Highly integrated vehicle-mounted controller

Abstract

The invention relates to a high-integration vehicle-mounted controller which comprises a heat dissipation base body, a filtering device body, an inversion device, an electromagnetic shielding cover and an AC switching assembly, the filtering device body is connected with the inversion device and the AC switching assembly, the filtering device body is encapsulated in a cuboid containing cavity, the inversion device is covered with the electromagnetic shielding cover, and the AC switching assembly is connected with the inversion device. The core body is welded between an upper layer plate and a lower layer plate of the laminated busbar, a filter capacitor is arranged on the side face of the core body, a power terminal is arranged on a side plate of the upper layer plate of the laminated busbar, the upper surface of the upper layer plate of the laminated busbar abuts against the top face of the cuboid containing cavity, and the side plate of the upper layer plate abuts against the side face of the rectangular plate-shaped structure. Compared with the prior art, the system has the advantages of high heat dissipation efficiency, high integration level and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of vehicle-mounted controllers, and in particular to a highly integrated vehicle-mounted controller. Background Art

[0002] With the rapid development of new energy vehicle technology, highly integrated, high-power motor controllers have gradually become the mainstream development trend of the market. Power devices and film capacitors in high-power, highly integrated motor controllers have the characteristics of small space, concentrated heat, and difficulty in cooling. Their heat generation is an unavoidable problem in the development process of drive motor controllers.

[0003] On the other hand, in recent years, new energy vehicle manufacturers have continuously exerted their efforts in the independent research and development of new energy vehicle electric drive assemblies, and the demand of OEMs for drive motor controller assemblies has eased, replaced by customized power device components. Customized motor controllers are used in the form of power components to match the integrated electric drive system on the vehicle side. In this way, the OEM's procurement cost for motor controllers can be reduced, and the integration of the electric drive system on the vehicle side can be improved. At the same time, this approach also increases the OEM's participation in the joint development of motor controllers, thereby further promoting the OEM's research and development capabilities for new energy three-electric systems.

[0004] In order to solve the above existing problems and market demands, there are many cases of power components for new energy motor controllers in the industry. The combination method is basically to make the heat sink, IGBT, and film capacitor into one component, so as to achieve an integrated assembly, and at the same time effectively cool the heat-generating components such as IGBT and film capacitor.

[0005] However, by consulting the existing technical solutions, it is not difficult to find that the existing assembly solutions are basically based on a separate radiator or heat sink, and the film capacitor and the power module are attached to both sides of the radiator to achieve the integration of the power components. In this type of integration solution, the capacitors are potted in a conventional plastic shell and fixed to one side of the radiator by bolts. The power module is covered on the other side of the radiator in a common way. With this existing technical solution, the film capacitor still needs an independent potting plastic shell and is fixed by bolts. Furthermore, the film capacitor is not tightly attached to the radiator, and the heat generated by the capacitor needs to pass through the plastic shell and the air gap between the plastic shell and the radiator before it can be conducted to the radiator, and the thermal resistance of heat dissipation is relatively large.

[0006] CN21643787 discloses a motor controller and automobile. The integrated solution is composed of a radiator, a film capacitor and an IGBT module. An independent radiator structure is adopted. The upper surface of the radiator is provided with a contoured groove structure. The film capacitor is potted in a plastic shell and then fixed to the contoured groove of the radiator by bolts. The power IGBT module is fixed on the other side of the radiator to achieve the integrated integration of the power module and the cooling of the heating devices on both sides of the radiator. However, the following problems or defects still exist: the capacitor still needs to be potted in an independent plastic shell and fixed to the radiator by bolts, and the assembly process is cumbersome and the production cost is high. At the same time, the film capacitor is fixed to the bottom of the radiator by bolts, and the thermal resistance between the capacitor and the radiator is large, which is not easy to dissipate heat.

[0007] PCT / CN2021 / 097164 discloses an integrated motor controller, and the integrated power board assembly consists of a thin film capacitor, a heat sink, a MOS power board, a drive board, a shielding board and a control board. The thin film capacitor is arranged at the bottom of the heat sink, the MOS power board is fixed to the upper surface of the heat sink by bolts, and the thin film capacitor is fixed to the bottom of the heat sink by bolts. A layer of thermal conductive pad is laid between the MOS power board and the heat sink, and between the thin film capacitor and the heat sink for heat conduction. The drive board and the control board are respectively fixed on both sides of the shielding board, and the shielding board is fixed above the MOS power board. This technical solution solves the stacked integration of the core components inside the traditional controller. The disadvantage is that this integration solution is to mechanically and physically stack the parts in the traditional controller, and fails to merge and streamline the types and quantities of parts, which makes the solution have too many types of parts, high material costs, complicated assembly processes, and not easy to mass produce.

[0008] In summary, the fixation between the capacitor and the radiator of the existing vehicle-mounted controller affects the heat dissipation effect, and the integration of various parts of the controller is insufficient. Summary of the invention

[0009] The purpose of the present invention is to provide a highly integrated vehicle-mounted controller in order to overcome the defects of the above-mentioned prior art. The filter device is encapsulated in the form of a copper busbar and a core in a cavity below an aluminum heat dissipation substrate, thereby achieving seamless fixation and heat conduction between the filter device body and the aluminum heat dissipation substrate. At the same time, the film capacitor and the radiator are integrated into one, thereby reducing the number of parts.

[0010] The purpose of the present invention can be achieved by the following technical solutions:

[0011] A highly integrated vehicle-mounted controller comprises: a heat dissipation substrate, a filter device body, an inverter device, an electromagnetic shielding cover and an AC adapter assembly, wherein the heat dissipation substrate comprises a rectangular plate-like structure and a rectangular parallelepiped cavity below the plate-like structure, wherein an opening of the rectangular parallelepiped cavity is located on a side elevation of the heat dissipation substrate, and a water inlet and a water outlet are arranged on the bottom surface of the rectangular plate-like structure;

[0012] The filter device body is connected to the inverter device and the AC adapter assembly, the filter device body is encapsulated in the rectangular cavity, and the electromagnetic shielding cover covers the inverter device, wherein:

[0013] The filter device body includes a laminated busbar and a core body, the laminated busbar is divided into an upper plate and a lower plate, the core body is welded between the upper plate and the lower plate of the laminated busbar, a filter capacitor is arranged on the side of the core body, a power terminal is arranged on the side plate of the upper plate of the laminated busbar, the upper surface of the upper plate of the laminated busbar is close to the top surface of the rectangular cavity, and the side plate of the upper plate is close to the side of the rectangular plate structure;

[0014] A water tank for containing coolant is provided on the upper surface of the rectangular plate structure, and the water tank is connected to the water inlet and the water outlet. A sealing cover is provided above the water tank, and the sealing cover is friction welded to the edge of the water tank into an integrated structure. The inverter is installed on the upper surface of the sealing cover, and a heat-conducting column is provided on the lower surface of the sealing cover.

[0015] Further, the upper surface of the rectangular plate-like structure is provided with two circles of columns, including an outer circle of columns A and an inner circle of columns B;

[0016] The inverter device includes an integrated circuit board, which integrates two areas, namely a drive unit area and a control unit area. The drive unit area is provided with a DC input terminal, an AC output terminal and an IGBT. The bottom surface of the integrated circuit board is fixed on the B column on the upper surface of the rectangular plate structure of the heat dissipation substrate, and the heat dissipation base plate at the bottom of the IGBT is fixed on the sealing cover plate of the heat dissipation substrate.

[0017] The AC output terminal is electrically connected to the AC adapter assembly, and the DC input terminal is electrically connected to the power terminal of the filter device body, and the power terminal is arranged in parallel on the side plate of the upper plate of the laminated busbar.

[0018] Furthermore, the electromagnetic shielding cover is provided with a plurality of L-shaped legs, which are fixed on the A pillars, and the number and positions of the legs correspond to the number and positions of the A pillars.

[0019] Furthermore, there are 8 A pillars in the outer circle, 3 A pillars are arranged on one side of the rectangular plate structure, and the rectangular plate structure between two adjacent A pillars among the 3 A pillars is provided with a groove, and there is 1 A pillar on the other side of the rectangular plate structure.

[0020] Furthermore, the cross sections of the columns are all concentric circles, and the radius of the large circle of the cross section of the A column is greater than the radius of the large circle of the cross section of the B column.

[0021] Furthermore, the bottom of the IGBT is coated with thermal conductive silicone grease and is fixedly connected to the sealing cover plate.

[0022] Furthermore, the cross section of the water tank matches the shape of the sealing cover plate, the middle portion of the sealing cover plate is a heat-conducting column area, and a heat-conducting column is arranged in the heat-conducting column area;

[0023] The shape of the heat-conducting column area is rectangular, and there are protrusions on both sides of the sealing cover plate, and the length of the protrusion on one side is greater than the length of the protrusion on the other side.

[0024] Furthermore, the cross section of the heat-conducting column inside the heat-conducting column area is elliptical.

[0025] Furthermore, the heat-conducting columns inside the heat-conducting column area are arranged in a staggered array.

[0026] Furthermore, bolt fixing points are provided on the side elevation of the heat dissipation substrate, and the AC adapter assembly is installed on the bolt fixing points.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] (1) The inverter device of the present invention is installed above the aluminum heat dissipation substrate, and the supporting electrical appliances (filtering devices) are directly encapsulated in the lower cavity of the aluminum heat dissipation substrate in the form of cores and busbars, thereby forming an integrated structure of the inverter assembly. Compared with traditional power components, the supporting capacitors no longer need to be separately encapsulated in a plastic shell and then fixed on the radiator, which reduces the number of parts and has the advantages of simple structure, easy assembly, and low manufacturing cost.

[0029] (2) The heat dissipation substrate of the present invention is provided with a water tank for containing coolant inside, and the top of the water tank is sealed by stir friction welding. A capacitor potting groove is provided below the water tank, and the filter device body is potted in the aluminum heat dissipation substrate, thereby realizing seamless heat conduction between the capacitor core and the busbar and the heat dissipation substrate, and having the advantages of large heat conduction area and high heat dissipation efficiency.

[0030] (3) The electromagnetic shielding cover of the present invention covers the top of the inverter device, which can shield the electromagnetic signals in the environment and prevent the driving circuit on the inverter device from being interfered with by the electromagnetic interference in the environment, so that the high-performance inverter assembly structure has excellent electromagnetic compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the explosion structure of the present invention;

[0032] Figure 2 It is a schematic diagram of the assembly structure of the present invention, wherein Figure 2(a) is a schematic diagram of the structure in one direction. Figure 2 (b) is a schematic diagram of the structure in another direction;

[0033] Figure 3 This is a structural diagram of the heat dissipation substrate of the present invention, wherein: Figure 3 (a) is a structural diagram of the heat dissipation substrate with a sealing cover installed. Figure 3 (b) is a structural diagram of the heat dissipation substrate without a sealing cover plate installed. Figure 3 (c) is a structural diagram of the bottom of the heat dissipation substrate;

[0034] Figure 4 is a structural diagram of the bottom surface of the sealing cover plate of the present invention, wherein Figure 4 (a) is a structural diagram of the bottom surface of the sealing cover plate in one direction. Figure 4 (b) is a detailed structural diagram of the heat-conducting column of the sealing cover plate;

[0035] Figure 5 is a schematic diagram of the structure of the filter device body of the present invention, wherein Figure 5 (a) is a schematic diagram of the structure of the installation of the filter device body, Figure 5 (b) is a schematic diagram of the exploded structure of the filter device body;

[0036] Figure 6 is a schematic diagram of the structure of the inverter device of the present invention, wherein Figure 6 (a) is a structural diagram of an inverter device in one direction. Figure 6 (b) is a schematic diagram of the structure of the bottom surface of the inverter device;

[0037] Figure 7 It is a schematic diagram of the structure of the electromagnetic shielding cover of the present invention;

[0038] In the figure, heat dissipation substrate 1, inverter device 2, filter device body 3, electromagnetic shielding cover 4, AC adapter assembly 5, sealing cover plate 6, thermally conductive column 61, thermally conductive column area 62, water tank 7, rectangular cavity 8, A column 9, B column 10, water inlet 11, water outlet 12, bolt fixing point 13, power terminal 31, laminated busbar 32, core body 33, drive unit area 21, DC input terminal 22, AC output terminal 23, control unit area 24, IGBT 25, integrated circuit board 26, IGBT heat dissipation base plate 27, and support foot 41. DETAILED DESCRIPTION

[0039] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0040] The present invention proposes a highly integrated vehicle-mounted controller, the exploded structure diagram of the controller is as follows Figure 1 The assembly structure diagram is shown in Figure 2 As shown. The on-board controller includes a heat dissipation substrate 1, a filter device body 3, an inverter device 2, an electromagnetic shielding cover 4 and an AC adapter assembly 5. The filter device body 3 is encapsulated in the lower cavity of the aluminum heat dissipation substrate 1, and the inverter device 2 is mounted on the upper surface of the sealing cover plate 6 of the aluminum heat dissipation substrate 1. The drive unit area 21 of the integrated circuit board 26 of the inverter device 2 is fixed above the IGBT25, and the edge of the integrated circuit board 26 is fixed on the B column 10 of the aluminum heat dissipation substrate 1. The electromagnetic shielding cover 4 covers the inverter device 2 and is fixed on the A column 9 of the aluminum heat dissipation substrate 1. The AC adapter assembly 5 is mounted on the fixing point of the side elevation of the aluminum heat dissipation substrate 1, and the copper busbar of the AC mounting assembly is electrically connected to the AC output terminal 23 of the inverter device 2.

[0041] The structure of the aluminum heat dissipation substrate 1 is shown in FIG. Figure 3 As shown. The aluminum heat dissipation substrate 1 includes a rectangular plate-like structure, and the upper surface of the rectangular plate-like structure is provided with two circles of columns, including an outer circle of A columns 9 and an inner circle of B columns 10. A rectangular cavity 8 is provided below the plate-like structure, which is used to replace the plastic shell of the traditional film capacitor and directly potting and fixing the filter device body 3 into the rectangular cavity 8. The outer side of the rectangular cavity 8 is respectively provided with a water inlet 11 and a water outlet 12 of the cooling circuit, and two bolt fixing points 13 are provided on the side elevation of the aluminum heat dissipation substrate 1 for later fixing the AC adapter component 5.

[0042] A "melon seed kernel" shaped water tank 7 is provided on the upper surface of the aluminum heat dissipation substrate 1. The water tank 7 is respectively connected with the water inlet 11 and the water outlet 12 of the cooling circuit. A conformal sealing cover plate 6 is provided above the water tank 7. The sealing cover plate 6 and the edge of the water tank 7 are stir-friction welded to form an integrated structure. A plurality of A columns 9 and B columns 10 are provided at the edge of the upper surface of the aluminum heat dissipation substrate 1. There are a total of 8 A columns 9 in the outer circle, and 3 A columns 9 are provided on one side of the rectangular plate-like structure. Among the 3 A columns 9, the rectangular plate-like structure between two adjacent A columns 9 is provided with a groove, and there is 1 A column 9 on the other side of the rectangular plate-like structure. The cross sections of the columns are all concentric circles, and the radius of the large circle of the cross section of the A column 9 is greater than the radius of the large circle of the cross section of the B column 10.

[0043] The shape of the sealing cover plate 6 matches the shape of the water tank 7. The structural diagram of the sealing cover plate 6 is shown in FIG. Figure 4As shown. A heat-conducting column 61 in a rectangular area (heat-conducting column area 62) is provided at the bottom of the sealing cover plate 6. The shape of the heat-conducting column area 62 is a rectangle. There are protrusions on both sides of the rectangle of the sealing cover plate 6, and the length of the protrusion on one side is greater than the length of the protrusion on the other side. The cross-section of the heat-conducting column 61 is elliptical, and it is arranged in a staggered array in the rectangular heat-conducting column 61 area. When working, the IGBT25 transfers heat to the sealing cover plate 6 through the heat dissipation base plate. The heat-conducting column 61 is inserted upside down in the water tank 7, and the flowing coolant flushes the staggered and orderly heat-conducting columns 61, thereby conducting heat to the sealing cover plate 6.

[0044] The filter device body 3 is composed of a laminated busbar 32 and a core body 33. The structure of the filter device body 3 is shown in FIG. Figure 5 As shown. The laminated busbar 32 has two positive and negative copper bars laminated and hot-pressed, and one end of the laminated busbar 32 is provided with six parallel power terminals 31, and the core body 33 is an elliptical structure wound with a polypropylene film, and the upper and lower end surfaces of the ellipse of the core body 33 are metal sprayed gold layers, and the laminated busbar 32 is divided into an upper plate and a lower plate, and the core body 33 is welded between the upper plate and the lower plate of the laminated busbar 32, and the side of the core body 33 is provided with a filter capacitor, and the side plate of the upper plate of the laminated busbar 32 is provided with a power terminal 31, and the upper surface of the upper plate of the laminated busbar 32 is close to the top surface of the rectangular cavity, and the side plate of the upper plate is close to the side of the rectangular plate structure.

[0045] The inverter device 2 includes an integrated circuit board 26 and an IGBT 25. The structure of the inverter device 2 is shown in FIG. Figure 6 As shown. The inverter device 2 includes an integrated circuit board 26 which is a two-in-one PCBA, which is divided into a control unit area 24 and a drive unit area 21. The two ends of the IGBT 25 are provided with a DC input terminal 22 and an AC output terminal 23. The DC input terminal 22 is electrically connected to the power terminal 31 of the filter device body 3, and the output AC terminal is electrically connected to the AC adapter component 5. The bottom of the IGBT 25 is provided with an IGBT heat dissipation base plate 27. When working, the IGBT heat dissipation base plate 27 of the IGBT 25 is coated with thermal conductive silicone grease and fixed on the sealing cover plate 6 of the aluminum heat dissipation substrate 1.

[0046] The structural schematic diagram of the electromagnetic shielding cover 4 is as follows Figure 7 As shown, the electromagnetic shielding cover 4 is a rectangular stamped steel plate structure, and eight L-shaped fixed legs 41 are arranged around the electromagnetic shielding cover 4. The number and position of the legs 41 correspond to the number and position of the A pillars 9. The legs 41 are fixed on the A pillars 9 of the aluminum heat dissipation substrate 1, and the electromagnetic shielding cover 4 covers the integrated circuit board 26 of the inverter device 2, thereby realizing electromagnetic interference shielding of the integrated circuit board 26.

[0047] The steps of assembling the present invention are as follows:

[0048] First, the filter device body 3 is assembled.

[0049] The laminated busbar 32 is hot pressed into a composite copper bar, and then the gold-sprayed layer of the wound core body 33 is soldered to the upper and lower end surfaces of the laminated busbar 32 .

[0050] Next, the aluminum heat dissipation substrate 1 is welded, and the filter device body 3 is installed.

[0051] The sealing cover plate 6 is placed on the water tank 7 on the aluminum heat dissipation substrate 1, and the sealing cover plate 6 and the aluminum heat dissipation substrate 1 are welded into one body by a stir friction welding process to form a closed heat dissipation water channel. Next, a layer of insulating heat-conducting ceramic sheet is brazed in the potting cavity at the bottom of the aluminum heat dissipation substrate 1. Then, the assembled support capacitor is placed in the potting cavity, and potted and cured with epoxy resin to achieve the fixation of the filter device body 3, and the air in the cavity before potting is emptied by epoxy resin to achieve seamless contact between the filter device body 3 and the water tank 7, which is convenient for the heat dissipation water channel to conduct heat to the filter device body 3.

[0052] Then, the inverter device 2 is installed.

[0053] Apply thermal grease to the heat dissipation base plate of IGBT25, and then lock IGBT25 on the sealing cover plate 6 of the aluminum heat dissipation base 1 through fasteners. Next, fix the integrated circuit board 26 to the A column 9 of the aluminum heat dissipation base 1 through bolts, and electrically connect the driving pins on the IGBT25 and the integrated circuit board 26 by copper drum soldering.

[0054] Finally, the AC adapter assembly 5 and the electromagnetic shielding cover 4 are installed.

[0055] The AC adapter assembly 5 is fixed to the bolt fixing point 13 on the side of the aluminum heat dissipation base 1 by bolts. Then, the AC output terminal 23 of the inverter device 2 is electrically connected to the copper busbar of the AC adapter assembly 5. Finally, the electromagnetic shielding cover 4 is covered directly above the inverter device 2, and the legs 41 of the electromagnetic shielding cover 4 are fixed to the A column 10 of the aluminum heat dissipation base 1 by bolts.

[0056] At this point, a high-performance laminated inverter assembly integrated solution for vehicle-mounted controllers has been installed. Subsequently, the laminated inverter assembly is placed in the vehicle housing, and the vehicle water channel is connected to the inlet and outlet of the laminated inverter assembly, and finally the high-voltage power bus is electrically connected to the laminated inverter assembly to realize the function of the drive motor controller.

[0057] The inverter device of the present invention is installed on the top of the aluminum heat dissipation substrate, the inverter device is integrated with the drive control unit circuit board, and the supporting electrical appliances are directly potted in the lower cavity of the aluminum heat dissipation substrate in the form of core and busbar, thereby forming an integrated structure of an inverter assembly. Compared with the traditional power components, the drive control board is eliminated from being installed separately, and the supporting capacitor no longer needs to be potted in a plastic shell separately and then fixed on the radiator, which simplifies the number of parts and has the advantages of simple structure, easy assembly, low manufacturing cost, etc. The present invention is provided with a water tank for accommodating coolant inside, and the water tank is sealed by stir friction welding above, and a capacitor potting groove is provided below the water tank. The inverter device is installed on the top of the aluminum heat dissipation substrate, and the filter device body is directly potted and fixed in the capacitor potting groove. Compared with the traditional power components, the present invention realizes the cooling of the coolant from the upper and lower sides of the aluminum heat dissipation substrate, and at the same time, the filter device body is potted in the aluminum heat dissipation substrate, realizing the seamless heat conduction between the capacitor core and the busbar and the heat dissipation substrate, and has the advantages of large heat conduction area and high heat dissipation efficiency. The electromagnetic shielding cover of the present invention covers the inverter device, can shield the electromagnetic signals in the environment, and prevent the driving circuit on the inverter device from being disturbed by the electromagnetic interference in the environment, so that the high-performance inverter assembly structure has excellent electromagnetic compatibility.

[0058] The preferred specific embodiments of the present invention are described in detail above. It should be understood that a person skilled in the art can make many modifications and changes based on the concept of the present invention without creative work. Therefore, any technical solution that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the concept of the present invention on the basis of the prior art should be within the scope of protection determined by the claims.

Claims

1. A highly integrated vehicle-mounted controller, characterized in that: include: A heat dissipation substrate (1), a filter device body (3), an inverter device (2), an electromagnetic shielding cover (4) and an AC adapter component (5), wherein the heat dissipation substrate (1) comprises a rectangular plate-like structure and a rectangular parallelepiped cavity below the plate-like structure, wherein the opening of the rectangular parallelepiped cavity is located on a side elevation of the heat dissipation substrate (1), and a water inlet (11) and a water outlet (12) are provided on the bottom surface of the rectangular plate-like structure; The filter device body (3) is connected to the inverter device (2) and the AC adapter component (5), the filter device body (3) is encapsulated in a rectangular parallelepiped cavity, and the electromagnetic shielding cover (4) covers the inverter device (2), wherein: The filter device body (3) comprises a laminated busbar (32) and a core body (33), the laminated busbar (32) is divided into an upper plate and a lower plate, the core body (33) is welded between the upper plate and the lower plate of the laminated busbar (32), a filter capacitor is arranged on the side of the core body (33), a power terminal (31) is arranged on the side plate of the upper plate of the laminated busbar (32), the upper surface of the upper plate of the laminated busbar (32) is close to the top surface of the rectangular cavity, and the side plate of the upper plate is close to the side of the rectangular plate-like structure; A water tank (7) for containing coolant is provided on the upper surface of the rectangular plate-like structure, the water tank (7) is communicated with a water inlet (11) and a water outlet (12), a sealing cover plate (6) is provided above the water tank (7), the sealing cover plate (6) and the edge of the water tank (7) are stir-friction welded to form an integrated structure, the inverter device (2) is installed on the upper surface of the sealing cover plate (6), and a heat-conducting column (61) is provided on the lower surface of the sealing cover plate (6).

2. A highly integrated vehicle-mounted controller according to claim 1, characterized in that: The upper surface of the rectangular plate-like structure is provided with two circles of columns, including an outer circle of A columns (9) and an inner circle of B columns (10); The inverter device (2) comprises an integrated circuit board (26), wherein two areas are integrated on the integrated circuit board (26), namely a drive unit area (21) and a control unit area (24), wherein the drive unit area (21) is provided with a DC input terminal (22), an AC output terminal (23) and an IGBT (25), wherein the bottom surface of the integrated circuit board (26) is fixed on a B column (10) on the upper surface of a rectangular plate-shaped structure of a heat dissipation substrate (1), and a heat dissipation base plate (27) at the bottom of the IGBT (25) is fixed on a sealing cover plate (6) of the heat dissipation substrate (1). The AC output terminal (23) is electrically connected to the AC adapter assembly (5), and the DC input terminal (22) is electrically connected to the power terminal (31) of the filter device body (3), and the power terminal (31) is arranged in parallel on the side plate of the upper plate of the laminated busbar (32).

3. A highly integrated vehicle-mounted controller according to claim 2, characterized in that: The electromagnetic shielding cover (4) is provided with a plurality of L-shaped legs (41), the legs (41) are fixed on the A pillars (9), and the number and positions of the legs (41) correspond to the number and positions of the A pillars (9).

4. A highly integrated vehicle-mounted controller according to claim 3, characterized in that: There are a total of 8 A columns (9) in the outer circle, 3 A columns (9) are respectively arranged on one side of the rectangular plate-like structure, and the rectangular plate-like structure between two adjacent A columns (9) of the 3 A columns (9) is provided with a groove, and there is 1 A column (9) on the other side of the rectangular plate-like structure.

5. A highly integrated vehicle-mounted controller according to claim 2, characterized in that: The cross sections of the columns are all concentric circles, and the radius of the large circle of the cross section of the A column (9) is greater than the radius of the large circle of the cross section of the B column (10).

6. A highly integrated vehicle-mounted controller according to claim 2, characterized in that: The bottom of the IGBT (25) is coated with thermal conductive silicone grease and is fixedly connected to the sealing cover plate (6).

7. The highly integrated vehicle-mounted controller according to claim 1, characterized in that: The cross section of the water tank (7) matches the shape of the sealing cover plate (6); the middle portion of the sealing cover plate (6) is a heat-conducting column area (62); and a heat-conducting column (61) is arranged in the heat-conducting column area (62); The shape of the heat-conducting column area (62) is rectangular, and both sides of the sealing cover plate (6) have protrusions, and the length of the protrusion on one side is greater than the length of the protrusion on the other side.

8. A highly integrated vehicle-mounted controller according to claim 7, characterized in that: The cross section of the heat-conducting column (61) inside the heat-conducting column region (62) is elliptical.

9. The highly integrated vehicle-mounted controller according to claim 7, characterized in that: The heat-conducting columns (61) inside the heat-conducting column area (62) are arranged in a staggered array.

10. The highly integrated vehicle-mounted controller according to claim 1, characterized in that: The side elevation of the heat dissipation substrate (1) is provided with a bolt fixing point, and the AC adapter assembly (5) is installed on the bolt fixing point.

Images