A semiconductor wafer processing and flipping mechanism

Abstract

The present invention provides a semiconductor wafer processing and flipping mechanism, belonging to the technical field of semiconductor wafers. The invention includes a flipping motor, a support plate, a positioning plate, and a wafer. A plurality of non-contact suction cups are symmetrically arranged on the support plate, and further includes: a uniform flow support component, a drying component, and an induction component; by combining dynamic balance and top cover support, a stable flipping environment is constructed, improving the flipping accuracy and efficiency of the wafer, reducing the risk of damage. At the same time, elastic gaskets isolate moisture, ensuring the dryness of the non-contact suction cup area and enhancing the adsorption stability; gas enters the air inlet groove through the gap between the baffle and the top cover, and drives the rotation of the fan wheel. The rotation of the fan wheel helps to uniformize the air flow and guides the moisture to the drying module for dehumidification, reducing wafer contamination and improving the adsorption reliability; the sensor monitors the humidity in real time, warns of water droplet accumulation, facilitates the replacement of the drying module, and ensures the continuous and stable operation of the system.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafers, and more particularly, to a processing and flipping mechanism for semiconductor wafer sheets. Background Art

[0002] In today's era of rapid technological development, in the process of semiconductor testing and flipping, a wafer flipping device can be used to flip the wafer. The semiconductor industry has become an important driving force for global economic growth. Wafer processing, as the core link of semiconductor manufacturing, the fineness of its process and technical level are directly related to the quality and efficiency of the entire industrial chain. During the processing and testing of semiconductors such as wafers, multiple flips are usually required to inspect different surfaces.

[0003] After retrieval, it is found that in current wafer flipping devices, the wafers are fixed in contact or non-contact ways. In the contact way, mechanical jigs or suction cups are usually used to directly contact the wafer surface. This contact way may cause scratches, indentations or wear on the wafer surface during long-term or multiple flips, thus affecting the surface quality of the wafer and the performance of the final product. For the non-contact suction cup, its performance is easily affected by environmental humidity. For example, in wet etching areas, cleaning areas, etc., high humidity may cause poor gas fluidity, affecting the adsorption stability of the suction cup, thereby reducing the smoothness of the wafer during flipping.

[0004] How to invent a processing and flipping mechanism for semiconductor wafer sheets to solve these problems has become an urgent problem for those skilled in the art. Summary of the Invention

[0005] To make up for the above deficiencies, the present invention provides a processing and flipping mechanism for semiconductor wafer sheets, aiming to solve the problems mentioned in the above background.

[0006] The present invention is implemented as follows:

[0007] The present invention provides a processing and flipping mechanism for semiconductor wafer sheets, including a flipping motor, a support plate, a positioning plate, an external manipulator and a wafer. The lower side of the flipping motor is fixedly connected to the external manipulator. The output end of the flipping motor is fixedly connected to a rotating shaft. An installation seat is installed at the end of the rotating shaft. The support plate is fixedly connected to the installation seat through the positioning plate. A plurality of non-contact suction cups are symmetrically arranged on the support plate. It further includes:

[0008] A uniform flow support component: The uniform flow support component is arranged on the support plate and is used to provide support for the wafer;

[0009] A drying component: The drying component is arranged inside the uniform flow support component and is used to perform drying treatment on the inside of the uniform flow support component;

[0010] Induction component: The induction component is arranged on the uniform flow support component, and the induction component can judge whether the drying component is saturated when the wafer is flipped.

[0011] Preferably, an air delivery cylinder is fixedly installed at the bottom of the support plate, an air flow passage is arranged inside the support plate, and a plurality of non-contact suction cups are communicated through the air flow passage. An air delivery port is arranged through between the air delivery cylinder and the air flow passage, the bottom of the air delivery cylinder is communicated with an external air pipeline, an installation groove is arranged on the support plate, a position sensor is installed in the installation groove, and the non-contact suction cup is a cyclone type non-contact suction cup.

[0012] Preferably, the uniform flow support component includes an elastic gasket and a fan wheel. The elastic gasket is fixedly arranged on the support plate and arranged around the non-contact suction cup. One side of the elastic gasket facing the corresponding non-contact suction cup is provided with a through hole, and a plurality of exhaust holes are arranged on the side of the elastic gasket far from the corresponding non-contact suction cup. An air inlet groove is arranged inside the fan wheel.

[0013] Preferably, the elastic gasket is made of flexible rubber material, and a plurality of the exhaust holes are annularly distributed along the edge of the elastic gasket, and the end of the exhaust hole penetrates through the side wall of the elastic gasket.

[0014] Preferably, the fan wheel is located inside the elastic gasket. A limiting rod is installed on the lower side of the fan wheel, a positioning slot is arranged on the lower side of the fan wheel, a positioning block matched with the positioning slot is arranged at the upper end of the limiting rod, the limiting rod is fixedly clamped with the fan wheel, and the limiting rod penetrates through the side wall of the support plate and is rotatably connected with the support plate.

[0015] Preferably, a top cover is arranged on the top of the fan wheel, the top cover is detachably arranged, and the top cover abuts against the top of the inner cavity of the elastic gasket.

[0016] Preferably, the drying component includes a placement groove and a drying module. The placement groove is located at the center of the fan wheel, the drying module is placed inside the placement groove, a gas guide port is arranged on one side of the placement groove facing the air inlet groove, and a baffle is fixedly arranged at the air inlet end of the air inlet groove.

[0017] Preferably, the top of the baffle is above the bottom of the air inlet groove, there is a gap between the baffle and the top cover, and the drying module is made of silica gel material.

[0018] Preferably, the induction component includes an inductor, and the inductor is arranged on the top cover and directly above the air inlet groove.

[0019] Preferably, the inductor is attached to the inner side wall of the top cover in the form of a patch, and the inductor is a microelectromechanical system (MEMS) sensor.

[0020] The beneficial effects of the present invention are as follows:

[0021] By adopting a non-contact suction cup, direct contact between the wafer surface and mechanical fixtures or traditional suction cups is avoided. Moreover, by combining the dynamic balance mechanism with the support of the top cover, a stable and reliable wafer flipping environment can be formed. In this environment, the wafer can be flipped and processed according to a predetermined trajectory and position without worrying about tilting problems caused by uneven gas pressure or other factors. This not only improves the accuracy and efficiency of wafer flipping but also reduces the risk of wafer damage during processing. On the other hand, through the elastic gasket, the non-contact suction cup can be separated from the external processing chamber to ensure relatively dry air flow near the non-contact suction cup, avoiding the situation where gas directly contacts external moisture and improving the adsorption stability.

[0022] Gas enters the air intake groove through the gap between the baffle and the top cover and drives the rotation of the fan wheel. The rotation of the fan wheel helps to further uniformize the air flow. The air flow entering the air intake groove enters the drying module through the air guide port, which can absorb and lock the moisture in the air flow. The dried air flow after drying treatment is guided out through the exhaust hole, further reducing problems such as adsorption failure or wafer contamination caused by moisture during wafer processing, thereby improving the stability and reliability of wafer adsorption. After the wafer is flipped, the sensor monitors the humidity situation in the air intake groove and sends a reminder to the system once water droplets are found to accumulate, facilitating the operator to replace the drying module in a timely manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 FIG. 1 is a schematic diagram of the overall structure of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0025] Figure 2 FIG. 2 is a schematic diagram of the structure when a semiconductor wafer is adsorbed by a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0026] Figure 3 FIG. 3 is a right view schematic diagram of the structure when a semiconductor wafer is adsorbed by a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0027] Figure 4 FIG. 4 is a schematic diagram of the internal structure of a support plate of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0028] Figure 5 It is a schematic diagram of the non-contact suction cup distribution structure of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0029] Figure 6 It is a schematic diagram of the bottom structure of the support plate of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0030] Figure 7 It is a schematic diagram of the flow equalizing support component structure of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0031] Figure 8 It is a schematic diagram of the top cover structure of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0032] Figure 9 It is a schematic diagram of the partial explosion structure of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention;

[0033] Figure 10 It is a schematic diagram of the installation position structure of the sensor of a semiconductor wafer processing and flipping mechanism provided by an embodiment of the present invention.

[0034] In the figure: 1, flipping motor; 2, mounting seat; 3, support plate; 4, positioning plate; 5, elastic washer; 6, fan wheel; 7, top cover; 8, non-contact suction cup; 9, limit rod; 10, wafer; 11, rotating shaft; 31, installation groove; 32, position sensor; 51, exhaust hole; 61, air inlet groove; 62, baffle; 63, placement groove; 64, air guide port; 65, positioning slot; 66, drying module; 71, sensor; 81, air delivery cylinder; 82, air delivery port; 83, air flow passage; 91, positioning block. Specific embodiments

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] Example 1, refer to Figures 1 - 8, a semiconductor wafer processing and flipping mechanism, including a flipping motor 1, a support plate 3, a positioning plate 4, an external manipulator, and a wafer 10. The lower side of the flipping motor 1 is fixedly connected to the external manipulator to facilitate the movement of the wafer 10. The flipping motor 1 serves as the power source of the flipping mechanism, providing the rotational power required for the flipping of the wafer 10. The output end of the flipping motor 1 is fixedly connected to a rotating shaft 11, and a mounting seat 2 is installed at the end of the rotating shaft 11. The support plate 3 is fixedly connected to the mounting seat 2 through the positioning plate 4. A plurality of non-contact suction cups 8 are symmetrically arranged on the support plate 3. The wafer 10 can be adsorbed and supported by the support plate 3 and the plurality of non-contact suction cups 8, and then the flipping of the wafer 10 can be controlled by the flipping motor 1. Due to the non-contact design, the suction cups do not directly contact the surface of the wafer 10, thus avoiding possible contamination and damage. This fixing method not only ensures the safety of the wafer 10 during the flipping process but also allows the wafer 10 to be accurately positioned and moved during the processing. It further includes:

[0037] Uniform flow support component: The uniform flow support component is arranged on the support plate 3 and is used to provide support for the wafer 10;

[0038] Drying component: The drying component is arranged inside the uniform flow support component and is used to dry the inside of the uniform flow support component;

[0039] Induction component: The induction component is arranged on the uniform flow support component and can judge whether the drying component is saturated when the wafer 10 is flipped.

[0040] Furthermore, an air delivery cylinder 81 is fixedly installed at the bottom of the support plate 3. An air flow passage 83 is arranged inside the support plate 3. The plurality of non-contact suction cups 8 are connected through the air flow passage 83 to ensure that each suction cup can obtain a uniform and stable air flow supply. An air delivery port 82 is provided between the air delivery cylinder 81 and the air flow passage 83. These air delivery ports 82 are the channels for the air flow to enter the air flow passage 83 from the air delivery cylinder 81. The bottom of the air delivery cylinder 81 is connected to an external air pipeline. The external air pipeline is responsible for introducing the air flow provided by an air source (such as a vacuum pump or a compressed air source) into the air delivery cylinder 81, and then delivering it to the non-contact suction cups 8 through the air delivery ports 82 and the air flow passage 83. An installation groove 31 is arranged on the support plate 3, and a position sensor 32 is installed in the installation groove 31. The position sensor 32 can real-time monitor the position information of the wafer 10 and feedback this information to the control system. The control system adjusts the actions of the flipping motor 1 and other actuators according to the feedback signal of the position sensor 32 to ensure that the wafer 10 can be flipped and processed according to the predetermined trajectory and position. The non-contact suction cup 8 is a cyclone type non-contact suction cup. The cyclone type non-contact suction cup uses high-speed air flow to generate negative pressure and air flow effect, enabling the suction cup to grasp and carry without contacting the target object, reducing the physical contact between the suction cup and the wafer 10 and lowering the contamination risk.

[0041] Further, the uniform flow support assembly includes an elastic washer 5 and a fan wheel 6. The elastic washer 5 is fixedly arranged on the support plate 3 and is arranged around the non-contact suction cup 8. This layout helps to ensure the uniform distribution of air flow around the suction cup, thereby improving the adsorption effect. One side of the elastic washer 5 facing the corresponding non-contact suction cup 8 is provided with a through hole, and several exhaust holes 51 are arranged on the side of the elastic washer 5 away from the corresponding non-contact suction cup 8. An air inlet groove 61 is arranged inside the fan wheel 6. When the wafer 10 abuts against the elastic washer 5, at this time, a part of the gas in the elastic washer 5 will act on the fan wheel 6 through the air inlet groove 61, thereby driving the fan wheel 6 to rotate. The rotation of the fan wheel 6 can make the gas between the elastic washer 5 and the wafer 10 more uniform to improve the adsorption effect, while the other part of the gas will be discharged from the exhaust holes 51.

[0042] It should be noted that the elastic washer 5 is made of flexible rubber material. This material has good elasticity and sealing performance, can deform under pressure to better fit the surface of the wafer 10, and can effectively isolate external impurities and gas from entering. The several exhaust holes 51 are annularly distributed along the edge of the elastic washer 5, and the end of the exhaust hole 51 penetrates the side wall of the elastic washer 5. After the wafer 10 is adsorbed by the non-contact suction cup 8, as the adsorption force increases, the wafer 10 will gradually approach the non-contact suction cup 8 and finally abut against the surface of the elastic washer 5 below it. Due to the flexibility and compressibility of the elastic washer 5, the pressure distribution on the surface of the wafer 10 will become more uniform, which helps to reduce the deformation or damage of the wafer 10 caused by uneven pressure during the flipping process. At this time, the excess gas will be discharged through the exhaust holes 51. After the wafer 10 is completely adsorbed and contacts the elastic washer 5, the whole system will reach a dynamic balance state. At this time, factors such as adsorption force, air flow, pressure distribution, and exhaust effect will coordinate with each other to ensure the stability and reliability of the wafer 10 during the flipping process.

[0043] Further, the fan wheel 6 is located inside the elastic washer 5. A limiting rod 9 is installed on the lower side of the fan wheel 6. A positioning slot 65 is arranged on the lower side of the fan wheel 6. The upper end of the limiting rod 9 is provided with a positioning block 91 that matches the positioning slot 65. The limiting rod 9 is fixedly clamped with the fan wheel 6 through the cooperation of the positioning block 91 and the positioning slot 65, thus realizing the positioning of the fan wheel 6. The limiting rod 9 penetrates the side wall of the support plate 3 and is rotatably connected to the support plate 3 to ensure that the fan wheel 6 can rotate.

[0044] It should be noted that a top cover 7 is arranged on the top of the fan wheel 6. The top cover 7 is detachably arranged. The top cover 7 abuts against the top of the inner cavity of the elastic washer 5. The top cover 7 can provide support for the elastic washer 5, and thus can support the wafer 10, while avoiding the contact between the wafer 10 and the top cover 7.

[0045] In this embodiment, the external gas pipeline introduces the air flow from a gas source (such as a vacuum pump or a compressed air source) into the air cylinder 81. Through the air outlet 82 at the bottom of the air cylinder 81, the air flow enters the air passage 83 inside the support plate 3. These air passages 83 evenly distribute the air flow to each non-contact suction cup 8. Each non-contact suction cup 8 (especially the cyclone-type non-contact suction cup) utilizes the high-speed air flow to generate negative pressure and air flow effects, so as to grasp and transport the wafer 10 without contacting it.

[0046] When the non-contact suction cup 8 moves below the wafer 10, the negative pressure generated by the suction cup adsorbs the wafer 10. As the adsorption force increases, the wafer 10 gradually approaches and finally abuts against the surface of the elastic gasket 5 below. Due to the flexibility and compressibility of the elastic gasket 5, when the wafer 10 contacts it, the gasket can deform to better fit the surface of the wafer 10, so that the pressure distribution on the surface of the wafer 10 becomes more uniform, which helps to reduce the deformation or damage of the wafer 10 caused by uneven pressure during the flipping process.

[0047] When the wafer 10 abuts against the elastic gasket 5, a part of the gas in the gasket acts on the fan wheel 6 through the air inlet groove 61, thereby driving the fan wheel 6 to rotate. The rotation of the fan wheel 6 helps to further uniformize the air flow between the elastic gasket 5 and the wafer 10 and improve the adsorption effect; during the process of the wafer 10 being adsorbed and contacting the elastic gasket 5, the excess gas will be discharged through the exhaust holes 51 on the edge of the elastic gasket 5. These exhaust holes 51 are annularly distributed along the edge of the gasket, which helps to ensure the uniform discharge of the air flow.

[0048] After the wafer 10 is completely adsorbed and contacts the elastic gasket 5, the whole system will reach a dynamic equilibrium state. At this time, factors such as the adsorption force, air flow, pressure distribution, rotation of the fan wheel 6, and exhaust effect will coordinate with each other to ensure the stability and reliability of the wafer 10 during the flipping process; the dynamic equilibrium mechanism ensures that during the adsorption process of the wafer 10, the pressure distribution on its surface is uniform and stable. This is mainly due to the flexibility and compressibility of the elastic gasket 5, which can make adaptive adjustments according to the shape and position of the wafer 10, so as to ensure that the pressures received by each point on the surface of the wafer 10 are approximately equal. At the same time, the rotation of the fan wheel 6 further promotes the uniform distribution of the air flow between the wafer 10 and the elastic gasket 5, enhancing the stability and consistency of the adsorption effect.

[0049] The supporting role of the top cover 7: The top cover 7, as the supporting structure above the elastic gasket 5, is designed to cleverly avoid direct contact with the wafer 10 while providing sufficient supporting force for the wafer 10. This supporting force helps to maintain the smoothness of the wafer 10 during the flipping process and prevent it from tilting due to air flow fluctuations, mechanical vibrations or other external interferences.

[0050] After the wafer 10 is stably adsorbed, the flipping motor 1 starts to work. The output end of the flipping motor 1 drives the mounting seat 2 and the support plate 3 to rotate together through the rotating shaft 11. As the support plate 3 rotates, the wafer 10 also flips accordingly. Since the wafer 10 is firmly adsorbed on the support plate 3 by the non-contact suction cup 8, the wafer 10 will not slip or move unnecessarily during the flipping process. The flipping motor 1 can control the flipping angle according to a preset program or an external instruction, which allows the wafer 10 to be flipped multiple times during the processing to meet different processing requirements. When the flipping reaches the predetermined angle, the flipping motor 1 stops working. At this time, the wafer 10 has completed the flipping action and is ready for the next processing or detection.

[0051] On the other hand, through the elastic gasket 5, the non-contact suction cup 8 can be separated from the wafer 10 processing chamber with a relatively high humidity (such as a wet etching area, a cleaning area, etc. with a relatively high humidity wafer 10). Through the sealing effect of the elastic gasket 5, the non-contact suction cup 8 and the air flow inside it can be isolated from the external moisture, forming a relatively dry working environment. In this way, even if the humidity of the external processing chamber is relatively high, it will not directly affect the air flow quality near the suction cup, thus ensuring the stability and reliability of the adsorption process.

[0052] In summary, in this embodiment, by combining the dynamic balance mechanism with the supporting effect of the top cover 7, a stable and reliable flipping environment for the wafer 10 can be formed. In this environment, the wafer 10 can flip and be processed according to a predetermined trajectory and position without worrying about the rollover problem caused by uneven gas pressure or other factors. This not only improves the flipping accuracy and efficiency of the wafer 10 but also reduces the risk of damage to the wafer 10 during the processing, laying a solid foundation for the subsequent semiconductor manufacturing process. On the other hand, through the elastic gasket 5, the non-contact suction cup 8 can be separated from the external processing chamber to ensure the relative dryness of the air flow near the non-contact suction cup, avoiding the situation where the gas directly contacts the external moisture and improving the adsorption stability.

[0053] Embodiment 2, referring to Figures 7 - 9 , the drying component includes a placement groove 63 and a drying module 66. The placement groove 63 is located at the center of the fan wheel 6. The drying module 66 is placed inside the placement groove 63. The top cover 7 can be disassembled to take out the drying module 66 for easy replacement. A gas guide port 64 is opened on one side of the placement groove 63 facing the air intake groove 61. The gas guide port 64 serves as a channel for the air flow to enter the drying module 66. This layout enables the drying module 66 to directly act on the air flow introduced by the air intake groove 61, thereby effectively removing the moisture in the air flow. A baffle 62 is fixedly arranged at the air intake end of the air intake groove 61.

[0054] It should be noted that the top of the baffle 62 is located above the bottom of the air intake groove 61, and there is a gap between the baffle 62 and the top cover 7. With such a setting, the gas can directly enter the air intake groove 61 through the gap between the baffle 62 and the top cover 7, which will generate a certain pressure, thereby driving the fan wheel 6 to rotate. Furthermore, the moisture inside the elastic washer 5 can be effectively absorbed into the air intake groove 61. If there is still moisture in the air intake groove 61, this moisture may condense into water droplets. However, due to the existence of the baffle 62, these water droplets are effectively blocked inside the air intake groove 61 and will not flow out directly. The drying module 66 is made of silica gel material. The silica gel drying module 66 can efficiently absorb and lock the moisture in the air flow, ensuring that the air flow near the suction cup is dry and improving the adsorption stability.

[0055] In this embodiment, the external gas enters the air intake groove 61 through the gap between the baffle 62 and the top cover 7. During this process, the gas generates a certain pressure, driving the rotation of the fan wheel 6. The air flow entering the air intake groove 61 enters the drying module 66 through the air guide port 64. In the drying module 66, the silica gel material efficiently absorbs and locks the moisture in the air flow, ensuring that the air flow passing through the drying module 66 becomes dry.

[0056] If there is still moisture in the air intake groove 61 that has not been completely removed, this moisture may condense into water droplets due to temperature reduction or pressure change. However, due to the existence of the baffle 62, these water droplets are effectively blocked inside the air intake groove 61 and will not directly flow out and contaminate other components; after long-term use, the drying module 66 may reach a saturated state. At this time, the drying module 66 needs to be replaced or regenerated to ensure its continuous and effective dehumidification ability. The top cover 7 can be disassembled to take out the drying module 66, which is convenient for replacement.

[0057] The dried air flow processed by the drying module 66 is guided to the vicinity of the suction cup, providing a stable and dry air flow environment for the adsorption of the wafer 10. This helps to improve the stability and reliability of the adsorption of the wafer 10 and reduce problems such as adsorption failure or wafer 10 contamination caused by moisture.

[0058] Embodiment Three. Refer to Figures 8 - 10 , the induction component includes an inductor 71. The inductor 71 is arranged on the top cover 7 and directly above the air intake groove 61, ensuring that when the wafer 10 is reversed (assuming that the drying module 66 is saturated at this time and there is a certain amount of water droplets accumulated in the air intake groove 61), the water droplets in the air intake groove 61 will directly fall onto the inductor 71. At this time, the inductor 71 will send a reminder to the system to replace the drying module 66.

[0059] It should be noted that the sensor 71 is attached to the inner wall of the top cover 7 in the form of a patch, which is convenient for installation and applicable to various complex scenarios. The sensor 71 is a microelectromechanical system (MEMS) sensor. A MEMS sensor is a miniature sensor that integrates a micro-mechanical structure and an electronic circuit, and has the advantages of small size, light weight, low power consumption, and high precision. MEMS technology can achieve very high measurement accuracy and is suitable for precision detection. Due to its tiny size, MEMS sensors usually have low power consumption and are very suitable for battery-powered applications; MEMS sensors can detect very small moisture changes because the micro-mechanical structure inside can accurately sense changes in environmental parameters and convert these changes into measurable electrical signals.

[0060] In this embodiment, when the drying module 66 is saturated or fails, a certain amount of water droplets may accumulate in the air intake groove 61. During the reverse rotation of the wafer 10, due to the action of gravity, these water droplets will fall onto the sensor 71 located directly above the air intake groove 61. When the water droplets come into contact with the sensor 71, the MEMS sensor immediately senses the change in moisture and generates a corresponding electrical signal. The sensor 71 transmits the detected electrical signal to the control unit of the system, and the control unit processes and analyzes these signals to determine whether there are indeed water droplets in the air intake groove 61. Once it is confirmed that there is water droplet accumulation in the air intake groove 61 (indicating that the environmental humidity is relatively high at this time), the control unit will immediately send a reminder signal to the system. This reminder signal can appear in the form of sound, light signal or digital information, depending on the design requirements of the system; after receiving the reminder signal, the operator can replace the drying module 66 in a timely manner according to the reminder of the system. By replacing the drying module 66, the relatively dry state of the gas can be restored, thus ensuring the continuous and stable operation of the system and the stable adsorption of the wafer 10.

[0061] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0062] It should be noted that the specific model specifications of the motor need to be selected and determined according to the actual specifications of the device, etc. The specific selection calculation method adopts the existing technology in this field, so it will not be elaborated in detail.

[0063] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, various modifications and variations can be made to the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor wafer processing flipping mechanism, comprising a flipping motor (1), a support plate (3), a positioning plate (4), an external manipulator and a wafer (10), wherein the lower side of the flipping motor (1) is fixedly connected to the external manipulator, the output end of the flipping motor (1) is fixedly connected to a rotating shaft (11), the end of the rotating shaft (11) is installed with a mounting seat (2), the support plate (3) is fixedly connected to the mounting seat (2) through the positioning plate (4), and a plurality of non-contact suction cups (8) are symmetrically arranged on the support plate (3), characterized in that: Also includes: A uniform flow support component: the uniform flow support component is arranged on the support plate (3), and the uniform flow support component is used to provide support for the wafer (10); The uniform flow support assembly comprises an elastic washer (5) and a fan wheel (6); the elastic washer (5) is fixedly arranged on the support plate (3) and arranged around the non-contact suction cup (8); a side of the elastic washer (5) facing the corresponding non-contact suction cup (8) is provided through, and a side of the elastic washer (5) away from the corresponding non-contact suction cup (8) is provided with a plurality of exhaust holes (51); an air intake groove (61) is provided inside the fan wheel (6); the fan wheel (6) is located on the inner side of the elastic washer (5); the fan wheel (6) A limiting rod (9) is installed on the lower side of the impeller (6), a positioning slot (65) is provided on the lower side of the impeller (6), a positioning block (91) matching the positioning slot (65) is provided on the upper end of the limiting rod (9), the limiting rod (9) is fixedly connected to the impeller (6), the limiting rod (9) passes through the side wall of the support plate (3) and is rotatably connected to the support plate (3); a top cover (7) is provided on the top of the impeller (6), the top cover (7) is detachably provided, and the top cover (7) abuts against the top of the inner cavity of the elastic gasket (5); Drying component: the drying component is arranged inside the uniform flow support component, and the drying component is used to dry the inside of the uniform flow support component; The drying component comprises a placement groove (63) and a drying module (66), the placement groove (63) being located at the center of the impeller (6), the drying module (66) being placed inside the placement groove (63), an air guide port (64) being provided on one side of the placement groove (63) facing the air inlet groove (61), and a baffle (62) being fixedly provided at the air inlet end of the air inlet groove (61); Sensing component: the sensing component is arranged on the uniform flow support component, and the sensing component can judge whether the drying component is saturated when the wafer (10) is turned over.

2. A semiconductor wafer processing flipping mechanism according to claim 1, characterized in that: A gas cylinder (81) is fixedly mounted on the bottom of the support plate (3), an air flow passage (83) is provided inside the support plate (3), a plurality of non-contact suction cups (8) are connected via the air flow passage (83), a gas delivery port (82) is provided between the gas cylinder (81) and the air flow passage (83), the bottom of the gas cylinder (81) is connected to an external gas delivery pipeline, a mounting groove (31) is provided on the support plate (3), a position sensor (32) is installed in the mounting groove (31), and the non-contact suction cup (8) is a cyclone type non-contact suction cup.

3. A semiconductor wafer processing flipping mechanism according to claim 1, characterized in that: The elastic gasket (5) is made of a flexible rubber material, and a plurality of the exhaust holes (51) are distributed in a ring shape along the edge of the elastic gasket (5), and the ends of the exhaust holes (51) penetrate the side wall of the elastic gasket (5).

4. The semiconductor wafer processing flipping mechanism according to claim 1, characterized in that: The top of the baffle (62) is located above the bottom of the air inlet groove (61), a gap exists between the baffle (62) and the top cover (7), and the drying module (66) is made of silica gel.

5. The semiconductor wafer processing flipping mechanism according to claim 1, characterized in that: The sensing component comprises a sensor (71), and the sensor (71) is arranged on the top cover (7) and is located directly above the air inlet groove (61).

6. A semiconductor wafer processing flipping mechanism according to claim 5, characterized in that: The sensor (71) is arranged in the form of a patch on the inner wall of the top cover (7), and the sensor (71) is a micro-electromechanical system sensor.

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