Electroplating device, electroplating method and electroplating system for packaging substrate

Abstract

The invention discloses an electroplating device, an electroplating method and an electroplating system for a packaging substrate, and the electroplating device comprises a transmission device which is used for transporting a to-be-packaged substrate; the rectifier comprises a first sub-rectifier and a second sub-rectifier, and the cathode of the rectifier is connected with the transmission device; the anode plates are arranged at one end of the rectifier and are respectively arranged on two sides of the transmission device; the anode of the first sub-rectifier is connected with the anode plate on one side, and the anode of the second sub-rectifier is connected with the anode plate on the opposite side; wherein the first sub-rectifier and the second sub-rectifier respectively provide the same or different voltages for two sides of the same substrate to be packaged or different substrates to be packaged. By means of the mode, the controllability of the current in the electroplating process is improved, it is guaranteed that the thickness of an electroplated layer is uniform and consistent, and various electroplating requirements are met.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit manufacturing, and in particular to an electroplating device, an electroplating method and an electroplating system for a packaging substrate. Background Art

[0002] Electroplating is one of the important processes in the production and manufacturing of integrated circuit boards. The electroplating process of the packaging substrate can be divided into pattern electroplating and full-board electroplating from the perspective of technology. It can also be divided into hole-filling electroplating and non-hole-filling electroplating based on whether the holes are filled.

[0003] Different electroplating panels have different electroplating requirements. The current conventional electroplating method can no longer meet the diverse needs and can easily lead to uneven electroplating layers on the packaging substrate, affecting subsequent production and processing. Summary of the invention

[0004] The main technical problem solved by the present application is to provide an electroplating device, an electroplating method and an electroplating system for a packaging substrate, so as to improve the controllability of the current during the electroplating process, ensure that the thickness of the electroplating layer is uniform, and meet various electroplating requirements.

[0005] In order to solve the above technical problems, the technical solution adopted in the present application provides an electroplating device for a packaging substrate, wherein the electroplating device comprises:

[0006] A transmission device, which transports the substrate to be packaged; at least one rectifier, which includes a first sub-rectifier and a second sub-rectifier, and the negative electrode of the rectifier is connected to the transmission device; an anode plate, which is arranged at one end of the rectifier and is respectively arranged on both sides of the transmission device; the positive electrode of the first sub-rectifier is connected to the anode plate on one side, and the positive electrode of the second sub-rectifier is connected to the anode plate on the opposite side; wherein the first sub-rectifier and the second sub-rectifier respectively provide the same or different voltages to both sides of the same substrate to be packaged or different substrates to be packaged.

[0007] The electroplating device further comprises: a first sub-rectifier and a second sub-rectifier are respectively arranged on both sides of the transmission device, and are arranged on the same side as the correspondingly connected anode plate.

[0008] Among them, the electroplating device also includes: a rectifier and a plurality of correspondingly connected anode plates forming a plurality of electroplating sections; a proximity switch, which is arranged close to the transmission device and turns on the rectifier located in the electroplating section when it detects that there is a substrate to be packaged in the electroplating section.

[0009] Among them, the transmission device includes: a plurality of guide rails and hangers in the electroplating section, adjacent hangers are movably connected to different guide rails to clamp the substrates to be packaged; the negative poles of the rectifiers are respectively connected to different guide rails; the positive poles of the plurality of first sub-rectifiers in the electroplating section are connected to the same anode plate on one side of the movable guide rail, and the positive poles of the plurality of second sub-rectifiers are connected to the same anode plate on the other side of the movable guide rail.

[0010] Among them, the electroplating device also includes: an electroplating tank, in which a plating liquid is arranged, and an anode plate is arranged in the electroplating tank and immersed in the plating liquid; a transmission device allows the substrate to be packaged to be immersed in the plating liquid, and an electroplating circuit is formed between the rectifier, the anode plate, the plating liquid, the packaged substrate and the transmission device.

[0011] Among them, the electroplating device also includes: jet devices are also arranged on both sides of the transmission device, and the jet devices are arranged between the transmission device and the anode plate; the corresponding jet devices on both sides are arranged facing the transmission device to spray the electroplating liquid to both sides of the substrate to be packaged.

[0012] The electroplating device further comprises: an anode baffle, which is correspondingly arranged between the transmission device and the anode plate.

[0013] In order to solve the above technical problems, the second aspect of the present application provides an electroplating method for a packaging substrate, the electroplating method comprising:

[0014] The rectifiers connected to the transmission device are turned on to control the current of the rectifiers respectively; the transmission device is controlled to transport the substrate to be packaged so that the substrate to be packaged is located between the anode plates, and the substrate to be packaged is electroplated.

[0015] The electroplating method includes: setting the current size of each rectifier of multiple electroplating sections to present a step current; the proximity switch of the electroplating section detects that the package substrate is transported to the electroplating section, and turns on the rectifier and the jet device of the electroplating section.

[0016] In order to solve the above technical problems, the third aspect of the present application provides an electroplating system for a packaging substrate, the system comprising:

[0017] An electroplating device for a packaging substrate, such as any of the electroplating devices for a packaging substrate described above; an electronic device, the electronic device comprising: a memory and a processor, the memory storing program instructions, the processor retrieving the program instructions from the memory to execute corresponding methods for electroplating a packaging substrate such as any of the above.

[0018] Different from the prior art, the present application provides a packaging substrate electroplating device, electroplating method and electroplating system, which can realize load sharing of the rectifier through electroplating through a sub-rectifier, extend the production life, improve the controllability of the current during the electroplating process, perform refined processing, ensure the uniform thickness of the electroplating layer, meet various electroplating requirements, and improve the production quality and efficiency of the packaging substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a top view of the structure of an embodiment of an electroplating device for a package substrate of the present application;

[0020] Figure 2 It is a structural front view of an embodiment of an electroplating device for a package substrate of the present application;

[0021] Figure 3 It is a top view of the structure of another embodiment of the electroplating device for packaging substrate of the present application;

[0022] Figure 4 It is a structural side view of another embodiment of the electroplating device for packaging substrate of the present application;

[0023] Figure 5 It is a schematic diagram of the rack structure of another embodiment of the electroplating device for packaging substrates of the present application;

[0024] Figure 6 It is a schematic flow chart of an implementation method of an electroplating method for a packaging substrate of the present application;

[0025] Figure 7 It is a schematic flow chart of another embodiment of a method for electroplating a packaging substrate of the present application;

[0026] Figure 8 It is a structural schematic diagram of an implementation scheme of an electroplating system for a packaging substrate of the present application. DETAILED DESCRIPTION

[0027] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0028] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0029] The term "and / or" in this article is only a description of the association relationship of the associated objects. There can be three kinds of relationships. For example, A and / or B can be: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally means that the associated objects before and after are in an "or" relationship. In addition, "more" in this article means two or more than two.

[0030] The rectifier and circuit configuration of the electroplating device in the figure are schematic diagrams of circuit logic, and the specific rectifier structure is based on the rectifier used in actual production for reference.

[0031] The present application first provides an electroplating device for a package substrate, see Figure 1 and Figure 2 , Figure 1 It is a top view of the structure of an embodiment of an electroplating device for a package substrate of the present application. Figure 2 It is a structural front view of an embodiment of an electroplating device for a package substrate of the present application.

[0032] like Figure 1 As shown, in order to solve the above technical problems, the technical solution adopted in the present application provides an electroplating device for a packaging substrate, wherein the electroplating device 100 includes:

[0033] A transmission device 101, the transmission device 101 transports the substrate to be packaged; at least one rectifier 102, the rectifier 102 includes a first sub-rectifier 1021 and a second sub-rectifier 1022, and the negative pole of the rectifier 102 is connected to the transmission device 101; an anode plate 103, the anode plate 103 is arranged at one end of the rectifier 102, and is respectively arranged on both sides of the transmission device 101; the positive pole of the first sub-rectifier 1021 is connected to the anode plate 103 on one side, and the positive pole of the second sub-rectifier 1022 is connected to the anode plate 103 on the opposite side.

[0034] The electroplating device 100 can be composed of one or more rectifiers, and the number of anode plates 103 is set corresponding to the number of rectifiers 102. The substrate to be packaged is transported between the anode plates 103 through the transmission device 101. The transmission device 101 can clamp or clip the substrate to be packaged, and the transportation speed can be adjusted, and the position where the substrate to be packaged is installed can also be adjusted according to the size of the substrate to be packaged.

[0035] The two sub-rectifiers of a rectifier 102 may be located in the same housing or separately arranged. The first rectifier 1021 and the second rectifier 1022 may be arranged on the same side of the transmission device 101 or on both sides thereof. The negative electrodes of the two sub-rectifiers are connected to the transmission device 101. Electroplating through the sub-rectifiers can realize load sharing of the rectifiers, which can extend the production life of the electroplating device 100.

[0036] The two projection planes of the anode plates 103 opposite to each other on both sides of the transmission device 101 are overlapped with each other perpendicular to the transmission device 101 so as to make the electroplating layer of the substrate to be packaged uniform.

[0037] The first sub-rectifier 1021 and the second sub-rectifier 1022 provide the same or different voltages to two sides of the same substrate to be packaged or different substrates to be packaged, respectively.

[0038] During the electroplating process, the first sub-rectifier 1021 and the second sub-rectifier 1022 can adjust the voltage according to production needs to provide different current sizes. For example, electroplating can be performed on one side of a substrate to be packaged alone, the same current can be provided to both sides of a substrate to be packaged, different currents can be provided to both sides of a substrate to be packaged, and the same current or different currents can be provided to both sides of different substrates to be packaged to achieve different electroplating effects.

[0039] In an optional embodiment, the electroplating device 100 also includes: an electroplating tank (not shown), a plating solution (not shown) is arranged in the electroplating tank, and the anode plate 103 is arranged in the electroplating tank and immersed in the plating solution; the transmission device 101 immerses the substrate to be packaged in the plating solution, and an electroplating circuit is formed between the rectifier 102, the anode plate 103, the plating solution, the packaged substrate and the transmission device 101.

[0040] The electroplating solution provides an electroplating ion source and conductivity for electroplating. The electroplating ion source in the electroplating solution can be one of palladium salts, copper salts, gold salts, tin salts, cobalt salts, or multiple salts in any mass ratio. It can also include hydrogen phosphates, complexing agents, brighteners, inhibitors, and leveling agents.

[0041] In an optional embodiment, during the electroplating process, gas is generated near the anode plate 103 due to electrolysis. In order to reduce the influence of bubbles in the electroplating solution on the stability of the electroplating current and the influence on the position of the board to be packaged during transportation, as shown in FIG. Figure 2 As shown, the electroplating device 100 further includes: an anode baffle 104 , and the anode baffle 104 is correspondingly arranged between the transmission device 101 and the anode plate 103 .

[0042] Since the density of electric line of force may be different at different positions in the electroplating tank, too high or too low will affect the electroplating effect of the electroplating layer. The anode baffle 104 can also make the electric line of force uniform, further ensuring uniform plating of the substrate to be packaged.

[0043] See also Figure 3 , Figure 4 and Figure 5 , Figure 3 is a top view of the structure of another embodiment of the electroplating device for the package substrate of the present application, Figure 4 It is a structural side view of another embodiment of the electroplating device for the package substrate of the present application. Figure 5 It is a schematic diagram of the rack structure of another embodiment of the electroplating device for packaging substrates of the present application.

[0044] like Figure 3 and Figure 4 As shown, the electroplating device 100 includes:

[0045] A transmission device 101, the transmission device 101 transports the substrate to be packaged; at least one rectifier 102, the rectifier 102 includes a first sub-rectifier 1021 and a second sub-rectifier 1022, and the negative electrode of the rectifier 102 is connected to the transmission device 101; an anode plate 103, the anode plate 103 is arranged at one end of the rectifier 102, and is respectively arranged on both sides of the transmission device 101; the positive electrode of the first sub-rectifier 1021 is connected to the anode plate 103 on one side, and the positive electrode of the second sub-rectifier 1022 is connected to the anode plate 103 on the opposite side;

[0046] The electroplating device 100 can be composed of one or more rectifiers 102, and the number of anode plates 103 is set corresponding to the number of rectifiers 102. The substrate to be packaged is transported between the anode plates 103 through the transmission device 101. The transmission device 101 can clamp or clip the substrate to be packaged, and the transportation speed can be adjusted, and the position where the substrate to be packaged is installed can also be adjusted according to the size of the substrate to be packaged.

[0047] The two sub-rectifiers of a rectifier 102 may be located in the same housing or may be arranged separately.

[0048] In an optional embodiment, the first sub-rectifier 1021 and the second sub-rectifier 1022 are respectively disposed on two sides of the transmission device 101 , and are disposed on the same side as the correspondingly connected anode plate 103 .

[0049] The negative electrodes of the two sub-rectifiers are connected to the transmission device 101. The load of the rectifier 102 is shared by performing electroplating through the sub-rectifiers, which can extend the production life of the electroplating device 100.

[0050] The two projection surfaces of the anode plates 103 opposite to each other on both sides of the transmission device 101 overlap perpendicularly to the transmission device 101, so that the electroplating layer of the substrate to be packaged is evenly plated. To ensure the size and uniformity of the electroplating current, the anode plate 103 is the same size as the substrate to be packaged or the anode plate 103 is slightly larger than the substrate to be packaged.

[0051] In an optional implementation, the first sub-rectifier 1021 and the second sub-rectifier 1022 provide the same or different voltages to two sides of the same substrate to be packaged or different substrates to be packaged, respectively.

[0052] During the electroplating process, the first sub-rectifier 1021 and the second sub-rectifier 1022 can adjust the voltage according to production needs to provide different current sizes. For example, electroplating can be performed on one side of a substrate to be packaged alone, the same current can be provided to both sides of a substrate to be packaged, different currents can be provided to both sides of a substrate to be packaged, and the same current or different currents can be provided to both sides of different substrates to be packaged to achieve different electroplating effects.

[0053] In an optional embodiment, in order to increase the electroplating efficiency of the electroplating device 100, the length of the electroplating device 100 can be increased to increase the number of substrates to be packaged in a single electroplating process, so the electroplating device 100 further includes: a rectifier 102 and a plurality of correspondingly connected anode plates 103 to form a plurality of electroplating sections. A proximity switch 105 is arranged near the transmission device 101, and when the proximity switch 105 detects that there is a substrate to be packaged in the electroplating section, the rectifier 102 located in the electroplating section is turned on.

[0054] A plurality of anode plates 103 may constitute an anode plate group. In this embodiment, a single-sided anode plate group is composed of three anode plates 103. In other embodiments, it may also be composed of two anode plates 103 or four anode plates 103. One rectifier 102 corresponds to one anode plate 103 or one anode plate group to form an electroplating section. The electroplating device 100 may be composed of multiple electroplating sections according to production needs to increase the overall length of the electroplating device 100.

[0055] The proximity switch 105 can be a mechanical switch structure, or it can be an infrared detector or an electromagnetic sensor. It can be set near the transmission device 101 or on the transmission device 101. According to the specific setting of the proximity switch 105, a sensing module is set on the bracket 1013 to control the opening and closing of the rectifier 102 by sensing the position of the bracket 1013.

[0056] In an optional embodiment, in order to further improve the electroplating efficiency of the electroplating device 100, a transmission device 101 includes: the transmission device 101 includes a conductive guide rail 1011, a movable guide rail 1012 and a rack 1013, and the rack 1013 is movably connected to the movable guide rail 1012; there are multiple conductive guide rails 1011 and racks 1013 in the electroplating section, and adjacent racks 1013 are movably connected to different conductive guide rails 1011 to clamp the substrate to be packaged; the negative pole of the rectifier 102 is respectively connected to different conductive guide rails 1011; the positive poles of multiple first sub-rectifiers 1021 of the electroplating section are connected to the same anode plate 103 on one side of the movable guide rail 1012, and the positive poles of multiple second sub-rectifiers 1022 are connected to the same anode plate 103 on the other side of the movable guide rail 1012.

[0057] like Figure 5 As shown, the rack 1013 can transport the substrate to be packaged on the movable rail 1012 by a transmission method such as a pulley, a slider, or a chain. The conductive rail and the rack 1013 are made of conductive metal. Adjacent racks 1013 form different current loops with the same anode plate 103 through different conductive rails 1011. In other embodiments, the movable rail 1012 and the conductive rail 1011 can be set as the same rail.

[0058] In an optional embodiment, the electroplating device 100 also includes: an electroplating tank (not shown), a plating solution (not shown) is arranged in the electroplating tank, and the anode plate 103 is arranged in the electroplating tank and immersed in the plating solution; the transmission device 101 immerses the substrate to be packaged in the plating solution, and an electroplating circuit is formed between the rectifier 102, the anode plate 103, the plating solution, the packaged substrate and the transmission device 101.

[0059] The electroplating solution provides an electroplating ion source and conductivity for electroplating. The electroplating ion source in the electroplating solution can be one of palladium salts, copper salts, gold salts, tin salts, cobalt salts, or multiple salts in any mass ratio. It can also include hydrogen phosphates, complexing agents, brighteners, inhibitors, and leveling agents.

[0060] The plating tanks between the plating sections are interconnected so that the substrate to be packaged can be immersed in the plating solution of the plating tank when it is transported between the two plating sections, so as to reduce the influence of the change of the electric line density during electroplating on the uniformity of the electroplating layer.

[0061] During the electroplating process, gas will be generated near the anode plate 103 due to electrolysis. In order to reduce the influence of bubbles in the plating solution on the stability of the electroplating current and the influence on the position of the panels to be packaged during transportation, the electroplating device 100 also includes: an anode baffle 104, which is correspondingly arranged between the transmission device 101 and the anode plate 103.

[0062] In an optional embodiment, the electroplating device 100 also includes: a jet device 106 is also arranged on both sides of the transmission device 101, and the jet device 106 is arranged between the transmission device 101 and the anode plate 103; the corresponding jet devices 106 on both sides are arranged facing the transmission device 101, and the electroplating liquid is sprayed to both sides of the substrate to be packaged.

[0063] The jet device 106 can promote the exchange of plating ions in the plating solution. The jet device 106 can be composed of one row of nozzles or multiple rows of nozzles. When performing hole-filling electroplating, the plating solution can be sprayed into the plating holes, which has a better hole-filling effect.

[0064] The electroplating device 100 provided in the above embodiment can realize the load sharing of the rectifier 102 during the electroplating process by electroplating through a sub-rectifier, thereby extending the production life, improving the controllability of the current size during the electroplating process, performing refined processing, ensuring that the thickness of the electroplating layer is uniform, meeting various electroplating requirements, and improving the production quality and efficiency of the packaging substrate.

[0065] Figure 6 1 is a schematic flow chart of an embodiment of a method for electroplating a package substrate of the present application. The electroplating method is applied to an electroplating device for a package substrate for electroplating processing. The execution subject of the electroplating method of the present embodiment corresponds to Figure 1, Figure 2 The electroplating device 100 of the above-mentioned embodiment.

[0066] The specific test method steps are as follows:

[0067] S11: Turn on the rectifiers connected to the transmission device and control the currents of the rectifiers respectively.

[0068] Before electroplating the substrate to be packaged, the substrate to be packaged is first fixed to the electroplating device through a transmission device, and the current of the rectifier is set according to the electroplating requirements, so that the first sub-rectifier and the second sub-rectifier can provide different currents according to production needs. For example, electroplating is performed on one side of a substrate to be packaged alone, the same current is provided to both sides of a substrate to be packaged, different currents are provided to both sides of a substrate to be packaged, the same current or different currents are provided to both sides of different substrates to be packaged, and the current of the electroplating device is ensured to be in a stable state.

[0069] S12: Controlling the transmission device to transport the substrate to be packaged so that the substrate to be packaged is located between the anode plates, and electroplating the substrate to be packaged.

[0070] When the transmission device transports the substrate to be packaged to the electroplating processing section with anode plates on both sides, the electroplating ion source forms an electroplating layer on the substrate to be packaged through the electroplating loop.

[0071] Figure 7 : is a schematic flow chart of another embodiment of a method for electroplating a package substrate of the present application; the electroplating method is applied to an electroplating device for a package substrate for electroplating processing, and the execution subject of the electroplating method of the present embodiment corresponds to Figure 1 to Figure 5 The electroplating device 100 according to any of the above-mentioned embodiments.

[0072] The specific test method steps are as follows:

[0073] Before electroplating the substrate to be packaged, the substrate to be packaged is first fixed to the electroplating device through a transmission device, and the current size of the rectifier is set according to the electroplating requirements.

[0074] In an optional embodiment, S21: setting the current size of each rectifier of the plurality of electroplating sections to present a step current.

[0075] In order to form the electroplating layer uniformly, the electroplating current can be set to a smaller value at the beginning of the electroplating stage and then the current can be increased in steps, or the electroplating section can be controlled to reduce the current in steps at the end when the electroplating is about to end, so that the electroplating layer of the substrate to be packaged is formed uniformly.

[0076] The rectifiers connected to the transmission device are turned on, and the current magnitudes of the rectifiers are controlled respectively.

[0077] The first sub-rectifier and the second sub-rectifier can provide different current sizes according to production needs, for example, electroplating one side of a substrate to be packaged separately, providing the same current to both sides of a substrate to be packaged, providing different currents to both sides of a substrate to be packaged, providing the same current or different currents to both sides of different substrates to be packaged, and ensuring that the current of the electroplating device is in a stable state.

[0078] In an optional embodiment, S22: the proximity switch of the electroplating section detects that the package substrate is transported to the electroplating section, and turns on the rectifier and the jet device of the electroplating section to control the current of the rectifier respectively.

[0079] The proximity switch controls the opening and closing of the rectifier of the corresponding electroplating section by sensing the position of the rack. If there are multiple rails and multiple corresponding rectifiers in the current electroplating section, the rectifiers are turned on in sequence according to the arrangement of the rails, and the substrates to be packaged on different racks in the same electroplating section are electroplated.

[0080] The jet device can promote the exchange of plating ions in the plating solution, and can spray the plating solution into the plating holes during hole-filling plating, thereby achieving a better hole-filling effect.

[0081] S23: Controlling the transmission device to transport the substrate to be packaged so that the substrate to be packaged is located between the anode plates, and electroplating the substrate to be packaged.

[0082] When the transmission device transports the substrate to be packaged to the electroplating processing section with anode plates on both sides, the electroplating ion source forms an electroplating layer on the substrate to be packaged through the electroplating loop.

[0083] See also Figure 8 , Figure 8 It is a structural schematic diagram of an implementation scheme of an electroplating system for a packaging substrate of the present application.

[0084] The electroplating system 300 of the package substrate includes an electroplating device 100 and an electronic device 200 for the package substrate as described above. The electroplating device 100 and the electronic device 200 can be coupled via a signal line or remotely connected via a network. The electronic device 200 includes a memory 201 and a processor 202. The memory 201 stores program instructions, and the processor 202 retrieves program instructions from the memory 201 to execute to implement the electroplating method of the package substrate as described above. The electronic device 200 can also be an external electronic component, such as a coupled computer, mobile terminal, etc. The electronic device 200 controls the transmission of the transmission device 101 of the electroplating device 100 and controls the current size of the rectifier 102, thereby improving the controllability of the current size during the electroplating process, performing refined processing, ensuring that the thickness of the electroplating layer is uniform, meeting various electroplating requirements, and improving the production quality and production efficiency of the package substrate. The electronic device 200 can also store and send or receive processing information, and cooperate with other devices connected to the electroplating device 100 that process the package substrate to further improve the processing efficiency of the package substrate.

[0085] In the several embodiments provided in the present application, it should be understood that the disclosed systems and devices can be implemented in other ways. For the technical solutions in the embodiments of the present application, it is obvious that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. For example, the device implementation described above is only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0086] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0087] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "coupled", "connected", "connected", "set", and "installed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0088] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0089] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0090] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electroplating device for a package substrate, characterized in that: The electroplating device comprises: A transmission device, wherein the transmission device transports the substrate to be packaged; at least one rectifier, the rectifier comprising a first sub-rectifier and a second sub-rectifier, the cathode of the rectifier being connected to the transmission device; an anode plate, the anode plate being arranged at one end of the rectifier and respectively arranged at both sides of the transmission device; the positive electrode of the first sub-rectifier is connected to the anode plate on one side, and the positive electrode of the second sub-rectifier is connected to the anode plate on the opposite side; The first sub-rectifier and the second sub-rectifier respectively provide the same or different voltages to two sides of the same substrate to be packaged or different substrates to be packaged.

2. The electroplating device for a package substrate according to claim 1, characterized in that: The electroplating device includes: the first sub-rectifier and the second sub-rectifier are respectively arranged on both sides of the transmission device, and are arranged on the same side as the correspondingly connected anode plate.

3. The electroplating device for a package substrate according to claim 1, characterized in that: The electroplating device comprises: The rectifier and a plurality of correspondingly connected anode plates form a plurality of electroplating sections; A proximity switch is disposed close to the transmission device, and when it is detected that there is a substrate to be packaged in the electroplating section, the rectifier located in the electroplating section is turned on.

4. The electroplating device for a package substrate according to claim 3, characterized in that: The transmission device comprises: The transmission device comprises a conductive guide rail, a movable guide rail and a hanger, and the hanger is movably connected to the movable guide rail; The electroplating section is provided with a plurality of conductive rails and racks, and adjacent racks are movably connected to different conductive rails to clamp the substrate to be packaged; The negative poles of the rectifiers are respectively connected to different conductive rails; the positive poles of the multiple first sub-rectifiers in the electroplating section are connected to the same anode plate on one side of the movable rail, and the positive poles of the multiple second sub-rectifiers are connected to the same anode plate on the other side of the movable rail.

5. The electroplating device for a package substrate according to claim 1, characterized in that: The electroplating device comprises: An electroplating tank, wherein the electroplating tank is provided with an electroplating solution, and the anode plate is arranged in the electroplating tank and immersed in the electroplating solution; The transmission device immerses the substrate to be packaged into the electroplating solution, and an electroplating loop is formed between the rectifier, the anode plate, the electroplating solution, the packaged substrate and the transmission device.

6. The electroplating device for a package substrate according to claim 5, characterized in that: The electroplating device comprises: The transmission device is also provided with jet devices on both sides, and the jet devices are arranged between the transmission device and the anode plate; The corresponding jet devices on both sides are arranged facing the transmission device to spray the electroplating liquid onto the two sides of the substrate to be packaged.

7. The electroplating device for a package substrate according to claim 1, characterized in that: The electroplating device comprises: An anode baffle is correspondingly arranged between the transmission device and the anode plate.

8. A method for electroplating a packaging substrate, characterized in that: The electroplating method comprises: The rectifier connected to the transmission device is turned on to control the current of the rectifier respectively; the transmission device is controlled to transport the substrate to be packaged so that the substrate to be packaged is located between the anode plates, and the substrate to be packaged is electroplated.

9. The electroplating method of a package substrate according to claim 8, characterized in that: The electroplating method comprises: Setting the current magnitude of each of the rectifiers of the plurality of electroplating sections to present a step current; The proximity switch of the electroplating section detects that the packaging substrate is transported to the electroplating section, and turns on the rectifier and the jet device of the electroplating section.

10. A system for electroplating a package substrate, characterized in that: The system comprises: An electroplating device for a package substrate, the electroplating device for a package substrate as claimed in any one of claims 1 to 7; An electronic device, comprising: a memory and a processor, wherein the memory stores program instructions, and the processor retrieves the program instructions from the memory to execute and implement the electroplating method for the packaging substrate as described in any one of claims 8 to 9.

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