A wafer lifting device for a semiconductor

Abstract

The present invention provides a wafer lifting device for semiconductors, belonging to the technical field of semiconductor processing equipment. The invention includes a process chamber, a support part and a wafer, and further includes: a lifting assembly, a uniform gas flow and ventilation assembly, and a gas blocking and exhaust assembly; through the settings of an air storage tank and an annular baffle, it is ensured that the movable part receives a uniform and stable thrust during the rising process, avoiding wear, tilting or jamming phenomena caused by uneven pressure. At the same time, only one air delivery pump is required to achieve uniform gas discharge, without the need for an additional valve control system; through the magnetic control mechanism, the opening and closing control of the ventilation slot is realized during the lifting process, and automatic exhaust is carried out after the lifting is completed, without the need for additional pumping treatment, saving energy consumption; the corrugated sleeve and the gasket provide double protection to ensure support even in extreme cases, and the spring and the corrugated sleeve cooperate to buffer and damp vibration to protect the wafer; the ejector pins can be flexibly adjusted to adapt to the lifting treatment of wafers of multiple specifications, enhancing the versatility of the equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and more particularly, to a wafer lifting device for semiconductors. Background Art

[0002] In the field of semiconductor integrated circuit manufacturing, integrated circuits are usually fabricated on wafers, and the fabrication of a complete chip requires multiple steps. During each process step, the wafer needs to be placed into the process chamber of the corresponding semiconductor device. The placement of the wafer is automated, and a wafer lifting device is required during the automatic picking and placing process of the wafer. The wafer lifting device is used to raise and lower the wafer in the process chamber to facilitate the picking and placing by the robot arm.

[0003] After retrieval, it is found that most of the existing technologies use lifting ejector pins such as cylinders and air sources. Cylinders usually require a certain space in the equipment for installation, which may limit the flexibility of the equipment design. In some compact process chambers, the installation position of the cylinder may be difficult to meet, thus restricting the application range of the wafer lifting device. If an air source is used, in order to ensure the uniformity of the air source input, an additional valve control system needs to be installed to adjust the air pressure, which increases the complexity and cost of the equipment. If not installed, the air source input will be uneven, which will lead to wear, tilt or jamming during the wafer lifting process, affecting the processing quality of the wafer and the stability of the equipment.

[0004] How to invent a wafer lifting device for semiconductors to solve these problems has become an urgent problem for those skilled in the art. Summary of the Invention

[0005] To make up for the above deficiencies, the present invention provides a wafer lifting device for semiconductors, aiming to solve the problems mentioned in the above background.

[0006] The present invention is implemented as follows:

[0007] The present invention provides a wafer lifting device for semiconductors, including a process chamber, a support part, and a wafer. The support part is composed of a flat part and a support shaft. A suction cup is installed on the flat part. The flat part is located inside the process chamber and is used to support the wafer. A plurality of through grooves are correspondingly and spacedly arranged inside the flat part and the suction cup. The support shaft is connected to the bottom of the flat part and extends from inside the process chamber to outside the process chamber. The device further includes:

[0008] A lifting assembly: The lifting assembly is arranged inside the process chamber and is used to elastically lift the wafer;

[0009] Uniform air flow component: The uniform air flow component is arranged inside the process chamber, and is used to ensure that the air flow acts on the elastic lifting component evenly.

[0010] Exhaust gas blocking component: The exhaust gas blocking component is arranged at the bottom of the process chamber, and controls the air path flow inside the lifting component according to the state of the uniform air flow component.

[0011] Preferably, the lifting component includes a movable part, an installation cavity and a corrugated sleeve. The installation cavity is located inside the bottom side wall of the process chamber. A sealing pad is installed at the bottom of the movable part. The top of the movable part penetrates through the inner bottom wall of the process chamber. A thimble is installed at the top of the movable part. A screw rod is arranged at the bottom of the thimble. A thread groove meshing with the screw rod is arranged at the top of the movable part.

[0012] Preferably, the upper end of the corrugated sleeve is fixedly connected to the bottom of the sealing pad, and the lower end is fixedly connected to the bottom of the installation cavity. A third spring is arranged inside the corrugated sleeve. The end parts of the third spring are respectively fixedly connected to the bottom of the sealing pad and the inner bottom wall of the corrugated sleeve. The bottoms of the installation cavity and the corrugated sleeve are both through settings.

[0013] Preferably, the installation cavity and the corrugated sleeve are both annular and coaxial with the support shaft. The thimble is arranged in a matching manner with the through groove. The number of the thread grooves is equal to that of the through grooves. The thimbles and the third springs are annularly distributed along the edge of the movable part.

[0014] Preferably, the movable part is in sliding seal connection with the top of the installation cavity, and the sealing pad is in sliding seal connection with the inner wall of the installation cavity. When the third spring is in the initial state, the top of the thimble is located inside the through groove. When the bottom of the movable part contacts the top of the installation cavity, the top of the thimble is located above the top of the flat part.

[0015] Preferably, the uniform air flow component includes an air storage tank arranged inside the bottom of the process chamber. A trachea is connected to the bottom wall of the air storage tank. An exhaust ring groove is arranged on one side of the air storage tank facing the outside of the flat part.

[0016] Preferably, the air storage tank has a certain height and is annularly arranged. The exhaust ring groove is located at the bottom of the air storage tank. The upper end of the trachea is located in the middle of the air storage tank. The lower end of the trachea extends to the outside of the process chamber. The lower end of the trachea is connected to an air delivery pump through a pipeline. The end of the exhaust ring groove is communicated with the bottom of the installation cavity.

[0017] Preferably, the uniform air flow component further includes a boss provided at the bottom of the process chamber and a limiting cavity provided at the bottom of the exhaust ring groove. The top of the limiting cavity penetrates the bottom wall of the exhaust ring groove. A plurality of first springs are annularly connected along the edge of the bottom wall of the limiting cavity. The upper end of the first spring is fixedly connected with an annular stopper. One side of the annular stopper facing the air storage tank is rhombus-shaped. The annular stopper is annular and its cross-section is a right trapezoid. The top of the annular stopper in the initial state of the first spring forms a contact seal with the top of the exhaust ring groove.

[0018] Preferably, the air blocking and exhausting component includes a sliding cavity provided at the bottom of the boss, an air vent groove, and a magnetic column installed at the bottom of the annular stopper. A waist-shaped hole is penetrated between the limiting cavity and the sliding cavity. A second spring is fixedly connected to the side wall of the sliding cavity close to the waist-shaped hole. The end of the second spring is fixedly connected with a current-blocking magnetic plate. The end of the air vent groove penetrates the side walls of the process chamber and the boss. A filter plate is installed at the bottom of the air vent groove.

[0019] Preferably, the magnetic column is located inside the first spring. The width of the current-blocking magnetic plate is greater than the width of the air vent groove. The opposite surfaces of the magnetic column and the current-blocking magnetic plate are set with the same-pole magnetism. In the initial state, the current-blocking magnetic plate is located in the sliding cavity and the bottom of the magnetic column is located above the sliding cavity. When the magnetic column and the current-blocking magnetic plate are aligned, a contact seal is formed between the current-blocking magnetic plate and the air vent groove.

[0020] The beneficial effects of the present invention are as follows:

[0021] 1. Through the settings of the air storage tank and the annular baffle, the uniform air flow component can ensure that the moving part receives a uniform and stable thrust during the rising process, thus avoiding wear, tilt or jamming caused by uneven pressure. This not only extends the service life of the equipment, but also improves the accuracy and stability of wafer lifting. At the same time, only one air delivery pump is needed to realize the transportation, storage and uniform discharge of gas, without an additional valve control system, which not only reduces the manufacturing cost and maintenance difficulty of the system, but also improves the reliability and stability of the system.

[0022] 2. The air blocking and exhausting component realizes the opening and closing control of the air vent groove during the lifting process through a magnetic control mechanism, ensures the stable flow of gas during the lifting process, and will automatically exhaust after the lifting is completed, without additional pump suction treatment, saving energy consumption. The overall structure is simple, reducing the failure points and maintenance costs.

[0023] 3. On the basis that the corrugated sleeve serves as the main sealing and buffering element, a gasket is added to the movable part, ensuring that even in extreme cases such as accidental rupture of the corrugated sleeve, the wafer can be safely lifted, supported, and lowered, reducing the risk of production interruption and wafer loss; the third spring and the corrugated sleeve cooperate to provide good elastic support and buffering effect for the lifting and lowering of the movable part, significantly reducing the vibration and impact during the lifting and lowering processes, and effectively protecting the wafer from damage; the number and height of the ejector pins can be flexibly adjusted according to the specifications of the wafer, meeting the processing requirements of wafers of different sizes and weights, and enhancing the versatility and adaptability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 is a schematic diagram of the overall structure of a wafer lifting device for semiconductors provided by an embodiment of the present invention;

[0026] Figure 2 is a schematic diagram of the bottom structure of a wafer lifting device for semiconductors provided by an embodiment of the present invention;

[0027] Figure 3 is a schematic diagram of the sectional structure of a wafer lifting device for semiconductors provided by an embodiment of the present invention;

[0028] Figure 4 is a wafer lifting device for semiconductors provided by an embodiment of the present invention Figure 3 schematic diagram of the enlarged structure at A therein;

[0029] Figure 5 is a wafer lifting device for semiconductors provided by an embodiment of the present invention Figure 3 schematic diagram of the enlarged structure at B therein;

[0030] Figure 6 is a wafer lifting device for semiconductors provided by an embodiment of the present invention Figure 5 schematic diagram of the enlarged structure at C therein;

[0031] Figure 7 is a schematic diagram of the sectional structure of the process chamber of a wafer lifting device for semiconductors provided by an embodiment of the present invention;

[0032] Figure 8Schematic diagram of the working structure of the uniform air flow and ventilation component of a wafer lifting device for semiconductors provided by an embodiment of the present invention;

[0033] Figure 9 A wafer lifting device for semiconductors provided by an embodiment of the present invention Figure 8 Schematic diagram of the enlarged structure at position D in it.

[0034] In the figure: 1, process chamber; 2, flat part; 3, movable part; 4, suction cup; 5, installation cavity; 6, air storage tank; 7, annular stopper; 8, current-limiting magnetic plate; 9, corrugated sleeve; 10, wafer; 11, boss; 12, ventilation groove; 13, filter plate; 21, support shaft; 22, through groove; 31, ejector pin; 32, screw; 33, screw groove; 34, gasket; 61, ventilation pipe; 62, exhaust ring groove; 71, limiting cavity; 72, first spring; 73, magnetic column; 74, waist-shaped hole; 81, sliding cavity; 82, second spring; 91, third spring. Specific embodiments

[0035] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Example 1, referring to Figures 1-5 , a wafer lifting device for semiconductors, including a process chamber 1, a support part and a wafer 10, providing a closed environment. The process chamber 1 is used for various processing processes of the wafer 10, such as etching, deposition, etc. The support part is composed of a flat part 2 and a support shaft 21. A suction cup 4 is installed on the flat part 2. The flat part 2 is located inside the process chamber 1 and is used to support the wafer 10. A number of through grooves 22 are correspondingly and spaced apart inside the flat part 2 and the suction cup 4. The support shaft 21 is connected to the bottom of the flat part 2 and extends from inside the process chamber 1 to outside the process chamber 1. The support shaft 21 can be connected to a power source such as a motor to drive the support part to rotate and / or lift, thereby driving the wafer 10 to rotate and / or lift. Source lines such as power lines and radio frequency lines can be accommodated in the support shaft 21. It also includes:

[0037] Lifting component: The lifting component is arranged inside the process chamber 1 and is used for elastically lifting the wafer 10;

[0038] Uniform air flow and ventilation component: The uniform air flow and ventilation component is arranged inside the process chamber 1 and is used to ensure that the air flow acts on the elastic lifting component evenly;

[0039] Exhaust gas blocking assembly: The exhaust gas blocking assembly is arranged at the bottom of the process chamber 1, and the exhaust gas blocking assembly controls the gas flow inside the lifting assembly according to the state of the uniform gas flow assembly.

[0040] Furthermore, the lifting assembly includes a movable part 3, a mounting cavity 5 and a corrugated sleeve 9. The mounting cavity 5 is located inside the bottom side wall of the process chamber 1, providing a sliding space for the movable part 3. A sealing gasket 34 is installed at the bottom of the movable part 3. The top of the movable part 3 penetrates the inner bottom wall of the process chamber 1. A thimble 31 is installed at the top of the movable part 3. A screw rod 32 is arranged at the bottom of the thimble 31. A thread groove 33 meshing with the screw rod 32 is arranged at the top of the movable part 3. The thimble 31 is used to directly lift the wafer 10. A screw rod 32 is arranged at its bottom, meshing with the thread groove 33 at the top of the movable part 3, realizing the fixation and adjustment of the thimble 31.

[0041] The upper end of the corrugated sleeve 9 is fixedly connected to the bottom of the sealing gasket 34, and the lower end is fixedly connected to the bottom of the mounting cavity 5. A third spring 91 is arranged inside the corrugated sleeve 9. The ends of the third spring 91 are respectively fixedly connected to the bottom of the sealing gasket 34 and the inner bottom wall of the corrugated sleeve 9. Through the arrangement of the corrugated sleeve 9 and the third spring 91, elastic support can be provided for the lifting of the movable part 3 (thimble 31). The bottoms of the mounting cavity 5 and the corrugated sleeve 9 are both through - set, facilitating the ventilation into the corrugated sleeve 9.

[0042] Both the mounting cavity 5 and the corrugated sleeve 9 are annular and coaxial with the support shaft 21. The thimble 31 is arranged in a matching manner with the through - slot 22. The number of the thread grooves 33 is equal to that of the through - slots 22. The number of thimbles 31 can be adjusted according to the specifications of the wafer 10. The thimbles 31 and the third springs 91 are annularly distributed along the edge of the movable part 3, ensuring that the wafer 10 can be evenly supported and preventing it from tilting.

[0043] It should be noted that both the connection between the movable part 3 and the top of the mounting cavity 5 and the connection between the sealing gasket 34 and the inner wall of the mounting cavity 5 are sliding - sealed connections, ensuring the sealing of the inner wall of the mounting cavity 5. Even if the corrugated sleeve 9 accidentally breaks, the gas can still push the movable part 3 to move through the sealing gasket 34, providing double protection. When the third spring 91 is in the initial state, the top of the thimble 31 is located inside the through - slot 22 and does not contact the wafer 10. At this time, the wafer 10 is supported by the flat part 2 and the suction cup 4 together. When the bottom of the movable part 3 contacts the top of the mounting cavity 5, the top of the thimble 31 is located above the top of the flat part 2, ensuring that the wafer 10 can be effectively lifted, facilitating the picking and placing by an external manipulator.

[0044] In this embodiment, initial state: In the initial state of the third spring 91, the top of the thimble 31 is located inside the through - slot 22 and does not contact the wafer 10. The wafer 10 is stably supported by the flat part 2 and the suction cup 4. At this time, corresponding processing can be performed on the wafer 10.

[0045] Lifting process: When it is necessary to lift the wafer 10 during the semiconductor processing flow, an external driving mechanism (such as a compressed gas source, etc.) starts to work, applying an upward force to the movable part 3. This force pushes the movable part 3 to slide upward along the installation cavity 5. As the movable part 3 rises, the ejector pin 31 at its top also gradually rises along the through groove 22. When the top of the ejector pin 31 exceeds the top of the planar part 2, the ejector pin 31 contacts the bottom of the wafer 10 and continues to rise to lift the wafer 10. During this process, the third spring 91 is stretched, providing necessary elastic support and buffering for the lifting process. This elastic support helps to reduce the impact and vibration during the lifting process, thereby protecting the wafer 10 from damage.

[0046] Stable state: When the ejector pin 31 lifts the wafer 10 to the required height, the external driving mechanism stops working. At this time, the wafer 10 is stably supported in the air by the ejector pin 31, separated from the planar part 2 and the suction cup 4. This stable state provides sufficient space and time for the external manipulator to safely pick up and place the wafer 10 for the next processing or transfer.

[0047] Lowering process: When the processing or transfer of the wafer 10 is completed and it needs to be placed back on the planar part 2 and the suction cup 4, at this time, the external driving mechanism works in reverse, applying a downward force to the movable part 3. This force pushes the movable part 3 to slide downward along the installation cavity 5, simultaneously driving the ejector pin 31 to gradually descend. When the top of the ejector pin 31 returns to the inside of the through groove 22 again, the wafer 10 is supported by the planar part 2 and the suction cup 4 again.

[0048] It should be noted that in addition to the third spring 91, the corrugated sleeve 9 also plays a buffering role during the lowering process. When the movable part 3 moves downward, the corrugated sleeve 9 will be compressed accordingly, and the air or gas inside it is compressed and generates a certain resistance. This resistance helps to slow down the descending speed of the movable part 3, further protecting the wafer 10 from sudden impacts.

[0049] Double - layer sealing guarantee: First of all, the corrugated sleeve 9, as the main elastic support and buffering component, can effectively absorb and disperse the impact and vibration during the lifting process under normal circumstances. However, if the corrugated sleeve 9 accidentally ruptures due to some reasons (such as aging, corrosion or external impact), the gas (usually an inert gas, such as nitrogen) can also apply pressure to the movable part 3 through the gasket 34. These gases act as additional driving forces to push the movable part 3 and the ejector pin 31 on it to continue moving. This double - layer guarantee mechanism ensures that even in extreme cases such as the accidental rupture of the corrugated sleeve 9, the wafer 10 can be safely lifted, supported and lowered. This design not only improves the reliability and safety of the equipment, but also reduces the production interruption and wafer 10 loss caused by failures.

[0050] Elastic support and buffering: The third spring 91 and the corrugated sleeve 9 provide elastic support and buffering effects for the lifting of the movable part 3, effectively reducing the vibration and impact during the jacking process and protecting the wafer 10 from damage.

[0051] Uniform support: The ejector pins 31 are annularly distributed along the edge of the movable part 3 and are matched with the through grooves 22, ensuring uniform support of the wafer 10 during the jacking process and avoiding the occurrence of tilting.

[0052] Flexible adjustment: The number and height of the ejector pins 31 can be flexibly adjusted according to the specifications of the wafer 10, meeting the processing requirements of wafers 10 of different sizes and weights.

[0053] Embodiment 2, referring to Figures 3-5 , the uniform gas flow and ventilation component includes an air storage tank 6 arranged inside the bottom of the process chamber 1. The bottom wall of the air storage tank 6 is connected with an air pipe 61. The air pipe 61 is responsible for transporting gas from the air delivery pump to the air storage tank 6. An exhaust ring groove 62 is opened on one side of the air storage tank 6 facing the outside of the planar part 2. The uniform gas flow and ventilation component further includes a boss 11 arranged at the bottom of the process chamber 1 and a limiting cavity 71 arranged at the bottom of the exhaust ring groove 62. The top of the limiting cavity 71 penetrates the bottom wall of the exhaust ring groove 62. A plurality of first springs 72 are annularly connected along the edge of the bottom wall of the limiting cavity 71, which are determined according to actual needs to ensure that the annular block 7 can seal the exhaust ring groove 62 evenly and stably. The upper end of the first spring 72 is fixedly connected with the annular block 7. The first spring 72 is used to support and adjust the position of the annular block 7.

[0054] Furthermore, the air storage tank 6 has a certain height and is annularly arranged. The exhaust ring groove 62 is located at the bottom of the air storage tank 6. The exhaust ring groove 62 is used to evenly discharge the gas in the air storage tank 6 to the bottom area of the installation cavity 5. The upper end of the air pipe 61 is located in the middle of the air storage tank 6. The lower end of the air pipe 61 extends to the outside of the process chamber 1 to ensure that the gas will first diffuse above the air storage tank 6 and gradually fill downwards. The lower end of the air pipe 61 is connected with the air delivery pump through a pipeline. The end of the exhaust ring groove 62 is communicated with the bottom of the installation cavity 5. The air storage tank 6 is used to temporarily store the gas from the air delivery pump so as to evenly release it into the corrugated sleeve 9 when needed.

[0055] It should be noted that one side of the annular stopper 7 facing the gas storage tank 6 is rhombus-shaped. The annular stopper 7 is annular and its cross-section is a right trapezoid. As gas is continuously introduced, the air pressure inside the gas storage tank 6 will continuously increase. Under this pressure, the gas will be discharged outward through the exhaust ring groove 62 at its bottom. Since the exhaust ring groove 62 is a flat annular structure, the gas pressure discharged from the exhaust ring groove 62 will be very large and uniform. At this time, this air pressure will act on the prism surface of the annular stopper 7 and gradually push it downward. Eventually, the exhaust ring groove 62 will be fully opened. The gas discharged through the exhaust ring groove 62 gradually enters the corrugated sleeve 9 through the through hole at the bottom of the installation cavity 5, thereby pushing the movable part 3 upward. The top of the annular stopper 7 in the initial state of the first spring 72 forms a contact seal with the top of the exhaust ring groove 62. The annular stopper 7 can move up and down under the support of the first spring 72 and form a contact seal with the top of the exhaust ring groove 62 to prevent gas leakage.

[0056] In this embodiment, after the gas delivery pump is started, the gas is delivered to the gas storage tank 6 through the gas delivery pipe 61. It will first diffuse above the gas storage tank 6 and gradually fill downward. Since the gas storage tank 6 is designed as an annular structure, therefore, as the gas is continuously input, the air pressure in the gas storage tank 6 will gradually increase, and this increase in pressure is uniform and will not form an excessive pressure difference in a certain local area. This uniformly distributed air pressure is crucial for the subsequent gas discharge and the wafer 10 lifting process. It can ensure that when the gas is discharged outward through the exhaust ring groove 62, the pressure is uniform and stable, thereby pushing the movable part 3 on the corrugated sleeve 9 to move upward in a stable manner, thus reducing the friction and wear caused by uneven pressure release. This not only extends the service life of the equipment but also improves the accuracy and stability of the wafer 10 lifting.

[0057] Gas discharge and seal adjustment: After the air pressure inside the gas storage tank 6 reaches a certain pressure threshold, the gas will start to find a release channel. At this time, the exhaust ring groove 62 located at the bottom of the gas storage tank 6 becomes the main path for gas discharge; since the exhaust ring groove 62 is designed as a flat annular structure, this design not only helps the gas to be evenly distributed in the groove but also enables the gas pressure discharged from the groove to remain relatively consistent and large. When the gas is discharged outward through the exhaust ring groove 62, it will directly act on the prism surface of the annular stopper 7. This prism surface design enables the annular stopper 7 to respond more effectively to changes in gas pressure.

[0058] As the gas pressure continuously increases, the annular stopper 7 will gradually move downward under the action of the gas pressure. In this process, the first spring 72 plays a key supporting and regulating role. On the one hand, it provides an initial supporting force for the annular stopper 7 to prevent it from moving randomly without gas pressure. On the other hand, it also allows the annular stopper 7 to move smoothly downward when the gas pressure is large enough, thus gradually opening the exhaust ring groove 62.

[0059] When the annular stopper 7 is completely pushed to the bottom of its stroke, the exhaust ring groove 62 will be fully opened. At this time, the gas can enter the inside of the corrugated sleeve 9 quickly through the through hole at the bottom of the installation cavity 5 with the maximum flow rate and pressure. This air flow forms a pressure inside the corrugated sleeve 9, which in turn pushes the movable part 3 upward.

[0060] In summary, the uniform ventilation component in this embodiment can ensure that the movable part 3 receives a uniform and stable thrust during the rising process through its unique structural design, thus avoiding wear, tilting or jamming caused by uneven pressure. This not only extends the service life of the equipment, but also improves the accuracy and stability of the wafer 10 lifting. At the same time, only one air delivery pump is needed to realize the transportation, storage and uniform discharge of gas, without an additional complex valve control system. This simplified design not only reduces the manufacturing cost and maintenance difficulty of the system, but also improves the reliability and stability of the system.

[0061] Embodiment Three. Refer to Figures 3-9 , the exhaust blocking component includes a sliding cavity 81 provided at the bottom of the boss 11, a ventilation groove 12, and a magnetic column 73 installed at the bottom of the annular stopper 7. A kidney-shaped hole 74 runs through between the limiting cavity 71 and the sliding cavity 81. A second spring 82 is fixedly connected to the side wall of the sliding cavity 81 near the kidney-shaped hole 74. The end of the second spring 82 is fixedly connected to a current-limiting magnetic plate 8. The end of the ventilation groove 12 runs through the side walls of the process cavity 1 and the boss 11. At this time, the gas inside the corrugated sleeve 9 will be discharged through the ventilation groove 12, and its internal air pressure is the same as that of the outside. A filter plate 13 is installed at the bottom of the ventilation groove 12 to filter the gas entering the corrugated sleeve 9 and prevent impurities from entering.

[0062] It should be noted that the magnetic column 73 is located inside the first spring 72. The width of the current-limiting magnetic plate 8 is greater than the width of the ventilation groove 12 to ensure that the ventilation groove 12 can be effectively blocked. The opposite surfaces of the magnetic column 73 and the current-limiting magnetic plate 8 are set with the same-pole magnetism. In the initial state, the current-limiting magnetic plate 8 is located inside the sliding cavity 81, and the bottom of the magnetic column 73 is located above the sliding cavity 81. At this time, the ventilation groove 12 is in a fully open state (refer to Figure 6), the internal air pressure of the corrugated sleeve 9 is the same as that of the external environment. When the magnetic column 73 is aligned with the current-limiting magnetic plate 8, a contact seal is formed between the current-limiting magnetic plate 8 and the ventilation slot 12. When the lifting starts, the gas pushes the annular block 7 and the magnetic column 73 downward. At this time, the first spring 72 is in a compressed state. After the magnetic column 73 moves downward, it will apply a repulsive magnetic force (greater than the elastic force of the second spring 82) to the current-limiting magnetic plate 8, so that the current-limiting magnetic plate 8 can block the ventilation slot 12 (refer to Figure 9 ), ensuring that the gas can only enter the inside of the corrugated sleeve 9 at this time to complete the lifting action. When the ventilation stops, under the action of the first spring 72, the second spring 82, and the third spring 91, the device will return to the initial state. The gas inside the corrugated sleeve 9 will be discharged through the ventilation slot 12, and there is no need for an additional pump for suction treatment, saving energy.

[0063] In this embodiment, in the initial state: the current-limiting magnetic plate 8 is located in the sliding cavity 81 under the action of the second spring 82. The bottom of the magnetic column 73 is above the sliding cavity 81, and they are not in a facing state, so there is no significant magnetic repulsive force between them. At this time, the ventilation slot 12 is completely open, and the internal air pressure of the corrugated sleeve 9 is the same as that of the outside (refer to Figure 6 ).

[0064] The start of lifting: When the gas is delivered to the air storage tank 6 and pushes the annular block 7 downward, the magnetic column 73 moves downward accordingly and enters the bottom of the limiting cavity 71. Since the magnetic column 73 and the current-limiting magnetic plate 8 are set with the same-pole magnetism, the magnetic column 73 will apply a repulsive force (this force is greater than the elastic force of the second spring 82) to the current-limiting magnetic plate 8 through the waist hole 74. Therefore, the current-limiting magnetic plate 8 is pushed to move in the sliding cavity 81 until it completely blocks the ventilation slot 12 (refer to Figure 9 ). At this time, the gas can only enter the inside of the corrugated sleeve 9 through the exhaust ring groove 62, pushing the movable part 3 upward to complete the lifting action.

[0065] Completion of lifting and reset: When the ventilation stops, under the combined action of the first spring 72 (restoring the position of the annular block 7), the second spring 82 (restoring the position of the current-limiting magnetic plate 8), and the third spring 91 (restoring the positions of the corrugated sleeve 9 and the movable part 3), the device returns to the initial state. At this time, the ventilation slot 12 is reopened, and the gas inside the corrugated sleeve 9 will naturally be discharged to the outside, without the need for additional pump suction treatment, saving energy.

[0066] In summary, the air-blocking and exhaust assembly realizes the opening and closing control of the ventilation slot 12 during the lifting process through the magnetic control mechanism, ensures the stable flow of gas during the lifting process, and will automatically exhaust after the lifting is completed, without the need for additional pump suction treatment, saving energy consumption. The overall structure is simple, reducing the failure points and maintenance costs.

[0067] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0068] It should be noted that the specific model and specification of the motor need to be selected and determined according to the actual specifications of the device, etc. The specific selection calculation method adopts the existing technology in the art, so it will not be elaborated in detail.

[0069] The above is only the preferred embodiment of the present invention and is not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor wafer lifting device, comprising a process chamber (1), a support portion and a wafer (10), wherein the support portion is composed of a plane portion (2) and a support shaft (21), a suction cup (4) is mounted on the plane portion (2), the plane portion (2) is located in the process chamber (1) and is used to support the wafer (10), a plurality of through grooves (22) are correspondingly spaced apart in the plane portion (2) and the suction cup (4), the support shaft (21) is connected to the bottom of the plane portion (2) and extends from the inside of the process chamber (1) to the outside of the process chamber (1), and is characterized in that: Also includes: Lifting assembly: the lifting assembly is arranged inside the process chamber (1), and is used to elastically lift the wafer (10); The lifting assembly comprises a movable part (3), a mounting cavity (5) and a corrugated sleeve (9), wherein the mounting cavity (5) is located in the bottom side wall of the process cavity (1), a sealing gasket (34) is installed at the bottom of the movable part (3), the top of the movable part (3) passes through the inner bottom wall of the process cavity (1), a ejector pin (31) is installed at the top of the movable part (3), a screw rod (32) is arranged at the bottom of the ejector pin (31), and a screw groove (33) meshing with the screw rod (32) is arranged at the top of the movable part (3); A uniform flow ventilation component: the uniform flow ventilation component is arranged inside the process chamber (1), and is used to ensure that the airflow acts evenly on the elastic lifting component; The uniform flow ventilation assembly comprises an air storage groove (6) arranged in the bottom of the process chamber (1), the bottom wall of the air storage groove (6) is connected to a ventilation pipe (61), and an exhaust ring groove (62) is provided on one side of the air storage groove (6) facing the outside of the plane portion (2); the uniform flow ventilation assembly also comprises a boss (11) arranged at the bottom of the process chamber (1) and a limiting cavity (71) arranged at the bottom of the exhaust ring groove (62), the top of the limiting cavity (71) passes through the bottom wall of the exhaust ring groove (62), the bottom wall of the limiting cavity (71) is annularly connected to a plurality of first springs (72) along its edge, the upper end of the first spring (72) is fixedly connected to an annular stopper (7), the side of the annular stopper (7) facing the air storage groove (6) is prismatic, the annular stopper (7) is annular and its cross section is a right-angled trapezoid, and the top of the annular stopper (7) forms a contact seal with the top of the exhaust ring groove (62) when the first spring (72) is in an initial state; An air-blocking and air-exhaust assembly: the air-blocking and air-exhaust assembly is arranged at the bottom of the process chamber (1), and the air-blocking and air-exhaust assembly controls the air flow inside the lifting assembly according to the state of the uniform air flow assembly; The air-blocking and exhaust-gas assembly comprises a sliding cavity (81) arranged at the bottom of the boss (11), a vent groove (12), and a magnetic column (73) installed at the bottom of the annular stopper (7); a waist hole (74) is provided between the limiting cavity (71) and the sliding cavity (81); a second spring (82) is fixedly connected to the side wall of the sliding cavity (81) close to the waist hole (74); the end of the second spring (82) is fixedly connected to a flow-blocking magnetic plate (8); the end of the vent groove (12) passes through the side walls of the process cavity (1) and the boss (11); and a filter plate (13) is installed at the bottom of the vent groove (12).

2. A semiconductor wafer lifting device according to claim 1, characterized in that: The upper end of the bellows (9) is fixedly connected to the bottom of the sealing gasket (34), and the lower end is fixedly connected to the bottom of the installation cavity (5). A third spring (91) is arranged inside the bellows (9), and the ends of the third spring (91) are respectively fixedly connected to the bottom of the sealing gasket (34) and the inner bottom wall of the bellows (9). The bottoms of the installation cavity (5) and the bellows (9) are both through-arranged.

3. A semiconductor wafer lifting device according to claim 2, characterized in that: The installation cavity (5) and the corrugated sleeve (9) are both annular and coaxial with the support shaft (21); the ejector pin (31) and the through slot (22) are arranged in a matching manner; the number of the screw grooves (33) and the through slot (22) are equal; and the ejector pin (31) and the third spring (91) are distributed in an annular shape along the edge of the movable portion (3).

4. The semiconductor wafer lifting device according to claim 2, characterized in that: The movable portion (3) and the top of the mounting cavity (5), as well as the sealing gasket (34) and the inner wall of the mounting cavity (5) are all connected in a sliding seal; when the third spring (91) is in an initial state, the top of the ejector pin (31) is located inside the through groove (22); when the bottom of the movable portion (3) contacts the top of the mounting cavity (5), the top of the ejector pin (31) is located above the top of the plane portion (2).

5. The semiconductor wafer lifting device according to claim 1, characterized in that: The air storage groove (6) has a certain height and is arranged in an annular shape. The exhaust annular groove (62) is located at the bottom of the air storage groove (6). The upper end of the ventilation pipe (61) is located in the middle of the air storage groove (6). The lower end of the ventilation pipe (61) extends to the outside of the process chamber (1). The lower end of the ventilation pipe (61) is connected to the air pump through a pipeline. The end of the exhaust annular groove (62) is connected to the bottom of the installation chamber (5).

6. The semiconductor wafer lifting device according to claim 1, characterized in that: The magnetic column (73) is located inside the first spring (72), the width of the intercepting magnetic plate (8) is greater than the width of the ventilation groove (12), the opposing surfaces of the magnetic column (73) and the intercepting magnetic plate (8) are magnetically arranged with the same polarity, the intercepting magnetic plate (8) in the initial state is located in the sliding cavity (81), the bottom of the magnetic column (73) is located above the sliding cavity (81), and when the magnetic column (73) and the intercepting magnetic plate (8) are facing each other, a contact seal is formed between the intercepting magnetic plate (8) and the ventilation groove (12).

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