Semiconductor packaging machine

Abstract

The invention provides a semiconductor packaging machine, which belongs to the technical field of semiconductor packaging shearing, and comprises a conveying frame, the conveying frame is connected with a first conveying belt and a second conveying belt, the surface of the first conveying belt is provided with a semiconductor strip, the inner side wall of the conveying frame is fixedly connected with a barrier strip, and the conveying frame is connected with an upper driving assembly and a lower driving assembly. The upper driving assembly comprises a pair of upper rotating plates, the lower driving assembly comprises a pair of lower rotating plates, and the device further comprises a fixing assembly which can absorb current generated by a semiconductor; the rib cutting assembly can be used for cooling the pin needing to be subjected to rib cutting, and the local air humidity is improved; and the bearing assembly is matched with the fixing assembly to fix the independent semiconductor. The method has the beneficial effects that the working efficiency can be improved, meanwhile, heat generated by cutting can be reduced, the humidity of a local space is increased, static electricity is avoided, the chip performance is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging shearing, and in particular to a semiconductor packaging machine. Background Art

[0002] In the semiconductor chip packaging process, after the chip injection and cooling are completed, the multiple chip units on the lead rack need to be cut off one by one, and the chip pins need to be bent and shaped while cutting, finally forming a finished chip. The finished chip can be packaged after testing.

[0003] Semiconductors are usually made by installing various semiconductor chips on a lead frame using multiple pins and then forming a package on the lead frame. The package and a section of the pins are then cut off from the overall frame of the semiconductor device to form a single semiconductor. The pins are shaped during the cutting process, and this process is called "cutting the ribs". When cutting the chips on the lead frame, the existing semiconductor packaging machine generally processes them by reciprocating the upper clamp up and down in coordination with the lower clamp. This requires the upper clamp's drive device to start and stop frequently to change the upper clamp's moving direction. However, this cutting method is generally inefficient, and the semiconductor chip is pre-treated before cutting, such as cleaning and grounding, to reduce initial static electricity. However, if cutting is performed in a dry environment for a long time, static electricity may still be generated during the cutting process. This static electricity may accumulate in the cutting area, and may discharge after accumulating to a certain extent, resulting in an increase in current density. This discharge will cause damage to the semiconductor material, such as breakdown, ablation, etc., seriously affecting the reliability and life of the chip. In addition, high current density will cause the temperature of the cutting area to rise, expand the heat-affected area, and thus reduce the cutting accuracy. How to invent a semiconductor packaging machine to solve these problems has become an urgent problem for those skilled in the art. Summary of the invention

[0004] In order to make up for the above deficiencies, the present invention provides a semiconductor packaging machine, which aims to solve the problems that the transmission clamp efficiency is average and static electricity will appear during the cutting process, thereby causing damage to the semiconductor chip and affecting the performance.

[0005] The present invention is achieved in that: The present invention provides a semiconductor packaging machine, comprising a conveyor frame, the conveyor frame is connected with a conveyor belt 1 and a conveyor belt 2, a semiconductor strip is arranged on the surface of the conveyor belt 1, a blocking strip is fixedly connected to the inner side wall of the conveyor frame, the conveyor frame is connected with an upper driving assembly and a lower driving assembly, the upper driving assembly comprises an upper rotating plate, the lower driving assembly comprises a lower rotating plate, the upper rotating plate and the lower rotating plate are each provided with a pair, and further comprising: A fixed component, the fixed component is located between the two upper rotating plates, and the fixed component can absorb the current generated by the semiconductor; A rib cutting assembly, which is located between the two upper rotating plates and can cool down the pins that need rib cutting and increase the local air humidity; A supporting component is located between the two lower rotating plates, and the supporting component cooperates with the fixing component to fix a separate semiconductor.

[0006] Preferably, the upper driving assembly also includes a driving motor 1 and an upper supporting seat, the driving motor 1 is fixedly connected to the side wall of the upper supporting seat, the upper supporting seat is fixedly connected to the conveying frame, the upper supporting seat is located on the outer side of the upper rotating plate, the side wall of the upper rotating plate is fixedly connected with a rotating shaft 1, the rotating shaft 1 passes through the side wall of the upper supporting seat and is fixedly connected to the output end of the driving motor 1, and the two upper rotating plates are symmetrical about the center line of the conveying frame.

[0007] Preferably, the lower driving assembly also includes a second driving motor and a lower supporting seat, the second driving motor is fixedly connected to the side wall of the lower supporting seat, the lower supporting seat is fixedly connected to the lower side wall of the conveying frame, the lower supporting seat is located on the outer side of the lower rotating plate, the lower rotating plate is fixedly connected with a second rotating shaft, one end of the second rotating shaft passes through the side wall of the lower supporting seat and is fixedly connected to the output end of the second driving motor, and the two lower rotating plates are symmetrical about the center line of the conveying frame.

[0008] Preferably, the rib cutting assembly includes a rib cutting blade, a telescopic airbag, a liquid storage box and a side panel, the two ends of the side panel are respectively fixedly connected to the opposite side walls of the two upper rotating plates, one side of the side panel is fixedly connected to the rib cutting blade, and the other side of the side panel is fixedly connected to the liquid storage box, the telescopic airbag is located on the inner side of the rib cutting blade, one end of the telescopic airbag is fixedly connected to the side panel, and connecting hoses are provided on both sides of the telescopic airbag.

[0009] Preferably, the two ends of the connecting hose are respectively fixedly connected to the side wall of the telescopic airbag and the side wall of the rib cutting blade, an air guide groove is provided at the connection between the rib cutting blade and the connecting hose, a diversion cavity is provided inside one end of the rib cutting blade, the diversion cavity is connected to an opening at one end of the air guide groove, an exhaust hole is provided between the inner wall of the diversion cavity and the side wall of the rib cutting blade, a docking hole is provided on the inner wall of one side of the air guide groove, an absorbent cotton strip is fixedly connected to the inside of the docking hole, and one end of the absorbent cotton strip passes through the side wall of the liquid storage box.

[0010] Preferably, the fixing assembly includes a pressure plate, a limiting rod and a buffer spring, the pressure plate is located on the inner side of the rib cutting blade, one end of the limiting rod passes through the side wall of the side plate and is fixedly connected to the pressure plate, the buffer spring is sleeved on the outer wall of the limiting rod, the two ends of the buffer spring are respectively fixedly connected to the side wall of the pressure plate and the side wall of the side plate, and the pressure plate is fixedly connected to one end of the telescopic airbag away from the side plate.

[0011] Preferably, one end of the pressure plate away from the limiting rod is fixedly connected to a pressure strip, the pressure strip is made of rubber, a cavity is opened inside the pressure plate, a diffusion plate is fixedly connected to the inner wall of the cavity, and an absorption partition is fixedly connected to one side of the diffusion plate.

[0012] Preferably, the side wall of the pressure plate is connected with a conductive rod and an elastic member, the conductive rod is arranged in a "T" shape, one end of the conductive rod passes through the inner wall of the cavity, the elastic member is sleeved on the outer wall of the conductive rod, and the two ends of the elastic member are respectively fixedly connected to the side wall of one end of the conductive rod and the side wall of the pressure plate.

[0013] Preferably, the supporting assembly comprises a supporting plate, one side of the supporting plate is fixedly connected to a fixing rod, and both ends of the fixing rod are respectively fixedly connected to the side walls of the two lower rotating plates.

[0014] Preferably, one end of the supporting plate away from the fixing rod is fixedly connected with a cutting strip and a supporting strip, and the cutting strip is located outside the supporting strip.

[0015] The beneficial effects of the present invention are: In the process of cutting the ribs of semiconductors, the frequent activation of the original rib cutting mechanism is avoided by fixing components and supporting components, thereby improving work efficiency. In addition, in the process of cutting the ribs, the telescopic airbag and the rib cutting blade can not only blow away the slight dust on the surface of the component, but also reduce the heat generated during the cutting, reduce damage to the component, and improve the performance of the semiconductor. It can also increase the diffusion rate of water on the surface of the absorbent cotton strip to increase the humidity of the local space, thereby avoiding the occurrence of static electricity during the cutting process, avoiding damage to semiconductor materials, and improving the reliability and life of the chip. At the same time, it can also reduce the temperature in the air to improve the cooling effect, which can effectively reduce the heat generated when the chip pins are cut. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall front structure of a semiconductor packaging machine provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the overall rear side structure of a semiconductor packaging machine provided by an embodiment of the present invention; Figure 3 It is a schematic structural diagram of an upper driving assembly and a lower driving assembly of a semiconductor packaging machine provided by an embodiment of the present invention; Figure 4 It is a schematic structural diagram of a rib cutting assembly and a supporting assembly of a semiconductor packaging machine provided by an embodiment of the present invention; Figure 5 It is a schematic structural diagram of a rib cutting assembly of a semiconductor packaging machine provided by an embodiment of the present invention; Figure 6 It is a partial structural cross-sectional view of a semiconductor packaging machine pressing plate and a rib cutting blade provided by an embodiment of the present invention; Figure 7 It is a partial structural cross-sectional view of a semiconductor packaging machine cutter provided by an embodiment of the present invention; Figure 8 It is a partial schematic diagram of a half-section structure of an upper drive assembly, a lower drive assembly and a conveyor frame of a semiconductor packaging machine provided by an embodiment of the present invention.

[0018] In the figure: 1, conveying rack; 2, fixing assembly; 21, pressure strip; 22, pressure plate; 221, cavity; 222, diffusion plate; 223, absorption partition; 23, conductive rod; 24, limit rod; 25, buffer spring; 26, elastic member; 3, rib cutting assembly; 31, rib cutting blade; 311, exhaust hole; 312, diversion cavity; 313, air guide groove; 314, docking hole; 32, telescopic airbag; 33, liquid storage box; 34, connecting hose; 35, Side panel; 36, absorbent cotton strip; 4, upper drive assembly; 41, drive motor 1; 42, upper support seat; 43, upper rotating plate; 44, rotating shaft 1; 5, lower drive assembly; 51, drive motor 2; 52, lower support seat; 53, lower rotating plate; 54, rotating shaft 2; 6, supporting assembly; 61, supporting plate; 611, cutting strip; 612, supporting strip; 62, fixing rod; 7, semiconductor strip; 8, conveyor belt 1; 9, stop bar; 10, conveyor belt 2. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Example, see Figure 1-Figure 8A semiconductor packaging machine includes a conveyor frame 1, the conveyor frame 1 is connected to a conveyor belt 1 8 and a conveyor belt 2 10, a semiconductor strip 7 is provided on the surface of the conveyor belt 1 8, a blocking strip 9 is fixedly connected to the inner side wall of the conveyor frame 1, the conveyor frame 1 is connected to an upper driving assembly 4 and a lower driving assembly 5, the upper driving assembly 4 includes an upper rotating plate 43, the lower driving assembly 5 includes a lower rotating plate 53, the upper rotating plate 43 and the lower rotating plate 53 are each provided with a pair, and further includes: A fixed component 2, the fixed component 2 is located between the two upper rotating plates 43, and the fixed component 2 can absorb the current generated by the semiconductor; The rib cutting assembly 3 is located between the two upper rotating plates 43. The rib cutting assembly 3 can cool down the pins that need to be cut and increase the local air humidity; The supporting assembly 6 is located between the two lower rotating plates 53 . The supporting assembly 6 cooperates with the fixing assembly 2 to fix a single semiconductor.

[0021] Furthermore; the upper driving assembly 4 also includes a driving motor 1 41 and an upper supporting seat 42, the driving motor 1 41 is fixedly connected to the side wall of the upper supporting seat 42, the upper supporting seat 42 is fixedly connected to the conveying frame 1, the upper supporting seat 42 is located at the outer side of the upper rotating plate 43, the side wall of the upper rotating plate 43 is fixedly connected with a rotating shaft 1 44, the rotating shaft 1 44 passes through the side wall of the upper supporting seat 42 and is fixedly connected to the output end of the driving motor 1 41, and the two upper rotating plates 43 are symmetrical about the center line of the conveying frame 1; the lower driving assembly 5 also includes a driving motor 2 51 and a lower supporting seat 52, the driving motor 2 51 is fixedly connected to the side wall of the lower supporting seat 52, the lower supporting seat 52 is fixedly connected to the lower side wall of the conveying frame 1, the lower supporting seat 52 is located at the outer side of the lower rotating plate 53, the lower rotating plate 53 is fixedly connected with a rotating shaft 2 54, one end of the rotating shaft 2 54 passes through the side wall of the lower supporting seat 52 and is fixedly connected to the output end of the driving motor 2 51, and the two lower rotating plates 53 are symmetrical about the center line of the conveying frame 1.

[0022] It should be noted that: drive motor 1 41 and drive motor 2 51 are important driving devices in the process of cutting the ribs of the semiconductor strip 7. Drive motor 1 41 drives the upper rotating plate 43 to realize the counterclockwise rotation of multiple fixed components 2 and the rib cutting component 3, while drive motor 2 51 is the key to realize the clockwise rotation of the supporting component 6 through the lower rotating plate 53, and the supporting component 6 corresponds to multiple fixed components 2 and the rib cutting component 3 one by one; in the process of cutting the ribs of the semiconductor strip 7, first start the conveyor belt 1 8 and the conveyor belt 2 10 to start working, and the semiconductor strip 7 is transferred to the side of the rib cutting component 3 through the conveyor belt 1 8. In the process of a single component on the semiconductor strip 7 being separated from the conveyor belt 1 8, the supporting plate 61 in the supporting component 6 first lifts the lower end of the component. At this time, the corresponding pressure strip 21 in the fixed component 2 gradually contacts the surface of the component. The pressure strip 21 made of rubber material not only has an insulating effect but also can buffer and protect the surface of the semiconductor component. During the continuous rotation, the supporting plate 61 gradually tends to be horizontal, and the pressure exerted by the pressure bar 21 on the component through the action of the pressure plate 22 gradually increases. When the pressure plate 22 is in a horizontal position, the pressure of the pressure bar 21 reaches a maximum value, and at the same time, the single component also completes the rib cutting process. The cut single component will be located on the upper surface of the support plate 61. As the rotation process continues, the pressure bar 21 will separate from the component surface. At this moment, the pressure bar 21 is no longer squeezed and fixed. Through the inclination of the support plate 61 and the action of the component's own gravity, the component can be lifted by the baffle 9 and then slide into the surface of the conveyor belt 210 for transportation. The baffle 9 is set in a "convex" shape. The length of the end of the baffle 9 close to the support plate 61 is less than the distance between the two support bars 612 on the surface of the support plate 61. Through such a setting, not only can the component be lifted, but also the interference with the movement of the support plate 61 can be avoided, thereby ensuring the normal rotation of the support plate 61. Through the above-mentioned operation method, when cutting the semiconductor strip 7, the up and down pause process in the traditional punching process can be effectively avoided, thereby improving work efficiency.

[0023] Reference Figure 2-Figure 7, further; the fixing assembly 2 includes a pressing plate 22, a limiting rod 24 and a buffer spring 25, the pressing plate 22 is located on the inner side of the rib cutting blade 31, one end of the limiting rod 24 passes through the side wall of the side plate 35 and is fixedly connected to the pressing plate 22, the buffer spring 25 is sleeved on the outer wall of the limiting rod 24, and the two ends of the buffer spring 25 are respectively fixedly connected to the side wall of the pressing plate 22 and the side wall of the side plate 35, and the pressing plate 22 is fixedly connected to one end of the telescopic airbag 32 away from the side plate 35; the end of the pressing plate 22 away from the limiting rod 24 is fixedly connected to the pressure strip 21, the pressure strip 21 is made of rubber, a cavity 221 is opened inside the pressing plate 22, and the inner wall of the cavity 221 is fixedly connected to the diffusion plate 222, and one side of the diffusion plate 222 is fixed The pressure plate 22 is fixedly connected with an absorption partition 223; the side wall of the pressure plate 22 is connected with a conductive rod 23 and an elastic member 26, the conductive rod 23 is arranged in a "T" shape, one end of the conductive rod 23 passes through the inner wall of the cavity 221, and the elastic member 26 is sleeved on the outer wall of the conductive rod 23, and the two ends of the elastic member 26 are respectively fixedly connected to the side wall of one end of the conductive rod 23 and the side wall of the pressure plate 22; the supporting assembly 6 includes a supporting plate 61, one side of the supporting plate 61 is fixedly connected with a fixing rod 62, and the two ends of the fixing rod 62 are respectively fixedly connected to the side walls of the two lower rotating plates 53; the end of the supporting plate 61 away from the fixing rod 62 is fixedly connected with a cutting strip 611 and a supporting strip 612, and the cutting strip 611 is located on the outside of the supporting strip 612.

[0024] It should be noted that: in the process of cutting the ribs of the component, the component can be fixed by the mutual cooperation of the pressure strip 21 and the supporting strip 612 to prevent the problem of component position displacement during the cutting process and affecting the processing quality. In the process of fixing the pressure strip 21, the pressure plate 22 will be driven to move toward the side of the side plate 35. At this time, the pressure plate 22 not only drives the limit rod 24 to move but also compresses the buffer spring 25. The advantage of this is that the stress generated during the extrusion can be absorbed during the fixing of the component to avoid the component from being broken due to the application of external force. In addition, the length of the conductive rod 23 is greater than the distance between the end surface of the pressure strip 21 and the pressure plate 22. Therefore, in the process of fixing the component, one end of the conductive rod 23 will contact the surface of the component, so that one end of the conductive rod 23 gradually shrinks to the inside of the cavity 221, and the conductive rod 23 is gradually compressed. The end of the electric rod 23 away from the element will contact the diffusion plate 222. The diffusion plate 222 adopts a closely arranged grid structure. This structure can better absorb current by increasing the surface area and reducing the porosity. At the same time, the absorption partition 223 arranged in a lightning shape can effectively absorb the current formed when the cutting blade 31 cuts the semiconductor pin. The free electrons and holes inside the semiconductor will move in a directional manner under the action of the electric field force, thereby avoiding the increase of local temperature and reducing the damage to the semiconductor. The diffusion plate 222 and the absorption partition 223 can be made of conductive metal materials such as copper or aluminum. This material not only has good conductive effect, but also has high heat dissipation efficiency. In addition, the conductive rod 23 can be made of a material with good conductivity such as metal powder, carbon fiber, etc. mixed with a polymer matrix, which has a certain elasticity while ensuring the conductive effect. When the pressure plate 22 and the supporting plate 61 are both in the horizontal position, the pressure plate 22 moves to the highest position and shrinks into the inside of the rib cutting blade 31. At this time, the cutting end of the rib cutting blade 31 protrudes, thereby cooperating with the action of the cutting strip 611 to squeeze each other to complete the cutting of all the component pins. In the process of the pressure plate 22 and the supporting plate 61 approaching each other, one end of the two will approach each other first, so that the pins on one side of the component may be cut by the rib cutting blade 31 and the cutting strip 611 first, but this situation does not affect the overall cutting effect, and local cutting first can also reduce heat accumulation and avoid heat concentration and damage to the component.

[0025] Reference Figure 4-Figure 8, further; the rib cutting assembly 3 includes a rib cutting blade 31, a telescopic airbag 32, a liquid storage box 33 and a side plate 35, the two ends of the side plate 35 are respectively fixedly connected to the opposite side walls of the two upper rotating plates 43, one side of the side plate 35 is fixedly connected to the rib cutting blade 31, and the other side of the side plate 35 is fixedly connected to the liquid storage box 33, the telescopic airbag 32 is located on the inner side of the rib cutting blade 31, one end of the telescopic airbag 32 is fixedly connected to the side plate 35, and a connecting hose 34 is provided on both sides of the telescopic airbag 32; the two ends of the connecting hose 34 are respectively connected to the side walls of the telescopic airbag 32 The rib cutting blade 31 is fixedly connected to the side wall thereof, an air guide groove 313 is provided at the connection between the rib cutting blade 31 and the connecting hose 34, a diversion chamber 312 is provided inside one end of the rib cutting blade 31, the diversion chamber 312 is connected to an opening at one end of the air guide groove 313, an exhaust hole 311 is provided between the inner wall of the diversion chamber 312 and the side wall of the rib cutting blade 31, a docking hole 314 is provided on the inner wall of one side of the air guide groove 313, an absorbent cotton strip 36 is fixedly connected inside the docking hole 314, and one end of the absorbent cotton strip 36 passes through the side wall of the liquid storage box 33.

[0026] It should be noted that: during the process of the pressure plate 22 squeezing the telescopic airbag 32, the gas inside the telescopic airbag 32 will be evenly dispersed into the corresponding air guide groove 313 through multiple connecting hoses 34, and then discharged from multiple exhaust holes 311 through the diversion cavity 312 to achieve a blowing effect on the component, which can not only blow away the slight dust on the surface of the component, but also reduce the heat generated during rib cutting, thereby reducing damage to the component during processing and improving the performance of the semiconductor. In addition, coolant can be added to the liquid storage box 33. The coolant can be water or other cooling liquid with a diffusion effect, and is absorbed and diffused through the absorbent cotton strip 36. During the above-mentioned gas discharge process, the surface of the absorbent cotton strip 36 can be blown to increase the diffusion rate of water, so as to increase the humidity of the local space within the cutting range during the rib cutting process, thereby avoiding the occurrence of static electricity during the cutting process, so as to avoid damage to semiconductor materials and improve the reliability and life of the chip. At the same time, due to the evaporation of water, the heat of surrounding objects can be taken away to reduce the temperature in the air and improve the cooling effect.

[0027] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor packaging machine, comprising a conveyor frame (1), the conveyor frame (1) being connected to a conveyor belt 1 (8) and a conveyor belt 2 (10), a semiconductor strip (7) being provided on the surface of the conveyor belt 1 (8), a baffle strip (9) being fixedly connected to the inner side wall of the conveyor frame (1), the conveyor frame (1) being connected to an upper drive assembly (4) and a lower drive assembly (5), the upper drive assembly (4) comprising an upper rotating plate (43), the lower drive assembly (5) comprising a lower rotating plate (53), the upper rotating plate (43) and the lower rotating plate (53) being each provided with a pair, characterized in that: Also includes: A fixed component (2), the fixed component (2) being located between the two upper rotating plates (43), and the fixed component (2) being capable of absorbing current generated by the semiconductor; A rib cutting assembly (3), the rib cutting assembly (3) being located between the two upper rotating plates (43), the rib cutting assembly (3) being capable of cooling down the pins that need rib cutting and increasing the local air humidity; A supporting component (6), the supporting component (6) being located between the two lower rotating plates (53), and the supporting component (6) being able to fix a single semiconductor in cooperation with the fixing component (2).

2. A semiconductor packaging machine according to claim 1, characterized in that: The upper driving assembly (4) further comprises a driving motor 1 (41) and an upper supporting seat (42), wherein the driving motor 1 (41) is fixedly connected to the side wall of the upper supporting seat (42), and the upper supporting seat (42) is fixedly connected to the conveying frame (1), and the upper supporting seat (42) is located outside the upper rotating plate (43), and the side wall of the upper rotating plate (43) is fixedly connected to a rotating shaft 1 (44), and the rotating shaft 1 (44) passes through the side wall of the upper supporting seat (42) and is fixedly connected to the output end of the driving motor 1 (41), and the two upper rotating plates (43) are symmetrical about the center line of the conveying frame (1).

3. A semiconductor packaging machine according to claim 1, characterized in that: The lower driving assembly (5) further comprises a second driving motor (51) and a lower supporting seat (52), wherein the second driving motor (51) is fixedly connected to the side wall of the lower supporting seat (52), and the lower supporting seat (52) is fixedly connected to the lower side wall of the conveying frame (1), and the lower supporting seat (52) is located on the outer side of the lower rotating plate (53), and the lower rotating plate (53) is fixedly connected to a second rotating shaft (54), and one end of the second rotating shaft (54) passes through the side wall of the lower supporting seat (52) and is fixedly connected to the output end of the second driving motor (51), and the two lower rotating plates (53) are symmetrical about the center line of the conveying frame (1).

4. A semiconductor packaging machine according to claim 1, characterized in that: The rib cutting assembly (3) comprises a rib cutting blade (31), a telescopic airbag (32), a liquid storage box (33) and a side plate (35); two ends of the side plate (35) are respectively fixedly connected to opposite side walls of two upper rotating plates (43); one side of the side plate (35) is fixedly connected to the rib cutting blade (31); the other side of the side plate (35) is fixedly connected to the liquid storage box (33); the telescopic airbag (32) is located inside the rib cutting blade (31); one end of the telescopic airbag (32) is fixedly connected to the side plate (35); and connecting hoses (34) are provided on both sides of the telescopic airbag (32).

5. A semiconductor packaging machine according to claim 4, characterized in that: The two ends of the connecting hose (34) are respectively fixedly connected to the side wall of the telescopic airbag (32) and the side wall of the rib cutting blade (31); an air guide groove (313) is provided at the connection between the rib cutting blade (31) and the connecting hose (34); a diversion cavity (312) is provided inside one end of the rib cutting blade (31); the diversion cavity (312) is connected to an opening at one end of the air guide groove (313); an exhaust hole (311) is provided between the inner wall of the diversion cavity (312) and the side wall of the rib cutting blade (31); a docking hole (314) is provided on the inner wall of one side of the air guide groove (313); an absorbent cotton strip (36) is fixedly connected inside the docking hole (314); one end of the absorbent cotton strip (36) passes through the side wall of the liquid storage box (33).

6. A semiconductor packaging machine according to claim 4, characterized in that: The fixing assembly (2) comprises a pressing plate (22), a limiting rod (24) and a buffer spring (25); the pressing plate (22) is located on the inner side of the rib cutting blade (31); one end of the limiting rod (24) passes through the side wall of the side plate (35) and is fixedly connected to the pressing plate (22); the buffer spring (25) is sleeved on the outer wall of the limiting rod (24); two ends of the buffer spring (25) are respectively fixedly connected to the side wall of the pressing plate (22) and the side wall of the side plate (35); the pressing plate (22) is fixedly connected to one end of the telescopic airbag (32) away from the side plate (35).

7. A semiconductor packaging machine according to claim 6, characterized in that: One end of the pressing plate (22) away from the limiting rod (24) is fixedly connected to a pressure strip (21), the pressure strip (21) is made of rubber material, a cavity (221) is provided inside the pressing plate (22), a diffusion plate (222) is fixedly connected to the inner wall of the cavity (221), and an absorption partition (223) is fixedly connected to one side of the diffusion plate (222).

8. A semiconductor packaging machine according to claim 7, characterized in that: The side wall of the pressing plate (22) is connected to a conductive rod (23) and an elastic member (26); the conductive rod (23) is arranged in a "T" shape; one end of the conductive rod (23) passes through the inner wall of the cavity (221); the elastic member (26) is sleeved on the outer wall of the conductive rod (23); and two ends of the elastic member (26) are respectively fixedly connected to the side wall of one end of the conductive rod (23) and the side wall of the pressing plate (22).

9. The semiconductor packaging machine according to claim 1, characterized in that: The supporting assembly (6) comprises a supporting plate (61), one side of the supporting plate (61) is fixedly connected to a fixing rod (62), and both ends of the fixing rod (62) are respectively fixedly connected to the side walls of the two lower rotating plates (53).

10. The semiconductor packaging machine according to claim 9, characterized in that: One end of the supporting plate (61) away from the fixing rod (62) is fixedly connected to a cutting strip (611) and a supporting strip (612), and the cutting strip (611) is located outside the supporting strip (612).

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