Wafer vapor deposition system and heating component

Abstract

The present invention relates to the field of wafer vapor deposition technology, and in particular to a wafer vapor deposition system and a heating assembly, including a tray structure, which includes a tray body and a first insulation cylinder arranged horizontally, the tray body is used to support and heat the wafer, and the first insulation cylinder is coaxially fixed to the bottom of the tray body; a heating structure, which includes an insulation board and a heating plate fixedly arranged on the top surface of the insulation board and an intermediate column coaxially fixed to the bottom of the insulation board, the heating plate is coaxially arranged inside the first insulation cylinder and located directly below the tray body, the heating plate is used to heat the tray body, and the bottom end of the intermediate column extends downward from the bottom end of the first insulation cylinder; a counter-rotating transmission mechanism, which can make the tray body and the insulation board rotate coaxially and counter-rotatingly; an alternating rotation driving mechanism, which is used to drive the tray structure or the heating structure to rotate alternately; and an outer frame, which is wrapped around the periphery of the tray structure and part of the heating structure. The present invention can achieve uniform heating of the wafer when the heating plate locally heats unevenly.

Description

Technical Field

[0001] The invention relates to the technical field of wafer vapor deposition, and in particular to a wafer vapor deposition system and a heating component. Background Art

[0002] Wafer vapor deposition is a technology that deposits a specific material layer on the surface of a wafer (silicon chip). Wafer vapor deposition mostly uses chemical vapor deposition (CVD). Chemical vapor deposition is to introduce gases containing the required elements into the reaction chamber, and then decompose these gases by heating to form the required materials and gradually deposit them on the surface of the wafer. The gas does not directly react with the wafer surface, and the wafer surface only serves as the bottom layer.

[0003] The heating plate plays a vital role in the wafer chemical vapor deposition process. Uniform temperature distribution is crucial to the vapor deposition process because it ensures that the entire wafer receives the same thermal treatment during the deposition process, thereby avoiding uneven deposition or defects due to temperature differences.

[0004] However, the current heating plate is still prone to local over-temperature or over-temperature when heating the wafer, that is, there is a problem with the uniformity of the heating temperature of the heating plate, which in turn leads to uneven temperature on the tray, and ultimately causes the wafer to be unable to be evenly heated, affecting the results of vapor deposition. Summary of the invention

[0005] The object of the present invention is to provide a wafer vapor deposition system and a heating assembly to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a heating component, comprising:

[0007] A tray structure, comprising a tray body and a first heat-insulating cylinder arranged horizontally, the tray body being used to support and heat the wafer, and the first heat-insulating cylinder being coaxially fixed to the bottom of the tray body;

[0008] A heating structure, comprising a heat insulation board, a heating plate fixedly arranged on the top surface of the heat insulation board, and an intermediate column coaxially fixed to the bottom of the heat insulation board, the heating plate coaxially arranged inside the first heat insulation cylinder and located directly below the tray body, the heating plate is used to heat the tray body, and the bottom end of the intermediate column extends downward from the bottom end of the first heat insulation cylinder;

[0009] The counter-rotating transmission mechanism can make the tray body and the heat insulation board rotate coaxially and in counter directions;

[0010] An alternating rotation driving mechanism, used for driving the tray structure or the heating structure to rotate alternately;

[0011] An outer frame, wrapped around the periphery of the tray structure and part of the heating structure.

[0012] Preferably, the heating plate is in the shape of a circular plate as a whole, and comprises an outer ring portion and an inner circle portion which are concentrically arranged;

[0013] The outer ring part includes a plurality of fan-shaped heating blocks;

[0014] The inner circle portion includes two semicircular heating blocks;

[0015] Among them, the two semicircular heating blocks are respectively formed integrally with two oppositely arranged fan-shaped heating blocks among the plurality of fan-shaped heating blocks.

[0016] Preferably, the counter-rotation transmission mechanism comprises a first bevel gear and a second bevel gear arranged opposite to each other and a third bevel gear meshed between the first bevel gear and the second bevel gear;

[0017] The first bevel gear is fixedly sleeved on the periphery of the first heat-insulating cylinder;

[0018] The second bevel gear is fixedly sleeved on the periphery of the annular plate, and the annular plate is coaxially fixed on the periphery of the intermediate column;

[0019] The third bevel gear is rotatably connected to the outer frame through the bearing seat.

[0020] Preferably, a first bearing is provided on the upper surface of the annular plate, and the annular plate is rotatably connected to the bottom end of the first thermal insulation cylinder via the first bearing.

[0021] Preferably, the alternating rotation drive mechanism comprises a lifting sleeve and a spiral groove provided at the bottom of the outer peripheral surface of the intermediate column, the lifting sleeve is arranged at the periphery of the intermediate column, and a protrusion that can slide in the spiral groove is fixed on the inner peripheral surface of the lifting sleeve;

[0022] The lifting sleeve is driven by a driving component to perform vertical lifting.

[0023] Preferably, the driving component comprises a push rod motor, a bottom fixed end of the push rod motor is fixedly mounted on the bottom of the outer frame via a mounting frame, and a top lifting end of the push rod motor is fixedly connected to the lifting sleeve.

[0024] Preferably, the outer frame comprises a second heat-insulating tube and a heat-insulating top plate, and the heat-insulating top plate is fixedly mounted on the top end of the second heat-insulating tube by bolts;

[0025] A circular hole is provided in the middle of the heat-insulating top plate, and the tray body is arranged in the circular hole.

[0026] Preferably, an inner ring is fixed to the bottom of the annular plate, an outer ring is rotatably sleeved on the outer side of the inner ring via a second bearing, and a plurality of support rods are fixed between the outer ring and the inner wall of the second heat-insulating cylinder.

[0027] Preferably, a plurality of wafer positioning members are arranged around the edge of the upper surface of the tray body.

[0028] A wafer vapor deposition system comprises the above-mentioned heating component.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. The present invention provides a counter-rotating transmission mechanism so that the tray body and the heating plate can rotate synchronously in counter-rotating directions. At this time, the heating plate can be used to realize rotational heating of the tray body, and the heating uniformity is good. Furthermore, since the rotation angular velocity of the tray body and the heating plate is the same, but the rotation directions of the two are opposite, the rotation speed of the tray body relative to the heating plate is twice the rotation speed of the tray body relative to the external frame. Therefore, on the one hand, in order to ensure the stability of the tray body and the wafers placed thereon, the rotation speed of the tray body relative to the external frame can be set to a speed at which the wafers can maintain stability, which is conducive to ensuring that the wafer vapor deposition process can be completed smoothly and the consistency of the thickness of the deposited film can be ensured. On the other hand, although the heating plate and the rotation speed are consistent with the tray body, since the two rotate in opposite directions, the heating plate is at a higher rotation speed state relative to the tray body. In this way, even if the heating plate has a small amount of uneven heating due to its own defects, it will be compensated due to the high rotation speed of the heating plate relative to the tray body, and will not cause uneven heating of the tray body and the wafers. Uniform heating of the wafers is conducive to improving the deposition effect.

[0031] 2. The present invention divides the heating plate into two parts, an outer ring and an inner circle, which are arranged concentrically, and uses a plurality of fan-shaped heating blocks to fill the outer ring part and two semicircular heating blocks to fill the inner circle part. Therefore, because the outer ring part is formed by splicing a plurality of fan-shaped heating blocks, and each fan-shaped heating block is independently powered, even if one of the fan-shaped heating blocks is suddenly damaged during use and cannot generate heat, the remaining fan-shaped heating blocks will continue to complete the continuous, stable and uniform heating of the tray body and the wafer due to the high rotation speed of the heating plate relative to the tray body, and the entire vapor deposition process will not be interrupted due to the damage of a certain fan-shaped heating block; further, because the two semicircular heating blocks fill the inner circle part, and the two semicircular heating blocks are respectively integrally formed with two relatively arranged fan-shaped heating blocks among the plurality of fan-shaped heating blocks, it is convenient to install and layout the resistance wire at the center position of the heating plate, so that accurate and uniform heating of the center position of the tray body can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a three-dimensional structural schematic diagram of the tray structure and the different-direction rotation transmission mechanism of the present invention;

[0033] Figure 2 For the present invention Figure 1 A schematic diagram of a front cross-sectional structure;

[0034] Figure 3 It is a schematic diagram of the three-dimensional structure of the heating structure of the present invention;

[0035] Figure 4 For the present invention Figure 3 A schematic diagram of a top view structure;

[0036] Figure 5 It is a schematic diagram of the overall structure of the present invention;

[0037] Figure 6 It is a schematic diagram of the overall front view structure of the present invention;

[0038] Figure 7 It is a schematic diagram of the cross-sectional three-dimensional structure of the external frame of the present invention;

[0039] Figure 8 It is a schematic diagram of the cross-sectional three-dimensional structure of the external frame of the present invention;

[0040] Fig. 9 For the present invention Figure 8 The enlarged structural diagram at A in the middle;

[0041] Fig.10 For the present invention Figure 7 Schematic diagram of the front view structure.

[0042] In the figure: 1. tray structure; 11. tray body; 12. first thermal insulation tube; 13. wafer positioning member; 2. heating structure; 21. thermal insulation plate; 22. heating plate; 221. fan-shaped heating block; 222. semicircular heating block; 23. intermediate column; 24. annular plate; 25. first bearing; 3. counter-rotation transmission mechanism; 31. first bevel gear; 32. second bevel gear; 33. third bevel gear; 34. bearing seat; 4. alternating rotation drive mechanism; 41. lifting sleeve; 42. spiral groove; 43. push rod motor; 44. mounting frame; 5. outer frame; 51. second thermal insulation tube; 52. thermal insulation top plate; 521. round hole; 53. outer ring; 54. inner ring; 55. second bearing; 56. support rod; 57. bolt. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] See also Figure 1-Figure 10 , the present invention provides a technical solution:

[0045] A heating assembly comprises a tray structure 1, a heating structure 2, a different-direction rotation transmission mechanism 3, an alternating rotation drive mechanism 4 and an outer frame 5. The structures and working principles of the five parts are described in detail online.

[0046] The tray structure 1 includes a horizontally arranged tray body 11 and a first insulation cylinder 12. The tray body 11 is used to support and heat the wafer. The first insulation cylinder 12 is coaxially fixed at the bottom of the tray body 11. Specifically, in the present embodiment, the tray body 11 is a circular plate, and its diameter is equal to the outer diameter of the first insulation cylinder 12. The tray body 11 is made of a heat-conducting material, so that the heating structure 2 can first heat the tray body 11, and then the tray body 11 heats the wafer. Furthermore, a plurality of wafer positioning members 13 are arranged around the edge of the upper surface of the tray body 11. The wafer positioning members 13 are used to limit the position of the wafer and improve the stability of the wafer.

[0047] like Figure 2 and Figure 3 As shown, the heating structure 2 includes a heat insulation board 21 and a heating plate 22 fixedly arranged on the top surface of the heat insulation board 21 and an intermediate column 23 coaxially fixed to the bottom of the heat insulation board 21. The heat insulation board 21 is supported on the bottom of the heating plate 22 to prevent heat loss. The heating plate 22 is coaxially arranged inside the first heat insulation tube 12 and is located directly below the tray body 11. The heating plate 22 is used to heat the tray body 11. The heating plate 22 in this embodiment is a resistance wire heating plate, which can directly convert electrical energy into thermal energy. The bottom end of the intermediate column 23 extends downward from the bottom end of the first heat insulation tube 12. It can be seen from the figure that the diameter of the intermediate column 23 is smaller than the diameter of the heat insulation board 21, and the intermediate column 23 is a hollow tube, and its interior is used to arrange the power line of the heating plate 22; further, as Figure 1-Figure 4 As shown, the heating plate 22 is in the shape of a circular plate as a whole, and includes an outer ring part and an inner circle part which are arranged concentrically; the outer ring part includes a plurality of fan-shaped heating blocks 221; the inner circle part includes two semicircular heating blocks 222; wherein the two semicircular heating blocks 222 are respectively integrally formed with two oppositely arranged fan-shaped heating blocks 221 among the plurality of fan-shaped heating blocks 221.

[0048] The counter-rotating transmission mechanism 3 can make the tray body 11 and the insulation plate 21 rotate coaxially and in opposite directions; specifically, the counter-rotating transmission mechanism 3 includes a first bevel gear 31 and a second bevel gear 32 arranged opposite to each other and a third bevel gear 33 meshing between the first bevel gear 31 and the second bevel gear 32. By rotating any one of the first bevel gear 31, the second bevel gear 32 and the third bevel gear 33, the first bevel gear 31 and the second bevel gear 32 can rotate in synchronous directions; the first bevel gear 31 is fixedly sleeved on the periphery of the first insulation tube 12; the second bevel gear 32 is fixedly sleeved on the periphery of the annular plate 24, and the annular plate 24 is coaxially fixed on the periphery of the intermediate column 23; the third bevel gear 33 is rotatably connected to the outer frame 5 through a bearing seat 34.

[0049] A first bearing 25 is disposed on the upper surface of the annular plate 24 , and the annular plate 24 is rotatably connected to the bottom end of the first heat-insulating cylinder 12 via the first bearing 25 .

[0050] The alternating rotation drive mechanism 4 is used to drive the tray structure 1 or the heating structure 2 to rotate alternately; specifically, the alternating rotation drive mechanism 4 includes a lifting sleeve 41 and a spiral groove 42 opened at the bottom of the outer circumference of the intermediate column 23, the lifting sleeve 41 is sleeved on the outer periphery of the intermediate column 23, and the inner circumference of the lifting sleeve 41 is fixed with a protrusion that can slide in the spiral groove 42; the lifting sleeve 41 is driven by a driving component to perform vertical lifting; further, the driving component includes a push rod motor 43, the bottom fixed end of the push rod motor 43 is fixedly installed on the bottom of the outer frame 5 through a mounting frame 44, and the top lifting end of the push rod motor 43 is fixedly connected to the lifting sleeve 41.

[0051] The outer frame 5 is wrapped around the outer circumference of the tray structure 1 and part of the heating structure 2; specifically, the outer frame 5 includes a second insulation tube 51 and an insulation top plate 52, the insulation top plate 52 is a circular plate, the diameter of the insulation top plate 52 is equal to the diameter of the second insulation tube 51, the second insulation tube 51 is a structure with an open top and a closed bottom, and the insulation top plate 52 is fixedly installed on the top of the second insulation tube 51 by bolts 57; a circular hole 521 is opened in the middle of the insulation top plate 52, and the tray body 11 is arranged in the circular hole 521; an inner ring 54 is fixed to the bottom of the annular plate 24, and an outer ring 53 is rotatably sleeved on the outer side of the inner ring 54 through a second bearing 55, and a plurality of support rods 56 are fixed between the outer ring 53 and the inner wall of the second insulation tube 51.

[0052] The basic working principle of the above technical solution is as follows: first, the wafer is placed on the upper surface of the tray body 11 of the tray structure 1, and the wafer is surrounded by a plurality of wafer positioning members 13 in the middle to limit the position of the wafer and prevent the wafer from shifting during the subsequent heating process; then the push rod motor 43 is started to drive the lifting end of the push rod motor 43 to reciprocate up and down. During this process, since the top lifting end of the push rod motor 43 is fixedly connected to the lifting sleeve 41, the lifting sleeve 41 can only perform vertical lifting movement but not rotational movement. Therefore, in conjunction with the spiral groove 42 and the protrusion fixed on the inner circumference of the lifting sleeve 41, the lifting movement of the lifting sleeve 41 can be converted into the alternating clockwise and counterclockwise rotation movement of the intermediate column 23 (for example, when the lifting sleeve 41 is raised, the intermediate column 23 will rotate clockwise, and when the lifting sleeve 41 is lowered, the intermediate column 23 will rotate clockwise). 3 will rotate counterclockwise), the rotation of the intermediate column 23 will also drive the heat insulation plate 21 and the heating plate 22 fixedly connected thereto to rotate together. Since the intermediate column 23 is fixedly connected to the second bevel gear 32 through the annular plate 24, the rotation of the intermediate column 23 will directly drive the second bevel gear 32 to rotate together. Since the second bevel gear 32 is meshed with the first bevel gear 31 through the third bevel gear 33, the first bevel gear 31 will move synchronously with the second bevel gear 32 but in the opposite direction. The first bevel gear 31 is fixedly connected to the first heat insulation tube 12, and the first heat insulation tube 12 is fixedly connected to the tray body 11, so it will eventually drive the tray body 11 to rotate; therefore, the tray body 11 and the heating plate 22 will rotate synchronously in opposite directions. At this time, the heating plate 22 can be used to realize rotational heating of the tray body 11, and the heating uniformity is good.

[0053] The beneficial effects that can be achieved by the above technical solution are:

[0054] First, by setting up the counter-rotating transmission mechanism 3, the tray body 11 and the heating plate 22 are allowed to rotate synchronously in counter-rotating directions. At this time, the heating plate 22 can be used to realize rotational heating of the tray body 11, and the heating uniformity is good; further, since the rotation angular velocity of the tray body 11 and the heating plate 22 is the same, but the rotation directions of the two are opposite, therefore, relative to the heating plate 22, the rotation speed of the tray body 11 is twice the rotation speed of the tray body 11 relative to the outer frame 5. For example, if the rotation speed of the tray body 11 relative to the outer frame 5 is 20rpm (20 revolutions per minute), the rotation speed of the tray body 11 relative to the heating plate 22 is 40rpm. Of course, the specific rotation speed can be adjusted according to the actual situation. Therefore, on the one hand, in order to ensure the stability of the tray body 11 and the wafers placed thereon, the rotation speed of the tray body 11 relative to the outer frame 5 can be set to a speed at which the wafers can maintain stability, which is beneficial to Ensure that the wafer vapor deposition process can be completed smoothly and ensure the consistency of the thickness of the deposited film. On the other hand, although the heating plate 22 and the rotation speed are consistent with the tray body 11, since the two rotate in opposite directions, the heating plate 22 is at a higher rotation speed relative to the tray body 11. In this way, even if the heating plate 22 generates a small amount of uneven heat due to its own defects, it will be compensated by the high rotation speed of the heating plate 22 relative to the tray body 11 (for example, when the temperature of the tray body 11 is locally low, since the heating plate 22 has a higher rotation speed relative to the tray body 11, other positions of the heating plate 22 that have reached the target temperature will compensate for the insufficient heat generated by the local low-temperature position, ensuring that the position of the tray body 11 corresponding to the local low-temperature position can also reach the target temperature), and will not cause uneven heating of the tray body 11 and the wafer. Uniform heating of the wafer is conducive to improving the deposition effect.

[0055] Secondly, by dividing the heating plate 22 into two parts, an outer ring and an inner circle, which are arranged concentrically, and using a plurality of fan-shaped heating blocks 221 to fill the outer ring part, and two semicircular heating blocks 222 to fill the inner circle part, since the outer ring part is formed by splicing a plurality of fan-shaped heating blocks 221, and each fan-shaped heating block 221 is independently powered, even if one of the fan-shaped heating blocks 221 is suddenly damaged during use and cannot generate heat, the remaining fan-shaped heating blocks 221 will continue to complete the continuous, stable and uniform heating of the tray body 11 and the wafer due to the high rotation speed of the heating plate 22 relative to the tray body 11, and the entire vapor deposition process will not be interrupted due to the damage of a certain fan-shaped heating block 221; further, since the two semicircular heating blocks 222 fill the inner circle part, and the two semicircular heating blocks 222 are respectively integrally formed with two oppositely arranged fan-shaped heating blocks 221 among the plurality of fan-shaped heating blocks 221, it is convenient to install and layout the resistance wire at the center position of the heating plate 22, so that accurate and uniform heating of the center position of the tray body 11 can be achieved;

[0056] In addition, by setting up the alternating rotation drive mechanism 4, the tray body 11 and the heating plate 22 can be rotated clockwise for a certain angle and then counterclockwise for the same angle. That is, during the whole process, the heating plate 22 does not rotate in the same direction all the time. In this way, the heating plate 22 can be directly connected to the power supply through a wire, ensuring that the heating plate 22 can maintain a stable connection with the power supply for a long time, and will not be disconnected from the power supply for a moment during the rotation of the heating plate 22, that is, ensuring that the heating plate 22 can continue to generate heat stably, which is more conducive to ensuring uniform heating of the wafer; moreover, the design of the lifting sleeve 41 and the spiral groove 42 makes it possible to realize the alternating rotation of the heating plate 22 by only pushing the lifting sleeve 41 to perform a lifting and reciprocating motion. In combination with the push rod motor 43, the radial size of the entire heating assembly can be reduced, which is convenient for the installation and application of the entire heating assembly.

[0057] A wafer vapor deposition system comprises the above-mentioned heating component.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heating component, characterized in that: include: A tray structure, comprising a tray body and a first heat-insulating cylinder arranged horizontally, the tray body being used to support and heat the wafer, and the first heat-insulating cylinder being coaxially fixed to the bottom of the tray body; A heating structure, comprising a heat insulation board, a heating plate fixedly arranged on the top surface of the heat insulation board, and an intermediate column coaxially fixed to the bottom of the heat insulation board, the heating plate coaxially arranged inside the first heat insulation cylinder and located directly below the tray body, the heating plate is used to heat the tray body, and the bottom end of the intermediate column extends downward from the bottom end of the first heat insulation cylinder; The counter-rotating transmission mechanism can make the tray body and the heat insulation board rotate coaxially and in counter directions; the counter-rotating transmission mechanism includes a first bevel gear and a second bevel gear arranged opposite to each other and a third bevel gear meshing between the first bevel gear and the second bevel gear; the first bevel gear is fixedly sleeved on the periphery of the first heat insulation cylinder; the second bevel gear is fixedly sleeved on the periphery of the annular plate, and the annular plate is coaxially fixed on the periphery of the intermediate column; the third bevel gear is rotatably connected to the outer frame through a bearing seat; The alternating rotation driving mechanism is used to drive the tray structure or the heating structure to rotate in an alternating direction; the alternating rotation driving mechanism includes a lifting sleeve and a spiral groove provided at the bottom of the outer peripheral surface of the intermediate column, the lifting sleeve is arranged on the outer periphery of the intermediate column, and a protrusion that can slide in the spiral groove is fixed on the inner peripheral surface of the lifting sleeve; The lifting sleeve is driven by a driving component to perform vertical lifting; An outer frame, wrapped around the periphery of the tray structure and part of the heating structure.

2. A heating assembly according to claim 1, characterized in that: The heating plate is in the shape of a circular plate as a whole, and comprises an outer ring part and an inner circle part which are arranged concentrically; The outer ring part includes a plurality of fan-shaped heating blocks; The inner circle portion includes two semicircular heating blocks; Among them, the two semicircular heating blocks are respectively formed integrally with two oppositely arranged fan-shaped heating blocks among the plurality of fan-shaped heating blocks.

3. A heating assembly according to claim 1, characterized in that: A first bearing is arranged on the upper surface of the annular plate, and the annular plate is rotatably connected to the bottom end of the first heat-insulating cylinder through the first bearing.

4. A heating assembly according to claim 1, characterized in that: The driving component comprises a push rod motor, the bottom fixed end of the push rod motor is fixedly mounted on the bottom of the outer frame through a mounting frame, and the top lifting end of the push rod motor is fixedly connected to the lifting sleeve.

5. A heating assembly according to claim 1, characterized in that: The outer frame includes a second heat-insulating tube and a heat-insulating top plate, and the heat-insulating top plate is fixedly mounted on the top of the second heat-insulating tube by bolts; A circular hole is provided in the middle of the heat-insulating top plate, and the tray body is arranged in the circular hole.

6. A heating assembly according to claim 5, characterized in that: An inner ring is fixed at the bottom of the annular plate, an outer ring is rotatably sleeved on the outer side of the inner ring through a second bearing, and a plurality of supporting rods are fixed between the outer ring and the inner wall of the second heat-insulating cylinder.

7. A heating assembly according to claim 1, characterized in that: A plurality of wafer positioning parts are arranged around the edge of the upper surface of the tray body.

8. A wafer vapor deposition system, characterized in that: The wafer vapor deposition system comprises the heating component described in any one of claims 1 to 7.

Images