Display module
By setting a limiting member at the bent part of the crystal-covered film of the display module, an arc-shaped transition surface is formed, and the stress of the crystal-covered film is reduced, the problem of peeling off at the binding of the crystal-covered film and the array substrate is solved, and the stability of the display screen is improved.
Patent Information
- Application Number
- CN202420578166.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-22
AI Technical Summary
In the existing display module, the binding of the crystal-covered film and the array substrate is prone to peel off, resulting in abnormal display screens.
A display module is designed, including an array substrate, an opposing substrate, a backlight module, a crystal-covered film and a limiting member. The limiting member is arranged at the bent part of the crystal-covered film. By forming an arc-shaped transition surface, the stress of the crystal-covered film is reduced, and the risk of internal circuit breakage and peeling at the binding is reduced.
It effectively reduces the stress of the crystal-covered film, reduces the risk of internal circuit breakage and peeling at binding, and improves the stability of the display screen.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the field of display technology, and in particular to a display module. Background Art
[0002] With the development of display technology, narrow-frame display devices have become the mainstream in the market. In order to meet the market demand, chip on film (COF) is needed to achieve narrow-frame design. Figure 1 As shown, in order to pursue an extremely narrow frame and a better appearance experience, the setting space of the chip-on-chip film on the display module will be reduced, so that the chip-on-chip film is in a tight state. At this time, the bent part near the binding point of the chip-on-chip film and the array substrate will produce greater stress, and the greater stress will cause the internal circuit of the chip-on-chip film to break (crack) and the binding point of the chip-on-chip film and the array substrate to peel off (peeling), which will cause abnormal display images. Utility Model Content
[0003] The utility model provides a display module to alleviate the technical problem that the bonding position between the chip-on-chip film and the array substrate of the existing display module is peeled off, resulting in abnormal display images.
[0004] To solve the above problems, the technical solutions provided by the present invention are as follows:
[0005] The present invention provides a display module, which includes:
[0006] An array substrate;
[0007] An opposing substrate is disposed on one side of the array substrate, and one end of the array substrate protrudes from one end of the opposing substrate;
[0008] A backlight module, arranged on a side of the array substrate away from the counter substrate;
[0009] A chip-on-chip film is disposed on one side of the array substrate, the counter substrate and the backlight module; one end of the chip-on-chip film is connected to one end of the array substrate protruding from the counter substrate, and the other end is connected to the backlight module; the chip-on-chip film includes a first binding portion and a first bending portion connected, and the first binding portion is bound to the array substrate; and
[0010] A limiting component is arranged on the side of the first bending portion facing the array substrate, and the limiting component includes a plurality of adjacent limiting portions, wherein the size of the limiting portion from the end close to the chip-on-chip film is larger than the size of the end away from the chip-on-chip film, and the distance between two partially adjacent limiting portions gradually increases from the end close to the chip-on-chip film to the end away from the chip-on-chip film.
[0011] In the display module provided by an embodiment of the utility model, the plurality of limiting portions are arranged in sequence along the bending direction of the first bending portion, and in the bending direction of the first bending portion, the distance between adjacent limiting portions away from one end of the first bending portion first decreases and then increases.
[0012] In the display module provided by the embodiment of the utility model, the longitudinal cross-section of the limiting portion is a polygon.
[0013] In the display module provided by the embodiment of the utility model, the longitudinal cross-section shape of the limiting portion is at least one of an equilateral triangle, an isosceles triangle, and an isosceles trapezoid.
[0014] In the display module provided by an embodiment of the utility model, each of the limiting portions includes a first edge and a second edge and a third edge connected to both ends of the first edge, the first edge is arranged on the first bending portion, and the length of the first edge is negatively correlated with the number of the limiting portions.
[0015] In the display module provided by the embodiment of the present invention, the length of the first side ranges from 0.3 mm to 1 mm, and the number of the limiting portions ranges from 3 to 11.
[0016] In the display module provided by the embodiment of the present invention, when the length of the first side is 0.3 mm, the number of the limiting portions is 5 to 11.
[0017] In the display module provided by the embodiment of the present invention, when the length of the first side is 0.5 mm, the number of the limiting portions is 4 to 6.
[0018] In the display module provided by the embodiment of the present utility model, the number of the limiting members is at least three, and the three limiting members are arranged along the extension direction of the bending axis of the first bending portion.
[0019] In the display module provided by an embodiment of the utility model, the display module also includes a circuit board arranged on a side of the backlight module away from the array substrate; the chip-on-film also includes adjacent second binding portions and second bending portions, the second binding portions are bound to the circuit board, and the backlight module is provided with an arc chamfer at a position corresponding to the second bending portion.
[0020] The beneficial effects of the utility model are as follows: in the display module provided by the utility model, the display module includes an array substrate, an opposing substrate, a backlight module, a chip-on-chip film and a limiting component, the opposing substrate is arranged on one side of the array substrate, one end of the array substrate protrudes from one end of the opposing substrate, and the backlight module is arranged on a side of the array substrate away from the opposing substrate; the chip-on-chip film is arranged on one side of the array substrate, the opposing substrate and the backlight module; one end of the chip-on-chip film is connected to one end of the array substrate protruding from the opposing substrate, and the other end is connected to the backlight module The optical module, the chip-on-chip film includes a first binding portion and a first bending portion which are connected, the first binding portion is bound to the array substrate, a limiting member is arranged on the side of the first bending portion facing the array substrate, the first bending portion forms an arc-shaped transition surface through the limiting member to reduce the stress of the first bending portion, thereby reducing the risk of internal circuit breakage of the chip-on-chip film and peeling off at the binding point of the chip-on-chip film and the array substrate, thereby improving the problem of abnormal display screen caused by peeling off at the binding point of the chip-on-chip film and the array substrate of the existing display module. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 The figure is a schematic cross-sectional structure diagram of a display module in the prior art.
[0023] Figure 2 A schematic cross-sectional structure diagram of a display module provided in an embodiment of the utility model.
[0024] Figure 3 for Figure 2 A schematic diagram of the structure when the flip chip film is flattened.
[0025] Figure 4 for Figure 3 Detailed structural diagram of the middle limiting component.
[0026] Figure 5 for Figure 4 Schematic diagram of the longitudinal section structure of the middle limiting component.
[0027] Figure 6 Another structural schematic diagram of the limiting component provided in an embodiment of the utility model. DETAILED DESCRIPTION
[0028] The description of the following embodiments is with reference to the attached diagrams to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, rather than to limit the present invention. In the figures, units with similar structures are represented by the same reference numerals. In the accompanying drawings, the thickness of some layers and regions is exaggerated for clear understanding and ease of description. That is, the size and thickness of each component shown in the drawings are shown arbitrarily, but the present invention is not limited to this.
[0029] Please refer to Figures 2 to 5 , Figure 2 A schematic cross-sectional structure diagram of a display module provided by an embodiment of the utility model, Figure 3 for Figure 2 A schematic diagram of the structure of the flip chip film when it is flattened. Figure 4 for Figure 3 Detailed structural diagram of the middle limit component. Figure 5 for Figure 4 Schematic diagram of the longitudinal section structure of the middle limiting component. Figure 2 The display module 100 includes an array substrate 10, an opposing substrate 20, a backlight module 30, a COF 40 and a limiting member 50. The opposing substrate 20 is arranged on one side of the array substrate 10, and one end of the array substrate 10 protrudes from one end of the opposing substrate 20, that is, the opposing substrate 20 exposes the edge area of the array substrate 10. The backlight module 30 is arranged on the side of the array substrate 10 away from the opposing substrate 20. The opposing substrate 20 may be a color filter substrate, and a liquid crystal layer is further arranged between the color filter substrate and the array substrate 10.
[0030] The chip-on-chip film 40 is arranged on one side of the array substrate 10, the opposing substrate 20 and the backlight module 30; one end of the chip-on-chip film 40 is connected to one end of the array substrate 10 protruding from the opposing substrate 20, and the other end is connected to the backlight module 30, that is, the chip-on-chip film 40 is arranged in the edge area of the array substrate 10, and is bent from the edge area to the side of the backlight module 30 away from the array substrate 10, and the chip-on-chip film 40 includes a connected first binding portion 41 and a first bending portion 42, and the first binding portion 41 is bound to the array substrate 10. The limiting member 50 is arranged on the side of the first bending portion 42 facing the array substrate 10. The first bending portion 42 forms an arcuate transition surface 420 through the limiting of the limiting member 50 to reduce the stress of the first bending portion 42. This can reduce the risk of internal circuit breakage of the chip-on-chip film 40 and peeling off at the binding point between the chip-on-chip film 40 and the array substrate 10, thereby improving the problem of abnormal display screen caused by peeling off at the binding point between the chip-on-chip film and the array substrate of the existing display module.
[0031] Specifically, continue to refer to Figure 2 The array substrate 10 is arranged opposite to the counter substrate 20, and the size of the counter substrate 20 is smaller than that of the array substrate 10, so that the array substrate 10 has an exposed portion relative to the counter substrate 20, and the exposed portion is the edge area of the array substrate 10. The edge area is used to set binding traces, etc., as the binding area of the array substrate 10.
[0032] The backlight module 30 is arranged opposite to the array substrate 10 and bonded to the array substrate 10. The backlight module 30 is used to provide backlight for the display module 100. The backlight module 30 includes a back plate 31, a plastic frame 32 and an optical element 33. The back plate 31 is a metal back plate, and the plastic frame 32 is adapted to the back plate 31 to support and fix the array substrate 10 and the opposing substrate 20. The back plate 31 is formed with a receiving cavity, and the optical element 33 is arranged in the receiving cavity. The optical element 33 may include a light source, a light guide plate, a diffuser, a brightness enhancement film, etc.
[0033] The display module 100 further includes a circuit board 60 disposed on a side of the backlight module 30 away from the array substrate 10. The circuit board 60 may be fixed on a side of the back plate 31 away from the optical element 33. The chip-on-film 40 is connected between the array substrate 10 and the circuit board 60. Specifically, one end of the chip-on-film 40 is bound to the array substrate 10 at an edge region of the array substrate 10, and the other end of the chip-on-film 40 is bound to the circuit board 60. The chip-on-film 40 includes an adjacent first binding portion 41 and a first bending portion 42, and the first binding portion 41 is bound to the array substrate 10. The chip-on-film 40 further includes an adjacent second binding portion 43 and a second bending portion 44, and the second binding portion 43 is bound to the circuit board 60. Optionally, the chip-on-film 40 further includes an intermediate transition portion 45 located between the first bending portion 42 and the second bending portion 44, and the intermediate transition portion 45 is arranged corresponding to the plastic frame 32 of the backlight module 30. A driving integrated circuit 401 is disposed on the COF 40 . The driving integrated circuit 401 is electrically connected to the array substrate 10 and the circuit board 60 through circuits in the COF 40 .
[0034] Optionally, the display module 100 further includes a front frame 70, and the front frame 70 is bonded to the opposing substrate 20. In order to achieve a narrow frame, the gap between the front frame 70 and the backlight module 30 is reduced, so that the space for setting the chip-on-film 40 is reduced, and the chip-on-film 40 is in a tight state. It can be understood that when the chip-on-film 40 is in a tight state, the bending part near the binding place of the chip-on-film 40 and the array substrate 10 will produce a large stress, and the large stress will cause the internal circuit of the chip-on-film 40 to break and the binding place of the chip-on-film 40 and the array substrate 10 to peel off, thereby causing abnormal display images. The utility model provides the limiting member 50 corresponding to the first bending portion 42 of the chip-on-film 40, and the limiting member 50 can limit the bending curvature of the first bending portion 42, so that the first bending portion 42 forms an arc transition surface 420 through the limiting of the limiting member 50, so as to reduce the stress of the first bending portion 42.
[0035] In one embodiment, the backlight module 30 is provided with an arc chamfer 320 at a position corresponding to the second bending portion 44, and the arc chamfer 320 can limit the bending curvature of the second bending portion 44, so that the second bending portion 44 forms an arc transition surface 420 through the limitation of the arc chamfer 320 to reduce the stress of the second bending portion 44.
[0036] The specific structure of the limiting member 50 will be described in detail below:
[0037] Reference Figure 3 , the number of the limiting members 50 is at least three, and the three limiting members 50 are arranged along the extension direction Y of the bending axis O of the first bending portion 42. For example, in the extension direction Y of the bending axis O of the first bending portion 42, one of the three limiting members 50 is located in the middle area of the first bending portion 42 of the COF 40, and the other two are located at both ends of the first bending portion 42. In this way, by setting a suitable number of limiting members 50 and setting them in appropriate positions, while reducing the stress of the first bending portion 42, the amount of material used to set the limiting members 50 can also be reduced to reduce costs. Among them, the extension direction Y of the bending axis of the first bending portion 42 is perpendicular to the bending direction X of the first bending portion 42.
[0038] Optionally, the material of the limiting member 50 is a material with a high thermal conductivity, such as copper, aluminum or graphene. By selecting a material with a high thermal conductivity to form the limiting member 50, the heat dissipation of the chip-on-film 40 can be facilitated. The limiting member 50 can be fixed to the chip-on-film 40 by adhesive bonding or the like. When the adhesive bonding fixing method is adopted, a thermally conductive adhesive can be used to further facilitate the heat dissipation of the chip-on-film 40.
[0039] Reference Figure 4 and Figure 5 The limiting member 50 includes a plurality of adjacent limiting portions 51, the size of the limiting portion 51 from the end close to the COF 40 is larger than the size of the end away from the COF 40, and the distance between two adjacent limiting portions 51 gradually increases from the end close to the COF 40 to the end away from the COF 40. The plurality of limiting portions 51 are sequentially arranged along the bending direction X of the first bending portion 42, and in the bending direction X of the first bending portion 42, the distance between the adjacent limiting portions 51 away from the end of the first bending portion 42 first decreases and then increases. For example, the first bending portion 42 includes a first sub-bending portion and a second sub-bending portion and a third sub-bending portion located at both ends of the first sub-bending portion, and the end of the third sub-bending portion away from the first sub-bending portion is connected to the array substrate 10. Among them, the distance between two adjacent limiting portions 51 corresponding to the first sub-bending portion and away from one end of the first sub-bending portion is smaller than the distance between two adjacent limiting portions 51 corresponding to the second sub-bending portion and away from one end of the second sub-bending portion, and is smaller than the distance between two adjacent limiting portions 51 corresponding to the third sub-bending portion and away from one end of the third sub-bending portion.
[0040] When the limiting member 50 is in a flattened state, there is a gap between two adjacent limiting portions 51. Optionally, in two adjacent limiting portions 51, the gap between the tops of the two limiting portions 51 is larger than the gap between the bottoms, wherein the bottoms of the limiting portions 51 are in contact with the COF 40, and the tops of the limiting portions 51 are away from the COF 40. When the limiting member 50 is in a bent state, the two adjacent limiting portions 51 are pressed against each other to limit the bending curvature of the first bending portion 42 of the COF 40, so as to reduce the bending stress.
[0041] The longitudinal cross-section of the limiting portion 51 is a polygon, for example, the longitudinal cross-section of the limiting portion 51 is at least one of a regular or irregular triangle, a quadrilateral, a pentagon, a hexagon, etc. For example, when the longitudinal cross-section of the limiting portion 51 is a triangle, it may be an equilateral triangle, an isosceles triangle, etc.; when the longitudinal cross-section of the limiting portion 51 is a quadrilateral, it may be an isosceles trapezoid, etc. This embodiment is described by taking the longitudinal cross-section of the limiting portion 51 as an equilateral triangle as an example.
[0042] Continue to refer to Figure 4 and Figure 5 Each of the limiting portions 51 includes a first side 511 and a second side 512 and a third side 513 connected to both ends of the first side 511. The first side 511 is disposed on the first bending portion 42. The length of the first side 511 is negatively correlated with the number of the limiting portions 51, wherein the negative correlation means that the length of the first side 511 decreases as the number of the limiting portions 51 increases. Optionally, the length of the first side 511 ranges from 0.3 mm to 1 mm, and the number of the limiting portions 51 is 3 to 11. For example, when the length of the first side 511 is 0.3 mm, the number of the limiting portions 51 is 5 to 11; when the length of the first side 511 is 0.5 mm, the number of the limiting portions 51 is 4 to 6; when the length of the first side 511 is 1 mm, the number of the limiting portions 51 is 3 to 6.
[0043] Further, in two adjacent limiting parts 51, the second side 512 of one limiting part 51 is opposite to the third side 513 of the other limiting part 51. When the limiting member 50 is in a flattened state, the angle between the second side 512 and the third side 513 is a, and the range of the angle a is 10 degrees to 60 degrees. The length of the first side 511 is positively correlated with the size of the angle a, wherein the positive correlation means that the length of the first side 511 increases with the increase of the angle a, for example, when the length of the first side 511 is 0.3 mm, the range of the angle a is 10 degrees to 30 degrees; when the length of the first side 511 is 0.5 mm, the range of the angle a is 15 degrees to 60 degrees; when the length of the first side 511 is 1 mm, the range of the angle a is 20 degrees to 60 degrees. When the limiting member 50 is in a bent state, the angle between the second side 512 and the third side 513 is b; wherein a is greater than b, a is greater than 0 degrees, and b is greater than or equal to 0 degrees.
[0044] In one embodiment, referring to Figures 2 to 6 , Figure 6 Another structural schematic diagram of a limiting member provided in an embodiment of the utility model. Different from the above embodiment, the longitudinal cross-section of the limiting portion 51 is an isosceles trapezoid, and each limiting portion 51 also includes a first side 511 and a second side 512 and a third side 513 connected to both ends of the first side 511, and the first side 511 is arranged on the first bending portion 42. For other descriptions, please refer to the above embodiment, which will not be repeated here.
[0045] According to the above embodiments, it can be seen that:
[0046] The utility model provides a display module, which comprises an array substrate, an opposing substrate, a backlight module, a chip-on-cover film and a limiting component. The opposing substrate is arranged on one side of the array substrate, one end of the array substrate protrudes from one end of the opposing substrate, and the backlight module is arranged on a side of the array substrate away from the opposing substrate; the chip-on-cover film is arranged on one side of the array substrate, the opposing substrate and the backlight module; one end of the chip-on-cover film is connected to one end of the array substrate protruding from the opposing substrate, and the other end is connected to the backlight module; the chip-on-cover film comprises a connected first binding portion and a first bending portion, the first binding portion is bound to the array substrate, and the limiting component is arranged on a side of the first bending portion facing the array substrate, the first bending portion forms an arc-shaped transition surface through the limiting of the limiting component to reduce the stress of the first bending portion, so that the risk of internal circuit of the chip-on-cover film being broken and the risk of peeling off at the binding point of the chip-on-cover film and the array substrate can be reduced, thereby improving the problem of abnormal display screen caused by peeling off at the binding point of the chip-on-cover film and the array substrate in the existing display module.
[0047] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0048] The above is a detailed introduction to the embodiments of the utility model. Specific examples are used in this article to illustrate the principles and implementation methods of the utility model. The description of the above embodiments is only used to help understand the technical solution and core idea of the utility model. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.
Claims
1. A display module, characterized in that: include: An array substrate; An opposing substrate is disposed on one side of the array substrate, and one end of the array substrate protrudes from one end of the opposing substrate; A backlight module, arranged on a side of the array substrate away from the counter substrate; A chip-on-chip film is disposed on one side of the array substrate, the counter substrate and the backlight module; one end of the chip-on-chip film is connected to an end of the array substrate protruding from the counter substrate, and the other end is connected to the backlight module; The chip-on-film comprises a first binding portion and a first bending portion connected to each other, and the first binding portion is bound to the array substrate; as well as A limiting component is arranged on the side of the first bending portion facing the array substrate, and the limiting component includes a plurality of adjacent limiting portions, wherein the size of the limiting portion from the end close to the chip-on-chip film is larger than the size of the end away from the chip-on-chip film, and the distance between two partially adjacent limiting portions gradually increases from the end close to the chip-on-chip film to the end away from the chip-on-chip film.
2. The display module according to claim 1, characterized in that: The plurality of limiting portions are arranged in sequence along the bending direction of the first bending portion, and in the bending direction of the first bending portion, the distance between adjacent limiting portions away from one end of the first bending portion first decreases and then increases.
3. The display module according to claim 2, characterized in that: The longitudinal cross-section of the limiting portion is in a polygonal shape.
4. The display module according to claim 3, characterized in that: The longitudinal cross-section of the limiting portion is in a shape of at least one of an equilateral triangle, an isosceles triangle, and an isosceles trapezoid.
5. The display module according to claim 3, characterized in that: Each of the limiting portions includes a first side and a second side and a third side connected to two ends of the first side. The first side is arranged on the first bending portion, and the length of the first side is negatively correlated with the number of the limiting portions.
6. The display module according to claim 5, characterized in that: The length of the first side ranges from 0.3 mm to 1 mm, and the number of the limiting portions ranges from 3 to 11.
7. The display module according to claim 6, characterized in that: When the length of the first side is 0.3 mm, the number of the limiting portions is 5 to 11.
8. The display module according to claim 6, characterized in that: When the length of the first side is 0.5 mm, the number of the limiting portions is 4 to 6.
9. The display module according to any one of claims 1 to 8, characterized in that: The number of the limiting members is at least three, and the three limiting members are arranged along the extending direction of the bending axis of the first bending portion.
10. The display module according to any one of claims 1 to 8, characterized in that: The display module also includes a circuit board arranged on a side of the backlight module away from the array substrate; the flip chip film also includes adjacent second binding portions and second bending portions, the second binding portions are bound to the circuit board, and the backlight module is provided with an arc chamfer at a position corresponding to the second bending portion.