Display module and display device

Abstract

The invention relates to a display module which comprises a display panel, a chip on film and a flexible circuit board, the display panel is connected with the flexible circuit board through the chip on film, a first end of the display panel is bent to enable the chip on film to be located on the back face of the display panel, and a second end of the display panel is bent to enable the chip on film to be located on the back face of the display panel. One end of the chip-on-film is bent, so that the flexible circuit board is positioned on one side, far away from the display panel, of the chip-on-film; the display module further comprises a heat dissipation film layer arranged on the back face of the display panel, the heat dissipation film layer comprises a metal layer, the metal layer comprises a body area, the body area comprises a first edge area, at least part of orthographic projection of the first binding area on the heat dissipation film layer is located in the first edge area, and at least part of orthographic projection of the first binding area on the heat dissipation film layer is located in the second edge area. The main body area comprises a second edge area except the first edge area, the metal layer further comprises a connecting part formed by extending at least part of the second edge area outwards, and the connecting part is electrically connected with the flexible circuit board. The invention further relates to a display device.

Description

Technical Field

[0001] The present invention relates to the technical field of display product manufacturing, and in particular to a display module and a display device. Background Art

[0002] Due to the high reliability requirements of automotive applications, the design of small-size automotive OLED modules usually encounters module size limitations, making it difficult to support the flat layout of COF (chip on film) and FPC (flexible circuit board). This can only be achieved by folding the COF, which involves multiple bendings. The COF is between the FPC and the module BKT (the support structure on the back of the display module), and the FPC cannot be fixed and grounded directly through the large area of ​​glue on the back of the FPC. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a display module and a display device to solve the problem of difficulty in grounding a flexible circuit board in a small-size module.

[0004] In order to achieve the above-mentioned object, the technical solution adopted in the embodiment of the present invention is: a display module, comprising a display panel, a chip-on-film and a flexible circuit board, wherein the display panel is connected to the flexible circuit board via the chip-on-film, and in a first direction, the display panel has a display area and a first binding area located on one side of the display area, and the first binding area is bent to the back side of the display panel;

[0005] In the first direction, the chip-on-film comprises a second binding area and a third binding area which are arranged opposite to each other, the second binding area is connected to the first binding area, and the chip-on-film is located on the back of the display panel;

[0006] The third binding area is bent to a side of the COF away from the display panel, the flexible circuit board is connected to the third binding area, and the flexible circuit board is located on a side of the COF away from the display panel;

[0007] The display module also includes a heat dissipation film layer arranged on the back side of the display panel, the heat dissipation film layer includes a metal layer, the metal layer includes a main area, the main area includes a first edge area, the orthographic projection of the first binding area on the heat dissipation film layer is at least partially located in the first edge area, along the circumferential direction of the main area, the main area includes a second edge area other than the first edge area, the metal layer also includes a connecting portion formed by extending outward from at least a portion of the second edge area, the connecting portion is bent to a side of the metal layer away from the display panel to be electrically connected to the flexible circuit board.

[0008] Optionally, the connection portion is electrically connected to a copper exposed area on a side of the flexible circuit board close to the display panel, or the connection portion is electrically connected to a copper exposed area on a side of the flexible circuit board away from the display panel.

[0009] Optionally, in a second direction, at least one side of the flexible circuit board includes a first area exposed to the chip-on-film arrangement, the second direction is perpendicular to the first direction, and the second direction is parallel to the light emitting surface of the display panel;

[0010] An adhesive layer is provided between the first region and the metal layer, and the adhesive force of the adhesive layer is greater than 6000 gf / inch.

[0011] Optionally, the adhesive layer is made of VHB glue.

[0012] Optional,

[0013] The main body area is rectangular, the second edge area includes a first sub-edge area arranged opposite to the first edge area, and a second sub-edge area and a third sub-edge area arranged adjacent to the first edge area, in the first direction, the first edge area and the first sub-edge area are arranged opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are arranged opposite to each other;

[0014] At least a portion of the second sub-edge region and / or at least a portion of the third sub-edge region extends outward to form the connecting portion.

[0015] Optionally, the connecting portion includes a first connecting area for electrically connecting to the flexible circuit board, the area of ​​the first connecting area is smaller than the area of ​​the bonding surface between the adhesive layer and the flexible circuit board, and under the bonding action of the adhesive layer and the flexible circuit board, the first connecting area is crimped to a side of the flexible circuit board close to the display panel.

[0016] Optionally, the connecting portion includes a first connecting area for electrically connecting to the flexible circuit board, and the first connecting area is electrically connected to a surface of the flexible circuit board away from the display panel through a conductive adhesive.

[0017] Optionally, a bending area is further provided between the main area and the connecting portion, and a hollow pattern is provided on the bending area.

[0018] Optionally, the main body area is rectangular, and the second edge area includes a first sub-edge area arranged opposite to the first edge area, and a second sub-edge area and a third sub-edge area arranged adjacent to the first edge area, and in the first direction, the first edge area and the first sub-edge area are arranged opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are arranged opposite to each other;

[0019] At least a portion of the first sub-edge region extends outward to form the connecting portion.

[0020] Optionally, the main body area is rectangular, and the second edge area includes a first sub-edge area arranged opposite to the first edge area, and a second sub-edge area and a third sub-edge area arranged adjacent to the first edge area, and in the first direction, the first edge area and the first sub-edge area are arranged opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are arranged opposite to each other;

[0021] At least a portion of the first sub-edge region extends outward to form the connecting portion, and at least a portion of the second sub-edge region and / or at least a portion of the third sub-edge region extends outward to form the connecting portion.

[0022] Optionally, the area of ​​the display region is substantially the same as the area of ​​the flexible circuit board.

[0023] An embodiment of the present invention further provides a display device, comprising the above-mentioned display module.

[0024] Optionally, the display module is applied to a vehicle steering wheel.

[0025] The beneficial effect of the present invention is that the display module also includes a heat dissipation film layer arranged on the back of the display panel, and the heat dissipation film layer includes a metal layer. The grounding setting of the flexible circuit board is achieved by expanding the local area of ​​the metal layer outward and electrically connecting it to the exposed copper area on the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram showing a display module in the related art;

[0027] Figure 2 A schematic diagram showing a display module in the related art;

[0028] Figure 3 A schematic diagram showing a display module in an embodiment of the present invention;

[0029] Figure 4 A schematic diagram showing a display module in an embodiment of the present invention;

[0030] Figure 5 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0031] Figure 6 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0032] Figure 7 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0033] Figure 8 A schematic diagram showing a display module in an embodiment of the present invention;

[0034] Fig. 9 A schematic diagram showing a display module in an embodiment of the present invention;

[0035] Fig.10 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0036] Fig.11 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0037] Fig.12 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0038] Fig.13 A schematic diagram showing a display module in an embodiment of the present invention;

[0039] Fig.14 A schematic diagram showing a display module in an embodiment of the present invention;

[0040] Fig.15 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0041] Fig.16 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention;

[0042] Fig.17 A schematic diagram showing a heat dissipation film layer in an embodiment of the present invention. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0044] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0045] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0046] Traditionally, in-vehicle OLED screens are mainly used in large-size platforms such as central control instrument entertainment, where there is relatively sufficient space for the layout of circuit structures such as PCB / FPC / COF, and there are usually no problems such as grounding difficulties. For some small-size (less than 3 inches) screens with insufficient space (mainly used in steering wheel finger screens, gear lever screens, boss key screens, etc.), the traditional solution is to use thicker conductive glue 4 to bond the flexible circuit board 3, but due to multiple bending, there is a high rebound force (300g), (the display panel 1 is bound to one end of the cover chip 2, and the other end of the cover chip 2 is connected to the cover chip 2). The flexible circuit board 3 is bound and connected, and the binding area of ​​the display panel 1 is bent to the backlight side of the display panel 1, so that the chip-on-chip film 2 is located on the backlight side of the display panel 1, and the binding area of ​​the chip-on-chip film 2 used for binding with the flexible circuit board 3 is bent to the side of the chip-on-chip film 2 away from the display panel 1, so that the flexible circuit board 3 is superimposed on the side of the chip-on-chip film 2 away from the display panel 1) and the conductive glue 4 itself needs to have a conductive property, so its bonding performance is difficult to achieve a relatively high level (<3000gf / inch), and the bonding area is very small. In the high temperature environment of the vehicle, there is a greater risk of peeling; Figure 1 and Figure 2 As shown in the figure, the small-sized car-mounted OLED screen has a multiple bending structure and uses conductive glue as the assembly and static conductive structure. The display panel is connected to the flexible circuit board through the cover film, and the flexible circuit board is connected to the back of the display panel through the conductive glue layer. Figure 2 The blue arrow in the figure indicates a location where peeling risk is likely to occur. Under the rebound effect of the bending area of ​​the flip chip film, the risk of peeling is likely to occur between the conductive adhesive layer and the display panel.

[0047] refer to Figure 3-Figure 17 As shown, in order to solve the above problems, this embodiment provides a display module, including a display panel 1, a chip-on-film 2 and a flexible circuit board 3.

[0048] In the first direction (reference Figure 3 In the X direction in the display panel 1, the display panel 1 has a display area and a first binding area 11 located on one side of the display area, and the first binding area 11 is bent to the back side of the display panel 1;

[0049] In the first direction, the chip-on-film 2 includes a second binding area 21 and a third binding area 22 that are arranged opposite to each other, the second binding area 21 is connected to the first binding area 11, and the chip-on-film 2 is located on the back of the display panel 1;

[0050] The third binding area 22 is bent to a side of the COF 2 away from the display panel 1, the flexible circuit board 3 is connected to the third binding area 22, and the flexible circuit board 3 is located on a side of the COF 2 away from the display panel 1;

[0051] The display module further includes a heat dissipation film layer disposed on the back of the display panel 1, the heat dissipation film layer includes a metal layer, the metal layer includes a main body area 51, the main body area 51 includes a first edge area 501, the orthographic projection of the first binding area 11 on the heat dissipation film layer is at least partially located in the first edge area 501, along the circumferential direction of the main body area 51, the main body area 51 includes a second edge area other than the first edge area 501, the metal layer further includes a connection portion 52 formed by extending outward from at least part of the second edge area, the connection portion 52 is bent to the side of the metal layer away from the display panel 1, so as to be electrically connected to the flexible circuit board 3. Using the above scheme, in this embodiment, the metal layer in the heat dissipation film layer is partially expanded, and the connection portion 52 formed by the expansion is bent to the side of the metal layer away from the display panel 1, so as to be electrically connected to the flexible circuit board 3 to achieve grounding, thereby solving the problem of difficulty in grounding the flexible circuit board 3 in a small-size module.

[0052] Exemplarily, the metal layer is a copper foil, which is ultra-thin (thickness is 0.03-0.1 mm) and plastic. After being bent, the copper foil undergoes plastic deformation, and the rebound force is negligible.

[0053] It should be noted that the overall cross-section of the display module (the cross-section in the direction parallel to the light-emitting surface of the display panel) can be a regular or irregular shape, such as a polygon, a circle, etc. The overall cross-section of the display module (the cross-section in the direction parallel to the light-emitting surface of the display panel) can also be an irregular shape. The shape of the metal layer, the shape of the flexible circuit board 3, etc. are consistent with the overall shape of the display module. For example, if the overall cross-section of the display module is a rectangle, the first edge region is an edge region disposed close to one side of the rectangle.

[0054] In an exemplary embodiment, the connection portion 52 is electrically connected to a copper exposed area on a side of the flexible circuit board 3 close to the display panel 1 , or the connection portion 52 is electrically connected to a copper exposed area on a side of the flexible circuit board 3 away from the display panel 1 .

[0055] In an exemplary embodiment, in a first direction (reference Figure 3 In the X direction), the opposite ends of the chip-on-film 2 are respectively bound and connected to the display panel 1 and the flexible circuit board 3, and in the second direction (reference Figure 3In the Y direction), at least one side of the flexible circuit board 3 includes a first area 31 (reference Figure 3 ), the second direction is perpendicular to the first direction, and the second direction is parallel to the display surface of the display panel 1;

[0056] An adhesive layer 4 is provided between the first region 31 and the metal layer, and the adhesive force of the adhesive layer 4 is greater than 6000 gf / inch.

[0057] In the related art, in order to realize the grounding of the flexible circuit board 3, it is necessary to connect the flexible circuit board 3 to the supporting structure on the back of the display panel 1 through a conductive adhesive. However, for a small-sized display module, there is insufficient space. After multiple bending and setting, the connection area between the flexible circuit board 3 and the conductive adhesive is limited. In addition, due to the conductive properties of the conductive adhesive, its adhesive force is insufficient and peeling is prone to occur. In this embodiment, by expanding the metal layer outward to be grounded and connected to the flexible circuit board 3, the fixing of the flexible circuit board 3 can select an adhesive layer 4 with relatively strong adhesive force, and the adhesive layer 4 does not need to have conductive properties, thereby enhancing the connection stability of the flexible circuit board 3.

[0058] In an exemplary embodiment, the adhesive layer 4 is made of VHB glue (Very High Bond) having a high adhesive force, but the present invention is not limited thereto.

[0059] In an exemplary embodiment, the main body area 51 is rectangular, and the second edge area includes a first sub-edge area 504 arranged opposite to the first edge area 501, and a second sub-edge area 502 and a third sub-edge area 503 arranged adjacent to the first edge area 501. In the first direction, the first edge area 501 and the first sub-edge area 504 are arranged opposite to each other, and in the second direction, the second sub-edge area 502 and the third sub-edge area 503 are arranged opposite to each other.

[0060] At least a portion of the second sub-edge region 502 and / or at least a portion of the third sub-edge region 503 extends outward to form the connecting portion 52 .

[0061] Figure 3-Figure 12 It is shown in the figure that both the second sub-edge region 502 and the third sub-edge region 503 are provided with the connecting portion 52 to ensure the grounding stability of the flexible circuit board 3 .

[0062] In an exemplary embodiment, the connecting portion 52 includes a first connecting area 521 (see FIG. 5 ) for electrically connecting to the flexible circuit board 3. Fig.10 and Fig.15The area of ​​the first connection area 521 is smaller than the area of ​​the bonding surface between the adhesive layer 4 and the flexible circuit board 3. Under the bonding effect between the adhesive layer 4 and the flexible circuit board 3, the first connection area 521 is pressed onto a side of the flexible circuit board 3 close to the display panel 1.

[0063] The adhesive layer 4 is made of a material with high adhesive force to enhance the connection stability of the flexible circuit board 3. At this time, the first connection area 521 is located between the flexible circuit board 3 and the adhesive layer 4. The area of ​​the first connection area 521 is smaller than the area of ​​the bonding surface between the adhesive layer 4 and the flexible circuit board 3. Therefore, no additional conductive adhesive is required between the first connection area 521 and the flexible circuit board 3. Under the bonding action of the adhesive layer 4 and the flexible circuit board 3, the first connection area 521 is pressed onto the side of the flexible circuit board 3 close to the display panel 1, so that the electrical connection between the first connection area and the copper exposed area of ​​the flexible circuit board 3 can be achieved.

[0064] Exemplarily, the connecting portion 52 is formed by a partial outward extension of the corresponding second sub-edge region 502 (i.e., in the first direction, the length of the connecting portion 52 is less than or equal to the length of the second sub-edge region 502), and / or the connecting portion 52 is formed by a partial outward extension of the corresponding third sub-edge region 503 (i.e., in the first direction, the length of the connecting portion 52 is less than or equal to the length of the third sub-edge region 503), which facilitates the bending of the connecting portion 52.

[0065] In an exemplary embodiment, the connecting portion 52 includes a first connecting area 521 for electrically connecting to the flexible circuit board 3 , and the first connecting area 521 is electrically connected to a side of the flexible circuit board 3 away from the display panel 1 through a conductive adhesive.

[0066] It should be noted that, since the connecting portion 52 is formed by extending part of the metal layer, the connecting portion 52 is bent to achieve connection with the flexible circuit board 3, wherein the bending of the connecting portion 52 is plastic deformation and the rebound force can be ignored. Therefore, the conductive glue between the first connecting area and the flexible circuit board 3 does not need to be specially selected from highly viscous conductive glue, and no peeling problem will occur.

[0067] In an exemplary embodiment, a bending zone is further provided between the main body area 51 and the connecting portion 52, and the bending zone is located between the main body area 51 and the first connecting area. Under the action of the bending zone, the first connecting area is located on the side of the main body area 51 away from the display panel 1, and a hollow pattern 5001 is provided on the bending zone.

[0068] The specific structural form of the hollow pattern 5001 can be various, for example, it can be a plurality of hollow holes arranged at intervals, and the shape of the hollow holes can be a regular or irregular geometric shape, such as square, circle, etc., which is not limited here.

[0069] In an exemplary embodiment, the main body area is rectangular, and the second edge area includes a first sub-edge area 504 arranged opposite to the first edge area 501, and a second sub-edge area 502 and a third sub-edge area 503 arranged adjacent to the first edge area 501. In the first direction, the first edge area 501 and the first sub-edge area 504 are arranged opposite to each other, and in the second direction, the second sub-edge area 502 and the third sub-edge area 503 are arranged opposite to each other.

[0070] At least a portion of the first sub-edge region 504 extends outward to form the connecting portion 52 .

[0071] The connection portion 52 is provided in the first sub-edge region 504 , which can effectively shield the exposed portion of the bending region of the chip-on-film 2 , thereby achieving a good EMI (electromagnetic interference) shielding function.

[0072] It should be noted that the bending area between the connecting portion 52 of the second sub-edge area 502 and the main area 51, and the bending area between the connecting portion 52 of the third sub-edge area 503 and the main area 51 may be provided with a hollow pattern 5001 (refer to Figure 3 and Figure 5 ), or you can choose not to set the hollow pattern (reference Figure 8 and Fig.13 ). The bending area between the connecting portion 52 of the first sub-edge area 504 and the main area 51 is not provided with a hollow pattern, and the whole structure is a solid structure (refer to Fig.13 ) to effectively shield the bending area 23 of the flip chip film 2 (refer to Figure 4 ) exposed part.

[0073] In an exemplary embodiment, the main body area 51 is rectangular, and the second edge area includes a first sub-edge area 504 arranged opposite to the first edge area 501, and a second sub-edge area 502 and a third sub-edge area 503 arranged adjacent to the first edge area 501. In the first direction, the first edge area 501 and the first sub-edge area 504 are arranged opposite to each other, and in the second direction, the second sub-edge area 502 and the third sub-edge area 503 are arranged opposite to each other.

[0074] At least a portion of the first sub-edge region 504 extends outward to form the connecting portion 52 .

[0075] In an exemplary embodiment, the main body area 51 is rectangular, and the second edge area includes a first sub-edge area 504 arranged opposite to the first edge area 501, and a second sub-edge area 502 and a third sub-edge area 503 arranged adjacent to the first edge area 501. In the first direction, the first edge area 501 and the first sub-edge area 504 are arranged opposite to each other, and in the second direction, the second sub-edge area 502 and the third sub-edge area 503 are arranged opposite to each other.

[0076] At least a portion of the first sub-edge region 504 extends outward to form the connecting portion 52 , and at least a portion of the second sub-edge region 502 and / or at least a portion of the third sub-edge region 503 extends outward to form the connecting portion 52 .

[0077] Figure 13-Figure 17 It is shown that at least a portion of the second sub-edge region 502 and at least a portion of the third sub-edge region 503 extend to form the connecting portion 52 , and at least a portion of the first sub-edge region 504 extends to form the connecting portion 52 .

[0078] In an exemplary embodiment, in a first direction, the display panel 1 includes a display area and a first binding area 11 located at one side of the display area, and the area of ​​the display area is substantially the same as the area of ​​the flexible circuit board 3 .

[0079] It should be noted that the display module in this embodiment is a small-size display module, and the area of ​​the display area is roughly the same as the area of ​​the flexible circuit board 3, including a certain tolerance, which is within the acceptable deviation range for specific values ​​determined by ordinary technicians in this field.

[0080] The display module includes a display panel 1, a chip-on-film 2 and a flexible circuit board 3. The display panel 1 transmits signals with the flexible circuit board 3 through the chip-on-film 2. The display module in this embodiment is a small-size display module. The binding area of ​​the display panel 1 is bent to the back of the display panel 1. The chip-on-film 2 is bound and connected to the display panel 1. The binding area of ​​the chip-on-film 2 used to bind to the flexible circuit board 3 is bent to a side of the chip-on-film 2 away from the display panel 1. The flexible circuit board 3 is located on a side of the chip-on-film 2 away from the display panel 1.

[0081] A heat dissipation film layer is disposed on the back of the display panel 1, the heat dissipation film layer includes a metal layer, the metal layer includes a main body area 51, the main body area 51 includes a first edge area 501, the orthographic projection of the first binding area on the heat dissipation film layer is at least partially located in the first edge area 501, along the circumferential direction of the main body area 51, the main body area 51 includes a second edge area other than the first edge area 501, the metal layer also includes a connecting portion 52 formed by at least part of the second edge area extending outward, the connecting portion 52 is bent to a side of the metal layer away from the display panel 1, so as to be electrically connected to the copper exposed area of ​​the flexible circuit board 3;

[0082] A support pad 6 is provided between the COF 2 and the heat dissipation film layer to ensure the bending radius of the display panel 1 and to support the COF 2 to ensure the flatness of the flat area of ​​the COF 2;

[0083] The flexible circuit board 3 includes a binding side for binding with the chip-on-film 2, and two non-binding sides arranged adjacent to the binding side. On at least one of the non-binding sides, the flexible circuit board 3 includes a first area 31 (reference Figure 3 ), an adhesive layer 4 is provided between the first region 31 and the heat dissipation film layer, and the adhesive layer 4 realizes the bonding and fixing of the flexible circuit board 3 and ensures the bending radius of the bending area of ​​the chip-on-film 2.

[0084] In the embodiment where the connection portion 52 is electrically connected to a surface of the flexible circuit board 3 close to the display panel 1, refer to Figure 1-Figure 7 , the display module assembly method comprises the following steps:

[0085] A polarizing film is attached to the light-emitting side of the display panel 1;

[0086] Binding and connecting the display panel 1 to the chip-on-film 2, and binding and connecting the chip-on-film 2 to the flexible circuit board 3;

[0087] Laminating a cover plate on the light-emitting side of the polarizer;

[0088] A heat dissipation film layer is attached to the back side (i.e., the backlight side) of the display panel 1;

[0089] The support pad 6 is attached to a surface of the heat dissipation film layer away from the display panel 1;

[0090] Bending the binding area of ​​the display panel 1 to the back side of the display panel 1;

[0091] The adhesive layer 4 is attached to a surface of the heat dissipation film layer away from the display panel 1;

[0092] The connecting portion 52 is bent so that the first connecting area of ​​the connecting portion 52 is located on the adhesive layer 4;

[0093] The binding area of ​​the COF 2 is bent to a side of the COF 2 away from the display panel 1 , so that the flexible circuit board 3 is bonded and fixed by the adhesive layer 4 and is electrically connected to the connection portion 52 .

[0094] In the embodiment where the connection portion 52 is electrically connected to a surface of the flexible circuit board 3 close to the display panel 1, refer to Figure 8-Figure 17 , the display module assembly method comprises the following steps:

[0095] A polarizing film is attached to the light-emitting side of the display panel 1;

[0096] Binding and connecting the display panel 1 to the chip-on-film 2, and binding and connecting the chip-on-film 2 to the flexible circuit board 3;

[0097] Laminating a cover plate on the light-emitting side of the polarizer;

[0098] A heat dissipation film layer is attached to the back side (i.e., the backlight side) of the display panel 1;

[0099] The support pad 6 is attached to a surface of the heat dissipation film layer away from the display panel 1;

[0100] Bending the binding area of ​​the display panel 1 to the back side of the display panel 1;

[0101] The adhesive layer 4 is attached to a surface of the heat dissipation film layer away from the display panel 1;

[0102] The binding area of ​​the chip-on-film 2 is bent to a side of the chip-on-film 2 away from the display panel 1, so that the flexible circuit board 3 is bonded and fixed by the adhesive layer 4;

[0103] The connecting portion 52 is bent so that the first connecting area of ​​the connecting portion 52 is electrically connected to the copper exposed area of ​​the side of the flexible circuit board 3 away from the display panel 1 .

[0104] An embodiment of the present invention further provides a display device, comprising the above-mentioned display module.

[0105] Exemplarily, the display module is applied to a vehicle-mounted steering wheel, such as a finger screen, a gear lever screen, a boss key screen, etc. on a vehicle-mounted steering wheel.

[0106] There are a few points to note:

[0107] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0108] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0109] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0110] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display module, characterized in that: The device comprises a display panel, a chip-on-chip film and a flexible circuit board, wherein the display panel is connected to the flexible circuit board via the chip-on-chip film, and in a first direction, the display panel has a display area and a first binding area located on one side of the display area, and the first binding area is bent to the back side of the display panel; In the first direction, the chip-on-film comprises a second binding area and a third binding area which are arranged opposite to each other, the second binding area is connected to the first binding area, and the chip-on-film is located on the back of the display panel; The third binding area is bent to a side of the COF away from the display panel, the flexible circuit board is connected to the third binding area, and the flexible circuit board is located on a side of the COF away from the display panel; The display module also includes a heat dissipation film layer arranged on the back side of the display panel, the heat dissipation film layer includes a metal layer, the metal layer includes a main area, the main area includes a first edge area, the orthographic projection of the first binding area on the heat dissipation film layer is at least partially located in the first edge area, along the circumferential direction of the main area, the main area includes a second edge area other than the first edge area, the metal layer also includes a connecting portion formed by extending outward from at least a portion of the second edge area, the connecting portion is bent to a side of the metal layer away from the display panel to be electrically connected to the flexible circuit board.

2. The display module according to claim 1, characterized in that: The connecting portion is electrically connected to a copper-exposed area on a side of the flexible circuit board close to the display panel, or the connecting portion is electrically connected to a copper-exposed area on a side of the flexible circuit board away from the display panel.

3. The display module according to claim 1, characterized in that: In a second direction, at least one side of the flexible circuit board includes a first area exposed to the chip-on-film arrangement, the second direction is perpendicular to the first direction, and the second direction is parallel to the light emitting surface of the display panel; An adhesive layer is provided between the first region and the metal layer, and the adhesive force of the adhesive layer is greater than 6000 gf / inch.

4. The display module according to claim 3, characterized in that: The bonding adhesive layer adopts VHB adhesive.

5. The display module according to claim 3, characterized in that: The main body area is rectangular, the second edge area includes a first sub-edge area arranged opposite to the first edge area, and a second sub-edge area and a third sub-edge area arranged adjacent to the first edge area, in the first direction, the first edge area and the first sub-edge area are arranged opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are arranged opposite to each other; At least a portion of the second sub-edge region and / or at least a portion of the third sub-edge region extends outward to form the connecting portion.

6. The display module according to claim 5, characterized in that: The connecting portion includes a first connecting area for electrically connecting to the flexible circuit board, the area of ​​the first connecting area is smaller than the area of ​​the bonding surface between the adhesive layer and the flexible circuit board, and under the bonding action of the adhesive layer and the flexible circuit board, the first connecting area is pressed onto a side of the flexible circuit board close to the display panel.

7. The display module according to claim 5, characterized in that: The connecting portion includes a first connecting area for electrically connecting to the flexible circuit board, and the first connecting area is electrically connected to a side of the flexible circuit board away from the display panel through a conductive adhesive.

8. The display module according to claim 5, characterized in that: A bending area is also arranged between the main area and the connecting portion, and a hollow pattern is arranged on the bending area.

9. The display module according to claim 3, characterized in that: The main body area is rectangular, the second edge area includes a first sub-edge area arranged opposite to the first edge area, and a second sub-edge area and a third sub-edge area arranged adjacent to the first edge area, in the first direction, the first edge area and the first sub-edge area are arranged opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are arranged opposite to each other; At least a portion of the first sub-edge region extends outward to form the connecting portion.

10. The display module according to claim 3, characterized in that: The main body area is rectangular, the second edge area includes a first sub-edge area arranged opposite to the first edge area, and a second sub-edge area and a third sub-edge area arranged adjacent to the first edge area, in the first direction, the first edge area and the first sub-edge area are arranged opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are arranged opposite to each other; At least a portion of the first sub-edge region extends outward to form the connecting portion, and at least a portion of the second sub-edge region and / or at least a portion of the third sub-edge region extends outward to form the connecting portion.

11. The display module according to claim 1, characterized in that: The area of ​​the display region is substantially the same as the area of ​​the flexible circuit board.

12. A display device, characterized in that: A display module comprising any one of claims 1-11.

13. The display device according to claim 12, characterized in that: The display module is applied to a vehicle steering wheel.

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