearing assembly. The first motor 522 is fixedly arranged on the first upper connecting plate 511 through a first motor seat 524, and the power output shaft of the first motor 522 is connected to the upper end of the first lead screw 521 through a coupling. The lower side surface of the first lower connecting plate 512 is fixedly arranged on the first mounting plate 531 in a detachable manner, and the first piercing probe 532 and the second piercing probe 533 are fixedly arranged on the lower side surface of the first mounting plate 531.

[0070] As a specific implementation, the first mounting plate 531 described in this embodiment has a square structure, and the four corners of the first mounting plate 531 are respectively provided with first connecting columns 5311 extending upward perpendicular to the first mounting plate 531, and the upper end of the first connecting column 5311 is fixedly connected to the first lower connecting plate 512 in a detachable manner.

[0071] like Figure 4 , Fig.16 , Fig.17 and Fig.18 As shown, the detection unit 7 includes a mounting seat 71 and a detector. The mounting seat 71 is fixedly arranged on the support plate 12, and the detector is fixedly arranged on the mounting seat 71 in a detachable manner. According to the needs of the detection project, the detector can be an integrating sphere 721 or a light receiving plate 722. When it is necessary to detect the wavelength of the light, the integrating sphere 721 is installed on the mounting seat 71. When it is necessary to detect the light spot formed by the light, the light receiving plate 722 is installed on the mounting seat 71, and the light spot formed on the light receiving plate 722 is photographed by the second industrial camera 54 to determine the light spot.

[0072] As a specific implementation, two legs 711 are provided on the lower side of the mounting seat 71 in this embodiment, the upper ends of the legs are fixedly connected to the mounting seat 71 by welding, and the lower ends of the legs are fixedly connected to the support plate 12 by screws. Exemplarily, the legs are made of channel steel, the upper wing plates of the channel steel are fixedly connected to the mounting seat 71 by welding, and the lower wing plates of the channel steel are fixedly connected to the support plate 12 by screws (not shown in the figure). Studs 712 are provided on the left and right sides of the mounting seat 71, and a connecting seat plate 723 is provided on the bottom surface of the detector. The connecting seat plate 723 includes a seat plate, the detector is fixedly arranged on the seat plate, and the left and right ends of the seat plate are respectively provided with vertical plates extending downward perpendicular to the seat plate. The vertical plate is provided with a positioning groove 7231 for accommodating the stud 712, and the opening of the positioning groove 7231 faces downward. The stud 712 is provided with a locking nut 7121 on the outer side of the vertical plate (the inner side is the side opposite to the two vertical plates). By tightening the locking nut 7121, the connecting seat plate 723 can be fixed on the mounting seat 71, thereby realizing the installation and fixation of the detector.

[0073] like Figure 4 , Fig.14 and Fig.15 As shown, the cutting unit 6 includes a second slide slidably connected to the crossbeam 112, and a second driving component for driving the second slide to slide up and down relative to the crossbeam 112 is provided between the second slide and the crossbeam 112. A cutting blade 632 is provided on the bottom surface of the second slide. When the heat sink 91 moves to the right below the cutting unit 6, the second slide moves downward under the drive of the second driving component, and the heat sink neck 913 of a row of COS 912 in the heat sink 91 can be cut by the cutting blade 632.

[0074] As a specific implementation, the second slide described in this embodiment includes a second upper connecting plate 611 and a second lower connecting plate 612 respectively located on the upper and lower sides of the cross beam 112, and two second guide posts 613 are arranged between the second upper connecting plate 611 and the second lower connecting plate 612, and the upper ends of the second guide posts 613 are fixedly connected to the second upper connecting plate 611 in a detachable manner, and the lower ends of the second guide posts 613 are fixedly connected to the second lower connecting plate 612 in a detachable manner. A second guide slide 614 matched with the second guide posts 613 is arranged on the cross beam 112. The second driving component includes a second lead screw 621 located between the two second guide posts 613 and a second motor 622 for driving the second lead screw 621 to rotate, and a second nut 623 matched with the second lead screw 621 is fixedly arranged on the cross beam 112 in a detachable manner. The upper end of the second lead screw 621 is rotatably connected to the second upper connecting plate 611 through a bearing assembly, and the lower end of the second lead screw 621 is rotatably connected to the second lower connecting plate 612 through a bearing assembly. The second motor 622 is fixedly arranged on the second upper connecting plate 611 through a second motor seat 624, and the power output shaft of the second motor 622 is connected to the upper end of the second lead screw 621 through a coupling. The lower side surface of the second lower connecting plate 612 is fixedly arranged on the second mounting plate 631 in a detachable manner, and the cutting blade 632 is fixedly arranged on the lower side surface of the first mounting plate 531.

[0075] As a specific implementation, the second mounting plate 631 described in this embodiment has a square structure, and second connecting columns 6311 extending upward perpendicular to the second mounting plate 631 are respectively provided at the four corners of the second mounting plate 631, and the upper ends of the second connecting columns 6311 are fixedly connected to the second lower connecting plate 612 in a detachable manner.

[0076] Furthermore, if Figure 8 and Fig. 9 As shown, the loading platform 3 is a hollow structure, and a plurality of adsorption holes 31 are provided on the upper side of the loading platform 3, which are connected to the internal space of the loading platform 3. The loading platform 3 is provided with an air outlet 32 ​​connected to the internal space of the loading platform 3, and the air outlet 32 ​​is connected to a vacuum device (not shown in the figure) through a pipeline (not shown in the figure). The internal space of the loading platform 3 is evacuated by the vacuum device, so that the heat sink assembly 9 placed on the loading platform 3 can be adsorbed on the loading platform 3.

[0077] As a specific implementation, in this embodiment, the plurality of adsorption holes 31 are arranged in a matrix.

[0078] like Fig.10 As shown, the heat sink assembly 9 includes a heat sink 91, and the heat sink 91 includes a frame. The frame includes an outer frame 9111 and a cross frame 9112 located inside the outer frame 9111. The cross frame 9112 divides the inner space of the outer frame 9111 into several sub-areas, and each of the sub-areas is provided with a plurality of COS912 arranged in a line, and the heat sink block 9122 of the COS912 is connected to the cross frame 9112 through a heat sink neck 913. A UV film 92 is provided on the lower side of the heat sink 91, and the heat sink 91 is fixedly connected to the UV film 92 by gluing. A blue film 93 is provided on the lower side of the UV film 92, and a collapse ring 94 is provided outside the blue film 93, and the UV film 92 is fixedly connected to the blue film 93 by gluing.

[0079] Furthermore, if Figure 2 As shown, a turntable 8 is provided between the loading platform 3 and the sliding platform of the second linear module 221 of the cross slide.

[0080] like Figure 8 As shown, the turntable 8 includes a horizontal plate 81, and the horizontal plate 81 is fixedly connected to the sliding table of the second linear module 221 in a detachable manner. A slewing support 82 is arranged on the horizontal plate 81, and the inner ring of the slewing support 82 is fixedly connected to the horizontal plate 81 by screws, and the outer ring of the slewing support 82 is fixedly connected to the loading platform 3 by screws. A slewing motor 83 is arranged on the horizontal plate 81, and the power output shaft of the slewing motor 83 is connected to the outer ring of the slewing support 82 through a third transmission mechanism. When the slewing motor 83 drives the outer ring of the slewing support 82 to rotate, the loading platform 3 can rotate together with the outer ring of the slewing support 82.

[0081] As a specific implementation, the third transmission mechanism described in this embodiment adopts gear transmission, a driving gear 831 is provided on the power output shaft of the rotary motor 83, a driven gear meshing with the driving gear 831 is provided on the outer ring of the rotary support 82, or the outer side surface of the outer ring of the rotary support 82 presents a toothed structure meshing with the driving gear 831.

[0082] The angle of the heat sink assembly 9 in the horizontal plane can be adjusted by setting the turntable 8. In this way, when the heat sink assembly 9 is placed in an incorrect position, it can be adjusted by the turntable 8 so that the cross frame 9112 of the frame of the heat sink 91 is parallel to the crossbeam 112.

[0083] An operating method of a semiconductor laser COS automatic detection and cutting device comprises the following steps:

[0084] S1. Bond a heat sink sheet 91 made of alloy to the UV film 92, expand a square piece of blue film 93 using a collapse ring 94, and then bond the UV film 92 bonded with the heat sink sheet 91 to the expanded blue film 93 to form a heat sink assembly 9.

[0085] S2, placing the heat sink assembly 9 on the loading platform 3, and turning on the vacuum equipment to firmly adsorb it.

[0086] S3, the cross slide drives the loading platform 3 to move to the bottom of the identification and positioning unit 4, and uses the first industrial camera 41 to identify the positions of the heat sink block 9122, the tube core 9121 and the cutting line 914 of the heat sink neck 913 of the first row COS912 of the heat sink assembly 9.

[0087] S4. According to the result of step S3, the cross slide moves to align the cutting line 914 of the heat sink neck 913 of the first row COS912 with the cutting blade 632 of the cutting unit 6, and the heat sink block 9122 and the tube core 9121 of the first row COS912 are aligned with the first probe needle 532 and the second probe needle 533 respectively.

[0088] S5. The cross slide drives the loading platform 3 to move, so that the first grain COS912 in the first row moves to the piercing position just below the piercing unit 5.

[0089] S6. The first driving component drives the first slide to move downward until the first measuring needle 532 and the second measuring needle 533 respectively contact the tube core 9121 and the heat sink block 9122 of the first COS912 in the first row, and then the set current is passed through the first measuring needle 532 and the second measuring needle 533 to test the parameters of the first COS912 in the first row. After the test is completed, the first driving component drives the first slide to move upward and reset.

[0090] Here, the parameter test may be wavelength measurement or light spot measurement, which can be selected according to the needs.

[0091] S7. Repeat the operations of steps S5-S6 to test other COS912 in the first row in turn until the test of COS912 in the first row is completed.

[0092] S8. The cross slide drives the loading platform 3 to move so that the cutting line 914 of the heat sink neck 913 of the first row of COS 912 is aligned with the cutting blade 632.

[0093] S9, the second driving component drives the second slide to move downward to cut the first row of COS912. After the cutting is completed, the second driving component drives the second slide to move upward and reset.

[0094] S10, repeat the operations of steps S3-S9 to test and cut the COS912 in other rows in turn.

[0095] Other embodiments obtained by those skilled in the art by combining, splitting, reorganizing, etc. the embodiments of the present application on the basis of the embodiments provided in the present application do not exceed the protection scope of the present application.

[0096] The above specific implementation methods have detailed the purpose, technical solutions and beneficial effects of the embodiments of the present application. The above are only specific implementation methods of the embodiments of the present application and are not used to limit the protection scope of the embodiments of the present application. That is, any modifications, equivalent substitutions, improvements, etc. made on the basis of the embodiments of the present application should be included in the protection scope of the embodiments of the present application.

Claims

1. A semiconductor laser COS automatic detection and cutting device, characterized in that: It comprises a main frame and a cross slide arranged on the main frame, wherein the cross slide is provided with a loading platform (3); An identification and positioning unit (4), a piercing and measuring unit (5) and a cutting unit (6) are arranged on the main frame above the cross slide, and a detection unit (7) is arranged on one side of the piercing and measuring unit (5); The identification and positioning unit (4) comprises a first industrial camera (41); The piercing and measuring unit (5) comprises a first slide slidably connected to the main frame, a first driving component for driving the first slide to slide up and down is arranged between the first slide and the main frame, a first piercing and measuring needle (532) and a second piercing and measuring needle (533) are arranged on the bottom surface of the first slide, when the first piercing and measuring needle (532) and the second piercing and measuring needle (533) of the piercing and measuring unit (5) are in contact with the tube core (9121) and the heat sink block (9122) of the COS (912) respectively, and current is passed through the first piercing and measuring needle (532) and the second piercing and measuring needle (533), the detection unit (7) can detect the light emitted by the COS (912); The cutting unit (6) includes a second slide slidably connected to the main frame, a second driving component for driving the second slide to slide up and down is arranged between the second slide and the main frame, and a cutting blade (632) is arranged on the bottom surface of the second slide.

2. A semiconductor laser COS automatic detection and cutting device according to claim 1, characterized in that: The detection unit (7) includes a mounting seat (71), on which an integrating sphere (721) or a light receiving plate (722) is detachably mounted, and a second industrial camera (54) is arranged on the first slide, and the second industrial camera (54) faces one side of the detection unit (7).

3. A semiconductor laser COS automatic detection and cutting device according to claim 2, characterized in that: Studs (712) are respectively arranged on both sides of the mounting seat (71), and connecting seat plates (723) are arranged at the lower ends of the integrating sphere (721) and the light receiving plate (722), and the connecting seat plate (723) includes a seat plate, and vertical plates are respectively arranged at both ends of the seat plate, and positioning grooves (7231) for accommodating the studs (712) are arranged on the vertical plates, and locking nuts (7121) are arranged on the studs (712) on the outer side of the vertical plates.

4. The semiconductor laser COS automatic detection and cutting device according to claim 1, characterized in that: The identification and positioning unit (4), the piercing and measuring unit (5) and the cutting unit (6) are arranged in a line along one direction, and the arrangement direction of the identification and positioning unit (4), the piercing and measuring unit (5) and the cutting unit (6) is parallel to a sliding direction of the cross slide.

5. The semiconductor laser COS automatic detection and cutting device according to claim 1, characterized in that: The main frame includes a support frame (11) and a support plate (12) arranged on the support frame (11), the support frame (11) includes two vertical frames (111), the inner side surface of the vertical frame (111) is provided with a support plate (1114) for supporting the support plate (12), a cross beam (112) is arranged between the two vertical frames (111) and above the support plate (12), the cross slide and the detection unit (7) are arranged on the support plate (12), and the identification and positioning unit (4), the piercing unit (5) and the cutting unit (6) are arranged on the cross beam (112).

6. The semiconductor laser COS automatic detection and cutting device according to claim 1, characterized in that: The cross slide comprises two first linear modules (211), the power input shafts of the two first linear modules (211) are connected via a synchronous rotating shaft (212), the power input shaft of one of the first linear modules (211) is connected to the power output shaft of the first drive motor (213), a second linear module (221) is arranged between the two first linear modules (211), the mounting seats (71) at both ends of the second linear module (221) are respectively connected to the sliding tables of the two first linear modules (211), the power input shaft of the second linear module (221) is connected to the power output shaft of the second drive motor (222), and the loading table (3) is arranged on the sliding table of the second linear module (221).

7. The semiconductor laser COS automatic detection and cutting device according to claim 1, characterized in that: The loading platform (3) is a hollow structure, and a plurality of adsorption holes (31) connected to the internal space of the loading platform (3) are arranged on the upper side surface of the loading platform (3), and the air outlet (32) of the loading platform (3) is connected to the vacuum equipment through a pipeline.

8. The semiconductor laser COS automatic detection and cutting device according to claim 1, characterized in that: A rotating table (8) is arranged between the loading platform (3) and the cross slide.

9. The semiconductor laser COS automatic detection and cutting device according to claim 8, characterized in that: The turntable (8) includes a horizontal plate (81), a slewing support (82) is arranged on the horizontal plate (81), the inner ring of the slewing support (82) is connected to the horizontal plate (81), the outer ring of the slewing support (82) is connected to the loading platform (3), and a slewing motor (83) is arranged on the horizontal plate (81), and the power output shaft of the slewing motor (83) is connected to the outer ring of the slewing support (82) through a third transmission mechanism.

10. An operating method for the semiconductor laser COS automatic detection and cutting device according to any one of claims 1 to 9, characterized in that: The following steps are included: S1, bonding a heat sink sheet (91) to a UV film (92), expanding a blue film (93) using a collapse ring (94), and then bonding the UV film (92) bonded with the heat sink sheet (91) to the blue film (93) to form a heat sink sheet assembly (9); S2, placing the heat sink assembly (9) on the loading platform (3), and turning on the vacuum device to firmly adsorb it; S3, the cross slide drives the loading platform (3) to move to the bottom of the identification and positioning unit (4), and identifies the positions of the heat sink block (9122), the tube core (9121) and the cutting line (914) of the heat sink neck (913) of the first row COS (912) of the heat sink assembly (9) through the first industrial camera (41); S4, according to the result of identification in step S3, the cross slide moves to align the cutting line (914) of the heat sink neck (913) of the first row of COS (912) with the cutting blade (632) of the cutting unit (6), and the heat sink block (9122) and the tube core (9121) of the first row of COS (912) are aligned with the first probe needle (532) and the second probe needle (533) respectively; S5, the cross slide drives the loading platform (3) to move, so that the first COS (912) in the first row moves to the piercing position just below the piercing unit (5); S6, the first driving component drives the first slide to move downward until the first measuring needle (532) and the second measuring needle (533) respectively contact the tube core (9121) and the heat sink (9122) of the first COS (912) in the first row, and then a set current is passed through the first measuring needle (532) and the second measuring needle (533) to test the parameters of the first COS (912) in the first row. After the test is completed, the first driving component drives the first slide to move upward to reset; S7, repeat the operations of steps S5-S6 to test other COS (912) of the first row in turn; S8, the cross slide drives the loading platform (3) to move so that the cutting line (914) of the heat sink neck (913) of the first row of COS (912) is aligned with the cutting blade (632); S9, the second driving component drives the second slide to move downward to cut the first row of COS (912), and after the cutting is completed, the second driving component drives the second slide to move upward to reset; S10, repeat the operations of steps S3-S9, and test and cut the COS (912) of other rows in turn.

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