Circuit board assembly and earphone

Abstract

The invention belongs to the field of electronic equipment, and provides a circuit board assembly and an earphone, the earphone comprises the circuit board assembly, the circuit board assembly comprises a PCB and a switch member, the thickness direction of the PCB is a first direction, the PCB is provided with a front surface, a back surface and a side surface, the front surface and the back surface are oppositely arranged along the first direction, and the side surface is arranged between the front surface and the back surface along the first direction; the switch piece is integrated on the side. According to the circuit board assembly, the switch piece is integrated on the side face of the PCB, the situation that the switch piece occupies the space of the side where the front face and the back face of the PCB are located is effectively avoided, the layout is reasonable, electronic components on the front face or the back face of the PCB are not prone to interference, and the technology difficulty and the production cost of products can be reduced; therefore, in the earphone assembling process, when the circuit board assembly, the battery, the loudspeaker and other assemblies are arranged in a stacked mode in the first direction, the switch piece is not prone to being collided, and the yield can be improved.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and more specifically, to a circuit board assembly and earphones. Background Art

[0002] With the advancement of technology and changes in people's lifestyles, miniaturized headphones are becoming increasingly popular among consumers due to their portability, wearing comfort, and aesthetics.

[0003] The PCB (Printed Circuit Board) of existing headphones is mainly stacked with components such as speakers and batteries along the thickness direction of the headphones. The switch components are packaged on the front or back of the PCB through SMT (Surface Mount Technology), so that the switch components need to occupy the space on the front or back side of the PCB, resulting in a crowded layout of electronic components on the front or back of the PCB, which is prone to interference, making product processing difficult and the production cost high. At the same time, when assembling the headphones, the switch components are easily damaged by collision, resulting in a low yield rate. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a circuit board assembly to solve the technical problem in the prior art that the switch component needs to occupy the space on the front side or the back side of the PCB and is easily damaged.

[0005] To achieve the above purpose, the technical solution adopted by the present application is: to provide a circuit board assembly, including:

[0006] A PCB, wherein the thickness direction of the PCB is a first direction, the PCB has a front side, a back side and a side surface, and the switch element, wherein the front side and the back side are arranged opposite to each other along the first direction, and the side surface is arranged between the front side and the back side along the first direction; and

[0007] The switch component is integrated with the side surface.

[0008] Compared with the prior art, the circuit board assembly provided by the present application integrates the switch component on the side of the PCB, effectively avoiding the switch component from occupying the space on the front and back sides of the PCB. The layout is reasonable, so that the electronic components on the front or back of the PCB are not easy to interfere, which is beneficial to reducing the process difficulty and production cost of the product. When the circuit board assembly is applied to headphones, since the switch component is integrated on the side of the PCB, during the assembly of the headphones, when the circuit board assembly is stacked with components such as batteries and speakers along the first direction, it is not easy to collide with the switch component, which is beneficial to improving the yield rate.

[0009] Optionally, the side surface of the PCB is provided with a groove, and the switch element is embedded in the groove.

[0010] By opening a groove on the side edge of the PCB and embedding the switch in the groove, the layout is reasonable, and the space occupied by the switch on the side of the PCB is effectively reduced, so that the structure of the circuit board assembly is more compact, and the volume of the circuit board assembly is effectively reduced, which is conducive to reducing the occupation of product space. For example, when the circuit board assembly is applied to headphones, it is conducive to reducing the occupation of the internal space of the headphones by the circuit board assembly, which helps to achieve miniaturization of the headphones. In addition, by embedding the switch in the groove, the process is simple, the assembly is convenient, and the stability of the switch integrated on the side of the PCB is effectively improved.

[0011] Optionally, the switch element includes a conductive substrate and a convex button, the conductive substrate is embedded in the groove, and the convex button is connected to the conductive substrate and protrudes from the side surface.

[0012] By embedding the conductive substrate in the groove, the convex button is connected to the conductive substrate and protrudes from the side, so that it is convenient for an external button to press the convex button, so that the switch element triggers the corresponding function of the PCB.

[0013] Optionally, the circuit board assembly further includes a conductive pin, and the switch element is electrically connected to the PCB via the conductive pin.

[0014] The switch element is electrically connected to the PCB via the conductive pin, so that the electrical connection between the switch element and the PCB is simple and easy to process, which is beneficial to reducing production costs.

[0015] Optionally, the length direction of the PCB is the second direction, and the width direction of the PCB is the third direction. The PCB is provided with a first via and a second via that are connected to each other. The first via extends along the second direction or the third direction, and one end extends to at least one of the side surfaces of the PCB. The second via extends along the first direction, and both ends extend to the front and the back, respectively. The conductive pin includes a first conductive segment and a second conductive segment that are connected to each other. The first conductive segment is passed through the first via and is electrically connected to the switch element. The second conductive segment is passed through the second via and is electrically connected to the circuit on the front or the circuit on the back.

[0016] The first conductive segment is passed through the first via hole to be electrically connected to the switch element on the side, and the second conductive segment is passed through the second via hole to be electrically connected to the circuit on the front side or the circuit on the back side, so that the switch element is electrically connected to the PCB through the conductive pins. The layout is reasonable and the structure is compact, which effectively reduces the space outside the PCB occupied by the conductive pins, and is conducive to reducing the volume of the circuit board assembly.

[0017] Optionally, the conductive pin further includes a first conductive sheet, a second conductive sheet and a third conductive sheet respectively attached to the side, the front and the back, the switch element is electrically connected to the first conductive segment through the first conductive sheet, and the second conductive segment is electrically connected to the circuit on the front through the second conductive sheet or is electrically connected to the circuit on the back through the third conductive sheet.

[0018] Optionally, the circuit board assembly includes two conductive pins, one of which is a positive pin and the other is a negative pin.

[0019] Optionally, the PCB is rectangular, the length direction of the PCB is a second direction perpendicular to the first direction, and the switch elements are distributed on the side along the second direction.

[0020] When the PCB is rectangular, the side area in the length direction of the PCB is larger than the side area in the width direction of the PCB. Therefore, by distributing the switch components on the side along the second direction, it is convenient to integrate the switch components on the side, which is conducive to reducing the process difficulty, thereby reducing production costs and improving yield rate.

[0021] Optionally, the number of the switch elements is one or more, and when there are multiple switch elements, the multiple switch elements are arranged at intervals.

[0022] The present application also provides an earphone, comprising any of the circuit board assemblies described above.

[0023] The circuit board assembly provided by the present application has the beneficial effect that the above-mentioned circuit board assembly is adopted, and the above-mentioned circuit board assembly effectively avoids the switch component from occupying the space on the side where the front and back sides of the PCB are located by integrating the switch component on the side of the PCB, and the layout is reasonable, so that the electronic components on the front or back side of the PCB are not easy to interfere, which is conducive to reducing the process difficulty and production cost of the product, and because the switch component is integrated on the side of the PCB, it is not easy to collide with the switch component when the circuit board assembly is stacked with components such as batteries and speakers along the first direction during the assembly of the earphone, which is conducive to improving the yield rate. In addition, because the switch component does not occupy the space on the side where the front and back sides of the PCB are located, it is conducive to reducing the thickness of the circuit board assembly in the first direction. In this way, when the circuit board assembly is applied to the earphone, it is conducive to reducing the thickness of the earphone in the first direction, and then it is conducive to miniaturizing the earphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 Schematic diagram of the three-dimensional structure of the circuit board assembly provided in the embodiment of the present application Figure 1 ;

[0026] Figure 2 Schematic diagram of the three-dimensional structure of the circuit board assembly provided in the embodiment of the present application Figure 2 ;

[0027] Figure 3 A schematic diagram of the exploded structure of a circuit board assembly provided in an embodiment of the present application;

[0028] Figure 4 A schematic diagram of the three-dimensional structure of a switch element provided in an embodiment of the present application;

[0029] Figure 5 A schematic diagram of the three-dimensional structure of the conductive pin provided in an embodiment of the present application.

[0030] Among them, the reference numerals in the figure are:

[0031] 10. PCB; 11. front; 12. back; 13. side; 14. groove; 15. first via hole; 16. second via hole; 20. switch; 21. conductive substrate; 22. convex button; 30. conductive pin; 31. first conductive segment; 32. second conductive segment; 33. first conductive sheet; 34. second conductive sheet; 35. third conductive sheet; F1. first direction; F2. second direction; F3. third direction. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] Please also read Figures 1 to 5 , the circuit board assembly provided in the embodiment of the present application is now described. The circuit board assembly can be applied to various electronic devices, especially small electronic devices, such as headphones, smart bracelets, home blood pressure monitors, calculators, home electronic scales, etc. In the embodiment of the present application, the circuit board assembly is applied to headphones as an example for description.

[0036] In some embodiments of this application, please refer to Figure 1 and Figure 2 The circuit board assembly includes a PCB 10 and a switch component 20. The thickness direction of the PCB 10 is a first direction F1. The PCB 10 has a front side 11, a back side 12 and a side surface 13. The front side 11 and the back side 12 are arranged opposite to each other along the first direction F1. The side surface 13 is arranged between the front side 11 and the back side 12 along the first direction F1. The switch component 20 is integrated in the side surface 13.

[0037] It can be understood that the front surface 11 and the back surface 12 are respectively opposite surfaces of the PCB 10 along the first direction F1 , and the side surface 13 is a circumferential surface of the PCB 10 along the first direction F1 .

[0038] The switch 20 is electrically connected to the PCB 10, and the switch 20 is a mechanical switch convex button, and the corresponding function of the PCB 10 is triggered by pressing the switch 20. For example, when the circuit board assembly is applied to headphones, the switch 20 can be pressed to enable the PCB 10 to control turning the headphones on or off, or the switch 20 can be pressed to enable the PCB 10 to control switching of the functions of the headphones, such as answering a call, hanging up a call, switching songs, increasing the volume, decreasing the volume, etc.

[0039] Compared with the prior art, the circuit board assembly provided by the present application integrates the switch element 20 into the side 13 of the PCB 10, effectively avoiding the switch element 20 from occupying the space on the side where the front 11 and the back 12 of the PCB 10 are located, and the layout is reasonable, so that the electronic components on the front 11 or the back 12 of the PCB 10 are not easy to interfere with each other, which is conducive to reducing the process difficulty and production cost of the product. When the circuit board assembly is applied to the earphone, since the switch element 20 is integrated into the side 13 of the PCB 10, during the assembly of the earphone, when the circuit board assembly is stacked with components such as the battery and the speaker along the first direction F1, it is not easy to collide with the switch element 20, which is conducive to improving the yield rate. In addition, when the circuit board assembly is applied to the earphone, since the switch element 20 does not occupy the space on the side where the front 11 and the back 12 of the PCB 10 are located, it is conducive to reducing the thickness of the circuit board assembly in the first direction F1. In this way, when the circuit board assembly is applied to the earphone, it is conducive to reducing the thickness of the earphone in the first direction F1, and then it is conducive to miniaturizing the earphone.

[0040] In some embodiments of this application, please refer to Figure 1 and Figure 2 PCB10 is rectangular, the length direction of PCB10 is the second direction F2, the second direction F2 is perpendicular to the first direction F1, the width direction of PCB10 is the third direction F3, the third direction F3 is perpendicular to the first direction F1 and the second direction F2, and the switch element 20 is integrated on the side 13 along the second direction F2.

[0041] When the PCB 10 is rectangular, the area of ​​the side surface 13 in the length direction of the PCB 10 is greater than the area of ​​the side surface 13 in the width direction of the PCB 10. Therefore, by distributing the switch element 20 on the side surface 13 along the second direction F2, it is convenient to integrate the switch element 20 onto the side surface 13, which is beneficial to reduce the process difficulty, thereby reducing production costs and improving yield rate.

[0042] Optionally, the number of the switch elements 20 may be one or more. For example, when the circuit board assembly is applied to the earphone and the number of the switch element 20 is one, the switch element 20 may be long pressed, for example, for more than 3 seconds, so that the PCB 10 controls turning the earphone on or off, and the switch element 20 may be short pressed, for example, quickly pressed once or multiple times within 1 second, so that the PCB 10 controls switching the earphone function. When the circuit board assembly is applied to the earphone and the number of the switch elements 20 is multiple, different switch elements 20 may be pressed to control the PCB 10 to control the earphone to achieve different functions.

[0043] When there are multiple switch components 20, the multiple switch components 20 are arranged at intervals. For example, all the switch components 20 may be integrated on the same side surface 13 of the PCB 10 along the second direction F2 or the third direction F3, and the multiple switch components 20 may be arranged at intervals. Alternatively, a portion of the switch components 20 may be integrated on one side surface 13 of the PCB 10 along the second direction F2, and another portion of the switch components 20 may be integrated on the other side surface 13 of the PCB 10 opposite to the second direction F2, or a portion of the switch components 20 may be integrated on one side surface 13 of the PCB 10 along the third direction F3, and another portion of the switch components 20 may be integrated on the other side surface 13 of the PCB 10 opposite to the third direction F3. Alternatively, a portion of the switch components 20 may be integrated on one side surface 13 of the PCB 10 along the second direction F2, and another portion of the switch components 20 may be integrated on one side surface 13 of the PCB 10 along the third direction F3.

[0044] The projection of the switch element 20 on the plane where the side surface 13 is located is within the projection range of the PCB 10 on the plane where the side surface 13 is located. For example, when the circuit board assembly is in a state where the first direction is the vertical direction, the end surface of the switch element 20 at one end along the first direction F1 is lower than the front surface 11 of the PCB 10 or is flush with the front surface 11 of the PCB 10, and the end surface of the switch element 20 at the other end along the first direction F1 is lower than the back surface 12 of the PCB 10 or is flush with the back surface 12 of the PCB 10. It can be understood that the switch element 20 does not protrude from the front surface 11 of the PCB 10 and the back surface 12 of the PCB 10, that is, the switch element 20 does not occupy the space on the side where the front surface 11 and the back surface 12 of the PCB 10 are located, which is conducive to reducing the circuit board assembly.

[0045] In some embodiments of this application, please refer to Figure 3 A groove 14 is formed on the side surface 13 of the PCB 10 , and the switch element 20 is embedded in the groove 14 .

[0046] By opening a groove 14 on the side 13 of the PCB 10 and embedding the switch 20 in the groove 14, the layout is reasonable, and the space outside the side 13 of the PCB 10 occupied by the switch 20 is effectively reduced, so that the structure of the circuit board assembly is more compact, and the volume of the circuit board assembly is effectively reduced, which is conducive to reducing the occupation of product space. For example, when the circuit board assembly is applied to headphones, it is conducive to reducing the occupation of the internal space of the headphones by the circuit board assembly, which helps to achieve miniaturization of the headphones. In addition, by embedding the switch 20 in the groove 14, the process is simple, the assembly is convenient, and the stability of the switch 20 integrated in the side 13 of the PCB 10 is effectively improved.

[0047] Optionally, the stability of the switch member 20 embedded in the groove 14 can be enhanced by gluing or welding.

[0048] It should be noted that the switch member 20 can be square, round, oval, etc., and the groove 14 is adapted to the switch member 20, which effectively enhances the stability of the switch member 20 embedded in the groove 14. For example, when the outer contour of the switch member 20 is a rectangle, the groove 14 is a rectangle adapted to the switch member 20.

[0049] Optionally, one end of the groove 14 along the first direction F1 passes through the front surface 11 of the PCB 10 , and the other end of the groove 14 along the first direction F1 passes through the back surface 12 .

[0050] By penetrating the groove 14 through the front side 11 and the back side 12 of the PCB 10 along the first direction F1 , it is convenient to embed the switch component 20 into the groove 14 , and the switch component 20 is not easily damaged during the assembly process.

[0051] In some embodiments of this application, please refer to Figure 4 The switch member 20 includes a conductive substrate 21 and a convex button 22 . The conductive substrate 21 is embedded in the groove 14 . The convex button 22 is connected to the conductive substrate 21 and protrudes from the side surface 13 .

[0052] By embedding the conductive substrate 21 in the groove 14 , the convex button 22 is connected to the conductive substrate 21 and protrudes from the side 13 , so that it is convenient for an external key to press the convex button 22 , so that the switch 20 triggers the corresponding function of the PCB 10 .

[0053] Optionally, the conductive substrate 21 is electrically connected to the PCB 10, and the convex button 22 is elastically connected to the conductive substrate 21, for example, the edge of the convex button 22 is electrically connected to the conductive substrate 21 through a pot. The conductive substrate 21 has a fixed conductive contact, and the convex button 22 has a movable conductive contact. By pressing the convex button 22, the convex button 22 overcomes the elastic force, and drives the movable conductive contact on the convex button 22 to approach and electrically contact with the fixed conductive contact. When the convex button 22 is released, the convex button 22 drives the movable conductive contact away from the fixed conductive contact under the elastic action, so that the switch 20 triggers the corresponding function of the PCB 10.

[0054] In some embodiments of this application, please refer to Figure 1 and Figure 2 The circuit board assembly further includes a conductive pin 30 , which is electrically connected to the PCB 10 and the switch element 20 .

[0055] Specifically, one end of the conductive pin 30 is electrically connected to the conductive substrate 21 , and the other end of the conductive pin 30 is electrically connected to the PCB 10 .

[0056] The switch element 20 is electrically connected to the PCB 10 via the conductive pin 30 , so that the electrical connection between the switch element 20 and the PCB 10 is simple and easy to process, which is beneficial to reducing production costs.

[0057] In some embodiments of this application, please refer to Figure 3 and Figure 5 A first via 15 and a second via 16 are provided on the PCB 10. The first via 15 extends along the second direction F2 or the third direction F3. One end of the first via 15 is connected to the middle of the second via 16. One end of the first via 15 away from the second via 16 passes through the side surface 13. The second via 16 extends along the first direction F1. Both ends of the second via 16 pass through the front surface 11 and the back surface 12 respectively. The conductive pin 30 includes a first conductive segment 31 and a second conductive segment 32. The first conductive segment 31 extends along the third direction F3 and is penetrated through the first via 15. The second conductive segment 32 extends along the first direction F1 and is penetrated through the second via 16. One end of the first conductive segment 31 is electrically connected to the second conductive segment 32. One end of the first conductive segment 31 away from the second conductive segment 32 extends to the side surface 13 of the PCB 10 through the first via 15 and is electrically connected to the switch element 20. Two ends of the second conductive segment 32 extend to the front side 11 and the back side 12 of the PCB 10 through the second via 16, respectively, and are electrically connected to the circuit on the front side 11 or the circuit on the back side 12, so that the switch element 20 is electrically connected to the circuit board through the conductive pin 30.

[0058] The first conductive segment 31 is passed through the first via hole 15 to be electrically connected to the switch element 20 located on the side 13, and the second conductive segment 32 is passed through the second via hole 16 to be electrically connected to the circuit on the front side 11 or the circuit on the back side 12, so that the switch element 20 is electrically connected to the PCB 10 through the conductive pin 30. The layout is reasonable and the structure is compact, which effectively reduces the excessive space occupied by the conductive pin 30 outside the PCB 10, and is conducive to reducing the volume of the circuit board assembly.

[0059] Optionally, the first conductive segment 31 and the second conductive segment 32 are both copper tubes with good conductivity. The first conductive segment 31 and the second conductive segment 32 are integrally formed, with simple process and low manufacturing cost.

[0060] In some embodiments of this application, please refer to Figure 3 and Figure 5 The conductive pin 30 further includes a first conductive sheet 33, a second conductive sheet 34 and a third conductive sheet 35. The first conductive sheet 33 is attached to the side surface 13, and the two ends of the first conductive sheet 33 are respectively electrically connected to the switch 20 and the end of the first conductive segment 31 away from the second conductive segment 32. Specifically, the end of the first conductive sheet 33 away from the first conductive segment 31 is electrically connected to the conductive substrate 21. The second conductive sheet 34 is attached to the front surface 11 and is electrically connected to one end of the second conductive segment 32. The third conductive sheet 35 is attached to the back surface 12 and is electrically connected to the other end of the second conductive segment 32. The second conductive sheet 34 is electrically connected to the circuit on the front surface 11 or the third conductive sheet 35 is electrically connected to the circuit on the back surface 12.

[0061] Optionally, the first conductive sheet 33, the first conductive segment 31, the second conductive segment 32, the second conductive sheet 34 and the third conductive sheet 35 are integrated, which has a simple process and low manufacturing cost. In addition, the first conductive sheet 33 can be in direct electrical contact with the conductive substrate, or the end of the first conductive sheet 33 away from the first conductive segment 31 can be welded to the conductive substrate 21 by welding.

[0062] In other embodiments, the number of conductive sheets on the conductive pin 30 for achieving external electrical connection may be four, five, or six, etc., and the specific design may be based on actual needs.

[0063] In some embodiments of this application, please refer to Figures 1 to 3 , the circuit board assembly includes two conductive pins 30, one of which is a positive pin and the other is a negative pin. Optionally, the two conductive pins 30 are respectively located at the two ends of the switch 20 along the second direction F2, and one end of the two conductive pins 30 is respectively electrically connected to the two ends of the switch 20, and the other ends of the two conductive pins 30 are electrically connected to the PCB 10. Specifically, the first conductive sheet 33 of one of the conductive pins 30 is electrically connected to one end of the conductive substrate 21 along the second direction F2, and the first conductive sheet 33 of the other conductive pin 30 is electrically connected to the other end of the conductive substrate 21 along the second direction F2.

[0064] It should be noted that the switch element 20 can be integrated into the side surface 13 of the PCB 10 during the molding process of the PCB 10 .

[0065] The present application also provides an earphone, comprising the circuit board assembly of any one of the above embodiments.

[0066] The earphone further includes an earphone shell, a battery, and a speaker. The battery, PCB 10 and the speaker are all accommodated in the earphone shell. The battery, PCB 10 and the speaker are stacked along a first direction F1.

[0067] The circuit board assembly provided in the present application adopts the above-mentioned circuit board assembly. The above-mentioned circuit board assembly effectively avoids the switch component 20 from occupying the space on the side where the front 11 and the back 12 of the PCB10 are located by integrating the switch component 20 into the side 13 of the PCB10. The layout is reasonable, so that the electronic components on the front 11 or the back 12 of the PCB10 are not easy to interfere with each other, which is conducive to reducing the process difficulty and production cost of the product. In addition, since the switch component 20 is integrated into the side 13 of the PCB10, it is not easy to collide with the switch component 20 when the circuit board assembly is stacked with components such as batteries and speakers along the first direction F1 during the assembly of the earphone, which is conducive to improving the yield rate. In addition, since the switch component 20 does not occupy the space on the side where the front 11 and the back 12 of the PCB10 are located, it is conducive to reducing the thickness of the circuit board assembly in the first direction F1. In this way, when the circuit board assembly is applied to the earphone, it is conducive to reducing the thickness of the earphone in the first direction F1, and then it is conducive to miniaturizing the earphone.

[0068] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

[0069] In addition, in this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0070] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0071] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

Claims

1. A circuit board assembly, characterized in that: include: A PCB, wherein the thickness direction of the PCB is a first direction, the PCB has a front side, a back side and a side surface, and the switch element, wherein the front side and the back side are arranged opposite to each other along the first direction, and the side surface is arranged between the front side and the back side along the first direction; and The switch component is integrated with the side surface.

2. The circuit board assembly according to claim 1, wherein: The side surface of the PCB is provided with a groove, and the switch element is embedded in the groove.

3. The circuit board assembly according to claim 2, wherein: The switch element comprises a conductive substrate and a convex button, wherein the conductive substrate is embedded in the groove, and the convex button is connected to the conductive substrate and protrudes from the side surface.

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The circuit board assembly further comprises a conductive pin, and the switch element is electrically connected to the PCB via the conductive pin.

5. The circuit board assembly according to claim 4, wherein: The length direction of the PCB is the second direction, and the width direction of the PCB is the third direction. The PCB is provided with a first via hole and a second via hole that are connected to each other. The first via hole extends along the second direction or the third direction, and one end extends to at least one of the side surfaces of the PCB. The second via hole extends along the first direction, and both ends extend to the front side and the back side respectively. The conductive pin includes a first conductive segment and a second conductive segment that are connected to each other. The first conductive segment is passed through the first via hole and is electrically connected to the switch element. The second conductive segment is passed through the second via hole and is electrically connected to the circuit on the front side or the circuit on the back side.

6. The circuit board assembly according to claim 5, wherein: The conductive pin also includes a first conductive sheet, a second conductive sheet and a third conductive sheet respectively attached to the side, the front and the back, the switch element is electrically connected to the first conductive segment through the first conductive sheet, and the second conductive segment is electrically connected to the circuit on the front through the second conductive sheet or is electrically connected to the circuit on the back through the third conductive sheet.

7. The circuit board assembly according to claim 4, wherein: The circuit board assembly includes two conductive pins, one of which is a positive pin and the other is a negative pin.

8. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The PCB is rectangular, the length direction of the PCB is a second direction perpendicular to the first direction, and the switch elements are distributed on the side surface along the second direction.

9. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The number of the switch elements is one or more. When there are multiple switch elements, the multiple switch elements are arranged at intervals.

10. A headset, characterized in that: Comprising a circuit board assembly as claimed in any one of claims 1 to 9.

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