Wafer post-processing method, wafer post-processing system, electronic equipment and storage medium

Abstract

The invention discloses a wafer post-processing method, a wafer post-processing system, electronic equipment and a storage medium, a spray rod is used for a wafer cleaning device, and the method comprises the following steps: adjusting the spray rod: arranging a spray rod adjusting device in the wafer cleaning device; a spray rod of the wafer cleaning device is adjusted through a spray rod adjusting device, and the spray rod adjusting device comprises a drop point calibration piece and a pointing adjusting piece; the spraying rod adjusting device is dismounted; and cleaning the wafer: positioning the wafer in a wafer cleaning device and cleaning the wafer; the method for adjusting the spraying rod of the wafer cleaning device through the spraying rod adjusting device comprises the steps that a drop point mark on a drop point calibration piece is matched with a preset liquid spraying drop point position on a wafer; and the pointing adjusting piece is actuated to drive the spraying rod to rotate around the axis of the spraying rod till the positioning part of the pointing adjusting piece is aligned with the drop point mark, and the extending direction of the positioning part is matched with the spraying direction of the sprayed cleaning liquid.

Description

Technical Field

[0001] The present application relates to the field of semiconductor wafer processing technology, and in particular, to a wafer post-processing method, a wafer post-processing system, an electronic device and a storage medium. Background Art

[0002] In the semiconductor field, the cleanliness of the wafer surface is one of the important factors affecting the reliability of semiconductor devices. In the wafer manufacturing process, such as deposition, plasma etching, photolithography, electroplating, etc., it is possible to introduce contamination or particles on the wafer surface, resulting in reduced cleanliness of the wafer surface and low yield of manufactured semiconductor devices. In order to achieve the goal of no contaminants on the wafer surface, it is necessary to remove the contaminants on the wafer surface to avoid the contaminants from remaining on the wafer surface before the process. Therefore, multiple surface cleanings are required during the wafer manufacturing process to remove contaminants such as metal ions, atoms, organic matter and particles attached to the wafer surface.

[0003] The wafer cleaning method that usually uses roller brush cleaning is to clean the wafer by using the friction between the roller brush and the wafer. In order to better clean the wafer, a spray bar is introduced into the brush module to spray deionized water for double cleaning. The spray angle of the spray bar directly affects the process effect of the brush module. However, the current method of adjusting the spray bar angle is generally to observe the spray angle of deionized water with the naked eye. Since deionized water is a colorless and transparent liquid, it is difficult to clearly see its spray point with the naked eye. Moreover, everyone has different criteria for judging the landing point, which makes it easy for the spray angle to deviate. In addition, since the wafer is inside the box and there is a certain amount of shaking back and forth, the landing point obtained by adjusting the wafer each time is deviated, resulting in uneven process effects. Summary of the invention

[0004] The present application provides a wafer post-processing method, a wafer post-processing system, an electronic device and a storage medium to solve or alleviate at least some of the problems mentioned above.

[0005] According to one aspect of the present application, a wafer post-processing method is provided, the method comprising:

[0006] Adjusting a spray bar, comprising: providing a spray bar adjusting device in a wafer cleaning device; adjusting the spray bar of the wafer cleaning device via the spray bar adjusting device, wherein the spray bar adjusting device comprises a drop point calibration member and a direction adjusting member; and removing the spray bar adjusting device; and

[0007] Cleaning a wafer, comprising: positioning the wafer in the wafer cleaning device and performing wafer cleaning;

[0008] “Adjusting the spray bar of the wafer cleaning device via the spray bar adjustment device” includes:

[0009] Matching the landing point mark on the landing point calibration piece with the preset liquid spray landing point position on the wafer; and

[0010] The directional adjustment member is actuated to drive the spray rod to rotate around its axis until the positioning portion of the directional adjustment member is aligned with the landing point mark, and the extending direction of the positioning portion matches the spray direction of the cleaning liquid sprayed from the spray rod.

[0011] Optionally or alternatively, "arranging a spray bar adjustment device in a wafer cleaning device" includes:

[0012] Arranging the plate-shaped body of the landing point calibration member along a vertical plane; the vertical plane corresponds to the position of the wafer in the wafer cleaning device;

[0013] The connecting portion of the directional adjustment member is detachably connected to the spray bar.

[0014] Optionally or alternatively, “actuating the directional adjustment member to drive the spray bar to rotate around its axis until the positioning portion of the directional adjustment member is aligned with the landing point mark” includes:

[0015] The positioning portion is retracted along its extension direction, and then extended toward the drop point marking member to align with the drop point mark when the directional adjustment member drives the spray bar to rotate around its axis.

[0016] Optionally or alternatively, the landing mark includes a calibration boss protruding from the body along a thickness direction perpendicular to the vertical surface; the positioning portion includes a telescopic sleeve and a positioning push rod, one end of the positioning push rod is slidably sleeved into the telescopic sleeve, and the other end is configured with an alignment portion matching the landing mark, and the alignment portion includes an alignment platform matching the shape of the upper surface of the calibration boss;

[0017] “When the directional adjustment member drives the spray bar to rotate around its axis, it extends toward the drop point marking member to align with the drop point mark” includes:

[0018] The alignment stage is placed against the upper surface of the calibration boss for alignment.

[0019] Optionally or alternatively, the body is configured with a calibration bevel recessed inwardly from the surface of the body, the calibration bevel extending in the horizontal direction and comprising: a bottom surface, the bottom surface being flush with the upper surface of the calibration boss; a vertical surface extending upwardly from the inner edge of the bottom surface; and an inclined surface extending obliquely from the edge of the vertical surface away from the bottom surface to the surface of the body;

[0020] The landing point mark includes a mark line extending horizontally on the vertical surface;

[0021] “When the directional adjustment member drives the spray bar to rotate around its axis, it extends toward the drop point marking member to align with the drop point mark” includes:

[0022] The aligning tip of the aligning portion is aligned with the identification line.

[0023] Optionally or alternatively, the method includes performing a step of adjusting the spray bar before performing the cleaning of the wafers and / or after performing the cleaning of the wafers for a preset number of wafers.

[0024] According to another aspect of the present application, a wafer post-processing system is provided, wherein the wafer post-processing system is configured to perform the method according to the aforementioned aspect, and comprises:

[0025] A wafer cleaning device configured to clean a wafer and comprising a spray bar for spraying a cleaning liquid onto the wafer;

[0026] a boom adjustment device for adjusting the boom; and

[0027] An actuating device is configured to actuate the boom adjustment device to perform the operation of adjusting the boom.

[0028] Optionally or alternatively, the actuating device comprises an actuator and a controller communicatively connected to the actuator; the controller is configured to send a control signal to the actuator to instruct the actuator to perform the operation of adjusting the spray boom.

[0029] Optionally or alternatively, the actuator comprises a robot and / or a drive integrated into the boom adjustment device.

[0030] According to another aspect of the present application, an electronic device is provided, comprising: a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus;

[0031] The memory is used to store at least one executable instruction, and the executable instruction enables the processor to issue an executable signal to execute an operation corresponding to the method described in the above aspects.

[0032] According to another aspect of the present application, a storage medium is provided, on which a computer program is stored. The computer program is executed by a processor to implement the method as described in the above aspect.

[0033] According to the wafer post-processing method, wafer post-processing system, electronic device and storage medium of the present application, by matching the landing point mark on the landing point calibration part with the expected preset spray landing point on the wafer, and by matching the extension direction of the pointing adjustment part with the spray direction of the cleaning liquid sprayed from the spray rod, a concrete operation of adjusting the spray rod angle is provided using specific physical standards, thereby reducing adjustment errors, improving adjustment accuracy, and thereby improving the effectiveness of wafer post-processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0035] Figure 1 It is a three-dimensional schematic diagram of a wafer cleaning device;

[0036] Figure 2 is a schematic diagram of a spray bar adjustment device according to an embodiment of the present application;

[0037] Figure 3 yes Figure 2 A side view of the boom adjustment device in FIG.

[0038] Figure 4 yes Figure 3 The enlarged view of A in FIG.

[0039] Figure 5 yes Figure 2 A schematic diagram of a directional adjustment member of a spray boom adjustment device;

[0040] Figure 6 Shows Figure 5 The enlarged view of point B in FIG.

[0041] Figure 7 is a flow chart of a method for adjusting a spray boom according to an embodiment of the present application;

[0042] Figure 8 is a flow chart of a wafer post-processing method according to an embodiment of the present application;

[0043] Fig. 9 is a schematic block diagram of a wafer post-processing system according to an embodiment of the present application; and

[0044] Fig.10 is a schematic diagram of an electronic device according to an embodiment of the present application.

[0045] Reference numerals:

[0046] Wafer post-processing system 1000, wafer W, wafer cleaning device 1, housing 10, support part 20, driving wheel 21, driven wheel 22, cleaning brush 30, spray rod 40, spray rod mounting seat 50;

[0047] Spray rod adjustment device 100, landing point calibration member 110, body 111, landing point mark 112, calibration boss 1121, calibration chute 1122, bottom surface 1122a, vertical surface 1122b, inclined surface 1122c, pointing adjustment member 120, connecting portion 121, first connecting member 1211, connecting head 1211a, connecting seat 1211b, second connecting member 1212, positioning portion 122, telescopic sleeve 1221, positioning ejector rod 1222, alignment portion 1223, alignment platform 1223a, alignment tip 1223b, connecting part 130;

[0048] Actuating device 200, actuator 210, controller 220;

[0049] Electronic device 300 , processor 310 , memory 320 , communication interface 330 , communication bus 340 . DETAILED DESCRIPTION

[0050] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0051] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0052] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0053] Figure 1 Schematic diagram of a wafer cleaning device. The wafer cleaning device 1 includes:

[0054] The housing 10 provides a relatively closed space for wafer cleaning operations ( Figure 1 For display purposes, one side wall and top cover of the housing 10 are hidden);

[0055] A supporting portion 20 , which is disposed on the housing 10 and supports the wafer W;

[0056] a pair of cleaning brushes 30 for cleaning the front and back surfaces of the wafer W;

[0057] A pair of spray bars 40 are provided with a plurality of nozzles and / or spray holes for supplying cleaning liquid toward the surface of the wafer W.

[0058] exist Figure 1 In the illustrated embodiment, the support portion 20 vertically supports (or horizontally supports in other embodiments) and positions the wafer W to be cleaned, and cleaning brushes 30 are provided on both sides of the wafer W, and the ends of the cleaning brushes 30 are connected to drive motors (not shown), and the drive motor drives the cleaning brushes 30 to rotate around their axes. When the wafer W is cleaned, the support portion 20 rotates, and under the action of friction, the wafer W vertically arranged on the support portion 20 rotates around the axis of the wafer W. Specifically, the support portion 20 includes a driving wheel 21 and a driven wheel 22, and the driving wheel 21 and the driven wheel 22 are provided with circumferentially surrounding card grooves, and the wafer W is clamped in the card grooves. Under the action of friction, the rotation of the driving wheel 21 can drive the wafer W to rotate around its axis. A spray rod 40 is provided on the upper part of the housing 10 to spray cleaning liquid on the surface of the wafer W. The spray rod 40 is fixed to the housing 10 via a spray rod mounting seat 50.

[0059] Figure 2 1 is a schematic diagram of a spray bar adjustment device 100 according to an embodiment of the present application, wherein the spray bar adjustment device 100 is installed in a wafer cleaning device 1 without wafers. The spray bar adjustment device 100 mainly includes a drop point calibration member 110 and a direction adjustment member 120. The drop point calibration member 110 is detachably installed in the wafer cleaning device 1, and is provided with a drop point mark 112 that matches the preset spray drop point on the wafer. The direction adjustment member 120 includes a connecting portion 121 detachably connected to the spray bar 40 and a positioning portion 122 connected to the connecting portion 121 (for a specific structure, see Figure 5), the extending direction of the pointing adjustment member 120 matches the spraying direction of the cleaning liquid sprayed from the spray rod 40, and the pointing adjustment member 120 is configured to drive the spray rod 40 to rotate around its (spray rod 40) axis until the positioning portion 122 is aligned with the drop mark 112, so that the spray rod 40 can spray the cleaning liquid to the preset spray drop point. Among them, the positioning portion 122 is configured to be retractable, and is configured to be retracted when installed to or removed from the spray rod 40 to avoid hitting the drop mark 110, and to extend toward the drop mark 110 to align with the drop mark 112 when the pointing adjustment member 120 drives the spray rod 40 to rotate around its axis.

[0060] According to the technical solution of the present application, by making the expected preset liquid spray landing point on the wafer equivalent to the landing point mark 112 on the landing point calibration member 110, and by matching the extension direction of the pointing adjustment member 120 with the spray direction of the cleaning liquid sprayed by the spray bar 40, the preset liquid spray landing point and the difficult-to-observe spray direction of the cleaning liquid are embodied as the extension direction of the landing point mark 112 and the pointing adjustment member 120, providing a specific physical standard for adjusting the angle of the spray bar 40. Furthermore, the synchronous rotation of the pointing adjustment member 120 and the spray bar 40 and the rotation adjustment of the spray bar 40 are achieved through the connection between the pointing adjustment member 120 and the spray bar 40. In addition, the positioning portion 122 of the pointing adjustment member 120 is designed to be retractable, thereby avoiding interference between the spray boom adjustment device 100 and the landing point marking member 110 or other components during installation or disassembly. The positioning portion 122 in the retracted state can save more operable controls for the spray boom adjustment device 100 or the wafer cleaning device 1, thereby improving the operational flexibility and convenience of the spray boom adjustment device 100; the positioning portion 122 in the extended state can be closer to or close to the landing point mark 112, thereby achieving accurate alignment of the positioning portion 122 with the landing point mark 112, reducing errors caused by human observation, and improving the accuracy of spray boom adjustment.

[0061] In a specific embodiment, in combination with Figure 2 as well as Figure 3 It can be seen from the side view of the spray bar adjustment device 100 shown that the drop point calibration member 110 includes a plate-shaped body 111, which is arranged along a vertical plane, and the middle section of the body 111 in the thickness direction can coincide with the middle section of the wafer in the thickness direction when the wafer is installed in the wafer cleaning device. The upper part of the body 111 can be configured as a semicircular plate, and the lower part of the body 111 can be configured as a roughly rectangular plate, and the two corners of the rectangle can be connected to the axle of the driving wheel 21 via connecting parts 130 (such as locking nuts). In optional embodiments, the drop point calibration member 110 can be configured into other shapes suitable for calibration and operation, and can also be installed on the rotating shaft of other rotating wheels (such as the driven wheel 22) or installed at other positions according to the needs of fixing and setting.

[0062] The landing point mark 112 includes a calibration boss 1121 protruding from the body 111 of the landing point calibration member 110 in the thickness direction perpendicular to the vertical plane. One or more (for example, two as shown) calibration bosses 1121 can be set on the first side of the landing point calibration member 110 facing one spray bar 40, and one or more (for example, two) calibration bosses 1121 can be set on the second side of the landing point calibration member 110 facing another spray bar. The vertical positions of the two or more calibration bosses 1121 on the same side are the same. The upper surface of the calibration boss 1121 can be set to be horizontal, and the calibration bosses 1121 on both sides of the landing point calibration member 110 can be set at different vertical positions to meet different cleaning requirements on both sides of the wafer.

[0063] Combination Figure 2 and Figure 4 It can be seen from the partial enlarged view that the body 111 of the landing point calibration member 110 also includes a calibration bevel 1122 recessed inward from the surface of the body 111, for example, two calibration bevels 1122 are respectively arranged on the first side and the second side of the landing point calibration member 110. The calibration bevel 1122 extends in the horizontal direction and includes a bottom surface 1122a flush with the upper surface of the calibration boss 1121, a vertical surface 1122b extending upward from the inner edge of the bottom surface 1122a, and an inclined surface 1122c extending outwardly from the edge of the vertical surface away from the bottom surface 1122a to the surface of the body 111 (for example, the inclination angle is 1° to 10°, preferably 2° to 8°). The plane of the vertical surface 1122b can coincide with the mid-section of the wafer in the thickness direction to simulate the installation position of the wafer in the wafer cleaning device. The landing point mark 112 includes a marking line (not marked) extending horizontally on the vertical surface 1122b. The distance between the marking line and the center of the wafer to be cleaned is 10 to 100 mm vertically, for example, 10 to 100 mm above the center of the wafer. The marking lines on both sides of the drop point calibration piece 110 can be staggered in the vertical direction, that is, located at different vertical heights. In addition, in order to ensure the structural strength of the drop point calibration piece 110, the thickness of the vertical surface 1122b can be set to be not less than 2 mm.

[0064] Combination Figure 4 The enlarged view of the part shown and Figure 5 It can be seen that the specific structure and specific alignment method of the pointing adjustment member 120. Figure 5As shown, the directional adjustment member 120 mainly includes a connecting portion 121 for detachably connecting to the spray rod 40 and a telescopic positioning portion 122 connected to the connecting portion 121. The positioning portion 122 includes a telescopic sleeve 1221 and a positioning push rod 1222. The telescopic sleeve 1221 can be telescopically slidably connected or fixedly connected to the connecting portion 121. One end of the positioning push rod 1222 is slidably sleeved into the telescopic sleeve 1221, and the other end is configured with an alignment portion 1223 matching the drop mark 112 (see Figure 6 ).

[0065] Figure 6 Shows Figure 5 The enlarged view of the B of FIG. 1 shows the specific structure of the alignment portion 1223. The alignment portion 1223 may include an alignment platform 1223a matching the shape of the upper surface of the calibration boss 1121, and the alignment platform 1223a is configured to abut against the upper surface of the calibration boss 1121. The alignment portion 1223 may also include an alignment tip 1223b, and the alignment tip 1223b is configured to align with the identification line. Figure 4 As shown, when the spray boom is adjusted, the positioning push rod 1222 extends toward the calibration slant slot 1122, so that the alignment platform 1223a abuts against the upper surface of the calibration boss 1121, and the alignment tip 1223b is aligned with the marking line. Figure 5 The tip 1223b has a certain length in the direction perpendicular to the paper surface, thereby forming an edge, so that the alignment between the alignment tip 1223b and the identification line is the alignment between lines, thereby improving the accuracy of the alignment.

[0066] The alignment of the alignment platform 1223a with the calibration boss 1121 and the alignment of the alignment tip 1223b with the marking line provide a dual alignment standard for the angle adjustment of the spray rod 40. The two alignment methods can assist and verify each other, avoid errors caused by human eye observation, provide dual guarantees for the accuracy of the angle adjustment of the spray rod 40, and improve the accuracy and adjustment efficiency of the angle adjustment of the spray rod 40. In addition, the calibration chute 1122 and the calibration boss 1121 are relatively easy to observe, which can facilitate the rapid adjustment of the position of the pointing adjustment member 120, and then make fine adjustments, thereby improving the adjustment efficiency. Furthermore, the calibration boss 1121 can also provide a vertical limit function for the pointing adjustment member 120, so that the pointing adjustment member 120 can be stably maintained at the adjusted position, preventing the pointing adjustment member 120 from deviating from the adjusted position when adjusting another spray rod or in other situations.

[0067] In a more specific embodiment, Figure 5As shown, the connection portion 121 includes a first connection member 1211 fixedly connected to the positioning portion 122 and a second connection member 1212 docked with the first connection member 1211. The first connection member 1211 may specifically include a connection head 1211a and a connection seat 1211b. The connection head 1211a is arranged opposite to the second connection member 1212 and clamps the spray rod 40 therebetween. The connection seat 1211b is used to be telescopically or fixedly connected (for example, via a fixing bolt) to the telescopic sleeve 1221. The connection head 1211a is configured with a first semicircular recess that is recessed away from the second connection member 1212, and the second connection member 1212 is configured with a second semicircular recess that is recessed away from the first connection member 1211, as shown in FIG. Figure 5 As shown, the connector 1211a is U-shaped as a whole, and the second connector 1212 is semicircular in shape as a whole. The inner diameters of the first semicircular recess and the second semicircular recess are the same and match the outer diameter of the spray rod, so that the first connector 1211 and the second connector 1212 are respectively clamped on the outside of the spray rod with the first semicircular recess and the second semicircular recess. During the installation process, the first connector 1211 can be clamped on the outside of the spray rod 40, and then the second connector 1212 can be pressed onto the outside of the spray rod 40 relative to the first connector 1211, and then the first connector 1211 and the second connector 1212 can be fixed relatively and fixed to the spray rod 40.

[0068] The inner diameter of the telescopic sleeve 1221 matches the outer diameter of the positioning push rod 1222. In the actual manufacturing process, the inner hole tolerance of the telescopic sleeve 1221 can be, for example, 0 to 0.018 mm, and the outer diameter tolerance of the positioning push rod 1222 can be, for example, -0.018 mm to -0.005 mm, so that there is a small gap between the two, and smooth sliding is achieved through the small gap matching, ensuring that the telescopic sliding process is stable and does not shake. The axial telescopic sliding range of the telescopic sleeve 1221 and the positioning push rod 1222 is, for example, 0 to 30 mm, that is, the positioning push rod 1222 can slide outward from the telescopic sleeve 1221 by a maximum of 30 mm.

[0069] The spray boom adjustment device 100 of the present application can be used to adjust the spray boom. Figure 7 A flow chart showing a method for adjusting a boom according to an embodiment of the present application is shown, the method comprising:

[0070] S1: Installing the landing point calibration component 110 in the wafer cleaning device 1;

[0071] S2: Connect the directional adjustment member 120 to the spray rod 40;

[0072] S3: rotating the pointing adjustment member 120 and stretching the positioning portion 122 until the positioning portion 122 is aligned with the landing point mark 112; and

[0073] S4: Retract the positioning portion 122 and disassemble the spray boom adjustment device 100.

[0074] Wherein, in step S2, when the directional adjustment member 120 is connected to the spray rod, the directional adjustment member 120 can be retracted to the shortest position, so as to facilitate the installation operation and avoid interference between the directional adjustment member 120 and other components. In addition, before the directional adjustment member 120 is relatively fixed to the spray rod, the position of the directional adjustment member 120 can be adjusted so that the axial extension direction of the directional adjustment member 120 matches the spray direction of the cleaning liquid sprayed from the spray rod, that is, the extension direction of the directional adjustment member 120 can simulate the spray direction of the cleaning liquid sprayed from the spray rod. In addition, S3 can include first adjusting the directional adjustment member 120 and the positioning portion 122 on one spray rod, and after adjusting the angle of the spray rod, adjusting the directional adjustment member 120 and the positioning portion 122 on another spray rod.

[0075] In a further embodiment, Figure 8 A flowchart of a wafer post-processing method according to an embodiment of the present application is schematically shown, and the method mainly includes:

[0076] S10: adjusting the spray bar 40, which may specifically include: S11: setting a spray bar adjusting device 100 in the wafer cleaning device; S12: adjusting the spray bar 40 of the wafer cleaning device via the spray bar adjusting device 100, the spray bar adjusting device 100 including a drop point calibration member 110 and a direction adjusting member 120; and S13: removing the spray bar adjusting device 100; and

[0077] S20: Cleaning the wafer W, which may specifically include: S21: Positioning the wafer W in the wafer cleaning device 1 and performing wafer cleaning.

[0078] Wherein, in step S11, “arranging the spray bar adjustment device 100 in the wafer cleaning device 1” may include:

[0079] S111: Arrange the plate-shaped body 111 of the drop point calibration member 110 along a vertical plane, wherein the vertical plane corresponds to the position of the wafer in the wafer cleaning device 1 ; and S112: Removably connect the connecting portion 121 of the pointing adjustment member 120 to the spray rod 40 .

[0080] According to the wafer post-processing method of the present application, by matching the landing point mark on the landing point calibration part with the expected preset spray landing point on the wafer, and by matching the extension direction of the pointing adjustment part with the spray direction of the cleaning liquid sprayed from the spray rod, a concrete operation of adjusting the spray rod angle is provided using specific physical standards, thereby reducing adjustment errors, improving adjustment accuracy, and thereby improving the effectiveness of wafer post-processing.

[0081] In a further embodiment, in step S12, "adjusting the spray rod 40 of the wafer cleaning device via the spray rod adjustment device 100" may include: S121: matching the landing point mark 112 on the landing point calibration member 110 with a preset liquid spray landing point position on the wafer; and S122: actuating the pointing adjustment member 120 to drive the spray rod 40 to rotate around its axis until the positioning portion 122 of the pointing adjustment member 120 is aligned with the landing point mark 112, wherein the extension direction of the positioning portion 122 matches the spray direction of the cleaning liquid sprayed from the spray rod 40.

[0082] More specifically, in step S122, “actuating the pointing adjustment member 120 to drive the spray rod 40 to rotate around its axis until the positioning portion 122 of the pointing adjustment member 120 is aligned with the drop mark 112” may include: contracting the positioning portion 122 along its extension direction, and then extending toward the drop mark 110 to align with the drop mark 112 when the pointing adjustment member 120 drives the spray rod 40 to rotate around its axis. “Extending toward the drop mark 110 to align with the drop mark 112 when the pointing adjustment member 120 drives the spray rod 40 to rotate around its axis” may include aligning the alignment platform 1223a against the upper surface of the calibration boss 1121, or may also include aligning the alignment tip 1223b of the alignment portion with the marking line.

[0083] It should be understood that the above-mentioned wafer post-processing method may include a step of adjusting the spray bar before performing wafer cleaning, i.e., calibration before cleaning, or may include a step of adjusting the spray bar after performing wafer cleaning for a preset number of wafers, so as to calibrate the spray angle deviation of the spray bar after the wafer cleaning device has been working for a period of time, thereby ensuring the effectiveness of subsequent cleaning operations. In other words, the step of adjusting the spray bar may be performed once or multiple times at one or more nodes where there is a need for adjustment after the wafer cleaning device is manufactured, before the first use, or during its service life.

[0084] Fig. 9 A schematic block diagram of a wafer post-processing system 1000 according to an embodiment of the present application is shown, wherein a dotted line represents a detachable connection between two devices, and a bidirectional hollow arrow represents a communication connection or an electrical connection. The wafer post-processing system 1000 is configured to perform the aforementioned wafer post-processing method, which may include:

[0085] A wafer cleaning device 1, which is configured to clean a wafer and includes a spray bar 40 for spraying a cleaning liquid onto the wafer;

[0086] A boom adjustment device 100 for adjusting the boom 40; and

[0087] The actuating device 200 is configured to actuate the spray boom adjusting device 100 to perform an operation of adjusting the spray boom.

[0088] The specific structures of the wafer cleaning device 1 and the spray bar adjustment device 100 can be found in Figure 1-6 As well as the description above. The actuator 200 may include an actuator 210 and a controller 220 that is communicatively connected to the actuator 210, and the controller 220 may be configured to send a control signal to the actuator 210 to instruct the actuator 210 to perform an operation of adjusting the spray bar. In one embodiment, the actuator 210 may include a manipulator that is used to adjust the spray bar 40, including moving the spray bar adjustment device 100 into, installing, and moving it out of the wafer cleaning device 1, so that the pointing adjustment member 120 of the spray bar adjustment device 100 drives the spray bar 40 to rotate around its axis, and aligning the positioning portion 122 of the pointing adjustment member 120 with the landing point mark 112, for example, with the help of a built-in or external device such as an image sensor. Or in an optional embodiment, the actuator 210 may also include a driver (not shown) integrated into the spray bar adjustment device 100, which may be used to perform operations such as alignment of the positioning portion 122 of the pointing adjustment member 120 with the landing mark 112, such as telescoping of the positioning portion 122, etc. In this case, the robot may only perform operations such as moving the spray bar adjustment device 100 into, installing, and removing the wafer cleaning device 1. It should be understood that the wafer post-processing system 1000 may also not include the actuator 200, but may use manual operations to perform the spray bar adjustment operation.

[0089] Fig.10 3 is a schematic diagram of an electronic device 300 according to an embodiment of the present application. The electronic device 300 may include a processor 310, a memory 320, a communication interface 330 and a communication bus 340, and the processor 310, the memory 320 and the communication interface 330 communicate with each other through the communication bus 340. The processor 310 may be a CPU, or an application specific integrated circuit ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiment of the present application. The processor 310 may be connected to the above-mentioned controller 220 for communication, and the controller 220 may control the actuator 210 to perform a corresponding operation after receiving an executable signal sent by the processor 310. The processor 310 may also be connected to the execution controller 220 of the wafer cleaning device for controlling the wafer cleaning device. The memory 320 is used to store at least one executable instruction, which enables the processor 310 to send an executable signal for executing an operation corresponding to the wafer post-processing method. The communication interface 330 is used to communicate with other electronic devices 300 or servers.

[0090] The present application also provides a storage medium (not shown), which stores a computer program, which can be executed by the processor 310 to implement the aforementioned wafer post-processing method. Specifically, a system or device equipped with a storage medium can be provided, on which a software program code for the function of any of the embodiments of the above-mentioned wafer post-processing method is stored, and the computer (or CPU or MPU) of the system or device is read out and executed by the program code stored in the storage medium. In this case, the program code read from the storage medium itself can be used to implement the operation of any of the embodiments in the above-mentioned embodiments, so the program code and the storage medium storing the program code constitute a part of the present application. The storage medium embodiment for providing the program code includes a floppy disk, a hard disk, a magneto-optical disk, an optical disk (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), a magnetic tape, a non-volatile memory card and a ROM.

[0091] The above describes the wafer post-processing method, wafer post-processing system, electronic device and storage medium of the application. It should be understood that the above implementation mode is only used to illustrate the embodiments of the present application, and is not a limitation to the embodiments of the present application. Ordinary technical personnel in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer post-processing method, characterized in that: The method comprises: Adjusting a spray bar, comprising: providing a spray bar adjusting device in a wafer cleaning device; adjusting the spray bar of the wafer cleaning device via the spray bar adjusting device, wherein the spray bar adjusting device comprises a drop point calibration member and a direction adjusting member; and removing the spray bar adjusting device; and Cleaning a wafer, comprising: positioning the wafer in the wafer cleaning device and performing wafer cleaning; “Adjusting the spray bar of the wafer cleaning device via the spray bar adjustment device” includes: Matching the landing point mark on the landing point calibration piece with the preset liquid spray landing point position on the wafer; and The directional adjustment member is actuated to drive the spray rod to rotate around its axis until the positioning portion of the directional adjustment member is aligned with the landing point mark, and the extending direction of the positioning portion matches the spray direction of the cleaning liquid sprayed from the spray rod.

2. The wafer post-processing method according to claim 1, characterized in that: "Providing a spray bar adjustment device in a wafer cleaning device" includes: Arranging the plate-shaped body of the landing point calibration member along a vertical plane; the vertical plane corresponds to the position of the wafer in the wafer cleaning device; The connecting portion of the directional adjustment member is detachably connected to the spray bar.

3. The wafer post-processing method according to claim 2, characterized in that: "Actuating the directional adjustment member to drive the spray rod to rotate around its axis until the positioning portion of the directional adjustment member is aligned with the drop point mark" includes: The positioning portion is retracted along its extension direction, and then extended toward the drop point marking member to align with the drop point mark when the directional adjustment member drives the spray bar to rotate around its axis.

4. The wafer post-processing method according to claim 3, characterized in that: The landing mark includes a calibration boss protruding from the body along a thickness direction perpendicular to the vertical surface; the positioning portion includes a telescopic sleeve and a positioning push rod, one end of the positioning push rod is slidably sleeved into the telescopic sleeve, and the other end is configured with an alignment portion matching the landing mark, and the alignment portion includes an alignment platform matching the shape of the upper surface of the calibration boss; "When the directional adjustment member drives the spray bar to rotate around its axis, it extends toward the drop point marking member to align with the drop point mark" includes: The alignment stage is placed against the upper surface of the calibration boss for alignment.

5. The wafer post-processing method according to claim 4, characterized in that: The body is configured with a calibration bevel recessed inward from the surface of the body, the calibration bevel extending in the horizontal direction and comprising: a bottom surface, the bottom surface being flush with the upper surface of the calibration boss; a vertical surface extending upward from the inner edge of the bottom surface; and an inclined surface extending obliquely from the edge of the vertical surface away from the bottom surface to the surface of the body; The landing point mark includes a mark line extending horizontally on the vertical surface; "When the directional adjustment member drives the spray bar to rotate around its axis, it extends toward the drop point marking member to align with the drop point mark" includes: The aligning tip of the aligning portion is aligned with the identification line.

6. The wafer post-processing method according to any one of claims 1 to 5, characterized in that: The method includes the step of adjusting the spray bar before performing wafer cleaning and / or after performing wafer cleaning for a preset number of wafers.

7. A wafer post-processing system, characterized in that: The wafer post-processing system is configured to perform the method according to any one of claims 1 to 6, comprising: A wafer cleaning device configured to clean a wafer and comprising a spray bar for spraying a cleaning liquid onto the wafer; a boom adjustment device for adjusting the boom; and An actuating device is configured to actuate the boom adjustment device to perform the operation of adjusting the boom.

8. The wafer post-processing system according to claim 7, characterized in that: The actuating device includes an actuator and a controller in communication with the actuator; the controller is configured to send a control signal to the actuator to instruct the actuator to perform the operation of adjusting the spray boom.

9. The wafer post-processing system according to claim 8, characterized in that: The actuator comprises a robot and / or a drive integrated into the boom adjustment device.

10. An electronic device, characterized in that: include: A processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to issue an executable signal to execute an operation corresponding to the method according to any one of claims 1 to 6.

11. A storage medium, characterized in that: The storage medium stores a computer program, which is executed by a processor to implement the method according to any one of claims 1 to 6.

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