Photoresist edge removing system, method, device, equipment and medium

Abstract

The invention relates to the field of wafer processing, in particular to a photoresist edge removing system, method, device and equipment and a medium, and the system comprises a wafer taking and conveying assembly, a wafer positioning assembly, an edge washing arm, an arm control assembly and a correction processor; the wafer taking and conveying assembly is used for bearing a to-be-processed wafer and conveying the to-be-processed wafer to a working position of the edge washing arm; the wafer positioning assembly is used for determining position information of the wafer to be processed; the correction processor determines a wafer offset according to the position information of the to-be-processed wafer and preset standard positioning information, and determines an offset compensation amount according to the wafer offset; and the arm control assembly is used for moving the edge washing arm according to the offset compensation amount and adjusting the edge washing width of the edge washing arm to the wafer to be processed. According to the invention, on the premise of low cost, the accuracy and the correction timeliness of photoresist edge removal are improved, the yield of finished products is further improved, and the process problems are reduced.

Description

Technical Field

[0001] The present invention relates to the field of wafer processing, and in particular to a photoresist edge removal system, method, device, equipment and medium. Background Art

[0002] In the process of wafer production and processing, coating and developing is a common method of patterning. However, the position offset of the wafer on the coating and developing machine and the mechanical offset of the conveyor arm will affect the result of photoresist edge removal, resulting in not only the removal of the area on the wafer chip that needs edge cleaning, but also damage to the effective area, thereby reducing the yield of the finished chip. The current coating and developing machine has no relevant means to correct the position of photoresist edge removal, and can only rely on offline inspection once a week to control the quality of the machine. Obviously, this method is costly and has poor timeliness, which limits the further improvement of the yield of the finished product.

[0003] Therefore, how to improve the accuracy and correction timeliness of photoresist edge removal and improve the yield of finished products while ensuring low cost is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0004] The purpose of the present invention is to provide a photoresist edge removal system, method, device, equipment and medium, which solves the problems of low accuracy, poor correction timeliness, low finished product yield and high correction cost in the prior art of photoresist edge removal.

[0005] In order to solve the above technical problems, the present invention provides a photoresist edge removal system, including a wafer pick-up and delivery component, a wafer positioning component, an edge cleaning arm, an arm control component and a correction processor;

[0006] The wafer fetching and delivering assembly is used to carry the wafer to be processed and deliver the wafer to be processed to the working position of the edge washing arm;

[0007] The wafer positioning component is used to determine the position information of the wafer to be processed;

[0008] The correction processor determines the wafer offset according to the position information of the wafer to be processed and the preset standard positioning information, and determines the offset compensation amount according to the wafer offset;

[0009] The arm control component is used to move the edge washing arm according to the offset compensation amount, and adjust the edge washing width of the edge washing arm on the wafer to be processed.

[0010] Optionally, the light blocking edge removal system further includes a distance measuring component;

[0011] The distance measuring component is used to measure the actual edge washing width of the wafer to be processed after edge washing;

[0012] The correction processor is further used for subtracting the actual edge-washing width from a preset target edge-washing width to obtain an edge-washing feedback difference, and determining an offset compensation amount according to the wafer offset and the edge-washing feedback difference.

[0013] Optionally, in the light blocking edge removal system, the distance measuring component is arranged at the working end of the edge washing arm.

[0014] A method for removing edges from a light block, the method for removing edges from a light block being implemented by using any of the above-mentioned light block removing systems, comprising:

[0015] Receiving position information of the wafer to be processed from the wafer positioning component;

[0016] Determining a wafer offset according to the position information of the wafer to be processed and preset standard positioning information;

[0017] Determining an offset compensation amount according to the wafer offset amount;

[0018] The offset compensation amount is sent to the arm control component, so that the arm control component moves the edge washing arm according to the offset compensation amount, and adjusts the edge washing width of the wafer to be processed by the edge washing arm.

[0019] Optionally, in the photoresist edge removal method, receiving the position information of the wafer to be processed from the wafer positioning component includes:

[0020] Receiving the center position information of the wafer to be processed from the wafer positioning component;

[0021] Accordingly, according to the position information of the wafer to be processed and the preset standard positioning information, determining the wafer offset includes:

[0022] The wafer offset is determined according to the center position information of the wafer to be processed and preset standard center positioning information.

[0023] Optionally, in the photoresist edge removal method, after completing edge cleaning of the wafer to be processed, the method further includes:

[0024] Acquiring the actual edge-washing width of the wafer to be processed after edge washing by the distance measuring component;

[0025] Subtracting the actual edge-washing width from the preset target edge-washing width to obtain an edge-washing feedback difference;

[0026] For subsequent wafers to be processed, determining the offset compensation amount according to the wafer offset includes:

[0027] An offset compensation amount is determined according to the wafer offset amount and the edge washing feedback difference.

[0028] Optionally, in the photoresist edge removal method, before subtracting the actual edge washing width from a preset target edge washing width to obtain an edge washing feedback difference, the method further includes:

[0029] Determining whether the actual edge washing width exceeds a preset error width range;

[0030] When the actual edge cleaning width exceeds the preset error width range, the corresponding wafer to be processed is determined to be unqualified, and the actual edge cleaning width is discarded;

[0031] When the actual edge-washing width does not exceed the preset error width range, the actual edge-washing width is subtracted from the preset target edge-washing width to obtain an edge-washing feedback difference.

[0032] A light blocking edge removal device, the light blocking edge removal device is realized by any of the light blocking edge removal systems described above, comprising:

[0033] A receiving module, used for receiving the position information of the wafer to be processed from the wafer positioning component;

[0034] An offset module, used to determine the wafer offset according to the position information of the wafer to be processed and preset standard positioning information;

[0035] A compensation module, used for determining an offset compensation amount according to the wafer offset amount;

[0036] The control module is used to send the offset compensation amount to the arm control component, so that the arm control component moves the edge washing arm according to the offset compensation amount and adjusts the edge washing width of the wafer to be processed by the edge washing arm.

[0037] A photoresist edge removal device, comprising:

[0038] Memory for storing computer programs;

[0039] A processor is used to implement the steps of any of the above-mentioned photoresist edge removal methods when executing the computer program.

[0040] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any of the above-mentioned photoresist edge removal methods are implemented.

[0041] The photoresist edge removal system provided by the present invention comprises a wafer pick-up and delivery component, a wafer positioning component, an edge washing arm, an arm control component and a correction processor; the wafer pick-up and delivery component is used to carry the wafer to be processed and deliver the wafer to be processed to the working position of the edge washing arm; the wafer positioning component is used to determine the position information of the wafer to be processed; the correction processor determines the wafer offset according to the position information of the wafer to be processed and preset standard positioning information, and determines the offset compensation amount according to the wafer offset; the arm control component is used to move the edge washing arm according to the offset compensation amount, and adjust the edge washing width of the wafer to be processed by the edge washing arm.

[0042] The present invention detects and locates the position of the wafer to be processed at the wafer delivery point, determines the offset between the position of the wafer to be processed sent to the bottom of the edge washing arm and the expected standard positioning information, and determines the offset compensation amount that the edge washing arm needs to correct by moving on this basis. By performing offset positioning and correcting and compensating the position of the edge washing arm before de-edging each wafer to be processed, the edge washing width of each wafer to be processed is greatly close to the expected value in the design, thereby improving the accuracy and correction timeliness of photoresist de-edging at a lower cost, further raising the finished product yield, and reducing process problems. The present invention also provides a photoresist de-edging method, device, equipment and medium with the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A schematic structural diagram of a specific implementation of the light blocking edge removal system provided by the present invention;

[0045] Figure 2 A schematic flow chart of a specific implementation of the photoresist edge removal method provided by the present invention;

[0046] Figure 3 A schematic structural diagram of a specific implementation of the photoresist edge removal device provided by the present invention.

[0047] In the figure, 01-wafer to be processed, 10-wafer picking and delivering assembly, 20-wafer positioning assembly, 30-edge washing arm, 40-arm control assembly, 50-correction processor, 60-distance measuring assembly, 100-receiving module, 200-offset module, 300-compensation module, and 400-control module. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0049] The core of the present invention is to provide a photoresist edge removal system, a structural schematic diagram of a specific implementation method thereof is shown in FIG. Figure 1 As shown, it is called the specific implementation mode 1, which includes a wafer pick-up and delivery component 10, a wafer positioning component 20, a cleaning arm 30, an arm control component 40 and a correction processor 50;

[0050] The wafer fetching and delivering assembly 10 is used to carry the wafer 01 to be processed and deliver the wafer 01 to be processed to the working position of the edge washing arm 30;

[0051] The wafer positioning component 20 is used to determine the position information of the wafer 01 to be processed;

[0052] The correction processor 50 determines the wafer offset according to the position information of the wafer to be processed 01 and the preset standard positioning information, and determines the offset compensation amount according to the wafer offset;

[0053] The arm control component 40 is used to move the edge washing arm 30 according to the offset compensation amount, and adjust the edge washing width of the wafer 01 to be processed by the edge washing arm 30.

[0054] Of course, after adjusting the edge washing arm 30 , the edge washing width of the wafer 01 to be processed should be as close as possible to the preset target edge washing width.

[0055] As a preferred embodiment, it further includes a distance measuring component 60;

[0056] The distance measuring component 60 is used to measure the actual edge width of the wafer 01 to be processed after edge washing;

[0057] The correction processor 50 is further configured to obtain a difference between the actual edge-washing width and a preset target edge-washing width to obtain an edge-washing feedback difference, and determine an offset compensation amount according to the wafer offset and the edge-washing feedback difference.

[0058] Although the wafer offset of the wafer to be processed 01 has been measured and the corresponding offset compensation has been made before the wafer to be processed 01 is washed, there may still be uncontrollable factors in actual operation that cause the wafer to be processed 01 to be misaligned. Therefore, in this preferred embodiment, a distance measuring component 60 is further provided for the photoresist edge removal system. After the wafer to be processed 01 passes through the edge washing arm 30, the distance measuring component 60 will measure the actual edge washing result to obtain the actual edge washing width, and compare the actual edge washing width with the preset target edge washing width, that is, to verify whether the edge washing effect meets expectations. If it meets expectations, no further processing is required. If it does not meet expectations, it is necessary to combine the wafer offset of the subsequent wafer to be processed placement position and the edge washing feedback difference in the previous edge washing process in the subsequent edge washing process to obtain the offset compensation, so that the photoresist edge removal system of the present invention can continuously optimize the calculation of the offset compensation in the edge washing process of multiple wafers to be processed 01, thereby further improving the yield of the finished product.

[0059] Furthermore, the distance measuring component 60 is disposed at the working end of the edge washing arm 30 .

[0060] In this preferred embodiment, the distance measuring component 60 is arranged at the working end of the edge washing arm 30, and the two ends of the edge washing arm 30 are respectively connected to the arm control component 40 and the edge washing nozzle. The working end is the end where the edge washing nozzle is located. Such a design can ensure that the distance measuring component 60 can always include the edge washing area of ​​the wafer 01 to be processed into the field of view, obtain the accurate actual edge washing width, ensure the accuracy of subsequent calculations, and at the same time save the need to set up a separate supporting device for the distance measuring component 60, simplify the system structure, and reduce costs.

[0061] The photoresist edge removal system provided by the present invention includes a wafer pick-up and delivery component 10, a wafer positioning component 20, a edge washing arm 30, an arm control component 40 and a correction processor 50; the wafer pick-up and delivery component 10 is used to carry a wafer to be processed 01 and deliver the wafer to be processed 01 to the working position of the edge washing arm 30; the wafer positioning component 20 is used to determine the position information of the wafer to be processed 01; the correction processor 50 determines the wafer offset according to the position information of the wafer to be processed 01 and preset standard positioning information, and determines the offset compensation according to the wafer offset; the arm control component 40 is used to move the edge washing arm 30 according to the offset compensation, and adjust the edge washing width of the wafer to be processed 01 by the edge washing arm 30. The present invention detects and locates the position of the wafer to be processed 01 at the wafer delivery and pick-up point, determines the offset between the position of the wafer to be processed 01 sent to the bottom of the edge washing arm 30 and the expected standard positioning information, and determines the offset compensation amount that the edge washing arm 30 needs to correct by moving on this basis, and by performing offset positioning and correcting and compensating the position of the edge washing arm 30 before edge removal of each wafer to be processed 01, the edge washing width of each wafer to be processed 01 is greatly close to the expected value in the design, thereby improving the accuracy and correction timeliness of photoresist edge removal at a relatively low cost, further improving the finished product yield, and reducing process problems.

[0062] The present invention also provides a photoresist edge removal method, and a flowchart corresponding to a specific implementation method thereof is shown in FIG. Figure 2 As shown, it is called the second specific implementation mode, the light blocking edge removal method is implemented by any of the light blocking edge removal systems described above, including:

[0063] S101 : receiving position information of the wafer 01 to be processed from the wafer positioning component 20 .

[0064] S102: Determine the wafer offset according to the position information of the wafer 01 to be processed and preset standard positioning information.

[0065] S103: Determine an offset compensation amount according to the wafer offset amount.

[0066] S104: Sending the offset compensation amount to the arm control component 40, so that the arm control component 40 moves the edge washing arm 30 according to the offset compensation amount, and adjusts the edge washing width of the wafer 01 to be processed by the edge washing arm 30.

[0067] The light block edge removal method in the present invention corresponds to the light block edge removal system described in the foregoing text, and is the working method of the light block edge removal system. Therefore, please refer to the foregoing text for all technical means, and the present invention will not be repeated here.

[0068] As a preferred embodiment, receiving the position information of the wafer to be processed 01 from the wafer positioning component 20 includes:

[0069] A1: Receive the center position information of the wafer 01 to be processed from the wafer positioning component 20.

[0070] Accordingly, according to the position information of the wafer to be processed 01 and the preset standard positioning information, determining the wafer offset includes:

[0071] A2: Determine the wafer offset according to the center position information of the wafer 01 to be processed and the preset standard center positioning information.

[0072] In this specific implementation, the position of the center of the wafer 01 to be processed is used to represent the position of the wafer 01 to be processed. Compared with other methods of measuring the position of the wafer, the position of the center of the wafer 01 to be processed is simpler and faster, and has low cost and high accuracy. Of course, other methods for determining the position of the wafer 01 to be processed can also be selected according to actual conditions, and the present invention is not limited here.

[0073] As another specific implementation, after completing edge cleaning of the wafer to be processed 01, the process further includes:

[0074] B1: The actual edge-washing width of the wafer 01 to be processed after edge washing is obtained through the distance measuring component 60 .

[0075] B2: Subtract the actual edge-washing width from the preset target edge-washing width to obtain an edge-washing feedback difference.

[0076] For the subsequent wafer 01 to be processed, determining the offset compensation amount according to the wafer offset amount includes:

[0077] B3: Determine the offset compensation amount according to the wafer offset amount and the edge washing feedback difference.

[0078] Please refer to the description of the distance measuring component 60 in the previous text. After obtaining the offset compensation amount, the offset compensation amount can be applied to the subsequent correction compensation of other wafers 01 to be processed. For example, if the edge washing feedback difference of wafer A is -5 mm, that is, the actual edge washing width is 5 mm narrower than the preset target edge washing width, then in the subsequent correction process of wafer B, on the basis of the corresponding wafer offset, the edge washing feedback value of wafer A is further considered. For example, the wafer offset of wafer B is +20 mm, that is, the position of wafer B is further away from the edge washing arm 30 than the preset standard positioning information, and the distance away is 20 mm. If the edge washing feedback value of wafer A is not considered, it is only necessary to move the edge washing arm 30 closer to wafer B by 20 mm. However, considering the edge washing feedback value of wafer A, it is necessary to move the edge washing arm 30 closer to wafer B by 25 mm (the edge washing width will increase accordingly when it is close to the wafer), that is, the final offset compensation amount should be +25 mm. The offset compensation amount of each wafer 01 to be processed can be determined based on the edge washing feedback difference of the previous wafer 01 to be processed, or can be determined based on the edge washing feedback difference of several wafers 01 to be processed in front of the same batch, and the present invention is not limited here.

[0079] Furthermore, before subtracting the actual edge-washing width from the preset target edge-washing width to obtain the edge-washing feedback difference, the method further includes:

[0080] C1: Determine whether the actual edge washing width exceeds a preset error width range.

[0081] C2: When the actual edge cleaning width exceeds the preset error width range, the corresponding wafer 01 to be processed is determined to be unqualified, and the actual edge cleaning width is discarded.

[0082] “Discarding the actual edge-washing width” in this step means that in the subsequent calibration and compensation process of the wafer 01 to be processed, the discarded actual edge-washing width is no longer used as a reference to determine the corresponding offset compensation amount.

[0083] C3: When the actual edge-washing width does not exceed the preset error width range, the actual edge-washing width is subtracted from the preset target edge-washing width to obtain an edge-washing feedback difference.

[0084] Of course, steps C2 and C3 are just two situations after step C1 is judged, and there is no sequence involved between C2 and C3.

[0085] In this preferred embodiment, it is further judged whether the actual edge washing width exceeds the allowable range. Only when the actual edge washing width does not exceed the preset error width range, the edge washing of the corresponding wafer 01 to be processed is considered to be effective, and the corresponding actual edge washing width is valid data. Otherwise, it can be considered that the wafer 01 to be processed has become a bad wafer after edge washing. Of course, the corresponding actual edge washing width is also invalid data and unavailable, thereby further avoiding the pollution of erroneous data and improving the yield of finished products.

[0086] The photoresist edge removal method provided by the present invention is implemented by a photoresist edge removal system as described in any one of the above-mentioned methods, by receiving the position information of the wafer to be processed 01 from the wafer positioning component 20; determining the wafer offset according to the position information of the wafer to be processed 01 and preset standard positioning information; determining the offset compensation according to the wafer offset; and sending the offset compensation to the arm control component 40, so that the arm control component 40 moves the edge washing arm 30 according to the offset compensation, and adjusts the edge washing width of the wafer to be processed 01 by the edge washing arm 30. The present invention detects and locates the position of the wafer to be processed 01 at the wafer delivery and pick-up point, determines the offset between the position of the wafer to be processed 01 sent to the bottom of the edge washing arm 30 and the expected standard positioning information, and determines the offset compensation amount that the edge washing arm 30 needs to correct by moving on this basis, and by performing offset positioning and correcting and compensating the position of the edge washing arm 30 before edge removal of each wafer to be processed 01, the edge washing width of each wafer to be processed 01 is greatly close to the expected value in the design, thereby improving the accuracy and correction timeliness of photoresist edge removal at a relatively low cost, further improving the finished product yield, and reducing process problems.

[0087] The following is an introduction to a light block edge removal device provided by an embodiment of the present invention. The light block edge removal device described below and the light block edge removal method described above can be referred to each other.

[0088] Figure 3 The structure diagram of the light blocking edge removal device provided in the embodiment of the present invention is implemented by any of the light blocking edge removal systems described above. Figure 3 The light blocking device may include:

[0089] A receiving module 100, configured to receive position information of the wafer to be processed from the wafer positioning assembly;

[0090] The offset module 200 is used to determine the wafer offset according to the position information of the wafer to be processed and the preset standard positioning information;

[0091] A compensation module 300, configured to determine an offset compensation amount according to the wafer offset amount;

[0092] The control module 400 is used to send the offset compensation amount to the arm control component, so that the arm control component moves the edge washing arm according to the offset compensation amount and adjusts the edge washing width of the wafer to be processed by the edge washing arm.

[0093] As a preferred implementation, the receiving module 100 includes:

[0094] A circle center positioning unit, used for receiving the circle center position information of the wafer to be processed from the wafer positioning component;

[0095] Accordingly, the offset module 200 includes:

[0096] The center offset unit is used to determine the wafer offset according to the center position information of the wafer to be processed and the preset standard center positioning information.

[0097] As a preferred implementation, the control module 400, after completing edge cleaning of the wafer to be processed, further includes:

[0098] An actual measurement unit, used for obtaining the actual edge-washing width of the wafer to be processed after edge washing through the distance measuring component;

[0099] A side-washing feedback unit, used for subtracting the actual side-washing width from a preset target side-washing width to obtain a side-washing feedback difference;

[0100] For subsequent wafers to be processed, the compensation module 300 determines the offset compensation amount according to the wafer offset amount, including:

[0101] The comprehensive compensation unit is used to determine the offset compensation amount according to the wafer offset amount and the edge washing feedback difference.

[0102] As a preferred implementation, the control module 400 further includes:

[0103] A judging unit, used for judging whether the actual edge washing width exceeds a preset error width range;

[0104] An unqualified unit, used for determining that the corresponding wafer to be processed is unqualified when the actual edge washing width exceeds a preset error width range, and discarding the actual edge washing width;

[0105] The qualified unit is used to obtain a feedback difference of the edge washing by subtracting the actual edge washing width from a preset target edge washing width when the actual edge washing width does not exceed a preset error width range.

[0106] The photoresist edge removal device provided by the present invention includes a receiving module 100, which is used to receive the position information of the wafer to be processed from the wafer positioning component; an offset module 200, which is used to determine the wafer offset according to the position information of the wafer to be processed and preset standard positioning information; a compensation module 300, which is used to determine the offset compensation according to the wafer offset; and a control module 400, which is used to send the offset compensation to the arm control component, so that the arm control component moves the edge washing arm according to the offset compensation, and adjusts the edge washing width of the wafer to be processed by the edge washing arm. The present invention detects and locates the position of the wafer to be processed at the wafer delivery and pick-up point, determines the offset between the position of the wafer to be processed sent to the bottom of the edge washing arm and the expected standard positioning information, and determines the offset compensation amount that the edge washing arm needs to correct by moving on this basis, and by performing offset positioning and correcting and compensating the position of the edge washing arm before edge removal of each wafer to be processed, the edge washing width of each wafer to be processed is greatly close to the expected value in the design, thereby improving the accuracy and correction timeliness of photoresist edge removal at a relatively low cost, further raising the finished product yield, and reducing process problems.

[0107] The light blocking de-edging device of the present embodiment is used to implement the aforementioned light blocking de-edging method. Therefore, the specific implementation of the light blocking de-edging device can be seen in the embodiment section of the light blocking de-edging method in the previous text. For example, the receiving module 100, the offset module 200, the compensation module 300, and the control module 400 are respectively used to implement steps S101, S102, S103 and S104 in the aforementioned light blocking de-edging method. Therefore, its specific implementation can refer to the description of the corresponding embodiments of each part, which will not be repeated here.

[0108] The present invention also provides a photoresist edge removal device, comprising:

[0109] Memory for storing computer programs;

[0110] A processor is used to implement the steps of the photoresist edge removal method as described in any one of the above when executing the computer program. The photoresist edge removal system provided by the present invention includes a wafer pick-up and delivery component, a wafer positioning component, a washing arm, an arm control component and a correction processor; the wafer pick-up and delivery component is used to carry the wafer to be processed and deliver the wafer to be processed to the working position of the washing arm; the wafer positioning component is used to determine the position information of the wafer to be processed; the correction processor determines the wafer offset according to the position information of the wafer to be processed and the preset standard positioning information, and determines the offset compensation according to the wafer offset; the arm control component is used to move the washing arm according to the offset compensation, and adjust the washing width of the wafer to be processed by the washing arm. The present invention detects and locates the position of the wafer to be processed at the wafer delivery and pick-up point, determines the offset between the position of the wafer to be processed sent to the bottom of the edge washing arm and the expected standard positioning information, and determines the offset compensation amount that the edge washing arm needs to correct by moving on this basis, and by performing offset positioning and correcting and compensating the position of the edge washing arm before edge removal of each wafer to be processed, the edge washing width of each wafer to be processed is greatly close to the expected value in the design, thereby improving the accuracy and correction timeliness of photoresist edge removal at a relatively low cost, further raising the finished product yield, and reducing process problems.

[0111] The present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the photoresist edge removal method as described in any one of the above are implemented. The photoresist edge removal system provided by the present invention includes a wafer pick-up and delivery component, a wafer positioning component, a wash arm, an arm control component and a correction processor; the wafer pick-up and delivery component is used to carry the wafer to be processed and deliver the wafer to be processed to the working position of the wash arm; the wafer positioning component is used to determine the position information of the wafer to be processed; the correction processor determines the wafer offset according to the position information of the wafer to be processed and the preset standard positioning information, and determines the offset compensation according to the wafer offset; the arm control component is used to move the wash arm according to the offset compensation, and adjust the wash width of the wafer to be processed by the wash arm. The present invention detects and locates the position of the wafer to be processed at the wafer delivery and pick-up point, determines the offset between the position of the wafer to be processed sent to the bottom of the edge washing arm and the expected standard positioning information, and determines the offset compensation amount that the edge washing arm needs to correct by moving on this basis, and by performing offset positioning and correcting and compensating the position of the edge washing arm before edge removal of each wafer to be processed, the edge washing width of each wafer to be processed is greatly close to the expected value in the design, thereby improving the accuracy and correction timeliness of photoresist edge removal at a relatively low cost, further raising the finished product yield, and reducing process problems.

[0112] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0113] It should be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0114] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0115] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0116] The above is a detailed introduction to the photoresist edge removal system, method, device, equipment and medium provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A light blocking edge removal system, characterized in that: It includes wafer pick-up and delivery components, wafer positioning components, edge washing arms, arm control components and correction processors; The wafer fetching and delivering assembly is used to carry the wafer to be processed and deliver the wafer to be processed to the working position of the edge washing arm; The wafer positioning component is used to determine the position information of the wafer to be processed; The correction processor determines the wafer offset according to the position information of the wafer to be processed and the preset standard positioning information, and determines the offset compensation amount according to the wafer offset; The arm control component is used to move the edge washing arm according to the offset compensation amount, and adjust the edge washing width of the edge washing arm on the wafer to be processed.

2. The light blocking edge removal system according to claim 1, characterized in that: Also included is a range-finding component; The distance measuring component is used to measure the actual edge washing width of the wafer to be processed after edge washing; The correction processor is further used for subtracting the actual edge-washing width from a preset target edge-washing width to obtain an edge-washing feedback difference, and determining an offset compensation amount according to the wafer offset and the edge-washing feedback difference.

3. The light blocking edge removal system according to claim 1, characterized in that: The distance measuring component is arranged at the working end of the edge washing arm.

4. A method for removing edge of photoresist, characterized in that: The light blocking edge removal method is implemented by the light blocking edge removal system according to any one of claims 1 to 3, comprising: Receiving position information of the wafer to be processed from the wafer positioning component; Determining a wafer offset according to the position information of the wafer to be processed and preset standard positioning information; Determining an offset compensation amount according to the wafer offset amount; The offset compensation amount is sent to the arm control component, so that the arm control component moves the edge washing arm according to the offset compensation amount, and adjusts the edge washing width of the wafer to be processed by the edge washing arm.

5. The photoresist edge removal method according to claim 4, characterized in that: Receiving the position information of the wafer to be processed from the wafer positioning component includes: Receiving the center position information of the wafer to be processed from the wafer positioning component; Accordingly, according to the position information of the wafer to be processed and the preset standard positioning information, determining the wafer offset includes: The wafer offset is determined according to the center position information of the wafer to be processed and preset standard center positioning information.

6. The method for removing edge of photoresist as claimed in claim 4, characterized in that: After completing edge cleaning of the wafer to be processed, the method further includes: Acquiring the actual edge-washing width of the wafer to be processed after edge washing by the distance measuring component; Subtracting the actual edge-washing width from the preset target edge-washing width to obtain an edge-washing feedback difference; For subsequent wafers to be processed, determining the offset compensation amount according to the wafer offset includes: An offset compensation amount is determined according to the wafer offset amount and the edge washing feedback difference.

7. The method for removing edge of photoresist as claimed in claim 6, characterized in that: Before obtaining the edge-washing feedback difference by subtracting the actual edge-washing width from the preset target edge-washing width, the method further includes: Determining whether the actual edge washing width exceeds a preset error width range; When the actual edge cleaning width exceeds the preset error width range, the corresponding wafer to be processed is determined to be unqualified, and the actual edge cleaning width is discarded; When the actual edge-washing width does not exceed the preset error width range, the actual edge-washing width is subtracted from the preset target edge-washing width to obtain an edge-washing feedback difference.

8. A light blocking edge removal device, characterized in that: The light blocking edge removal device is implemented by the light blocking edge removal system according to any one of claims 1 to 3, comprising: A receiving module, used for receiving the position information of the wafer to be processed from the wafer positioning component; An offset module, used to determine the wafer offset according to the position information of the wafer to be processed and preset standard positioning information; A compensation module, used for determining an offset compensation amount according to the wafer offset amount; The control module is used to send the offset compensation amount to the arm control component, so that the arm control component moves the edge washing arm according to the offset compensation amount and adjusts the edge washing width of the wafer to be processed by the edge washing arm.

9. A photoresist edge removal device, characterized in that: include: Memory for storing computer programs; A processor is used to implement the steps of the photoresist edge removal method as described in any one of claims 4 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the photoresist edge removal method according to any one of claims 4 to 7 are implemented.

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