Intelligent packaging control system for diode products

Abstract

The invention relates to the technical field of diode product intelligent packaging, and particularly discloses a diode product intelligent packaging control system which comprises a placement position adjusting module, an arrangement neat adjusting module, a hot pressing temperature confirming module, a hot pressing pressure confirming module and a database. According to the invention, before hot-pressing sealing of the patch diodes, the placement positions and the arrangement neat conditions of the patch diodes are analyzed and adjusted, after hot-pressing sealing of the patch diodes, the appropriate conditions of the current hot-pressing temperature and the current hot-pressing pressure are analyzed respectively, and the appropriate hot-pressing temperature and the appropriate hot-pressing pressure corresponding to the next batch are confirmed. The sealing performance and the overall quality of a product are improved, smooth operation of automatic equipment is facilitated, the phenomena of material blocking, material throwing and the like are reduced, therefore, the production efficiency is improved, meanwhile, the proper hot pressing temperature can be found more quickly, potential air leakage channels are reduced or eliminated, and the packaging quality of the diode product is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent packaging of diode products, and in particular to an intelligent packaging control system for diode products. Background Art

[0002] The packaging process of traditional diode products mostly relies on manual operation, which has problems such as low efficiency, easy errors, and high costs. With the development of industrial automation technology, intelligent packaging systems have gradually become an industry trend. However, the intelligent packaging control system based on the characteristics of diode products is still imperfect and it is difficult to meet the packaging needs of high efficiency, precision, and low cost.

[0003] For example, the patent with publication number CN112407441A discloses an automatic diode packaging device. When in use, when the box reaches the bottom, the diodes stored in the machine can be automatically dropped, instead of manually filling the box with diodes, reducing labor costs and speeding up work efficiency. Later, when the box is transported to the rear, the machine will cover the lid and complete the packaging of the box, so that the machine reduces unnecessary labor costs, speeds up efficiency and reduces error rates while reducing costs.

[0004] The above existing technologies still have the following problems: 1) Before the SMD diodes are hot-pressed and sealed, the placement position offset and arrangement neatness of the SMD diodes are not analyzed; 2) After the SMD diodes are hot-pressed and sealed, the appropriateness of the current hot-pressing temperature and hot-pressing pressure are not analyzed separately. Summary of the invention

[0005] In view of this, in order to solve the problems raised in the above background technology, an intelligent packaging control system for diode products is now proposed.

[0006] The purpose of the present invention can be achieved through the following technical solutions: The present invention provides an intelligent packaging control system for diode products, including: a placement position adjustment module, which is used to collect images corresponding to each group of diodes when each group of diodes in a target batch is placed on a corresponding packaging tray, and obtain the center point position of each patch diode therefrom, and at the same time extract the placement position of the center point of each patch diode set in the packaging tray, confirm each offset patch diode in each group of diodes, and feed it back to the packaging control center for adjustment.

[0007] The arrangement adjustment module is used to collect the adjusted images corresponding to each group of diodes after the offset of each offset SMD diode in each group of diodes is adjusted, and to determine whether the arrangement of the SMD diodes in each group of diodes is neat. If not, it will be immediately fed back to the packaging control center for adjustment.

[0008] The hot pressing temperature confirmation module is used to hot press and seal each group of diodes after they are neatly arranged in the target batch, collect the corresponding packaging images of each group of diodes after hot pressing and sealing, and evaluate whether the hot pressing temperature corresponding to the target batch is appropriate. If not, the hot pressing temperature corresponding to the target batch is extracted to confirm the appropriate hot pressing temperature for the next batch.

[0009] The hot pressing pressure confirmation module is used to perform airtightness test on each group of diodes in the target batch after hot pressing and sealing, obtain the airtightness test information corresponding to each group of diodes in the target batch, evaluate whether the hot pressing pressure corresponding to the target batch is appropriate, and if not, extract the hot pressing pressure corresponding to the target batch and confirm the appropriate hot pressing pressure corresponding to the next batch.

[0010] The database is used to store the standard packaging contour corresponding to the diode after hot pressing and sealing, store the required adjustment hot pressing temperature value corresponding to the unit deformation deviation, store the monitoring time corresponding to the monitoring time period, and store the required adjustment hot pressing pressure value corresponding to the unit airtightness evaluation index difference.

[0011] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects: (1) The present invention collects images corresponding to each group of diodes and images corresponding to each group of diodes after offset adjustment, and analyzes the placement position offset and arrangement neatness of the SMD diodes before hot pressing and sealing, thereby ensuring that the placement position of the SMD diodes before hot pressing and sealing is accurate and arranged neatly, improving the sealing performance and overall quality of the product, contributing to the smooth operation of automated equipment, reducing material jamming, material throwing and other phenomena, and thus improving production efficiency.

[0012] (2) The present invention calculates the edge straightness and spacing uniformity of the SMD diodes in each group of diodes, thereby calculating the arrangement uniformity of the SMD diodes in each group of diodes, thereby achieving diversified and multi-angle analysis of the arrangement uniformity, and at the same time improving the accuracy and persuasiveness of the arrangement uniformity analysis.

[0013] (3) The present invention calculates the corresponding deformation degree of the diodes in the target batch after hot pressing and sealing, evaluates whether the hot pressing temperature corresponding to the target batch is appropriate, and confirms the appropriate hot pressing temperature corresponding to the next batch. It can accurately evaluate the impact of the current hot pressing temperature on the diode packaging quality, thereby helping to reduce packaging defects. At the same time, the traditional hot pressing temperature setting often relies on experience or multiple tests, while through the evaluation of deformation, the appropriate hot pressing temperature can be found more quickly, reducing the trial and error cost caused by frequent temperature adjustments.

[0014] (4) The present invention calculates the airtightness evaluation index corresponding to the hot pressing sealing of the diodes in the target batch, evaluates whether the hot pressing pressure corresponding to the target batch is appropriate, and confirms the appropriate hot pressing pressure corresponding to the next batch. It intuitively reflects the sealing effect of the diodes after packaging, and can accurately evaluate whether the current hot pressing pressure is sufficient to ensure good sealing, reduce or eliminate potential leakage channels, thereby reducing the risk of leakage of the product during use and improving the packaging quality of the diode products. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the system module structure connection of the present invention.

[0017] Figure 2 It is a schematic diagram of the process flow of the present invention.

[0018] Figure 3 This is a schematic diagram of the packaging of the diode of the present invention after heat pressing and sealing.

[0019] Description of the accompanying drawings: 1. Packaging tray, 2. SMD diode. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figure 1 As shown, the present invention provides an intelligent packaging control system for diode products, including: a placement position adjustment module, an arrangement adjustment module, a hot pressing temperature confirmation module, a hot pressing pressure confirmation module and a database.

[0022] The placement position adjustment module is connected to the arrangement adjustment module, the arrangement adjustment module is connected to the hot pressing temperature confirmation module, and the hot pressing temperature confirmation module and the hot pressing pressure confirmation module are both connected to the database.

[0023] See also Figure 2As shown, the placement position adjustment module is used to collect images corresponding to each group of diodes when each group of diodes in the target batch is placed on the corresponding packaging tray, and obtain the center point position of each patch diode therefrom, and at the same time extract the placement position of the center point of each patch diode set in the packaging tray, confirm each offset patch diode in each group of diodes, and feed it back to the packaging control center for adjustment.

[0024] It should be noted that the images corresponding to the groups of diodes are acquired through the installed high-definition cameras.

[0025] In a specific embodiment of the present invention, the specific process of confirming each offset patch diode in each group of diodes is as follows: A1, obtaining the center point coordinate value of each patch diode in each group of diodes, and recording it as ,in, Indicates the number of each group of diodes, , Indicates the number of the SMD diode. .

[0026] It should be noted that the center point of each group of diodes is located from the image corresponding to each group of diodes, and a two-dimensional rectangular coordinate system of each group of diodes is established with the center point as the base point, the horizontal direction as the x-axis, and the vertical direction as the y-axis. The center point position of each patch diode in each group of diodes is substituted into the corresponding two-dimensional rectangular coordinate system to obtain the center point coordinate value of each patch diode in each group of diodes.

[0027] A2. Obtain the center point placement coordinates of each SMD diode set in the packaging tray and record them as .

[0028] It should be noted that the placement positions of the center points of the SMD diodes set in the packaging tray are substituted into the two-dimensional rectangular coordinate system, so as to obtain the placement coordinate values ​​of the center points of the SMD diodes set in the packaging tray.

[0029] A3. Calculate the placement alignment of each SMD diode in each group of diodes , ,in, and Respectively indicate the setting permission Axis and The placement position offset value corresponding to the axis.

[0030] A4. Compare the placement position alignment of each SMD diode in each group of diodes with the placement position alignment of the set reference. If the placement position alignment of a SMD diode in a group of diodes is less than the placement position alignment of the set reference, then the SMD diode is recorded as an offset SMD diode, thereby obtaining the offset SMD diodes in each group of diodes.

[0031] The arrangement adjustment module is used to collect the adjusted images corresponding to each group of diodes after the offset of each offset SMD diode in each group of diodes is adjusted, and determine whether the arrangement of the SMD diodes in each group of diodes is neat. If not, immediately feedback to the packaging control center for adjustment.

[0032] It should be noted that the adjusted images corresponding to the groups of diodes are acquired through the installed high-definition cameras.

[0033] In a specific embodiment of the present invention, the specific process of judging whether the arrangement of the SMD diodes in each group of diodes is neat is as follows: B1, based on the adjusted images corresponding to each group of diodes, respectively calculating the edge straightness of the SMD diodes in each group of diodes and spacing uniformity .

[0034] In a specific embodiment of the present invention, the specific process of calculating the edge straightness of the patch diodes in each group of diodes is as follows: C1, obtaining the upper contour edge of each patch diode from the adjusted image corresponding to each group of diodes, obtaining the upper contour edge curve of each group of diodes, and overlapping and comparing it with the set standard straight line to obtain the upper contour edge overlap length of each group of diodes, and record it as .

[0035] C2. Record the length of the set standard straight line as .

[0036] C3. Calculate the edge straightness of the SMD diodes in each group of diodes , ,in, Indicates the ratio of the overlapping length of the referenced contour edge. Represents a natural constant.

[0037] Table 1 Example of edge straightness data

[0038]

[0039] As shown in Table 1, the edge straightness is determined by the ratio of the upper contour edge overlap length, the standard straight line length, and the reference contour edge overlap length. The greater the ratio between the upper contour edge overlap length and the standard straight line length, the greater the edge straightness.

[0040] In a specific embodiment of the present invention, the specific process of calculating the spacing uniformity of the SMD diodes in each group of diodes is: D1. The leftmost SMD diode in the adjusted image corresponding to each group of diodes is recorded as the target SMD diode, and the other SMD diodes are recorded as reference SMD diodes.

[0041] D2. In the target patch diodes of each group of diodes, each monitoring point is arranged from top to bottom in sequence, recorded as each target detection point, and each target detection point is mapped to each reference patch diode to obtain the mapping point corresponding to each target detection point in each reference patch diode, and then the distance between each target detection point in the target patch diode of each group of diodes and the mapping point corresponding to each target detection point in each reference patch diode is obtained, recorded as ,in, Indicates the reference number of the SMD diode. , Indicates the number of the mapping point, .

[0042] D3. Calculate the spacing uniformity of the SMD diodes in each group of diodes , ,in, and They respectively represent the horizontal spacing deviation between the reference SMD diodes and the vertical spacing deviation of a single SMD diode. Indicates Reference SMD diodes, Indicates Mapping points.

[0043] B2. Calculate the arrangement uniformity of the SMD diodes in each group of diodes , ,in, and They represent the weights of the evaluation of the arrangement neatness corresponding to the edge straightness and spacing uniformity of the set reference, .

[0044] In a specific embodiment of the present invention, The setting value of is 0.5. The setting value is 0.5. When calculating the arrangement uniformity of the SMD diodes in each group of diodes, edge straightness and spacing uniformity are important considerations, and they each have an important impact on the overall arrangement uniformity.

[0045] The embodiment of the present invention calculates the edge straightness and spacing uniformity of the SMD diodes in each group of diodes, thereby calculating the arrangement neatness of the SMD diodes in each group of diodes, thereby achieving diversified and multi-angle analysis of the arrangement neatness, and at the same time improving the accuracy and persuasiveness of the arrangement neatness analysis.

[0046] B3. Compare the arrangement uniformity of the SMD diodes in each group of diodes with the arrangement uniformity of the set reference. If the arrangement uniformity of the SMD diodes in a group of diodes is less than the arrangement uniformity of the set reference, it indicates that the arrangement of the SMD diodes in the group of diodes is not uniform. Otherwise, it indicates that the arrangement of the SMD diodes in the group of diodes is uniform.

[0047] The embodiment of the present invention collects images corresponding to each group of diodes and images after offset adjustment corresponding to each group of diodes, and analyzes the placement position offset and arrangement neatness of the SMD diodes before hot pressing and sealing, thereby ensuring the accurate placement position and neat arrangement of the SMD diodes before hot pressing and sealing, improving the sealing performance and overall quality of the product, contributing to the smooth operation of automated equipment, reducing material jamming, material throwing and other phenomena, and thus improving production efficiency.

[0048] See also Figure 3 As shown, the hot pressing temperature confirmation module is used to hot press and seal each group of diodes after the diodes in the target batch are neatly arranged, collect the corresponding packaging images of each group of diodes after hot pressing and sealing, evaluate whether the hot pressing temperature corresponding to the target batch is appropriate, if not appropriate, extract the hot pressing temperature corresponding to the target batch, and confirm the appropriate hot pressing temperature corresponding to the next batch.

[0049] It should be noted that the corresponding packaging images of each group of diodes after heat-pressing and sealing are acquired through the installation of a high-definition camera.

[0050] In a specific embodiment of the present invention, the specific process of evaluating whether the hot pressing temperature corresponding to the target batch is appropriate is as follows: E1, locating the packaging contour of each group of diodes from the packaging image corresponding to each group of diodes after hot pressing and sealing, and overlapping and comparing it with the standard packaging contour corresponding to the diodes after hot pressing and sealing stored in the database, to obtain the packaging overlapping volume of each group of diodes, and record it as .

[0051] E2. Locate the standard packaging contour volume from the corresponding standard packaging contour after the diode is hot-pressed and sealed, and record it as .

[0052] E3. Calculate the corresponding deformation of diodes in the target batch after hot pressing and sealing , ,in, Indicates the number of diode groups, Indicates the packaging overlap volume ratio for setting reference.

[0053] E4. Compare the deformation degree corresponding to the diodes in the target batch after hot pressing and sealing with the deformation degree of the set reference. If the deformation degree corresponding to the diodes in the target batch after hot pressing and sealing is greater than or equal to the deformation degree of the set reference, it indicates that the hot pressing temperature corresponding to the target batch is not appropriate. Otherwise, it indicates that the hot pressing temperature corresponding to the target batch is appropriate.

[0054] In a specific embodiment of the present invention, the specific process of determining the appropriate hot pressing temperature corresponding to the next batch is as follows: F1, recording the hot pressing temperature corresponding to the target batch as .

[0055] F2. Extract the required hot pressing temperature value corresponding to the unit deformation deviation from the database and record it as .

[0056] F3, set the appropriate hot pressing temperature for the next batch , ,in, Indicates the deformation degree of the setting reference.

[0057] The embodiment of the present invention calculates the corresponding deformation degree of the diodes in the target batch after hot pressing and sealing, evaluates whether the hot pressing temperature corresponding to the target batch is appropriate, and confirms the appropriate hot pressing temperature corresponding to the next batch. It can accurately evaluate the impact of the current hot pressing temperature on the diode packaging quality, thereby helping to reduce packaging defects. At the same time, traditional hot pressing temperature settings often rely on experience or multiple tests, and through the evaluation of deformation, the appropriate hot pressing temperature can be found more quickly, reducing the trial and error costs caused by frequent temperature adjustments.

[0058] The hot pressing pressure confirmation module is used to perform an airtightness test on each group of diodes in the target batch after hot pressing and sealing, obtain the airtightness test information corresponding to each group of diodes in the target batch, evaluate whether the hot pressing pressure corresponding to the target batch is appropriate, and if not appropriate, extract the hot pressing pressure corresponding to the target batch, and confirm the appropriate hot pressing pressure corresponding to the next batch.

[0059] In a specific embodiment of the present invention, the airtightness test information includes the number of bubbles that appear in each monitoring time period and the volume of each bubble that appears.

[0060] It should be noted that the number of bubbles appearing in each monitoring time period and the volume of each bubble appearing are collected by the installed bubble detection sensor and bubble meter respectively.

[0061] In a specific embodiment of the present invention, the specific process of evaluating whether the hot pressing pressure corresponding to the target batch is appropriate is as follows: G1. Extracting the monitoring time corresponding to the monitoring time period from the database and recording it as .

[0062] G2. Extract the number of bubbles appearing in each monitoring time period and the volume of each bubble appearing from the airtightness test information corresponding to each group of diodes in the target batch.

[0063] G3. Record the number of bubbles that appear in each monitoring time period corresponding to each group of diodes in the target batch as ,in, Indicates the number of the monitoring time period. .

[0064] G4. Calculate the bubble emission frequency corresponding to each group of diodes , ,in, Indicates the number of monitoring time periods.

[0065] G5. Compare the volume of each bubble that appears in each monitoring time period corresponding to each group of diodes with the set reference bubble volume. If the volume of a bubble that appears in a certain monitoring time period is greater than or equal to the set reference bubble volume, the bubble that appears is determined to be an oversized bubble. Count the number of oversized bubbles corresponding to each group of diodes and record it as .

[0066] G6. Calculate the corresponding airtightness evaluation index of the diodes in the target batch after hot pressing and sealing .

[0067] It should be noted that the formula for calculating the airtightness evaluation index corresponding to the diodes in the target batch after hot pressing and sealing is: ,in, and They respectively represent the frequency of bubble emergence and the proportion of bubbles with super large volume according to the set reference.

[0068] G7. Compare the airtightness evaluation index corresponding to the diodes in the target batch after hot-pressing sealing with the set reference airtightness evaluation index. If the airtightness evaluation index corresponding to the diodes in the target batch after hot-pressing sealing is greater than or equal to the set reference airtightness evaluation index, it indicates that the hot-pressing pressure corresponding to the target batch is appropriate; otherwise, it indicates that the hot-pressing pressure corresponding to the target batch is inappropriate.

[0069] In a specific embodiment of the present invention, the specific process of determining the appropriate hot pressing pressure corresponding to the next batch is as follows: H1, the hot pressing pressure corresponding to the target batch is recorded as .

[0070] H2. Extract the required adjustment hot pressing pressure value corresponding to the unit air tightness evaluation index difference from the database and record it as .

[0071] H3. Set the appropriate hot pressing pressure for the next batch , ,in, Indicates the airtightness evaluation index of the set reference.

[0072] The embodiment of the present invention calculates the airtightness evaluation index corresponding to the diodes in the target batch after hot pressing and sealing, evaluates whether the hot pressing pressure corresponding to the target batch is appropriate, and confirms the appropriate hot pressing pressure corresponding to the next batch. It intuitively reflects the sealing effect after diode packaging, and can accurately evaluate whether the current hot pressing pressure is sufficient to ensure good sealing, reduce or eliminate potential leakage channels, thereby reducing the risk of leakage of the product during use and improving the packaging quality of the diode product.

[0073] The database is used to store the standard packaging contour corresponding to the diode after hot pressing and sealing, store the required adjustment hot pressing temperature value corresponding to the unit deformation deviation, store the monitoring time corresponding to the monitoring time period, and store the required adjustment hot pressing pressure value corresponding to the unit airtightness evaluation index difference.

[0074] Table 2 Data sources in the database of this embodiment

[0075]

[0076] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they shall all fall within the protection scope of the present invention.

Claims

1. An intelligent packaging control system for diode products, characterized in that: include: The placement position adjustment module is used to collect images corresponding to each group of diodes when each group of diodes in the target batch is placed on the corresponding packaging tray, and obtain the center point position of each SMD diode from it, and at the same time extract the placement position of the center point of each SMD diode set in the packaging tray, confirm each offset SMD diode in each group of diodes, and feed it back to the packaging control center for adjustment; The arrangement adjustment module is used to collect the adjusted images corresponding to each group of diodes after the offset of each offset SMD diode in each group of diodes is adjusted, and judge whether the arrangement of the SMD diodes in each group of diodes is neat. If not, it will be fed back to the packaging control center for adjustment immediately; The hot pressing temperature confirmation module is used to perform hot pressing and sealing on each group of diodes after the diodes in the target batch are neatly arranged, collect the corresponding packaging images of each group of diodes after hot pressing and sealing, and evaluate whether the hot pressing temperature corresponding to the target batch is appropriate. If not, extract the hot pressing temperature corresponding to the target batch and confirm the appropriate hot pressing temperature corresponding to the next batch; The hot pressing pressure confirmation module is used to perform airtightness test on each group of diodes in the target batch after hot pressing and sealing, obtain airtightness test information corresponding to each group of diodes in the target batch, evaluate whether the hot pressing pressure corresponding to the target batch is appropriate, and if not, extract the hot pressing pressure corresponding to the target batch, and confirm the appropriate hot pressing pressure corresponding to the next batch; The database is used to store the standard packaging contour corresponding to the diode after hot pressing and sealing, store the required adjustment hot pressing temperature value corresponding to the unit deformation deviation, store the monitoring time corresponding to the monitoring time period, and store the required adjustment hot pressing pressure value corresponding to the unit airtightness evaluation index difference.

2. The intelligent packaging control system for diode products according to claim 1, characterized in that: The specific process of confirming each offset chip diode in each group of diodes is as follows: A1. Obtain the coordinates of the center points of each patch diode in each group of diodes and record them as ,in, Indicates the number of each group of diodes, , Indicates the number of the SMD diode. ; A2. Obtain the center point placement coordinates of each SMD diode set in the packaging tray and record them as ; A3. Calculate the placement alignment of each SMD diode in each group of diodes , ,in, and Respectively indicate the setting permission Axis and The placement position offset value corresponding to the axis; A4. Compare the placement position alignment of each SMD diode in each group of diodes with the placement position alignment of the set reference. If the placement position alignment of a SMD diode in a group of diodes is less than the placement position alignment of the set reference, then the SMD diode is recorded as an offset SMD diode, thereby obtaining the offset SMD diodes in each group of diodes.

3. The intelligent packaging control system for diode products according to claim 2 is characterized in that: The specific process of judging whether the arrangement of the SMD diodes in each group of diodes is neat is as follows: B1. Based on the adjusted images corresponding to each group of diodes, calculate the edge straightness of the SMD diodes in each group of diodes and spacing uniformity ; B2. Calculate the arrangement uniformity of the SMD diodes in each group of diodes , ,in, and They represent the weights of the evaluation of the arrangement neatness corresponding to the edge straightness and spacing uniformity of the set reference, ; B3. Compare the arrangement uniformity of the SMD diodes in each group of diodes with the arrangement uniformity of the set reference. If the arrangement uniformity of the SMD diodes in a group of diodes is less than the arrangement uniformity of the set reference, it indicates that the arrangement of the SMD diodes in the group of diodes is not uniform. Otherwise, it indicates that the arrangement of the SMD diodes in the group of diodes is uniform.

4. The intelligent packaging control system for diode products according to claim 3 is characterized in that: The specific process of calculating the edge straightness of the SMD diodes in each group of diodes is as follows: C1. Obtain the upper contour edge of each patch diode from the adjusted image corresponding to each group of diodes, obtain the upper contour edge curve of each group of diodes, and overlap and compare it with the set standard straight line to obtain the overlap length of the upper contour edge of each group of diodes, and record it as ; C2. Record the length of the set standard straight line as ; C3. Calculate the edge straightness of the SMD diodes in each group of diodes , ,in, Indicates the ratio of the overlapping length of the referenced contour edge. Represents a natural constant.

5. The intelligent packaging control system for diode products according to claim 3, characterized in that: The specific process of calculating the spacing uniformity of the SMD diodes in each group of diodes is as follows: D1, the leftmost SMD diode in the adjusted image corresponding to each group of diodes is recorded as the target SMD diode, and the other SMD diodes are recorded as reference SMD diodes; D2. In the target patch diodes of each group of diodes, each monitoring point is arranged from top to bottom in sequence, recorded as each target detection point, and each target detection point is mapped to each reference patch diode to obtain the mapping point corresponding to each target detection point in each reference patch diode, and then the distance between each target detection point in the target patch diode of each group of diodes and the mapping point corresponding to each target detection point in each reference patch diode is obtained, recorded as ,in, Indicates the reference number of the SMD diode. , Indicates the number of the mapping point, ; D3. Calculate the spacing uniformity of the SMD diodes in each group of diodes , ,in, and They represent the horizontal spacing deviation between the reference SMD diodes and the vertical spacing deviation of a single SMD diode. Indicates Reference SMD diodes, Indicates Mapping points.

6. The intelligent packaging control system for diode products according to claim 4, characterized in that: The specific process of evaluating whether the hot pressing temperature corresponding to the target batch is appropriate is as follows: E1. Locate the packaging contour of each group of diodes from the packaging image corresponding to each group of diodes after hot pressing and sealing, and overlap and compare it with the standard packaging contour corresponding to the diodes after hot pressing and sealing stored in the database to obtain the packaging overlap volume of each group of diodes, and record it as ; E2. Locate the standard packaging contour volume from the corresponding standard packaging contour after the diode is hot-pressed and sealed, and record it as ; E3. Calculate the corresponding deformation of diodes in the target batch after hot pressing and sealing , ,in, Indicates the number of diode groups, Indicates the packaging overlap volume ratio of the set reference; E4. Compare the deformation degree corresponding to the diodes in the target batch after hot pressing and sealing with the deformation degree of the set reference. If the deformation degree corresponding to the diodes in the target batch after hot pressing and sealing is greater than or equal to the deformation degree of the set reference, it indicates that the hot pressing temperature corresponding to the target batch is not appropriate. Otherwise, it indicates that the hot pressing temperature corresponding to the target batch is appropriate.

7. The intelligent packaging control system for diode products according to claim 6, characterized in that: The specific process of confirming the appropriate hot pressing temperature corresponding to the next batch is: F1. Record the hot pressing temperature corresponding to the target batch as ; F2. Extract the required hot pressing temperature value corresponding to the unit deformation deviation from the database and record it as ; F3, set the appropriate hot pressing temperature for the next batch , ,in, Indicates the deformation degree of the setting reference.

8. The intelligent packaging control system for diode products according to claim 7, characterized in that: The airtightness test information includes the number of bubbles that appear in each monitoring time period and the volume of each bubble that appears.

9. The intelligent packaging control system for diode products according to claim 8, characterized in that: The specific process of evaluating whether the hot pressing pressure corresponding to the target batch is appropriate is as follows: G1. Extract the monitoring duration corresponding to the monitoring time period from the database and record it as ; G2. Extract the number of bubbles appearing in each monitoring time period and the volume of each bubble appearing from the airtightness test information corresponding to each group of diodes in the target batch; G3. Record the number of bubbles that appear in each monitoring time period corresponding to each group of diodes in the target batch as ,in, Indicates the number of the monitoring time period. ; G4. Calculate the bubble emission frequency corresponding to each group of diodes , ,in, Indicates the number of monitoring time periods; G5. Compare the volume of each bubble that appears in each monitoring time period corresponding to each group of diodes with the set reference bubble volume. If the volume of a bubble that appears in a certain monitoring time period is greater than or equal to the set reference bubble volume, the bubble that appears is determined to be an oversized bubble. Count the number of oversized bubbles corresponding to each group of diodes and record it as ; G6. Calculate the corresponding airtightness evaluation index of the diodes in the target batch after hot pressing and sealing ; G7. Compare the airtightness evaluation index corresponding to the diodes in the target batch after hot-pressing sealing with the set reference airtightness evaluation index. If the airtightness evaluation index corresponding to the diodes in the target batch after hot-pressing sealing is greater than or equal to the set reference airtightness evaluation index, it indicates that the hot-pressing pressure corresponding to the target batch is appropriate; otherwise, it indicates that the hot-pressing pressure corresponding to the target batch is inappropriate.

10. The intelligent packaging control system for diode products according to claim 9, characterized in that: The specific process of confirming the appropriate hot pressing pressure corresponding to the next batch is: H1, record the hot pressing pressure corresponding to the target batch as ; H2. Extract the required adjustment hot pressing pressure value corresponding to the unit air tightness evaluation index difference from the database and record it as ; H3. Set the appropriate hot pressing pressure for the next batch , ,in, Indicates the airtightness evaluation index of the set reference.

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