Flexible circuit board and electronic equipment

Abstract

The embodiment of the invention provides a flexible circuit board and electronic equipment, relates to the technical field of display, and can reduce interference between signal lines. The flexible circuit board includes: a display chip connection portion extending along a first direction; the wiring part is arranged on one side of the display chip connecting part along the first direction; the capacitor device area is arranged between the display chip connecting part and the wiring part in the first direction, the capacitor device area comprises capacitor devices, and the wiring part is electrically connected with the display chip connecting part through the capacitor devices in the capacitor device area.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a flexible circuit board and an electronic device. Background Art

[0002] With the development of display technology, more and more electronic devices use organic light-emitting diode (OLED) display panels. Electronic devices with touch display function include OLED display panels, flexible printed circuit boards (FPCs) and touch chips. The OLED display panel includes a stacked display layer and a touch layer, wherein the signal line on the FPC is used to transmit the touch signal between the touch layer and the touch chip. However, the current FPC has the problem of mutual interference between signal lines. Summary of the invention

[0003] The technical solution of the present application provides a flexible circuit board and an electronic device, which can reduce interference between signal lines.

[0004] In a first aspect, a flexible circuit board is provided, comprising: a display chip connection portion extending along a first direction; a wiring portion arranged on one side of the display chip connection portion along the first direction; and a capacitor device area arranged between the display chip connection portion and the wiring portion along the first direction, the capacitor device area comprising a capacitor device, and the wiring portion is electrically connected to the display chip connection portion through the capacitor device in the capacitor device area.

[0005] In a possible implementation, on the same side of the display chip connection portion, the wiring portion includes a touch chip connection portion and a mainboard connection portion, the mainboard connection portion and the touch chip connection portion are arranged along a second direction, the mainboard connection portion is electrically connected to the display chip connection portion through a capacitor device in the capacitor device area, and the second direction is perpendicular to the first direction.

[0006] In a possible implementation, the display chip connection portion includes multiple touch sensing signal terminals and multiple power signal terminals, and the multiple touch sensing signal terminals and the multiple power signal terminals are arranged along a first direction; the touch chip connection portion is electrically connected to the multiple touch sensing signal terminals through multiple touch sensing signal lines; the mainboard connection portion is electrically connected to the multiple power signal terminals through multiple power signal lines, and at least part of the multiple power signal lines are electrically connected to the capacitor device in the capacitor device area.

[0007] In a possible implementation manner, the capacitor device area is located between the plurality of touch sensing signal lines and the mainboard connection portion.

[0008] In a possible implementation, the multiple touch sensing signal terminals include multiple first touch sensing signal terminals and multiple second touch sensing signal terminals, the display chip connection part includes multiple non-touch signal terminals, the multiple non-touch signal terminals are located between the multiple first touch sensing signal terminals and the multiple second touch sensing signal terminals, and the multiple non-touch signal terminals include multiple power signal terminals; the touch chip connection part includes multiple third touch sensing signal terminals and multiple fourth touch sensing signal terminals, the multiple touch sensing signal lines include multiple first touch sensing signal lines and multiple second touch sensing signal lines, the multiple third touch sensing signal terminals are respectively connected to the multiple first touch sensing signal terminals through the multiple first touch sensing signal lines, and the multiple fourth touch sensing signal terminals are respectively connected to the multiple second touch sensing signal terminals through the multiple second touch sensing signal lines.

[0009] In a possible implementation, the flexible circuit board has a first wiring layer and a second wiring layer stacked in a thickness direction, and the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines are located in the first wiring layer and the second wiring layer.

[0010] In a possible embodiment, the touch chip connecting part includes a first touch chip connecting part and a second touch chip connecting part, and the first touch chip connecting part and the second touch chip connecting part are used to respectively connect different touch chips; the plurality of third touch sensing signal terminals include a plurality of first terminals belonging to the first touch chip connecting part, and the plurality of fourth touch sensing signal terminals include a plurality of second terminals belonging to the first touch chip connecting part; the plurality of first touch sensing signal lines include a plurality of first signal lines respectively connected to the plurality of first terminals; the plurality of second touch sensing signal lines include a plurality of second signal lines respectively connected to the plurality of second terminals; in the second direction, the distance between the second touch chip connecting part and the display chip connecting part is smaller than the distance between the first touch chip connecting part and the display chip connecting part.

[0011] In a possible embodiment, the flexible circuit board has an interlaced wiring area, in which the multiple first touch sensing signal lines and the multiple second touch sensing signal lines include multiple first-layer signal lines located in a first wiring layer and multiple second-layer signal lines located in a second wiring layer; in the interlaced wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is a second-layer signal line between any two adjacent first-layer signal lines, and there is a first-layer signal line between any two adjacent second-layer signal lines.

[0012] In one possible embodiment, the staggered wiring area includes a first staggered wiring area, in which a plurality of first signal lines are located in a first wiring layer, and a plurality of second signal lines are located in a second wiring layer; in the first staggered wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is a second signal line between any two adjacent first signal lines, and there is a first signal line between any two adjacent second signal lines.

[0013] In a possible embodiment, the multiple third touch sensing signal terminals include multiple third terminals belonging to the second touch chip connection part; the multiple first touch sensing signal lines include multiple third signal lines respectively connected to the multiple third terminals; the staggered wiring area includes a second staggered wiring area, in the second staggered wiring area, the multiple first signal lines are located in the first wiring layer, and the multiple third signal lines are located in the second wiring layer; in the second staggered wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is a third signal line between any two adjacent first signal lines, and there is a first signal line between any two adjacent third signal lines.

[0014] In a possible implementation, the plurality of fourth touch sensing signal terminals include a plurality of fourth terminals belonging to the second touch chip connecting portion; and the plurality of second touch sensing signal lines include a plurality of fourth signal lines respectively connected to the plurality of fourth terminals.

[0015] In a possible implementation, the multiple third touch sensing signal terminals include multiple third terminals belonging to the second touch chip connection part; the multiple first touch sensing signal lines include multiple third signal lines respectively connected to the multiple third terminals; the multiple fourth touch sensing signal terminals include multiple fourth terminals belonging to the second touch chip connection part; the multiple second touch sensing signal lines include multiple fourth signal lines respectively connected to the multiple fourth terminals.

[0016] In a possible implementation, in the second direction, the capacitor device region is located on a side of the fourth signal lines away from the second signal lines; in the first direction, the capacitor device region is located on a side of the fourth signal lines away from the third signal lines.

[0017] In a possible implementation, the flexible circuit board has a cross-wiring area, in which at least part of the multiple touch sensing signal lines and the multiple power signal lines are vertically crossed, and the multiple touch sensing signal lines include at least part of the multiple first touch sensing signal lines and the multiple second touch sensing signal lines.

[0018] In a possible implementation, the mainboard connection portion includes a plurality of display signal terminals, and the plurality of display signal terminals are respectively connected to a plurality of display signal lines; the plurality of display signal lines include a cross-line portion extending along the second direction, and the cross-line portion perpendicularly crosses the plurality of fourth signal lines.

[0019] In a possible embodiment, the plurality of first touch sensing signal lines include a first portion extending along a first direction, the plurality of display signal lines include a second portion extending along the first direction, and the second portion is located between the display chip connection portion and the first portion; the plurality of non-touch signal terminals include a plurality of display terminals, and the plurality of display terminals are electrically connected to the plurality of non-touch signal lines, respectively.

[0020] In a possible implementation, the plurality of display signal lines are mobile industry processor interface MIPI signal lines.

[0021] In a possible embodiment, the display chip connection portion includes a plurality of first touch drive signal terminals and a plurality of second touch drive signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of second touch sensing signal terminals; the display chip connection portion includes a plurality of third touch drive signal terminals and a plurality of fourth touch drive signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of first touch sensing signal terminals; the plurality of first touch drive signal terminals are connected to the first touch chip connection portion through a plurality of first touch drive signal lines; the plurality of second touch drive signal terminals are connected to the second touch chip connection portion through a plurality of second touch drive signal lines; the plurality of third touch drive signal terminals are connected to the first touch chip connection portion through a plurality of third touch drive signal lines; the plurality of fourth touch drive signal terminals are connected to the second touch chip connection portion through a plurality of fourth touch drive signal lines; in the second direction, the second portion is located between the plurality of first touch drive signal lines and the plurality of second touch drive signal lines.

[0022] In a second aspect, an electronic device is provided, comprising: the above-mentioned flexible circuit board; a display chip, the display chip is connected to the display chip connection part of the flexible circuit board; a display panel, the display panel is connected to the display chip; and a touch chip, the touch chip is connected to the touch chip connection part of the flexible circuit board.

[0023] In the flexible circuit board and electronic device in the embodiments of the present application, since the capacitor device area is located between the display chip connection part and the wiring part in the first direction, the signal line on the wiring part can be directly extended to the display chip connection part, and after connecting to the capacitor of the capacitor device area during the extension process, it is connected to the display chip connection part. This structure does not require the signal line to extend outward and then inward, thereby saving the space occupied by the signal line. Moreover, since the extension direction of the signal lines is consistent, the probability of signal interference caused by the overlap between different signal lines is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of an electronic device in the related art;

[0025] Figure 2 It is a structural schematic diagram of another electronic device in the related art;

[0026] Figure 3 This is a schematic diagram of the structure of an electronic device in an embodiment of the present application;

[0027] Figure 4 This is a schematic diagram of the structure of a flexible circuit board in an embodiment of the present application;

[0028] Figure 5 for Figure 4 A notated schematic diagram of the structure in

[0029] Figure 6 for Figure 5 A partial enlarged schematic diagram of the middle A1 area;

[0030] Figure 7 for Figure 5 A partial enlarged schematic diagram of the A2 area in the middle;

[0031] Figure 8 for Figure 5 A partial enlarged schematic diagram of the middle A3 area;

[0032] Fig. 9 for Figure 8 A partial enlarged schematic diagram of the first staggered wiring area;

[0033] Fig.10 for Figure 8 A partial enlarged schematic diagram of the second staggered wiring area;

[0034] Fig.11 for Figure 8 A schematic diagram of a cross-sectional structure in the BB' direction;

[0035] Fig.12 for Figure 8 A schematic diagram of a cross-sectional structure in the CC' direction;

[0036] Fig.13 for Figure 5 A partial enlarged schematic diagram of the cross wiring area;

[0037] Fig.14 for Figure 4 Another annotated schematic diagram of the structure in;

[0038] Fig.15 This is a schematic diagram of the structure of another flexible circuit board in an embodiment of the present application;

[0039] Fig.16 for Fig.15 A labeled schematic diagram of the structure in . DETAILED DESCRIPTION

[0040] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0041] Before introducing the embodiments of the present application, the related technologies and their technical problems are first explained.

[0042] Electronic devices in the related art include OLED display panels, display chips, FPCs, touch chips and motherboards. The OLED display panel includes a display layer and a touch layer that are stacked. The touch layer includes a plurality of drive electrodes and a plurality of sensing electrodes. The drive electrodes and the sensing electrodes are insulated and crossed. The original touch control is to apply touch signals to the drive electrodes in sequence and detect the signal changes on the sensing electrodes at the same time. If the corresponding signal changes can be detected on the sensing electrodes corresponding to the touch positions, since the sensing electrodes are arranged in one direction, the position of the sensing electrodes to which the signal changes belong can be used to determine the touch coordinates in this direction. Since the signal on the drive electrode corresponds to time and the drive electrodes are arranged in another direction, the time of the signal change can be used to determine which drive electrode applied the signal that caused the signal change, so the touch coordinates in another direction can be determined. The intersection of the drive electrode and the sensing electrode corresponds to the touch reporting point position. The display chip is mainly used to realize functions related to reality. In addition, the display chip is also used to transmit the touch signal in the touch layer to the touch signal line on the FPC. The touch signal line includes a sensing signal line and a driving signal line. The sensing signal line is used to transmit the sensing signal of the corresponding sensing electrode, and the driving signal line is used to transmit the driving signal of the corresponding driving electrode. In addition, in addition to the touch signal line, the FPC also includes other signal lines, such as power signal lines and display signal lines. The display signal line refers to a signal line related to the content displayed by the OLED display panel. The display signal line on the FPC is used to transmit the display signal provided by the motherboard to the display chip. The display chip drives the OLED display panel to display the corresponding picture based on the display signal. For the touch signal line and other signal lines, if there is an overlap between the two, parasitic capacitance will be generated between the overlapping signal lines. The coupling effect of the parasitic capacitance will cause the signal change of one of them to cause the other to be interfered. For conventional electronic devices such as straight-plate mobile phones, the touch reporting point positions are relatively small, and the number of touch signal lines is small. Therefore, the touch sensing signal line on the FPC is not easy to cross with other signal lines, that is, the touch sensing signal line is not easily interfered. However, for electronic devices with a large number of touch signal lines, the touch sensing signal lines on the FPC are easily interfered by other signal lines. For the drive signal and the sensing signal, the sensing signal is more easily interfered by other signals, which may lead to a decrease in touch accuracy. For example, for electronic devices with high touch accuracy requirements, more touch reporting points are required, which means more touch signal lines are required; for another example, for foldable mobile phones, the folding structure will cause the number of touch electrodes to double, which means more touch signal lines are required.Based on this, for electronic devices with a large number of touch signal lines, a three-layer or four-layer FPC design can be used. In this way, a shielding layer can be set between the sensing signal line and other signal lines at the part where the sensing signal line crosses other signal lines. The shielding layer can be used to reduce interference between the two. However, this requires more layers of FPC, resulting in higher cost and increased thickness.

[0043] like Figure 1 As shown, in a related technology, the touch layer includes a plurality of driving electrodes TX and a plurality of sensing electrodes RX, each driving electrode TX extends along a second direction h2, a plurality of driving electrodes TX are arranged along a first direction h1, each sensing electrode RX extends along the first direction h1, a plurality of sensing electrodes RX are arranged along a second direction h2, the driving electrodes TX and the sensing electrodes RX are insulated and crossed, and the second direction h2 may be perpendicular to the first direction h1. During the touch process, a driving signal may be provided to the driving electrode TX in a time-sharing manner, and a sensing signal on each sensing electrode RX may be received. At a position where no user touches, the driving signal on the driving electrode TX will generate a coupling effect on the sensing electrode RX at the intersection in a fixed manner, and at a position where the user touches, the user's touch will generate a coupling effect on the sensing electrode RX at the intersection of the driving electrode TX and the sensing electrode RX. In this way, at the position where the user touches, the sensing signal received by the sensing electrode RX can be identified. On the one hand, by identifying the position of the sensing electrode RX of the touch signal in the second direction, the coordinates of the touch position in that direction can be determined. On the other hand, by identifying the time when the touch signal is detected, the position of the driving electrode TX can be determined, that is, the coordinates of the touch position in the first direction can be determined, so that the touch position can be determined by the coordinates of two dimensions. The touch layer is connected to the touch chip through the display chip and the FPC. Figure 1 In the structure shown, the driving electrode TX leads out the driving signal line TXL only on one side, the driving signal line TXL is connected to the display chip, and is led out from the lower left side of the display chip to the FPC and routed to the touch chip in the FPC; the sensing electrode RX also leads out the sensing signal line RXL only on one side, the sensing signal line RXL is connected to the display chip, and is led out from the lower right side of the display chip to the FPC and routed to the touch chip in the FPC. Figure 1 In the structure shown, the driving electrode TX and the sensing electrode RX only lead out the signal line on one side, so it is called a 1T1R structure. Compared with the driving signal, the sensing signal is more easily interfered by other signals. Figure 1 In the structure shown, the sensing signal line RXL is connected to the touch chip from the right side of the display chip via a shorter path to reduce the probability of crossing between the sensing signal line RXL and other signal lines such as the power signal line PL, thereby reducing signal interference. Figure 1 The structure in can be realized by double-layer FPC.

[0044] However, with the emergence of electronic devices with high touch requirements such as foldable phones, the requirements for touch positions are higher, and the corresponding wiring structure can be 2T1R or even 2T2R. 2T1R means that the driving electrode TX leads out signal lines on both opposite sides, and the sensing electrode RX leads out signal lines only on one side. 2T2R means that the driving electrode TX leads out signal lines on both opposite sides, and the sensing electrode RX also leads out signal lines on both opposite sides. For example, Figure 2 In the structure shown, both the sensing signal line RXL and the driving signal line TXL need to be led out to the FPC on both sides of the display chip, so both types of signal lines need to cross the entire FPC. In addition, a mainboard connection portion and a device area are provided on the FPC. The mainboard connection portion is used to connect to the mainboard, and the device area is provided with devices such as capacitors. At least part of the power signal line PL led out from the mainboard connection portion is first extended to the device area to facilitate connection with the required devices in the device area, such as capacitor devices, and then extends to the right and is connected to the display chip. The touch chip is closer to the display chip than the device area and the mainboard connection portion. This will cause the sensing signal line RXL and the power signal line PL to cross at more locations, thereby increasing the probability of interference with the sensing signal line. Therefore, in order to solve this problem, it is usually Figure 2 In the structure shown, the FPC will adopt a three-layer or four-layer structure. In this way, a shielding layer can be set between the sensing signal line RXL and the power signal line PL at the intersection of the two to reduce the probability of the sensing signal line being interfered by other signals. However, this will increase the number of layers of the FPC, that is, increase the cost.

[0045] In order to solve the above-mentioned problems, a technical solution of an embodiment of the present application is provided, and the technical solution of the embodiment of the present application is described below.

[0046] like Figure 3 As shown, an embodiment of the present application provides an electronic device, including: a flexible circuit board 100; a display chip 200, the display chip 200 is connected to the display chip connection part 1 of the flexible circuit board 100; a display panel 300, the display panel 300 is connected to the display chip 200; a touch chip 400, the touch chip 400 is connected to the touch chip connection part of the flexible circuit board 100, and the display panel 300 includes a display layer and a touch layer stacked.

[0047] like Figures 4 to 7As shown, the embodiment of the present application also provides a flexible circuit board 100, including: a display chip connection part 1, extending along a first direction h1, the display chip connection part 1 is used to connect a display chip 200; a wiring part 20, arranged on one side of the display chip connection part 1 along the first direction h1; and a capacitor device area 61, arranged between the display chip connection part 1 and the wiring part 20 along the first direction h1, the capacitor device area 61 includes a capacitor device C, and the wiring part 20 is electrically connected to the display chip connection part 1 through the capacitor device C in the capacitor device area 61. The wiring part 20 is used to connect external devices, for example, to connect the touch chip 400 and the mainboard.

[0048] In such Figure 2 In the related technology shown, since the device area is located outside the wiring part, the signal line of the motherboard connection part needs to first extend outward to the device area and connect to the capacitor in the device area, and then extend to the display chip, which makes it easier to interfere with other signal lines during the routing process.

[0049] As for the flexible circuit board and the electronic device in the embodiments of the present application, since the capacitor device area is located between the display chip connection part and the wiring part in the first direction, the signal line on the wiring part can be directly extended to the display chip connection part, and is connected to the capacitor of the capacitor device area during the extension process, and then connected to the display chip connection part. This structure does not require the signal line to extend outward and then inward, thereby saving the space occupied by the signal line. Moreover, since the extension direction of the signal lines is consistent, the probability of signal interference caused by the overlap between different signal lines is reduced.

[0050] In a possible implementation, Figure 4 and Figure 5 As shown, on the same side of the display chip connection part 1, the wiring part 20 includes a touch chip connection part 2 and a mainboard connection part 3, the mainboard connection part 3 and the touch chip connection part 2 are arranged along the second direction h2, the mainboard connection part 3 is electrically connected to the display chip connection part 1 through the capacitor device C in the capacitor device area 61, and the second direction h2 is perpendicular to the first direction h1. Among them, the mainboard connection part 3 can be located on the side of the display chip connection part 1, that is, the display chip connection part 1 and the mainboard connection part 3 are arranged along the first direction h1. Under this structure, the signal line of the mainboard connection part 3 can directly extend to the left and connect to the capacitor device C in the capacitor device area 61, and then continue to extend to the left and connect to the display chip connection part 1. The touch chip connection part 2 does not need to be connected to the capacitor device C, so it can directly bypass the capacitor device area 61 and then connect to the display chip connection part 1. In this way, the probability of the signal line of the touch chip connection part 2 overlapping with the signal line of the mainboard connection part 3 is reduced, thereby reducing the interference of the signal line corresponding to the mainboard connection part 3 on the signal line of the touch chip connection part 2.

[0051] In a possible implementation, Figure 5 As shown, the display chip connection part includes multiple touch sensing signal terminals and multiple power signal terminals PP, the multiple touch sensing signal terminals include multiple first touch sensing signal terminals RXP1 and multiple second touch sensing signal terminals RXP2, and the multiple touch sensing signal terminals and the multiple power signal terminals PP are arranged along the first direction h1; the touch chip connection part 2 is electrically connected to the multiple touch sensing signal terminals through multiple touch sensing signal lines; the mainboard connection part 3 is electrically connected to the multiple power signal terminals PP through multiple power signal lines 4, and at least part of the multiple power signal lines 4 are electrically connected to the capacitor device C in the capacitor device area 61.

[0052] Specifically, the motherboard connection part 3 is used to connect the motherboard, and the motherboard is usually provided with devices such as a processor and a memory to realize the functions of the electronic device. The length direction of the display chip connection part 1 is the first direction h1, and the width direction of the display chip connection part 1 is the second direction h2. The multiple terminals on the display chip connection part 1 are arranged along the first direction h1, and the display chip connection part 1 is located at the upper end of the FPC. The signal lines drawn from the multiple terminals of the display chip connection part 1 extend downward to the FPC along the second direction h2 to realize wiring. In other words, whether it is a touch sensing signal line drawn from the touch sensing signal terminal or a power signal line drawn from the power signal terminal PP, they are all signal lines drawn downward from the display chip connection part 1, and the power signal line 4 needs to be connected to the motherboard connection part 3, and at least part of the power signal line 4 needs to be connected to the capacitor device C in the capacitor device area 61; the touch sensing signal line needs to be connected to the touch chip connection part 2 located below the motherboard connection part 3. In the embodiment of the present application, the terminal is a pin for connecting a signal line, and one terminal is used to lead out a signal line, but the signal line after being led out can be forked into multiple lines as needed.

[0053] In the embodiment of the present application, since the mainboard connection part is located on the side of the display chip connection part, the touch chip connection part is located below the mainboard connection part, and the capacitor device area is located at a position closer to the display chip connection part relative to both the mainboard connection part and the touch chip connection part in the first direction, the power signal line drawn from the display chip connection part can be directly connected to the capacitor device in the capacitor device area first, and then directly connected to the mainboard connection part to the right, and the touch sensing signal line drawn from the display chip connection part does not need to pass through the capacitor device area to be connected to the touch chip connection part. Under such a structure, it is helpful to reduce the crossing between the power signal line and the touch sensing signal line, thereby reducing the interference of the power signal line on the touch sensing signal.

[0054] In a possible implementation, Figure 4 and Figure 5As shown, the capacitor device area 61 is located between any touch sensing signal line and the mainboard connection portion 3. That is, the touch sensing signal line extending from the display chip connection portion 1 to the touch chip connection portion 2 bypasses the capacitor device area 61. Since at least part of the power signal line needs to pass through the capacitor device area 61, this structure can minimize the crossing between the touch sensing signal line and the power signal line.

[0055] In a possible implementation, Figure 5 As shown, the plurality of touch sensing signal terminals include a plurality of first touch sensing signal terminals RXP1 and a plurality of second touch sensing signal terminals RXP2, the display chip connection portion 1 includes a plurality of non-touch signal terminals P, the plurality of non-touch signal terminals P include the plurality of power signal terminals PP, the plurality of non-touch signal terminals P are located between the plurality of first touch sensing signal terminals RXP1 and the plurality of second touch sensing signal terminals RXP2, for example, Figure 4 and Figure 5 In the structure shown, the display chip connection part 1 is located on the upper side of the FPC, a plurality of first touch sensing signal terminals RXP1 are located on the left side, and a plurality of second touch sensing signal terminals RXP2 are located on the right side. The display chip connection part 1 is used to connect the display chip, and the display chip is used to connect the display panel. The display chip and the display panel are connected at Figure 4 and Figure 5 touch chip connection portion 2, the touch chip connection portion 2 may be located on the right side of the FPC, the touch chip connection portion 2 is used to connect the touch chip ( Figure 4 and Figure 5 The touch chip connection part 2 is connected to the display chip connection part 1 through the wiring on the FPC to realize the transmission of the touch signal. Figure 4 and Figure 5 In the structure shown, there are two touch chip connection parts 2, and the two touch chip connection parts 2 can be connected to two touch chips respectively, but the embodiment of the present application is not limited to this. For example, in other embodiments, there can be only one touch chip connection part 2 to connect one touch chip. Figure 6 and Figure 7 As shown, the touch chip connection part 2 includes a plurality of third touch sensing signal terminals RXP3 and a plurality of fourth touch sensing signal terminals RXP4, the plurality of touch sensing signal lines include a plurality of first touch sensing signal lines and a plurality of second touch sensing signal lines, the plurality of third touch sensing signal terminals RXP3 are respectively connected to the plurality of first touch sensing signal terminals RXP1 through the plurality of first touch sensing signal lines, and the plurality of fourth touch sensing signal terminals RXP4 are respectively connected to the plurality of second touch sensing signal terminals RXP2 through the plurality of second touch sensing signal lines. Figure 5 to Figure 12As shown, the plurality of first touch sensing signal lines include a plurality of first signal lines L1 and a plurality of third signal lines L3 , and the plurality of second touch sensing signal lines include a plurality of second signal lines L2 and a plurality of fourth signal lines L4 . The FPC also includes a plurality of non-touch signal lines respectively connected to a plurality of non-touch signal terminals P, and at least part of the plurality of non-touch signal lines extends along the second direction h2; a plurality of first touch sensing signal lines include a first part 31 extending along the first direction h1, and a part of the plurality of non-touch signal lines extending in the second direction h2 is located between the first part 31 and the display chip connection part 1, that is, in order to reduce the interference of the non-touch signal line on the first touch sensing signal line, the first touch sensing signal line is routed along the outermost side of the FPC, i.e., the lower side. In this way, the first touch sensing signal line can be kept as far away as possible from the dense routing area, which is the position where the plurality of non-touch signal lines extend in the second direction h2; the flexible circuit board has a first wiring layer and a second wiring layer stacked in the thickness direction, and a plurality of first touch sensing signal lines, a plurality of second touch sensing signal lines and a plurality of non-touch signal lines are located in the first wiring layer and the second wiring layer. It should be noted that Figure 4 and Figure 5 The structures shown are the same, except that, for clarity, Figure 5 right Figure 4 Some structures in the figure are marked with white filled patterns.

[0056] In the flexible circuit board of the embodiment of the present application, the touch sensing signal terminals are respectively arranged at the two ends of the display chip connection part, that is, the touch sensing signal line led out of one end can be connected to the touch chip at a relatively close distance to reduce the interference of other signal lines, and the touch sensing signal line led out of the other end is arranged outside the non-touch signal line by winding to reduce the interference of the non-touch signal line. Therefore, the embodiment of the present application only needs to use two layers of PFC to realize the arrangement of signal routing, that is, while reducing the interference of other signal lines to the touch sensing signal line, it reduces the cost and reduces the thickness of the flexible circuit board and the whole machine.

[0057] In a possible implementation, Figures 8 to 12As shown, the flexible circuit board has a staggered wiring area, and the staggered wiring area includes a first staggered wiring area 11 and a second staggered wiring area 12. In the staggered wiring area, a plurality of first touch sensing signal lines and a plurality of second touch sensing signal lines include a plurality of first layer signal lines M1 located in the first wiring layer and a plurality of second layer signal lines M2 located in the second wiring layer; in the staggered wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is a second layer signal line M2 between any two adjacent first layer signal lines M1, and there is a first layer signal line M1 between any two adjacent second layer signal lines M2. On the one hand, in a direction perpendicular to the plane where the flexible circuit board is located, there is no overlap between signal lines of different layers, which can reduce signal interference caused by mutual coupling between the two layers; on the other hand, the space of the FPC is effective. In order to arrange more signal lines in a limited space, signal lines of different layers are arranged in a staggered arrangement, which is easier to implement in terms of process and is conducive to saving space. A two-layer FPC refers to an FPC having two stacked wiring layers. Fig.11 and Fig.12 As described, the first-layer signal line M1 and the second-layer signal line M2 belong to two wiring layers respectively, and an intermediate dielectric layer 71 is provided between the two wiring layers. A first insulating protective layer 72 is provided on the side of the first-layer signal line M1 away from the intermediate dielectric layer 71, and a second insulating protective layer 73 is provided on the side of the second-layer signal line M2 away from the intermediate dielectric layer 71, wherein any one of the intermediate dielectric layer 71, the first insulating protective layer 72 and the second insulating protective layer 73 can be a single-layer or multi-layer dielectric, and any one of the first-layer signal line M1 and the second-layer signal line M2 can be a single-layer metal material layer, a stack of multiple metal material layers, or a composite metal material layer.

[0058] In a possible implementation, Figure 5 to Figure 7As shown, the touch chip connection part 2 includes a first touch chip connection part T1 and a second touch chip connection part T2, and the first touch chip connection part T1 and the second touch chip connection part T2 are used to connect different touch chips respectively; the plurality of third touch sensing signal terminals RXP3 include a plurality of first terminals belonging to the first touch chip connection part T1, and the plurality of fourth touch sensing signal terminals RXP4 include a plurality of second terminals belonging to the first touch chip connection part T1; the plurality of first touch sensing signal lines include a plurality of first signal lines L1 respectively connected to the plurality of first terminals; the plurality of second touch sensing signal lines include a plurality of second signal lines L2 respectively connected to the plurality of second terminals, that is, the third touch sensing signal terminals L1 in the first touch chip connection part T1 are connected to the plurality of first terminals. The signal terminal RXP3 is connected to the first signal line L1, the second signal line L2 connected to the fourth touch sensing signal terminal RXP4 in the first touch chip connection part T1, the third signal line L3 connected to the third touch sensing signal terminal RXP3 in the second touch chip connection part T2, and the fourth signal line L4 connected to the fourth touch sensing signal terminal RXP3 in the second touch chip connection part T2; in the second direction h2, the distance between the second touch chip connection part T2 and the display chip connection part 1 is smaller than the distance between the first touch chip connection part T1 and the display chip connection part 1, that is, in the second direction h2, the second touch chip connection part T2 is located between the display chip connection part 1 and the first touch chip connection part T1. Figure 8 to Figure 12 As shown, the staggered wiring area includes a first staggered wiring area 11. In the first staggered wiring area 11, multiple first signal lines L1 are located in the first wiring layer, and multiple second signal lines L2 are located in the second wiring layer; in the first staggered wiring area 11, in a direction perpendicular to the plane where the flexible circuit board is located, there is a second signal line L2 between any two adjacent first signal lines L1, and there is a first signal line L1 between any two adjacent second signal lines L2, that is, in the first staggered wiring area 11, the first signal line L1 is a first layer signal line M1, and the second signal line L2 is a second layer signal line M2. That is to say, a part of the touch sensing signal lines led out from the first touch chip connection part T1 corresponding to the same touch chip is used to connect to the first signal line L1 on the left side of the display chip connection part 1, and the other part is used to connect to the second signal line L2 on the right side of the display chip connection part 1. Both of them first extend to the left in the first staggered wiring area 11, and then, the second signal line L2 extends upward and is connected to a part of the second touch sensing signal terminal RXP2 on the right side of the display chip connection part 1, and the first signal line L1 keeps extending to the left and extends upward after reaching the left side of the FPC and is connected to a part of the first touch sensing signal terminal RXP1 on the left side of the display chip connection part 1.

[0059] It should be noted that the plurality of first touch sensing signal terminals RXP1 and the plurality of second touch sensing signal terminals RXP2 may be terminals for transmitting the same signal or terminals for transmitting different signals. Figure 4 and Figure 5 In the example shown, both are terminals that transmit the same signal. For example, these terminals are terminals used to transmit signals on the touch sensing electrodes in the display panel. Assuming there are 40 touch sensing electrodes, these 40 touch sensing electrodes lead out 40 signal lines on the left and right sides respectively. The 40 signal lines on the left are connected to the 40 first touch sensing signal terminals RXP1 on the left through the display chip, and the 40 signal lines on the right are connected to the 40 second touch sensing signal terminals RXP2 through the display chip. Among them, when the electronic device used by the FPC is a folding screen electronic device, the touch function of only part of the screen may be used when the screen is folded, and the touch function of the other part of the screen is not used. Assume that the signal lines of the touch sensing electrodes corresponding to part of the screen are 1 to 20, and the signal lines of the touch sensing electrodes corresponding to the other part of the screen are 21 to 40. Then, signal lines 1 to 20 corresponding to the first touch sensing signal terminal RXP1 on the left are connected to the first touch chip connection part T1, signal lines 21 to 40 corresponding to the first touch sensing signal terminal RXP1 on the left are connected to the second touch chip connection part T2, signal lines 1 to 20 corresponding to the second touch sensing signal terminal RXP2 on the right are connected to the first touch chip connection part T1, and signal lines 21 to 40 corresponding to the second touch sensing signal terminal RXP2 on the left are connected to the second touch chip connection part T2. When the screen is folded, the touch chip connected to the first touch chip connection part T1 works, and the other touch chip connected to the second touch chip connection part T2 does not work, that is, the touch sensing electrodes connected to the signal lines 1 to 20 work, and the touch sensing electrodes connected to the signal lines 21 to 20 do not work.

[0060] It should also be noted that the terminals of the touch chip connection portion 2 can be located in the same metal layer, and can be switched to the corresponding metal layer after the signal line is led out. Figure 7 As shown, the first signal line L1 and the second signal line L2 led out from the first touch chip connection part T1 are initially located in the same metal layer. Afterwards, the second signal line L2 switches to another metal layer at a corresponding position. After the layer switching, the second signal line L2 and the first signal line L1 are respectively located in different layers and can be staggered, that is, extended to the first staggered wiring area 11.

[0061] In a possible implementation, Figure 6 and Figure 7As shown, the plurality of third touch sensing signal terminals RXP3 include a plurality of third terminals belonging to the second touch chip connection portion T2; the plurality of first touch sensing signal lines include a plurality of third signal lines L3 respectively connected to the plurality of third terminals; Figure 8 , Fig.10 and Fig.12 As shown, the staggered wiring area includes a second staggered wiring area 12. In the second staggered wiring area 12, a plurality of first signal lines L1 are located in the first wiring layer, and a plurality of third signal lines L3 are located in the second wiring layer. In the second staggered wiring area 12, in a direction perpendicular to the plane where the flexible circuit board is located, there is a third signal line L3 between any two adjacent first signal lines L1, and there is a first signal line L1 between any two adjacent third signal lines L3. That is, referring to Figure 5 As shown, a part of the touch sensing signal line led out from the second touch chip connection part T2 is used to connect to the third signal line L3 on the left side of the display chip connection part 1. After extending to the left and crossing the second signal line L2, this part of the third signal line L3 extends downward to the position of the plurality of first signal lines L1, merges with the plurality of first signal lines L1 and extends to the left together. The part where the plurality of third signal lines L3 merge with the plurality of first signal lines L1 and extend to the left together is the above-mentioned first part 31. In the first part 31, the first signal line L1 is the first layer signal line M1, and the third signal line L3 is the second layer signal line M2. After the first part 31 extends to the left side of the FPC and bypasses the plurality of non-touch signal lines with dense routing, the plurality of first signal lines L1 and the plurality of third signal lines L3 extend upward and are connected to the plurality of first touch sensing signal terminals RXP1 on the left side of the display chip connection part 1.

[0062] In a possible implementation, Figure 6 and Figure 7 As shown, the plurality of fourth touch sensing signal terminals RXP4 include a plurality of fourth terminals belonging to the second touch chip connection portion T2; the plurality of second touch sensing signal lines include a plurality of fourth signal lines L4 respectively connected to the plurality of fourth terminals. Figure 5 As shown, another part of the touch sensing signal lines led out from the second touch chip connection part T2 is used to connect to the fourth signal line L4 on the right side of the display chip connection part 1, and the multiple third signal lines L3 and the multiple fourth signal lines L4 led out from the second touch chip connection part T2 first extend to the left, and then, the multiple fourth signal lines L4 extend upward and are connected to part of the second touch sensing signal terminals RXP2 on the right side of the display chip connection part 1, and the multiple third signal lines L3 extend to cross the second signal lines L2 and merge with the multiple first signal lines L1 to form the first part 31.

[0063] In a possible implementation, Figure 4 and Figure 5 As shown, in the second direction h2, the capacitor device area 61 is located on the side of the plurality of fourth signal lines L4 away from the plurality of second signal lines L2; ​​in the first direction h1, the capacitor device area 61 is located on the side of the plurality of fourth signal lines L4 away from the plurality of third signal lines L3. That is to say, in the second direction h2, the plurality of capacitor devices C are located on the upper side of all touch signal lines, and in the first direction h1, the plurality of capacitor devices C are located on the right side of all touch signal lines. The power signal line 4 is used to supply power to the display panel and other devices through the motherboard. On the FPC, at least part of the power signal line 4 needs to be connected to the capacitor device C, and the capacitor device C is easy to interfere with other signal lines due to coupling. Therefore, the capacitor device C is set outside each touch sensing signal line, and the touch sensing signal line will bypass the capacitor device C during the routing process, thereby reducing the interference of the capacitor device C on the sensing signal.

[0064] In a possible implementation, Figure 4 and 5 As shown, a portion of the power signal line 4 led out of the motherboard connection portion 3 directly extends to the left to the capacitor device area 61, and continues to extend to the left after connecting the capacitor device C, and another portion of the power signal line 4 led out of the motherboard connection portion 3 extends downward. The flexible circuit board has a cross wiring area 13, such as Fig.13 As shown, in the cross wiring area 13, at least part of the multiple touch sensing signal lines and the multiple power signal lines 4 are arranged vertically and crosswise, and the multiple touch sensing signal lines include at least part of the multiple first touch sensing signal lines and the multiple second touch sensing signal lines. For some power signal lines 4, they may need to extend downward and connect to the protective device first, which will cause the power signal line 4 to overlap with the touch sensing signal line. Therefore, in order to reduce the coupling interference of the power signal line 4 to the touch sensing signal line when the two overlap, the extension directions of the two are set to be perpendicular to each other. Under this setting, the parasitic capacitance area between the two is reduced, that is, the parasitic capacitance between the two is reduced, thereby reducing the coupling interference between the two. In addition, since the voltage value on the power signal line 4 does not change, its interference with the touch sensing signal line is the same. Therefore, the interference of the power signal line 4 to the touch sensing signal line can be filtered out by an algorithm.

[0065] In a possible implementation, the mainboard connection portion 3 includes a plurality of display signal terminals, and the plurality of display signal terminals are respectively connected to a plurality of display signal lines 5; Figure 5 and Fig.13As shown, the plurality of display signal lines 5 include a cross-line portion extending along the second direction h2, and the cross-line portion crosses the plurality of fourth signal lines L4 perpendicularly. The display signal line 5 is used to transmit display data between the display panel and the mainboard. On the FPC, the display signal line 5 will cross the fourth signal line L4 and the third signal line L3 in the cross wiring area 13. Therefore, in this area, the display signal line 5 is perpendicular to the fourth signal line L4, and the display signal line 5 is perpendicular to the third signal line L3. In this way, the coupling interference between the display signal line 5 and the touch sensing signal line can be minimized.

[0066] In a possible implementation, Figure 5 As shown, the plurality of display signal lines 5 include a second portion 32 extending along the first direction h1 , and the second portion 32 is located between the display chip connecting portion 1 and the first portion 31 .

[0067] In a possible implementation, the plurality of display signal lines 5 are mobile industry processor interface (MIPI) signal lines.

[0068] In a possible implementation, Fig.14 As shown, the display chip connection part 1 includes a plurality of first touch drive signal terminals TXP1 and a plurality of second touch drive signal terminals TXP2 located on a side where the plurality of non-touch signal terminals P are away from the plurality of second touch sensing signal terminals RXP2; the display chip connection part 1 includes a plurality of third touch drive signal terminals TXP3 and a plurality of fourth touch drive signal terminals TXP4 located on a side where the plurality of non-touch signal terminals P are away from the plurality of first touch sensing signal terminals RXP1; the plurality of first touch drive signal terminals TXP1 are connected to the first touch chip through a plurality of first touch drive signal lines TXL1. The second touch drive signal line TXL2 is connected to the second touch chip connection part T2; the third touch drive signal line TXL3 is connected to the first touch chip connection part T1; the fourth touch drive signal line TXL4 is connected to the second touch chip connection part T2; in the second direction h2, the second part 32 is located between the first touch drive signal line TXL1 and the second touch drive signal line TXL2. The touch drive signal line is less susceptible to interference than the touch sensing signal line. Therefore, on the lower side of the FPC, the touch drive signal line can be routed above the touch sensing signal line. However, the touch drive signal line still tries to bypass other types of signal lines to reduce interference.

[0069] In a possible implementation, Figure 4As shown, the plurality of non-touch signal terminals P include, for example, a plurality of external input power terminals P1, a plurality of internally generated power and control signal terminals P2, and a plurality of display signal terminals P3, the display signal terminals P3 are used to connect a plurality of display signal lines 5, and the plurality of power signal terminals PP may be at least part of the plurality of external input power terminals P1. When the FPC is set in an electronic device, Figure 4 The capacitor device area 61 shown can be located within the projection of the battery in the electronic device, so the height limit of the devices in this area is relatively large. The capacitor device area 61 is provided with capacitors and protection devices corresponding to the external power supply. The protection device is, for example, a transient voltage suppression diode (TVS) or a series resistor. The external power supply includes, for example, the anode voltage ELVDD, cathode voltage ELVSS, analog voltage AVDD, and data voltage DVDD of the OLED device in the display panel. In addition, the capacitor device area 61 can also be provided with a protection device for the touch external supply signal. The peripheral device area 62 is located outside the projection of the battery in the electronic device, so there is no strict requirement for the height of the devices here. In the electronic device, the peripheral device area 62 is provided with a touch chip and peripheral capacitors, protection devices, crystal devices, etc. In addition, the peripheral device area 62 can also be provided with an external power supply protection device. As shown Figure 4 and Figure 5 As shown, part of the power signal line 4 led out from the motherboard connection part 3 extends to the left to the capacitor device area 61, and is connected to the corresponding capacitor device C and the protection device in the capacitor device area 61, and then these power signal lines 4 continue to extend to the left, and multiple non-touch signal terminals P include power terminals corresponding to part of the power signal lines 4, which are connected to the corresponding power signal lines 4 at corresponding positions; another part of the power signal line 4 led out from the motherboard connection part 3 first extends downward, connects to the corresponding protection device in the peripheral device area 62, and then returns to the capacitor device area 61 and extends to the left (the reason is that the protection device connected to this part of the power signal line 4 is height-restricted and can only be set in the peripheral device area 62). Since the capacitor device area 61, that is, the position of multiple capacitor devices C is outside the second signal line L2, the third signal line L3 and the fourth signal line L4, and is far away from the fan-out position of the touch signal terminal, on the one hand, the fan-out routing pressure of the touch signal line can be alleviated; on the other hand, the routing length of the power signal line 4 can be minimized to reduce the power supply impedance, because the power signal line 4 does not need to be wound because of the connection with the capacitor device C, and can be connected to the capacitor device C at a shorter distance after being led out from the mainboard connection part 3; on the other hand, the number of crossings between the power signal line 4 and the touch signal line can be reduced to reduce interference between the two.

[0070] In addition, for Fig.15 and Fig.16In the structure shown, there is also a capacitor device area 61. The flexible circuit board also includes a plurality of power signal lines respectively connected to a plurality of power signal terminals, and the plurality of power signal lines are connected to a plurality of capacitor devices in the capacitor device area 61; in the second direction h2, the plurality of capacitor devices are located on the side of the plurality of fourth signal lines L4 away from the plurality of second signal lines L2; ​​in the first direction h1, the plurality of capacitor devices are located on the side of the plurality of fourth signal lines L4 away from the plurality of third signal lines L3. That is to say, in the second direction h2, the plurality of capacitor devices are located on the upper side of all touch signal lines, and in the first direction h1, the plurality of capacitor devices are located on the right side of all touch signal lines. Therefore, arranging capacitor devices outside each touch sensing signal line also has the beneficial effects of alleviating the fan-out routing pressure of the touch signal line; reducing the routing length of the power signal line and reducing the power supply impedance; reducing the number of crossings between the power signal line and the touch signal line and reducing the interference between the two. However, Fig.15 and Fig.16 In the structure shown, all power signal lines extend directly to the left to the capacitor device area 61. During the connection between the protection device and the capacitor, it is no longer necessary to set a part of the power signal line to extend downward and then to the left. The reason is that in this structure, the height of the protection device is no longer a limitation and can be set in the capacitor device area 61.

[0071] In other possible implementations, the routing may be different, for example, Fig.15 and Fig.16 The structure shown is Figure 4 and Figure 5 Compared with the structure shown in FIG. 1 , under the FPC, the first signal line L1 and the third signal line L3 are not arranged alternately, and other structures are similar and will not be described in detail.

[0072] It should be noted that the embodiments of the present application do not limit whether the touch wiring method belongs to 2T1R or 2T2R, and both can apply the technical solutions of the embodiments of the present application. In addition, the embodiments of the present application only take two touch chips set on the FPC as an example for explanation, but the embodiments of the present application do not limit the number of touch chips set on the FPC. For example, in a possible embodiment, only one touch chip can be set on the FPC, then there is only one touch chip connection part 2 on the FPC, even so, one touch chip connection part 2 is still at the position of two touch chip connection parts 2 on the FPC, and the corresponding signal lines also need to be led out, so the technical solutions of the embodiments of the present application can still be applied.

[0073] like Figure 3As shown, the electronic device may further include a mainboard, on which a processor may be provided, and the processor and the mainboard are connected to the flexible circuit board 100. The specific structure and principle of the flexible circuit board 100 are the same as those in the above embodiment, and will not be repeated here. The electronic device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a vehicle-mounted device, an AR device, a VR device, etc.

[0074] It is to be understood that the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on the electronic device. In other embodiments of the present application, the electronic device may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0075] The processor may include one or more processing units, for example, the processor may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0076] The controller can generate operation control signals according to the instruction operation code and timing signal to complete the control of instruction fetching and execution.

[0077] The processor may also include a memory for storing instructions and data.

[0078] The electronic device implements the display function through the GPU, the display chip 200, the display panel 300, and the application processor. The GPU is a microprocessor for image processing, which connects the display panel 300 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor may include one or more GPUs, which execute program instructions to generate or change display information.

[0079] The display panel 300 is used to display images, videos, etc. The display panel may be an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), etc. In some embodiments, the electronic device may include 1 or N display panels 300, where N is a positive integer greater than 1.

[0080] In the embodiments of the present application, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or the second signal line may represent the existence of A alone, the existence of A and the second signal line at the same time, and the existence of the second signal line alone. Among them, A, the second signal line can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, a, at least one of the second signal line and the third signal line can represent: a, the second signal line, the third signal line, a-the second signal line, a-the third signal line, the second signal line-the third signal line, or a-the second signal line-the third signal line, wherein a, the second signal line, the third signal line can be single or multiple.

[0081] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A flexible circuit board, characterized in that: include: A display chip connecting portion extending along a first direction; A wiring portion, arranged on one side of the display chip connecting portion along the first direction; as well as A capacitor device region is provided between the display chip connection portion and the wiring portion along the first direction. The capacitor device region includes a capacitor device. The wiring portion is electrically connected to the display chip connection portion through the capacitor device in the capacitor device region.

2. The flexible circuit board according to claim 1, characterized in that: On the same side of the display chip connection part, the wiring part includes a touch chip connection part and a mainboard connection part, the mainboard connection part and the touch chip connection part are arranged along a second direction, the mainboard connection part is electrically connected to the display chip connection part through the capacitor device in the capacitor device area, and the second direction is perpendicular to the first direction.

3. The flexible circuit board according to claim 2, characterized in that: The display chip connection portion includes a plurality of touch sensing signal terminals and a plurality of power signal terminals, and the plurality of touch sensing signal terminals and the plurality of power signal terminals are arranged along the first direction; The touch chip connection portion is electrically connected to the plurality of touch sensing signal terminals through a plurality of touch sensing signal lines; The mainboard connection portion is electrically connected to the plurality of power signal terminals through a plurality of power signal lines, and at least a portion of the plurality of power signal lines is electrically connected to the capacitive device in the capacitive device area.

4. The flexible circuit board according to claim 3, characterized in that: The capacitor device area is located between the plurality of touch sensing signal lines and the mainboard connecting portion.

5. The flexible circuit board according to claim 3, characterized in that: The plurality of touch sensing signal terminals include a plurality of first touch sensing signal terminals and a plurality of second touch sensing signal terminals, the display chip connection portion includes a plurality of non-touch signal terminals, the plurality of non-touch signal terminals are located between the plurality of first touch sensing signal terminals and the plurality of second touch sensing signal terminals, and the plurality of non-touch signal terminals include the plurality of power signal terminals; The touch chip connection part includes a plurality of third touch sensing signal terminals and a plurality of fourth touch sensing signal terminals, the plurality of touch sensing signal lines include a plurality of first touch sensing signal lines and a plurality of second touch sensing signal lines, the plurality of third touch sensing signal terminals are respectively connected to the plurality of first touch sensing signal terminals through the plurality of first touch sensing signal lines, and the plurality of fourth touch sensing signal terminals are respectively connected to the plurality of second touch sensing signal terminals through the plurality of second touch sensing signal lines.

6. The flexible circuit board according to claim 5, characterized in that: The flexible circuit board has a first wiring layer and a second wiring layer stacked in a thickness direction, and the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines are located in the first wiring layer and the second wiring layer.

7. The flexible circuit board according to claim 6, characterized in that: The touch chip connection portion includes a first touch chip connection portion and a second touch chip connection portion, wherein the first touch chip connection portion and the second touch chip connection portion are used to respectively connect different touch chips; The plurality of third touch sensing signal terminals include a plurality of first terminals belonging to the first touch chip connection portion, and the plurality of fourth touch sensing signal terminals include a plurality of second terminals belonging to the first touch chip connection portion; The plurality of first touch sensing signal lines include a plurality of first signal lines respectively connected to the plurality of first terminals; The plurality of second touch sensing signal lines include a plurality of second signal lines respectively connected to the plurality of second terminals; In the second direction, a distance between the second touch chip connection portion and the display chip connection portion is smaller than a distance between the first touch chip connection portion and the display chip connection portion.

8. The flexible circuit board according to claim 7, characterized in that: The flexible circuit board has a staggered wiring area, in which the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines include a plurality of first layer signal lines located in the first wiring layer and a plurality of second layer signal lines located in the second wiring layer; In the staggered wiring area, in a direction perpendicular to the plane of the flexible circuit board, there is a second-layer signal line between any two adjacent first-layer signal lines, and there is a first-layer signal line between any two adjacent second-layer signal lines.

9. The flexible circuit board according to claim 8, characterized in that: The staggered wiring area includes a first staggered wiring area, in which the plurality of first signal lines are located in the first wiring layer, and the plurality of second signal lines are located in the second wiring layer; In the first interlaced wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is one second signal line between any two adjacent first signal lines, and there is one first signal line between any two adjacent second signal lines.

10. The flexible circuit board according to claim 9, characterized in that: The plurality of third touch sensing signal terminals include a plurality of third terminals belonging to the second touch chip connection portion; The plurality of first touch sensing signal lines include a plurality of third signal lines respectively connected to the plurality of third terminals; The staggered wiring area includes a second staggered wiring area, in which the plurality of first signal lines are located in the first wiring layer, and the plurality of third signal lines are located in the second wiring layer; In the second staggered wiring area, in a direction perpendicular to the plane where the flexible circuit board is located, there is one third signal line between any two adjacent first signal lines, and there is one first signal line between any two adjacent third signal lines.

11. The flexible circuit board according to claim 10, characterized in that: The plurality of fourth touch sensing signal terminals include a plurality of fourth terminals belonging to the second touch chip connection portion; The plurality of second touch sensing signal lines include a plurality of fourth signal lines respectively connected to the plurality of fourth terminals.

12. The flexible circuit board according to claim 9, characterized in that: The plurality of third touch sensing signal terminals include a plurality of third terminals belonging to the second touch chip connection portion; The plurality of first touch sensing signal lines include a plurality of third signal lines respectively connected to the plurality of third terminals; The plurality of fourth touch sensing signal terminals include a plurality of fourth terminals belonging to the second touch chip connection portion; The plurality of second touch sensing signal lines include a plurality of fourth signal lines respectively connected to the plurality of fourth terminals.

13. The flexible circuit board according to claim 12, characterized in that: In the second direction, the capacitor device region is located on a side of the plurality of fourth signal lines away from the plurality of second signal lines; In the first direction, the capacitive device region is located on a side of the plurality of fourth signal lines away from the plurality of third signal lines.

14. The flexible circuit board according to claim 12, characterized in that: The flexible circuit board has a cross wiring area, in which a plurality of touch sensing signal lines and at least part of the plurality of power signal lines are vertically cross-arranged, and the plurality of touch sensing signal lines include at least part of the plurality of first touch sensing signal lines and the plurality of second touch sensing signal lines.

15. The flexible circuit board according to claim 12, characterized in that: The mainboard connection portion includes a plurality of display signal terminals, and the plurality of display signal terminals are respectively connected to a plurality of display signal lines; The plurality of display signal lines include a line-crossing portion extending along the second direction, and the line-crossing portion perpendicularly crosses the plurality of fourth signal lines.

16. The flexible circuit board according to claim 15, characterized in that: The plurality of first touch sensing signal lines include a first portion extending along the first direction, and the plurality of display signal lines include a second portion extending along the first direction, wherein the second portion is located between the display chip connecting portion and the first portion; The plurality of non-touch signal terminals include a plurality of display terminals, and the plurality of display terminals are electrically connected to a plurality of non-touch signal lines respectively.

17. The flexible circuit board according to claim 15 or 16, characterized in that: The plurality of display signal lines are mobile industry processor interface MIPI signal lines.

18. The flexible circuit board according to claim 16, characterized in that: The display chip connection portion includes a plurality of first touch driving signal terminals and a plurality of second touch driving signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of second touch sensing signal terminals; The display chip connection portion includes a plurality of third touch driving signal terminals and a plurality of fourth touch driving signal terminals located on a side of the plurality of non-touch signal terminals away from the plurality of first touch sensing signal terminals; The plurality of first touch driving signal terminals are connected to the first touch chip connecting portion through a plurality of first touch driving signal lines; The plurality of second touch driving signal terminals are connected to the second touch chip connecting portion through a plurality of second touch driving signal lines; The plurality of third touch driving signal terminals are connected to the first touch chip connecting portion through a plurality of third touch driving signal lines; The plurality of fourth touch driving signal terminals are connected to the second touch chip connecting portion through a plurality of fourth touch driving signal lines; In the second direction, the second portion is located between the plurality of first touch driving signal lines and the plurality of second touch driving signal lines.

19. An electronic device, characterized in that: include: The flexible circuit board according to any one of claims 1 to 18; A display chip, wherein the display chip is connected to a display chip connection portion of the flexible circuit board; A display panel, wherein the display panel is connected to the display chip; A touch chip is connected to the touch chip connecting portion of the flexible circuit board.

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