Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises an array substrate, a liquid crystal layer and a color film substrate. The color film substrate comprises a first substrate, a black matrix and a plurality of color resistors, the black matrix comprises a plurality of openings, the color resistors are located on the side, away from the first substrate, of the black matrix, the color resistors cover the openings in the first direction, at least part of the color resistors are located in the openings, and the first direction is the direction perpendicular to the plane where the display panel is located; the display panel further comprises a near-field communication coil, the near-field communication coil is located in the display area and comprises a plurality of first wires which are electrically connected, the first wires are arranged on the black matrix, and in the first direction, the projection of the black matrix covers the projection of the first wires; the sum of the thickness of the black matrix and the first wiring is not greater than the thickness of the color resistor. While the size of the near field communication coil is flexibly adjusted, mutual interference between a near field communication coil signal and a display signal can be reduced, and the risk of color resistor stripping can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Near Field Communication (NFC) is a contactless identification and interconnection technology that uses near-field magnetic field communication. It has the advantages of low cost, good performance, and high security. It provides a very safe and fast communication method for various electronic products that are becoming more and more popular in our daily lives. It has been widely used in electronic payment, identity authentication, ticketing, data exchange, anti-counterfeiting, advertising and other fields.

[0003] However, in existing display products with integrated NFC functions, the NFC coil has poor performance and has significant interference with the display signal. Therefore, a solution is urgently needed. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device to solve the problem of significant interference between NFC signals and display signals.

[0005] The present invention provides a display panel, comprising an array substrate, a liquid crystal layer and a color film substrate, wherein the array substrate and the color film substrate are arranged opposite to each other, and the liquid crystal layer is located between the array substrate and the color film substrate; the color film substrate comprises a first substrate, a black matrix and a plurality of color resists, wherein the black matrix is ​​located on a side of the first substrate close to the array substrate, and the black matrix comprises a plurality of openings; the color resists are located on a side of the black matrix away from the first substrate, and along a first direction, the color resists cover the openings, and at least part of the color resists are located in the openings, and the first direction is a direction perpendicular to the plane where the display panel is located; the display panel also comprises a near field communication coil, which is located in a display area of ​​the display panel, and the near field communication coil comprises a plurality of electrically connected first wirings, which are arranged on the black matrix, and in the first direction, the projection of the black matrix covers the projection of the first wirings; wherein the sum of the thickness of the black matrix and the first wiring in the first direction is not greater than the thickness of the color resist in the first direction.

[0006] Based on the same inventive concept, the present invention also provides a method for preparing a display panel, which is used to prepare the above-mentioned display panel.

[0007] Based on the same inventive concept, the present invention further provides a display device, comprising the above-mentioned display panel.

[0008] Compared with the prior art, the display panel and the manufacturing method thereof, and the display device provided by the present invention achieve at least the following beneficial effects:

[0009] The display panel and its preparation method and display device provided by the present invention, by arranging the near-field communication coil in the display area, the size of the near-field communication coil is less limited, which is conducive to flexibly adjusting the size of the near-field communication coil according to actual needs. Moreover, the near-field communication coil is arranged on the black matrix of the color film substrate. On the one hand, the signal between the near-field communication coil and the signal line in the array substrate can be separated by the liquid crystal layer, which is conducive to reducing the signal interference between the two; on the other hand, it can prevent the near-field communication coil from blocking the normal light output of the display panel, which is conducive to ensuring the light transmittance of the display panel.

[0010] In addition, by setting the sum of the thickness of the black matrix and the first wiring in the first direction to be no greater than the thickness of the color resist in the first direction, it can be ensured that the color resist has sufficient thickness. Even if the alignment of the color resist and the opening is offset, the thicker color resist can still fill the opening, which is beneficial to reduce the risk of color resist peeling and avoid the problem of white light leakage at the opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0012] Figure 1 A schematic diagram of the structure of a display panel provided in this application;

[0013] Figure 2 for Figure 1 A schematic diagram of the structure of a medium color film substrate;

[0014] Figure 3 A schematic plan view of a display panel provided in the present application;

[0015] Figure 4 It is a schematic plan view of a display panel in the prior art;

[0016] Figure 5 for Figure 3 An enlarged schematic diagram of the middle region Q;

[0017] Figure 6 A schematic plan view of another display panel provided in the present application;

[0018] Figure 7 A schematic diagram of the structure of another display panel provided in the present application;

[0019] Figure 8 A schematic diagram of the structure of another display panel provided in the present application;

[0020] Fig. 9 A schematic diagram of the structure of another display panel provided in the present application;

[0021] Fig.10 A schematic plan view of another display panel provided in the present application;

[0022] Fig.11 A schematic plan view of another display panel provided in the present application;

[0023] Fig.12 for Fig.11 A schematic cross-sectional view along the NN' tangent line;

[0024] Fig.13 A process flow chart of manufacturing a display panel provided in this application;

[0025] Fig.14 A schematic diagram of a display device provided in the present application. DETAILED DESCRIPTION

[0026] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0027] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0028] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0029] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0030] Figure 1 A schematic diagram of the structure of a display panel provided in this application, Figure 2 for Figure 1 A structural schematic diagram of a medium color film substrate.

[0031] The present application provides a display panel 01, such as Figure 1As shown, the display panel 01 includes an array substrate 1 , a liquid crystal layer 2 and a color filter substrate 3 . The array substrate 1 and the color filter substrate 3 are arranged opposite to each other, and the liquid crystal layer 2 is located between the array substrate 1 and the color filter substrate 3 .

[0032] like Figure 2 As shown, the color film substrate 3 includes a first substrate 31, a black matrix 32 and a plurality of color resists 33. The black matrix 32 is located on a side of the first substrate 31 close to the array substrate 1. The black matrix 32 includes a plurality of openings P, and light can be emitted from the openings P. The openings P can be used to limit the light emitting area of ​​the sub-pixel.

[0033] The color resist 33 is located at a side away from the first substrate 31 . Along the first direction Z, the color resist 33 covers the opening P, and at least a portion of the color resist 33 is located in the opening P. The first direction Z is a direction perpendicular to the plane where the display panel 01 is located.

[0034] Optionally, the color resist 33 includes red color resist, green color resist and blue color resist. Since the color resist 33 can emit light of corresponding colors by filtering white light, the light emitted by the light source of the display panel 01 can emit red light after passing through the red color resist, can emit green light after passing through the green color resist, and can emit blue light after passing through the blue color resist, which is conducive to achieving full-color display of the display panel 01.

[0035] Please continue to refer to Figure 2 On the side of the color resist 33 away from the first substrate 31 , an organic layer 34 may be provided as a planarization layer to ensure the flatness of the color filter substrate 3 .

[0036] like Figure 3 As shown, Figure 3 A plan view schematically showing a display panel provided in the present application, the display panel 01 includes a display area AA and a non-display area NA. The non-display area NA surrounds the display area AA, and the non-display area NA includes a first non-display area NA1 located at one side of the display area AA.

[0037] The display panel 01 also includes a near-field communication coil 4, which is located in the display area AA of the display panel 01. The first non-display area NA1 can be used to bind a first flexible circuit board 5. The first flexible circuit board 5 is electrically connected to the near-field communication coil 4 and is used to send and / or receive near-field communication signals to the near-field communication coil 4.

[0038] For example, Figure 3As shown, the near field communication coil 4 in the display area AA and the first flexible circuit board 5 in the first non-display area NA1 and the connection lines therebetween can enclose an area FB. Since the performance of near field communication is usually related to the area of ​​the area FB, within a certain range, the larger the area of ​​the area FB, the better the performance of near field communication. Based on this setting, the area size of the area surrounded by the near field communication coil 4 in the display area AA can be flexibly adjusted according to the actual needs of near field communication.

[0039] Please continue to refer to Figure 2 The near field communication coil 4 includes a plurality of electrically connected first traces 41 , the first traces 41 are arranged on the black matrix 32 , and in the first direction Z, the projection of the black matrix 32 covers the projection of the first traces 41 .

[0040] That is, in the process of manufacturing the display panel 01, after the black matrix 32 is manufactured, the first wiring 41 can be manufactured on the black matrix 32, and in the direction parallel to the plane where the display panel 01 is located, the length of the first wiring 41 is not greater than the length of the black matrix 32 where it is located. Of course, in the first direction Z, the first wiring 41 does not overlap with the opening P.

[0041] The sum of the thickness of the black matrix 32 and the first wiring 41 in the first direction Z is not greater than the thickness of the color resist 33 in the first direction Z.

[0042] For example, Figure 2 As shown, the thickness of the black matrix 32 in the first direction Z is H, the thickness of the first trace 41 in the first direction Z is D, and the thickness of the color resist 33 in the first direction Z is S, H+D≤S.

[0043] In the display panel 01 provided in the present application, the array substrate 1 may include devices and wiring such as transistors, pixel electrodes, common electrodes, scanning signal lines, and data signal lines. The film layer in the array substrate 1 may be the same as the prior art and will not be repeated here.

[0044] The inventor of the present application has found through research that in an existing setting method, if Figure 4 As shown, Figure 4 This is a schematic plan view of a display panel in the prior art, in which the near field communication coil 4' is arranged in the non-display area NA' of the display panel 01', and the near field communication coil 4' surrounds the display area AA'. In this arrangement, the near field communication coil 4' is limited by the size of the display area AA'. When the display area AA' is larger, the near field communication coil 4' will also be larger, which will affect the performance of the near field communication coil 4', resulting in poor performance of the near field communication coil 4'.

[0045] In another existing setting, the near field communication coil is usually set in the array substrate. In this setting, the signal on the near field communication coil will cause serious interference with the signals on the scanning signal line and the data signal line in the array substrate, affecting the display of the display panel and the near field communication function.

[0046] In view of this, the present application sets the near-field communication coil 4 in the display area AA, so the size of the near-field communication coil 4 is less limited, which is conducive to flexibly adjusting the size of the near-field communication coil 4 according to actual needs, thereby improving the performance of the near-field communication coil 4. Moreover, the near-field communication coil 4 is set on the black matrix 32 of the color film substrate 3. On the one hand, the signal between the near-field communication coil 4 and the signal line in the array substrate 1 can be separated by the liquid crystal layer 2, which is conducive to reducing the signal interference between the two. On the other hand, it can prevent the near-field communication coil 4 from blocking the normal light output of the display panel 01, which is conducive to ensuring the light transmittance of the display panel 01.

[0047] The inventor of the present application has also found through research that during the preparation process of the color resist 33, there may be a problem of misalignment between the color resist 33 and the opening P. In this case, on the one hand, the risk of peeling of the color resist 33 is increased; on the other hand, the color resist 33 may fail to fully cover the opening P in the first direction Z, resulting in white light leakage from the opening P, thereby affecting the display quality.

[0048] Therefore, the present application sets the sum of the thickness of the black matrix 32 and the first wiring 41 in the first direction Z to be no greater than the thickness of the color resist 33 in the first direction Z, which can ensure that the color resist 33 has sufficient thickness. Even if the alignment of the color resist 33 and the opening P is offset, the thicker color resist 33 can still fill the opening P, which is beneficial to reduce the risk of peeling of the color resist 33 and avoid the problem of white light leakage in the opening P.

[0049] Optional, such as Figure 3 As shown, in the display area AA, the near field communication coils 4 are distributed in a U shape on a macro scale.

[0050] Figure 5 for Figure 3 An enlarged schematic diagram of the middle region Q.

[0051] In some optional embodiments, combined with Figure 2 , Figure 3 and Figure 5 As shown, the first trace 41 surrounds the opening P. For example, Figure 5 As shown, the first wiring 41 surrounds the opening P.

[0052] Optionally, at a microscopic level, the near field communication coils 4 are distributed in a grid shape.

[0053] Based on this setting, multiple first traces 41 can be connected in parallel, which is equivalent to increasing the cross-sectional area of ​​the near-field communication coil 4, which is beneficial to reducing the resistance of the near-field communication coil 4, and further beneficial to reducing the signal loss on the near-field communication coil 4 and improving the performance of the near-field communication coil 4.

[0054] Further, the square resistance of the first wiring 41 is not greater than 0.1Ω / □. Exemplarily, the first wiring 41 includes at least one of copper, aluminum, and silver. In this way, the resistance of the near field communication coil 4 is further reduced, thereby further improving the performance of the near field communication coil 4.

[0055] In addition, the first wiring 41 may also include an anti-oxidation material, such as metal titanium, metal molybdenum, etc., and the anti-oxidation material is located on the surface of the first wiring 41. Exemplarily, the anti-oxidation material may be located on the upper surface and the lower surface of the first wiring 41, and may be in contact with the organic material. In this way, it is helpful to avoid the gas generated by the organic material from corroding the low-resistance material inside the first wiring 41 during the preparation process, and it is helpful to ensure the low-resistance characteristics and service life of the first wiring 41.

[0056] Please continue to refer to Figure 2 In some optional embodiments of the present application, the thickness of the first wiring 41 in the first direction Z is D, 1μm≤D≤2.5μm. On the one hand, it is beneficial to ensure that the cross-sectional area of ​​the first wiring 41 is large, so as to further reduce the resistance of the near field communication coil 4, so as to further improve the performance of the near field communication coil 4. On the other hand, it can avoid the thickness of the first wiring 41 being too large, which is beneficial to avoid the first substrate 31 from warping during the preparation process of the first wiring 41; and it is beneficial to ensure the lightness and thinness of the display panel 01.

[0057] Figure 6 A schematic plan view of another display panel provided in an embodiment of the present application.

[0058] In some optional embodiments, such as Figure 6 As shown, the display area AA includes a first area A1 and a second area A2, and the near field communication coil 4 is located in the first area A1. A virtual communication line 6 is provided in the second area A2, and the virtual communication line 6 is in the same layer as the first line 41. That is, the virtual communication line 6 and the first line 41 can be prepared by the same process and the same material.

[0059] For example, Figure 6 As shown, the second area A2 includes a first sub-area A21 and a second sub-area A22 , and the first sub-area A21 and the second sub-area A22 are located at opposite sides of the near field communication coil 4 .

[0060] Further, the second area A2 may be any area in the display area AA except the first area A1.

[0061] Optionally, in the display area AA, except for the area where the first wiring 41 is arranged, other areas are arranged with virtual communication wiring 6 .

[0062] In the present application, setting the virtual communication line 6 and the first line 41 on the same layer is conducive to ensuring the flatness of the color filter substrate 3. In this way, in the display area AA, the light transmittance of each area of ​​the color filter substrate 3 tends to be consistent, which is conducive to ensuring the display uniformity of the display panel 01. In addition, when preparing the support column on the color filter substrate 3, the height uniformity of the support column at each position can also be ensured.

[0063] Optionally, the virtual communication line 6 receives a fixed potential signal. Exemplarily, the virtual communication line 6 may receive a common potential signal COM or a ground signal GND.

[0064] Based on this setting method, it is beneficial to ensure the stability of the signal on the virtual communication line 6 and avoid the induction signal appearing on the virtual communication line 6 to interfere with the signal on the near-field communication coil 4.

[0065] Figure 7 A schematic diagram of the structure of another display panel provided in an embodiment of the present application.

[0066] In one embodiment of the present application, Figure 7 As shown, the display panel 01 includes a first step area T1 and a second step area T2, and the first step area T1 and the second step area T2 are located in the non-display area NA of the display panel 01. The first step area T1 and the second step area T2 are located on opposite sides of the display area AA. The first step area T1 is used to bind the driving chip 7, and the second step area T2 is used to bind the first flexible circuit board 5.

[0067] The driving chip 7 is used to transmit display signals, the first flexible circuit board 5 is used to be electrically connected to the near field communication coil 4, and the first flexible circuit board 5 can send and / or receive near field communication signals to the near field communication coil 4. From the above analysis, it can be seen that the second step area T2 in the embodiment of the present application is located in the first non-display area NA1.

[0068] Combination Figure 6 As shown, the near field communication coil 4 will form an area FB with the first flexible circuit board 5 in the second step area T2, and a magnetic field usually exists in the area FB. In the embodiment of the present application, the first step area T1 and the second step area T2 are arranged on opposite sides of the display area AA, so the driver chip 7 in the first step area T1 will not be located in the area FB formed by the near field communication coil 4 and the first flexible circuit board 5, which is conducive to reducing the influence of the magnetic field of the near field communication coil 4 on the driver chip 7 when it is working, thereby ensuring that the driver chip 7 drives the display panel 01 to display normally.

[0069] Further, combined with Figure 6 and Figure 7 As shown, the first step area T1 is also used to bind the second flexible circuit board 8, the second flexible circuit board 8 is electrically connected to the driving chip 7 (not shown in the figure), and the second flexible circuit board 8 can be used to transmit a working voltage signal to the driving chip 7.

[0070] Based on this setting, the second flexible circuit board 8 will not be located in the area FB formed by the near field communication coil 4 and the first flexible circuit board 5, which is beneficial to reduce the influence of the magnetic field of the near field communication coil 4 on the second flexible circuit board 8 when it is working, thereby ensuring the normal operation of the second flexible circuit board 8.

[0071] Please continue to refer to Figure 7 In some optional embodiments, the first step area T1 is located on the array substrate 1, and the second step area T2 is located on the color filter substrate 3. That is, on the side of the first step area T1, the array substrate 1 protrudes from the color filter substrate 3, and on the side of the second step area T2, the color filter substrate 3 protrudes from the array substrate 1.

[0072] Specifically, in some optional embodiments, the first flexible circuit board 5 for binding with the near-field communication line 4 is arranged on the second step area T2 of the color film substrate 3. Therefore, the electrical connection between the near-field communication coil 4 and the first flexible circuit board 5 can be made more convenient, which is conducive to reducing the difficulty of realizing the electrical connection between the near-field communication coil 4 and the first flexible circuit board 5.

[0073] Exemplarily, in the second step region T2 , the color resist 33 and the organic layer 34 may be removed, and the first flexible circuit board 5 is electrically connected to the first trace 41 , thereby achieving electrical connection between the first flexible circuit board 5 and the near field communication coil 4 .

[0074] Figure 8 A schematic diagram of the structure of another display panel provided in an embodiment of the present application.

[0075] like Figure 8 As shown, the first step area T1 and the second step area T2 are both located on the array substrate 1. That is, on the first step area T1 side, the array substrate 1 protrudes from the color filter substrate 3, and on the second step area T2 side, the array substrate 1 protrudes from the color filter substrate 3.

[0076] The second step area T2 includes a connecting wire 9, which is used to connect the first flexible circuit board 5. The material of the connecting wire 9 can be different from that of the first wire 41.

[0077] A conductive structure 10 is disposed between the color filter substrate 3 and the array substrate 1 , and the conductive structure 10 is electrically connected to the near field communication coil 4 and the connecting wire 9 .

[0078] Exemplarily, the conductive structure 10 can be a sealing structure between the color filter substrate 3 and the array substrate 1. By adding gold balls in the sealing structure, the sealing structure is made conductive, thereby realizing electrical connection between the near field communication coil 4 on the color filter substrate 3 side and the connecting trace 9 on the array substrate 1 side.

[0079] Exemplarily, the conductive structure 10 may be silver paste, which is provided on the adhesive layer between the color filter substrate 3 and the array substrate 1 , and the near field communication coil 4 on the color filter substrate 3 side and the connection trace 9 on the array substrate 1 side are electrically connected by the conductive silver paste.

[0080] In the embodiment of the present application, the second step area T2 is set on the side of the array substrate 1, and the first trace 41 on the side of the color filter substrate 3 can be electrically connected to the connecting trace 9 in the array substrate 1 through the conductive structure 10, and then electrically connected to the first flexible circuit board 5 through the connecting trace 9. In this way, the first trace 41 in the color filter substrate 3 does not need to be exposed, and the connecting trace 9 can be located inside the array substrate 1 to avoid being exposed. Alternatively, the connecting trace 9 can be made of an anti-oxidation material, such as titanium. In this way, even if the connecting trace 9 is exposed, the performance and service life of the connecting trace 9 can still be guaranteed.

[0081] Fig. 9 A schematic diagram of the structure of another display panel provided in this application, Fig.10 A schematic plan view of another display panel provided in the present application.

[0082] Combination Fig. 9 and Fig.10 As shown, the display panel 01 includes a first step area T1, and the first step area T1 is arranged on the array substrate 1. That is, on the side of the first step area T1, the array substrate 1 protrudes from the color filter substrate 3.

[0083] Among them, the first step area T1 is used to bind the driving chip 7 and the composite flexible circuit board 11, and the composite flexible circuit board 11 is electrically connected to the driving chip 7 and is used to be electrically connected to the near field communication coil 4. The composite flexible circuit board 11 can be used to transmit the working voltage signal to the driving chip 7 and send and / or receive the near field communication signal to the near field communication coil 4. The first step area T1 only needs to bind the composite flexible circuit board 11 to meet the normal operation of the driving chip 7 and the near field communication coil 4, which is conducive to reducing the number of binding times of the display panel 01, thereby reducing the process difficulty and saving costs. .

[0084] Exemplarily, the near field communication coil 4 in the color film substrate 3 can be electrically connected to the composite flexible circuit board 11 on the array substrate 1 through the conductive structure 10 between the color film substrate 3 and the array substrate 1. In some optional embodiments, the near field communication coil 4 includes at least one turn of coil. Since the more turns of the near field communication coil 4, the stronger the magnetic field of the near field communication coil 4, the better the performance. Since the near field communication coil 4 is arranged on the color film substrate 3, and the first trace 41 in the near field communication coil 4 is located in the display area AA, it is conducive to flexibly adjusting the number of turns of the near field communication coil 4 to meet different performance requirements.

[0085] It should be noted that since the performance of the near-field communication coil 4 is also related to its resistance, the resistance will be larger when the number of coil turns is larger. Therefore, the number of turns of the near-field communication coil 4 can be determined based on actual needs by comprehensively considering the resistance and magnetic field effect of the near-field communication coil 4.

[0086] Exemplarily, in the display panel 01 , the near field communication coil 4 may have 1 turn or 2 turns.

[0087] Fig.11 A schematic plan view of another display panel provided in the present application is shown in FIG. Fig.12 for Fig.11 A schematic cross-sectional view along the NN' tangent line.

[0088] In one embodiment of the present application, the near field communication coil 4 may include a multi-turn coil. Fig.11 and Fig.12 As shown, in the near field communication coil 4, the plurality of first traces 41 include a first sub-portion 411, a second sub-portion 412 and a third sub-portion 413, and the second sub-portion 412 and the third sub-portion 413 are located on opposite sides of the first sub-portion 411. The near field communication coil 4 also includes a jumper trace 42, and the jumper trace 42 is located on a side of the color resistor 33 away from the first sub-portion 411.

[0089] In the process of manufacturing the display panel 01 , after the first wiring 41 is manufactured, the color resist 33 may be manufactured next, and after the color resist 33 is manufactured, the jumper wiring 42 may be manufactured.

[0090] The jumper wire 42 is electrically connected to the second sub-section 412 and the third sub-section 413 , and is electrically insulated from the first sub-section 411 in the first direction Z. Of course, in the first direction Z, the jumper wire 42 overlaps the first sub-section 411 .

[0091] For example, Fig.12 As shown, in the first direction Z, two ends of the jumper trace 42 are overlapped with the second sub-portion 412 and the third sub-portion 413 respectively.

[0092] It is understandable that when the near field communication coil 4 includes at least 2 turns of coils, the near field communication coil 4 may have coil overlap in the first direction Z. In the embodiment of the present application, by setting the jumper wiring 42 so that the position where the coils overlap is electrically insulated in the first direction Z, it is possible to avoid the situation where some coils in the near field communication coil 4 cannot work properly, which is conducive to ensuring the normal operation of the multi-turn coils in the near field communication coil 4, and further conducive to improving the performance of the near field communication coil 4.

[0093] Optionally, the square resistance of the jumper trace 42 is not greater than 0.1Ω / □.

[0094] Exemplarily, the material of the jumper trace 42 is the same as that of the first trace 41 .

[0095] Please continue to refer to Fig.12 The plurality of color resists 33 include a first color resist 331 and a second color resist 332. Along the first direction Z, in the color resist 33 between the first sub-portion 411 and the jumper trace 42, the first color resist 331 and the second color resist 332 are adjacent, and the first color resist 331 and the second color resist 332 partially overlap.

[0096] Furthermore, in the first direction Z, in the color resist 33 between the first sub-portion 411 and the jumper trace 42 , adjacent color resists of different colors in the first direction Z all overlap.

[0097] For example, Fig.12 As shown, the plurality of color resists 33 also include a third color resist 333. In the color resist 33 located between the first sub-portion 411 and the jumper trace 42, the first color resist 331 and the second color resist 332 are adjacent to each other, and the second color resist 332 is also adjacent to the third color resist 333. That is, the second color resist 332 is located between the first color resist 331 and the third color resist 333. Along the first direction Z, the first color resist 331 partially overlaps the second color resist 332, and the second color resist 332 and the third color resist 333 are partially adjacent to each other.

[0098] Optionally, the first color resist 331 is a red color resist, the second color resist 332 is a green color resist, and the third color resist 333 is a blue color resist.

[0099] In the embodiment of the present application, in the color resist 33 located between the first sub-section 411 and the jumper trace 42, adjacent color resists of different colors are arranged to partially overlap in the first direction Z, so as to avoid the appearance of gaps between adjacent color resists 33, thereby helping to avoid the jumper trace 42 being electrically connected to the first sub-section 411 through the gap when preparing the jumper trace 42, and further helping to ensure the reliability of electrical insulation between the jumper trace 42 and the first sub-section 411 in the first direction Z.

[0100] The present application also provides a method for preparing a display panel, which is used to prepare the display panel 01 provided in the above embodiment. Fig.13 As shown, Fig.13 A process flow chart of manufacturing a display panel provided in this application, wherein the manufacturing method comprises:

[0101] Step S1: providing a first substrate 31 of a color filter substrate 3 .

[0102] Step S2: preparing a black matrix 32 on one side of the first substrate 31 and forming an opening P.

[0103] Step S3: preparing the first wiring 41 on the black matrix 32. In the first direction Z, the projection of the black matrix 32 covers the projection of the first wiring 41, and the first direction Z is perpendicular to the plane where the first substrate 31 is located.

[0104] Step S4 : preparing a color resist 33 on a side of the first trace 41 away from the first substrate 31 .

[0105] The color resist 33 covers the opening P in the first direction Z, and at least a portion of the color resist 33 is located in the opening P. The sum of the thickness of the black matrix 32 and the first trace 41 in the first direction Z is not greater than the thickness of the color resist 33 in the first direction Z.

[0106] Optionally, an organic layer may be prepared on the side of the color resist 33 away from the first substrate 31 to serve as a planarization layer, and a support column may be prepared on the planarization layer.

[0107] In the preparation method provided by the present invention, the near field communication coil 4 is arranged on the black matrix 32 of the color film substrate 3. On the one hand, the signal between the near field communication coil 4 and the signal line in the array substrate 1 can be separated by the liquid crystal layer 2, which is beneficial to reduce the signal interference between the two; on the other hand, the near field communication coil 4 can be prevented from blocking the normal light output of the display panel 01, which is beneficial to ensure the transmittance of the display panel 01.

[0108] In addition, by setting the sum of the thickness of the black matrix 32 and the first wiring 41 in the first direction Z to be no greater than the thickness of the color resist 33 in the first direction Z, it can be ensured that the color resist 33 has sufficient thickness. Even if the alignment of the color resist 33 and the opening P is offset, the thicker color resist 33 can still fill the opening P, which is beneficial to reduce the risk of the color resist 33 peeling off and to avoid the problem of white light leakage in the opening P.

[0109] Further, such as Fig.12 As shown, the near field communication coil 4 also includes a jumper wiring 42, and the preparation method also includes:

[0110] Step S5 : preparing a jumper wiring 42 on a side of the color resist 33 away from the first wiring 41 .

[0111] Fig.14 A schematic diagram of a display device provided in the present application.

[0112] The present application provides a display device 02, such as Fig.14 As shown, it includes a display panel 01 provided in the above embodiment. Exemplarily, the display device 02 is an electronic device such as a mobile phone, a tablet, a wearable electronic device, etc., which is not specifically limited in this application.

[0113] It can be seen from the above embodiments that the display panel and the manufacturing method thereof, and the display device provided by the present invention achieve at least the following beneficial effects:

[0114] In the display panel and display device provided by the present invention, if the near field communication coil is arranged in the display area, the size of the near field communication coil is less limited, which is conducive to flexibly adjusting the size of the near field communication coil according to actual needs. Moreover, the near field communication coil is arranged on the black matrix of the color film substrate. On the one hand, the signal between the near field communication coil and the signal line in the array substrate can be separated by the liquid crystal layer, which is conducive to reducing the signal interference between the two; on the other hand, it can prevent the near field communication coil from blocking the normal light output of the display panel, which is conducive to ensuring the light transmittance of the display panel.

[0115] In addition, by setting the sum of the thickness of the black matrix and the first wiring in the first direction to be no greater than the thickness of the color resist in the first direction, it can be ensured that the color resist has sufficient thickness. Even if the alignment of the color resist and the opening is offset, the thicker color resist can still fill the opening, which is beneficial to reduce the risk of color resist peeling and avoid the problem of white light leakage at the opening.

[0116] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The invention comprises an array substrate, a liquid crystal layer and a color filter substrate, wherein the array substrate and the color filter substrate are arranged opposite to each other, and the liquid crystal layer is located between the array substrate and the color filter substrate; the color filter substrate comprises: a first substrate; A black matrix, located on a side of the first substrate close to the array substrate, the black matrix comprising a plurality of openings; A plurality of color resists are located on a side of the black matrix away from the first substrate, and along a first direction, the color resists cover the opening, and at least a portion of the color resists is located in the opening, and the first direction is a direction perpendicular to a plane where the display panel is located; The display panel further includes a near field communication coil, the near field communication coil is located in the display area of ​​the display panel, the near field communication coil includes a plurality of electrically connected first wirings, the first wirings are arranged on the black matrix, and in the first direction, the projection of the black matrix covers the projection of the first wirings; The sum of the thicknesses of the black matrix and the first wiring in the first direction is not greater than the thickness of the color resist in the first direction.

2. The display panel according to claim 1, characterized in that: The first trace surrounds the opening.

3. The display panel according to claim 1, characterized in that: The thickness of the first wiring is D, 1 μm≤D≤2.5 μm.

4. The display panel according to claim 1, characterized in that: The square resistance of the first wiring is no greater than 0.1Ω / □.

5. The display panel according to claim 4, characterized in that: The first trace includes at least one of copper, aluminum, and silver.

6. The display panel according to claim 5, characterized in that: The first wiring further includes an anti-oxidation material, and the anti-oxidation material is located on a surface of the first wiring.

7. The display panel according to claim 1, characterized in that: The near field communication coil includes at least one coil turn.

8. The display panel according to claim 1, characterized in that: The display area includes a first area and a second area, the near field communication coil is located in the first area, a virtual communication line is arranged in the second area, and the virtual communication line is in the same layer as the first line.

9. The display panel according to claim 8, characterized in that: The virtual communication line receives a fixed potential signal.

10. The display panel according to claim 1, characterized in that: The display panel comprises a first step area and a second step area, the first step area and the second step area are located at opposite sides of the display area, the first step area is used to bind the driving chip, and the second step area is used to bind the first flexible circuit board; The driving chip is used to transmit display signals, and the first flexible circuit board is used to be electrically connected to the near field communication coil.

11. The display panel according to claim 10, characterized in that: The first step area is also used to bind a second flexible circuit board, and the second flexible circuit board is electrically connected to the driving chip.

12. The display panel according to claim 10, characterized in that: The first step region is disposed on the array substrate, and the second step region is disposed on the color filter substrate.

13. The display panel according to claim 10, characterized in that: The first step area and the second step area are both arranged on the array substrate, the second step area includes a connecting wire, and the connecting wire is used to connect the first flexible circuit board; A conductive structure is disposed between the color film substrate and the array substrate, and the conductive structure is electrically connected to the near field communication coil and the connecting wire.

14. The display panel according to claim 1, characterized in that: The display panel includes a first step area, which is arranged on the array substrate. The first step area is used to bind a driving chip and a composite flexible circuit board. The composite flexible circuit board is used to be electrically connected to the driving chip and to the near field communication coil.

15. The display panel according to claim 7, characterized in that: The plurality of first traces include a first sub-portion, a second sub-portion and a third sub-portion, wherein the second sub-portion and the third sub-portion are located at opposite sides of the first sub-portion; the near field communication coil further includes a jumper trace, and the jumper trace is located at a side of the color resistor away from the first sub-portion; The jumper wiring is electrically connected to the second sub-section and the third sub-section, and in the first direction, the jumper wiring is electrically insulated from the first sub-section.

16. The display panel according to claim 15, characterized in that: The square resistance of the jumper wiring is no more than 0.1Ω / □.

17. The display panel according to claim 15, characterized in that: The plurality of color resists include a first color resist and a second color resist. In the color resist located between the first sub-portion and the jumper wiring, the first color resist partially overlaps with the second color resist along the first direction.

18. A method for preparing a display panel, characterized in that: For preparing a display panel according to any one of claims 1 to 17, the method comprising: Providing the first substrate of the color filter substrate; Preparing the black matrix on one side of the first substrate and forming the opening; Preparing the first wiring on the black matrix; The color resist is prepared on a side of the first wiring away from the first substrate.

19. The method according to claim 18, characterized in that The near field communication coil also includes a jumper wiring; the method also includes: The jumper wiring is prepared on a side of the color resistor away from the first wiring.

20. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1-17.

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