Grinding device

Abstract

The invention provides a grinding device which can perform replacement operation simply and at low cost when a grinding wheel unit is replaced. A mounting member (7) on which a grinding wheel unit (5) is mounted is provided on the upper surface of an indexing table (3) that moves a chuck table (2). Furthermore, the chuck table (2) is rotated, so that the carrying component (7) is moved below the main shaft (4), the main shaft (4) is lowered, the magnetic attraction state of the holding device (6) for magnetically attracting the grinding wheel unit (5) is switched to the demagnetization state, and the grinding wheel unit (5) can be carried on the carrying component (7) and collected. On the other hand, when a new grinding wheel unit (5) is mounted, the grinding wheel unit (5) is mounted to a pin (72) provided on the mounting member (7), the indexing table (3) is rotated, and the spindle (4) is lowered to magnetically attract the grinding wheel unit (5) in a state in which the rotation axis of the spindle (4) is aligned with the rotation axis of the grinding wheel unit.

Description

Technical Field

[0001] The present invention relates to a grinding device for grinding a surface of a wafer, and more particularly to a grinding device capable of easily replacing a grinding wheel unit for grinding a wafer. Background Art

[0002] Conventionally, a semiconductor wafer cut relatively thin by a wire saw is ground even thinner by a grinding device. Figure 6 Such a grinding device is shown.

[0003] Figure 6 This is a diagram of a grinding device viewed from above, reference numeral 91 is a chuck table that holds and rotates a wafer 90 cut by a wire saw, and reference numeral 92 is a indexing table that orbits the chuck table 91. Reference numeral 93 is a grinding wheel unit that has a grinding wheel for grinding the wafer 90 held on the chuck table 91, and is mounted on a spindle 94 that moves up and down toward the surface of the wafer 90. In such a structure, the rotation axis in the Z-axis direction of the chuck table 91 and the rotation axis in the Z-axis direction of the spindle 94 that holds the grinding wheel unit 93 are offset in the lateral direction, and the chuck table 91 and the grinding wheel unit 93 are rotated separately, so that the surface of the wafer 90 is roughly ground by the grinding wheel unit 93, and then the indexing table 92 is rotated to perform fine grinding under the adjacent spindle 94.

[0004] However, such a grinding wheel unit is replaced with a new one after being used for a certain period of time.

[0005] As a method of replacing such an old grinding wheel unit with a new one, a method such as that shown in the following Patent Document 1 has been proposed.

[0006] In Patent Document 1 (see paragraph 62), an electromagnet is pre-installed at the bottom of the spindle, and a grinding wheel pad having a grinding wheel flange magnetically attracted to the electromagnet is provided, and a new grinding wheel pad can be replaced by switching the magnetic attraction state and the demagnetization state of the electromagnet. This eliminates the need to insert a tool from below to remove the screw during replacement work as in the past, and thus replacement work can be easily performed.

[0007] Prior art literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2001-148361 Summary of the invention

[0009] Problems to be solved by the invention

[0010] However, when the grinding wheel unit is replaced using such a structure, there are the following problems.

[0011] That is, generally speaking, when replacing the grinding wheel unit, the main shaft is moved to an upper position, a large space is formed below it, and then the grinding wheel unit is removed for replacement, but in this case, the heavy grinding wheel unit must be supported by both hands, which makes it difficult for one person to work. On the other hand, as shown in Patent Document 1, the grinding wheel unit can also be automatically replaced using a device such as an arm, but in this case, there is a problem that the device becomes complicated and the cost also becomes high.

[0012] Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a grinding device that can perform replacement work simply and at low cost when replacing a grinding wheel unit.

[0013] Means for solving problems

[0014] That is, in order to solve the above-mentioned problems, the grinding device of the present invention is constructed to include: a chuck table, which holds the workpiece and rotates it; a dividing table, which moves the chuck table; a grinding wheel unit, which contacts the surface of the workpiece held on the above-mentioned chuck table and grinds the workpiece; a spindle, which raises and lowers the grinding wheel unit and rotates the grinding wheel unit; a holding device, which holds the above-mentioned grinding wheel unit on the spindle in a detachable manner; and a switching part, which switches the installation state and the removal state of the above-mentioned grinding wheel unit in the holding device, and the above-mentioned grinding device includes: a loading component, which is arranged on the above-mentioned dividing table and is used to load the above-mentioned grinding wheel unit; and a control part, which switches the above-mentioned switching part to the removal state in a state after the above-mentioned spindle is lowered, and loads the above-mentioned grinding wheel unit on the loading component on the above-mentioned dividing table.

[0015] If constituted like this, the grinding wheel unit can be replaced by the indexing table, and it is not necessary to support the grinding wheel unit with both hands to replace it. In addition, since it is not necessary to set up new arms, etc., the structure can be simplified and the product can be completed at low cost.

[0016] Furthermore, in such an invention, when the holding device is provided, the grinding wheel unit is magnetically attracted by a magnet.

[0017] If it is constructed in this way, there is no need to use a complicated mechanism, and the grinding wheel unit can be disassembled and assembled with a simple structure. In addition, when the main shaft is lowered, the grinding wheel unit can be magnetically adsorbed to the main shaft via the holding device only by approaching the grinding wheel unit to a certain extent, so there is no need to fine-tune the lowered position of the main shaft.

[0018] Furthermore, the placement member is provided with a positioning member for aligning the rotation axis of the main shaft with the rotation axis of the grinding wheel unit when the grinding wheel unit placed on the placement member is moved below the main shaft.

[0019] According to this structure, the rotation axis of the spindle and the rotation axis of the grinding wheel unit can be aligned simply by placing the grinding wheel unit on the positioning member and moving the index table below the spindle. The grinding wheel unit can be mounted simply by lowering the spindle in this state.

[0020] Furthermore, when the indexing table is provided with a plurality of openings for accommodating the chuck table, the placement member is provided between adjacent openings.

[0021] According to such a configuration, even in a state where the chuck table is attached to the index table, the grinding wheel unit can be mounted on the index table via the mounting member.

[0022] Effects of the Invention

[0023] According to the present invention, the grinding wheel unit can be replaced by utilizing the indexing table, and it is not necessary to support the grinding wheel unit with both hands for replacement. In addition, since it is not necessary to separately provide a new arm, etc., the structure can be simplified, and the product can be completed at a low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic plan view showing a grinding device according to an embodiment of the present invention.

[0025] Figure 2 This is a cross-sectional perspective view of a grinding wheel unit, a holding device, etc. in this embodiment.

[0026] Figure 3 This is a diagram showing an indexing table and a mounting member in this embodiment.

[0027] Figure 4 This is a diagram showing a state of replacing the grinding wheel unit in this embodiment.

[0028] Figure 5 This is a diagram showing a state of replacing the grinding wheel unit in this embodiment.

[0029] Figure 6 It is a schematic plan view showing a grinding device of a conventional example. DETAILED DESCRIPTION

[0030] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[0031] like Figure 1 As shown in FIG. 1 , the grinding device 1 in this embodiment includes: a chuck table 2 that rotates while holding a wafer 10, an indexing table 3 that moves the chuck table 2 between a rough grinding position A1 and a fine grinding position A2, etc., a grinding wheel unit 5 that grinds the wafer 10 held on the chuck table 2, a spindle 4 that raises and lowers the grinding wheel unit 5 and rotates the grinding wheel unit 5, and a Figure 2As shown, the grinding wheel unit 5 is detachably held on the spindle 4 by a holding device 6 and a switching unit 60 for switching the mounted state and the removed state of the grinding wheel unit 5 in the holding device 6. Figure 3 As shown, a mounting member 7 for mounting a grinding wheel unit 5 is provided on the indexing table 3, and in the state where the spindle 4 is lowered ( Figure 4 (b)) Place the old grinding wheel unit 5 on the mounting member 7 ( Figure 5 (c)), the indexing table 3 is rotated to recover the grinding wheel unit 5 at the grinding wheel replacement position A3. On the contrary, when a new grinding wheel unit 5 is installed, the new grinding wheel unit 5 is placed on the mounting member 7 at the grinding wheel replacement position A3, the indexing table 3 is rotated, the grinding wheel unit 5 is moved to the bottom of the spindle 4, and the spindle 4 is lowered to install the new grinding wheel unit 5 on the spindle 4. The present embodiment is described in detail below.

[0032] First, if Figure 1 As shown, the chuck table 2 of the grinding device 1 is configured to have a diameter slightly larger than the wafer 10, and is configured to use an air-based suction mechanism (not shown) to adsorb the wafer 10 to the upper surface of the chuck table 2. In addition, while the wafer 10 is adsorbed by air, it is rotated by a motor (not shown) provided below.

[0033] like Figure 3 As shown, the indexing table 3 is configured to have a plurality of openings 31 for accommodating the chuck table 2. The chuck table 2 accommodated in the openings 31 is rotated by a motor (not shown) to move the chuck table 2 to the rough grinding position A1 (see Figure 1 ) and the finish grinding position A2, etc. In addition, between the openings 31 and 31 of the indexing table 3, an intermediate portion 32 having an upper surface portion at a position higher than the position of the opening 31 is provided, and a mounting member 7 described later is installed in a long hole 33 provided in the upper surface portion of the intermediate portion 32.

[0034] On the other hand, a spindle 4 is provided near the indexing table 3 (see Figure 1 ).like Figure 4 and Figure 5 As shown, the spindle 4 uses an air cylinder to raise and lower the grinding wheel unit 5 along the normal direction (Z-axis direction) of the wafer 10, and the grinding wheel unit 5 presses the surface of the wafer 10 and rotates. A grinding wheel unit 5 for rough grinding is installed on one side of the spindle 4, and a grinding wheel unit 5 for fine grinding is installed on the other side.

[0035] like Figure 2As shown, the grinding wheel unit 5 mounted on the spindle 4 is formed by arranging a plurality of grinding wheels 53 along the circumferential direction on the lower surface of a metal grinding wheel flange 51 capable of magnetic attraction, and is mounted with its axis aligned with the rotation axis of the spindle 4. The rotation axis of the grinding wheel unit 5 and the rotation axis of the chuck table 2 below it are offset in parallel in the lateral direction, and the grinding wheel unit 5 and the chuck table 2 are rotated respectively, thereby grinding the wafer 10 as a whole. In addition, here, the grinding wheel flange 51 is composed of a disc-shaped member, but a handle (not shown) can also be provided on its outer peripheral portion, and the grinding wheel unit 5 can be carried by the handle.

[0036] The holding device 6 provided below the main spindle 4 can automatically remove the grinding wheel unit 5 from the main spindle 4. Figure 2 The switching part 60 shown can switch between the installation state and the removal state. In addition, various structures can be used as the structure of the holding device 6, but here, a structure that allows the grinding wheel unit 5 to be installed and removed by a magnet is used. Specifically, the holding device 6 has a permanent magnet inside, and by inserting the pin 62 of the switching part 60 into the switching hole 61 set on the side of the holding device 6 and rotating it 180 degrees, it is possible to switch the magnetic adsorption state and the demagnetization state based on the permanent magnet. In addition, the pin 62 used for the switching is set to slide from the side at the position after the main shaft 4 is lowered, and the pin 62 is advanced by the cylinder 63 and inserted into the switching hole 61. In this state, the pin 62 is rotated 180 degrees by the motor 64 to switch the magnetic adsorption state (installation state) and the demagnetization state (removal state). And, in this way, by removing the grinding wheel unit 5 only at the position after the grinding wheel unit 5 is lowered, the grinding wheel unit 5 will not fall accidentally from a high place. In addition, if the grinding wheel unit 5 is only magnetically adsorbed to the lower surface of the main shaft 4, there is a possibility that the grinding wheel unit 5 and the lower surface of the main shaft 4 may slide due to the friction force during rotation. Therefore, here, a columnar member hanging downward from the main shaft 4 is provided as a friction movement limiting portion 41 for limiting the friction movement, and the lower end portion of the columnar member is engaged with the hole portion 54 on the upper surface of the grinding wheel flange to prevent the grinding wheel unit 5 from sliding.

[0037] Based on such a structure, in the present embodiment, a mounting member 7 for mounting the grinding wheel unit 5 is provided on the indexing table 3 .

[0038] The mounting member 7 mounts and fixes the grinding wheel unit 5. In the present embodiment, the thickness is set to a thickness that does not allow the grinding wheel 53 to abut against the indexing table 3 or the chuck table 2 when the grinding wheel unit 5 is mounted. In addition, the size is set to a size that does not allow the grinding wheel flange 51 to interfere with the chuck table 2. In addition, a plurality of pins 72 (see FIG. 1 ) are provided on the upper surface of the mounting member 7. Figure 3 ), the pin 72 is aligned with the hole 52 (see Figure 2) is engaged to fix the grinding wheel flange 51. On the other hand, the mounting member 7 is slidably mounted in the long hole 33 along the radial direction of the indexing table 3 and fixed at a predetermined position by a screw 71. In addition, when the mounting member 7 is mounted on the indexing table 3, the rotation axis of the grinding wheel flange 51 fixed to the pin 72 is adjusted within the range of the long hole 33 so that the rotation axis of the main shaft 4 coincides with the rotation axis of the main shaft 4 while the indexing table 3 is rotated, and then fixed by the screw 71.

[0039] Control unit 8 ( Figure 2 ) The cylinder 63, the motor 64, etc. are controlled so that the above-mentioned series of actions can be performed, and the control is performed so that the mounting member 7 is moved to the position below the spindle 4 by the action of the switch, and the switching unit 60 is driven in a state where the grinding wheel unit 5 is lowered to the vicinity of the mounting member 7, so that the grinding wheel unit 5 is mounted on the mounting member 7. In addition, when a new grinding wheel unit 5 is installed, the mounting member 7 is placed at the grinding wheel replacement position A3, and the spindle 4 is lowered in a state where the grinding wheel unit 5 is moved to the position below the spindle 4, and the switching unit 60 is driven to magnetically attract the grinding wheel unit 5. In addition, when the grinding wheel unit 5 mounted on the mounting member 7 is stopped at a position below the rotation axis of the spindle 4, the following method can be used, etc.: a mark is marked on the indexing table 3 or the mounting member 7, and the mark is read by an optical sensor, thereby controlling the stop position so that each rotation axis is aligned.

[0040] Next, a method of replacing the grinding wheel unit 5 in the grinding device 1 configured as above will be described. In the description, the case where the old grinding wheel unit 5 is previously mounted on the holding device 6 of the spindle 4 and then removed and replaced with a new grinding wheel unit 5 will be described.

[0041] First, with the old grinding wheel unit 5 removed, set the switch to "removal mode 81" ( Figure 2 ), so that the mounting member 7 on the indexing table 3 is rotated to the position directly below the rotation axis of the spindle 4 ( Figure 4 (a) status).

[0042] Then, the spindle 4 is lowered in this state, and the grinding wheel unit 5 is stopped at a position near the mounting member 7 (for example, a position several millimeters away). Figure 4 (b) status).

[0043] Next, the switching hole 61 of the holding device 6 provided in the main spindle 4 is directed toward the sliding direction of the pin 62, and in this state, the pin 62 is advanced via the cylinder 63. Then, the pin 62 is inserted into the switching hole 61 and rotated 180 degrees.

[0044] Then, the holding device 6 switches from the magnetic adsorption state to the demagnetization state, and the grinding wheel unit 5 falls onto the mounting member 7 ( Figure 5 (c) state). In this way, when the grinding wheel flange 51 falls, the hole portion 52 of the grinding wheel flange 51 is fitted with the pin 72 of the mounting member 7, and the grinding wheel flange 51 is fixed.

[0045] Then, in this state, the spindle 4 is raised ( Figure 5 (d) state), and rotate the indexing table 3 to move to the grinding wheel replacement position A3 of the grinding wheel unit 5. Then, the old grinding wheel unit 5 is grasped and collected with both hands.

[0046] Next, when a new grinding wheel unit 5 is installed, the reverse operation is performed. That is, the new grinding wheel unit 5 is carried to the grinding wheel replacement position A3 and placed on the placement member 7. At this time, the hole 52 of the grinding wheel unit 5 is fitted with the pin 72 of the placement member 7.

[0047] Then, the switch is switched to the “installation mode 82 ”, the indexing table 3 is rotated, and the grinding wheel unit 5 mounted on the mounting member 7 is moved to a position directly below the rotation axis of the main spindle 4 .

[0048] Then, the spindle 4 is lowered, and at this position, the pin 62 of the switching portion 60 is advanced and inserted into the switching hole 61 of the holding device 6, and this time it is rotated 180 degrees in the reverse direction.

[0049] Then, the grinding wheel unit 5 is magnetically attracted to the holding device 6 of the main shaft 4 and is lifted from the mounting member 7. At this time, the columnar member (sliding restriction portion 41) hanging from the main shaft 4 is fitted into the hole portion 54 provided on the upper surface of the grinding wheel flange, so that the grinding wheel unit 5 is fixed so as not to slide in the rotation direction.

[0050] Then, the pin 62 of the switching portion 60 is retracted, and the spindle 4 is raised, and then the wafer 10 can be ground using the new grinding wheel unit 5 .

[0051] Thus, according to the above embodiment, the grinding device 1 is constructed to include: a chuck table 2, which holds the wafer 10 and rotates; a dividing table 3, which makes the chuck table 2 revolve; a grinding wheel unit 5, which contacts the surface of the wafer 10 held on the chuck table 2 and grinds the wafer 10; a spindle 4, which raises and lowers the grinding wheel unit 5 and rotates the grinding wheel unit 5; a holding device 6, which holds the grinding wheel unit 5 on the spindle 4 in a detachable manner; and a switching unit 60, which switches the magnetic adsorption state and the demagnetization state of the grinding wheel unit 5 in the holding device 6. The grinding device 1 is provided with: a loading component 7, which is provided on the dividing table 3 and is used to load the grinding wheel unit 5; and a control unit 8, which switches the switching unit 60 to a disassembly mode 81 in a state where the spindle 4 is lowered, and loads the grinding wheel unit 5 on the dividing table 3, so that the grinding wheel unit 5 can be replaced by using the dividing table 3, and there is no need to support the grinding wheel unit 5 with both hands for replacement. In addition, since there is no need to separately provide a new arm or the like, the structure can be simplified and the product can be completed at a low cost.

[0052] In addition, the present invention is not limited to the above-mentioned embodiment, and can be implemented in various forms.

[0053] For example, in the above embodiment, if Figure 3 As shown, the indexing table 3 is provided with three openings 31 to mount the chuck table 2, but the number of the openings 31 is not limited thereto. In addition, the indexing table 3 is rotated and moved below the spindle 4, but the indexing table 3 may also be moved in a linear direction.

[0054] In addition, in the above-mentioned embodiment, the substantially elliptical mounting member 7 is provided on the indexing table 3, but the shape is not limited thereto, and mounting members of various shapes can be used. In addition, in the above-mentioned embodiment, the mounting member 7 is provided separately from the indexing table 3, but the upper surface of the indexing table 3 can also be configured as the mounting member 7.

[0055] In addition, in the above-mentioned embodiment, the switching unit 60 is provided near the descending position of the spindle 4, and the magnetic adsorption state and the demagnetization state are switched at the position after the spindle 4 is descended. However, in the case where the holding device 6 is constituted by an electromagnet, the on / off state of the electromagnet may be switched only in the state after the grinding wheel unit 5 is descended. In addition, in the case where a physical claw is provided to detach the grinding wheel unit 5 relative to the spindle 4 without using such a permanent magnet or electromagnet for attachment and detachment, the claw may be advanced and retracted in the state after the grinding wheel unit 5 is descended to remove the grinding wheel unit 5.

[0056] In the above embodiment, the index table 3 is rotated by the motor to rotate the grinding wheel unit 5 between the lower side of the main spindle 4 and the grinding wheel replacement position A3. However, the index table 3 may be rotated manually.

[0057] In addition, in the above-mentioned embodiment, the sliding limiting portion 41 is constructed by fitting a columnar member hanging from the main shaft 4 into the hole portion 54, but in addition to this, a convex portion and a concave portion may be provided on the joint surface between the retaining device 6 and the grinding wheel unit 5 so that they fit together to limit the sliding in the rotation direction, or a radial wavy portion may be provided on the joint surface between the main shaft 4 and the retaining device 6 so that these wavy portions fit together to limit the sliding in the rotation direction.

[0058] In addition, in the above-mentioned embodiment, the indexing table 3 is rotated after the grinding wheel unit 5 is placed on the mounting member 7, but in this case, the indexing table 3 may be rotated after the grinding wheel unit 5 is detected to be placed on the mounting member 7. In this case, as a method for detecting the placement of the grinding wheel unit 5, a detection unit such as a load sensor, an optical sensor, or a magnetic sensor may be pre-set on the mounting member 7, and the detection unit may be used to detect the placement of the grinding wheel unit 5 on the mounting member 7.

[0059] In the above embodiment, the pin 72 is protruded toward the mounting member 7 to position and mount the grinding wheel unit 5. However, in addition to the pin 72, recesses and projections may be formed on the joint surface between the mounting member 7 and the grinding wheel unit 5 and these may be fitted.

[0060] In addition, in the above-mentioned embodiment, the grinding wheel unit 5 is held on the main shaft 4, but in this case, a pointed portion protruding in a pointed shape on the front end side and a fitting portion fitting with the pointed portion may be provided at the center of the main shaft 4 and the center of the grinding wheel unit 5 in such a manner that the rotation center of the main shaft 4 and the rotation center of the grinding wheel unit 5 are aligned, and the respective rotation centers are aligned through the pointed portion.

[0061] When the grinding wheel unit 5 is held on the spindle 4 in this way, in order to detect whether the grinding wheel unit 5 is magnetically attracted, a magnetic attraction detection unit such as a load sensor, an optical sensor, or a magnetic sensor may be provided to detect the magnetic attraction state of the grinding wheel unit 5 .

[0062] Description of Reference Numerals

[0063] 1...Grinding device

[0064] 2...Chuck table

[0065] 3...Indexing table

[0066] 4...Spindle

[0067] 5...Grinding wheel unit

[0068] 6...Retention device

[0069] 60...Switch

[0070] 61...Switch hole

[0071] 62...Pin

[0072] 7...Loading parts

[0073] 72...Pin (positioning component)

[0074] 8...Control Department.

Claims

1. A grinding device, comprising: The chuck table holds the workpiece and rotates it; An indexing table to move the chuck table; a grinding wheel unit that contacts a surface of a workpiece held on the chuck table to grind the workpiece; A main shaft, which enables the grinding wheel unit to be raised and lowered, and the grinding wheel unit to be rotated; A holding device for holding the grinding wheel unit on the spindle in a detachable manner; and a switching unit for switching the mounting state and the dismounting state of the grinding wheel unit in the holding device; The grinding device is characterized in that it has: a loading component, disposed on the indexing table and used for loading the grinding wheel unit; and The control unit switches the switching unit to the disassembled state in a state where the main spindle is lowered, and places the grinding wheel unit on the placing member on the indexing table.

2. The grinding device according to claim 1, wherein: The holding device is configured to magnetically attract the grinding wheel unit by a magnet.

3. The grinding device according to claim 1, wherein: The mounting member is provided with a positioning member for aligning the rotation axis of the main spindle with the rotation axis of the grinding wheel unit in a state where the grinding wheel unit mounted on the mounting member is moved below the main spindle.

4. The grinding device according to claim 1, wherein: The indexing table has a plurality of openings for accommodating the chuck table. The placement member is provided between adjacent openings of the indexing table.

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