Automatic board disassembling device and method for circuit board production

Abstract

The invention discloses an automatic board disassembling device and method for circuit board production, and relates to the field of circuit board production and manufacturing, the device comprises a rack, a conveying belt and a stacking table, and the conveying belt and the stacking table are arranged in a containing space formed by the rack from left to right; a moving mechanism is arranged on the rack, the moving mechanism comprises an X-axis moving module and a Z-axis moving module, the X-axis moving module is fixed to the upper portion of the rack, the Z-axis moving module is fixed to a moving part of the X-axis moving module, and a vacuum suction cup is fixed to a moving part of the Z-axis moving module. The device is high in automation degree, copper foil on the surface of a circuit board substrate is sucked through a vacuum suction cup, the circuit board substrate is clamped through a clamping assembly during suction, air nozzles arranged on the two sides of a conveying belt blow air to the copper foil, the copper foil is separated from the circuit board substrate more easily, the separated copper foil and a circuit board are stacked on a stacking table, and the copper foil stacking efficiency is improved. And circulation of subsequent procedures is facilitated, and the plate dismounting efficiency is high.

Description

Technical Field

[0001] The invention relates to the field of circuit board production and manufacturing, and in particular to an automatic circuit board disassembly device and method for circuit board production. Background Art

[0002] Copper-clad laminate is a plate-like material made by impregnating electronic glass fiber cloth or other materials with resin, covering one or both sides with copper foil and hot pressing. It is called copper-clad laminate. Copper-clad laminate needs to be cut into multiple boards of uniform size before processing. Both sides of each board are covered with a copper foil protective layer. Before the subsequent process of the circuit board is carried out, the copper foil protective layer on both sides of the circuit board needs to be removed.

[0003] There are two ways to remove the copper foil protective layer of the circuit board: mechanical method and chemical method. The chemical method is to use chemical solvents to dissolve the copper foil from the substrate, immerse the circuit board in the chemical solvent, so that the solvent can decompose the adhesive layer between the copper foil and the circuit board substrate, and wait for enough time until the copper foil and the circuit board substrate are separated. However, since the chemical method requires the use of chemical solvents, the operation is more complicated and there is a certain degree of danger.

[0004] Mechanical methods are commonly used to remove the copper foil protective layer on the surface of the circuit board substrate. When the copper foil is thin, the copper foil is cut manually and a copper foil cutter is used to separate the copper foil from the circuit board substrate. When the copper foil is thick, the circuit board is first soaked in a chemical solvent to soften the circuit board substrate, and then a scraper, copper foil cutter or mechanical stripping equipment is used to strip the copper foil from the circuit board substrate. The stripping should be done as slowly as possible and not too fast to avoid damaging the copper foil. The above-mentioned existing mechanical methods for removing the copper foil protective layer on the circuit board substrate have the problems of low board removal efficiency and easy damage to the copper foil and the circuit board substrate. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an automated circuit board disassembly device and method for circuit board production to solve the problems of low efficiency and easy damage to copper foil and circuit board substrate in the existing mechanical disassembly method.

[0006] The objective of the present invention is achieved through the following technical solutions: An automatic board disassembly device for circuit board production comprises a frame, a conveyor belt and a stacking platform. The frame is hollow inside and has a containing space. The conveyor belt and the stacking platform are arranged from left to right in the containing space formed by the frame.

[0007] The frame is provided with a moving mechanism, which includes an X-axis moving module and a Z-axis moving module. The X-axis moving module is fixed to the upper part of the frame, and the Z-axis moving module is fixed to the moving part of the X-axis moving module. The moving part of the Z-axis moving module is fixed with a vacuum suction cup, and the vacuum suction cup is located above the conveyor belt.

[0008] The conveyor belt is provided with an air blowing assembly and a clamping assembly, the air blowing assembly includes a plurality of air nozzles, and the plurality of air nozzles are evenly arranged on the racks on both sides of the conveyor belt; the clamping assembly includes a vertical moving module, a horizontal moving module and a telescopic pole, the vertical moving module is fixed on the rack of the conveyor belt, the horizontal moving module is fixed on the moving part of the vertical moving module, the telescopic pole is fixed on the moving part of the horizontal moving module, and the horizontal moving module and the vertical moving module are perpendicular to each other; a clamping block is provided on the telescopic rod of the telescopic pole, and the racks on both sides of the conveyor belt are provided with clamping assemblies; the clamping assembly is used to clamp the circuit board substrate, and the air nozzle of the air blowing assembly is used to blow up the copper foil to separate the copper foil from the circuit board substrate.

[0009] The vacuum suction cup sequentially sucks the copper foil and the circuit board substrate and then moves to the stacking platform driven by the X-axis moving module to stack the circuit board substrate and the copper foil.

[0010] It also includes a control system, which is a programmable PC.

[0011] The X-axis moving module and the Z-axis moving module are gear rack slide modules.

[0012] The vacuum suction cup is connected to a vacuum generator through a pipeline.

[0013] The vertical moving module and the horizontal moving module are any one of a pneumatic slide and an electric slide.

[0014] The clamping block is also provided with cushioning foam.

[0015] A plurality of the air nozzles are connected to an air compressor via pipelines.

[0016] The clamping block is also provided with an in-position sensor.

[0017] A visual sensor is arranged at the bottom of the vacuum suction cup.

[0018] A method for automatically disassembling circuit boards for circuit board production, based on the above-mentioned circuit board disassembling device, comprises the following steps: S1. Stack the cut circuit boards of the same size, put the stacked circuit boards into the front end of the conveyor belt, start the conveyor belt, and transport the stacked circuit boards to the preset position.

[0019] S2. The image collected by the visual sensor at the bottom of the vacuum suction cup is compared with the image stored in the control system, and the X-axis moving module is controlled to drive the vacuum suction cup to move along the X-axis direction, so that the vacuum suction cup is directly above the circuit board. According to the number of stacked layers of the circuit board, the control system controls the Z-axis moving module to drive the vacuum suction cup to move along the Z-axis direction.

[0020] S3. The clamping block in the clamping assembly clamps the circuit board under the drive of the telescopic pole, the vacuum generator is started, the vacuum suction cup absorbs the copper foil on the surface of the circuit board substrate, and the air blowing assembly blows air to the circuit board under the action of the air compressor to separate the copper foil on the surface of the circuit board substrate from the surface of the circuit board substrate.

[0021] S4. After sucking the copper foil, the vacuum suction cup drives the sucked copper foil to move to the stacking table under the action of the X-axis moving module, and each piece of copper foil after sucking is stacked on the stacking table.

[0022] S5. After the vacuum suction cup releases the sucked copper foil, it sucks the circuit board substrate driven by the X-axis moving module and transports it to the stacking table for stacking.

[0023] S6. After the copper foil on one side of the circuit board is sucked and stacked, the stacked circuit board substrate is turned over as a whole, and the above steps S1-S5 are repeated to separate the copper foil on the other side of the circuit board substrate.

[0024] The beneficial effects of the present invention are: The present invention has a high degree of automation. A vacuum suction cup is used to suck the copper foil on the surface of the circuit board substrate. While sucking, the clamping assembly clamps the circuit board substrate, so that the vacuum suction cup can more easily separate the copper foil from the circuit board substrate. The air nozzles arranged on both sides of the conveyor belt blow air to the copper foil, so that the copper foil can be more easily separated from the circuit board substrate. The separated copper foil and circuit board are stacked on the stacking table, which is more conducive to the flow of subsequent processes. The problem of chemical board removal being complicated and dangerous to operate is avoided, and the problem of low efficiency and easy damage to the copper foil and circuit board substrate in traditional mechanical board removal is also avoided. The present invention improves the efficiency of separating the copper foil from the circuit board substrate, has high safety, and a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 is a side view of the present invention; Figure 3 A top view of the present invention; Figure 4 It is a structural schematic diagram of the conveyor belt; Figure 5 is a schematic diagram of the structure of the clamping assembly; Figure 6It is a structural schematic diagram of the mobile mechanism; In the figure, 1-frame, 2-conveyor belt, 3-palletizing platform, 4-X-axis moving module, 5-Z-axis moving module, 6-vacuum suction cup, 7-air nozzle, 8-vertical moving module, 9-lateral moving module, 10-telescopic pole, 11-clamping block. DETAILED DESCRIPTION

[0026] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0027] like Figure 1 to Figure 6 As shown, an automatic board disassembly device for circuit board production includes a frame 1, a conveyor belt 2 and a stacking platform 3. The frame 1 is a frame with a hollow interior and a accommodating space. The conveyor belt 2 and the stacking platform 3 are arranged from left to right in the accommodating space formed by the frame 1.

[0028] A moving mechanism is provided on the frame 1, and the moving mechanism includes an X-axis moving module 4 and a Z-axis moving module 5. The X-axis moving module 4 is fixed to the upper part of the frame 1, and the Z-axis moving module 5 is fixed to the moving part of the X-axis moving module 4. The moving part of the Z-axis moving module 5 is fixed with a vacuum suction cup 6, and the vacuum suction cup 6 is located above the conveyor belt 2.

[0029] The conveyor belt 2 is provided with an air blowing assembly and a clamping assembly, the air blowing assembly includes a plurality of air nozzles 7, and the plurality of air nozzles 7 are evenly arranged on the frames on both sides of the conveyor belt 2; the clamping assembly includes a vertical moving module 8, a horizontal moving module 9 and a telescopic pole 10, the vertical moving module 8 is fixed on the frame of the conveyor belt 2, the horizontal moving module 9 is fixed on the moving part of the vertical moving module 8, the telescopic pole 10 is fixed on the moving part of the horizontal moving module 9, and the horizontal moving module 9 and the vertical moving module 8 are perpendicular to each other; a clamping block 11 is provided on the telescopic rod of the telescopic pole 10, and the frames on both sides of the conveyor belt 2 are provided with clamping assemblies; the clamping assembly is used to clamp the circuit board substrate, and the air nozzle 7 of the air blowing assembly is used to blow up the copper foil to separate the copper foil from the circuit board substrate.

[0030] The vacuum suction cup 6 sequentially absorbs the copper foil and the circuit board substrate, and then moves to the stacking platform 3 driven by the X-axis moving module 4 to stack the circuit board substrate and the copper foil.

[0031] It also includes a control system, which is a programmable PC.

[0032] The X-axis moving module 4 and the Z-axis moving module 5 are gear rack slide modules.

[0033] The vacuum suction cup 6 is connected to a vacuum generator via a pipeline.

[0034] The vertical moving module 8 and the horizontal moving module 9 are any one of a pneumatic slide and an electric slide.

[0035] The clamping block 11 is also provided with cushioning foam.

[0036] A plurality of the air nozzles 7 are connected to an air compressor via pipelines.

[0037] The clamping block 11 is also provided with an in-position sensor.

[0038] A visual sensor is disposed at the bottom of the vacuum suction cup 6 .

[0039] A method for automatically disassembling circuit boards for circuit board production, based on the above-mentioned circuit board disassembling device, comprises the following steps: S1. Stack the cut circuit boards of the same size, put the stacked circuit boards into the front end of the conveyor belt, start the conveyor belt, and transport the stacked circuit boards to the preset position; S2. The image collected by the visual sensor at the bottom of the vacuum chuck is compared with the image stored in the control system, and the X-axis moving module is controlled to drive the vacuum chuck to move along the X-axis direction, so that the vacuum chuck is directly above the circuit board. According to the number of stacked layers of the circuit board, the control system controls the Z-axis moving module to drive the vacuum chuck to move along the Z-axis direction; S3. The clamping block in the clamping assembly clamps the circuit board under the drive of the telescopic pole, the vacuum generator is started, the vacuum suction cup absorbs the copper foil on the surface of the circuit board substrate, and the air blowing assembly blows air to the circuit board under the action of the air compressor, so that the copper foil on the surface of the circuit board substrate is separated from the surface of the circuit board substrate; S4. After sucking the copper foil, the vacuum suction cup drives the sucked copper foil to move to the stacking table under the action of the X-axis moving module, and each copper foil after sucking is stacked on the stacking table; S5. After the vacuum suction cup releases the sucked copper foil, it sucks the circuit board substrate driven by the X-axis moving module and transports it to the stacking table for stacking; S6. After the copper foil on one side of the circuit board is sucked and stacked, the stacked circuit board substrate is turned over as a whole, and the above steps S1-S5 are repeated to separate the copper foil on the other side of the circuit board substrate.

[0040] The control system in the automatic board disassembly device for circuit board production of the present invention is a programmable PC, which pre-stores an image of the circuit board being conveyed to a preset position by a conveyor belt. The visual sensor at the bottom of the vacuum suction cup compares the pre-stored image. When the position of the circuit board does not meet the requirements, the X-axis moving module is automatically controlled to move along the X-axis direction so that the vacuum suction cup is directly above the circuit board. A piezoelectric sensor is also provided on the vacuum suction cup. When the piezoelectric sensor contacts the circuit board, an electric charge is generated and fed back to the controller in the form of voltage, and the controller controls the Z-axis moving module to stop. At this time, before starting the board removal work, it is necessary to determine the total height of the stacked circuit boards according to the thickness of the circuit boards, the thickness of the copper foil and the number of stacked layers of the circuit boards, and store the stacking height data, the number of circuit boards and the thickness of the circuit boards in the control system. After the controller controls the Z-axis moving module to stop, the vertical moving module in the clamping assembly is controlled to work according to the height of the stacked circuit boards, driving the telescopic pole and the lateral moving module to rise to a certain height, the rising height is equal to the height of the stacked circuit boards, and the lateral moving module is controlled to drive the telescopic pole to move toward the circuit board. The moving part of the lateral moving module reaches the end, and the telescopic pole is controlled to continue to move toward the circuit board. The clamping block on the telescopic pole is provided with an in-place sensor. When the in-place sensor detects that the clamping block forms a clamp with the circuit board, the in-place sensor outputs an electrical signal to the control system, and the control system immediately controls the telescopic pole to stop working. The racks on both sides of the conveyor belt are provided with clamping assemblies to clamp the circuit board substrate, so that the vacuum suction cup will not adsorb the circuit board substrate and the copper foil together when adsorbing the copper foil on the surface of the circuit board substrate, thereby causing the problem of failure to separate the copper foil and the circuit board substrate.

[0041] Next, after completing the clamping operation of the circuit board substrate, the control system controls the vacuum generator to start working, and the vacuum suction cup begins to absorb the copper foil on the surface of the circuit board substrate. At this time, the control system turns on the air compressor, and the airflow generated by the air compressor is transmitted to the copper foil on the surface of the circuit board substrate through several air nozzles, so that the copper foil around the circuit board substrate begins to separate from the surface of the circuit board substrate under the influence of the airflow, and the clamping assembly firmly clamps the circuit board substrate, making it easier for the vacuum suction cup to separate the copper foil from the surface of the circuit board substrate.

[0042] After completing the disassembly of the first circuit board, the control system controls the height of the vertical moving component to descend according to the thickness of a single circuit board and the thickness of the copper foil. At this time, the descending height is equal to the sum of the thickness of the circuit board and the thickness of the copper foil of one board. The clamping component continues to clamp the second circuit board, and so on to complete all the disassembly work.

[0043] The present invention has a high degree of automation. A vacuum suction cup is used to suck the copper foil on the surface of the circuit board substrate. While sucking, the clamping assembly clamps the circuit board substrate, so that the vacuum suction cup can more easily separate the copper foil from the circuit board substrate. The air nozzles arranged on both sides of the conveyor belt blow air to the copper foil, so that the copper foil can be more easily separated from the circuit board substrate. The separated copper foil and circuit board are stacked on the stacking table, which is more conducive to the flow of subsequent processes. The problem of chemical board removal being complicated and dangerous to operate is avoided, and the problem of low efficiency and easy damage to the copper foil and circuit board substrate in traditional mechanical board removal is also avoided. The present invention improves the efficiency of separating the copper foil from the circuit board substrate, has high safety, and a high degree of automation.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automatic circuit board disassembly device for circuit board production, characterized in that: It comprises a frame (1), a conveyor belt (2) and a stacking platform (3), wherein the frame (1) is hollow inside and has a storage space, and the conveyor belt (2) and the stacking platform (3) are arranged from left to right in the storage space formed by the frame (1); The frame (1) is provided with a moving mechanism, the moving mechanism comprising an X-axis moving module (4) and a Z-axis moving module (5), the X-axis moving module (4) being fixed to the upper part of the frame (1), the Z-axis moving module (5) being fixed to the moving part of the X-axis moving module (4), the moving part of the Z-axis moving module (5) being fixed with a vacuum suction cup (6), and the vacuum suction cup (6) being located above the conveyor belt (2); The conveyor belt (2) is provided with an air blowing assembly and a clamping assembly, the air blowing assembly comprising a plurality of air nozzles (7), the plurality of air nozzles (7) being evenly arranged on the frames on both sides of the conveyor belt (2); the clamping assembly comprising a vertical moving module (8), a horizontal moving module (9) and a telescopic pole (10), the vertical moving module (8) being fixed on the frame of the conveyor belt (2), the horizontal moving module (9) being fixed on the moving part of the vertical moving module (8), the telescopic pole (10) being fixed on the moving part of the horizontal moving module (9), the horizontal moving module (9) and the vertical moving module (8) being perpendicular to each other; a clamping block (11) being arranged on the telescopic rod of the telescopic pole (10), and the frames on both sides of the conveyor belt (2) being provided with clamping assemblies; the clamping assembly is used for clamping a circuit board substrate, and the air nozzle (7) of the air blowing assembly is used for blowing up copper foil so as to separate the copper foil from the circuit board substrate; The vacuum suction cup (6) sequentially sucks the copper foil and the circuit board substrate and then moves to the stacking platform (3) driven by the X-axis moving module (4) to stack the circuit board substrate and the copper foil; It also includes a control system, which is a programmable PC.

2. The automatic circuit board disassembly device for circuit board production according to claim 1 is characterized in that: The X-axis moving module (4) and the Z-axis moving module (5) are gear rack slide modules.

3. The automatic circuit board disassembly device for circuit board production according to claim 1 is characterized in that: The vacuum suction cup (6) is connected to a vacuum generator via a pipeline.

4. The automatic circuit board disassembly device for circuit board production according to claim 1, characterized in that: The vertical moving module (8) and the horizontal moving module (9) are any one of a pneumatic slide and an electric slide.

5. The automatic circuit board disassembly device for circuit board production according to claim 1 is characterized in that: The clamping block (11) is also provided with a cushioning foam.

6. The automatic circuit board disassembly device for circuit board production according to claim 1, characterized in that: A plurality of the air nozzles (7) are connected to an air compressor via pipelines.

7. The automatic circuit board disassembly device for circuit board production according to claim 1, characterized in that: The clamping block (11) is also provided with an in-position sensor.

8. The automatic circuit board disassembly device for circuit board production according to claim 1, characterized in that: A visual sensor is provided at the bottom of the vacuum suction cup (6).

9. A method for automated circuit board disassembly for circuit board production, based on the circuit board disassembly device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Stack the cut circuit boards of the same size, put the stacked circuit boards into the front end of the conveyor belt, start the conveyor belt, and transport the stacked circuit boards to the preset position; S2. The image collected by the visual sensor at the bottom of the vacuum chuck is compared with the image stored in the control system, and the X-axis moving module is controlled to drive the vacuum chuck to move along the X-axis direction, so that the vacuum chuck is directly above the circuit board. According to the number of stacked layers of the circuit board, the control system controls the Z-axis moving module to drive the vacuum chuck to move along the Z-axis direction; S3. The clamping block in the clamping assembly clamps the circuit board under the drive of the telescopic pole, the vacuum generator is started, the vacuum suction cup absorbs the copper foil on the surface of the circuit board substrate, and the air blowing assembly blows air to the circuit board under the action of the air compressor, so that the copper foil on the surface of the circuit board substrate is separated from the surface of the circuit board substrate; S4. After sucking the copper foil, the vacuum suction cup drives the sucked copper foil to move to the stacking table under the action of the X-axis moving module, and each copper foil after sucking is stacked on the stacking table; S5. After the vacuum suction cup releases the sucked copper foil, it sucks the circuit board substrate driven by the X-axis moving module and transports it to the stacking table for stacking; S6. After the copper foil on one side of the circuit board is sucked and stacked, the stacked circuit board substrate is turned over as a whole, and the above steps S1-S5 are repeated to separate the copper foil on the other side of the circuit board substrate.

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