Heat dissipation structure of electronic assembly

Abstract

The present disclosure provides a heat dissipation structure of an electronic assembly, comprising: a substrate having a first surface and a second surface, the first surface being provided with a control wafer and a plurality of connector fixing seats; the plurality of connectors are arranged on the connector fixing seats of the substrate; the fixing device is used for fixing the connectors on the substrate; the towing bracket is arranged and fixed on the base plate, and the towing bracket is provided with at least one lock hole; and the heat dissipation device is fixed on the substrate through the lock hole of the towing bracket, the fixing device is provided with a plurality of elastic structures to elastically press the upper surfaces of the connectors respectively, and the second surface of the substrate is provided with a component to reinforce the strength of the substrate and provide heat conduction.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure of an electronic component, and more particularly to a heat dissipation structure of an electronic component with a fixing device. Background Art

[0002] Near packaged optics (NPO) separates the optical engine (OE) from the switch chip, assembling them on the same printed circuit board (PCB) and adding an intermediate layer, making it easier to route signals from the switch chip to the optical engine. The use of the intermediate layer technology also means that the entire printed circuit board does not need to be upgraded, greatly reducing costs. Summary of the invention

[0003] According to an embodiment of the present disclosure, a heat dissipation structure of an electronic component is provided, comprising: a substrate having a first surface and a second surface, the first surface being provided with a control chip and a plurality of connector fixing seats, each of the connector fixing seats having a first end and a second end, the first ends being arranged toward the outer edge of the substrate; a plurality of connectors being arranged on the connector fixing seats of the substrate, and an interface of each of the connectors being located at the first end of each of the connector fixing seats; a fixing device for fixing the connectors to the substrate; a bracket being arranged and fixed to the substrate and located at the second ends of the connector fixing seats, the bracket having at least one locking hole; and a heat dissipation device being fixed to the substrate through the locking hole of the bracket, and being in contact with the control chip and the connectors on the substrate, wherein the fixing device is provided with a plurality of elastic structures for elastically pressing the upper surfaces of the connectors respectively, wherein the second surface of the substrate is provided with a component for reinforcing the strength of the substrate and providing heat conduction.

[0004] In some embodiments, the substrate includes a printed circuit board (PCB).

[0005] In some embodiments, the connectors include optical engines (OE) or electrical signal connectors. In some embodiments, the connectors surround the control chip.

[0006] In some embodiments, the fixing device includes an integrated fixing device or a separate fixing device. In some embodiments, each of the elastic structures has a first end and a second end, and one of the first end and the second end is embedded in the fixing device. In some embodiments, each of the elastic structures has a first end and a second end, and the first end and the second end are embedded in the fixing device.

[0007] In some embodiments, the carriage surrounds the control wafer.

[0008] In some embodiments, the second surface of the substrate is provided with a power module and a plurality of second connectors. In some embodiments, the component has a first surface and a second surface, the first surface has a plurality of grooves to accommodate the power module, and the second surface is provided with a plurality of fins. In some embodiments, a medium is also filled between the grooves and the power module. In some embodiments, the heat dissipation structure of the electronic component further includes a second substrate disposed thereon, and the second substrate is electrically connected through the second connectors. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The following will be described in detail with reference to the accompanying drawings. It should be noted that the various feature components are not drawn to scale and are only used for illustration. In fact, the size of the components may be enlarged or reduced to clearly show the technical features of the embodiments of the present disclosure.

[0010] Figure 1 According to one embodiment of the present disclosure, an exploded view of a heat dissipation structure (optical signal) of an electronic component;

[0011] Figure 2 According to one embodiment of the present disclosure, an exploded view of a heat dissipation structure (electrical signal) of an electronic component;

[0012] Figure 3 According to one embodiment of the present disclosure, a three-dimensional diagram of a portion of a heat dissipation structure of an electronic component;

[0013] Figure 4 According to one embodiment of the present disclosure, a three-dimensional diagram of a portion of a heat dissipation structure of an electronic component;

[0014] Figure 5 According to one embodiment of the present disclosure, a schematic diagram of a bracket in a heat dissipation structure of an electronic component;

[0015] Figure 6 According to one embodiment of the present disclosure, a three-dimensional diagram of a fixing device in a heat dissipation structure of an electronic component;

[0016] Figure 7 According to one embodiment of the present disclosure, a three-dimensional diagram of a fixing device in a heat dissipation structure of an electronic component;

[0017] Fig. 8A According to one embodiment of the present disclosure, a top view of a fixing device in a heat dissipation structure of an electronic component;

[0018] Figure 8B According to one embodiment of the present disclosure, a cross-sectional view of a fixing device in a heat dissipation structure of an electronic component;

[0019] Fig. 9AAccording to one embodiment of the present disclosure, a top view of a fixing device in a heat dissipation structure of an electronic component;

[0020] Fig. 9B According to one embodiment of the present disclosure, a cross-sectional view of a fixing device in a heat dissipation structure of an electronic component;

[0021] Fig. 10A According to one embodiment of the present disclosure, an exploded view of a heat dissipation structure of an electronic component;

[0022] Fig. 10B According to an embodiment of the present disclosure, a top view of a portion of a heat dissipation structure of an electronic component;

[0023] Fig. 10C According to an embodiment of the present disclosure, a cross-sectional view of a portion of a heat dissipation structure of an electronic component;

[0024] Fig.11A According to one embodiment of the present disclosure, a three-dimensional diagram of a component in a heat dissipation structure of an electronic component;

[0025] Fig. 11B According to one embodiment of the present disclosure, a three-dimensional diagram of a component in a heat dissipation structure of an electronic component; and

[0026] Fig.12 According to an embodiment of the present disclosure, a three-dimensional diagram of a partial structure of a heat dissipation structure of an electronic component is connected to an external substrate.

[0027] Description of Figure Numbers:

[0028] 10: Heat dissipation structure of electronic components

[0029] 10', 10a, 10b: Partial structure of the heat dissipation structure of the electronic component

[0030] 12:Substrate

[0031] 12a: first surface of substrate

[0032] 12b: Second surface of substrate

[0033] 12e: Outer edge of the substrate

[0034] 14: Connector

[0035] 14a: Connector interface

[0036] 14t: Top surface of connector

[0037] 16: Fixtures

[0038] 16a: First part of the fixture

[0039] 16b: Second part of the fixture

[0040] 16c: The third part of the fixture

[0041] 16d: The fourth part of the fixture

[0042] 18:Trailer

[0043] 20: Heat dissipation device

[0044] 22: Control chip

[0045] 24: Connector fixing seat

[0046] 24a: First end of connector fixing seat

[0047] 24b: Second end of connector fixing seat

[0048] 26: Keyhole

[0049] 28: Components

[0050] 28a: First surface of the component

[0051] 28b: Second surface of the component

[0052] 30: Power module

[0053] 32: Second connector

[0054] 34: Hole position

[0055] 36,36': Communication components

[0056] 38,38': Elastic structure

[0057] 38a, 38'a: first end of the elastic structure

[0058] 38b, 38'b: second end of the elastic structure

[0059] 40: Stud

[0060] 42: Screw

[0061] 44: Groove

[0062] 46: Opening

[0063] 48: Fins

[0064] 50: Second substrate

[0065] 52: The third connector DETAILED DESCRIPTION

[0066] The following disclosure provides many different embodiments to implement the different features of the present invention. The following disclosure describes specific examples of each component and its arrangement to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if the disclosed embodiment describes a first characteristic component formed on or above a second characteristic component, it means that it may include an embodiment in which the first characteristic component and the second characteristic component are in direct contact, and may also include an embodiment in which an additional characteristic component is formed between the first characteristic component and the second characteristic component, so that the first characteristic component and the second characteristic component may not be in direct contact.

[0067] It should be understood that additional operating steps may be implemented before, during or after the method, and in other embodiments of the method, some operating steps may be replaced or omitted.

[0068] In addition, spatially related words may be used, such as "below", "below", "lower", "above", "above", "higher" and similar words. These spatially related words are used to facilitate the description of the relationship between one (some) element or feature component and another (some) element or feature component in the diagram. These spatially related words include different orientations of the device in use or operation, as well as the orientations described in the drawings. When the device is turned to different orientations (rotated 45 degrees or other orientations), the spatially related adjectives used therein will also be interpreted according to the orientation after the turn. In some embodiments of the present disclosure, terms such as "connect", "interconnect", etc. regarding joining and connection, unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, with other structures being arranged between the two structures. And the terms regarding joining and connection may also include situations where both structures are movable, or both structures are fixed.

[0069] In the specification, the terms "about", "approximately", "generally", "substantially", "same", and "similar" generally indicate that a characteristic value is within plus or minus 15%, or within plus or minus 10%, or within plus or minus 5%, or within plus or minus 3%, or within plus or minus 2%, or within plus or minus 1%, or within plus or minus 0.5% of a given value. The quantity given here is an approximate quantity, that is, in the absence of specific description of "about", "approximately", "generally", "substantially", the meaning of "about", "approximately", "generally", "substantially" can still be implied.

[0070] It should be understood that although the terms "first", "second", "third", etc. are used herein to describe different elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the technology disclosed herein, the first element, component, region, layer or section discussed below can be referred to as a second element, component, region, layer or section.

[0071] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of this disclosure.

[0072] See also Figure 1 According to an embodiment of the present disclosure, a heat dissipation structure 10 of an electronic component is provided. Figure 1 It is an exploded view of the heat dissipation structure 10 of the electronic component.

[0073] like Figure 1 As shown, the heat dissipation structure 10 of the electronic component includes a substrate 12, a plurality of connectors 14, a fixing device 16, a bracket 18, and a heat dissipation device 20. The substrate 12 has a first surface 12a and a second surface 12b. The first surface 12a is provided with a control chip 22 and a plurality of connector fixing seats 24. The number of the connector fixing seats 24 is not limited. For example, 16 connector fixing seats (such as Figure 1 Each connector holder 24 has a first end 24a and a second end 24b, and the first end 24a is disposed toward the outer edge 12e of the substrate 12. A plurality of connectors 14 are disposed on the connector holder 24 of the substrate 12, and the interface 14a of each connector 14 is located at the first end 24a of each connector holder 24. The number of connectors 14 is not limited and can be considered in conjunction with the number of connector holders. For example, 16 connectors (such as Figure 1 The fixing device 16 is used to fix the connector 14 to the substrate 12. The carriage 18 is arranged to be fixed to the substrate 12 and is located at the second end 24b of the connector fixing seat 24. The carriage 18 has a locking hole 26. The number of the locking holes 26 is not limited, for example, four locking holes (such as Figure 1The embodiment shown in the figure). The structural state of the bracket 18 will be described in detail later. The heat dissipation device 20 is fixed to the substrate 12 through the locking hole 26 of the bracket 18. The fixing device 16 is provided with a plurality of elastic structures (not shown) to elastically press against the upper surface 14t of the connector 14 respectively. The elastic structures provided in the fixing device 16 will be described in detail later. The second surface 12b of the substrate 12 is provided with a component 28 to strengthen the strength of the substrate 12 and provide heat conduction. The structural composition of the component 28 will be described in detail later.

[0074] In addition to fixing the connector 14 to the substrate 12, the fixing device 16 also provides appropriate downward pressure to make the connection between the connector 14 and the substrate 12 more secure. The heat sink 20 is locked and fixed to the substrate 12 through the locking hole 26 of the bracket 18. Since the locking hole 26 is located at a position closer to the center of the overall packaging structure, for example, around the control chip 22, the warping phenomenon caused by the increase in span when the heat sink 20 is locked through the locking hole located at a position closer to the periphery of the overall packaging structure can be reduced. Since the fixing effect of the heat sink 20 is good, the heat dissipation effect of the heat sink 20 is also promoted. The bracket 18 can also increase the rigidity of the substrate 12.

[0075] In some embodiments, the substrate 12 may include a printed circuit board (PCB).

[0076] In some embodiments, the connector 14 may include an optical engine (OE) or an electrical signal connector. Figure 1 In the embodiment, the connector 14 is an optical engine (OE), for example, an optical engine with different transmission speeds. The connector 14 surrounds the control chip 22.

[0077] In some embodiments, the fixing device 16 may include an integrated fixing device or a separate fixing device. Figure 1 The fixing device 16 is a separate fixing device. The related structural components of the integrated and separate fixing devices 16 will be described in detail later.

[0078] exist Figure 1 In the embodiment, the carriage 18 surrounds the control wafer 22 .

[0079] The heat sink 20 can promote heat dissipation of the connector 14 and the control chip 22. In some embodiments, the heat sink 20 may include a heat sink composed of a temperature plate and fins or a heat sink composed of a heat pipe and fins. Figure 1 In the figure, the heat sink 20 is a heat sink composed of a temperature equalizing plate and fins.

[0080] See also Figure 2According to an embodiment of the present disclosure, a heat dissipation structure 10 of an electronic component is provided. Figure 2 It is an exploded view of the heat dissipation structure 10 of the electronic component.

[0081] like Figure 2 As shown, the heat dissipation structure 10 of the electronic component includes a substrate 12, a plurality of connectors 14, a fixing device 16, a bracket 18, and a heat dissipation device 20. The substrate 12 has a first surface 12a and a second surface 12b. The first surface 12a is provided with a control chip 22 and a plurality of connector fixing seats 24. The number of the connector fixing seats 24 is not limited. For example, 16 connector fixing seats (such as Figure 2 Each connector holder 24 has a first end 24a and a second end 24b, and the first end 24a is disposed toward the outer edge 12e of the substrate 12. A plurality of connectors 14 are disposed on the connector holder 24 of the substrate 12, and the interface 14a of each connector 14 is located at the first end 24a of each connector holder 24. The number of connectors 14 is not limited and can be considered in conjunction with the number of connector holders. For example, 16 connectors (such as Figure 2 The fixing device 16 is used to fix the connector 14 to the substrate 12. The carriage 18 is arranged to be fixed to the substrate 12 and is located at the second end 24b of the connector fixing seat 24. The carriage 18 has a locking hole 26. The number of the locking holes 26 is not limited, for example, four locking holes (such as Figure 2 The embodiment shown in the figure). The structural state of the bracket 18 will be described in detail later. The heat dissipation device 20 is fixed to the substrate 12 through the locking hole 26 of the bracket 18. The fixing device 16 is provided with a plurality of elastic structures (not shown) to elastically press against the upper surface 14t of the connector 14 respectively. The elastic structures provided in the fixing device 16 will be described in detail later. The second surface 12b of the substrate 12 is provided with a component 28 to strengthen the strength of the substrate 12 and provide heat conduction. The structural composition of the component 28 will be described in detail later.

[0082] In addition to fixing the connector 14 to the substrate 12, the fixing device 16 also provides appropriate downward pressure to make the connection between the connector 14 and the substrate 12 more secure. The heat sink 20 is locked and fixed to the substrate 12 through the locking hole 26 of the bracket 18. Since the locking hole 26 is located at a position closer to the center of the overall packaging structure, for example, around the control chip 22, the warping phenomenon caused by the increase in span when the heat sink 20 is locked through the locking hole located at a position closer to the periphery of the overall packaging structure can be reduced. Since the fixing effect of the heat sink 20 is good, the heat dissipation effect of the heat sink 20 is also promoted. The bracket 18 can also increase the rigidity of the substrate 12.

[0083] In some embodiments, the substrate 12 may include a printed circuit board (PCB).

[0084] In some embodiments, the connector 14 may include an optical engine (OE) or an electrical signal connector. Figure 2 In the embodiment, the connector 14 is an electrical signal connector, such as a common connector socket (CCS) connector. The connector 14 surrounds the control chip 22.

[0085] In some embodiments, the fixing device 16 may include an integrated fixing device or a separate fixing device. Figure 2 The fixing device 16 is a separate fixing device. The related structural components of the integrated and separate fixing devices 16 will be described in detail later.

[0086] exist Figure 2 In the embodiment, the carriage 18 surrounds the control wafer 22 .

[0087] The heat sink 20 can promote heat dissipation of the connector 14 and the control chip 22. In some embodiments, the heat sink 20 may include a heat sink composed of a temperature plate and fins or a heat sink composed of a heat pipe and fins. Figure 2 In the embodiment, the heat dissipation device 20 is a heat dissipation device composed of heat pipes and fins.

[0088] See also Figure 3 According to an embodiment of the present disclosure, it is further described as follows Figure 1 The illustrated electronic component heat dissipation structure 10 is a partial structure 10 ′ of the assembly state. Figure 3 It is a three-dimensional diagram of a partial structure 10 ′ of a heat dissipation structure 10 of an electronic component, which includes a component 28 disposed below a substrate 12 , the substrate 12 , a control chip 22 disposed above the substrate 12 , a carriage 18 , a connector 14 , and a fixing device 16 .

[0089] like Figure 3 As shown, in the partial structure 10' of the heat dissipation structure 10 of the electronic component, the first surface 12a of the substrate 12 is provided with a control chip 22 and a plurality of connectors 14, surrounding the control chip 22. The fixing device 16 provided on the substrate 12 is used to fix the connector 14 to the substrate 12. The carriage 18 is arranged and fixed to the substrate 12, surrounding the control chip 22, and has a locking hole 26. The heat dissipation device (not shown) is fixed to the substrate 12 through the locking hole 26 of the carriage 18. The second surface 12b of the substrate 12 is provided with a member 28 to reinforce the strength of the substrate 12 and provide heat conduction.

[0090] See also Figure 4According to an embodiment of the present disclosure, it is further described as follows Figure 1 The heat dissipation structure 10 of the electronic component is shown as being configured on the second surface 12 b of the substrate 12 . Figure 4 It is a three-dimensional diagram of a part of the heat dissipation structure 10 of the electronic component.

[0091] like Figure 4 As shown, in the partial structure of the heat dissipation structure 10 of the electronic component, the second surface 12b of the substrate 12 is provided with a power module 30 and a plurality of second connectors 32. In some embodiments, the power module 30 may include, for example, a plurality of DC-to-DC converters. The number of components constituting the power module 30 is not limited, for example, 19 DC-to-DC converters (such as Figure 4 In some embodiments, the second connector 32 can be used as a board-to-board connector to connect to an external substrate. The number of second connectors 32 is not limited. For example, two board-to-board connectors (such as Figure 4 embodiment shown).

[0092] See also Figure 5 According to an embodiment of the present disclosure, the structure of the trailer 18 is further described. Figure 5 FIG. 1 is a schematic diagram of a bracket 18 in a heat dissipation structure 10 for electronic components.

[0093] like Figure 5 As shown, the carriage 18 includes a plurality of holes 34 and a plurality of locking holes 26. The holes 34 of the carriage 18 are used to fix the carriage 18 to the substrate 12. The number of holes 34 is not limited, for example, 8 holes (such as Figure 5 When considering locking the heat sink, due to the limitation of the wiring layout of the substrate, it is impossible to add additional holes around the control chip on the substrate for locking the heat sink. The present disclosure uses the locking holes 26 of the bracket 18 to lock the heat sink without adding additional holes. On the one hand, the fixing effect of the heat sink 20 is improved, and on the other hand, the rigidity around the control chip can be increased.

[0094] See also Figure 6 According to an embodiment of the present disclosure, the structural composition of the fixing device 16 is further described. Figure 6 It is a three-dimensional diagram of a partial structure 10a of the heat dissipation structure 10 of the electronic component.

[0095] like Figure 6As shown, in the partial structure 10a of the heat dissipation structure 10 of the electronic component, the fixing device 16 is not yet connected to the communication component 36. The communication component 36 includes a component 28 disposed below the substrate 12, the substrate 12, and a control chip 22 disposed above the substrate 12, a bracket 18, and a connector 14. Figure 6 In the figure, the fixing device 16 is a separate fixing device, which includes a first part 16a, a second part 16b, a third part 16c, and a fourth part 16d, which are respectively used to fix the connector 14 in the communication component 36, and the separate fixing device 16 does not overlap with the trailer 18.

[0096] See also Figure 7 According to an embodiment of the present disclosure, the structural composition of the fixing device 16 is further described. Figure 7 It is a three-dimensional diagram of a partial structure 10b of the heat dissipation structure 10 of the electronic component.

[0097] like Figure 7 As shown, in the partial structure 10b of the heat dissipation structure 10 of the electronic component, the case where the fixing device 16 has not yet been connected to the communication component 36' is used as an example for explanation. The communication component 36' includes a component 28 disposed below the substrate 12, the substrate 12, and a control chip 22 and a connector 14 disposed above the substrate 12. Figure 7 In the embodiment, the fixing device 16 is an integrated fixing device, for example, Figure 6 The bracket structure shown is integrated therein. The integrated fixing device 16 can not only fix the connector 14 in the communication component 36', but also provide a heat sink locking device.

[0098] See also Fig. 8A and Figure 8B According to one embodiment of the present disclosure, the elastic structure 38 disposed in the fixing device 16 is further described. Fig. 8A It is a top view of the fixing device 16 in the heat dissipation structure 10 of the electronic component. Figure 8B for Fig. 8A Section view along section line A-A'.

[0099] like Fig. 8A and Figure 8B As shown, each elastic structure 38 in the fixing device 16 has a first end 38a and a second end 38b, and at least one of the first end 38a and the second end 38b is embedded in the fixing device 16. Fig. 8A and Figure 8B In the illustrated embodiment, the first end 38 a and the second end 38 b of the elastic structure 38 are both embedded in the fixing device 16 .

[0100] like Fig. 8A and Figure 8BThe fixing device 16 shown can provide appropriate positive pressure to each connector, and the elastic structure 38 in the device can further control the downward positive force to stabilize the connector on the substrate.

[0101] See also Fig. 9A and Fig. 9B According to one embodiment of the present disclosure, the elastic structure 38' disposed in the fixing device 16 is further described. Fig. 9A It is a top view of the fixing device 16 in the heat dissipation structure 10 of the electronic component. Fig. 9B for Fig. 9A Section view along the BB' section line.

[0102] like Fig. 9A and Fig. 9B As shown, each elastic structure 38' in the fixing device 16 has a first end 38'a and a second end 38'b, and at least one of the first end 38'a and the second end 38'b is embedded in the fixing device 16. Fig. 9A and Fig. 9B In the illustrated embodiment, the first end 38 ′ a of the elastic structure 38 ′ is embedded in the fixing device 16 , while the second end 38 ′ b is suspended and not embedded in the fixing device 16 .

[0103] like Fig. 9A and Fig. 9B The fixing device 16 shown can provide appropriate positive pressure to each connector, and the elastic structure 38' in the device can further control the positive downward force to stabilize the connector on the substrate.

[0104] See also Fig. 10A , Fig. 10B and Fig. 10C According to an embodiment of the present disclosure, the assembly sequence of the bracket 18, the connector 14, the fixing device 16, and the heat dissipation device 20 in the heat dissipation structure 10 of the electronic component and the configuration relationship between the components are further described. Fig. 10A It is an exploded view of the heat dissipation structure 10 of the electronic component. Fig. 10B It is a top view of a partial structure 10 ′ in the heat dissipation structure 10 of the electronic component. Fig. 10C for Fig. 10B Section view along the C-C' section line.

[0105] like Fig. 10AAs shown, the carriage 18, the connector 14, the fixing device 16, and the heat sink 20 are assembled. First, the carriage 18 is locked on the first surface 12a (upper surface) of the substrate 12 by eight studs 40 and fixed around the control chip 22. The carriage 18 has four locking holes 26 for subsequent locking of the heat sink 20. The substrate 12 is provided with a member 28 on the second surface 12b (lower surface) of the carriage 18. Afterwards, the connector 14 is assembled to the substrate 12. Next, the separate fixing device 16 (including the first part 16a, the second part 16b, the third part 16c, and the fourth part 16d) is locked on the substrate 12 by 20 screws 42 (divided into four groups in total) to fix the connector 14 located around the control chip 22. Afterwards, the heat sink 20 is locked on the carriage 18 by four spring screws (not shown) through the locking holes 26 of the carriage 18, and the assembly of the heat sink structure 10 of the electronic component is completed.

[0106] like Fig. 10B As shown, the above view further illustrates the configuration relationship between the components on the substrate 12. The carriage 18 is locked to the substrate 12 by 8 studs (not shown) and fixed around the control chip 22. The carriage 18 has 4 locking holes 26 for subsequent locking of the heat sink 20. The separate fixing device 16 (including the first part 16a, the second part 16b, the third part 16c, and the fourth part 16d) is locked to the substrate 12 by 20 screws 42 (divided into four groups) to fix the connector 14 located around the control chip 22.

[0107] like Fig. 10C As shown in the cross-sectional view, a member 28 is provided on the lower surface of the base plate 12. The carriage 18 is fixed to the base plate 12 by means of a stud 40. The carriage 18 has a locking hole 26 for subsequent fixing of the heat sink 20. The separate fixing device 16 (e.g., the first portion 16a) is fixed to the base plate 12 by means of a screw 42.

[0108] See also Fig.11A and Fig. 11B According to one embodiment of the present disclosure, the structural composition of the component 28 is further described. Fig.11A and Fig. 11B FIG. 2 is a perspective view of a component 28 in a heat dissipation structure 10 of an electronic component.

[0109] like Fig.11A As shown, the first surface 28a of the component 28 has a plurality of grooves 44 and a plurality of openings 46. The grooves 44 of the component 28 can be used to accommodate Figure 4The power module 30 shown disposed on the second surface 12b of the substrate 12 can accommodate, for example, 19 DC-to-DC converters. In some embodiments, a medium such as a gap filler is also filled between the groove 44 and the power module 30, which can absorb various assembly tolerances on one hand and transfer the heat released by the power module 30 to the component 28 on the other hand. The number of grooves 44 of the component 28 is not limited. For example, a component 28 having 8 grooves (such as Fig.11A The embodiment shown in the figure) is mainly determined by the number of components of the power module 30. Figure 4 The second connector 32 disposed on the second surface 12b of the substrate 12 can be exposed from the opening 46 of the component 28. The exposed second connector 32 can be further connected to an external substrate.

[0110] like Fig. 11B As shown, a plurality of fins 48 are disposed on the second surface 28b of the component 28. When the heat released by the power module 30 is transferred to the component 28, the fins 48 disposed on the second surface 28b can achieve a heat dissipation effect through conduction.

[0111] The component 28 disposed at the bottom of the substrate 12 of the present disclosure not only has the function of heat dissipation through conduction, but also can enhance the rigidity of the entire substrate.

[0112] See also Fig.12 According to an embodiment of the present disclosure, the bonding state between a partial structure 10 ′ of the heat dissipation structure 10 of the electronic component and an external substrate is further described. Fig.12 It is a three-dimensional view of a bonding state between a partial structure 10 ′ of a heat dissipation structure 10 of an electronic component and an external substrate.

[0113] like Fig.12 As shown, a partial structure 10' of the heat dissipation structure 10 of the electronic component is disposed on the second substrate 50, wherein the partial structure 10' of the heat dissipation structure 10 of the electronic component is electrically connected to the second substrate 50 by engaging a second connector (not shown) disposed on the second surface of the substrate in the partial structure 10' of the heat dissipation structure 10 of the electronic component with a third connector 52 of the second substrate 50. In some embodiments, the second substrate 50 may include a printed circuit board (PCB).

[0114] The components of some of the above-mentioned embodiments are provided so that those skilled in the art to which the present disclosure belongs can better understand the viewpoints of the embodiments of the present disclosure. Those skilled in the art to which the present disclosure belongs should understand that they can design or modify other processes and structures based on the embodiments of the present disclosure to achieve the same purposes and / or advantages as the embodiments introduced herein. Those skilled in the art to which the present disclosure belongs should also understand that such equivalent structures do not deviate from the spirit and scope of the present disclosure, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be defined by the attached application claims. In addition, although the present disclosure has been disclosed as above with several preferred embodiments, it is not intended to limit the present disclosure.

[0115] References throughout this specification to features, advantages, or similar language do not imply that all features and advantages that may be realized using the present disclosure should or may be realized in any single embodiment of the present disclosure. Rather, language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, discussion of features and advantages and similar language throughout this specification may, but does not necessarily, refer to the same embodiment.

[0116] Furthermore, in one or more embodiments, the described features, advantages, and characteristics of the present disclosure may be combined in any suitable manner. Based on the description herein, one skilled in the relevant art will appreciate that the present disclosure may be implemented without one or more of the specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be identified in certain embodiments that may not be present in all embodiments of the present disclosure.

Claims

1. A heat dissipation structure of an electronic component, comprising: A substrate having a first surface and a second surface, wherein the first surface is provided with a control chip and a plurality of connector fixing seats, each of the plurality of connector fixing seats having a first end and a second end, and the plurality of first ends are arranged toward an outer edge of the substrate; A plurality of connectors are disposed on the plurality of connector fixing seats of the substrate, and an interface of each of the plurality of connectors is located at the first end of each of the plurality of connector fixing seats; A fixing device, used for fixing the plurality of connectors on the substrate; A carriage, arranged and fixed on the base plate and located at the plurality of second ends of the plurality of connector fixing seats, the carriage having at least one locking hole; as well as The heat dissipation device is fixed to the base plate through the locking hole of the bracket.

2. The heat dissipation structure of an electronic component according to claim 1, wherein the substrate comprises a printed circuit board (PCB).

3. The heat dissipation structure of an electronic component according to claim 1, wherein the plurality of connectors include light engines or electrical signal connectors.

4. The heat dissipation structure of an electronic component according to claim 1, wherein the plurality of connectors surround the control chip.

5. The heat dissipation structure of an electronic component according to claim 1, wherein the fixing device comprises an integrated fixing device or a separate fixing device.

6. The heat dissipation structure of an electronic component according to claim 1, wherein the carriage surrounds the control chip.

7. The heat dissipation structure of an electronic component according to claim 1, wherein the fixing device is provided with a plurality of elastic structures to elastically press against the upper surfaces of the plurality of connectors respectively. 8 . The heat dissipation structure of an electronic component according to claim 7 , wherein each of the plurality of elastic structures has a first end and a second end, and at least one of the first end and the second end is embedded in the fixing device.

9. The heat dissipation structure of an electronic component according to claim 1, wherein a power module and a plurality of second connectors are disposed on the second surface of the substrate.

10. The heat dissipation structure of an electronic component according to claim 9, wherein a component is disposed on the second surface of the substrate to reinforce the strength of the substrate and provide heat conduction. 11 . The heat dissipation structure of an electronic component according to claim 10 , wherein the component has a first surface and a second surface, the first surface has a plurality of grooves to accommodate the power module, and the second surface is provided with a plurality of fins. 12 . The heat dissipation structure of an electronic component according to claim 9 , wherein the heat dissipation structure of an electronic component further comprises a heat dissipation device disposed on a second substrate and electrically connected to the second substrate through the plurality of second connectors.

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