Wafer UV film laminating machine

Abstract

The present invention relates to a wafer UV film laminating machine, including a material box component, a wafer transport component, an alignment component, a wafer bearing component, a film cutting component, a film clamping and throwing component, a film laminating component and a film tearing auxiliary component; the alignment component is used to accurately correct the wafer, the wafer bearing component is used to transport the wafer to the bottom of each module, the film cutting component cuts the UV film roll material in multiple directions until it is consistent with the shape and size of the wafer, the film laminating component automatically applies downward pressure to laminar the wafer, and the film tearing auxiliary component attaches a film tearing sticker to the surface of the film-laminar wafer. The present invention proposes to laminar the wafer in a fully automated manner, which effectively improves the efficiency of wafer laminating; the present invention proposes that multiple alignment cameras accurately correct the wafer position, which is conducive to improving the accuracy of laminating; the present invention proposes that multiple film cutting knives are used to cut the UV roll material in multiple directions, which is conducive to reducing material loss and reducing costs; the present invention proposes to apply downward pressure when laminating, which is conducive to avoiding the generation of bubbles and improving the laminating effect.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment automation, and more specifically to a wafer UV film laminating machine. Background Art

[0002] In semiconductor equipment, wafers are a basic material for manufacturing semiconductor chips, and their surfaces need to be treated with UV film, which can provide good protection for the wafer surface. The UV film is in the form of rolls, and the UV roll film has three layers, the upper and lower layers are base films, and the middle layer is an effective layer. Usually, the lower base film needs to be torn off before filming to obtain the UV film to be attached. When filming the wafer, the UV film needs to be kept neat and clean before attachment.

[0003] At present, the processing method of UV roll film is to cut it manually or use tools to cut it and then transport it to the application site again, tear off the base film at the application site and then apply the film. This processing method is inefficient, easily contaminates the UV film, requires workers' proficiency, and causes a large amount of material loss and bubbles and scratches on the wafer surface. The present invention can directly integrate the module to automatically apply the film on the wafer surface, ensuring that the UV film and the wafer fit more accurately and tightly to protect the wafer surface from contamination, oxidation or other damage. It is efficient and fast, and effectively prevents the contamination of the UV film and material loss. Summary of the invention

[0004] The technical problem to be solved by the present invention is low efficiency, high cost and poor laminating effect. In view of the above-mentioned defects of the prior art, a wafer UV laminating machine is provided.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A wafer UV film laminating machine is constructed, which includes a clean room, a material box assembly, a wafer conveying assembly, an alignment assembly, a wafer bearing assembly, a film cutting assembly, a film clamping and throwing assembly, a film laminating assembly and a film tearing auxiliary assembly, wherein the film clamping and throwing assembly is arranged on the film cutting assembly, and the clean room, the material box assembly, the wafer conveying assembly, the alignment assembly, the wafer bearing assembly, the film cutting assembly, the film laminating assembly and the film tearing auxiliary assembly are respectively arranged on the frame;

[0007] The alignment component includes at least two alignment cameras and is used to correct the wafer position;

[0008] The wafer carrying assembly is movably disposed below the film cutting assembly, the film clamping and throwing assembly, the film sticking assembly and the film tearing auxiliary assembly, and is used to carry the wafer;

[0009] The film cutting assembly is located on one side of the frame and is used to cut the UV film;

[0010] The film sticking assembly is located in front of the film cutting assembly and is used to closely stick the UV film to the wafer;

[0011] The film clamping and discarding assembly is located between the film cutting assembly and the film sticking assembly, and is used to clamp out and discard waste film.

[0012] Furthermore, the alignment component includes an alignment X-axis module, an alignment X-axis driving member, an alignment support frame, an alignment Y-axis module, an alignment Y-axis driving member, an alignment platform, an alignment rotation driving member and a correction plate; the alignment support frame moves along the direction of the alignment X-axis module under the drive of the alignment X-axis driving member; the alignment Y-axis module is fixed on the support frame, the alignment platform is arranged above the alignment Y-axis module, and the alignment platform moves along the direction of the alignment Y-axis module under the drive of the alignment Y-axis driving member ; The correction plate is located above the alignment platform, the alignment rotation drive component is located below the alignment platform and is fixedly connected to the alignment platform, the output end of the alignment rotation drive component passes through the alignment platform and is fixedly connected to the correction plate, and the alignment rotation drive component drives the correction plate to rotate; the correction plate is used to correct the position of the wafer; the alignment X-axis drive component, the alignment Y-axis drive component and the alignment rotation drive component cooperate to drive the correction plate to move horizontally and rotationally.

[0013] Furthermore, the alignment component also includes a plurality of module sensors, which are respectively arranged on the alignment X-axis module and the alignment Y-axis module and are used to detect the moving position of the object on the module.

[0014] Furthermore, the alignment component also includes an alignment base, a first camera mounting plate, a first camera, a second camera connecting plate, a second camera mounting plate and a second camera; the alignment base is fixedly connected to the frame; the first camera is located on the side of the alignment base, and is fixedly connected to the alignment base through the first camera mounting plate; the second camera connecting plate is located above the alignment base, and is fixedly connected to the alignment base; the second camera is located below the second camera connecting plate, and is fixedly connected to the second camera connecting plate through the second camera mounting plate; the second camera is parallel to the first camera, the second camera is used to perform preliminary alignment of the wafer on the correction plate, and the first camera is used to perform precise alignment of the wafer.

[0015] Furthermore, the wafer supporting assembly is provided with a position sensor for detecting the moving position of the wafer.

[0016] Furthermore, the film cutting assembly includes at least one film cutting knife, which performs multi-directional movement on the UV film and is used to cut the UV film into the same size and shape as the wafer.

[0017] Furthermore, the film clamping and film throwing assembly includes a film clamping and film throwing mounting plate, a jaw lifting cylinder, a jaw mounting plate, a jaw tightening cylinder and at least two jaws, and the film clamping and film throwing mounting plate is fixedly connected to the film cutting assembly; the jaw lifting cylinder is fixedly arranged on the side of the film clamping and film throwing mounting plate; the output end of the jaw lifting cylinder is connected to the jaw mounting plate and is used to drive the jaw mounting plate to lift and lower; the jaw tightening cylinder is vertically arranged and fixedly connected to the jaw mounting plate; the output end of the jaw tightening cylinder is connected to the jaw and is used to drive the jaw to clamp or release; the jaw lifting cylinder and the jaw tightening cylinder cooperate to drive the jaw to perform lifting and lowering movements, clamping movements and loosening movements; the jaw is used to tear the waste film off the wafer.

[0018] Furthermore, the film clamping and discarding assembly also includes a detection component, which is located on each of the clamping jaws and is used to detect the discarding of the waste film.

[0019] Furthermore, the film clamping and discarding assembly also includes a waste box and at least two film discarding air blowing pipes, wherein the film discarding air blowing pipes are arranged above the film clamping and discarding mounting plate, and the film discarding air blowing pipes are used to blow the waste film into the waste box.

[0020] Furthermore, the film laminating assembly includes a downward pressure cylinder, and the downward pressure cylinder is used to apply downward pressure to the UV film so that the UV film is closely attached to the wafer.

[0021] Furthermore, it also includes a film-tearing auxiliary component, which is located in front of the film-sticking component and is used to attach a film-tearing sticker to the surface of the wafer that has been film-sticked.

[0022] Furthermore, the wafer handling assembly includes a wafer loading and unloading mechanism and a wafer transfer mechanism, the wafer loading and unloading mechanism is movably arranged between the material box assembly and the alignment assembly, and is used to transport the wafer from the material box assembly to the alignment assembly; the wafer transfer mechanism is movably arranged between the alignment assembly and the wafer supporting assembly, and is used to transport the wafer from the alignment assembly to the wafer supporting assembly.

[0023] The beneficial effects of the present invention are:

[0024] 1. The present invention adopts fully automated wafer acquisition, visual alignment, UV film cutting, wafer film attaching, waste film recovery and film tearing and attaching, which effectively improves the efficiency of wafer film attaching;

[0025] 2. The alignment component used in the present invention includes a plurality of alignment cameras, which can be used for preliminary alignment and then for precise alignment, thereby effectively avoiding the error rate of film pasting and helping to reduce costs;

[0026] 3. The film cutting assembly used in the present invention uses multiple film cutting knives to cut the UV film in multiple directions until it is consistent with the shape and size of the wafer, which effectively avoids the waste of UV film materials and is conducive to further reducing costs;

[0027] 4. The downward pressure cylinder in the film laminating assembly used in the present invention generates downward pressure on the UV film, which is beneficial to avoid the generation of bubbles during film laminating and further improves the laminating effect of the UV film on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is an overall structural diagram of a wafer UV film laminating machine in one embodiment of the present invention;

[0029] Figure 2 It is a three-dimensional diagram of a wafer UV laminating machine without a clean room in one embodiment of the present invention;

[0030] Figure 3 It is another three-dimensional diagram of the wafer UV laminating machine without the clean room in one embodiment of the present invention;

[0031] Figure 4 is a three-dimensional diagram of a material box assembly in one embodiment of the present invention;

[0032] Figure 5 It is a three-dimensional diagram of a wafer loading and unloading mechanism in a wafer handling assembly in one embodiment of the present invention;

[0033] Figure 6 is a three-dimensional diagram of an alignment component in one embodiment of the present invention;

[0034] Figure 7 is a front view of an alignment component in one embodiment of the present invention;

[0035] Figure 8 is a three-dimensional diagram of a wafer transfer mechanism in a wafer handling assembly in one embodiment of the present invention;

[0036] Fig. 9 is a three-dimensional diagram of a wafer carrying assembly in one embodiment of the present invention;

[0037] Fig.10 is a three-dimensional diagram of a membrane cutting assembly according to an embodiment of the present invention;

[0038] Fig.11 This is an application diagram of a film pulling component in a complete machine according to an embodiment of the present invention;

[0039] Fig.12 is a three-dimensional diagram of a film clamping and film throwing assembly according to an embodiment of the present invention;

[0040] Fig.13 is a three-dimensional diagram of a film sticking assembly in one embodiment of the present invention;

[0041] Fig.14 1 is a three-dimensional diagram of a film tearing auxiliary component in one embodiment of the present invention.

[0042] Explanation of reference numbers: 1. Rack; 2. Clean room; 3. Material box assembly; 4. Wafer handling assembly; 5. Alignment assembly; 6. Wafer bearing assembly; 7. Film cutting assembly; 8. Film clamping and throwing assembly; 9. Film pasting assembly; 10. Film tearing auxiliary assembly;

[0043] Material box support frame; 311, slide rail; 32, sliding plate; 321, alignment block; 322, slider; 33, material box; 34, pressing cylinder;

[0044] 41. Wafer loading and unloading mechanism; 411. Loading and unloading X-axis module; 412. Loading and unloading Y-axis module; 413. Loading and unloading Z-axis module; 414. Loading and unloading rotation module; 415. Vacuum suction cup; 416. Suction cup vacuum pressure gauge;

[0045] 42. Wafer transfer mechanism; 421. Transfer chassis; 422. Transfer horizontal module; 423. Transfer lifting module; 424. Lifting reinforcement ribs; 425. Transfer adsorption platform; 426. Platform reinforcement ribs;

[0046] 51. Alignment X-axis module; 511. Alignment X-axis driving member; 512. Alignment X-axis sensor; 52. Alignment support frame; 53. Alignment Y-axis module; 531. Alignment Y-axis driving member; 532. Alignment Y-axis sensor; 54. Alignment platform; 55. Alignment rotation driving member; 56. Correction plate; 57. Alignment chassis; 58. First camera mounting plate; 581. First camera; 59. Second camera connecting plate; 591. Second camera mounting plate; 592. Second camera;

[0047] 61. Bearing module; 62. Bearing horizontal driving member; 63. Bearing support frame; 64. Bearing platform; 65. Heating rod; 66. Heating plate; 67. Suction plate; 68. Position sensor;

[0048] 71. Film cutting chassis; 72. Film cutting module; 73. Sheet film cutting cylinder connecting plate; 731. Sheet film cutting cylinder; 732. Sheet film cutting knife; 74. Rotary film cutting drive; 741. Rotary platform; 742. Rotary film cutting cylinder connecting plate; 743. Rotary film cutting cylinder; 744. Rotary film cutting knife;

[0049] 81. Film clamping and film throwing installation plate; 82. Claw lifting cylinder; 83. Claw mounting plate; 84. Claw loosening cylinder; 85. Claw; 86. Detection part; 87. Film throwing air pipe; 88. Waste box;

[0050] 91. Film sticking chassis; 92. Downward pressure cylinder;

[0051] 101. Film peeling sticker loading component; 102. Film peeling sticker lifting module; 103. Film peeling sticker horizontal module; 104. Film peeling sticker attaching component; 105. Anti-static component; 106. Attachment detection component. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0053] Please refer to the attached Figure 1-Figure 14 The present invention proposes a wafer UV film laminating machine, comprising a frame 1, a material box assembly 3, a wafer conveying assembly 4, an alignment assembly 5, a wafer bearing assembly 6, a film cutting assembly 7, a film clamping and throwing assembly 8, a film laminating assembly 9 and a film tearing auxiliary assembly 10, wherein the film clamping and throwing assembly 8 is arranged on the film cutting assembly 7, and the material box assembly 3, the wafer conveying assembly 4, the alignment assembly 5, the wafer bearing assembly 6, the film cutting assembly 7, the film laminating assembly 9 and the film tearing auxiliary assembly 10 are respectively arranged on the frame 1;

[0054] The alignment component 5 includes at least two alignment cameras and is used to correct the wafer position;

[0055] The wafer carrying assembly 6 is movably arranged below the film cutting assembly 7, the film clamping and throwing assembly 8 and the film sticking assembly 9, and is used to carry the wafer;

[0056] The film cutting assembly 7 is located on one side of the frame 1 and is used to cut the UV film;

[0057] The film sticking assembly 9 is located in front of the film cutting assembly 7 and is used to closely stick the UV film to the wafer;

[0058] The film clamping and discarding assembly 8 is located between the film cutting assembly 7 and the film sticking assembly 9, and is used to clamp out and discard the waste film.

[0059] In this embodiment, the clean shed 2 is located on the frame 1, and the material box assembly 3, the wafer handling assembly 4, the alignment assembly 5, the wafer bearing assembly 6, the film cutting assembly 7, the film clamping and throwing assembly 8, the film pasting assembly 9 and the film tearing auxiliary assembly 10 are all arranged in the clean shed 2. The clean shed 2 is used to protect the entire film pasting machine. In a specific embodiment, the clean shed 2 is provided with a transparent glass window for observing the internal operation. The clean shed 2 can also push and pull the window, which is conducive to the maintenance of the components; the material box assembly 3 is used to store wafers, and the wafer handling assembly 4 contains The wafer loading and unloading mechanism 41 and the wafer transfer mechanism 42 are included. The wafer loading and unloading mechanism 41 is movably arranged between the material box component 3 and the alignment component 5, and is used to transport the wafer from the material box component 3 to the alignment component 5; the alignment component 5 includes at least two alignment cameras for accurately aligning and correcting the wafer position; the wafer transfer mechanism 42 is movably arranged between the alignment component 5 and the wafer carrying component 6, and is used to transport the wafer from the alignment component 5 to the wafer carrying component 6; the wafer carrying component 6 is movably arranged between the film cutting component 7 and the film clamping component 7. Below the film assembly 8, the film sticking assembly 9 and the film tearing auxiliary assembly 10, the wafer carrying assembly 6 is provided with a heating element and an adsorbing element, which heat and adsorb the wafer, and the wafer carrying assembly 6 transports the wafer to the bottom of the film cutting assembly 7; the present invention proposes to use multiple film cutting knives to cut the UV roll material in multiple directions, so that the UV film with the same size and shape as the wafer is covered on the wafer; the film clamping and throwing assembly 8 is located between the film cutting assembly 7 and the film sticking assembly 9, and is used to clamp out and discard the waste film; the wafer carrying assembly 6 covers the UV roll material The wafer with UV film is transported to the bottom of the film sticking assembly 9, and the film sticking assembly 9 sticks film on the wafer to obtain the wafer with film stuck; the wafer carrying assembly 6 transports the wafer with film stuck to the bottom of the film tearing sticker, and the film tearing sticker sticks the film tearing sticker on the surface of the wafer with film stuck; the wafer with film stuck is then sent back to the material box assembly 3 for storage by the cooperation of the wafer transfer mechanism 42 and the wafer loading and unloading mechanism 41. At this point, the whole process of wafer removal, wafer correction UV film cutting, wafer film sticking, film tearing sticker sticking and wafer with film stuck storage is completed in a fully automated manner;

[0060] The present invention uses a fully automated method to complete the entire process of wafer removal, wafer correction, UV film cutting, wafer film pasting, film tearing and pasting, and storage of film-pasted wafers, which effectively improves the wafer film pasting efficiency; the alignment component 5 used in the present invention includes multiple alignment cameras, which can perform precise alignment after preliminary alignment, effectively avoiding the error rate of film pasting and helping to reduce costs; the present invention proposes to use multiple film cutting knives to perform multi-directional cutting of UV coils, which is helpful to reduce material loss and reduce costs; the wafer supporting component 6 used in the present invention heats and adsorbs the placed wafers, which is helpful to avoid bubbles when pasting the film and improve the bonding effect of the UV film on the wafer; the film pasting component 9 used in the present invention applies downward pressure when pasting the film, which is helpful to avoid bubbles when pasting the film and further improve the bonding effect of the UV film on the wafer.

[0061] Please refer to Figure 2 and Figure 4 The material box assembly 3 is arranged on the frame 1 and is used to store unfilmed wafers and filmed wafers.

[0062] In the specific implementation: the material box assembly 3 includes a material box 33, a material box support frame 31, a sliding plate 32, a material box 33, a pressing cylinder 34 and a photoelectric sensor; the material box support frame 31 is placed horizontally and is fixedly connected to the frame 1, and the material box support frame 31 is provided with an upper layer and a lower layer, the upper layer is used to store wafers without film, and the lower layer is used to store wafers with film already attached; the upper layer and the lower layer are both provided with a sliding plate 32, the material box support frame 31 is provided with a slide rail 311, the sliding plate 32 is provided with a slider 322, and the slider 322 is provided corresponding to the slide rail 311 The sliding plate 32 can be pulled out and arranged on the material box support frame 31. The sliding plate 32 can be pulled out and installed and disassembled from one side of the material box support frame 31; the sliding plate 32 is provided with a plurality of alignment blocks 321, and the alignment blocks 321 are L-shaped. The alignment blocks 321 are fixedly connected to the sliding plate 32, and the alignment blocks 321 are respectively arranged at the four corners of the material box 33 to form a placement area. The material box 33 is embedded in the placement area to effectively prevent the material box 33 from shaking back and forth and left and right; a pressing cylinder is also provided above the material box 33, and the pressing cylinder and the material box The support frame 31 is fixedly connected, and the material box 33 at the output end of the pressing cylinder is abutted, which effectively prevents the material box 33 from shaking up and down; the cooperation of the positioning block 321 and the pressing cylinder effectively and stably installs the material box 33 on the sliding plate 32; the material box 33 is provided with a multi-layer plug for separating the wafers, which effectively prevents the wafers from being scratched; the photoelectric sensor is arranged under the sliding plate 32 for real-time detection of the number of wafers; in a specific embodiment, the unfilmed wafers have been placed in the upper material box 33 in advance, and when the wafers need to be filmed, the material box 33 is manually installed. Install it on the sliding plate 32, install the sliding plate 32 on the upper layer of the material box support frame 31, and then use the pressing cylinder to press the material box 33 to complete the loading; after the wafers are filmed, they are sent to the lower material box 33 for storage. When the lower material box 33 is full of filmed wafers, just close the pressing cylinder, manually pull out the sliding plate 32 in the lower layer, and remove the material box 33 to complete the unloading; during the whole process of equipment operation, the photoelectric sensor detects the number of wafers in real time. When the unfilmed wafers are taken out and the filmed wafers are full, the photoelectric sensor will issue a timely warning.

[0063] Please refer to Figure 2 , Figure 5 and Figure 8 The wafer handling assembly 4 includes a wafer loading and unloading mechanism 41 and a wafer transfer mechanism 42. The wafer loading and unloading mechanism 41 is movably arranged between the material box assembly 3 and the alignment assembly 5, and is used to transport the wafer from the material box assembly 3 to the alignment assembly 5; the wafer transfer mechanism 42 is movably arranged between the alignment assembly 5 and the wafer supporting assembly 6, and is used to transport the wafer from the alignment assembly 5 to the wafer supporting assembly 6.

[0064] In specific implementation: the wafer loading and unloading mechanism 41 includes an loading and unloading X-axis module 411, a loading and unloading Y-axis module 412, a loading and unloading Z-axis module 413, an loading and unloading rotation module 414, a vacuum suction cup 415 and a suction cup vacuum pressure gauge 416; the loading and unloading X-axis module 411 is placed horizontally and fixedly connected to the frame 1; the loading and unloading Y-axis module 412 is installed above the X-axis module, and the loading and unloading Y-axis module 412 is perpendicular to the X-axis module in the horizontal direction. At this time, the loading and unloading Y-axis module 412 can move along the direction of the loading and unloading X-axis module 411; the loading and unloading Z-axis module 413 is installed above the loading and unloading Y-axis module 412, and the loading and unloading Z-axis module 413 is perpendicular to the Y-axis module in the vertical direction. At this time, the loading and unloading Z-axis module 413 can move along the direction of the loading and unloading X-axis module 411 and the loading and unloading Y-axis module 412; the loading and unloading rotation module 414 is installed on the loading and unloading Z-axis module On the side of the assembly, at this time, the loading and unloading rotating module 414 can move in the direction of the loading and unloading X-axis module 411, the loading and unloading Y-axis module 412 and the loading and unloading Z-axis module 413; the vacuum suction cup 415 is installed above the rotating module. At this time, the loading and unloading X-axis module 411, the loading and unloading Y-axis module 412, the loading and unloading Z-axis module 413 and the loading and unloading rotating module 414 cooperate to move, so that the vacuum suction cup 415 can realize the spatial XYZ axis movement and rotation movement; in a specific embodiment, the vacuum suction cup 415 is in the shape of a tooth fork, and the vacuum suction cup 415 moves to the bottom of the unfilmed wafer in the material box assembly 3, and absorbs the wafer by vacuum, takes the wafer out of the material box 33 and transports it to the camera alignment assembly 5. After the wafer is filmed, the vacuum suction cup 415 transports the wafer back to the material box 33 for storage; in this process, the suction cup vacuum pressure gauge 416 monitors the pressure of the vacuum suction cup 415 in real time;

[0065] The wafer transfer mechanism 42 includes a transfer base frame 421, a transfer horizontal module 422, a transfer lifting module 423, lifting reinforcement ribs 424, a transfer adsorption platform 425, and platform reinforcement ribs 426; the transfer base frame 421 is fixedly connected to the frame 1, the transfer horizontal module 422 is installed above the transfer base frame 421, the transfer lifting module 423 is arranged on the side of the transfer horizontal module 422, and the transfer lifting module 423 is perpendicular to the transfer horizontal module 422, and the transfer lifting module 423 is fixedly connected to the transfer horizontal module 422 through the lifting reinforcement ribs 424. At this time, the transfer lifting module 423 can move along the direction of the transfer horizontal module 422; the transfer adsorption platform The platform 425 is arranged on the side of the transfer lifting module 423, and the transfer adsorption platform 425 is perpendicular to the transfer lifting module 423. The transfer adsorption platform 425 is fixedly connected to the transfer lifting module 423 through the platform reinforcement rib 426. At this time, with the coordinated movement of the transfer horizontal module 422 and the transfer lifting module 423, the transfer adsorption platform 425 component can realize horizontal movement and lifting movement; the transfer adsorption platform 425 is used for vacuum adsorption of wafers; in a specific embodiment, after the wafer completes position correction on the alignment component 5, the transfer adsorption platform 425 component moves to above the wafer, and the wafer is transported from the alignment component 5 to the wafer carrying component 6 by vacuum adsorption.

[0066] Please refer to Figure 2 , Figure 6 and Figure 7 The alignment component 5 includes an alignment X-axis module 51, an alignment X-axis driving component 511, an alignment support frame 52, an alignment Y-axis module 53, an alignment Y-axis driving component 531, an alignment platform 54, an alignment rotation driving component 55 and a correction plate 56; the alignment support frame 52 moves along the direction of the alignment X-axis module 51 under the drive of the alignment X-axis driving component 511; the alignment Y-axis module 53 is arranged above the alignment support frame 52 and is fixedly connected to the alignment support frame 52; the alignment platform 54 is arranged above the alignment Y-axis module 53, and the alignment platform 54 moves along the direction of the alignment Y-axis module 53 under the drive of the alignment Y-axis driving component 531; the correction plate 56 is located above the alignment platform 54, The alignment rotation drive member 55 is located below the alignment platform 54 and is fixedly connected to the alignment platform 54. The output end of the alignment rotation drive member 55 passes through the alignment platform 54 and is fixedly connected to the correction plate 56. The alignment rotation drive member 55 drives the correction plate 56 to rotate. The correction plate 56 is used to correct the position of the wafer. The alignment X-axis drive member 511, the alignment Y-axis drive member 531 and the alignment rotation drive member 55 cooperate to drive the correction plate 56 to move horizontally and rotationally. The alignment component 5 also includes a plurality of module sensors, which are respectively arranged on the alignment X-axis module 51 and the alignment Y-axis module 53, and are used to detect the moving position of the object on the module.

[0067] In the specific implementation: the module sensor includes an alignment X-axis sensor 512 and an alignment Y-axis sensor 532, and the alignment component 5 also includes an alignment X-axis module 51, an alignment X-axis driver 511, an alignment support frame 52, an alignment Y-axis module 53, an alignment Y-axis driver 531, an alignment platform 54, an alignment rotation driver 55 and a correction plate 56, and all are located below the alignment base frame 57; the alignment X-axis module 51 is fixedly connected to the frame 1, and the alignment support frame 52 is fixedly connected to the frame 1. The X-axis alignment module 51 moves along the X-axis alignment module 51 under the driving of the X-axis alignment driving member 511. The X-axis alignment sensor 512 is located on the X-axis alignment module 51 and is used to prevent the alignment support frame 52 from moving beyond the limit position on the X-axis alignment module 51 and causing a collision. The Y-axis alignment module 53 is arranged above the alignment support frame 52 and is fixedly connected to the alignment support frame 52. The alignment platform 54 is arranged above the Y-axis alignment module 53 and is located on the Y-axis alignment driving member. The alignment Y-axis sensor 532 is located on the alignment Y-axis module 53 and is used to prevent the alignment platform 54 from moving beyond the limit position on the alignment Y-axis module 53 and causing a collision. The driving end of the alignment rotation drive member 55 is located below the alignment platform 54 and is fixedly connected to the alignment platform 54. The output end of the alignment rotation drive member 55 passes through the alignment platform 54 and is fixedly connected to the correction plate 56. The alignment rotation drive member 55 drives the correction plate 56 to rotate. The correction plate 56 is used to correct the position of the wafer. The alignment X-axis drive member 511, the alignment Y-axis drive member 531 and the alignment rotation drive member 55 cooperate to drive the correction plate 56 to move along the direction of the alignment X-axis module 51, the direction of the alignment Y-axis module 53 and the rotation. In a specific embodiment, the alignment X-axis drive member 511, the alignment Y-axis drive member 531 and the alignment rotation drive member 55 are servo motors.

[0068] Please refer to Figure 2 , Figure 6 and Figure 7 The alignment component 5 also includes an alignment base frame 57, a first camera mounting plate 58, a first camera 581, a second camera connecting plate 59, a second camera mounting plate 591 and a second camera 592; the alignment base frame 57 is fixedly connected to the frame 1; the first camera 581 is located on the side of the alignment base frame 57, and is fixedly connected to the alignment base frame 57 through the first camera mounting plate 58; the second camera connecting plate 59 is located above the alignment base frame 57 and is fixedly connected to the alignment base frame 57; the second camera 592 is located below the second camera connecting plate 59 and is fixedly connected to the second camera connecting plate 59 through the second camera mounting plate 591; the second camera 592 is parallel to the first camera 581, the second camera 592 is used for preliminary alignment of the wafer, and the first camera 581 is used for precise alignment of the wafer.

[0069] In a specific implementation, the alignment assembly 5 also includes an alignment chassis 57, a first camera mounting plate 58, a first camera 581, a second camera connecting plate 59, a second camera mounting plate 591, and a second camera 592; the alignment chassis 57 is fixedly connected to the frame 1; the first camera 581 is located on the side of the alignment chassis 57 and is fixedly connected to the alignment chassis 57 through the first camera mounting plate 58; the second camera connecting plate 59 is located above the alignment chassis 57 and is fixedly connected to the alignment chassis 57; the second camera 592 is located below the second camera connecting plate 59 and is fixedly connected to the second camera connecting plate 59 through the second camera mounting plate 591; the second camera 5 92 is parallel to the first camera 581, and the second camera 592 is located in front of the first camera 581. The second camera 592 is used for preliminary alignment of the wafer, and the first camera 581 is used for precise alignment of the wafer. In a specific embodiment, the precise alignment uses a mark point for static alignment, and the mark point is a reference point, that is, the final target position. The first camera 581 and the second camera 592 obtain the current position of the wafer, and according to the difference between the current position and the mark point, control the wafer on the correction plate 56 to perform horizontal and rotational movements until the wafer reaches the final target position. This effectively improves the accuracy of subsequent film pasting, which is conducive to reducing costs.

[0070] Please refer to Figure 2 and Fig. 9 The wafer carrying assembly 6 is movably arranged under the film cutting assembly 7, the film clamping and throwing assembly 8, the film sticking assembly 9 and the film tearing auxiliary assembly 10, and is used to carry the wafer; the wafer carrying assembly 6 is also provided with a position sensor 68, and is used to detect the moving position of the wafer.

[0071] In specific implementation: the wafer carrying assembly 6 includes a carrying module 61, a carrying horizontal driving member 62, a position sensor 68, a carrying support frame 63, a carrying platform 64, a heating rod 65, a heating plate 66 and a suction plate 67; the carrying support frame 63 is arranged above the carrying module 61, and the carrying support frame 63 moves along the direction of the carrying module 61 under the drive of the carrying horizontal driving member 62; the position sensor 68 is arranged on the carrying module 61, and is used to detect the moving position of the carrying support frame 63 to prevent the carrying support frame 63 from exceeding the limited stroke and colliding with the machine; the carrying platform 64 is arranged above the carrying support frame 63 and is fixedly connected to the carrying support frame 63; the heating rod 65 is arranged on the carrying platform 64 and the heating plate The plates 66 are provided and used for heating the plates 66; a suction plate 67 is provided above the heating plate 66 and used for heating the suction plate 67 so that the suction plate 67 can absorb and heat the wafer; in a specific embodiment, the bearing horizontal driving member 62 is a servo motor; the bearing module 61 moves below the film cutting assembly 7, the film clamping and throwing assembly 8, the film pasting assembly 9 and the film tearing auxiliary assembly 10, and the wafer on the suction plate 67 can move back and forth below the film cutting assembly 7, the film clamping and throwing assembly 8, the film pasting assembly 9 and the film tearing auxiliary assembly 10; the suction plate 67 vacuum absorbs the wafer to prevent the wafer from shifting or falling; the heating rod 65 heats the wafer, which is used to make the wafer adhere more tightly when film is pasted, avoid the generation of bubbles, and improve the bonding effect of the UV film on the wafer.

[0072] Please refer to Figure 3 , Fig.10 and Fig.11 The film cutting assembly 7 includes at least one film cutting knife, which performs multi-directional movement on the UV film and is used to cut the UV film to the same size and shape as the wafer.

[0073] In the specific implementation: the film cutting assembly 7 includes a film cutting base frame 71, a film cutting module 72, a sheet film cutting cylinder connecting plate 73, a sheet film cutting cylinder 731, a sheet film cutting knife 732, a rotary film cutting driving member 74, a rotary platform 741, a rotary film cutting cylinder connecting plate 742, a rotary film cutting cylinder 743, and a rotary film cutting knife 744; the film cutting base frame 71 is fixedly connected to the frame 1, the film cutting module 72 is fixedly connected to the film cutting base frame 71, and the film cutting module 72 is parallel to the vacuum film drawing plate; the sheet film cutting cylinder connecting plate 73 is arranged on the side of the film cutting module 72, and is vertically connected to the film cutting cylinder 731. The module 72 is vertical, and the sheet-shaped film cutting cylinder 731 is connected to the film cutting module 72 through the sheet-shaped film cutting cylinder connecting plate 73, and the sheet-shaped film cutting cylinder 731 can move horizontally along the direction of the film cutting module 72; the output end of the sheet-shaped film cutting cylinder 731 is connected to the sheet-shaped film cutting knife 732, and the sheet-shaped film cutting knife 732 can realize lifting movement under the drive of the film cutting cylinder; the film cutting module 72 and the sheet-shaped film cutting cylinder 731 move in coordination, so that the sheet-shaped film cutting knife 732 can realize horizontal movement and lifting movement relative to the UV film, and the sheet-shaped film cutting knife 732 is used to cut the UV film into sheets to obtain a sheet-shaped UV film;

[0074] The rotary film cutting driving member 74 is located on the side of the sheet film cutting knife 732 and is fixedly connected to the film cutting base frame 71; the output end of the rotary film cutting driving member 74 is connected to the rotating platform 741, and the rotary film cutting driving member 74 drives the rotating platform 741 to realize rotational motion; the rotary film cutting cylinder connecting plate 742 is located on the side of the rotating platform 741 and is perpendicular to the rotating platform 741; the rotary film cutting cylinder 743 is connected to the rotating platform 741 through the rotary film cutting cylinder connecting plate 742, and realizes rotational motion under the drive of the rotary film cutting driving member 74; the output end of the rotary film cutting cylinder 743 is connected to the rotary film cutting knife 744, and the rotary film cutting knife 744 realizes lifting motion under the drive of the rotary film cutting cylinder 743; the coordinated operation of the rotary film cutting cylinder 743 and the rotary film cutting driving member 74 The rotary film cutting knife 744 is used to cut the sheet-like UV film into a circular UV film of the same size and shape as the wafer; in a specific embodiment, the rotary film cutting driving member 74 is a servo motor; the wafer carrying assembly 6 moves the wafer to the bottom of the film cutting assembly 7, the vacuum film pulling plate pulls out and tensions the UV film, the sheet-like film cutting knife 732 cuts the UV film, and the vacuum film pulling plate stops adsorbing the UV film. At this time, the sheet-like UV film covers the wafer, and the rotary film cutting knife 744 cuts the sheet-like UV film until it is cut into a circular UV film of the same size and shape as the wafer; cutting the sheet-like film first and then the circular film effectively avoids the waste of UV film materials, which is conducive to further reducing costs.

[0075] Please refer to Figure 3 , Fig.11 and Fig.12 The film clamping and film throwing assembly 8 includes a film clamping and film throwing mounting plate 81, a clamping jaw lifting cylinder 82, a clamping jaw mounting plate 83, a clamping jaw tensioning cylinder 84 and at least two clamping jaws 85. The film clamping and film throwing mounting plate 81 is fixedly connected to the film cutting assembly 7; the clamping jaw lifting cylinder 82 is fixedly arranged on the side of the film clamping and film throwing mounting plate 81; the output end of the clamping jaw lifting cylinder 82 is connected to the clamping jaw mounting plate 83 and is used to drive the clamping jaw mounting plate 83 to move up and down; the clamping jaw tensioning cylinder 84 is vertically arranged with the clamping jaw mounting plate 83 and is fixedly connected with the clamping jaw mounting plate 83; the output end of the clamping jaw tensioning cylinder 84 is connected to the clamping jaw 85, It is also used to drive the clamping jaws 85 to clamp or release; the clamping jaw lifting cylinder 82 and the clamping jaw tightening cylinder 84 cooperate in movement to drive the clamping jaws 85 to perform lifting movement, clamping movement and loosening movement; the clamping jaws 85 are used to tear the waste film from the wafer; the film clamping and film discarding assembly 8 also includes a detection part 86, which is located on each clamping jaw 85, and the detection part 86 is used to detect the discarding of waste film; the film clamping and film discarding assembly 8 also includes a waste box 88 and at least two film discarding air blowing pipes 87, which are arranged above the film clamping and film discarding mounting plate 81, and the film discarding air blowing pipes 87 are used to blow the waste film into the waste box 88.

[0076] In specific implementation: the film clamping and throwing assembly 8 includes a film clamping and throwing mounting plate 81, a clamping jaw lifting cylinder 82, a clamping jaw mounting plate 83, a clamping jaw tightening cylinder 84 and at least two clamping jaws 85, the film clamping and throwing mounting plate 81 is fixedly connected to the film cutting assembly 7; the clamping jaw lifting cylinder 82 is fixedly arranged on the side of the film clamping and throwing mounting plate 81; the output end of the clamping jaw lifting cylinder 82 is connected to the clamping jaw mounting plate 83, and is used to drive the clamping jaw mounting plate 83 to lift and lower; the clamping jaw tightening cylinder 84 is vertically arranged and fixedly connected to the clamping jaw mounting plate 83; the output end of the clamping jaw tightening cylinder 84 is connected to the clamping jaw 85, and is used to drive the clamping jaw 85 to clamp or loosen; the clamping jaw lifting cylinder 82 and the clamping jaw tightening cylinder 84 cooperate to move to drive the clamping jaw 85 to lift, clamp and loosen. The film clamping and throwing assembly 8 also includes a detection member 86, and the detection member 8 6 is located on each clamping jaw 85, and the detection part 86 is used to detect the discarding of waste film; the film clamping and discarding assembly 8 also includes a waste box 88 and at least two film discarding air blowing pipes 87. The film discarding air blowing pipes 87 are arranged above the film clamping and discarding mounting plate 81, and the waste box 88 is arranged below the film cutting assembly 7 and is fixedly connected to the frame 1. The film discarding air blowing pipes 87 are used to blow the waste film into the waste box 88 to avoid incomplete discarding of the waste film. In a specific embodiment, the detection part 86 can be a photoelectric sensor, and each clamping jaw 85 is synchronously lowered to the waste film, and the waste film enters the inner layer of the clamping jaw 85. The clamping jaw 85 clamps the waste film and performs a lifting movement until the waste film is separated from the UV film. The film discarding air blowing pipes 87 blow air to blow the waste film into the waste box 88. The detection part 86 detects the discarding of waste on the clamping jaw 85. If there is still waste film remaining on the clamping jaw 85, repeated film discarding, air blowing or error warning is implemented.

[0077] Please refer to Figure 3 and Fig.13 The film laminating assembly 9 includes a downward pressure cylinder 92, which is used to apply downward pressure to the UV film so that the UV film is closely attached to the wafer.

[0078] In the specific implementation: the film laminating assembly 9 includes a film laminating frame 91 and a downward pressure cylinder 92. The film laminating frame 91 is fixedly connected to the frame 1, and the downward pressure cylinder 92 is arranged on the film laminating frame 91. The wafer carrying assembly 6 transports the wafer to the bottom of the laminating assembly, and the downward pressure cylinder 92 applies downward pressure to the UV film, so that the UV film and the wafer are more closely attached, effectively improving the laminating effect of the UV film on the wafer.

[0079] Please refer to Figure 2 and Fig.14 The film-tearing auxiliary component 10 is located in front of the film-sticking component 9 and is used to attach the film-tearing sticker to the surface of the film-sticked wafer.

[0080] In specific implementation: the film tearing auxiliary component 10 includes a film tearing sticker feeding component 101, a film tearing sticker lifting module 102, a film tearing sticker horizontal module 103, a film tearing sticker attachment component 104, a static electricity removal component 105 and an attachment detection component 106; the film tearing sticker feeding component 101 is placed vertically, and the film tearing sticker feeding component 101 is used to guide the film tearing sticker out and place it horizontally; the film tearing sticker lifting module 102 and the film tearing sticker horizontal module 103 are both arranged above the film tearing sticker feeding component 101, the film tearing sticker lifting module 102 is located on the side of the film tearing sticker horizontal module 103, and the film tearing sticker lifting module 104 is located on the side of the film tearing sticker horizontal module 103. 02 is connected to the tear film sticker horizontal module 103, and the tear film sticker lifting module 102 can move horizontally along the tear film sticker horizontal module 103; the tear film sticker attaching component 104 is connected to the tear film sticker lifting module 102, and the tear film sticker attaching component 104 can move up and down along the tear film sticker lifting module 102. The tear film sticker lifting module 102 and the tear film sticker horizontal module 103 cooperate to drive the tear film sticker attaching component 104 to move up and down and horizontally; the static electricity removal component 105 is arranged between the tear film sticker horizontal module 103 and the film-attached wafer. Component 105 is used to remove static electricity from the surface of the wafer film; the tear film sticker attaching component 104 obtains the tear film sticker from the tear film sticker loading component 101, and attaches the tear film sticker to the surface of the wafer film; the attachment detection component 106 is connected to the tear film sticker horizontal module 103, and the attachment detection component 106 is parallel to the tear film sticker lifting module 102. The attachment detection component 106 can synchronize the tear film sticker lifting module 102 and move horizontally along the tear film sticker horizontal module 103. The attachment detection component 106 is used to detect the attachment of the tear film sticker to the surface of the wafer film; in a specific embodiment, the attached There is also a layer of base film on the surface of the film wafer. Generally, the tear film sticker loading component 101 guides out the tear film sticker and places it horizontally, the tear film sticker attaching component 104 obtains the tear film sticker and transports it above the film-attached wafer, the static electricity removal component 105 removes static electricity from the surface of the film-attached wafer, the tear film sticker attaching component 104 attaches the tear film sticker to the surface of the wafer film, and at the same time, the attachment detection component 106 detects the attachment effect of the tear film sticker; the static electricity removal component 105 effectively avoids the damage of static electricity to the wafer, and the attachment detection component 106 monitors the attachment situation in real time, effectively reducing the attachment error rate of the tear film sticker.

[0081] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0082] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer UV laminating machine, comprising a frame, characterized in that: It includes a clean room, a material box assembly, a wafer handling assembly, an alignment assembly, a wafer bearing assembly, a film cutting assembly, a film clamping and throwing assembly, a film pasting assembly and a film tearing auxiliary assembly, wherein the film clamping and throwing assembly is arranged on the film cutting assembly, and the clean room, the material box assembly, the wafer handling assembly, the alignment assembly, the wafer bearing assembly, the film cutting assembly, the film pasting assembly and the film tearing auxiliary assembly are respectively arranged on the frame; The alignment component includes at least two alignment cameras and is used to correct the wafer position; The wafer carrying assembly is movably disposed below the film cutting assembly, the film clamping and throwing assembly, the film sticking assembly and the film tearing auxiliary assembly, and is used to carry the wafer; The film cutting assembly is located on one side of the frame; The film sticking assembly is located in front of the film cutting assembly; The film clamping and discarding assembly is located between the film cutting assembly and the film sticking assembly, and is used to clamp out and discard the waste film; The alignment component includes an alignment X-axis module, an alignment X-axis driving member, an alignment support frame, an alignment Y-axis module, an alignment Y-axis driving member, an alignment platform, an alignment rotation driving member and a correction plate; the alignment support frame moves along the direction of the alignment X-axis module under the drive of the alignment X-axis driving member; the alignment Y-axis module is fixed on the support frame, the alignment platform is arranged above the alignment Y-axis module, and the alignment platform moves along the direction of the alignment Y-axis module under the drive of the alignment Y-axis driving member; The correction plate is located above the alignment platform, the alignment rotation drive member is located below the alignment platform and is fixedly connected to the alignment platform, the output end of the alignment rotation drive member passes through the alignment platform and is fixedly connected to the correction plate, and the alignment rotation drive member drives the correction plate to rotate; the correction plate is used to correct the position of the wafer; the alignment X-axis drive member, the alignment Y-axis drive member and the alignment rotation drive member cooperate to drive the correction plate to move horizontally and rotate; The alignment component further comprises a plurality of module sensors, which are respectively arranged on the alignment X-axis module and the alignment Y-axis module and are used to detect the movement position of the object on the module; The alignment component also includes an alignment base, a first camera mounting plate, a first camera, a second camera connecting plate, a second camera mounting plate and a second camera; the alignment base is fixedly connected to the frame; the first camera is located on the side of the alignment base, and is fixedly connected to the alignment base through the first camera mounting plate; the second camera connecting plate is located above the alignment base, and is fixedly connected to the alignment base; the second camera is located below the second camera connecting plate, and is fixedly connected to the second camera connecting plate through the second camera mounting plate; the second camera is parallel to the first camera, and the second camera is used to perform preliminary alignment of the wafer on the correction plate, and the first camera is used to perform precise alignment of the wafer.

2. The wafer UV laminating machine according to claim 1, characterized in that: The wafer carrying assembly is provided with a position sensor for detecting the moving position of the wafer.

3. The wafer UV laminating machine according to claim 1, characterized in that: The film cutting assembly includes at least one film cutting knife, which performs multi-directional movement on the UV film and is used to cut the UV film into the same size and shape as the wafer.

4. The wafer UV laminating machine according to claim 1, characterized in that: The film clamping and film throwing assembly includes a film clamping and film throwing mounting plate, a jaw lifting cylinder, a jaw mounting plate, a jaw tensioning cylinder and at least two jaws, wherein the film clamping and film throwing mounting plate is fixedly connected to the film cutting assembly; the jaw lifting cylinder is fixedly arranged on the side of the film clamping and film throwing mounting plate; the output end of the jaw lifting cylinder is connected to the jaw mounting plate and is used to drive the jaw mounting plate to lift and lower; the jaw tensioning cylinder is vertically arranged and fixedly connected to the jaw mounting plate; the output end of the jaw tensioning cylinder is connected to the jaw and is used to drive the jaw to clamp or release; the jaw lifting cylinder and the jaw tensioning cylinder cooperate to drive the jaw to perform lifting and lowering movements, clamping movements and release movements; the jaw is used to tear the waste film off the wafer.

5. The wafer UV laminating machine according to claim 4, characterized in that: The film clamping and discarding assembly also includes a detection component, which is located on each of the clamping jaws and is used to detect the discarding of the waste film.

6. The wafer UV laminating machine according to claim 4, characterized in that: The film clamping and discarding assembly also includes a waste box and at least two film discarding air blowing pipes, wherein the film discarding air blowing pipes are arranged above the film clamping and discarding mounting plate, and the film discarding air blowing pipes are used to blow the waste film into the waste box.

7. The wafer UV laminating machine according to claim 1, characterized in that: The film sticking assembly comprises a downward pressure cylinder, and the downward pressure cylinder is used to apply downward pressure to the UV film so that the UV film is closely attached to the wafer.

8. The wafer UV laminating machine according to claim 1, characterized in that: It also includes a film-tearing auxiliary component, which is located in front of the film-sticking component and is used to stick a film-tearing sticker to the surface of the wafer that has been film-sticked.

9. The wafer UV laminating machine according to claim 1, characterized in that: The wafer handling assembly includes a wafer loading and unloading mechanism and a wafer transfer mechanism. The wafer loading and unloading mechanism is movably arranged between the material box assembly and the alignment assembly, and is used to transport the wafer from the material box assembly to the alignment assembly; the wafer transfer mechanism is movably arranged between the alignment assembly and the wafer supporting assembly, and is used to transport the wafer from the alignment assembly to the wafer supporting assembly.

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