Preparation method of functional window of aircraft

Abstract

The invention discloses a preparation method of a functional window of an aircraft. The preparation method comprises the steps of high-temperature treatment, plasma treatment, coating of a silane coupling agent, silk-screen printing, electroplating thickening, coating of macromolecules and hot bending forming. The conductive circuit is manufactured on the surface of the PC base material in a silk-screen printing mode, the conductive circuit is attached to the PC base material, the thermal deformation quantity of the conductive circuit and the thermal deformation quantity of the PC base material are relatively consistent during hot bending forming, and debonding of the conductive circuit is effectively prevented; the circuit shape of the conductive circuit is a curve, and the embedded curve metal is not easy to break in slight deformation, so that the stable function is ensured; a metal grid in the conducting circuit subjected to silk-screen printing can block the interference of electromagnetic waves of 10 KHz to 18 GHz; in addition, the infrared absorbent in the high polymer material can block laser infrared rays, and the ultraviolet absorbent enhances the aging resistance of the material. The conductive circuit and the PC base material are stably combined and are not prone to falling off and breaking, and the functionality and practicability of the curved window are effectively improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of conductive films, and in particular to a method for preparing a functional window of an aircraft. Background Art

[0002] At present, polycarbonate (PC) has the advantages of excellent optical properties, light weight, impact resistance, good thermal stability, etc. It is a key material for achieving lightweight in high-end strategic fields such as automobiles and aircraft. For example, in addition to good optical properties, the observation glass of an aircraft must also be able to realize heating film and electromagnetic shielding functions to ensure the normal operation of the components in the cabin and flight safety. Therefore, the preparation method based on PC transparent functional parts is of great significance. However, polycarbonate currently has difficulties in surface printing and poor bonding between the functional layer and the substrate, which hinders the in-depth application of polycarbonate. Therefore, it is necessary to explore a method for preparing functional windows for aircraft, so as to solve the above problems. Summary of the invention

[0003] The main purpose of the present invention is to provide a method for preparing an aircraft functional window to solve the problems of difficulty in surface printing and poor bonding between the functional layer and the substrate in the prior art.

[0004] In order to achieve the above object, a method for preparing an aircraft functional window is provided according to the present invention, and the method comprises the following steps:

[0005] Step S1: high temperature treatment: heating the PC substrate and then cooling it naturally;

[0006] Step S2: plasma treatment: using plasma to clean and activate the surface of the PC substrate;

[0007] Step S3: applying a silane coupling agent; applying a silane coupling agent on the surface of the PC substrate;

[0008] Step S4: screen printing; printing silver paste on the surface of the PC substrate by screen printing, and placing the PC substrate in an oven for sintering after screen printing, so that a conductive circuit is formed on the surface of the PC substrate;

[0009] Step S5: electroplating thickening: electroplating thickening the conductive circuit;

[0010] Step S6: coating polymer: coating polymer material on the surface of PC substrate and conductive circuit;

[0011] Step S7: hot bending forming; heating and softening the substrate obtained in the above steps, and transferring it to a mold for forming.

[0012] Preferably, in step S1, the PC substrate is placed in an environment with a temperature of 60 to 85°C, heated for 120 to 180 minutes and then naturally cooled; the device for high temperature treatment is a heating plate, a heating roller or an oven.

[0013] Preferably, the plasma used in step S2 is Ar, O2, N2 or NH3.

[0014] Preferably, in step S3, the step of applying the silane coupling agent is:

[0015] Step S3-1: soaking a fine dust-free cloth with an epoxy silane coupling agent;

[0016] Step S3-2: Wring out a fine dust-free cloth until it is drip-free, and gently wipe the surface of the PC substrate;

[0017] Step S3-3: placing the wiped PC substrate in a constant temperature and humidity environment for 15 to 30 minutes.

[0018] Preferably, in step S4, the screen printing method is to print the silver paste onto the PC substrate through a precision screen printing screen; the line width of the pattern of the precision screen printing screen in this step is 50 μm to 100 μm, the line spacing is 400 μm to 2000 μm, and the shape of the line is a curve; the viscosity of the silver paste is 8000 to 20000 mPa.S;

[0019] After screen printing, the semi-finished product is placed in an oven for sintering at a temperature of 90 to 130°C;

[0020] The sintering treatment time is: 30 to 60 minutes.

[0021] Preferably, in step S5: the electroplating thickening includes a copper electroplating process and a nickel electroplating process performed sequentially.

[0022] Preferably, in step S5: the copper electroplating solution used in the copper electroplating process contains a mixture of copper sulfate, hydrochloric acid and sulfuric acid; the electroplating time of the copper electroplating process is 70 to 100 seconds; the nickel electroplating solution used in the nickel electroplating process contains a mixture of nickel sulfate, ammonium chloride and boric acid; the electroplating time of the nickel electroplating process is 40 to 60 seconds.

[0023] Preferably, in step S6: the polymer material is polycarbonate containing an infrared absorber and an ultraviolet absorber, or polysiloxane containing an infrared absorber and an ultraviolet absorber.

[0024] Preferably, in step S6: the polymer material is coated by any coating method including spraying, scraping or spin coating; and after coating, high temperature curing or ultraviolet curing is adopted for forming.

[0025] Preferably, in step S7: the heating temperature of the hot bending forming is 105-110°C, the heating time is 30-90 minutes, so that the PC substrate is softened, and the softened PC substrate is transferred to the customized mold, and the mold is removed after cooling to room temperature to obtain a substrate with a curved surface shape.

[0026] It can be seen from the above technical scheme that the embodiments of the present invention have the following advantages: the present invention makes a conductive circuit on the surface of the PC substrate by screen printing, the conductive circuit is bonded to the PC substrate, and the thermal deformation of the two is relatively consistent during hot bending, which effectively prevents the debonding of the conductive circuit; the line shape of the conductive circuit is a curve, and the embedded curved metal will not easily break in a slight deformation, ensuring stable function; the metal grid in the screen-printed conductive circuit can block the interference of 10KHz to 18GHz electromagnetic waves; in addition, the infrared absorber in the polymer material can block laser infrared, and the ultraviolet absorber enhances the aging resistance of the material. The aircraft functional window of the present invention can make a conductive circuit on a curved surface, and the combination of the conductive circuit and the PC substrate is stable and not easy to fall off or break, which effectively improves the functionality and practicality of the curved window. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] Figure 1 is a flow chart of a method for preparing an aircraft functional window of the present invention;

[0029] The marks in the drawings are as follows: DETAILED DESCRIPTION

[0030] The main purpose of the present invention is to provide a method for preparing an aircraft functional window to solve the problems of difficulty in surface printing and poor bonding between the functional layer and the substrate in the prior art.

[0031] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1 The present invention provides a method for preparing an aircraft functional window, the method comprising the following steps:

[0033] Step S1: high temperature treatment; the PC substrate is heated and then naturally cooled; in this step, the main purpose is to remove small molecules inside the substrate.

[0034] Step S2: plasma treatment; use plasma to clean and activate the surface of the PC substrate; in this step, Ar, O2 or other plasma can be used to clean the residual dirt on the surface of the PC substrate, activate the surface active functional groups, increase the roughness of the microstructure, and provide the possibility for chemical bond cross-linking and mechanical interlocking.

[0035] Step S3: Apply silane coupling agent; Apply silane coupling agent on the surface of PC substrate; The purpose of this step is to improve the adhesion of the substrate surface. In this step, attention should be paid to the ambient temperature and humidity. In a high temperature and high humidity environment, the operation should be performed as quickly as possible to avoid the failure of the coupling agent.

[0036] Step S4: screen printing; printing silver paste on the surface of the PC substrate by screen printing, and placing the PC substrate in an oven for sintering after screen printing, so that a conductive circuit is formed on the surface of the PC substrate; the purpose of this step is to form a conductive circuit on the surface of the PC substrate. The screen printing method makes it easier to control the direction of the circuit. For example, in order to adapt to the curved aircraft window, the conductive circuit can be made into a curved shape, so that the conductive circuit can better match the various shapes of the PC substrate.

[0037] Step S5: electroplating thickening; electroplating thickening is performed on the conductive circuit; in this step, the purpose of electroplating thickening is to thicken the silver wire so that the conductive circuit meets the use requirements, reduces the risk of breakage, and reduces the metal reflectivity.

[0038] Step S6: coating polymer; coating polymer material on the surface of PC substrate and conductive circuit; in this step, the purpose of coating polymer material is to improve the stability of embedded conductive circuit

[0039] Step S7: hot bending: the substrate obtained in the above step is heated and softened, and then transferred to a mold for molding. In this step, the PC substrate and the conductive circuit are heated and bent into the required shape to suit various usage scenarios.

[0040] Preferably, in step S1, the PC substrate is placed in an environment with a temperature of 60 to 85°C, heated for 120 to 180 minutes, and then naturally cooled; the high temperature treatment device is a heating plate, a heating roller, or an oven. In this embodiment, the purpose of the high temperature treatment is to remove small molecules inside the PC substrate, and the high temperature treatment method can be a heating plate, a heating roller, or an oven. The specific heating method and heating equipment depend on the state and size of the PC substrate.

[0041] Preferably, the plasma used in step S2 is Ar, O2, N2 or NH3.

[0042] Preferably, in step S3, the step of applying the silane coupling agent is:

[0043] Step S3-1: soaking a fine dust-free cloth with an epoxy silane coupling agent;

[0044] Step S3-2: Wring out a fine dust-free cloth until it is drip-free, and gently wipe the surface of the PC substrate;

[0045] Step S3-3: Place the wiped PC substrate in a constant temperature and humidity environment for 15 to 30 minutes. In this step, in order to prevent the coupling agent from becoming ineffective, the wiped material is placed in a constant temperature and humidity environment for natural drying.

[0046] Preferably, in step S4, the screen printing method is to print the silver paste onto the PC substrate through a precision screen printing screen; the line width of the pattern of the precision screen printing screen in this step is 50 μm to 100 μm, the line spacing is 400 μm to 2000 μm, and the shape of the line is a curve; the viscosity of the silver paste is 8000 to 20000 mPa.S;

[0047] After screen printing, the semi-finished product is placed in an oven for sintering at a temperature of 90 to 130°C;

[0048] The sintering treatment time is: 30 to 60 minutes.

[0049] In this embodiment, the shape of the conductive circuit is determined by a precision screen printing plate. In order to meet the requirements of the curved aircraft functional window, the pattern in the precision screen printing plate adopts a line width of 50μm to 100μm, and the circuit is set to 400μm to 2000μm, and the shape of the circuit is set to a curved structure. When the PC substrate is bent, the curved part on the conductive circuit can well avoid the problem of bending and breaking.

[0050] Preferably, in step S5: the electroplating thickening includes a copper electroplating process and a nickel electroplating process performed sequentially.

[0051] Preferably, in step S5: the copper electroplating solution used in the copper electroplating process contains a mixture of copper sulfate, hydrochloric acid and sulfuric acid; the electroplating time of the copper electroplating process is 70 to 100 seconds; the nickel electroplating solution used in the nickel electroplating process contains a mixture of nickel sulfate, ammonium chloride and boric acid; the electroplating time of the nickel electroplating process is 40 to 60 seconds.

[0052] Preferably, in step S6: the polymer material is polycarbonate containing infrared absorber and ultraviolet absorber, or polysiloxane containing infrared absorber and ultraviolet absorber. In this embodiment, the infrared absorber can block laser infrared, while the ultraviolet absorber enhances the aging resistance of the material.

[0053] Preferably, in step S6: the polymer material is coated by any coating method including spraying, scraping or spin coating; and after coating, high temperature curing or ultraviolet curing is adopted for forming.

[0054] Preferably, in step S7: the heating temperature of the hot bending forming is 105-110°C, the heating time is 30-90 minutes, so that the PC substrate is softened, and the softened PC substrate is transferred to the customized mold, and the mold is removed after cooling to room temperature to obtain a substrate with a curved surface shape.

[0055] It can be seen from the above technical scheme that the embodiments of the present invention have the following advantages: the present invention makes a conductive circuit on the surface of the PC substrate by screen printing, the conductive circuit is bonded to the PC substrate, and the thermal deformation of the two is relatively consistent during hot bending, which effectively prevents the debonding of the conductive circuit; the line shape of the conductive circuit is a curve, and the embedded curved metal will not easily break in a slight deformation, ensuring stable function; the metal grid in the screen-printed conductive circuit can block the interference of 10KHz to 18GHz electromagnetic waves; in addition, the infrared absorber in the polymer material can block laser infrared, and the ultraviolet absorber enhances the aging resistance of the material. The aircraft functional window of the present invention can make a conductive circuit on a curved surface, and the combination of the conductive circuit and the PC substrate is stable and not easy to fall off or break, which effectively improves the functionality and practicality of the curved window.

[0056] The above are only preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the embodiments of the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for preparing an aircraft functional window, characterized in that: The method comprises the following steps: Step S1: high temperature treatment: heating the PC substrate and then cooling it naturally; Step S2: plasma treatment: using plasma to clean and activate the surface of the PC substrate; Step S3: applying a silane coupling agent; applying a silane coupling agent on the surface of the PC substrate; Step S4: screen printing; printing silver paste on the surface of the PC substrate by screen printing, and placing the PC substrate in an oven for sintering after screen printing, so that a conductive circuit is formed on the surface of the PC substrate; Step S5: electroplating thickening; Electroplating thickens the conductive circuit; Step S6: coating polymer: coating polymer material on the surface of PC substrate and conductive circuit; Step S7: hot bending forming; heating and softening the substrate obtained in the above steps, and transferring it to a mold for forming.

2. The method for preparing an aircraft functional window according to claim 1, characterized in that: In step S1, the PC substrate is placed in an environment with a temperature of 60 to 85°C, heated for 120 to 180 minutes and then naturally cooled; the high temperature treatment device is a heating plate, a heating roller or an oven.

3. The method for preparing an aircraft functional window according to claim 1, characterized in that: The plasma used in step S2 is Ar, O2, N2 or NH3.

4. The method for preparing an aircraft functional window according to claim 1, characterized in that: In step S3, the steps of applying the silane coupling agent are: Step S3-1: soaking a fine dust-free cloth with an epoxy silane coupling agent; Step S3-2: Wring out a fine dust-free cloth until it is drip-free, and gently wipe the surface of the PC substrate; Step S3-3: placing the wiped PC substrate in a constant temperature and humidity environment for 15 to 30 minutes.

5. The method for preparing an aircraft functional window according to claim 1, characterized in that: In step S4, the screen printing method is to print the silver paste onto the PC substrate through a precision screen printing plate; the line width of the pattern of the precision screen printing plate in this step is 50μm-100μm, the line spacing is 400μm-2000μm, and the shape of the line is a curve; the viscosity of the silver paste is 8000-20000mPa.S; After screen printing, the semi-finished product is placed in an oven for sintering at a temperature of 90 to 130°C; The sintering treatment time is: 30 to 60 minutes.

6. The method for preparing an aircraft functional window according to claim 1, characterized in that: In step S5 : the electroplating thickening process includes a copper electroplating process and a nickel electroplating process performed sequentially.

7. The method for preparing an aircraft functional window according to claim 1, characterized in that: In step S5: the copper electroplating solution used in the copper electroplating process contains a mixture of copper sulfate, hydrochloric acid and sulfuric acid; the electroplating time of the copper electroplating process is 70 to 100 seconds; the nickel electroplating solution used in the nickel electroplating process contains a mixture of nickel sulfate, ammonium chloride and boric acid; the electroplating time of the nickel electroplating process is 40 to 60 seconds.

8. The method for preparing an aircraft functional window according to claim 1, characterized in that: In step S6: the polymer material is polycarbonate containing an infrared absorber and an ultraviolet absorber, or polysiloxane containing an infrared absorber and an ultraviolet absorber.

9. The method for preparing an aircraft functional window according to claim 8, characterized in that: In step S6: the polymer material is coated by any coating method including spraying, scraping or spin coating; after coating, high temperature curing or ultraviolet curing is adopted.

10. The method for preparing an aircraft functional window according to claim 1, characterized in that: In step S7: the heating temperature of the hot bending molding is 105-110°C, and the heating time is 30-90 minutes, so that the PC substrate is softened, and the softened PC substrate is transferred to the customized mold, and the mold is removed after cooling to room temperature to obtain a substrate with a curved surface shape.

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