A chemical plating solution processing technology for chemical nickel-palladium-gold plating of semiconductors

Abstract

The present invention belongs to the field of semiconductor processing technology, and in particular discloses a chemical plating solution processing technology applied to semiconductor chemical nickel-palladium-gold plating, comprising two bottom plates arranged in parallel, a solution frame arranged between the two bottom plates, a chemical plating solution in two placement slots of the solution frame, a support plate fixed to the top of the bottom plate by a support rod, and a top block fixed to the top of the support plate, a placement rack arranged on the top of the solution frame, the placement rack correspondingly placed on the top of a plurality of top blocks, and a triangular groove arranged on the top surface of the top block. The present invention uses a lifting component to drive the lifting plate and semiconductor materials to move inside the placement rack through a slide, so that the lifting plate drives the semiconductor materials to move smoothly on the top of the solution frame, thereby preventing the semiconductor materials from shaking arbitrarily during the movement, preventing the chemical plating solution remaining on the surface of the semiconductor materials from arbitrarily sputtering, protecting the surrounding environment, and avoiding the waste of chemical plating solution.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a chemical plating solution processing technology applied to semiconductor chemical nickel-palladium-gold plating. Background Art

[0002] Chemical plating, also known as electroless plating or autocatalytic plating, is a plating method that uses a suitable reducing agent to reduce metal ions in the plating solution into metal and deposit them on the surface of the part without an external current.

[0003] The semiconductor material is rapidly deposited and moved in the chemical plating solution by a robotic arm, so that the chemical plating solution is randomly sputtered and the chemical plating solution is wasted.

[0004] Therefore, it is necessary to invent a chemical plating solution processing technology applied to semiconductor chemical nickel palladium gold plating to solve the above problems. Summary of the invention

[0005] In view of the above problems, the present invention provides a chemical plating solution processing technology applied to semiconductor chemical nickel-palladium-gold plating to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a chemical plating solution processing technology applied to semiconductor chemical nickel-palladium-gold plating, comprising two bottom plates arranged in parallel, a solution frame arranged between the two bottom plates, a chemical plating solution in two placement grooves of the solution frame, a support plate fixed to the top of the bottom plate by a support rod, and a top block fixed to the top of the support plate, a placement rack arranged on the top of the solution frame, the placement rack correspondingly placed on the top of a plurality of top blocks, a triangular groove arranged on the top surface of the top block, and a wedge corresponding to the triangular groove arranged on the bottom surface of the placement rack, pull plates arranged on both sides of the top surface of the placement rack, and the placement rack is connected to the output end of the control component by the pull plates, and the control component controls the placement rack to move up and down by the pull plates, The control component controls the placement rack to move horizontally on the top of the solution frame, side panels are provided on both sides of the top surface of the placement rack, the two side panels are arranged opposite to each other, a transverse groove is provided at the center of the side panel, a slide plate is inserted into the transverse groove, a slider is fixed at the outer end of the slide plate, a slide rack is provided between the two side panels, the bottoms of the two side surfaces of the slide rack are respectively connected to the inner ends of the two slide plates, the bottom surface of the slide rack and the bottom surface of the slider are both in contact with the top surface of the placement rack, a lifting plate is provided on the inside of the slide rack, and a lifting component for controlling the lifting plate to move up and down is provided on the inside of the slide rack, a vertical groove is provided at the center of the lifting plate, and a cross bar is rotatably connected to the bottom of the vertical groove, a plurality of support bars are fixed to the outer side surface of the circumference of the cross bar, and the top of the semiconductor material is hung on the surface of the plurality of support bars through the through hole;

[0007] The processing technology comprises the following steps:

[0008] S1. The semiconductor material is hung on the surface of multiple branches of the crossbar through the through holes. The control component uses the pull plate to place the placement rack on the top of the solution frame, and the placement rack uses the wedge block to correspond to the triangular groove of the top block;

[0009] S2. The lifting component moves the lifting plate downward, and the downwardly moved lifting plate uses the support bars on the surface of the crossbar to move the semiconductor material downward to the inside of the placement groove of the solution frame, and the chemical plating solution inside the placement groove performs coating processing on the semiconductor material.

[0010] Furthermore, two ring plates are fixed on the outer side of the circumference of the crossbar, and the two ring plates are respectively located on both sides of the lifting plate. Nuts are spirally sleeved on the surfaces of the ring plates, and the inner sides of the nuts are in contact with the side surfaces of the lifting plate.

[0011] Furthermore, an arc-shaped portion is provided at the outer end of the support bar, and the horizontal plane where the end surface of the arc-shaped portion is located is higher than the horizontal plane where the center line of the support bar is located.

[0012] Furthermore, a slide groove is provided at the center of the top surface of the placement rack, and an inner rod is provided at the center of the slide groove, and the lifting plate is slidably matched with the inner rod by means of a vertical groove.

[0013] Furthermore, the lifting component includes a top plate, the top of the lifting plate is fixedly connected to the bottom surface of the top plate, a rotating rod is arranged on the top inner side of the slide, the rotating rod passes through the slide correspondingly, and both ends of the rotating rod have inherent round blocks, and the rotating rod is connected to the output end of the motor by means of the round blocks, and the top surface of the top plate is connected to the rotating rod by means of a winding strip, and when the rotating rotating rod reels in the winding strip, the winding strip pulls the top plate and the lifting plate up.

[0014] Furthermore, the lifting component also includes two vertical plates arranged opposite to each other, both inner side walls of the slide are provided with inner grooves, the outer ends of the vertical plates are located inside the inner grooves, the inner sides of the vertical plates are provided with square and round rods, the inner ends of the square and round rods are movably inserted into the end parts of the top plates, the outer ends of the square and round rods are fixed with connecting blocks, the outer ends of the connecting blocks are fixed with vertical bars, and the inner side surfaces of the vertical plates are provided with bar grooves corresponding to the vertical bars.

[0015] Furthermore, a rotating sleeve is provided on the outer side of the vertical plate, and a clamping rod is provided on the bottom of the outer side surface of the vertical plate. The rotating sleeve is rotatably sleeved on the surface of the clamping rod. A screw rod is connected to the outer end of the rotating sleeve. The screw rod spirally penetrates the slide plate and the sliding block. A side rod penetrating the slide frame is fixed to the top of the outer side surface of the vertical plate.

[0016] Furthermore, a spring is sleeved on the surface of the square rod, the inner end of the spring is connected to the end of the top plate, and the outer end of the spring is connected to the inner side of the connecting block, and the spring is in a compressed state.

[0017] Technical effects and advantages of the present invention:

[0018] 1. The present invention uses a lifting component to drive the lifting plate and the semiconductor material to move inside the placement frame through the slide, so that the lifting plate drives the semiconductor material to move smoothly on the top of the solution frame, thereby preventing the semiconductor material from shaking during the movement and preventing the chemical plating solution remaining on the surface of the semiconductor material from sputtering. While protecting the surrounding environment, it can also avoid the waste of chemical plating solution.

[0019] 2. The present invention adjusts the relative distance between the vertical plate and the top plate in real time through the spiral cooperation between the screw rod and the slide plate, which facilitates fixing the top plate between the two vertical plates and ensures the stability of the top plate and the lifting plate on the inner side of the placement groove.

[0020] 3. The present invention gradually moves the nut away from the lifting plate by screwing the nut, and drives the cross bar to rotate inside the vertical groove of the lifting plate through the support bar. At this time, the support bar gradually tilts, and the semiconductor material moves down on the inclined support bar surface using the through hole, which facilitates the semiconductor material to quickly detach from the support bar. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of chemical plating solution processing components used in semiconductor chemical nickel-palladium-gold plating according to an embodiment of the present invention;

[0022] Figure 2 is an overall schematic diagram of a solution frame according to an embodiment of the present invention;

[0023] Figure 3 Schematic diagram of the cooperation between the lifting plate and the cross bar in an embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of the inner part of the slide according to an embodiment of the present invention;

[0025] Figure 5 The embodiment of the present invention Figure 4 A magnified view of the structure of part A;

[0026] In the figure: 1, bottom plate; 2, solution frame; 3, placement groove; 4, support plate; 5, top block; 6, placement rack; 7, pull plate; 8, side plate; 9, slide plate; 10, slider; 11, slide rack; 12, lifting plate; 13, cross bar; 14, support bar; 15, ring plate; 16, nut; 17, inner rod; 18, top plate; 19, rotating rod; 20, rolling bar; 21, vertical plate; 22, inner groove; 23, square and round rod; 24, connecting block; 25, vertical bar; 26, bar groove; 27, rotating sleeve; 28, screw; 29, side rod; 30, spring. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0028] The present invention provides a chemical plating solution processing technology for chemical nickel-palladium-gold plating of semiconductors, such as Figures 1 to 4 As shown, it includes two bottom plates 1 arranged in parallel, a solution frame 2 is arranged between the two bottom plates 1, the chemical plating solution is in the two placement grooves 3 of the solution frame 2, a support plate 4 is fixed to the top of the bottom plate 1 by a support rod, and a top block 5 is fixed to the top of the support plate 4, a placement rack 6 is arranged on the top of the solution frame 2, the placement rack 6 is correspondingly placed on the top of multiple top blocks 5, the top surface of the top block 5 is provided with a triangular groove, and the bottom surface of the placement rack 6 is provided with a wedge corresponding to the triangular groove, pull plates 7 are arranged on both sides of the top surface of the placement rack 6, and the placement rack 6 is connected to the output end of the control component by the pull plate 7, the control component controls the placement rack 6 to move up and down by the pull plate 7, and the control component controls the placement rack 6 to move horizontally on the top of the solution frame 2. Among them, the control component is a manipulator that controls the up and down and horizontal movement of the placement rack 6 in the prior art. After the control component places the placement rack 6 on the top of multiple top blocks 5, the placement rack 6 is buckled in the triangular groove of the top block 5 using a wedge block. The wedge block and the triangular groove are buckled together to make the placement rack 6 stably placed on the top of the top block 5, thereby preventing the placement rack 6 controlled by the control component from shaking at will on the top of the solution frame 2.

[0029] Side plates 8 are provided on both sides of the top surface of the placement rack 6. The two side plates 8 are arranged opposite to each other. A transverse groove is provided at the center of the side plates 8. A slide plate 9 is inserted inside the transverse groove. A slider 10 is fixed to the outer end of the slider 9. A slide 11 is provided between the two side plates 8. The bottom of the two sides of the slide 11 are respectively connected to the inner ends of the two slide plates 9. The bottom of the slide 11 and the bottom of the slider 10 are both in contact with the top surface of the placement rack 6. A lifting plate 12 is provided on the inner side of the slide 11, and a lifting component for controlling the up and down movement of the lifting plate 12 is provided on the inner side of the slide 11. A vertical groove is provided at the center of the lifting plate 12, and a cross bar 13 is rotatably connected to the bottom of the vertical groove. Multiple support bars 14 are fixed on the outer side of the circumference of the cross bar 13, and the top of the semiconductor material is hung on the surface of multiple support bars 14 through a through hole. A slide groove is provided at the center of the top surface of the placement rack 6, and an inner rod 17 is provided at the center of the slide groove. The lifting plate 12 slides with the inner rod 17 using the vertical groove. The lifting component controls the lifting plate 12 to move downward, and the lifting plate 12 that moves downward uses the support bar 14 on the surface of the cross bar 13 to drive the semiconductor material to move to the inside of the placement slot 3 of the solution frame 2, and the lifting plate 12 uses the vertical groove to move downward on the surface of the inner rod 17. After the semiconductor material is immersed in the chemical plating solution for a period of time, the lifting component uses the lifting plate 12 to drive the semiconductor material to move upward until the semiconductor material moves to the top of the solution frame 2. Push the slide 11 to move, the slide 11 drives the slide plate 9 to slide inside the cross groove of the side plate 8, and the slider 10 at the outer end of the slide plate 9 limits the slide plate 9 to prevent the slide 11 from deviating between the two side plates 8. The moving slide 11 drives the lifting plate 12 and the semiconductor material to move synchronously through the lifting component, and the lifting plate 12 uses the vertical groove to slide horizontally on the surface of the inner rod 17 until the semiconductor material moves to the top of another placement slot 3 of the solution frame 2, which is convenient for the semiconductor material to be immersed again.

[0030] When the slide 11 uses the lifting components to drive the lifting plate 12 and the semiconductor material to move inside the placement rack 6, the lifting plate 12 drives the semiconductor material to move smoothly on the top of the solution frame 2, thereby preventing the semiconductor material from shaking at will during the movement, preventing the chemical plating solution remaining on the surface of the semiconductor material from sputtering at will, protecting the surrounding environment, and avoiding the waste of chemical plating solution.

[0031] The processing technology comprises the following steps:

[0032] S1. The semiconductor material is hung on the surface of the plurality of branches 14 of the crossbar 13 through the through hole, and the control component uses the pull plate 7 to place the placement rack 6 on the top of the solution frame 2, and the placement rack 6 uses the wedge block to correspond to the triangular groove of the top block 5;

[0033] S2, the lifting component moves the lifting plate 12 downward, and the downwardly moved lifting plate 12 uses the support bars 14 on the surface of the cross bar 13 to move the semiconductor material downward to the inside of the placement groove 3 of the solution frame 2, and the chemical plating solution inside the placement groove 3 performs coating processing on the semiconductor material.

[0034] exist Figure 3 In the embodiment, two ring plates 15 are fixed to the outer side of the circumference of the cross bar 13, and the two ring plates 15 are respectively located on both sides of the lifting plate 12, and a nut 16 is spirally sleeved on the surface of the ring plate 15, and the inner side of the nut 16 is in contact with the side of the lifting plate 12. When the nut 16 is screwed, the spiral fit between the nut 16 and the ring plate 15 makes the inner side of the nut 16 closely fit with the side of the lifting plate 12, and the static friction between the nut 16 and the lifting plate 12 limits the ring plate 15, and the ring plate 15 is used to limit the cross bar 13, so as to prevent the cross bar 13 from rotating inside the vertical slot of the lifting plate 12, so that the support bar 14 is in a horizontal state.

[0035] The outer end of the support bar 14 is provided with an arc portion, and the horizontal plane where the end surface of the arc portion is located is higher than the horizontal plane where the center line of the support bar 14 is located. The semiconductor material passes through the through hole corresponding to the arc portion at the end of the support bar 14 until the through hole of the semiconductor material is sleeved on the surface of the support bar 14 by the arc portion. The support bar 14 in a horizontal state uses the arc portion to limit the semiconductor material. When the slide 11 uses the lifting component to drive the semiconductor material on both sides of the lifting plate 12 to move, the semiconductor material is prevented from being separated from the surface of the support bar 14.

[0036] Loosen the nut 16, the nut 16 gradually moves away from the lifting plate 12, and drives the cross bar 13 to rotate inside the vertical groove of the lifting plate 12 through the support bar 14. At this time, the support bar 14 gradually tilts, and the semiconductor material moves down on the surface of the inclined support bar 14 using the through hole, which facilitates the semiconductor material to quickly detach from the support bar 14.

[0037] exist Figure 1 and Figure 4 In the embodiment, the lifting component includes a top plate 18, the top of the lifting plate 12 is fixedly connected to the bottom of the top plate 18, a rotating rod 19 is arranged on the top of the inner side of the slide 11, the rotating rod 19 passes through the slide 11, and both ends of the rotating rod 19 have inherent round blocks, and the rotating rod 19 is connected to the output end of the motor by the round blocks, and the top surface of the top plate 18 is connected to the rotating rod 19 by the winding strip 20, when the rotating rotating rod 19 reels the winding strip 20, the winding strip 20 pulls the top plate 18 and the lifting plate 12 to move upward. Start the motor, the motor output end makes the round block drive the rotating rod 19 to rotate, the rotating rotating rod 19 gradually reels the winding strip 20 inside the slide 11, and the winding strip 20 gradually pulls the top plate 18 and the lifting plate 12 upward during the reeling process, and the lifting plate 12 that moves upward moves on the surface of the inner rod 17 by the vertical groove. The motor output end causes the round block to drive the rotating rod 19 to rotate in the opposite direction. At this time, the top plate 18 and the lifting plate 12 move down on the inner side of the slide 11 due to their own weight. The downwardly moved top plate 18 pulls the coil 20 out from the surface of the rotating rod 19. At this time, the lifting plate 12 moves down on the surface of the inner rod 17 using the vertical groove.

[0038] exist Figure 4 and Figure 5In the embodiment, the lifting component further comprises two vertical plates 21 arranged opposite to each other, both inner side walls of the slide 11 are provided with inner grooves 22, the outer ends of the vertical plates 21 are located inside the inner grooves 22, the inner side of the vertical plates 21 are provided with square rods 23, the inner ends of the square rods 23 are movably plugged into the end of the top plate 18, the outer ends of the square rods 23 are fixed with connecting blocks 24, the outer ends of the connecting blocks 24 are fixed with vertical bars 25, and the inner side of the vertical plates 21 is provided with bar grooves 26 corresponding to the vertical bars 25. When the top plate 18 moves up and down, the top plate 18 drives the vertical bars 25 at the outer side of the connecting blocks 24 to move up and down inside the bar grooves 26 of the vertical plates 21 by using the square rods 23, and the vertical plates 21 limit the vertical bars 25 by using the bar grooves 26, so that the vertical bars 25 are always in a vertical state, and the vertical bars 25 in the vertical state use the square rods 23 to make the lifting plate 12 at the bottom of the top plate 18 vertically arranged, so as to avoid the lifting plate 12 from being offset or tilted during the process of moving up and down.

[0039] The outer side of the vertical plate 21 is provided with a rotating sleeve 27, and the bottom of the outer side of the vertical plate 21 is provided with a clamping rod, the rotating sleeve 27 is rotatably sleeved on the surface of the clamping rod, the outer end of the rotating sleeve 27 is connected with a screw rod 28, the screw rod 28 spirally penetrates the slide plate 9 and the slider 10, and the top of the outer side of the vertical plate 21 is fixed with a side rod 29 that penetrates the slide 11. The surface of the square rod 23 is sleeved with a spring 30, the inner end of the spring 30 is connected to the end of the top plate 18, and the outer end of the spring 30 is connected to the inner side of the connecting block 24, and the spring 30 is in a compressed state. The screw rod 28 is turned and rotated at the center of the slide plate 9 and the slider 10. The spiral cooperation between the screw rod 28 and the slide plate 9 makes the rotating sleeve 27 at the inner end of the screw rod 28 drive the vertical plate 21 close to the top plate 18. The rotating screw rod 28 rotates on the surface of the clamping rod on the outer side of the vertical plate 21 by the rotating sleeve 27. When the vertical plate 21 moves, the vertical plate 21 pulls the side rod 29 into the inner side of the slide 11. The side rod 29 limits the top of the vertical plate 21, and the rotating sleeve 27 limits the bottom of the vertical plate 21 by the clamping rod to prevent the vertical plate 21 from tilting. The vertical plate 21 close to the top plate 18 drives the connecting block 24 to move synchronously, and the connecting block 24 drives the square rod 23 to be inserted into the top plate 18, and the vertical plate 21 close to the top plate 18 cooperates with the spring 30 that squeezes the surface of the square rod 23. The elastic force of the spring 30 makes the outer end of the vertical bar 25 fit tightly with the inner wall of the bar groove 26 until the vertical plate 21 can no longer move close to the top plate 18. At this time, the vertical plate 21 uses the connecting block 24 and the elastic force of the spring 30 to clamp the top plate 18 to prevent the top plate 18 from shaking up and down between the two vertical plates 21, so as to facilitate the semiconductor material at the bottom of the lifting plate 12 to be stably placed in the placement groove 3, so that the semiconductor material is fully plated on the inner side of the placement groove 3.

[0040] The relative distance between the vertical plate 21 and the top plate 18 can be adjusted in real time by the spiral cooperation between the screw rod 28 and the slide plate 9, so as to facilitate fixing the top plate 18 between the two vertical plates 21 and ensure the stability of the top plate 18 and the lifting plate 12 inside the placement groove 3.

[0041] Working principle of the present invention:

[0042] Reference Figures 1 to 5 As shown, after the control component places the placement rack 6 on the top of the plurality of top blocks 5, the placement rack 6 is buckled in the triangular groove of the top block 5 by the wedge block, and the wedge block and the triangular groove are buckled to stably place the placement rack 6 on the top of the top block 5. When the nut 16 is screwed, the spiral fit between the nut 16 and the ring plate 15 makes the inner side of the nut 16 fit tightly with the side of the lifting plate 12, and the static friction between the nut 16 and the lifting plate 12 limits the ring plate 15, and the ring plate 15 is used to limit the cross bar 13, so that the cross bar 13 is prevented from rotating inside the vertical groove of the lifting plate 12, so that the support bar 14 is in a horizontal state, and the semiconductor material passes through the through hole to correspond to the arc portion at the end of the support bar 14, until the through hole of the semiconductor material is sleeved on the surface of the support bar 14 by the arc portion, and the support bar 14 in a horizontal state limits the semiconductor material by the arc portion.

[0043] The motor is started, and the motor output end causes the round block to drive the rotating rod 19 to rotate. The rotating rotating rod 19 gradually reels the roll strip 20 inside the carriage 11. During the reeling process, the roll strip 20 gradually pulls the top plate 18 and the lifting plate 12 upward, and the lifting plate 12 that moves upward uses the vertical groove to move upward on the surface of the inner rod 17. The motor output end causes the round block to drive the rotating rod 19 to rotate in the opposite direction. At this time, the top plate 18 and the lifting plate 12 move downward on the inner side of the carriage 11 due to their own weight. The downwardly moving top plate 18 pulls the roll strip 20 out of the rotating rod 19 surface, and the lifting plate 12 moves downward on the surface of the inner rod 17 using the vertical groove.

[0044] When the lifting plate 12 moves downward, the lifting plate 12 moves downward using the support bar 14 on the surface of the cross bar 13 to drive the semiconductor material to move into the placement slot 3 of the solution frame 2, and the lifting plate 12 moves downward on the surface of the inner rod 17 using the vertical groove. After the semiconductor material is immersed in the chemical plating solution for a period of time, the lifting component uses the lifting plate 12 to drive the semiconductor material to move upward until the semiconductor material moves to the top of the solution frame 2. The slide 11 is pushed to move, and the slide 11 drives the slide plate 9 to slide inside the cross groove of the side plate 8, and the slider 10 at the outer end of the slide plate 9 limits the slide plate 9 to prevent the slide 11 from deviating between the two side plates 8. The moving slide 11 drives the lifting plate 12 and the semiconductor material to move synchronously through the lifting component, and the lifting plate 12 slides horizontally on the surface of the inner rod 17 using the vertical groove until the semiconductor material moves to the top of another placement slot 3 of the solution frame 2, so as to facilitate the semiconductor material to be immersed again.

[0045] When the slide 11 uses the lifting components to drive the lifting plate 12 and the semiconductor material to move inside the placement rack 6, the lifting plate 12 drives the semiconductor material to move smoothly on the top of the solution frame 2, thereby preventing the semiconductor material from shaking at will during the movement, preventing the chemical plating solution remaining on the surface of the semiconductor material from sputtering at will, protecting the surrounding environment, and avoiding the waste of chemical plating solution.

[0046] The screw rod 28 is turned and rotated at the center of the slide plate 9 and the slider 10. The spiral cooperation between the screw rod 28 and the slide plate 9 makes the rotating sleeve 27 at the inner end of the screw rod 28 drive the vertical plate 21 close to the top plate 18. The rotating screw rod 28 rotates on the surface of the clamping rod on the outer side of the vertical plate 21 by the rotating sleeve 27. When the vertical plate 21 moves, the vertical plate 21 pulls the side rod 29 into the inner side of the slide 11. The side rod 29 limits the top of the vertical plate 21, and the rotating sleeve 27 limits the bottom of the vertical plate 21 by the clamping rod to prevent the vertical plate 21 from tilting. The vertical plate 21 close to the top plate 18 drives the connecting block 24 to move synchronously, and the connecting block 24 drives the square rod 23 to be inserted into the top plate 18, and the vertical plate 21 close to the top plate 18 cooperates with the spring 30 that squeezes the surface of the square rod 23. The elastic force of the spring 30 makes the outer end of the vertical bar 25 fit tightly with the inner wall of the bar groove 26 until the vertical plate 21 can no longer move close to the top plate 18. At this time, the vertical plate 21 uses the connecting block 24 and the elastic force of the spring 30 to clamp the top plate 18 to prevent the top plate 18 from shaking up and down between the two vertical plates 21, so as to facilitate the semiconductor material at the bottom of the lifting plate 12 to be stably placed in the placement groove 3, so that the semiconductor material is fully plated on the inner side of the placement groove 3.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them.

Claims

1. A chemical plating solution processing technology for semiconductor chemical nickel-palladium-gold plating, comprising two parallel bottom plates (1), a solution frame (2) is arranged between the two bottom plates (1), the chemical plating solution is in two placement grooves (3) of the solution frame (2), a support plate (4) is fixed on the top of the bottom plate (1) by a support rod, and a top block (5) is fixed on the top of the support plate (4), characterized in that: A placement rack (6) is arranged on the top of the solution frame (2), and the placement rack (6) is placed on the top of a plurality of top blocks (5) correspondingly, and a triangular groove is arranged on the top surface of the top block (5), and a wedge block corresponding to the triangular groove is arranged on the bottom surface of the placement rack (6), and a pull plate (7) is arranged on both sides of the top surface of the placement rack (6), and the placement rack (6) is connected to the output end of the control component by means of the pull plate (7), and the control component controls the placement rack (6) to move up and down by means of the pull plate (7), and the control component controls the placement rack (6) to move horizontally on the top of the solution frame (2), and side plates (8) are arranged on both sides of the top surface of the placement rack (6), and the two side plates (8) are arranged oppositely, and a transverse groove is arranged at the center of the side plate (8), and a plug is inserted into the inside of the transverse groove. A slide plate (9) is connected, a slider (10) is fixed to the outer end of the slide plate (9), a slide frame (11) is arranged between the two side plates (8), the bottoms of the two side surfaces of the slide frame (11) are respectively connected to the inner ends of the two slide plates (9), the bottom surface of the slide frame (11) and the bottom surface of the slider (10) are both in contact with the top surface of the placement frame (6), a lifting plate (12) is arranged on the inner side of the slide frame (11), and a lifting component for controlling the lifting plate (12) to move up and down is arranged on the inner side of the slide frame (11), a vertical groove is arranged at the center of the lifting plate (12), and a cross bar (13) is rotatably connected to the bottom of the vertical groove, a plurality of support bars (14) are fixed to the outer side surface of the circumference of the cross bar (13), and the top of the semiconductor material is hung on the surface of the plurality of support bars (14) through a through hole; Two ring plates (15) are fixed on the outer circumferential side of the cross bar (13), and the two ring plates (15) are respectively located on both sides of the lifting plate (12), and a nut (16) is spirally sleeved on the surface of the ring plate (15), and the inner side of the nut (16) is in contact with the side of the lifting plate (12); The lifting component comprises a top plate (18), and the lifting component also comprises two vertical plates (21) arranged opposite to each other. Both inner side walls of the slide frame (11) are provided with inner grooves (22), and the outer ends of the vertical plates (21) are located inside the inner grooves (22). The inner side of the vertical plates (21) is provided with square rods (23), and the inner ends of the square rods (23) are movably plugged into the end of the top plate (18). The outer ends of the square rods (23) are fixed with connecting blocks (24), and the outer ends of the connecting blocks (24) are fixed with vertical bars (25), and the inner side surfaces of the vertical plates (21) are provided with bar grooves (26) corresponding to the vertical bars (25); A rotating sleeve (27) is arranged on the outer side of the vertical plate (21), and a clamping rod is arranged on the bottom of the outer side surface of the vertical plate (21). The rotating sleeve (27) is rotatably sleeved on the surface of the clamping rod. A screw rod (28) is connected to the outer end of the rotating sleeve (27). The screw rod (28) spirally penetrates the slide plate (9) and the slide block (10). A side rod (29) penetrating the slide frame (11) is fixed to the top of the outer side surface of the vertical plate (21); a spring (30) is sleeved on the surface of the square and round rod (23), the inner end of the spring (30) is connected to the end of the top plate (18), the outer end of the spring (30) is connected to the inner side surface of the connecting block (24), and the spring (30) is in a compressed state; The processing technology comprises the following steps: S1. The semiconductor material is hung on the surface of the plurality of branches (14) of the crossbar (13) through the through hole, and the control component uses the pull plate (7) to place the placement rack (6) on the top of the solution frame (2), and the placement rack (6) uses the wedge block to correspond to the triangular groove of the top block (5); S2, the lifting component causes the lifting plate (12) to move downward, and the lowered lifting plate (12) uses the support bars (14) on the surface of the cross bar (13) to move the semiconductor material downward to the inside of the placement groove (3) of the solution frame (2), and the chemical plating solution inside the placement groove (3) performs coating processing on the semiconductor material.

2. The chemical plating solution processing technology for chemical nickel-palladium-gold plating of semiconductors according to claim 1, characterized in that: The outer end of the support bar (14) is provided with an arc-shaped portion, and the horizontal plane where the end surface of the arc-shaped portion is located is higher than the horizontal plane where the center line of the support bar (14) is located.

3. The chemical plating solution processing technology for chemical nickel-palladium-gold plating of semiconductors according to claim 1, characterized in that: A slide groove is arranged at the center of the top surface of the placement rack (6), and an inner rod (17) is arranged at the center of the slide groove. The lifting plate (12) is slidably matched with the inner rod (17) by means of a vertical groove.

4. The chemical plating solution processing technology for chemical nickel-palladium-gold plating of semiconductors according to claim 1, characterized in that: The top of the lifting plate (12) is fixedly connected to the bottom surface of the top plate (18), and a rotating rod (19) is arranged at the top of the inner side of the slide (11). The rotating rod (19) passes through the slide (11) correspondingly, and both ends of the rotating rod (19) have inherent round blocks, and the rotating rod (19) is connected to the output end of the motor by means of the round blocks. The top surface of the top plate (18) is connected to the rotating rod (19) by means of a winding strip (20). When the rotating rotating rod (19) reels the winding strip (20), the winding strip (20) pulls the top plate (18) and the lifting plate (12) upward.

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