Gallium nitride wafer cutting device and technology thereof

Abstract

The invention relates to the technical field of gallium nitride cutting, in particular to a gallium nitride wafer cutting device and a process thereof.The gallium nitride wafer cutting device comprises a diamond wire cutting machine capable of moving longitudinally, and a fixing mechanism and a pressing piece making contact with the end face of a gallium nitride crystal column are arranged on the two sides of the cutting path of the diamond wire cutting machine respectively; the fixing mechanism is provided with a clamping end in contact with the end face of the gallium nitride crystal column; the fixing mechanism is further provided with a clamping piece. The fixing mechanism and the pressing piece are installed on the first linear driver and the second linear driver respectively, when the gallium nitride crystal column is short, the second linear driver starts to work to drive the pressing piece to move along the sleeve frame and abut against one end of the gallium nitride crystal column, then the fixing mechanism drives the multiple clamping pieces to turn over, and the clamping pieces are driven by the second linear driver to move along the sleeve frame to abut against one end of the gallium nitride crystal column. The multiple clamping pieces are separated from the outer edge face of the gallium nitride crystal column, the two ends of the gallium nitride crystal column are fixed under the combined action of the clamping ends of the sleeves and the pressing pieces, and the continuity of gallium nitride wafer cutting is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of gallium nitride cutting, and in particular to a gallium nitride wafer cutting device and a process thereof. Background Art

[0002] Gallium nitride is a wide bandgap semiconductor material, commonly used in the manufacture of high-frequency, high-power electronic devices and blue light LEDs. The wide bandgap characteristics of gallium nitride enable it to effectively detect ultraviolet light, and it has high sensitivity and stability, which makes gallium nitride an ideal choice for high-performance ultraviolet light detectors and is commonly used in the manufacture of ultraviolet photodetectors.

[0003] Gallium nitride materials usually need to be cut into wafers, and a diamond wire saw is required during the cutting process. The gallium nitride wafer is a column before cutting, and the gallium nitride crystal column is fixed by a three-jaw chuck. However, when cutting to the tail end of the gallium nitride crystal column, the cutting cannot be continued due to the obstruction of the chuck claws. At this time, either the material is not cut further as leftover material, or the fixture is replaced for cutting again, resulting in a decrease in overall efficiency. To address this problem, a gallium nitride wafer cutting device and process need to be proposed. Summary of the invention

[0004] In view of this, the purpose of the present invention is to propose a gallium nitride wafer cutting device and process thereof, so as to solve the technical problem that when cutting to the tail end of the gallium nitride crystal column, the cutting cannot be continued due to the obstruction of the chuck claw body. At this time, either the leftover material is not cut further, or the fixture is replaced for cutting again, resulting in a technical problem of reduced overall efficiency.

[0005] Based on the above purpose, the present invention provides a gallium nitride wafer cutting device, including a diamond wire saw that can move longitudinally, a fixing mechanism and a clamping member in contact with the end face of the gallium nitride crystal column are respectively arranged on both sides of the cutting path of the diamond wire saw, the fixing mechanism has a clamping end in contact with the end face of the gallium nitride crystal column, and a rubber sheet is arranged at the clamping end;

[0006] The fixing mechanism is also provided with a clamping piece, and the fixing mechanism controls the clamping piece to fix the gallium nitride crystal column at the clamping end;

[0007] The gallium nitride wafer cutting device also includes a first linear drive and a second linear drive, and the fixing mechanism and the pressing member are respectively installed on the first linear drive and the second linear drive.

[0008] Preferably, the fixing mechanism comprises a sleeve arranged at the working end of the first linear drive, and the outer end surface of one end of the sleeve facing the pressing member is a clamping end;

[0009] The clamping piece is in an arc-shaped structure, and the clamping piece is arranged around the sleeve, and a hinge seat is arranged on the outer arc surface of the clamping piece, and the clamping piece is connected to the sleeve through the hinge seat;

[0010] A turning drive assembly is arranged inside the sleeve, and the turning drive assembly is used to control a plurality of clamping members to turn along the axial direction of the sleeve.

[0011] Preferably, the flip drive assembly includes a first ring body sleeved on the outside of the sleeve, a slide groove is provided on the outside of the sleeve in the same direction as the axial line of the sleeve, the first ring body is slidably connected with the sleeve through the slide groove, a first cylinder is provided inside the sleeve, and a connecting frame is provided on the output shaft of the first cylinder, and the connecting frame penetrates the outside of the sleeve and is fixedly connected with the first ring body;

[0012] A connecting rod corresponding to the clamping piece is arranged around the outer edge surface of the first ring body, one end of the connecting rod is hinged to the first ring body, and the other end of the connecting rod is connected to the hinge seat of the clamping piece.

[0013] Preferably, it also includes a sleeve frame, a clamping piece is arranged around the sleeve frame, the clamping piece is arranged at one end of the sleeve frame facing the fixing mechanism, a second ring body is arranged inside the sleeve frame, the second ring body is connected to the clamping piece, a guide rod is arranged on the second ring body, the second ring body is slidably connected to the sleeve frame through the guide rod, a second cylinder is arranged on the sleeve frame, and the output shaft of the second cylinder is connected to the second ring body.

[0014] Preferably, a first vacuum suction cup is provided at one end of the sleeve frame facing the fixing mechanism, and a second vacuum suction cup is provided at the clamping end of the sleeve.

[0015] Preferably, a third linear drive is provided at the output end of the second linear drive, the sleeve frame is installed at the output end of the third linear drive, and the third linear drive is used to drive the sleeve frame to move longitudinally.

[0016] Preferably, it further comprises a water collecting tank, which is arranged below the diamond wire cutting machine, and a chain conveyor is arranged on the water collecting tank, the chain conveyor extends to the outside of the water collecting tank, and a material receiving rack is arranged above the chain conveyor extending to the outside;

[0017] A material carrier for carrying the gallium nitride wafer is arranged on the chain of the chain conveyor, and the chain conveyor conveys the gallium nitride wafer to the material support rack through the material carrier.

[0018] Preferably, the material carrier comprises a straight frame arranged on the chain of the chain conveyor, an end face stand and a blocking member are arranged on the straight frame, and an arc-shaped groove is formed between the end face stand and the blocking member;

[0019] An electric push rod is arranged at the bottom of the flat frame, and an output end of the electric push rod is connected to the blocking member;

[0020] The material receiving frame comprises an end baffle plate, and side frames are symmetrically arranged on both sides of the end baffle plate, and the distance between the two side frames is greater than the width of the end stand frame.

[0021] Preferably, a gallium nitride wafer cutting process comprises the following steps:

[0022] Step 1: The staff puts the end face of the gallium nitride crystal column in contact with the rubber sheet at the clamping end of the fixing mechanism;

[0023] Step 2: The flip driving assembly in the fixing mechanism starts to work, the output shaft of the first cylinder drives the first ring body to move through the connecting frame, the first ring body pulls the clamping piece through the connecting rod to flip, and multiple clamping pieces move toward the center of the clamping end of the sleeve to clamp the gallium nitride crystal column;

[0024] Step 3: The diamond wire cutting machine starts to work, and the cutting part of the diamond wire cutting machine starts to descend to cut the gallium nitride crystal column;

[0025] Step 4: After the GaN crystal column has been cut multiple times, its length will continue to shorten. When the clamping piece becomes an obstacle to the GaN crystal column, the second linear drive starts to work, driving the clamping piece to move along the sleeve and contact one end of the GaN crystal column. Then the flipping drive assembly in the fixing mechanism works again, and the output end of the first cylinder pushes the first ring body to move. The first ring body pulls the clamping piece through the connecting rod to flip. The multiple clamping pieces are away from the center of the clamping end of the sleeve and are not in any radial direction of the GaN crystal column.

[0026] Step 5: The two ends of the shorter gallium nitride crystal column are fixed by the clamping end of the sleeve and the clamping piece.

[0027] Beneficial effects of the present invention:

[0028] In the present invention, when the gallium nitride crystal column is at a shorter length, the second linear drive starts to work, driving the clamping member to move along the sleeve and abut against one end of the gallium nitride crystal column, and then the fixing mechanism drives multiple clamping members to flip, and the multiple clamping members are separated from the outer edge surface of the gallium nitride crystal column and are not in any radial direction thereof. The two ends of the gallium nitride crystal column are fixed by the combined action of the clamping end of the sleeve and the clamping member, which effectively improves the continuity of gallium nitride wafer cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1It is a schematic diagram of the three-dimensional structure of the present invention;

[0031] Figure 2 It is a front view of the present invention;

[0032] Figure 3 It is a three-dimensional structural schematic diagram of the fixing mechanism and the pressing member of the present invention;

[0033] Figure 4 It is a front view of the fixing mechanism and the pressing member of the present invention;

[0034] Figure 5 The three-dimensional structure of the fixing mechanism of the present invention is shown in FIG. Figure 1 ;

[0035] Figure 6 The three-dimensional structure of the fixing mechanism of the present invention is shown in FIG. Figure 2 ;

[0036] Figure 7 It is a schematic diagram of the three-dimensional structure of the pressing member and the second linear drive of the present invention;

[0037] Figure 8 It is a three-dimensional structural schematic diagram of the pressing member of the present invention;

[0038] Fig. 9 It is a three-dimensional structural schematic diagram of the water collecting trough, chain conveyor, material receiving frame and material carrying member of the present invention;

[0039] Fig.10 It is a schematic diagram of the three-dimensional structure of the material carrier of the present invention.

[0040] The numbers in the figure are:

[0041] 1-diamond wire cutting machine; 2-first linear drive; 21-fixing mechanism; 211-sleeve; 2111-second vacuum suction cup; 212-flip drive assembly; 2121-first ring body; 2122-first cylinder; 2123-connecting frame; 2124-connecting rod; 22-rubber sheet; 23-clamping piece; 3-second linear drive; 31-third linear drive; 4-pressing piece; 5-sleeve Rack; 51-second ring body; 52-guide rod; 53-second cylinder; 54-first vacuum suction cup; 6-water collecting trough; 61-chain conveyor; 62-material support rack; 621-end baffle; 622-side rack; 63-material carrier; 631-flat rack; 632-end stand; 633-blocking piece; 634-arc groove; 635-electric push rod; 7-gallium nitride crystal column; 71-gallium nitride wafer. DETAILED DESCRIPTION

[0042] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0043] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0044] In a first aspect of the present invention, a gallium nitride wafer cutting device is provided, such as Figure 1 refer to Figure 8 As shown, it includes a diamond wire saw 1 that can move longitudinally, and a fixing mechanism 21 and a clamping member 4 that contacts the end surface of the gallium nitride crystal column 7 are respectively arranged on both sides of the cutting path of the diamond wire saw 1, and the fixing mechanism 21 has a clamping end that contacts the end surface of the gallium nitride crystal column 7, and a rubber sheet 22 is arranged at the clamping end;

[0045] The fixing mechanism 21 is also provided with a clamping member 23, and the fixing mechanism 21 controls the clamping member 23 to fix the gallium nitride crystal column 7 at the clamping end;

[0046] The gallium nitride wafer cutting device further includes a first linear drive 2 and a second linear drive 3 , and a fixing mechanism 21 and a pressing member 4 are respectively mounted on the first linear drive 2 and the second linear drive 3 .

[0047] The fixing mechanism 21 includes a sleeve 211 disposed at the working end of the first linear actuator 2, and the outer end surface of the sleeve 211 facing the pressing member 4 is a clamping end;

[0048] The clamping member 23 is an arc-shaped structure, and the clamping member 23 is arranged around the sleeve 211. The outer arc surface of the clamping member 23 is provided with a hinge seat, and the clamping member 23 is connected to the sleeve 211 through the hinge seat;

[0049] A flip driving assembly 212 is disposed inside the sleeve 211 . The flip driving assembly 212 is used to control the plurality of clamping members 23 to flip along the axial direction of the sleeve 211 .

[0050] The flip drive assembly includes a first ring body 2121 sleeved on the outside of the sleeve 211, a slide groove in the same direction as the axial line of the sleeve 211 is provided on the outside of the sleeve 211, the first ring body 2121 is slidably connected with the sleeve 211 through the slide groove, a first cylinder 2122 is provided inside the sleeve 211, and a connecting frame 2123 is provided on the output shaft of the first cylinder 2122, and the connecting frame 2123 penetrates the outside of the sleeve 211 and is fixedly connected with the first ring body 2121;

[0051] A connecting rod 2124 corresponding to the clamping member 23 is disposed around the outer edge surface of the first ring body 2121 , one end of the connecting rod 2124 is hinged to the first ring body 2121 , and the other end of the connecting rod 2124 is connected to the hinge seat of the clamping member 23 .

[0052] In this embodiment, the staff makes the end face of the gallium nitride crystal column 7 contact with the rubber sheet 22 at the clamping end of the fixing mechanism 21, and the flip driving assembly 212 in the fixing mechanism 21 starts to work. The output shaft of the first cylinder 2122 drives the first ring body 2121 to move through the connecting frame 2123, and the first ring body 2121 moves along the axis of the sleeve 211. The first ring body 2121 pulls the clamping piece 23 through the connecting rod 2124 to flip, and multiple clamping pieces 23 move toward the center of the clamping end of the sleeve 211 to clamp the gallium nitride crystal column 7;

[0053] The diamond wire saw 1 starts to work, and the cutting part of the diamond wire saw 1 starts to descend to cut the gallium nitride crystal column 7. After the gallium nitride crystal column 7 is cut multiple times, the length of the column will be continuously shortened, and the clamping member 23 will hinder the gallium nitride crystal column 7.

[0054] Next, the second linear drive 3 starts to work, driving the clamping member 4 to move along the sleeve 5 and contact one end of the gallium nitride crystal column 7, and then the flip driving assembly 212 in the fixing mechanism 21 works again, and the output end of the first cylinder 2122 pushes the first ring body 2121 to move, and the first ring body 2121 moves along the axis of the sleeve 211, and the first ring body 2121 pulls the clamping member 23 to flip through the connecting rod 2124, and the multiple clamping members 23 are away from the center of the clamping end of the sleeve 211 and are not in any radial direction of the gallium nitride crystal column 7;

[0055] At this time, both ends of the shorter gallium nitride crystal column 7 are fixed by the clamping end of the sleeve 211 and the pressing member 4 .

[0056] The first linear drive 2 in this solution is specifically a screw slide but is not limited thereto, and the second linear drive 3 in this solution is specifically a pneumatic slide but is not limited thereto.

[0057] As an embodiment, during the process of cutting the gallium nitride wafer 71 by the diamond wire saw 1, the material is cut as follows: Figure 1 , Figure 5 and Figures 7 to 10 As shown, further:

[0058] The gallium nitride wafer cutting device also includes a sleeve frame 5, on which a clamping piece 4 is arranged around, and the clamping piece 4 is arranged at one end of the sleeve frame 5 facing the fixing mechanism 21, and a second ring body 51 is arranged inside the sleeve frame 5, and the second ring body 51 is connected to the clamping piece 4, and a guide rod 52 is arranged on the second ring body 51, and the second ring body 51 is slidably connected to the sleeve frame 5 through the guide rod 52, and a second cylinder 53 is arranged on the sleeve frame 5, and the output shaft of the second cylinder 53 is connected to the second ring body 51.

[0059] A first vacuum suction cup 54 is disposed at one end of the sleeve frame 5 facing the fixing mechanism 21 , and a second vacuum suction cup 2111 is disposed at the clamping end of the sleeve 211 .

[0060] The output end of the second linear driver 3 is provided with a third linear driver 31 , and the sleeve frame 5 is installed at the output end of the third linear driver 31 . The third linear driver 31 is used to drive the sleeve frame 5 to move longitudinally.

[0061] The gallium nitride wafer cutting device further includes a water collecting tank 6, which is arranged below the diamond wire saw 1, and a chain conveyor 61 is arranged on the water collecting tank 6, and the chain conveyor 61 extends to the outside of the water collecting tank 6, and a material receiving rack 62 is arranged above the chain conveyor 61 extending to the outside;

[0062] A material carrier 63 for carrying the gallium nitride wafer 71 is disposed on the chain of the chain conveyor 61 . The chain conveyor 61 conveys the gallium nitride wafer 71 to the material support rack 62 through the material carrier 63 .

[0063] The material carrier 63 includes a straight frame 631 disposed on the chain of the chain conveyor 61, an end face stand 632 and a blocking member 633 are disposed on the straight frame 631, and an arc groove 634 is formed between the end face stand 632 and the blocking member 633;

[0064] An electric push rod 635 is disposed at the bottom of the flat frame 631, and an output end of the electric push rod 635 is connected to the blocking member 633;

[0065] The material receiving frame 62 includes an end baffle 621 , and side frames 622 are symmetrically arranged on both sides of the end baffle 621 , and the distance between the two side frames 622 is greater than the width of the end stand frame 632 .

[0066] In this embodiment, before the diamond wire saw 1 performs cutting, the output end of the second linear drive 3 drives the sleeve 5 to move so that the first vacuum chuck 54 contacts the end surface of the gallium nitride crystal column 7. When the diamond wire saw 1 completes cutting, the part adsorbed by the first vacuum chuck 54 is the gallium nitride wafer 71. The third linear drive 31 drives the first vacuum chuck 54 to descend through the sleeve 5 until the gallium nitride wafer 71 falls on the carrier 63, and the first vacuum chuck 54 is depressurized.

[0067] The first vacuum suction cup 54 and the second vacuum suction cup 2111 are both connected to the vacuum pump through a structure such as an air pipe to complete the action of adsorbing the gallium nitride wafer 71. This is a mature existing technology and will not be described in detail here.

[0068] When the gallium nitride crystal column 7 is in a relatively short state and can only be cut into two wafer lengths, the cutting process by the diamond wire saw 1 is as follows:

[0069] The second cylinder 53 starts to work, driving the second ring body 51 to move along the sleeve frame 5, and the second ring body 51 drives the clamping member 4 to contact one end of the gallium nitride crystal column 7, and at this time the first vacuum suction cup 54 also contacts the end face of the crystal column, and then the flip driving assembly 212 in the fixing mechanism 21 works again, and the output end of the first cylinder 2122 pushes the first ring body 2121 to move, and the first ring body 2121 moves along the axis of the sleeve 211, and the first ring body 2121 pulls the clamping member 23 to flip through the connecting rod 2124, and the multiple clamping members 23 are away from the center of the clamping end of the sleeve 211 and are not in any radial direction of the gallium nitride crystal column 7;

[0070] At this time, the two ends of the shorter gallium nitride crystal column 7 are fixed by the clamping end of the sleeve 211 and the pressing member 4;

[0071] After the cutting part of the diamond wire saw 1 has finished cutting the crystal column, it rises up and leaves the range of the gallium nitride crystal column 7. At this time, the first vacuum chuck 54 and the second vacuum chuck 2111 prevent the wafer from loosening and sliding.

[0072] The third linear actuator 31 drives the first vacuum chuck 54 to descend through the sleeve 5 until the gallium nitride wafer 71 falls on the carrier 63 and the first vacuum chuck 54 is depressurized;

[0073] The third linear driver 31 drives the first vacuum suction cup 54 to reset through the sleeve frame 5 and contact and adsorb the other wafer. The second vacuum suction cup 2111 is depressurized. The third linear driver 31 drives the first vacuum suction cup 54 to descend again through the sleeve frame 5 until the first vacuum suction cup 54 is depressurized when the gallium nitride wafer 71 falls on the carrier 63.

[0074] In the present embodiment, the third linear drive 31 drives the sleeve frame 5 to move longitudinally specifically through a cylinder and corresponding connecting parts.

[0075] Since water needs to be sprayed toward the cutting point during the diamond wire cutting process, a water collecting tank 6 is provided below;

[0076] After being transported to the carrier 63, the gallium nitride wafer 71 needs to be transferred to the material support rack 62. The gallium nitride wafer 71 is sunk into the arc-shaped groove 634, and its two end faces are respectively controlled by the end face stand 632 and the blocking member 633. The chain of the chain conveyor 61 transports the gallium nitride wafer 71 to the material support rack 62 through the carrier 63. When the gallium nitride wafer 71 is on the material support rack 62, its outer edge surface is supported by the arc-shaped concave surfaces of the side frames 622 on both sides. Before the gallium nitride wafer 71 reaches the predetermined position, the electric push rod 635 drives the blocking member 633 to descend, and then the carrier 63 continues to move slightly to make it close to the end face baffle 621 or the previous gallium nitride wafer 71.

[0077] This scheme proposes a gallium nitride wafer cutting process, which includes the following steps:

[0078] Step 1: The staff brings the end surface of the gallium nitride crystal column 7 into contact with the rubber sheet 22 at the clamping end of the fixing mechanism 21;

[0079] Step 2: The flip driving assembly 212 in the fixing mechanism 21 starts to work, the output shaft of the first cylinder 2122 drives the first ring body 2121 to move through the connecting frame 2123, the first ring body 2121 pulls the clamping piece 23 to flip through the connecting rod 2124, and the multiple clamping pieces 23 move toward the center of the clamping end of the sleeve 211 to clamp the gallium nitride crystal column 7;

[0080] Step 3: the diamond wire cutting machine 1 starts to work, and the cutting part of the diamond wire cutting machine 1 starts to descend to cut the gallium nitride crystal column 7;

[0081] Step 4: After the gallium nitride crystal column 7 is cut multiple times, its length will be continuously shortened. When the clamping piece 23 appears to hinder the gallium nitride crystal column 7, the second linear drive 3 starts to work, driving the clamping piece 4 to move along the sleeve 5 and abut against one end of the gallium nitride crystal column 7. Then the flip driving assembly 212 in the fixing mechanism 21 works again, and the output end of the first cylinder 2122 pushes the first ring body 2121 to move. The first ring body 2121 pulls the clamping piece 23 to flip through the connecting rod 2124. The multiple clamping pieces 23 are away from the center of the clamping end of the sleeve 211 and are not in any radial direction of the gallium nitride crystal column 7.

[0082] Step 5: Both ends of the shorter gallium nitride crystal column 7 are fixed by the clamping end of the sleeve 211 and the pressing member 4 .

[0083] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0084] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A gallium nitride wafer cutting device, comprising a longitudinally movable diamond wire saw (1), characterized in that: A fixing mechanism (21) and a clamping member (4) in contact with the end face of a gallium nitride crystal column (7) are respectively arranged on both sides of a cutting path of a diamond wire cutting machine (1); the fixing mechanism (21) has a clamping end in contact with the end face of the gallium nitride crystal column (7); a rubber sheet (22) is arranged at the clamping end; A clamping piece (23) is also provided on the fixing mechanism (21), and the fixing mechanism (21) controls the clamping piece (23) to fix the gallium nitride crystal column (7) at the clamping end; The gallium nitride wafer cutting device also includes a first linear drive (2) and a second linear drive (3), and the fixing mechanism (21) and the pressing member (4) are respectively mounted on the first linear drive (2) and the second linear drive (3).

2. A gallium nitride wafer cutting device according to claim 1, characterized in that: The fixing mechanism (21) comprises a sleeve (211) arranged at the working end of the first linear drive (2), and the outer end surface of one end of the sleeve (211) facing the pressing member (4) is a clamping end; The clamping member (23) is in an arc-shaped structure, and the clamping member (23) is arranged around the sleeve (211). The outer arc surface of the clamping member (23) is provided with a hinge seat, and the clamping member (23) is connected to the sleeve (211) via the hinge seat; A turning drive assembly (212) is arranged inside the sleeve (211), and the turning drive assembly (212) is used to control a plurality of clamping members (23) to turn along the axial direction of the sleeve (211).

3. A gallium nitride wafer cutting device according to claim 2, characterized in that: The flip drive assembly comprises a first ring body (2121) sleeved on the outside of a sleeve (211); a slide groove which is consistent with the axial direction of the sleeve (211) is provided on the outside of the sleeve (211); the first ring body (2121) is slidably connected with the sleeve (211) via the slide groove; a first cylinder (2122) is provided inside the sleeve (211); a connecting frame (2123) is provided on the output shaft of the first cylinder (2122); the connecting frame (2123) penetrates the outside of the sleeve (211) and is fixedly connected with the first ring body (2121); A connecting rod (2124) corresponding to the clamping member (23) is disposed around the outer edge surface of the first ring body (2121), one end of the connecting rod (2124) is hinged to the first ring body (2121), and the other end of the connecting rod (2124) is connected to the hinge seat of the clamping member (23).

4. The gallium nitride wafer cutting device according to claim 1, characterized in that: The invention also comprises a sleeve frame (5), a pressing piece (4) is arranged around the sleeve frame (5), the pressing piece (4) is arranged at one end of the sleeve frame (5) facing the fixing mechanism (21), a second ring body (51) is arranged inside the sleeve frame (5), the second ring body (51) is connected to the pressing piece (4), a guide rod (52) is arranged on the second ring body (51), the second ring body (51) is slidably connected to the sleeve frame (5) through the guide rod (52), a second cylinder (53) is arranged on the sleeve frame (5), and the output shaft of the second cylinder (53) is connected to the second ring body (51).

5. The gallium nitride wafer cutting device according to claim 4, characterized in that: A first vacuum suction cup (54) is arranged at one end of the sleeve frame (5) facing the fixing mechanism (21), and a second vacuum suction cup (2111) is arranged at the clamping end of the sleeve (211).

6. The gallium nitride wafer cutting device according to claim 5, characterized in that: The output end of the second linear drive (3) is provided with a third linear drive (31), the sleeve frame (5) is mounted on the output end of the third linear drive (31), and the third linear drive (31) is used to drive the sleeve frame (5) to move longitudinally.

7. The gallium nitride wafer cutting device according to claim 6, characterized in that: The machine also includes a water collecting trough (6), the water collecting trough (6) being arranged below the diamond wire cutting machine (1), a chain conveyor (61) being arranged on the water collecting trough (6), the chain conveyor (61) extending to the outside of the water collecting trough (6), and a material receiving frame (62) being arranged above the part where the chain conveyor (61) extends to the outside; A material carrier (63) for carrying the gallium nitride wafer (71) is provided on the chain of the chain conveyor (61), and the chain conveyor (61) conveys the gallium nitride wafer (71) to the material support rack (62) via the material carrier (63).

8. The gallium nitride wafer cutting device according to claim 7, characterized in that: The material carrier (63) comprises a straight frame (631) arranged on the chain of the chain conveyor (61), an end face stand (632) and a blocking member (633) are arranged on the straight frame (631), and an arc-shaped groove (634) is formed between the end face stand (632) and the blocking member (633); An electric push rod (635) is disposed at the bottom of the flat frame (631), and an output end of the electric push rod (635) is connected to the blocking member (633); The material receiving frame (62) comprises an end baffle (621), and side frames (622) are symmetrically arranged on both sides of the end baffle (621), and the distance between the two side frames (622) is greater than the width of the end stand frame (632).

9. A gallium nitride wafer cutting process, the cutting process applying any one of claims 1 to 8, characterized in that: The process includes the following steps: Step 1: A staff member brings the end surface of the gallium nitride crystal column (7) into contact with the rubber sheet (22) at the clamping end of the fixing mechanism (21); Step 2: The flip driving assembly (212) in the fixing mechanism (21) starts to work, the output shaft of the first cylinder (2122) drives the first ring body (2121) to move through the connecting frame (2123), the first ring body (2121) pulls the clamping member (23) through the connecting rod (2124) to flip, and the multiple clamping members (23) move toward the center of the clamping end of the sleeve (211) to clamp the gallium nitride crystal column (7); Step 3: the diamond wire cutting machine (1) starts to work, and the cutting part of the diamond wire cutting machine (1) starts to descend to cut the gallium nitride crystal column (7); Step 4: After the gallium nitride crystal column (7) has been cut multiple times, the length of the column will continue to shorten. When the clamping piece (23) becomes an obstacle to the gallium nitride crystal column (7), the second linear drive (3) starts to work, driving the clamping piece (4) to move along the sleeve (5) and to contact one end of the gallium nitride crystal column (7). Then, the flipping drive assembly (212) in the fixing mechanism (21) works again, and the output end of the first cylinder (2122) pushes the first ring body (2121) to move. The first ring body (2121) pulls the clamping piece (23) to flip through the connecting rod (2124). The multiple clamping pieces (23) are away from the center of the clamping end of the sleeve (211) and are not located in any radial direction of the gallium nitride crystal column (7). Step 5: The two ends of the shorter gallium nitride crystal column (7) are fixed by the combined action of the clamping end of the sleeve (211) and the pressing member (4).

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