DIP packaging chip test fixture

Abstract

The invention provides a DIP packaging chip test fixture, which comprises a workbench, a test circuit board, a support column, a clamping mechanism, a measuring mechanism and a cylinder, and is characterized in that the test circuit board and the support column are arranged on the workbench, the test circuit board is parallel to the clamping mechanism up and down, the clamping mechanism is slidably connected with the support column, and the measuring mechanism is connected with the cylinder. The measuring mechanism is in sliding fit with the clamping mechanism, the air cylinder is fixedly connected with the workbench, the air cylinder provides power for the clamping mechanism and the measuring mechanism at the same time through the output hose under the control of the control button, the position adjustment of a DIP packaging chip is completed through the clamping mechanism, and the electrical performance of a chip pin is detected. The flatness of the surface of a chip and the thickness of the chip are detected through an induction soft board in the measuring mechanism, when the chip is unqualified and short-circuited with a test circuit board, an electromagnet attracts a ball to compress a third spring, fixation is relieved, a clamping mechanism rebounds rapidly, and the conditions that the short circuit is overheated and the test circuit board is burnt are avoided.

Description

Technical Field

[0001] The invention relates to the technical field of DIP package chip testing, in particular to a DIP package chip testing fixture. Background Art

[0002] With the advancement of integrated circuit technology, the integration of chips has continued to increase, resulting in a significant increase in the number of input and output (I / O) pins on a single chip. This requires that the test fixture must be able to effectively contact all pins while ensuring the reliability and accuracy of the contact.

[0003] DIP packaged chips usually contact the test fixture through pins. Since the pins may bend or otherwise deform, the test fixture must be able to adapt to these changes to ensure that the pins can reliably contact the fixture during each test. At the same time, it protects the pins to prevent them from bending or being damaged, which would affect the service life of the chip.

[0004] As we all know, the electrical performance testing of chip pins is the most common and important testing link, but the appearance of the chip is also crucial, especially the flatness and thickness of the chip surface, which will also affect the use of the chip. Summary of the invention

[0005] The technical problem to be solved by the present invention is: by adjusting the clamping mechanism, the chip pins and the pin interfaces of the test circuit board are ensured to correspond, the electrical performance detection of the DIP package chip pins is completed, and at the same time, the flatness of the chip surface is detected by the measuring mechanism, and the thickness of the chip is detected by using the induction soft board and the scale.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a DIP packaged chip test fixture, comprising: a workbench, a test circuit board, a support column, a clamping mechanism, a measuring mechanism and a cylinder, the test circuit board and the support column are arranged on the workbench, the test circuit board is parallel to the clamping mechanism up and down, the clamping mechanism is slidably connected to the support column, the measuring mechanism is slidably matched with the clamping mechanism, and the cylinder is fixedly connected to the workbench.

[0007] As a preferred solution of a DIP packaged chip testing fixture described in the present invention, wherein: the workbench includes a fixed bracket and a carrier plate, the carrier plate is fixedly connected to the fixed bracket, a third mounting groove is opened on the carrier plate, a cylinder is installed in the third mounting groove, a control button is fixedly arranged on the carrier plate, and the control button is electrically connected to the cylinder.

[0008] As a preferred solution of a DIP packaged chip testing fixture described in the present invention, wherein: the support column includes a first sliding rail, a second sliding rail, a third sliding rail, a first limiter, a second limiter, a third limiter and a fourth limiter, the first sliding rail and the second sliding rail are symmetrically fixedly connected to the support column, the first limiter is fixedly connected to the inner wall of one side of the first sliding rail, the second limiter is fixedly connected to the inner wall of one side of the second sliding rail corresponding to the first limiter, the third limiter is fixedly connected to the inner wall of the other side of the first sliding rail, the fourth limiter is fixedly connected to the inner wall of the other side of the second sliding rail corresponding to the third limiter, and the middle part of the support column is fixedly connected to the third sliding rail.

[0009] As a preferred solution of a DIP package chip testing fixture described in the present invention, the clamping mechanism comprises a clamping plate, a first spring, a second spring, a fixed plate and a connecting plate, the clamping plate is provided with a accommodating cavity inside, the accommodating cavity is provided with a fourth sliding rail inside, a sliding rod is provided on the corresponding surface of the fourth sliding rail, a sliding bar is provided correspondingly to the fourth sliding rail, a sliding hole is opened at one end of the sliding bar, the sliding rod is fixedly connected to the clamping plate through the sliding hole, the top of the sliding bar is fixedly connected to the fifth sliding rail, a fixed limiting block is provided at one end of the fifth sliding rail, a sliding block is provided correspondingly to the fifth sliding rail, one end of the first spring and the second spring are respectively fixedly connected to the clamping plate, and the other ends of the first spring and the second spring are respectively fixedly connected to the workbench, and two fixed plates are provided, one side of the two fixed plates are respectively fixedly connected to the two ends of the clamping plate, and the other side of the two fixed plates are respectively fixedly connected to the connecting plate.

[0010] As a preferred solution of a DIP packaged chip testing fixture described in the present invention, the measuring mechanism includes a telescopic rod, a measuring board and a sensing soft board, one end of the telescopic rod is connected to the cylinder through an output pipe, the measuring board is fixedly connected to the other end of the telescopic rod, and the sensing soft board is fixedly connected to the measuring board.

[0011] As a preferred solution of the DIP packaged chip testing fixture described in the present invention, a scale is provided on one side of the support column, a first locking groove and a second locking groove are respectively provided on both sides of the support column at heights corresponding to the clamping plate, a fixed eaves is provided on the top of the support column, and one side of the first limiter, the second limiter, the third limiter and the fourth limiter are respectively fixedly connected to rubber pads.

[0012] As a preferred solution of the DIP package chip testing fixture described in the present invention, an output pipe is opened in the middle of the support column, an output hose is installed in the output pipe, and a three-way valve is arranged in the middle of the output hose.

[0013] As a preferred solution of a DIP package chip testing fixture described in the present invention, a first installation groove is opened in the middle of the fixed plate, an electromagnet is installed in the first installation groove, one side of the electromagnet is fixedly connected to one end of a third spring, and the other end of the third spring is fixedly connected to a locking block.

[0014] As a preferred solution of the DIP package chip testing fixture described in the present invention, a second mounting groove is opened in the middle of the locking block, and a round ball is installed in the second mounting groove.

[0015] As a preferred solution of the DIP package chip testing fixture described in the present invention, a DIP package chip is placed on the fifth slide rail.

[0016] Beneficial effects of the present invention:

[0017] 1. The present invention uses an output pipeline and a cylinder to provide power to the clamping mechanism and the measuring mechanism at the same time, so as to complete the adjustment of the chip, align the chip pins with the test circuit board pin interface, and complete the electrical performance test of the pins. At the same time, the sensing soft board of the measuring mechanism can measure the thickness of the chip and feed the result back to the back end, and judge the flatness of the chip by the fit between the sensing soft board and the chip.

[0018] 2. The present invention utilizes the accommodating cavity of the clamping mechanism to place the chip pins, leaving some pins, which can not only detect the electrical properties of the pins, but also protect the pins to prevent the pins from being too long and causing bending. When a short circuit occurs in the chip, the electromagnet generates electromagnetic force, absorbs the spring, and immediately rebounds the clamping mechanism to avoid heating caused by the short circuit and burning of the chip and the test circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of a DIP package chip testing fixture in an embodiment of the present disclosure.

[0020] Figure 2 It is a side cross-sectional view of a DIP package chip testing fixture in an embodiment of the present disclosure.

[0021] Figure 3 It is a three-dimensional structural schematic diagram of a DIP package chip test fixture without a test circuit board in an embodiment of the present disclosure.

[0022] Figure 4 It is a top cross-sectional view of a DIP package chip testing fixture in an embodiment of the present disclosure.

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the clamping plate of the clamping mechanism in the embodiment of the present disclosure.

[0024] Figure 6It is a schematic diagram of the three-dimensional structure of the fixing plate of the clamping mechanism in the embodiment of the present disclosure.

[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of the DIP packaged chip in the embodiment of the present disclosure.

[0026] Figure numerals: 1, workbench; 101, fixed bracket; 102, carrier; 103, control button; 104, third mounting slot; 2, test circuit board; 3, support column; 301, scale; 302, first locking slot; 303, second locking slot; 304, first slide rail; 305, second slide rail; 306, third slide rail; 307, first stopper; 308, second stopper; 309, third stopper; 310, fourth stopper; 311, rubber pad; 312, fixed eaves; 313, output pipe; 314, output hose; 315, three-way valve; 4, clamping mechanism; 40 1. Accommodating cavity; 402. Fourth slide rail; 403. Sliding bar; 404. Sliding rod; 405. Sliding hole; 406. Fifth slide rail; 407. Sliding block; 408. Fixed limit block; 409. First spring; 410. Second spring; 411. Fixed plate; 412. First mounting groove; 413. Electromagnet; 414. Third spring; 415. Locking block; 416. Second mounting groove; 417. Ball; 418. Connecting plate; 419. Clamping plate; 5. Measuring mechanism; 501. Telescopic rod; 502. Measuring board; 503. Inductive soft board; 6. DIP package chip; 7. Cylinder. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0028] Example 1

[0029] Reference Figure 1-Figure 3 and Figure 7 This embodiment provides a DIP package chip test fixture, including a workbench 1, a test circuit board 2, a support column 3, a clamping mechanism 4, a measuring mechanism 5 and a cylinder 7, wherein the test circuit board 2 and the support column 3 are arranged on the workbench 1, the test circuit board 2 is vertically parallel to the clamping mechanism 4, the clamping mechanism 4 is slidably connected to the support column 3, the measuring mechanism 5 is slidably matched with the clamping mechanism 4, and the cylinder 7 is fixedly connected to the workbench 1;

[0030] The DIP package chip test fixture is characterized in that: the workbench 1 includes a fixed bracket 101 and a carrier 102, the carrier 102 is fixedly connected to the fixed bracket 101, a third mounting groove 104 is opened on the carrier 102, the third mounting groove 104 is installed with a cylinder 7, and a control button 103 is fixedly arranged on the carrier 102, and the control button 103 is electrically connected to the cylinder 7;

[0031] An output pipe 313 is provided in the middle of the support column 3 , an output hose 314 is installed in the output pipe 313 , and a three-way valve 315 is provided in the middle of the output hose 314 .

[0032] In this embodiment, the control button 103 starts the cylinder 7, and provides power to the mechanism by installing an output hose 314 in the output pipe 313. At the same time, a three-way valve 315 is set in the output pipe 313 to distribute the power provided by the cylinder 7 from the output hose 314 to the clamping mechanism 4 and the measuring mechanism 5, thereby forming a linkage between the clamping mechanism 4 and the measuring mechanism 5.

[0033] The clamping mechanism 4 includes a clamping plate 419, a first spring 409, a second spring 410, a fixing plate 411 and a connecting plate 418. The clamping plate 419 is provided with a receiving cavity 401 inside. The receiving cavity 401 is provided with a fourth sliding rail 402 inside. The corresponding surface of the fourth sliding rail 402 is provided with a sliding rod 404. The fourth sliding rail 402 is provided with a sliding bar 403 correspondingly. A sliding hole 405 is opened at one end of the sliding bar 403. The sliding rod 404 is fixedly connected to the clamping plate 419 through the sliding hole 405. The top of the sliding bar 403 is fixed Connect the fifth slide rail 406, one end of the fifth slide rail 406 is provided with a fixed limit block 408, the fifth slide rail 406 is correspondingly provided with a sliding block 407, one end of the first spring 409 and the second spring 410 are respectively correspondingly fixedly connected to the clamping plate 419, the other ends of the first spring 409 and the second spring 410 are respectively correspondingly fixedly connected to the workbench 1, and two fixed plates 411 are provided, one side of the two fixed plates 411 is respectively fixedly connected to the two ends of the clamping plate 419, and the other sides of the two fixed plates 411 are respectively fixedly connected to the connecting plate 418;

[0034] The measuring mechanism 5 includes a telescopic rod 501, a measuring plate 502 and a sensing soft board 503. One end of the telescopic rod 501 is connected to the cylinder 7 through an output pipe 313. The measuring plate 502 is fixedly connected to the other end of the telescopic rod 501. The sensing soft board 503 is fixedly connected to the measuring plate 502.

[0035] A DIP packaged chip 6 is placed on the fifth slide rail 406 .

[0036] In the preferred embodiment of the present invention, the distance between the accommodating cavities 401 of the clamping mechanism 4 is relatively short. Under the power provided by the cylinder 7, the position of the DIP packaged chip 6 can be quickly adjusted. Through the joint action of the sliding bar 403, the fixed limit block 408 and the sliding block 407, the position of the chip pins is adjusted so that the pins are aligned with the pin interface of the test circuit board 2. At the same time, the fixed limit block 408 and the sliding block 407 can also fix the position of the DIP packaged chip 6, while the telescopic rod 501 moves a long distance and takes a long time to reach the clamping mechanism 4. Under the power provided by the cylinder 7, it is pressed downward to drive the clamping mechanism 4 to move, so that the DIP packaged chip 6 and the test circuit board 2 are fitted together, and the electrical properties of the pins of the DIP packaged chip 6 are detected. The induction soft board 503 fits with the surface of the DIP packaged chip 6 during the pressing process, and the flatness of the surface of the DIP packaged chip 6 can be judged by the degree of fitting between the two.

[0037] The support column 3 includes a first sliding rail 304, a second sliding rail 305, a third sliding rail 306, a first stopper 307, a second stopper 308, a third stopper 309 and a fourth stopper 310. The first sliding rail 304 and the second sliding rail 305 are symmetrically fixedly connected to the support column 3. The first stopper 307 is fixedly connected to the inner wall of one side of the first sliding rail 304. The second stopper 308 is fixedly connected to the inner wall of one side of the second sliding rail 305 corresponding to the first stopper 307. The third stopper 309 is fixedly connected to the inner wall of the other side of the first sliding rail 304. The fourth stopper 310 is fixedly connected to the inner wall of the other side of the second sliding rail 305 corresponding to the third stopper 309. The middle part of the support column 3 is fixedly connected to the third sliding rail 306.

[0038] A scale 301 is provided on one side of the support column 3, and a first locking groove 302 and a second locking groove 303 are respectively opened on both sides of the support column 3 at heights corresponding to the clamping plate 419, and a fixed eaves 312 is provided on the top of the support column 3, and one side of the first limiter 307, the second limiter 308, the third limiter 309 and the fourth limiter 310 are respectively fixedly connected to a rubber pad 311.

[0039] In this embodiment, the support column 3 preferably limits the moving distance of the clamping mechanism 4 by two pairs of limiters, and a rubber pad 311 is provided on the limiter. The elasticity of the rubber pad 311 is used to buffer the clamping mechanism 4, thereby reducing the damage to the DIP packaged chip 6 caused by collision. A scale 301 is provided on one side of the support column 3, and the thickness of the DIP packaged chip 6 is detected by sensing the alignment surface of the soft board 503 and the scale 301 to determine whether the chip meets the requirements.

[0040] Example 2

[0041] Reference Figure 4-Figure 6This embodiment provides a DIP package chip test fixture, including a clamping mechanism 4, the clamping mechanism 4 includes a clamping plate 419, a first spring 409, a second spring 410, a fixing plate 411 and a connecting plate 418, the clamping plate 419 is provided with a receiving cavity 401, the receiving cavity 401 is provided with a fourth slide rail 402, the corresponding surface of the fourth slide rail 402 is provided with a sliding rod 404, the fourth slide rail 402 is provided with a sliding bar 403, one end of the sliding bar 403 is provided with a sliding hole 405, the sliding rod 404 is fixedly connected to the clamping plate 4 through the sliding hole 405 19, the top of the sliding bar 403 is fixedly connected to the fifth sliding rail 406, one end of the fifth sliding rail 406 is provided with a fixed limit block 408, the fifth sliding rail 406 is correspondingly provided with a sliding block 407, one end of the first spring 409 and the second spring 410 are respectively correspondingly fixedly connected to the clamping plate 419, the other ends of the first spring 409 and the second spring 410 are respectively correspondingly fixedly connected to the workbench 1, the fixed plate 411 is provided with two pieces, one side of the two fixed plates 411 is respectively fixedly connected to the two ends of the clamping plate 419, and the other sides of the two fixed plates 411 are respectively fixedly connected to the connecting plate 418;

[0042] A first mounting slot 412 is defined in the middle of the fixing plate 411 , an electromagnet 413 is mounted in the first mounting slot 412 , one side of the electromagnet 413 is fixedly connected to one end of a third spring 414 , and the other end of the third spring 414 is fixedly connected to a locking block 415 .

[0043] In the present embodiment, preferably, two fixing plates 411 are provided, a first mounting groove 412 is opened in the middle of the fixing plate 411, an electromagnet 413 is installed in the first mounting groove 412, one side of the electromagnet 413 is fixedly connected to one end of a third spring 414, and the other end of the third spring 414 is fixedly connected to a locking block 415. When the clamping mechanism 4 reaches the position under the action of the measuring mechanism 5, the locking block 415 pops out and is respectively inserted into the first locking groove 302 and the second locking groove 303 of the support column 3 to fix the position of the clamping mechanism 4. Since the output hose 314 passes through the first locking groove 302, when the locking block 415 pops out, the transmission of the cylinder 7 is blocked and the measuring mechanism 5 retracts.

[0044] A first mounting groove 412 is formed in the middle of the fixing plate 411, and an electromagnet 413 is mounted in the first mounting groove 412. One side of the electromagnet 413 is fixedly connected to one end of a third spring 414, and the other end of the third spring 414 is fixedly connected to a locking block 415.

[0045] A second mounting groove 416 is defined in the middle of the locking block 415 , and a round ball 417 is mounted in the second mounting groove 416 .

[0046] Preferably, in this embodiment, the ball 417 is an iron ball. When sliding down, the smoothness of the ball 417 is used to reduce friction, thereby reducing useless work. When the chip pin is unqualified and forms a short circuit with the test circuit board 2, a magnetic field is generated to strengthen the suction force of the electromagnet 413, attract the ball 417, compress the third spring 414, release the limit, and the clamping mechanism 4 rebounds quickly under the elastic force of the first spring 409 and the second spring 410, avoiding short circuit heating and burning of the test circuit board 2, thereby reducing unnecessary losses.

[0047] The implementation principle of the present invention is as follows: before using the clamp, place the DIP packaged chip 6 to be tested on the fifth slide rail 406, start the cylinder 7 through the control button 103, and use the cylinder 7 to provide power to the clamping mechanism 4 and the measuring mechanism 5 through the output hose 314. Due to the difference in movement distance, the clamping mechanism 4 first completes the position adjustment of the DIP packaged chip 6 through the joint action of the sliding bar 403, the fixed limit block 408 and the sliding block 407, and makes the pins of the DIP packaged chip 6 correspond to the pin interface of the test circuit board 2. Then, the measuring mechanism 5 moves to the top of the clamping mechanism 4 under the action of the cylinder 7, driving the clamping mechanism 4 to move downward together. When the clamping mechanism 4 reaches the position, the locking blocks 415 in a pair of fixed plates 411 of the clamping mechanism 4 are inserted into the first locking groove 302 and the second locking groove in the support column 3 respectively under the action of the third spring 414. In 303, the position of the clamping mechanism 4 is fixed, and the electrical performance of the pins of the DIP package chip 6 is tested. At the same time, the output hose 314 is compressed, the cylinder 7 is disconnected, and the measuring mechanism 5 retracts. During the downward pressing process, the measuring mechanism 5 judges the flatness of the surface of the DIP package chip 6 by sensing the fit between the soft board 503 and the DIP package chip 6. At the same time, the thickness of the DIP package chip 6 is detected by the combined action of the sensing soft board 503 and the scale 301 on the support column 3, and the relevant data is fed back to the back end. When the DIP package chip 6 is unqualified and short-circuited with the test circuit board 2, a magnetic field is formed to strengthen the magnetic force of the electromagnet 413, and the electromagnet 413 attracts the ball 417, compresses the third spring 414, and releases the fixation. Under the combined action of the first spring 409 and the second spring 410, the clamping mechanism 4 rebounds quickly to avoid short-circuit overheating and burning of the test circuit board 2.

Claims

1. A DIP package chip test fixture, characterized in that: The invention comprises a workbench (1), a test circuit board (2), a support column (3), a clamping mechanism (4), a measuring mechanism (5) and a cylinder (7); the test circuit board (2) and the support column (3) are arranged on the workbench (1); the test circuit board (2) and the clamping mechanism (4) are vertically parallel; the clamping mechanism (4) is slidably connected to the support column (3); the measuring mechanism (5) is slidably matched with the clamping mechanism (4); and the cylinder (7) is fixedly connected to the workbench (1).

2. A DIP package chip testing fixture as claimed in claim 1, characterized in that: The workbench (1) comprises a fixed bracket (101) and a carrier plate (102); the carrier plate (102) is fixedly connected to the fixed bracket (101); a third mounting groove (104) is provided on the carrier plate (102); a cylinder (7) is installed in the third mounting groove (104); a control button (103) is fixedly provided on the carrier plate (102); and the control button (103) is electrically connected to the cylinder (7).

3. A DIP package chip testing fixture as claimed in claim 1, characterized in that: The support column (3) comprises a first sliding rail (304), a second sliding rail (305), a third sliding rail (306), a first stopper (307), a second stopper (308), a third stopper (309) and a fourth stopper (310); the first sliding rail (304) and the second sliding rail (305) are symmetrically fixedly connected to the support column (3); the first stopper (307) is fixedly connected to an inner wall on one side of the first sliding rail (304); the second stopper (308) and the first stopper (307) are fixedly connected to an inner wall on one side of the second sliding rail (305) correspondingly; the third stopper (309) is fixedly connected to an inner wall on the other side of the first sliding rail (304); the fourth stopper (310) and the third stopper (309) are fixedly connected to an inner wall on the other side of the second sliding rail (305) correspondingly; and the middle part of the support column (3) is fixedly connected to the third sliding rail (306).

4. A DIP package chip testing fixture as claimed in claim 1, characterized in that: The clamping mechanism (4) comprises a clamping plate (419), a first spring (409), a second spring (410), a fixing plate (411) and a connecting plate (418); a receiving cavity (401) is arranged inside the clamping plate (419); a fourth sliding rail (402) is arranged inside the receiving cavity (401); a sliding rod (404) is arranged on a corresponding surface of the fourth sliding rail (402); a sliding bar (403) is arranged corresponding to the fourth sliding rail (402); a sliding hole (405) is opened at one end of the sliding bar (403); the sliding rod (404) is fixedly connected to the clamping plate (419) through the sliding hole (405); the sliding bar (403) The top is fixedly connected to a fifth sliding rail (406), one end of the fifth sliding rail (406) is provided with a fixed limit block (408), the fifth sliding rail (406) is correspondingly provided with a sliding block (407), one end of the first spring (409) and the second spring (410) are respectively correspondingly fixedly connected to a clamping plate (419), the other ends of the first spring (409) and the second spring (410) are respectively correspondingly fixedly connected to a workbench (1), two fixed plates (411) are provided, one side of the two fixed plates (411) is respectively fixedly connected to two ends of the clamping plate (419), and the other sides of the two fixed plates (411) are respectively fixedly connected to a connecting plate (418).

5. A DIP package chip testing fixture as claimed in claim 1, characterized in that: The measuring mechanism (5) comprises a telescopic rod (501), a measuring plate (502) and a sensing soft plate (503); one end of the telescopic rod (501) is connected to the cylinder (7) via an output pipe (313); the measuring plate (502) is fixedly connected to the other end of the telescopic rod (501); and the sensing soft plate (503) is fixedly connected to the measuring plate (502).

6. A DIP package chip testing fixture as claimed in claim 3, characterized in that: A scale (301) is provided on one side of the support column (3), a first locking groove (302) and a second locking groove (303) are respectively provided on both sides of the support column (3) at heights corresponding to the clamping plate (419), a fixed eave (312) is provided on the top of the support column (3), and one side of the first limiter (307), the second limiter (308), the third limiter (309) and the fourth limiter (310) are respectively fixedly connected to a rubber pad (311).

7. A DIP package chip testing fixture as claimed in claim 3, characterized in that: An output pipe (313) is provided in the middle of the support column (3), an output hose (314) is installed in the output pipe (313), and a three-way valve (315) is provided in the middle of the output hose (314).

8. A DIP package chip testing fixture as claimed in claim 4, characterized in that: A first mounting groove (412) is provided in the middle of the fixing plate (411), an electromagnet (413) is installed in the first mounting groove (412), one side of the electromagnet (413) is fixedly connected to one end of a third spring (414), and the other end of the third spring (414) is fixedly connected to a locking block (415).

9. A DIP package chip testing fixture as claimed in claim 4, characterized in that: A second mounting groove (416) is provided in the middle of the locking block (415), and a round ball (417) is installed in the second mounting groove (416).

10. A DIP package chip testing fixture as claimed in claim 4, characterized in that: A DIP packaged chip (6) is placed on the fifth slide rail (406).

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