Computing device and vehicle

Abstract

A computing device and a vehicle are applied to the field of intelligent terminals, and the computing device comprises a heat dissipation device and a circuit board. The heat dissipation device comprises a first cold plate and a second cold plate, and the first cold plate and the second cold plate are arranged in a stacked mode. The circuit board is clamped between the first cold plate and the second cold plate, the circuit board comprises a first surface and a second surface which are oppositely arranged in the thickness direction of the heat dissipation device, the first surface is provided with at least one first heating device, and the second surface is provided with at least one second heating device. The first cold plate is in heat-conducting connection with at least one first heating device, and the second cold plate is in heat-conducting connection with at least one second heating device. The first cold plate and the second cold plate of the heat dissipation device are used for achieving double-face heat dissipation of the circuit board, the heat dissipation efficiency is greatly improved, the heat dissipation problem of the circuit board with concentrated high-power-consumption devices is solved, and the heat management stability and safety of the computing equipment are improved. And moreover, double-sided heat dissipation is beneficial to reducing the layout area of the circuit board, and the integration level of the computing equipment is improved.

Description

Technical Field

[0001] The present application relates to the fields of computer technology and terminal technology, and in particular to a computing device and a vehicle. Background Art

[0002] As people demand more intelligence, safety and comfort from their devices, more and more devices are deployed in the devices. With the rapid development of digitalization and intelligence, the functions of devices are gradually integrated, and more and more functions are concentrated on the computing platform. This makes the number of electronic devices integrated on the circuit board of the computing platform, especially high-power electronic devices, more and more, which brings great challenges to the heat dissipation of the equipment. Taking smart cars as an example, the early electronic and electrical architecture adopted a decentralized architecture, and a single function used an independent controller. The whole vehicle included nearly 100 controllers, which were costly, heavy and had a low assembly level. With the iteration of the electronic and electrical architecture of the whole vehicle, from decentralized architecture to domain fusion architecture to central computing platform, the various functions of the vehicle are gradually concentrated on the central computing device. In the face of complex and changing mobile travel and life scenarios, as well as the emerging functional innovations such as smart cockpit, smart driving, and vehicle control, powerful computing devices are needed to support it, which makes the layout area of ​​computing devices continue to increase, and more and more high-power electronic devices are deployed on the circuit board.

[0003] With the development of circuit integration and chip packaging technology, the product size of high-power devices has also been miniaturized, resulting in heat concentration on the circuit board, affecting the reliability of electronic devices. In the electronics industry, when the ambient temperature of a device rises by 10°C, its failure rate will double (the famous "10°C rule"). Therefore, the circuit board needs to be equipped with a corresponding heat dissipation device.

[0004] However, the power consumption of chips arranged on circuit boards is increasing, and the power per unit area is getting higher and higher. For vehicles, the circuit boards of the central computing platform of the vehicle often concentrate a large number of high-power devices. The current liquid cooling solution can no longer meet the heat dissipation requirements of circuit boards with concentrated high-power devices. Especially for the computing platform in the car, its reliability is closely related to the personal safety of users. Solving the heat dissipation problem of circuit boards with concentrated high-power devices has become a key research direction in the vehicle industry. Summary of the invention

[0005] The present application provides a computing device and a vehicle, and also provides a heat dissipation device. When the heat dissipation device dissipates heat for a circuit board in the computing device, it can achieve double-sided heat dissipation of the circuit board, which can greatly improve the heat dissipation efficiency, solve the heat dissipation problem of the circuit board with high-power devices concentrated, and improve the thermal management stability and safety of the computing device. Moreover, double-sided heat dissipation is conducive to reducing the layout area of ​​the circuit board, which is conducive to the miniaturization and integrated design of the computing device.

[0006] In a first aspect, the present application provides a computing device, including a heat dissipation device and a circuit board. The heat dissipation device includes a first cold plate and a second cold plate, and the first cold plate and the second cold plate are stacked along the thickness direction of the heat dissipation device. The circuit board is sandwiched between the first cold plate and the second cold plate, and the circuit board includes a first surface and a second surface that are arranged opposite to each other along the thickness direction of the heat dissipation device, and the first surface is provided with at least one first heating device, and the second surface is provided with at least one second heating device. The first cold plate of the heat dissipation device is thermally connected to the at least one first heating device, and the second cold plate is thermally connected to the at least one second heating device.

[0007] In the computing device provided by the present application, a first cold plate and a second cold plate are arranged on both sides of the circuit board, and the first cold plate and the second cold plate are used to dissipate heat for the heating device arranged on the first surface and the heating device arranged on the second surface of the circuit board, respectively. That is, the heat dissipation device can realize double-sided heat dissipation of the circuit board, and double-sided heat dissipation can greatly improve the heat dissipation efficiency of the circuit board, solving the heat dissipation problem of the circuit board with high-power consumption devices concentrated.

[0008] The above design can solve the heat dissipation problem of the circuit board where high-power devices are concentrated. As a possible implementation, since both sides of the circuit board can dissipate heat, high-power devices (such as chips) can be arranged on the first surface and the second surface of the circuit board, that is, the double-sided layout of the circuit board is realized, thereby greatly reducing the layout area of ​​the circuit board and ensuring that the heat dissipation requirements of high-efficiency devices on both sides of the circuit board can be met.

[0009] As another possible implementation, the circuit board can still be single-sided, but a heat-conducting component can be set on the back of some or all high-power devices, and the heat-conducting component can conduct the heat generated by the high-power devices to the back. At this time, the high-power devices arranged on one side can be cooled on both the front and back sides. Those skilled in the art should know that when designing the placement of high-power devices on the circuit board, considering the efficiency of heat dissipation, the high-power devices are usually spaced a large distance apart. In the present application, by performing double-sided heat dissipation on the high-power devices, the heat dissipation efficiency can be greatly improved, so that the high-power devices can be arranged more densely, thereby making the layout area of ​​the circuit board smaller.

[0010] In short, the computing device provided by this application greatly improves the heat dissipation efficiency, solves the heat dissipation problem of the circuit board where high-power devices are concentrated, can reduce the layout area of ​​the circuit board, and is conducive to the miniaturization and integrated design of the computing device. Especially in the scenario of smart cars, the circuit board of the computing platform (such as the intelligent driving controller) in the vehicle will be arranged with a large number of chips, and the power consumption of these chips is very high. The computing device provided by this application can solve the heat dissipation problem of the circuit board where high-power devices are concentrated in the vehicle, and can improve the stability, reliability and safety of the vehicle.

[0011] Optionally, the heat dissipation device may adopt one or more heat dissipation methods such as liquid cooling and air cooling to dissipate heat. Among them, liquid cooling is to remove heat through the flow of liquid (i.e., cooling medium) to reduce the temperature of the heating device. Air cooling is to remove heat through the flow of air to reduce the temperature of the heating device.

[0012] In a possible implementation of the first aspect, a first flow channel is provided in the first cold plate, and a second flow channel is provided in the second cold plate, and the first flow channel and the second flow channel are used for the flow of cooling medium. In this case, the first cold plate and the second cold plate use the flow of cooling medium to dissipate heat, which has high heat dissipation efficiency, is less affected by factors such as ambient temperature and air circulation, and has high stability.

[0013] In a possible implementation of the first aspect, the first cold plate includes a third surface, and at least one first heat dissipation boss is disposed on the third surface. The protruding heat dissipation boss is convenient for fitting with a heating device on the circuit board, thereby dissipating heat for the heating device in a targeted manner, and can improve the heat dissipation efficiency of the heating device.

[0014] Furthermore, when the first cold plate is a cold plate that uses liquid cooling to dissipate heat, a first flow channel is also provided in the first cold plate. Along the thickness direction of the first cold plate, the third surface and the first flow channel are located on opposite sides of the first cold plate.

[0015] In another possible implementation of the first aspect, the orthographic projections of the at least one first heat generating device and the at least one first heat dissipation boss on the third surface at least partially overlap. Further, the at least one first heat generating device is thermally connected to the at least one first heat dissipation boss.

[0016] In the above embodiment, the positions of the heat dissipation boss and the heating device are corresponding, so that the two can fit together, thereby specifically improving the heat dissipation efficiency of the heating device. The thermal connection here can be a contact connection between the two (i.e., close fitting), or a connection through a thermal conductive material, so that heat can be conducted from the heating device to the heat dissipation boss.

[0017] Exemplarily, a heat-conducting medium is provided between at least one first heat-generating device and at least one first heat-dissipating boss, and the two are bonded together through the heat-conducting medium. The heat-conducting medium may include silicone grease or a thermal pad (e.g., a phase-change thermally conductive film), etc. The heat-conducting material can avoid direct contact between the boss and the surface of the high-power-consuming device, thereby reducing the risk of damage to the high-power-consuming device. The heat-conducting medium has a low thermal resistance and can be extremely thin in terms of process. Bonding the heat-dissipating boss and the high-power-consuming chip through the heat-conducting medium can improve the heat conduction efficiency, which is beneficial to reducing the temperature of the high-power-consuming device.

[0018] In another possible implementation of the first aspect, the first flow channel forms a first projection on the third surface, at least one first heating device forms a second projection on the third surface, and the first projection covers the second projection. In the above implementation, the flow channel in the first cold plate can cover the area on the first surface where the heating device is arranged, which can maximize the heat dissipation requirements of the heating device and improve the heat dissipation efficiency.

[0019] In another possible implementation of the first aspect, the first flow channel forms a first projection on the third surface, at least one first heating device forms a second projection on the third surface, and the first projection partially covers the second projection. In the above implementation, the flow channel in the first cold plate can at least cover a portion of the area on the first surface where the heating device is arranged. Due to various requirements on the manufacturing process and chip layout, ensuring that the flow channel area partially covers the heating device can, on the one hand, maximize the heat dissipation effect for the heating device, and on the other hand, it can make more possibilities in chip position design and circuit wiring design, and has higher practicality.

[0020] In another possible implementation manner of the first aspect, the second cold plate includes a fourth surface, and at least one second heat dissipation boss is disposed on the fourth surface. The technical effects can be seen from the above.

[0021] In another possible implementation of the first aspect, the orthographic projections of the at least one second heat generating device and the at least one second heat dissipation boss on the fourth surface at least partially overlap. Further, the at least one second heat generating device and the at least one second heat dissipation boss are thermally connected.

[0022] In yet another possible implementation of the first aspect, the second flow channel forms a third projection on the fourth surface, the at least one second heating device forms a fourth projection on the fourth surface, and the third projection covers the fourth projection.

[0023] In another possible implementation of the first aspect, the second flow channel forms a third projection on the fourth surface, the at least one second heating device forms a fourth projection on the fourth surface, and the third projection partially covers the fourth projection.

[0024] In another possible implementation of the first aspect, at least one first heat generating device includes a chip, and at least one second heat generating device includes a chip. The above implementation introduces a layout method, and high-power consumption devices (such as chips) can be arranged on the first surface and the second surface of the circuit board, that is, a double-sided layout method. This layout method makes the design position of the chip more flexible, and can greatly reduce the layout area of ​​the circuit board, and the double-sided heat dissipation heat dissipation device can ensure that the heat dissipation requirements of high-efficiency devices on both sides of the circuit board can be met.

[0025] In another possible implementation of the first aspect, at least one first heat-generating device includes a chip, and at least one second heat-generating device includes a heat-conducting component, and the heat-conducting component is thermally connected to the chip. The heat-conducting component is, for example, a copper sheet, a metal boss, etc. The above implementation introduces another layout method, in which high-power-consuming devices (such as chips) are arranged on the first surface of the circuit board, and heat-conducting components can be arranged on the second surface. The heat-conducting components can conduct the heat generated by the high-power-consuming devices to the back side. At this time, the high-power-consuming devices arranged on one side can be dissipated on both the front and back sides, which can greatly improve the heat dissipation efficiency, so that the high-power-consuming devices can be arranged more densely, thereby making the layout area of ​​the circuit board smaller.

[0026] Optionally, the orthographic projections of the heat-conducting component and the chip on the first surface at least partially overlap, which can improve the heat-conducting efficiency of the heat-conducting component and the heat dissipation efficiency.

[0027] In another possible implementation of the first aspect, the first cold plate is provided with a first liquid passage port, a second liquid passage port, a first connecting port, and a second connecting port, and the second cold plate is provided with a third connecting port and a fourth connecting port. The first flow channel and the second flow channel are connected through the first connecting port and the third connecting port, and the second flow channel and the second liquid passage port are connected through the second connecting port and the fourth connecting port. The first liquid passage port, the first flow channel, the first connecting port, the third connecting port, the second flow channel, the second connecting port, the fourth connecting port, and the second liquid passage port are connected in sequence.

[0028] The above-mentioned embodiment introduces a design of the liquid inlet and outlet of a heat dissipation device, wherein the first cold plate and the second cold plate share the liquid inlet and outlet, and the liquid inlet and outlet are both arranged on the first cold plate, the first flow channel and the second flow channel are conductive, and the cooling medium can flow between the first cold plate and the second cold plate through the connecting port. In this embodiment, the cooling system only needs to design a set of cooling medium output and output pipes to meet the demand, which can reduce the design complexity of the cooling system matched with the heat dissipation device. In addition, in the above-mentioned embodiment, the liquid inlet and outlet (i.e., the first liquid port and the second liquid port) are both arranged on the first cold plate, so that the pipelines matched with the liquid inlet and outlet can be designed in almost the same plane, which is convenient for the pipeline routing design and installation and fixation. In addition, the liquid inlet and outlet are designed on the first cold plate, so that the design complexity of the external shape of the second cold plate is reduced, which is convenient for the mold opening and manufacturing of the heat dissipation device, and can reduce the production cost.

[0029] In another possible implementation of the first aspect, the third communication port is a connection port of a first pipe joint disposed on the second cold plate. In this case, the first communication port on the first cold plate is an interface of a first via hole, and the first via hole cooperates with the first pipe joint, and the two can be fixedly connected, thereby achieving conduction between the first flow channel and the second flow channel. Alternatively, the first pipe joint is disposed on the first cold plate, and in this case, the first via hole is correspondingly disposed on the second cold plate.

[0030] Similarly, the fourth connecting port is a connecting port of a second pipe joint provided on the second cold plate, and a second through hole is also provided on the first cold plate, and the second through hole cooperates with the second pipe joint, and the two can be fixedly connected, so as to realize the conduction between the second flow channel and the second liquid port. Alternatively, the second pipe joint is provided on the first cold plate, and the second through hole is correspondingly provided on the second cold plate.

[0031] In another possible implementation of the first aspect, the first communication port and the third communication port are arranged on the same side of the heat dissipation device. Since the first communication port and the third communication port need to be connected, arranging them on the same side can reduce the length of the pipeline connection, which is conducive to the lightweight design of the computing device.

[0032] Similarly, the second communication port and the fourth communication port can be arranged on the same side of the heat sink. Since the second communication port and the fourth communication port need to be connected, arranging them on the same side can reduce the length of the pipeline connection, which is conducive to the lightweight design of the computing device.

[0033] In another possible implementation of the first aspect, the first liquid port and the second liquid port are arranged on the same side of the heat sink. In this way, the liquid inlet and the liquid outlet can be arranged on the same side of the heat sink, which can reduce the design complexity of the cooling system matched with the heat sink. Moreover, the liquid inlet and outlet designed on the same side are convenient for mold opening and manufacturing, thereby reducing production costs.

[0034] In another possible implementation of the first aspect, the first liquid port and the second liquid port are arranged on opposite sides of the heat dissipation device. The liquid ports are arranged on opposite sides, and can be adapted to a variety of possible liquid inlet and outlet designs. For example, in a cold plate, the flow channel design is usually an S-shaped design, and the liquid port is designed on opposite sides to adapt to the S-shaped flow channel design. Those skilled in the art will know that the S-shaped design can include a quasi-S-shaped design, etc., and the overall design is presented as an S-shaped design.

[0035] In another possible implementation of the first aspect, the first cold plate is provided with a third liquid port and a fifth connecting port, the second cold plate is provided with a fourth liquid port and a sixth connecting port, the first flow channel and the second flow channel are connected through the fifth connecting port and the sixth connecting port, and the third liquid port, the first flow channel, the fifth connecting port, the sixth connecting port, the second flow channel and the fourth liquid port are connected in sequence.

[0036] The above-mentioned embodiment introduces another design of the liquid inlet and outlet of the heat dissipation device, in which the first cold plate and the second cold plate share the liquid inlet and outlet, and one of the liquid inlet and the liquid outlet is arranged on the first cold plate, and the other is arranged on the second cold plate. The first flow channel and the second flow channel are conductive, and the cooling medium can flow between the first cold plate and the second cold plate through the connecting port. Similarly, the cooling system only needs to design a set of cooling medium output and output pipes to meet the needs, which can reduce the design complexity of the cooling system matched with the heat dissipation device. In addition, the liquid inlet and outlet are arranged separately, which can reduce a set of connecting ports, can reduce the interfaces in the pipeline, reduce the risk of leakage, and is conducive to the lightweight design of the computing device.

[0037] In another possible implementation of the first aspect, the fifth communication port and the sixth communication port are arranged on the same side of the heat dissipation device. Since the fifth communication port and the sixth communication port need to be connected, arranging them on the same side can reduce the length of the pipeline connection, which is conducive to the lightweight design of the computing device.

[0038] In another possible implementation of the first aspect, the third liquid port and the fourth liquid port are arranged on the same side of the heat sink. In this way, the liquid inlet pipe and the liquid outlet pipe can be arranged on the same side of the heat sink, which can reduce the design complexity of the cooling system matched with the heat sink.

[0039] In another possible implementation of the first aspect, the third liquid port and the fourth liquid port are arranged on different sides of the heat sink. This implementation can be adapted to a variety of possible flow channel designs. For example, in a cold plate, the flow channel design is usually S-shaped, and designing the liquid ports on different sides can be adapted to the S-shaped flow channel design.

[0040] In another possible implementation of the first aspect, the first cold plate is provided with a first liquid inlet and a first liquid outlet, both of which are in communication with the first flow channel, the first liquid inlet is used for cooling medium to flow in, and the first liquid outlet is used for cooling medium to flow out. The second cold plate is provided with a second liquid inlet and a second liquid outlet, both of which are in communication with the second flow channel, the second liquid inlet is used for cooling medium to flow in, and the second liquid outlet is used for cooling medium to flow out.

[0041] The above embodiment introduces another design of the liquid inlet and outlet of the heat dissipation device, in which the flow channels of the first cold plate and the second cold plate are independent, and each has a pair of liquid inlet and outlet. The cooling medium used by the first cold plate and the second cold plate can be the same, or different. By using independent flow channels, the heat dissipation capacity of the first cold plate and the heat dissipation capacity of the second cold plate are equal, so that both surfaces of the electric heating plate can achieve a good heat dissipation effect, which can improve the heat dissipation efficiency.

[0042] In another possible implementation of the first aspect, the first liquid inlet and the second liquid inlet are located on the same side of the heat sink, and the first liquid outlet and the second liquid outlet are located on the same side of the heat sink. This can reduce the design complexity of the cooling system matched with the heat sink.

[0043] In another possible implementation of the first aspect, the first flow channel is an S-shaped flow channel. The S-shaped flow channel allows the coolant to pass through the entire third surface of the first cold plate in sequence, facilitating the circulation of the coolant and improving the heat dissipation efficiency.

[0044] In another possible implementation of the first aspect, the first cold plate includes a first substrate and a first cover plate, the first flow channel is recessed on a fifth surface of the first substrate, the fifth surface is a surface of the first substrate away from the circuit board, and the first cover plate is used to seal the first flow channel. In the above implementation, the first cold plate includes two components, the first substrate and the first cover plate, which facilitates the overall manufacturing of the first substrate, reduces production difficulty, and improves production efficiency.

[0045] Furthermore, the first cover plate and the first base plate can be integrated together by welding, sealing adhesive bonding, sealing ring connection or other connection methods.

[0046] In another possible implementation of the first aspect, the first flow channel includes a plurality of sub-flow channels connected end to end in sequence. In the above implementation, the first flow channel is divided into a plurality of sub-flow channels, and the plurality of sub-flow channels are connected end to end, so that the cooling medium can flow in sequence along a certain fixed path, and the flow rate of the cooling medium at various locations in the first cold plate can be ensured to be more uniform. The design of the sub-flow channels can also prevent the water flow from being blocked, stagnant, or forming eddies at a certain location, thereby improving the heat dissipation efficiency.

[0047] In yet another possible implementation of the first aspect, the first flow channel includes a first sub-flow channel, a second sub-flow channel, and a third sub-flow channel.

[0048] The first cold plate has a first side and a second side opposite to each other along the length direction of the heat sink, and a third side and a fourth side opposite to each other along the width direction of the heat sink. A first partition member and a second partition member are arranged in the first flow channel, and the first partition member and the second partition member are arranged at intervals along the width direction of the heat sink. The bottom of the first partition member is connected to the bottom surface of the first flow channel and extends along the length direction of the heat sink. One end of the first partition member is connected to the first side, and the other end is arranged at intervals from the second side. The bottom of the second partition member is connected to the bottom surface of the first flow channel and extends along the length direction of the heat sink. One end of the second partition member is connected to the second side, and the other end is arranged at intervals from the first side. The first partition member and the third side form a first sub-flow channel, the first partition member and the second partition member form a second sub-flow channel, and the second partition member and the fourth side form a third sub-flow channel. The first sub-flow channel and the second sub-flow channel are connected through the interval between the first partition member and the second side of the first cold plate, and the second sub-flow channel and the third sub-flow channel are connected through the interval between the second partition member and the first side of the first cold plate.

[0049] In the above embodiment, the first flow channel can be divided into three end-to-end sub-flow channels by two partitioning components, so that the cooling medium flows along the three S-shaped sub-flow channels, so that the cooling medium flows evenly and the heat dissipation efficiency can be improved.

[0050] Exemplarily, in combination with the aforementioned first liquid inlet and outlet design of the heat dissipation device, the first liquid inlet is arranged on the first side of the first cold plate, and the first liquid inlet is connected to the first sub-channel. Optionally, the second liquid inlet and the second connecting port are arranged at a position close to the first side of the first cold plate.

[0051] As another example, in combination with the aforementioned design of the liquid inlet and outlet of the second heat dissipation device, the third liquid outlet is disposed on the first side of the first cold plate, and the third liquid outlet is communicated with the first sub-channel.

[0052] As another example, in combination with the aforementioned third liquid inlet and outlet design of the heat dissipation device, the first liquid inlet is arranged on the first side of the first cold plate, and the first liquid inlet is connected to the first sub-channel. The first liquid outlet is arranged on the second side of the first cold plate, and the first liquid outlet is connected to the third sub-channel.

[0053] In another possible implementation of the first aspect, the first cold plate further includes a plurality of first heat dissipation teeth (or heat dissipation columns) protruding from the first flow channel, and the plurality of first heat dissipation teeth are connected to the bottom surface of the first flow channel. By designing the heat dissipation teeth, the contact area between the cooling medium and the substrate can be increased, and the heat dissipation efficiency can be improved. Optionally, the plurality of first heat dissipation teeth can be directly integrally die-casted with the first substrate, or can be integrally formed with the first substrate by brazing, friction welding or other connection methods.

[0054] In another possible implementation of the first aspect, the plurality of first heat dissipation teeth extend in a direction perpendicular to the bottom surface of the first flow channel. The provided heat dissipation teeth are easy to manufacture or weld, and have high production efficiency.

[0055] In another possible implementation of the first aspect, at least one of the plurality of first heat dissipation teeth forms an angle with the bottom surface of the first flow channel and is inclined along the direction of flow of the cooling medium. The inclined first heat dissipation tooth can reduce the resistance during cooling flow, increase the flow rate, and thus improve the heat dissipation efficiency. In addition, the inclined heat dissipation tooth is not easily eroded by water flow, and can increase the service life of the heat dissipation device.

[0056] In another possible implementation of the first aspect, the second cold plate includes a second substrate and a second cover plate, the second flow channel is recessed on a sixth surface of the second substrate, the sixth surface is a surface of the second substrate away from the circuit board, and the second cover plate is used to seal the second flow channel. For related beneficial effects, refer to the beneficial effects of the first cold plate side described above.

[0057] In yet another possible implementation of the first aspect, the second flow channel includes a plurality of sub-flow channels connected end to end in sequence.

[0058] In another possible implementation of the first aspect, the second flow channel includes a fourth sub-flow channel, a fifth sub-flow channel, a sixth sub-flow channel, and a seventh sub-flow channel. The second cold plate has a fourth side and a sixth side opposite to each other along the length direction of the heat sink, and a seventh side and an eighth side opposite to each other along the width direction of the heat sink. A third partition component, a fourth partition component, and a fifth partition component are provided in the first flow channel, and the bottom of the third partition component, the bottom of the fourth partition component, and the bottom of the fifth partition component are all connected to the bottom surface of the second flow channel. The third partition component extends along the width direction of the heat sink, one end of which is connected to the eighth side, and the other end of which is connected to the fourth partition component and is spaced from the seventh side. The fourth partition component extends along the length direction of the heat sink, one end of which is connected to the third partition component and is spaced from the sixth side, and the other end of which is spaced from the fourth side. The fifth partition component is provided between the fourth partition component and the eighth side, the fourth partition component and the fifth partition component are spaced apart along the width direction of the heat sink, and the fifth partition component extends along the length direction of the heat sink, one end of which is connected to the fourth side of the second substrate, and the other end of which is spaced apart from the third partition component.

[0059] A fourth sub-channel is formed between the third partition and the second side, a fifth sub-channel is formed between the fourth partition and the third side, a sixth sub-channel is formed between the fourth partition and the fifth partition, and a seventh sub-channel is formed between the fifth partition and the fourth side. The fourth sub-channel and the fifth sub-channel are connected through a first interval and a second interval, the first interval being the interval between the third partition and the third side, and the second interval being the interval between the fourth partition and the second side. The fifth sub-channel and the sixth sub-channel are connected through the interval between the fourth partition and the first side, and the sixth sub-channel and the seventh sub-channel are connected through the interval between the fifth partition and the third partition.

[0060] In the above embodiment, the three partitioning components divide the second flow channel into four sub-flow channels connected end to end, so that the cooling medium flows along the four sub-flow channels connected end to end, so that the cooling medium flows evenly, which can improve the heat dissipation efficiency.

[0061] In another possible implementation manner of the first aspect, the second cold plate further includes a plurality of second heat dissipation teeth protruding in the second flow channel, and the plurality of second heat dissipation teeth are connected to a bottom surface of the second flow channel.

[0062] In yet another possible implementation of the first aspect, the plurality of second heat dissipating teeth extend in a direction perpendicular to a bottom surface of the second flow channel.

[0063] In another possible implementation manner of the first aspect, at least one second heat dissipation tooth among the plurality of second heat dissipation teeth forms an angle with the bottom surface of the second flow channel and is inclined along the direction of flow of the cooling medium.

[0064] In another possible implementation of the first aspect, there is a receiving space between the first cold plate and the second cold plate, and the receiving space can be a fully enclosed space, a semi-enclosed space, or an approximately fully enclosed space with a through hole. The receiving space is used to accommodate the circuit board. In some schemes, the first cold plate and the second cold plate simultaneously serve as the outer shell of the computing device, and the circuit board is sealed (or semi-sealed) in a box body formed by the first cold plate and the second cold plate as the outer shell.

[0065] In another possible implementation of the first aspect, the first cold plate is further provided with at least one first connection portion, and the first connection portion is used to achieve a fixed connection between the first cold plate and other structural members. For example, the circuit board may be provided with a second connection portion, and the first connection portion and the second connection portion may be assembled in cooperation to achieve a fixed connection between the first cold plate and the circuit board.

[0066] Similarly, a similar installation design may also be provided on the second cold plate. Exemplarily, the second cold plate is further provided with at least one third connection portion, and the circuit board is provided with a fourth connection portion, and the third connection portion and the fourth connection portion are used to realize a fixed connection between the second cold plate and the circuit board.

[0067] In another possible implementation manner of the first aspect, the first cold plate is further provided with at least one fifth connection portion, and the second cold plate is provided with a sixth connection portion, and the fifth connection portion and the sixth connection portion are used for matching and assembling to achieve a fixed connection between the first cold plate and the second cold plate.

[0068] In another possible implementation of the first aspect, the first cold plate is further provided with a first positioning portion, and the second cold plate is further provided with a second positioning portion, and the first positioning portion is used to cooperate with the second positioning portion to facilitate the cooperation and assembly between the first cold plate and the second cold plate.

[0069] In a second aspect, an embodiment of the present application provides a heat dissipation device, the heat dissipation device comprising a first cold plate and a second cold plate. The first cold plate and the second cold plate are stacked in a thickness direction of the heat dissipation device. The first cold plate is thermally connected to at least one first heating device arranged on a first surface of a circuit board, and the second cold plate is thermally connected to at least one second heating device arranged on a second surface of the circuit board, and the first surface and the second surface are two surfaces of the circuit board arranged opposite to each other in the thickness direction of the heat dissipation device.

[0070] Furthermore, the first cold plate and the second cold plate may be cold plates that use liquid cooling to dissipate heat. In this case, a first flow channel is provided in the first cold plate, and a second flow channel is provided in the second cold plate. The first flow channel and the second flow channel are used for the flow of cooling medium. Of course, the first cold plate and the second cold plate may also be cold plates that use other heat dissipation methods, such as air cooling.

[0071] Possible implementations of the heat dissipation device may refer to the description of the first aspect or any possible implementation of the first aspect.

[0072] In a third aspect, the present application provides a terminal, which includes the computing device described in the first aspect or any possible implementation of the first aspect, or includes the heat dissipation device described in the second aspect or any possible implementation of the second aspect.

[0073] Among them, the terminal may include vehicles, drones, robots, industrial robotic arms and other means of transportation or intelligent devices.

[0074] The beneficial effects of the technical solutions of the second and third aspects of the present application can refer to the beneficial effects of the technical solution of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The following is a brief introduction to the drawings required for describing the embodiments.

[0076] Figure 1 It is a schematic diagram of the overall structure of a heat dissipation device provided in an embodiment of the present application;

[0077] Figure 2is a disassembly schematic diagram of a heat dissipation device provided in an embodiment of the present application;

[0078] Figure 3 and Figure 4 is a disassembly schematic diagram of an electronic device provided in an embodiment of the present application;

[0079] Figure 5 and Figure 6 is a disassembly schematic diagram of a first cold plate provided in an embodiment of the present application;

[0080] Figure 7 and Figure 8 is a disassembly schematic diagram of a second cold plate provided in an embodiment of the present application;

[0081] Fig. 9 It is a schematic diagram of the circulation path of a cooling system;

[0082] Fig.10 is a schematic diagram of a cooling medium flow path of a heat dissipation device provided in an embodiment of the present application;

[0083] Fig.11 It is another schematic diagram of the circulation path of a cooling system;

[0084] Fig.12 is a schematic diagram of a cooling medium flow path of another heat dissipation device provided in an embodiment of the present application;

[0085] Fig.13 is a schematic diagram of a cooling medium flow path of another heat dissipation device provided in an embodiment of the present application;

[0086] Fig.14 is a schematic diagram of a heat dissipation scenario provided in an embodiment of the present application;

[0087] Fig.15 is a schematic diagram of another heat dissipation scenario provided in an embodiment of the present application;

[0088] Fig.16 It is a schematic diagram of the positional relationship between a projection of a heat dissipation boss and a projection of a heat generating device provided in an embodiment of the present application;

[0089] Fig.17 This is a schematic diagram of the positional relationship between the projection of another heat dissipation boss and the projection of a heat generating device provided in an embodiment of the present application;

[0090] Fig.18 It is a schematic diagram of the positional relationship between the projection of a flow channel and the projection of a heating device provided in an embodiment of the present application;

[0091] Fig.19 It is a schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application;

[0092] Fig. 20 is a disassembly schematic diagram of another heat dissipation device provided in an embodiment of the present application;

[0093] Fig.21 It is a schematic diagram of a vehicle provided in an embodiment of the present application.

[0094] Reference numerals:

[0095] 10-heat dissipation device, 11-first cold plate, 12-second cold plate, 20-circuit board, 21-first surface, 21 (such as 21a and 21b)-first heating device, 22-second surface, 22x (such as 22a and 22b)-second heating device, 23-second connection part, 30-computing device, 41-first substrate, 411-first side, 412-second side, 413-third side, 414-fourth side, 415-first partition component, 416-second partition component, 417-first connector assembly port, 418-first connection portion, 419-fifth connection portion, 42-first cover plate, 43-first liquid passage port, 44-second liquid passage port, 45-first flow channel, 451-first sub-flow channel, 452-second sub-flow channel, 453-third sub-flow channel, 454-first communication port, 455-second communication port, 456-first heat dissipation tooth, 457-first side hole, 46-third surface, 461x (such as 461a and 461b)-first heat dissipation boss, 47-first positioning portion, 51-second substrate, 511-fifth side, 512-sixth side, 513-seventh side, 514-eighth side, 515-third partition member, 516-fourth partition member, 517-fifth partition member, 52-second cover plate, 53-first pipe joint, 54-second pipe joint, 55-fourth surface, 551x (such as 551a and 551b)-second heat dissipation boss, 56-second positioning portion, 57-second flow channel, 571-fourth sub-flow channel, 572-fifth sub-channel, 573-sixth sub-channel, 574-seventh sub-channel, 575-third connecting port, 576-second side hole, 577-second heat dissipation tooth, 578-third side hole, 579-fourth connecting port, 481-third liquid outlet, 482-fifth connecting port, 581-fourth liquid outlet, 582-sixth connecting port, 483-first liquid inlet, 484-first liquid outlet, 583-second liquid inlet, 584-second liquid outlet, 60-connecting port support frame. DETAILED DESCRIPTION

[0096] With the development of technologies such as computers and artificial intelligence, the functions of equipment are becoming more and more intelligent and diversified. The intelligent and diversified functions rely on high-power computing devices to be realized, which leads to an increasing number of high-power devices, such as chips, arranged on the circuit boards of computing devices. High-power devices generate a lot of heat when working, and the heat needs to be dissipated in time. Especially when multiple high-power devices are concentrated on the circuit board, the heat per unit area of ​​the circuit board is high, and the current heat dissipation solution can no longer meet the heat dissipation needs of circuit boards with concentrated high-power devices.

[0097] In some solutions, in order to reduce the heat dissipation pressure, high-power devices are arranged relatively sparsely, which will undoubtedly increase the layout area of ​​the circuit board and limit the installation position of the circuit board. Other solutions split the circuit board into multiple pieces, place the high-power devices on multiple circuit boards in a dispersed manner, and then stack the multiple circuit boards to reduce the layout area on the vertical and horizontal planes. This method will increase the height of the device and significantly increase the size of the computing device. In addition, the stacked circuit boards need to be connected with electrical connectors, which will cause high-speed signal attenuation and affect the processing efficiency of the computing device.

[0098] In view of this, the present application provides a heat dissipation device, a computing device and a vehicle, which can improve the heat dissipation efficiency and solve the heat dissipation problem of a circuit board with concentrated high-power devices. The present application can also reduce the layout area of ​​the circuit board, which is conducive to the miniaturization and integrated design of the computing device.

[0099] Combine the following Figure 1 and Figure 2 A heat dissipation device provided in an embodiment of the present application is introduced.

[0100] See also Figure 1 and Figure 2 The heat sink 10 includes a first cold plate 11 and a second cold plate 12. Figure 1 and Figure 2 The first cold plate 11 and the second cold plate 12 are stacked together along the thickness direction of the heat dissipation device 10. There is a receiving space between the first cold plate 11 and the second cold plate 12, and a heat dissipation component, such as a circuit board, can be arranged in the receiving space. The receiving space between the first cold plate and the second cold plate can be a fully enclosed space, a semi-enclosed space, or an approximately fully enclosed space with through holes. The receiving space is used to accommodate the heat dissipation component. In some embodiments, the first cold plate 11 and the second cold plate 12 simultaneously serve as the outer shell of the computing device, and the heat dissipation component is accommodated in a box formed by the outer shell.

[0101] See also Figure 3 and Figure 4When the circuit board 20 is arranged between the first cold plate 11 and the second cold plate 12, the circuit board 20 is sandwiched between the first cold plate 11 and the second cold plate 12. The circuit board 20 includes a first surface 21 and a second surface 22 arranged opposite to each other along the thickness direction of the heat dissipation device 10. The first cold plate 11 and the second cold plate 12 are used to dissipate heat for the heating device arranged on the first surface 21 and the heating device arranged on the second surface 22, respectively. Therefore, the heat dissipation device 10 provided in the present application can realize double-sided heat dissipation of the circuit board 20. Double-sided heat dissipation can greatly improve the heat dissipation efficiency of the circuit board 20 and solve the heat dissipation problem of the circuit board 20 where high-power consumption devices are concentrated.

[0102] Exemplarily, the first surface 21 may be provided with one or more heating devices, and the heating device provided on the first surface 21 is referred to as the first heating device for the convenience of distinction. Exemplarily, in combination with Figure 3 , at least one first heating device includes a first heating device 21a and a first heating device 21b. The first cold plate 11 is thermally connected to the at least one first heating device, so as to dissipate heat on the first surface 21 side of the circuit board 20. Figure 4 The second surface 22 may be provided with one or more heating devices, and the heating device provided on the second surface is referred to as the second heating device for the convenience of distinction. For example, in combination with Figure 3 The at least one second heating device includes a second heating device 22a and a second heating device 22b, etc. The second cold plate 12 is thermally connected to the at least one second heating device, so as to dissipate heat on the second surface 22 of the circuit board 20 .

[0103] In some possible implementations, the heat dissipation device 10 may dissipate heat through one or more methods such as liquid cooling and air cooling.

[0104] As a possible implementation, the first cold plate 11 and the second cold plate 12 both use liquid cooling to dissipate heat. In this case, the cold plate can also be called a water-cooled plate, a cooling plate, etc. For example, a flow channel is provided in the first cold plate 11 and the second cold plate 12. The flow channel is used for the flow of cooling medium to take away heat, so that the temperature of the heating device on the circuit board is reduced. Figure 5 As shown, the first cold plate 11 is provided with a first flow channel 45, and the first flow channel 45 can be used for the flow of cooling medium. Figure 8 A second flow channel 57 is provided in the second cold plate 12, and the second flow channel 57 is used to supply cooling medium to flow (the detailed design of the flow channel is introduced below).

[0105] In the above introduction, both the first cold plate 11 and the second cold plate 12 adopt liquid cooling to dissipate heat, and the present application is also applicable to the case where the first cold plate 11 and / or the second cold plate 12 adopt other methods to dissipate heat. As a possible implementation, the first cold plate 11 may adopt liquid cooling to dissipate heat, while the second cold plate 12 adopts other methods to dissipate heat. For example, a flow channel is provided in the first cold plate 11, and the flow channel can allow the cooling medium to flow, and the first cold plate 11 may include a fan to dissipate heat by air cooling. As another possible implementation, the first cold plate 11 and the second cold plate 12 may also both adopt air cooling to dissipate heat. As another possible implementation, the first cold plate 11 adopts liquid cooling to dissipate heat, and the second cold plate 12 adopts a heat conductive material to transfer heat to the first cold plate 11 for dissipation. In short, the present application is applicable to various active heat dissipation methods.

[0106] In some scenarios, in order to dissipate heat specifically for the heat generating device on the circuit board 20, the first cold plate 11 and / or the second cold plate 12 may be provided with a heat dissipation boss, and the protruding heat dissipation boss is easy to fit with the heat generating device on the circuit board, thereby improving the heat dissipation efficiency of the heat generating device. The following is an introduction to some possible implementation methods of the present application:

[0107] In some possible implementations, combining Figure 6 The first cold plate 11 includes a third surface 46, on which at least one heat dissipation boss (referred to as a first heat dissipation boss for easy distinction) is protruding, for example, a first heat dissipation boss 461a and a first heat dissipation boss 461b. Figure 3 At least one first heat dissipation boss may be attached to at least one heat generating device on the first surface 21 of the circuit board 20. For example, the first heat dissipation boss 461a is attached to the first heat generating device 21a, and the first heat dissipation boss 461b is attached to the first heat generating device 21b.

[0108] Similarly, combining Figure 7 The second cold plate 12 may include a fourth surface 55, on which at least one heat dissipation boss (referred to as a second heat dissipation boss for easy distinction) is protruding, such as a second heat dissipation boss 551a and a second heat dissipation boss 551b. Figure 4 At least one heat dissipation boss may be attached to at least one second heat generating device on the second surface 22 of the circuit board 20. For example, the second heat dissipation boss 551a is attached to the second heat generating device 22a, and the second heat dissipation boss 551b is attached to the second heat generating device 22b.

[0109] In some possible implementations, combining Figure 5 and Figure 6, when the first cold plate 11 includes the first flow channel 45 and the third surface 46, the third surface 46 and the first flow channel 45 are arranged on opposite sides of the first cold plate 11. That is, the first flow channel 45 does not directly contact the heat generating device on the first surface 21 of the circuit board 20, but is arranged on the side of the third surface 46 away from the circuit board 20. The heat emitted by the heat generating device on the first surface 21 of the circuit board 20 can be transferred to the third surface 46 of the first cold plate 11 through the heat dissipation boss, and continuously transferred in the first cold plate 11. Heat exchange occurs at the contact surface between the first flow channel 45 and the cooling medium, and the heat is taken away as the cooling medium in the first flow channel 45 flows.

[0110] Similarly, combining Figure 7 and Figure 8 , when the second cold plate 12 includes the second flow channel 57 and the fourth surface 55, the fourth surface 55 and the second flow channel 57 are arranged on opposite sides of the second cold plate 12. That is, the second flow channel 57 does not directly contact the heat generating device on the second surface 22 of the circuit board 20. The heat emitted by the heat generating device on the second surface 22 of the circuit board 20 can be transferred to the fourth surface 55 of the second cold plate 12 through the heat dissipation boss, and continuously transferred in the second cold plate 12. Heat exchange occurs at the contact surface between the second flow channel 57 and the cooling medium, and the heat is taken away as the cooling medium in the second flow channel 57 flows.

[0111] As mentioned above, the first cold plate 11 and the second cold plate 12 can be cooled by liquid cooling. In this case, in addition to the flow channel, the heat dissipation device 10 also needs to design channels for the cooling medium to flow in and out. The following introduces some possible solutions for liquid inlet and outlet:

[0112] Solution 1: The flow channels in the first cold plate 11 and the second cold plate 12 are connected, for example, through a connecting pipe. In this case, the cooling medium can flow between the first cold plate 11 and the second cold plate 12. Optionally, the water inlet and outlet can be set on the same cold plate, or on different cold plates. Two possible designs of the positions of the water inlet and outlet are introduced below:

[0113] Design 1, please refer to Figure 5 and Figure 6 The first cold plate 11 is provided with a first liquid passage port 43, a second liquid passage port 44, a first communication port 454 and a second communication port 455. Figure 7 and Figure 8The second cold plate 12 is provided with a third communication port 575 and a fourth communication port 579. The first flow channel 45 and the second flow channel 57 are communicated through the first communication port 454 and the third communication port 575, and the second flow channel 57 and the second liquid passage port 44 are communicated through the second communication port 455 and the fourth communication port 579. The first liquid passage port 43, the first flow channel 45, the first communication port 454, the third communication port 575, the second flow channel 57, the second communication port 455, the fourth communication port 579 and the second liquid passage port 44 are communicated in sequence.

[0114] For example, the cooling medium may enter from the first liquid passage port 43, flow through the first flow channel 45, the first communication port 454, the third communication port 575, the second flow channel 57, the second communication port 455 and the fourth communication port 579, and flow out from the second liquid passage port 44. Alternatively, the cooling medium may enter from the second liquid passage port 44, flow through the fourth communication port 579, the second communication port 455, the second flow channel 57, the third communication port 575, the first communication port 454 and the first flow channel 45, and flow out from the first liquid passage port 43.

[0115] Optionally, the third connecting port 575 is a connecting port of the first pipe joint 53 provided on the second cold plate 12. In this case, the first connecting port 454 on the first cold plate 11 is an interface of the first via hole, and the first via hole is assembled with the first pipe joint 53 to realize the conduction between the first flow channel 45 and the second flow channel 57. Alternatively, the first pipe joint 53 may also be provided on the first cold plate, and in this case, the first via hole is correspondingly provided on the second cold plate.

[0116] Similarly, the fourth communication port 579 is a connection port of the second pipe joint 54 provided on the second cold plate 12, and the first cold plate 11 is also provided with a second via hole, which cooperates with the second pipe joint 54 to achieve the conduction between the second flow channel 57 and the second liquid port 44. Alternatively, the second pipe joint 54 is provided on the first cold plate 11, and the second via hole is correspondingly provided on the second cold plate 12.

[0117] Optionally, the first communication port 454 and the third communication port 575 are disposed on the same side of the heat dissipation device 10. Optionally, the second communication port 455 and the fourth communication port 579 may be disposed on the same side of the heat dissipation device.

[0118] Optionally, the first liquid port 43 and the second liquid port 44 are arranged on the same side of the heat sink 10. In some schemes, the cooling medium needs to be processed by the cooling system, the first liquid port and the second liquid port are arranged on the same side, and the liquid inlet and outlet pipes of the cooling system can be arranged on the same side of the heat sink. Fig. 9 , Fig. 9It is a schematic diagram of the circulation path of a cooling system, which includes a cooling circuit and a refrigeration circuit. The cooling circuit includes a cooler and a cold plate (such as the two cold plates in the present application), and optionally also includes an electronic water pump, an electronic expansion valve (or a solenoid valve and a thermal expansion valve) and an electronic water valve. Among them: the cooling plate and the cooler are heat exchange components, which are used for heat exchange between the heat-generating component and the cooling circuit, and between the cooling circuit and the refrigeration circuit. The electronic water pump provides a power source for the coolant circulation and is a driving component. The electronic expansion valve can actively adjust the circuit flow according to the pressure and temperature of the circuit and is a control component. Combined with Fig. 9 It can be seen that by setting the water inlet and outlet on the same side of the cold plate, the pipeline design between the heat sink and the cooling system can be simpler. Optionally, the cooling system can also dissipate heat for the power battery pack. In this case, the heat sink can be connected in series or in parallel with the battery cooling plate, and the cooling system can be used to dissipate heat for the circuit board and the power battery pack at the same time.

[0119] Alternatively, the first liquid passage opening 43 and the second liquid passage opening 44 are arranged on different sides of the heat dissipation device 10. Fig.10 , the first liquid port 43 and the second liquid port 44 are both arranged on the first cold plate 11, and are arranged on opposite sides of the first cold plate 11. Taking the first liquid port 43 as the liquid outlet and the second liquid port 44 as the liquid inlet as an example, the cooling medium flows in from the first liquid port 43 on one side of the first cold plate, passes through the first flow channel, the first connecting port 454, the third connecting port 575, the second flow channel, the fourth connecting port 579 and the second connecting port (not directly shown), and flows out from the second liquid port 44. Fig.10 In the design shown, the liquid inlet and the liquid outlet are arranged on opposite sides. This design can be adapted to a cooling system in which the liquid inlet and the liquid outlet are arranged on opposite sides of the cooling device, such as Fig.11 In addition, under this design, the flow channels in the first cold plate 11 and the second cold plate 12 can be designed to be S-shaped, such as Fig.10 shown.

[0120] The above describes a design in which the inlet and outlet ports are both arranged on the same cold plate. The following describes another design for the positions of the inlet and outlet ports.

[0121] Design 2, see Fig.12, the first cold plate 11 is provided with a third liquid port 481 and a fifth connecting port 482, the second cold plate 12 is provided with a fourth liquid port 581 and a sixth connecting port 582, the first flow channel and the second flow channel are connected through the fifth connecting port 482 and the sixth connecting port 582, the third liquid port 481, the first flow channel, the fifth connecting port 482, the sixth connecting port 582, the second flow channel and the fourth liquid port 581 are connected in sequence. Since the first flow channel and the second flow channel are connected, the cooling medium can flow between the first cold plate and the second cold plate through the fifth connecting port 482 and the sixth connecting port 582. In this case, the cooling system only needs to design a set of cooling medium output and output pipes to meet the needs, which can reduce the design complexity of the cooling system matched with the heat dissipation device. In addition, the inlet and outlet are set separately, which can reduce a set of connecting ports, can reduce the interfaces in the pipeline, reduce the risk of leakage, and is conducive to the lightweight design of the computing device. For example, the cooling medium may enter from the third liquid port 481, flow through the first flow channel, the fifth communication port 482, the sixth communication port 582 and the second flow channel, and flow out from the fourth liquid port 581. Alternatively, the cooling medium may enter from the fourth liquid port 581, flow through the second flow channel, the sixth communication port 582, the fifth communication port 482 and the first flow channel, and flow out from the third liquid port 481.

[0122] Optionally, the fifth communication port 482 and the sixth communication port 582 are arranged on the same side of the heat dissipation device.

[0123] Optionally, the third liquid outlet 481 and the fourth liquid outlet 581 are arranged on the same side of the heat sink. In this case, the liquid inlet pipe and the liquid outlet pipe can be arranged on the same side of the heat sink (e.g. Fig. 9 ), which can reduce the design complexity of the cooling system matched with the heat sink. Alternatively, the third liquid port and the fourth liquid port are arranged on the opposite sides of the heat sink. The liquid inlet and the liquid outlet are arranged on the opposite sides, which can adapt to the cooling system in which the liquid inlet pipe and the liquid outlet pipe are arranged on the opposite sides of the cooling device, such as Fig.11 Cooling system shown.

[0124] Solution 2: The flow channels in the first cold plate and the second cold plate are independent. In this case, the first cold plate and the second cold plate each have a pair of liquid inlet and outlet ports. Furthermore, the cooling medium used by the first cold plate 11 and the second cold plate 12 may be the same or different.

[0125] See also Fig.13The first cold plate 11 is provided with a first liquid inlet 483 and a first liquid outlet 484, both of which are connected to the first flow channel, the first liquid inlet 483 is used for the cooling medium to flow in, and the first liquid outlet 484 is used for the cooling medium to flow out. The second cold plate 12 is provided with a second liquid inlet 583 and a second liquid outlet 584, both of which are connected to the second flow channel, the second liquid inlet 583 is used for the cooling medium to flow in, and the second liquid outlet 584 is used for the cooling medium to flow out. In the above design, the first cold plate 11 and the second cold plate 12 use independent flow channels, so that the heat dissipation capacity of the first cold plate and the heat dissipation capacity of the second cold plate are equal, so that both surfaces of the electric heating plate can achieve a good heat dissipation effect, which can improve the heat dissipation efficiency.

[0126] Optionally, the first liquid inlet 483 and the second liquid inlet 583 are located on the same side of the heat sink, and the first liquid outlet 484 and the second liquid outlet 584 are located on the same side of the heat sink. This can reduce the design complexity of the cooling system matched with the heat sink.

[0127] The above describes the design of the liquid inlet and outlet of the cold plate. The following describes possible structures of the first cold plate and the second cold plate, and first describes the structure of the first cold plate.

[0128] See also Figure 5 and Figure 6 The first cold plate 11 includes a first substrate 41 and a first cover plate 42, and the first flow channel 45 is recessed in the fifth surface of the first substrate 41, and the fifth surface is the surface of the first substrate away from the circuit board 20 (or the second cold plate 12). The first cover plate 42 is used to seal the first flow channel 45. Optionally, the first substrate 41 and the first cover plate 42 can be integrated by welding, sealing adhesive bonding, sealing ring connection and other connection methods. Since a flow channel for the flow of cooling medium needs to be set in the first cold plate, the first cold plate is divided into two structural parts, and then the flow channel is formed by connecting the structural parts, which can reduce the manufacturing difficulty of the cold plate, reduce costs and improve production efficiency.

[0129] In some possible implementations, the first flow channel 45 is an "S"-shaped flow channel, and the coolant will flow in a winding manner in the "S"-shaped flow channel, so that the coolant can cover most areas of the circuit board. The "S"-shaped flow channel design can prevent the water flow from being blocked, stationary, or forming eddies at a certain point, which can improve the heat dissipation efficiency. It should be understood that the S-shaped design can include a quasi-S-shaped design (such as a "J"-shaped design), and the overall design presents an S-shape.

[0130] In some other possible implementations, the first flow channel 45 includes a plurality of sub-flow channels connected end to end in sequence. The plurality of sub-flow channels are connected end to end so that the cooling medium can flow in sequence along a certain fixed path and can ensure that the flow rate of the cooling medium at various locations in the first cold plate is more uniform. As a possible design, the plurality of sub-flow channels connected end to end in sequence can be arranged in an "S" shape to cover most areas of the circuit board.

[0131] For example, see Figure 5 , two partition members may be provided on the first substrate 41, and the two partition members, in combination with the side walls on both sides, may divide the first flow channel into three end-to-end sub-flow channels, so that the cooling medium flows along the three sub-flow channels arranged in an S shape, so that the cooling medium flows evenly, which can improve the heat dissipation efficiency. For details, please refer to Figure 5 , the first flow channel 45 includes a first sub-flow channel 451, a second sub-flow channel 452 and a third sub-flow channel 453. The first substrate 41 has a first side 411 and a second side 412 opposite to each other along the length direction (such as the x direction) of the heat sink 10, and a third side 413 and a fourth side 414 opposite to each other along the width direction (such as the y direction) of the heat sink 10. The length direction and the width direction here are only used to represent two different directions, and can also be replaced by the first direction or the second direction. The first direction can be perpendicular to the second direction. A first partition member 415 and a second partition member 416 are arranged in the first flow channel 45 at intervals along the width direction of the heat sink 10. The bottom of the first partition member 415 is connected to the bottom surface of the first flow channel 45 and extends along the length direction of the heat sink 10. One end of the first partition member 415 is connected to the first side 411, and the other end is arranged at intervals from the second side 412. The bottom of the second partition member 416 is connected to the bottom surface of the first flow channel 45 and extends along the length direction of the heat sink 10. One end of the second partition member 416 is connected to the second side 412, and the other end is spaced apart from the first side 411. The first partition member 415 and the third side 413 form a first sub-flow channel 451, the first partition member 415 and the second partition member 416 form a second sub-flow channel 452, and the second partition member 416 and the fourth side 414 form a third sub-flow channel 453. The first sub-flow channel 451 and the second sub-flow channel 452 are connected through the gap between the first partition member 415 and the second side 412 of the first cold plate 11, and the second sub-flow channel 452 and the third sub-flow channel 453 are connected through the gap between the second partition member 416 and the first side 411 of the first cold plate 11.

[0132] For example, in combination with the first inlet and outlet design described above, Figure 5 and Figure 6The first liquid passage 43 is disposed on the first side 411 of the first cold plate, and the first liquid passage 43 is communicated with the first sub-channel 451. Optionally, the second liquid passage 44 and the second communication port 455 are disposed near the first side 411.

[0133] As another example, in combination with the second inlet and outlet design described above, Fig.12 The third liquid port 481 is disposed on the first side of the first cold plate 11 and communicates with the first sub-channel.

[0134] As another example, in combination with the third inlet and outlet design described above, Fig.13 The first liquid inlet 483 is disposed on the first side of the first cold plate 11, and the first liquid inlet 483 is connected to the first sub-channel. The first liquid outlet 484 is disposed on the second side of the first cold plate 11, and the first liquid outlet 484 is connected to the third sub-channel.

[0135] Optionally, a first side hole 457 is provided on a surface of the second side 412 of the first cold plate 11 facing the first flow channel 45 , and the first side hole 457 is used to achieve communication between the first communication port 454 and the first flow channel 45 (or the third sub-flow channel 453 ).

[0136] It should be understood that the flow channel design in the first cold plate described above is only an example. In a specific implementation, more (or fewer) partition components may be arranged along the width direction of the heat sink to form more (or fewer) sub-flow channels.

[0137] In some solutions, in order to increase the contact area between the cooling medium and the substrate, one or more heat dissipation teeth can be set in the flow channel. Figure 5 The first cold plate 11 further includes a plurality of first heat dissipation teeth 456 (or heat dissipation columns) protruding from the first flow channel, and the plurality of first heat dissipation teeth 456 are connected to the bottom surface of the first flow channel. Optionally, the plurality of first heat dissipation teeth 456 can be directly integrally die-casted with the first substrate 41, or can be integrally formed with the first substrate 41 by brazing, friction welding, or other connection methods.

[0138] In the above, one end of the first heat dissipation tooth 456 is connected to the bottom surface of the flow channel, and the extension direction and shape of the first heat dissipation tooth 456 have multiple possible designs. Taking the extension direction as an example, as a possible design, multiple first heat dissipation teeth 456 extend in a direction perpendicular to the bottom surface of the first flow channel 45, and the vertically arranged heat dissipation teeth are easy to manufacture or weld, and the production efficiency is high. As another possible design, at least one of the multiple first heat dissipation teeth 456 is at an angle with the bottom surface of the first flow channel 45, and the extension direction is inclined along the direction of the flow of the cooling medium. The inclined first heat dissipation tooth can reduce the resistance during the cooling flow, increase the flow rate, and thus improve the heat dissipation efficiency. In addition, the inclined heat dissipation tooth is not easily eroded by the water flow, which can increase the service life of the heat dissipation device. Optionally, the shape of the first heat dissipation tooth 456 can be cylindrical, prismatic, lightning-shaped, etc., and the cylindrical heat dissipation tooth is used as an example for introduction. When the heat dissipation tooth is cylindrical, the surface of the heat dissipation tooth is relatively evenly pressed along the flow direction of the water flow, which can resist erosion, avoid contaminating the cooling medium, and increase the service life of the computing device.

[0139] The structure of the first cold plate is introduced above, and some possible structures of the second cold plate are introduced below. It should be understood that the detailed description of some designs of the second cold plate can refer to the above introduction of the first cold plate.

[0140] See also Figure 7 and Figure 8 The second cold plate 12 includes a second substrate 51 and a second cover plate 52. The second flow channel 57 is recessed on the sixth surface of the second substrate 51. The sixth surface is the surface of the second substrate 51 away from the circuit board 20 (or the first cold plate 11). The second cover plate 52 is used to seal the second flow channel 57. For related beneficial effects, please refer to the beneficial effects of the first cold plate side mentioned above.

[0141] In some possible implementations, the second flow channel includes a plurality of sub-flow channels connected end to end in sequence. For example, three partitioning components may be provided on the second substrate to divide the second flow channel into four sub-flow channels connected end to end, so that the cooling medium flows along the four sub-flow channels connected end to end, thereby improving the heat dissipation efficiency. For details, please refer to Figure 8, the second flow channel 57 includes a fourth sub-flow channel 571, a fifth sub-flow channel 572, a sixth sub-flow channel 573 and a seventh sub-flow channel 574. The second substrate 51 has a fifth side 511 and a sixth side 512 opposite to each other along the length direction (e.g., x direction) of the heat sink 10 (or the second cold plate 12, or the second substrate 51), and a seventh side 513 and an eighth side 514 opposite to each other along the width direction (e.g., y direction) of the heat sink 10. A third partition member 515, a fourth partition member 516 and a fifth partition member 517 are provided in the second flow channel 57, and the bottom of the third partition member 515, the bottom of the fourth partition member 516 and the bottom of the fifth partition member 517 are all connected to the bottom surface of the second flow channel 57. The third partition member 515 extends along the width direction of the heat sink 10, one end of which is connected to the eighth side 514, and the other end of which is connected to the fourth partition member 516 and is spaced apart from the seventh side 513. The fourth partition member 516 extends along the length direction of the heat sink 10, one end of which is connected to the third partition member 515 and spaced from the sixth side 512, and the other end of which is spaced from the fifth side 511. The fifth partition member 517 is disposed between the fourth partition member 516 and the eighth side 514. The fourth partition member 516 and the fifth partition member 517 are spaced from each other along the width direction of the heat sink 10. The fifth partition member 517 extends along the length direction of the heat sink 10, one end of which is connected to the fifth side 511 of the second substrate 51, and the other end of which is spaced from the third partition member 515. A fourth sub-channel 571 is formed between the third partition member 515 and the sixth side 512, a fifth sub-channel 572 is formed between the fourth partition member 516 and the seventh side 513, a sixth sub-channel 573 is formed between the fourth partition member 516 and the fifth partition member 517, and a seventh sub-channel 574 is formed between the fifth partition member 517 and the eighth side 514. The fourth sub-channel 574 and the fifth sub-channel 572 are connected through a first interval and a second interval, wherein the first interval is the interval between the third partition member 515 and the seventh side 513, and the second interval is the interval between the fourth partition member 516 and the sixth side 512. The fifth sub-channel 572 and the sixth sub-channel 573 are connected through the interval between the fourth partition member 516 and the fifth side 511, and the sixth sub-channel 573 and the seventh sub-channel 574 are connected through the interval between the fifth partition member 517 and the third partition member 515.

[0142] Optionally, a surface of the sixth side 512 of the second cold plate 12 facing the second flow channel 57 is provided with a second side hole 576, and the second side hole 576 is used to achieve conduction between the third connecting port 575 and the second flow channel 57 (or the fourth sub-flow channel 571). Optionally, a surface of the fifth side 511 of the second cold plate 12 facing the second flow channel 57 is provided with a third side hole 578, and the third side hole 578 is used to achieve conduction between the fourth connecting port 579 and the second flow channel 57 (or the seventh sub-flow channel 574).

[0143] In some embodiments, in order to increase the contact area between the cooling medium and the substrate, one or more heat dissipation teeth may be provided in the second flow channel 57. Figure 8 The second cold plate 12 further includes a plurality of second heat dissipation teeth 577 protruding from the second flow channel 57, and the plurality of second heat dissipation teeth 577 are connected to the bottom surface of the second flow channel 57. Optionally, the plurality of second heat dissipation teeth 577 can be directly integrally die-casted with the second substrate 51, or can be integrally formed with the second substrate 51 by brazing, friction welding or other connection methods.

[0144] Similar to the aforementioned first heat dissipation tooth 456, one end of the second heat dissipation tooth 577 is connected to the bottom surface of the second flow channel 57, but there are many possible designs for the extension direction and shape of the second heat dissipation tooth. Taking the extension direction as an example, as a possible design, multiple second heat dissipation teeth 577 extend in a direction perpendicular to the bottom surface of the second flow channel 57. The vertically arranged heat dissipation teeth are convenient for manufacturing or welding, and the production efficiency is relatively high. As another possible design, at least one second heat dissipation tooth 577 among the multiple second heat dissipation teeth 577 is at an angle to the bottom surface of the second flow channel 57, and the extension direction is inclined along the direction of flow of the cooling medium. Optionally, the shape of the second heat dissipation tooth 577 can be cylindrical, prismatic, lightning-shaped, etc., and a cylindrical heat dissipation tooth is used as an example for introduction here. When the second heat dissipation tooth 577 is cylindrical, the surface of the heat dissipation tooth is under pressure more evenly along the flow direction of the water flow, which can resist erosion, avoid contaminating the cooling medium, and increase the service life of the computing device.

[0145] The first cold plate and the second cold plate are introduced above respectively. The connection and assembly design between the first cold plate and the second cold plate are introduced below.

[0146] In some possible implementations, in order to facilitate the installation of the output and / or output line of the circuit board, the first cold plate 11 and / or the second cold plate 12 may be provided with a first connector assembly port, which is used to assemble a connector or facilitate the connection end of the transmission line to be inserted into the connection port on the circuit board. Figure 7 A first connector assembly port 417 may be provided on the first cold plate 11 , and the first connector assembly port 417 is connected to the receiving space formed between the first cold plate 11 and the second cold plate 12 , so as to facilitate the insertion of the connection end of the transmission line into the connection port on the circuit board 20 .

[0147] In some possible implementations, the first cold plate 11 is further provided with at least one first connection portion 418 , and the first connection portion 418 is used to achieve a fixed connection between the first cold plate 11 and other structural components.

[0148] Similarly, a similar mounting portion design may also be provided on the second cold plate 12. Exemplarily, the second cold plate 12 is further provided with at least one third connecting portion, and the third connecting portion is used to achieve a fixed connection between the second cold plate 12 and other structural members.

[0149] In some possible implementations, the first cold plate 11 is further provided with at least one fifth connection portion 419, and the second cold plate 12 is provided with a sixth connection portion, and the fifth connection portion 419 and the sixth connection portion are used for matching and assembling to achieve a fixed connection between the first cold plate 11 and the second cold plate 12. Figure 5 , a first connecting hole (ie, the fifth connecting portion 419) is provided on the first substrate 41, see Figure 7 A second connecting hole 518 is provided on the second substrate 51, and a third connecting hole 521 is provided on the first cover plate. By fastening screws through the third connecting hole 521, the second connecting hole 518 and the third connecting hole 521, fixed assembly between the first cold plate and the second cold plate can be achieved.

[0150] In some possible implementations, the first cold plate 11 is further provided with a first positioning portion 47, and the second cold plate is further provided with a second positioning portion 56. The first positioning portion 47 is used to cooperate with the second positioning portion 56 to facilitate assembly between the first cold plate 11 and the second cold plate 12. Figure 6 The first cold plate 11 is provided with a positioning hole (which can be regarded as the first positioning portion 47 ), and the second cold plate 12 is provided with a positioning pin (which can be regarded as the third positioning portion 56 ). The positioning pin can be inserted into the positioning hole to facilitate assembly between the first cold plate 11 and the second cold plate 12 .

[0151] The above is an introduction to the heat dissipation device. Figure 3 and Figure 4 A computing device provided in an embodiment of the present application is introduced.

[0152] The present application provides a computing device 30, including the aforementioned heat dissipation device 10 and a circuit board 20. In combination with the above, it can be seen that the heat dissipation device 10 includes a first cold plate 11 and a second cold plate 12, and the first cold plate 11 and the second cold plate 12 are stacked along the thickness direction of the heat dissipation device 10. The circuit board 20 is sandwiched between the first cold plate 11 and the second cold plate 12, and the circuit board 20 includes a first surface 21 and a second surface 22 that are arranged opposite to each other along the thickness direction of the heat dissipation device 10, and the first surface 21 is provided with at least one first heating device, and the second surface 22 is provided with at least one second heating device. The first cold plate 11 of the heat dissipation device 10 is thermally connected to the at least one first heating device, and the second cold plate 12 is thermally connected to the at least one second heating device. In the computing device 30 provided in the present application, the heat dissipation device 10 can realize double-sided heat dissipation of the circuit board 20, and double-sided heat dissipation can greatly improve the heat dissipation efficiency of the circuit board 20, and solve the heat dissipation problem of the circuit board 20 where high-power consumption devices are concentrated.

[0153] The heat dissipation device 10 may adopt one or more heat dissipation methods such as liquid cooling and air cooling to dissipate heat. Liquid cooling is to remove heat through the flow of liquid (i.e., cooling medium) to reduce the temperature of the heating device. Air cooling is to remove heat through the flow of air to reduce the surface temperature of the device. For possible implementation methods of the heat dissipation device, please refer to the above, which will not be repeated here.

[0154] A circuit board refers to a printed circuit board (PCB) on which electronic components are welded or assembled. In some scenarios, it may also be called a printed circuit board assembly (PCBA). Furthermore, the circuit board may also include some assembled structural parts, and the circuit board is also referred to as a single board. In some scenarios, the basic (or main) circuit board in a device (or controller) may also be referred to as a mainboard, also called a main circuit board, a system board, or a motherboard. In short, the circuit board of this application may cover concepts such as PCBA, single board, and mainboard.

[0155] To facilitate understanding of the advantages of double-sided heat dissipation, two possible heat dissipation scenarios are described below by way of example.

[0156] In a possible example, at least one first heat generating device includes a chip, and at least one second heat generating device includes a chip. Fig.14As shown, the first surface 21 of the circuit board 20 is arranged with the first chip 21c and the second chip 21d, and the second surface 22 is arranged with the third chip 22c and the fourth chip 22d, that is, the circuit board 20 adopts a double-sided layout method, and chips are arranged on both the first surface 21 and the second surface 22. It is not difficult to see that when the same number of high-power devices are deployed, the double-sided layout method can significantly reduce the layout area of ​​the circuit board 20. It should be understood that the position and number of chips here are only examples.

[0157] Furthermore, a first heat dissipation boss 461c and a first heat dissipation boss 461d are provided on the surface of the first cold plate 11 close to the circuit board 20, wherein the first heat dissipation boss 461c can be attached to the first chip 21c (including attachment through a heat-conducting medium), and the first heat dissipation boss 461d is attached to the second chip 21d, thereby specifically dissipating heat for the first chip 21c and the second chip 21d. Similarly, a second heat dissipation boss 551c and a second heat dissipation boss 551d are provided on the surface of the second cold plate 12 close to the circuit board 20, wherein the second heat dissipation boss 551c can be attached to the third chip 22c, and the second heat dissipation boss 551d is attached to the fourth chip 22d, thereby specifically dissipating heat for the third chip 22c and the fourth chip 22d. In the case of double-sided board layout, the stacked upper and lower cold plates solve the heat dissipation problem of high-efficiency devices on both sides of the circuit board.

[0158] In another possible example, at least one first heat generating device includes a chip, and at least one second heat generating device includes a heat conducting component, and the heat conducting component is heat conductingly connected to the chip. The heat conducting component is, for example, a copper sheet, a metal boss, etc. Fig.15 As shown, the first surface 21 of the circuit board 20 is arranged with a first chip 21e and a second chip 21f, while the second surface 22 is arranged with a first heat-conducting component 22e and a second heat-conducting component 22f. The first heat-conducting component 22e is thermally connected to the first chip 21e, and the heat generated by the first chip 21e can be transferred to the other surface (i.e., the second surface 22) of the circuit board 20. Similarly, the second heat-conducting component 22f is thermally connected to the second chip 21f, and the heat generated by the second chip 21f can be transferred to the second surface 22 of the circuit board 20. In this way, the high-power consumption devices arranged on one side of the circuit board can be cooled on both the front and back sides, which can greatly improve the heat dissipation efficiency, so that the high-power consumption devices can be arranged more densely, thereby making the layout area of ​​the circuit board smaller. Optionally, the orthographic projections of the heat-conducting component and the chip on the first surface at least partially overlap, so that the thermal conductivity efficiency of the heat-conducting component can be improved, and the heat dissipation efficiency can be improved.

[0159] Furthermore, a first heat dissipation boss 461e and a first heat dissipation boss 461f are provided on the surface of the first cold plate 11 close to the circuit board 20, wherein the first heat dissipation boss 461e can be attached to the first chip 21e (including attachment through a heat-conducting medium), and the first heat dissipation boss 461f is attached to the second chip 21f, so as to dissipate heat specifically to the first chip 21e and the second chip 21f. Similarly, a second heat dissipation boss 551e and a second heat dissipation boss 551f are provided on the surface of the second cold plate 12 close to the circuit board 20, wherein the second heat dissipation boss 551e can be attached to the first heat-conducting component 22e, and the second heat dissipation boss 551f is attached to the second heat-conducting component 22f, so as to dissipate heat specifically to the second heat dissipation boss 551e and the second heat dissipation boss 551f, so as to indirectly dissipate heat to the first chip 21e and the second chip 21f, thereby greatly improving the heat dissipation efficiency of high-power consumption devices.

[0160] It should be understood that the above two examples can be combined. For example, the circuit board uses double-sided layout, but for some chips with extremely high power consumption, a heat-conducting component can be used on the back to achieve double-sided heat dissipation.

[0161] Optionally, the chips arranged on the circuit board 20 may include system on chip (SoC) and other forms of chips, such as application-specific integrated circuit (ASIC), programmable logic device (PLD), central processing unit (CPU), microprocessor unit (MPU), microcontroller unit (MCU), neural network processing unit (NPU), etc.

[0162] The above describes the applicable heat dissipation scenarios of the present application. The following describes the associated design between the first cold plate 11 and the heat generating components on the first surface 21 of the circuit board 20 .

[0163] In some possible implementations, at least one first heat dissipation boss is provided on the third surface 46 of the first cold plate 11, and at least one first heating device is thermally connected to at least one first heat dissipation boss. In this way, the heat dissipation of the heating device can be targeted. Taking liquid cooling as an example, the heat generated by the first heating device enters the cold plate through conduction of the heat dissipation boss, and the temperature of the first heating device can be reduced through the circulation of the liquid cooling medium. For related content, please refer to the introduction above.

[0164] In some possible implementations, the orthographic projections of at least one first heat generating device and at least one first heat dissipation boss on the third surface at least partially overlap. At least partial overlap includes complete overlap, complete coverage, and partial overlap. Taking A and B as an example, the complete overlap of A and B can be understood as A and B having the same shape and area and completely consistent positions. A and B completely cover each other, which means that A completely covers B or B completely covers A. A partially covers B, which means that A covers part of B, while another part of B is not covered. For example, see Fig.16 , the orthographic projection of the first heat dissipation boss 461a on the third surface 46 can completely cover the orthographic projection of the first heating device 21a on the third surface 46, and the orthographic projection of the first heat dissipation boss 461b on the third surface 46 can completely cover the orthographic projection of the first heating device 21b. For another example, see Fig.17 , the orthographic projection of the first heat dissipation boss 461a on the third surface 46 can partially cover the orthographic projection of the first heating device 21a on the third surface 46, and the orthographic projection of the first heat dissipation boss 461b on the third surface 46 can partially cover the orthographic projection of the first heating device 21b on the third surface 46. Of course, since there are multiple first heat dissipation bosses, the coverage between different first heat dissipation bosses and corresponding first heating devices may be different. For example, part of the first heat dissipation bosses and the corresponding part of the first heating device are completely covered, while another part of the first heat dissipation bosses and the corresponding other part of the first heating device partially overlap.

[0165] In some possible implementations, a heat-conducting medium may be provided between at least one first heat-dissipating boss and at least one first heating device. The heat-conducting medium may include silicone grease or a thermal pad (e.g., a phase-change thermally conductive film), etc. The heat-conducting material can avoid direct contact between the boss and the surface of the high-power-consuming device, thereby reducing the risk of damage to the high-power-consuming device. The heat-conducting medium has a low thermal resistance and can be extremely thin in terms of process. By bonding the heat-dissipating boss and the high-power-consuming chip through the heat-conducting medium, the heat conduction efficiency can be improved, which is beneficial to reducing the temperature of the high-power-consuming device.

[0166] In some possible implementations, a first flow channel 45 is provided in the first cold plate 11. The first flow channel 45 forms a first projection on the third surface 46, and at least one first heating device forms a second projection on the third surface 46, and the first projection covers the second projection. Alternatively, the first projection partially covers the second projection. Fig.18 In the projection of the first heating device disposed on the first surface 21 , the projection of the first heating device 21 a is covered by the projection of the first flow channel 45 . In addition, the projection of the first heating device 21 b is partially covered by the projection of the first flow channel 45 .

[0167] Next, the associated design between the second cold plate 12 and the heating components on the second surface 22 of the circuit board 20 will be introduced.

[0168] In some possible implementations, at least one second heat dissipation boss is provided on the fourth surface 55 of the second cold plate 12, and at least one second heating element is thermally connected to at least one second heat dissipation boss. In this way, the heat dissipation of the heating element can be targeted. Furthermore, the orthographic projections of at least one second heating element and at least one second heat dissipation boss on the fourth surface 55 at least partially overlap. Fig.16 and Fig.17 Related instructions.

[0169] In some possible implementations, the second flow channel 57 forms a third projection on the fourth surface 55, at least one second heating device forms a fourth projection on the fourth surface, and the third projection covers the fourth projection or the third projection partially covers the fourth projection. Fig.18 Related instructions.

[0170] In some possible implementations, there is a receiving space between the first cold plate 11 and the second cold plate 12 , and the receiving space may be a fully enclosed space, a semi-enclosed space, or a nearly fully enclosed space with through holes. The receiving space is used to accommodate the circuit board 20 .

[0171] See also Fig.19 , Fig.19 1 is a schematic diagram of an assembly of an electronic device provided by an embodiment of the present application, wherein the first cold plate 11 and the second cold plate 12 simultaneously serve as the outer shell of the computing device 30, and the circuit board 20 is sealed in the box body formed by the outer shell. Optionally, the computing device further includes a connection port support frame 60, which can be fixedly mounted in the first cold plate 11 and / or the second cold plate 12 to facilitate the installation of the output of the circuit board and / or the output line.

[0172] In some possible implementations, combining Figure 3 , Figure 4 and Fig. 20 , the first cold plate 11 is provided with at least one first connection portion 418, and the circuit board 20 is provided with a second connection portion 23, and the first connection portion 418 and the second connection portion 23 can be assembled together to achieve a fixed connection between the first cold plate 11 and the circuit board 20. Exemplarily, a stud (which can be regarded as the first connection portion 418) is provided on the surface of the first cold plate 11 close to the circuit board 20 (i.e., the third surface 46), and a through hole (which can be regarded as the second connection portion 23) is provided on the circuit board, and a screw (such as a fastening screw) is nailed into the stud through the through hole to achieve a fixed connection between the first cold plate 11 and the circuit board 20.

[0173] In some possible implementations, the second cold plate 12 is further provided with at least one third connection portion, and the circuit board is provided with a fourth connection portion, and the third connection portion and the fourth connection portion are used to achieve a fixed connection between the second cold plate 12 and the circuit board 20 .

[0174] The heat dissipation device provided in the embodiment of the present application can be applied to a variety of devices with heat dissipation requirements to dissipate heat for the circuit boards where the high-power consumption devices of these terminals are concentrated. Exemplarily, the heat dissipation device and computing device provided in the present application can be applied to devices such as terminals, network devices, computer room equipment, industrial equipment, or entertainment and leisure equipment. Among them, the terminal is such as transportation equipment, mobile phones, tablet computers, laptops, smart bracelets, smart watches, or smart glasses. Transportation equipment can further include vehicles, ships, aircraft, rail transportation (such as subways, high-speed railways, etc.), or logistics robots. Network equipment includes but is not limited to metropolitan area routers, central routers, or base stations. Computer room equipment such as data center servers or data center switches. Industrial equipment such as industrial robots, robotic arms, etc. Leisure and entertainment equipment such as virtual reality (VR) equipment, mixed reality (MR) equipment, massage chairs, or 4D cinema cabins. The embodiments of the present application do not strictly limit this.

[0175] Taking a terminal as an example, an embodiment of the present application further provides a terminal, which includes the aforementioned heat dissipation device, or includes the aforementioned computing device. The terminal may include a vehicle, a drone, a robot, an industrial robot arm, or other means of transport or an intelligent device. Fig.21 , Fig.21 1 is a schematic diagram of a vehicle provided by the present application, wherein the vehicle 100 includes a computing device 30, which may be used as (or include) an intelligent driving controller, a cockpit domain controller, a vehicle domain controller (VDC), a vehicle integrated unit (VIU), or a battery management system, etc. Among them, the intelligent driving controller is, for example, a mobile data center (MDC).

[0176] Those skilled in the art should know that the on-board computing devices are usually installed in the engine compartment, cockpit, co-pilot glove box, front of the car and other locations of electric vehicles. These locations have a high ambient temperature and a very bad heat dissipation environment. With the development of vehicle intelligence, intelligent functions such as intelligent driving and intelligent cockpit have gradually become standard features of vehicles. As a result, more and more chips are arranged on the on-board devices, power consumption continues to increase, and the heat dissipation demand of on-board devices continues to grow. Taking an intelligent driving controller equipped with an advanced driving system (ADS) as an example, the intelligent driving controller can interact with various sensors installed on the vehicle body through cables, receive driving condition data fed back by multiple sensors (such as laser radar, millimeter wave radar, camera, positioning module, temperature / humidity sensor, inertial measurement unit, etc.), and perform real-time reasoning, judge the driving environment, and issue operation commands to various control units in the vehicle to control the vehicle to complete various operations, such as braking, deceleration, lane change, or parking. Therefore, the intelligent driving controller needs to calculate and analyze a large amount of data and output a large amount of calculation results and / or control signals. If the intelligent driving controller has the risk of overheating, it is very likely to endanger the lives of the passengers. Therefore, it is necessary to provide stable and efficient heat dissipation for the intelligent driving controller.

[0177] The heat dissipation device and computing device provided by the embodiments of the present application can greatly improve the heat dissipation efficiency, solve the heat dissipation problem of the vehicle controller with concentrated high-power devices, provide stable and efficient heat dissipation for the vehicle controller, and improve the thermal management stability and safety of the vehicle. Moreover, the solution of the present application can also reduce the layout area of ​​the vehicle controller, which is conducive to the miniaturization and integrated design of vehicle equipment.

[0178] It should be understood that in the embodiments of the present application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0179] In the embodiments of the present application, the "end" appearing in the terms "one end", "the other end", "end", "free end", "upper end", "lower end", "connecting end", etc. is not limited to the end head, endpoint or end face, but also includes a portion extending an axial distance and / or radial distance from the end head, endpoint, or end face on the device or element to which the end head, endpoint, or end face belongs.

[0180] In the description of the present application, the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", "left", "side", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. It should be understood that the z direction, y direction, etc. mentioned in some embodiments of the present application are based on the XYZ rectangular coordinate system as a reference to facilitate the description of the features in the present solution, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation.

[0181] In addition, in the embodiments of the present application, the back-to-back arrangement refers to different orientations, and does not necessarily limit the orientations of the two parts to two completely opposite directions. For example, the first surface and the second surface are arranged back to back, which means that the first surface and the second surface have roughly different orientations in the z direction, such as one roughly facing the positive direction of the z direction and the other roughly facing the negative direction of the z direction. In some possible cases, the first surface is parallel to the second surface and is arranged back to back, and in some other cases, the first surface and the second surface may not be completely back to back, but there is a certain inclination angle. Similarly, the first edge and the second edge are back to back, the third edge and the fourth edge are back to back, etc. have similar situations.

[0182] The "at least one" mentioned in the embodiments of the present application refers to one or more, and "plurality" refers to two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can be represented by: a, b, c, (a and b), (a and c), (b and c), or (a and b and c), where a, b, c can be single or multiple. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can be represented by: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0183] Furthermore, unless otherwise specified, the embodiments of the present application use ordinal numbers such as "first" and "second" to distinguish between multiple objects and are not used to limit the order, timing, priority or importance of multiple objects.

Claims

1. A computing device, characterized in that: Including heat sink and circuit board, The heat dissipation device comprises a first cold plate and a second cold plate, the first cold plate is provided with a first flow channel, the second cold plate is provided with a second flow channel, and the first flow channel and the second flow channel are used for the flow of cooling medium; Along the thickness direction of the heat dissipation device, the first cold plate and the second cold plate are stacked. The circuit board is sandwiched between the first cold plate and the second cold plate, and includes a first surface and a second surface that are disposed opposite to each other along a thickness direction of the heat dissipation device, the first surface is provided with at least one first heating device, and the second surface is provided with at least one second heating device. The first cold plate is thermally connected to the at least one first heat generating device, and the second cold plate is thermally connected to the at least one second heat generating device.

2. The computing device according to claim 1, wherein: The first cold plate includes a third surface, and the third surface is provided with at least one first heat dissipation boss. The orthographic projections of at least one of the first heat-generating components and at least one of the first heat-dissipating bosses on the third surface at least partially overlap, At least one of the first heat-generating components is thermally connected to at least one of the first heat-dissipating bosses.

3. The computing device according to claim 2, characterized in that The first flow channel forms a first projection on the third surface, and at least one of the first heating devices forms a second projection on the third surface. The first projection covers the second projection, or the first projection partially covers the second projection.

4. The computing device according to claim 2 or 3, characterized in that The second cold plate includes a fourth surface, on which at least one second heat dissipation boss is disposed, the orthographic projections of at least one second heat-generating device and at least one second heat-dissipating boss on the fourth surface at least partially overlap, and at least one second heat-generating device and at least one second heat-dissipating boss are thermally connected.

5. The computing device according to claim 4, characterized in that The second flow channel forms a third projection on the fourth surface, at least one of the second heating devices forms a fourth projection on the fourth surface, and the third projection covers the fourth projection, or the third projection partially covers the fourth projection.

6. The computing device according to any one of claims 1 to 5, characterized in that: The at least one first heat generating device includes a chip, and the at least one second heat generating device includes a chip.

7. The computing device according to any one of claims 1 to 5, characterized in that: The at least one first heat-generating device comprises a chip, and the at least one second heat-generating device comprises a heat-conducting component, and the heat-conducting component is thermally connected to the chip.

8. The computing device according to any one of claims 1 to 7, characterized in that: The first cold plate is provided with a first liquid port, a second liquid port, a first communication port and a second communication port, and the second cold plate is provided with a third communication port and a fourth communication port. The first flow channel and the second flow channel are connected through the first communication port and the third communication port, and the second flow channel and the second liquid passage port are connected through the second communication port and the fourth communication port; The first liquid passage, the first flow channel, the first communication port, the third communication port, the second flow channel, the second communication port, the fourth communication port and the second liquid passage are connected in sequence.

9. The computing device according to claim 8, characterized in that The first communication port and the third communication port are arranged on the same side of the heat dissipation device, The second communication port and the fourth communication port are arranged on the same side of the heat dissipation device, The first liquid passage opening and the second liquid passage opening are arranged on the same side of the heat dissipation device, or on different sides.

10. The computing device according to any one of claims 1 to 7, characterized in that: The first cold plate is provided with a third liquid port and a fifth communication port, and the second cold plate is provided with a fourth liquid port and a sixth communication port. The first flow channel and the second flow channel are connected through the fifth communication port and the sixth communication port. The third liquid passage, the first flow channel, the fifth communication port, the sixth communication port, the second flow channel and the fourth liquid passage are connected in sequence.

11. The computing device according to any one of claims 1 to 7, characterized in that: The first cold plate is provided with a first liquid inlet and a first liquid outlet, the first liquid inlet and the first liquid outlet are both connected to the first flow channel, the first liquid inlet is used for the cooling medium to flow in, and the first liquid outlet is used for the cooling medium to flow out, The second cold plate is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet and the second liquid outlet are both connected with the second flow channel, the second liquid inlet is used for the cooling medium to flow in, and the second liquid outlet is used for the cooling medium to flow out.

12. The computing device according to any one of claims 1 to 11, characterized in that: The first flow channel is an "S"-shaped flow channel.

13. The computing device according to any one of claims 1 to 12, characterized in that: The first cold plate includes a first substrate and a first cover plate. The first flow channel is recessed in a fifth surface of the first substrate. The fifth surface is a surface of the first substrate away from the circuit board. The first cover plate is used to seal the first flow channel.

14. The computing device according to any one of claims 1 to 13, characterized in that: The first flow channel includes a plurality of sub-flow channels which are connected end to end in sequence.

15. The computing device according to any one of claims 11 to 14, characterized in that: The first flow channel includes a first sub-flow channel, a second sub-flow channel and a third sub-flow channel; The first cold plate has a first side and a second side opposite to each other along a length direction of the heat sink, and a third side and a fourth side opposite to each other along a width direction of the heat sink; A first partition component and a second partition component are provided in the first flow channel, and the first partition component and the second partition component are arranged at intervals along the width direction of the heat dissipation device; The bottom of the first partition member is connected to the bottom surface of the first flow channel and extends along the length direction of the heat dissipation device, one end of the first partition member is connected to the first side, and the other end is spaced apart from the second side; The bottom of the second partition member is connected to the bottom surface of the first flow channel and extends along the length direction of the heat dissipation device, one end of the second partition member is connected to the second side, and the other end is spaced apart from the first side; The first partition member and the third side form the first sub-channel, the first partition member and the second partition member form the second sub-channel, and the second partition member and the fourth side form the third sub-channel; The first sub-channel and the second sub-channel are communicated with each other through a gap between the first partition member and the second side, and the second sub-channel and the third sub-channel are communicated with each other through a gap between the second partition member and the first side.

16. The computing device according to any one of claims 1 to 15, characterized in that: The first cold plate further includes a plurality of first heat dissipation teeth protruding from the first flow channel, and the plurality of first heat dissipation teeth are connected to the bottom surface of the first flow channel.

17. The computing device according to any one of claims 1 to 16, characterized in that: The second cold plate includes a second substrate and a second cover plate. The second flow channel is recessed in a sixth surface of the second substrate. The sixth surface is a surface of the second substrate away from the circuit board. The second cover plate is used to seal the second flow channel.

18. The computing device according to claim 17, characterized in that The second flow channel includes a plurality of sub-flow channels connected end to end in sequence.

19. The computing device according to claim 17 or 18, characterized in that The second flow channel includes a fourth sub-flow channel, a fifth sub-flow channel, a sixth sub-flow channel and a seventh sub-flow channel; The second cold plate has a fifth side and a sixth side opposite to each other along the length direction of the heat sink, and a seventh side and an eighth side opposite to each other along the width direction of the heat sink; A third partition member, a fourth partition member and a fifth partition member are provided in the first flow channel, and the bottom of the third partition member, the bottom of the fourth partition member and the bottom of the fifth partition member are all connected to the bottom surface of the second flow channel. The third partition member extends along the width direction of the heat sink, one end of which is connected to the eighth side, and the other end of which is connected to the fourth partition member and spaced from the seventh side. The fourth partition member extends along the length direction of the heat sink, one end of which is connected to the third partition member and spaced apart from the sixth side, and the other end of which is spaced apart from the fifth side. The fifth partition member is disposed between the fourth partition member and the eighth side, and the fourth partition member and the fifth partition member are arranged at intervals along the width direction of the heat sink. The fifth partition member extends along the length direction of the heat sink, one end of which is connected to the fifth side of the second substrate, and the other end of which is spaced apart from the third partition member. A fourth sub-channel is formed between the third partition member and the sixth side, a fifth sub-channel is formed between the fourth partition member and the seventh side, a sixth sub-channel is formed between the fourth partition member and the fifth partition member, and a seventh sub-channel is formed between the fifth partition member and the eighth side; The fourth sub-channel and the fifth sub-channel are connected through a first interval and a second interval, the first interval is the interval between the third partition member and the seventh side, and the second interval is the interval between the fourth partition member and the sixth side; The fifth sub-channel and the sixth sub-channel are connected through the gap between the fourth partition member and the fifth side; The sixth sub-flow channel and the seventh sub-flow channel are connected to each other through a gap between the fifth partition member and the third partition member.

20. The computing device according to any one of claims 1 to 19, characterized in that: The second cold plate further includes a plurality of second heat dissipation teeth disposed in the second flow channel, and the plurality of second heat dissipation teeth are connected to the bottom surface of the second flow channel.

21. A vehicle, characterized in that: The vehicle comprises the computing device of any one of claims 1-20.

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