A semiconductor-grade high-sealing pressure reducing valve and sealing structure

Abstract

The present invention discloses a semiconductor-grade high-sealing pressure reducing valve and a sealing structure, which relates to the technical field of semiconductor manufacturing production line parts, and solves the problem that the sealing effect of the processing hole of the existing pressure reducing valve is not good and the sealing failure of the pressure reducing valve is easily caused by wrong operation. A pressure reducing valve includes: a valve body, a sealing gasket, a sealing component, a first C-type sealing ring, a truncated cone bolt, and a second C-type sealing ring, wherein a processing hole is opened at the bottom of the valve body, and the processing hole includes a hole to be sealed and a fluid channel; the sealing gasket is located in the hole to be sealed; the sealing component is used to cooperate with the thread of the hole to be sealed to seal the hole to be sealed; the first C-type sealing ring is coaxially arranged between the sealing gasket and the sealing component with the internal thread through hole; the truncated cone bolt is threadedly matched with the sealing component; the second C-type sealing ring abuts on the sealing component and the sealing gasket, and its inner ring surface abuts on the outer ring surface of the first C-type sealing ring, and the sealing structure includes: a sealing component, a first C-type sealing ring, a truncated cone bolt, and a second C-type sealing ring.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing production line parts, and in particular to a semiconductor-grade high-sealing pressure reducing valve and a sealing structure. Background Art

[0002] Semiconductor-grade pressure reducing valves require a funnel-shaped through hole at the bottom of the valve body that is engaged with the valve needle. When opening this through hole, it is usually necessary to open a processing hole from the bottom to the top at the bottom of the valve body, and then seal it. In order to avoid leakage of the pressure reducing valve, it is necessary to block this processing hole, and it does not need to be opened again in the future. In this way, compared with other diaphragm valves, the pressure reducing valve has the risk of leakage from the processing hole. During transportation and operation, it is also necessary to prevent the processing personnel from opening it by mistake and configure it to be unopenable or difficult to open. In the traditional sealing method, only the bolts are screwed into the above-mentioned processing holes, and they are sealed and cannot be disassembled by gluing and welding. However, the above method is not only undetachable and cannot be repaired, but also because the particles at the thread will penetrate into the valve body, causing the particles to exceed the standard, and cannot meet the semiconductor-grade ultra-clean requirements. Therefore, there is a need for a high-sealing pressure reducing valve with good sealing effect and cannot be opened or opened easily. Summary of the invention

[0003] The purpose of the present invention is to provide a semiconductor-grade high-sealing pressure reducing valve and a sealing structure to solve the problem that the sealing effect of the processing hole of the existing semiconductor-grade high-sealing pressure reducing valve is poor and the sealing failure of the semiconductor-grade high-sealing pressure reducing valve is easily caused by incorrect operation.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] A semiconductor-grade high-sealing pressure reducing valve, comprising:

[0006] A valve body, wherein a processing hole is opened at the bottom of the valve body, the processing hole includes a hole to be sealed and a fluid channel, the hole to be sealed is provided with an internal thread, the fluid channel is connected with the hole to be sealed when it is not sealed, and the connection between the hole to be sealed and the fluid channel of the valve body is blocked after sealing;

[0007] A sealing gasket is located in the hole to be sealed, and the sealing gasket is in sealing contact with a position at the bottom of the hole to be sealed close to the fluid channel to seal the fluid channel;

[0008] A sealing component, wherein the outer peripheral surface of the sealing component is provided with an external thread, and the sealing component is provided with an internal thread through hole along its axis, and the sealing component is matched with the thread of the hole to be sealed through the external thread;

[0009] A first C-shaped sealing ring, the first C-shaped sealing ring is located between the sealing pad and the sealing component, and the first C-shaped sealing ring is coaxially arranged with the internal threaded through hole;

[0010] A truncated cone bolt, the truncated cone bolt is threadedly matched with the internal threaded through hole, the truncated cone section of the truncated cone bolt is located between the sealing gasket and the first C-type sealing ring, the inclined surface of the truncated cone section is in contact with the side of the first C-type sealing ring away from the sealing component, and the truncated cone bolt is used to limit the axial position of the first C-type sealing ring;

[0011] The second C-type sealing ring is coaxially arranged on the outside of the first C-type sealing ring and respectively abuts against the sealing component and the sealing gasket, the inner ring surface of the second C-type sealing ring abuts against the outer ring surface of the first C-type sealing ring, and the outer ring surface of the second C-type sealing ring abuts against the inner wall of the hole to be sealed.

[0012] Compared with the prior art, in the semiconductor-grade high-sealing pressure reducing valve provided by the present invention, when sealing the hole to be sealed of the valve body, the first C-type ring is first placed coaxially with the sealing component on the sealing component, and then the conical bolt is screwed into the internal threaded through hole of the sealing component, so that the conical section of the conical bolt is clamped on the upper part of the first C-type sealing ring, and then the second C-type sealing ring is pushed into the hole to be sealed, so that the top of the ring abuts against the sealing gasket and its outer peripheral surface abuts against the valve body, and then the sealing component is screwed into the hole to be sealed, so that the outer ring surface of the first C-type sealing ring arranged on the sealing component abuts against the inner ring surface of the second C-type sealing ring. The second C-type sealing ring is then pressed against the first C-type sealing ring and the second C-type sealing ring is pressed against the second C-type sealing ring. And in the process of the cone bolt moving downward, the first C-type sealing ring applies an outward ejecting force to the sealing component, and the squeezed second C-type sealing ring is deformed and applies an outward ejecting force to the sealing component. The two forces will generate a pressure perpendicular to the thread on the threaded contact surface between the sealing component and the hole to be sealed, thereby increasing the friction between the threads and enhancing the self-locking force of the threads, making it difficult for the sealing component to be screwed out.

[0013] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure reducing valve, the valve body is further provided with a first annular protrusion, the first annular protrusion is arranged around the outer edge of the fluid channel, and the first annular protrusion is in close contact with the sealing gasket.

[0014] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure reducing valve, the valve body is also provided with a second annular protrusion, which is arranged on the side wall surface of the hole to be sealed and is located between the sealing gasket and the sealing component. The second annular protrusion gradually approaches the axis of the hole to be sealed in the direction from the sealing gasket to the sealing component. The second C-type sealing ring is fixedly arranged on the sealing component, and the lower part of the outer ring surface of the second C-type sealing ring contacts the inclined surface of the second annular protrusion.

[0015] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure reducing valve, the diameter of the annular cross-section of the second C-type sealing ring is greater than the diameter of the annular cross-section of the first C-type sealing ring.

[0016] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure-reducing valve, the outer ring surface of the second C-type sealing ring is provided with a clamping groove, the valve body is provided with a guide groove, and the guide groove is provided on the second annular protrusion, and the semiconductor-grade high-sealing pressure-reducing valve further includes:

[0017] A bayonet pin is disposed in the guide groove and is used to engage with the groove to limit the circumferential position of the second C-shaped sealing ring;

[0018] The elastic element is arranged in the guide groove, and the two ends of the elastic element are respectively in contact with the bayonet pin and the valve body, and the elastic element is used to apply an elastic force close to the second C-shaped sealing ring to the bayonet pin.

[0019] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure reducing valve, there are multiple card grooves, and the multiple card grooves are opened along a circle of the outer ring surface of the second C-type sealing ring; there are multiple guide grooves, and the multiple guide grooves are opened along a circle of the second annular protrusion corresponding to the multiple card grooves one by one.

[0020] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure reducing valve, the slot is a square blind hole, and the bayonet pin is a flat-head pin; or the slot is a through hole.

[0021] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure reducing valve, a first through hole is opened at the end of the truncated cone bolt away from the truncated cone section, and the cross-section of the first through hole perpendicular to its axis is a polygon. The first through hole is used to clamp a wrench to apply torque to the truncated cone bolt.

[0022] Optionally, in the above-mentioned semiconductor-grade high-sealing pressure reducing valve, a second through hole is opened at the end of the sealing component away from the sealing gasket, the second through hole is connected to the internal threaded through hole, the inscribed circle radius of the second through hole is larger than the inscribed circle radius of the internal threaded through hole, and the cross-section of the second through hole perpendicular to its axis is a polygon, which is used to clamp a wrench to apply torque to the sealing component.

[0023] The present invention also provides a sealing structure for being arranged in a processing hole of a semiconductor-grade high-sealing pressure reducing valve, the sealing structure comprising:

[0024] A sealing component, wherein the outer peripheral surface of the sealing component is provided with an external thread, and the sealing component is provided with an internal thread through hole along its axis, and the sealing component is used to cooperate with the thread of the hole to be sealed;

[0025] A first C-shaped sealing ring, the first C-shaped sealing ring and the internal threaded through hole are coaxially arranged on the sealing component;

[0026] A truncated cone bolt, the truncated cone bolt is threadedly matched with the internal threaded through hole, the inclined surface of the truncated cone section is in contact with the side of the first C-type sealing ring away from the sealing component, and the truncated cone bolt is used to limit the axial position of the first C-type sealing ring;

[0027] The second C-type sealing ring is coaxially arranged on the outside of the first C-type sealing ring, and the second C-type sealing ring is used to lean against the sealing gasket. The lower middle part of the inner ring surface of the second C-type sealing ring abuts against the upper middle part of the outer ring surface of the first C-type sealing ring, and the outer ring surface of the second C-type sealing ring abuts against the inner wall of the hole to be sealed.

[0028] Compared with the prior art, the beneficial effects of the sealing structure provided by the present invention have been mentioned in detail in the semiconductor-grade high-sealing pressure reducing valve described in the above technical solution, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0030] Figure 1 It is a front cross-sectional view of a semiconductor-grade high-sealing pressure reducing valve proposed in an embodiment of the present invention;

[0031] Figure 2 It is a main exploded view of a semiconductor-grade high-sealing pressure reducing valve proposed in an embodiment of the present invention;

[0032] Figure 3 A sectional perspective view of a semiconductor-grade high-sealing pressure reducing valve proposed in an embodiment of the present invention;

[0033] Figure 4 It is a three-dimensional cross-sectional exploded view of a semiconductor-grade high-sealing pressure reducing valve proposed in an embodiment of the present invention;

[0034] Figure 5 for Figure 1 A partial enlarged view of

[0035] Figure 6 for Figure 2 A partial enlarged view of .

[0036] Figure numerals: 1 is the valve body, 101 is the first annular protrusion, 2 is the processed hole, 201 is the hole to be sealed, 202 is the fluid channel, 3 is the sealing gasket, 4 is the sealing component, 401 is the internal threaded through hole, 5 is the first C-type sealing ring, 6 is the second C-type sealing ring, 7 is the truncated cone bolt, 71 is the truncated cone section, 102 is the second annular protrusion, 61 is the groove, 8 is the guide groove, 9 is the elastic element, 10 is the first through hole, 11 is the second through hole, 12 is the bayonet pin, and 13 is the valve needle. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0040] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] See also Figure 1 The semiconductor-grade high-sealing pressure reducing valve provided by the embodiment of the present invention comprises: a valve body 1, a sealing gasket 3, a sealing component 4, a first C-type sealing ring 5, a truncated cone bolt 7 and a second C-type sealing ring 6, wherein a processing hole 2 is opened at the bottom of the valve body 1, and the processing hole 2 comprises a hole to be sealed 201 and a fluid channel 202, the hole to be sealed 201 is provided with an internal thread, and the fluid channel 202 is connected with the hole to be sealed 201 when it is not sealed, and the connection between the hole to be sealed 201 and the fluid channel 202 is blocked after sealing; the sealing gasket 3 is located in the hole to be sealed 201, and the sealing gasket 3 is in sealing contact with the bottom of the hole to be sealed 201 near the fluid channel 202, so as to seal the fluid channel 202; the outer peripheral surface of the sealing component 4 is provided with an external thread, and the sealing component 4 is provided with an internal thread through hole 401 along its axis, and the sealing component 4 is through The external thread is threadedly matched with the hole 201 to be sealed; the first C-type sealing ring 5 is located between the sealing gasket 3 and the sealing component 4, and the first C-type sealing ring 5 is coaxially arranged with the internal threaded through hole 401; the truncated cone bolt 7 is threadedly matched with the internal threaded through hole 401, and the truncated cone section 71 of the truncated cone bolt 7 is located between the sealing gasket 3 and the first C-type sealing ring 5, and the inclined surface of the truncated cone section 71 is in contact with the side of the first C-type sealing ring 5 away from the sealing component 4, and the truncated cone bolt 7 is used to limit the first C-type sealing ring 5 in the up and down directions; the second C-type sealing ring 6 is coaxially arranged on the outside of the first C-type sealing ring 5, and is respectively abutted against the sealing component 4 and the sealing gasket 3, the inner ring surface of the second C-type sealing ring 6 is abutted against the outer ring surface of the first C-type sealing ring 5, and the outer ring surface of the second C-type sealing ring 6 is abutted against the inner wall of the hole 201 to be sealed.

[0043] For specific implementation: please refer to Figure 2When sealing the hole 201 to be sealed of the valve body 1, firstly, place the first C-type sealing ring 5 coaxially on the sealing component 4, then screw the conical bolt 7 into the internal threaded through hole 401 of the sealing component 4, so that the conical section 71 of the conical bolt 7 is clamped on the upper part of the first C-type sealing ring 5, then push the second C-type sealing ring 6 into the hole 201 to be sealed, so that the top thereof abuts against the sealing gasket 3, and the outer peripheral surface thereof abuts against the valve body 1, and then screw the sealing component 4 into the hole 201 to be sealed, so that the outer ring surface of the first C-type sealing ring 5 arranged on the sealing component 4 abuts against the inner ring surface of the second C-type sealing ring 6. At this time, the second C-type sealing ring 6 is respectively in contact with the sealing gasket 3 and the sealing component 4, the second C-type sealing ring 6 surrounds and contacts the first C-type sealing ring 5, the inner ring surface of the second C-type sealing ring 6 is clamped with the outer ring surface of the first C-type sealing ring 5, and the lower side of the truncated cone section 71 of the truncated cone bolt 7 is clamped with the upper part of the inner ring surface of the first C-type sealing ring 5. Therefore, when sealing and plugging the hole 201 to be sealed, the sealing component 4 is screwed into the hole 201 to be sealed, and the truncated cone bolt 7 is rotated downward. During the downward movement of the truncated cone bolt 7, the first C-type sealing ring 5 is squeezed and deformed by the truncated cone section 71 of the truncated cone bolt 7. Specifically, the first C-type sealing ring 5 is laterally widened by the downward pressure, thereby squeezing the second C-type sealing ring 6 toward the surrounding area. The second C-type sealing ring 6 is squeezed and deformed to squeeze the sealing gasket 3 upward, so that the sealing gasket 3 is close to the first annular protrusion 101, which plays a better sealing role, thereby enhancing the sealing of the semiconductor-grade high-sealing pressure reducing valve. And in the process of the cone bolt 7 moving downward, the first C-type sealing ring 5 gives the sealing component 4 an outward ejecting force, and the squeezed second C-type sealing ring 6 is deformed and gives the sealing component 4 an outward ejecting force. The two forces will generate a pressure perpendicular to the thread on the threaded contact surface between the sealing component 4 and the hole 201 to be sealed, thereby increasing the friction between the threads and enhancing the self-locking force of the threads, making it difficult for the sealing component 4 to be screwed out.

[0044] It should be noted that the processed hole 2 includes a hole to be sealed 201 and a fluid channel 202. The purpose of opening the processed hole 2 is to open a funnel-shaped through hole at the bottom of the valve body 1 that is engaged with the valve needle 13, wherein the hole to be sealed 201 is a specific cylindrical shape, and the inner wall is provided with threads, which provides a structural basis for subsequent sealing operations, and the diameter and depth of the hole to be sealed 201 are designed after precise calculations taking into account the fluid pressure, sealing performance, etc., so as to adapt to semiconductor-grade high-sealing pressure reducing valves and sealing components 4 of different specifications; the fluid channel 202 is connected to the hole to be sealed 201 when it is not sealed, and its cross-sectional shapes are: standard circle, ellipse, rectangle, etc. The cross-sectional shape of the fluid channel 202 is designed and optimized according to actual conditions to reduce the resistance and pressure loss during fluid flow. The elliptical cross-section can change the flow velocity distribution of the fluid to a certain extent. Due to the special shape of the fluid, the flow velocity of the fluid in the elliptical channel will be different in the major and minor axis directions, reducing the turbulence of the fluid, making the fluid flow relatively smoothly in the elliptical channel, and helping to reduce energy loss and noise during the fluid flow process; the fluid channel with a rectangular cross-section is relatively simple to manufacture and process, with low cost, and can provide a larger flow area, which can meet the higher fluid conveying requirements of some semiconductor-grade high-sealing pressure reducing valves with large flow rates. Moreover, the fluid channel with a rectangular cross-section can increase the contact area between the fluid and the channel wall to a certain extent, thereby improving the heat transfer efficiency. In some semiconductor-grade high-sealing pressure reducing valves that need to heat or cool the fluid, the fluid channel with a rectangular cross-section can better realize the heat exchange function.

[0045] As a possible implementation, Figure 5 or Figure 6 As shown, the valve body 1 is also provided with a first annular protrusion 101, which is arranged around the outer edge of the fluid channel 202, and the first annular protrusion 101 is in close contact with the sealing gasket 3. Firstly, the first annular protrusion 101 is arranged around the outer edge of the fluid channel 202, which enhances the sealing performance. Specifically, it provides additional sealing protection. The first annular protrusion 101 is arranged around the outer edge of the fluid channel 202, and is in close contact with the sealing gasket 3, forming an additional sealing defense line. When the semiconductor-level high-sealing pressure reducing valve is in working state, the fluid flows in the fluid channel 202, and the close contact between the first annular protrusion 101 and the sealing gasket 3 can effectively prevent the fluid from leaking from the contact point between the fluid channel 202 and the sealing gasket 3, thereby greatly improving the sealing performance of the semiconductor-level high-sealing pressure reducing valve. The above-mentioned arrangement makes the pressure distribution more uniform. During the operation of the semiconductor-grade high-sealing pressure reducing valve, the pressure of the fluid may impact the sealing gasket 3, and the first annular protrusion 101 can evenly disperse this pressure to various parts of the sealing gasket 3, thereby ensuring that the sealing gasket 3 is always in close fit with the valve body 1, further enhancing the sealing effect.

[0046] Secondly, the provision of the first annular protrusion 101 enhances the stability of the structure. Specifically, it can play a role in positioning the sealing gasket 3. When installing the sealing gasket 3, the first annular protrusion 101 can be used as a reference position to ensure that the sealing gasket 3 is accurately installed in the correct position on the valve body 1, thereby improving the assembly accuracy and structural stability of the semiconductor-level high-sealing pressure reducing valve. When the semiconductor-level high-sealing pressure reducing valve is subjected to internal fluid pressure or external impact, the first annular protrusion 101 can share part of the pressure, reduce the risk of deformation of the valve body 1, and improve the overall reliability of the semiconductor-level high-sealing pressure reducing valve.

[0047] Thirdly, the provision of the first annular protrusion 101 allows the squeezed sealing gasket 3 to better wrap the first annular protrusion 101 , thereby increasing the sealing area and thus improving the sealing performance.

[0048] In addition, the contact surface between the first annular protrusion 101 and the sealing gasket 3 can be located directly above, inside or outside the contact surface between the second C-shaped sealing ring 6 and the sealing gasket 3. That is, when it is directly above, there is no lateral force component, the extrusion force is the largest, and the sealing performance under large flow is the best. When it is on the inside or outside, the deformation of the sealing gasket 3 is greater, the sealing gasket 3 wraps the first annular protrusion 101 better, and the sealing performance and sealing life of small flow are better.

[0049] Furthermore, if Figure 5 or Figure 6As shown, the valve body 1 is further provided with a second annular protrusion 102, which is arranged on the side wall surface of the hole 201 to be sealed and is located between the sealing gasket 3 and the sealing component 4. The second annular protrusion 102 gradually approaches the axis of the hole 201 to be sealed in the direction from the sealing gasket 3 to the sealing component 4. The second C-type sealing ring 6 is fixedly arranged on the sealing component 4, and the lower part of the outer ring surface of the second C-type sealing ring 6 contacts the inclined surface of the second annular protrusion 102. That is, the second annular protrusion 102 is arranged on the side wall surface of the valve body 1 in the hole 201 to be sealed, and gradually approaches the axis of the hole 201 to be sealed in the direction from the sealing gasket 3 to the sealing component 4, which means that it is a structure protruding from the side wall of the valve body 1 toward the center direction of the hole 201 to be sealed, and it is inclined from top to bottom to approach the axis of the hole 201 to be sealed. On the one hand, such a design has certain advantages for the sealing effect: such an inclined design provides better pressure distribution and sealing effect for sealing. When the second C-type sealing ring 6 is squeezed and its outer circumference contacts the valve body 1 and the sealing gasket 3, the second C-type sealing ring 6 will deform along the inclined surface, thereby ensuring that its upper part contacts the sealing gasket 3 more fully, thereby improving the reliability of the seal, and the inclined surface can guide the pressure, so that the second C-type sealing ring 6 fits more closely in the sealing position, thereby enhancing the sealing performance; on the other hand, such a design also has a certain effect on preventing the sealing component 4 from being accidentally screwed out. Since the second C-type sealing ring 6 is fixed as one body with the sealing component 4, during installation, the sealing component 4 with the second C-type sealing ring 6 fixed thereto is pushed into the hole 201 to be sealed. The second C-type sealing ring 6 has a certain elasticity. Therefore, after installation, the outer circumference of the second C-type sealing ring contacts the inclined surface of the second annular protrusion 102, as shown in the figure. When the sealing component 4 is screwed out by mistake, the second C-shaped sealing ring 6 is limited by the second annular protrusion 102, so that the sealing component 4 is not easily screwed out, thereby increasing the reliability of the semiconductor-grade high-sealing pressure reducing valve.

[0050] As a possible implementation method, the annular cross-sectional diameter of the second C-type sealing ring 6 is greater than the annular cross-sectional diameter of the first C-type sealing ring 5. Since the annular cross-sectional diameter of the second C-type sealing ring 6 is greater than that of the first C-type sealing ring 5, after being installed in place, the second C-type sealing ring 6 can better surround the first C-type sealing ring 5 to form an interlaced sealing structure. When the fluid attempts to pass through the sealing part, it needs to pass through a more complex path, which increases the difficulty of leakage. The contact between the first C-type sealing ring 5 and the second C-type sealing ring 6 at different height positions can better adapt to pressure changes and possible deformations, and improve the reliability of the seal. And it has a certain effect on the stability of the structure. The squeezing of the middle and upper part of the first C-type sealing ring 5 on the middle and lower part of the second C-type sealing ring 6 not only enhances the sealing effect, but also forms mutual support in the structure. The squeezing force between the two sealing rings can share part of the external pressure and impact force, thereby improving the stability of the entire sealing structure. When the semiconductor-level high-sealing pressure reducing valve is subjected to vibration, impact or other external forces, this mutual support can reduce the displacement and deformation of the sealing ring and maintain the effectiveness of the seal.

[0051] Furthermore, a groove 61 is provided on the outer ring surface of the second C-type sealing ring 6, and a guide groove 8 is provided on the valve body 1, and the guide groove 8 is provided on the second annular protrusion 102. The semiconductor-grade high-sealing pressure reducing valve also includes: a bayonet 12 and an elastic element 9, wherein the bayonet 12 is arranged in the guide groove 8, and the bayonet 12 is used to engage with the bayonet 61 to limit the circumferential position of the second C-type sealing ring 6; the elastic element 9 is arranged in the guide groove 8, and the two ends of the elastic element 9 are respectively abutted against the bayonet 12 and the valve body 1, and the elastic element 9 is used to apply an elastic force close to the second C-type sealing ring 6 to the bayonet 12.

[0052] Further, the guide groove 8 may be a hemispherical shape matched with the bayonet pin 12, and used for circumferentially limiting the second C-type sealing ring 6, or the guide groove 8 may be a hemispherical groove opened in an annular shape, and used for vertically limiting the second C-type sealing ring 6. The shape of the hemispherical guide groove matches the shape of the bayonet pin 12 and other matching parts. When the bayonet pin 12 is placed in the hemispherical guide groove, due to the limitation of the hemispherical curved surface, the bayonet pin 12 can only move within a specific range to a certain extent. When the second C-type sealing ring 6 has a tendency to rotate circumferentially, the bayonet pin 12 will generate a corresponding movement tendency in the hemispherical guide groove. However, due to the curved surface limitation of the hemispherical guide groove, the movement of the bayonet 12 is constrained, thereby preventing the circumferential rotation of the sealing ring; when the guide groove 8 is a hemispherical groove opened in an annular shape, it provides a space for the bayonet 12 to be installed and moved. When the second C-type sealing ring 6 has a tendency to move upward or downward, the bayonet 12 will interact with the inner surface of the hemispherical groove and the second C-type sealing ring 6 to prevent the displacement of the second C-type sealing ring 6. For example, if the second C-type sealing ring 6 moves upward, the bayonet 12 will be pushed by the second C-type sealing ring 6 and move upward, but because the upper part of the hemispherical groove will block the bayonet 12 from continuing to move upward, the upward displacement of the second C-type sealing ring 6 is limited by the bayonet 12. Similarly, when the second C-type sealing ring 6 moves downward, the bayonet 12 will move downward in the hemispherical groove until it is blocked by the lower part of the hemispherical groove, thereby limiting the downward displacement of the second C-type sealing ring 6.

[0053] like Figure 5 or Figure 6As shown, specifically, a card groove 61 is provided on the outer ring surface of the second C-type sealing ring 6, which is used to cooperate with the card pin 12 to realize the card connection function, thereby enhancing the stability of the semiconductor-grade high-sealing pressure reducing valve; the guide groove 8 provided along the circumference of the hole 201 to be sealed provides an installation space for the card pin 12 and the elastic element 9, and plays a guiding role for the card pin 12, ensuring that the card pin 12 can move in a specific direction and card with the card groove 61 on the second C-type sealing ring 6; the elastic element 9 is arranged in the guide groove 8, which can apply an elastic force close to the card groove 61 to the card pin 12, and when the second C-type sealing ring 6 is installed, the elastic element 9 pushes the card pin 12 to card into the card groove 61, so that the sealing ring and the valve The connection between the two bodies 1 is tighter and more stable. At the same time, the elastic force of the elastic element 9 can also adapt to the deformation of the second C-type sealing ring 6 during the working process to a certain extent, and maintain the reliability of the clamping state; a bayonet 12 is arranged in the guide groove 8, and the function of the bayonet 12 is to clamp with the clamping groove 61, hinder the downward movement of the second C-type sealing ring 6, and prevent the sealing component 4 from being screwed out. Under the action of the elastic element 9, the bayonet 12 can be relatively firmly clamped into the clamping groove 61, which increases the anti-loosening ability of the sealing structure. At the same time, when installing or removing the sealing component 4, it is necessary to overcome the elastic force of the elastic element 9 to remove the bayonet 12 from the clamping groove 61 to ensure the reliability of the operation. Among them, the first C-type sealing ring 5 and the second C-type sealing ring 6 can be made of elastic metals such as iron, steel or titanium alloy.

[0054] The beneficial effects of such arrangement are as follows: first, the anti-screwing effect of the sealing component 4 is enhanced by the engagement of the bayonet 12 with the slot 61 and the action of the elastic element 9. As mentioned above, the engagement of the bayonet 12 with the slot 61 hinders the downward movement of the second C-type sealing ring 6, thereby preventing the sealing component 4 from being screwed out. Secondly, the presence of the elastic element 9 enables the sealing structure to adapt to a certain degree of dimensional change and deformation. For example, when the temperature or pressure changes, the second C-type sealing ring 6 may expand or contract. The elastic element 9 can adapt to such changes by adjusting the relative position of the bayonet 12 in the slot 61, ensuring that the bayonet 12 is always engaged in the slot 61. Finally, although the bayonet 12 and the elastic element 9 are added, the difficulty of operation during installation and maintenance will not be increased. During installation, it is only necessary to align the second C-type sealing ring 6 to the position, and the bayonet 12 will automatically engage in the slot 61 under the action of the elastic element 9. The same is true when disassembling, and the operation is simple and quick.

[0055] Further, there are multiple card slots 61, which are opened along the outer ring surface of the second C-type sealing ring 6; there are multiple guide slots 8, which are opened along the second annular protrusion 102 in a one-to-one correspondence with the multiple card slots 61. It can be understood that setting the number of card slots 61 and guide slots 8 to multiple enhances the circumferential limiting effect of the card slots 61 and the bayonet pin 12 on the second C-type sealing ring 6, thereby making it more difficult for the sealing component 4 to be screwed out.

[0056] It is worth mentioning that a plurality of guide grooves 8 can be evenly distributed along the circumference of the hole 201 to be sealed and opened on the second annular protrusion 102. The beneficial effect of such a setting is that the evenly distributed guide grooves 8 enable the force acting on the sealing structure to be more evenly dispersed. When the semiconductor-level high-sealing pressure reducing valve is working, the internal fluid pressure and other external forces will act on the sealing component 4. The evenly distributed guide grooves 8 can avoid excessive local force, thereby affecting the sealing performance and the stability of the structure, ensuring that the forces in all directions are shared more evenly, reducing local stress concentration, and the evenly distributed guide grooves 8 make the bayonet pins 12 evenly distributed, which can better limit the rotation of the second C-type sealing ring 6. In addition, when the semiconductor-level high-sealing pressure reducing valve is regularly inspected and maintained, the maintenance personnel can quickly find the bayonet pins 12 and elastic elements 9 in each guide groove 8, which is not easy to be missed, and can be inspected and replaced, reducing the maintenance time and difficulty.

[0057] Further, the slot 61 is a square blind hole and the bayonet 12 is a flat pin, or the slot 61 is a through hole. The flat pin cooperates with the square blind hole to limit the circumferential position of the second C-type sealing ring 6. Compared with the cooperation between the slot 61 and the bayonet 12 described above, when the sealing component 4 rotates, the bayonet 12 can slide on the arc surface of the slot 61, so that the sealing component 4 is not easily screwed out. In this embodiment, the bayonet 12 is set as a flat pin, and the slot 61 is set as a square blind hole that cooperates therewith. The four sides of the square blind hole can fit tightly with the four sides of the flat pin, thereby limiting the rotation of the second C-type sealing ring 6 in the circumferential direction. Compared with the circular or other shaped slots 61, such a configuration can provide a more accurate circumferential limiting effect. When the sealing component 4 is twisted downward, even if the sealing component 4 is subjected to a large external force, the second C-type sealing ring 6 is not easy to rotate in the circumferential direction, that is, the sealing component 4 fixedly connected thereto is also not able to rotate, so that the sealing component 4 cannot be removed, thereby ensuring the reliability of the semiconductor-grade high-sealing pressure reducing valve. When the slot 61 is set as a through hole, the bayonet pin 12 can be inserted into the through hole to limit the circumferential position of the second C-type sealing ring 6.

[0058] During specific implementation: after the second C-type sealing ring 6 is installed, the elastic element 9 pushes the bayonet pin 12 to be inserted into the through hole. Since the bayonet pin 12 is inserted into the through hole, the second C-type sealing ring 6 is locked by the bayonet pin 12 and cannot rotate. That is, the sealing component 4 fixed to the second C-type sealing ring 6 is also locked and cannot rotate, which can ensure that the sealing component 4 cannot be removed by mistake, thereby ensuring the reliability of the semiconductor-grade high-sealing pressure reducing valve.

[0059] As a possible implementation, a first through hole 10 is opened at one end of the cone bolt 7 away from the cone section 71 , and the cross-section of the first through hole 10 perpendicular to its axis is a polygon. The first through hole 10 is used to clamp a wrench to apply torque to the cone bolt 7 .

[0060] The cross section of the first through hole 10 perpendicular to its axis is a polygon, that is, a regular hexagon, a regular octagon, a regular quadrilateral, etc. In specific implementation: when the wrench is clamped in the first through hole 10, the truncated cone bolt 7 can be controlled to move along the internal threaded through hole 401 by rotating the wrench. Specifically, when the wrench is rotated, due to the clamping effect, the force will be transmitted to the truncated cone bolt 7, so that it rotates and moves along the internal threaded through hole 401 under the action of the thread.

[0061] The beneficial effects of such a setting are: providing a convenient way to control the movement of the truncated cone bolt 7. In the case where the space provided by this embodiment is limited or it is difficult to directly operate the bolt by hand, using a wrench to screw the truncated cone bolt 7 through the first through hole 10 can be more convenient and labor-saving; and because the wrench and the first through hole 10 are firmly connected, the movement of the truncated cone bolt 7 can be accurately controlled and the position of the bolt can be accurately adjusted. The design of the polygonal first through hole 10 can be matched with a variety of standard wrenches, which improves the applicability of the truncated cone bolt 7. Different types of wrenches can be selected according to actual needs. The type of wrench is not limited here, as long as it meets different operating environments and requirements.

[0062] As a possible implementation, Figure 4-Figure 5 As shown, a second through hole 11 is opened at one end of the sealing component 4 away from the sealing gasket 3, and the second through hole 11 is connected to the internal threaded through hole 401. The radius of the inscribed circle of the second through hole 11 is larger than the radius of the inscribed circle of the internal threaded through hole 401, and the cross-section of the second through hole 11 perpendicular to its axis is a polygon, which is used to clamp a wrench to apply torque to the sealing component 4.

[0063] In specific implementation, since the second through hole 11 is connected to the first through hole 10 and is located below it, during operation, the movement of the sealing component 4 can be controlled by the second through hole 11. After adjusting to a suitable position, the first through hole 10 can be used to control the movement of the cone bolt 7, so that the two achieve a synergistic effect. This synergistic effect can achieve precise adjustment of the entire sealing structure and improve installation efficiency.

[0064] The beneficial effects of such a setting are: the design of the two through holes facilitates the installation of the entire device, and different through holes can be selected to control the movement of the corresponding components according to the specific situation, making the operation more flexible and precise, and by precisely controlling the relative position of the sealing component 4 and the conical bolt 7, the tight fit between the sealing component 4 and the hole 201 to be sealed can be better guaranteed, and the fit between the first C-type sealing ring 5 and the conical bolt 7 can be better guaranteed, thereby improving the sealing performance and effectively preventing leakage of the semiconductor-grade high-sealing pressure reducing valve.

[0065] The present invention also provides a sealing structure for being arranged in a processing hole of a semiconductor-grade high-sealing pressure reducing valve, the sealing structure comprising:

[0066] The sealing component 4 has an external thread on its outer peripheral surface, and an internal thread through hole 401 is formed along its axis. The sealing component 4 is used to threadably cooperate with the hole 201 to be sealed;

[0067] A first C-shaped sealing ring 5, the first C-shaped sealing ring 5 is coaxially arranged on the sealing component 4 with the internal thread through hole 401;

[0068] The truncated cone bolt 7 is threadably matched with the internal threaded through hole 401, and the inclined surface of the truncated cone section 71 of the truncated cone bolt 7 contacts the side of the first C-shaped sealing ring 5 away from the sealing component 4. The truncated cone bolt 7 is used to limit the axial position of the first C-shaped sealing ring 5;

[0069] The second C-type sealing ring 6 is coaxially arranged on the outside of the first C-type sealing ring 5, and the second C-type sealing ring 6 is used to lean against the sealing gasket 3. The inner ring surface of the second C-type sealing ring 6 abuts against the outer ring surface of the first C-type sealing ring 5, and the outer ring surface of the second C-type sealing ring 6 is used to abut against the inner wall of the hole 201 to be sealed.

[0070] The specific implementation of the sealing structure provided by the present invention has been mentioned in detail in the pressure reducing valve described in the above technical solution, and will not be repeated here.

[0071] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0072] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A semiconductor-grade high-sealing pressure reducing valve, characterized in that: include: A valve body (1), wherein a processing hole (2) is provided at the bottom of the valve body (1), wherein the processing hole (2) comprises a hole to be sealed (201) and a fluid channel (202), wherein the valve body (1) is provided with a second annular protrusion (102), wherein the second annular protrusion (102) is arranged on the side wall surface of the hole to be sealed (201), wherein the valve body (1) is provided with a guide groove (8), wherein the guide groove (8) is arranged on the second annular protrusion (102), wherein the hole to be sealed (201) is provided with an internal thread, wherein the fluid channel (202) is connected to the hole to be sealed (201) when not sealed, and wherein the connection between the hole to be sealed (201) and the fluid channel (202) is blocked after sealing; A sealing gasket (3), the sealing gasket (3) being located in the hole to be sealed (201), the sealing gasket (3) being in sealing contact with a position of the bottom of the hole to be sealed (201) close to the fluid channel (202), thereby sealing the fluid channel (202); A sealing component (4), wherein the outer peripheral surface of the sealing component (4) is provided with an external thread, the sealing component (4) is provided with an internal threaded through hole (401) along its axis, the sealing component (4) is threadably matched with the hole to be sealed (201) via the external thread, the second annular protrusion (102) is located between the sealing gasket (3) and the sealing component (4), and the second annular protrusion (102) gradually approaches the axis of the hole to be sealed (201) in a direction from the sealing gasket (3) to the sealing component (4); a first C-type sealing ring (5), the first C-type sealing ring (5) being located between the sealing pad (3) and the sealing component (4), the first C-type sealing ring (5) being coaxially arranged with the internal threaded through hole (401); a truncated cone bolt (7), the truncated cone bolt (7) being threadedly engaged with the internally threaded through hole (401), the truncated cone section (71) of the truncated cone bolt (7) being located between the sealing gasket (3) and the first C-type sealing ring (5), the inclined surface of the truncated cone section (71) being in contact with a side of the first C-type sealing ring (5) away from the sealing component (4), and the truncated cone bolt (7) being used to limit the axial position of the first C-type sealing ring (5); a second C-type sealing ring (6), wherein the outer ring surface of the second C-type sealing ring (6) is provided with a groove (61), the second C-type sealing ring (6) is fixedly arranged on the sealing component (4), the lower part of the outer ring surface of the second C-type sealing ring (6) contacts the inclined surface of the second annular protrusion (102), the second C-type sealing ring (6) is coaxially arranged on the outer side of the first C-type sealing ring (5), and respectively abuts against the sealing component (4) and the sealing gasket (3), the inner ring surface of the second C-type sealing ring (6) abuts against the outer ring surface of the first C-type sealing ring (5), and the outer ring surface of the second C-type sealing ring (6) abuts against the inner wall of the hole to be sealed (201); A bayonet pin (12), the bayonet pin (12) being arranged in the guide groove (8), the bayonet pin (12) being used to engage with the bayonet groove (61) to limit the circumferential position of the second C-shaped sealing ring (6); An elastic element (9), the elastic element (9) being arranged in the guide groove (8), and the two ends of the elastic element (9) respectively abutting against the bayonet pin (12) and the valve body (1), the elastic element (9) being used to apply an elastic force to the bayonet pin (12) close to the second C-type sealing ring (6).

2. The semiconductor-grade high-sealing pressure reducing valve according to claim 1, characterized in that: The valve body (1) is further provided with a first annular protrusion (101), the first annular protrusion (101) being arranged around the outer edge of the fluid channel (202), and the first annular protrusion (101) being in close contact with the sealing gasket (3).

3. The semiconductor-grade high-sealing pressure reducing valve according to claim 1, characterized in that: The diameter of the annular cross section of the second C-shaped sealing ring (6) is greater than the diameter of the annular cross section of the first C-shaped sealing ring (5).

4. The semiconductor-grade high-sealing pressure reducing valve according to claim 1, characterized in that: The outer ring surface of the second C-type sealing ring (6) is provided with a plurality of grooves (61), and the plurality of grooves (61) are opened along a circumference of the outer ring surface of the second C-type sealing ring (6); the valve body is provided with a plurality of guide grooves (8), and the plurality of guide grooves (8) are opened along a circumference of the second annular protrusion (102) in a one-to-one correspondence with the plurality of grooves (61).

5. The semiconductor-grade high-sealing pressure reducing valve according to claim 4, characterized in that: The card slot (61) is a square blind hole, and the card pin (12) is a flat head pin; or the card slot (61) is a through hole.

6. The semiconductor-grade high-sealing pressure reducing valve according to claim 1, characterized in that: A first through hole (10) is formed at one end of the truncated cone bolt (7) away from the truncated cone section (71); a cross section of the first through hole (10) perpendicular to its axis is a polygon; the first through hole (10) is used to clamp a wrench to apply torque to the truncated cone bolt (7).

7. The semiconductor-grade high-sealing pressure reducing valve according to claim 1, characterized in that: A second through hole (11) is formed at one end of the sealing component (4) away from the sealing pad (3); the second through hole (11) is connected to the internal threaded through hole (401); the radius of the inscribed circle of the second through hole (11) is larger than the radius of the inscribed circle of the internal threaded through hole (401); the cross section of the second through hole (11) perpendicular to its axis is a polygon and is used to clamp a wrench to apply torque to the sealing component (4).

8. A sealing structure, characterized in that: Used to be arranged in a processing hole of a semiconductor-grade high-sealing pressure reducing valve, the sealing structure comprises: A sealing component (4), wherein the outer peripheral surface of the sealing component (4) is provided with an external thread, the sealing component (4) is provided with an internal threaded through hole (401) along its axis, the processed hole comprises a hole to be sealed (201), a sealing gasket (3) is provided in the hole to be sealed (201), and the sealing component (4) is used to threadably cooperate with the hole to be sealed (201); A first C-shaped sealing ring (5), the first C-shaped sealing ring (5) being coaxially arranged on the sealing component (4) with the internal thread through hole (401); a truncated cone bolt (7), the truncated cone bolt (7) being threadedly engaged with the internally threaded through hole (401), the inclined surface of the truncated cone section (71) of the truncated cone bolt (7) being in contact with a side of the first C-shaped sealing ring (5) away from the sealing component (4), the truncated cone bolt (7) being used to limit the axial position of the first C-shaped sealing ring (5); a second C-type sealing ring (6), wherein the outer ring surface of the second C-type sealing ring (6) is provided with a groove (61), the second C-type sealing ring (6) is fixedly arranged on the sealing component (4), the semiconductor-grade high-sealing pressure reducing valve comprises a valve body (1), the valve body (1) is provided with a second annular protrusion (102), the lower part of the outer ring surface of the second C-type sealing ring (6) contacts the inclined surface of the second annular protrusion (102), the second C-type sealing ring (6) is coaxially arranged on the outer side of the first C-type sealing ring (5), the second C-type sealing ring (6) is used to abut against the sealing gasket (3), the inner ring surface of the second C-type sealing ring (6) abuts against the outer ring surface of the first C-type sealing ring (5), and the outer ring surface of the second C-type sealing ring (6) is used to abut against the inner wall of the hole to be sealed (201); A bayonet pin (12), the bayonet pin (12) being engaged in the bayonet groove (61), the bayonet pin (12) being used to be arranged in the guide groove (8) of the valve body (1) to limit the circumferential position of the second C-shaped sealing ring (6); An elastic element (9), the elastic element (9) being arranged in a guide groove of a valve body (1), the two ends of the elastic element (9) respectively abutting against the bayonet pin (12) and the valve body (1), the elastic element (9) being used to apply an elastic force to the bayonet pin (12) close to the second C-type sealing ring (6).

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