Miniaturized BGA welding type connector

Abstract

The invention belongs to the technical field of connectors, and particularly relates to a miniaturized BGA welding type connector which comprises a jack connector and a pin connector which are connected in a pluggable mode, the jack connector comprises a metal base shell, a plurality of jack contact assemblies and a plurality of grounding pins, and the metal base shell is connected with the pin connector in a pluggable mode. The pin connector assembly comprises one metal head housing, a plurality of pin contact member assemblies and a plurality of grounding pins. Independent high-speed signal transmission paths formed by the jack contact assembly and the pin contact assembly are respectively assembled in different independent transmission cavities, and are separated and shielded through the metal shell, so that the electromagnetic shielding performance is good, and better characteristic impedance is easy to obtain; due to the mutual isolation, the crosstalk generated between the two parts is low and even no crosstalk is generated, and the transmission performance is stable; and by virtue of the integral shielding characteristic of the metal shell, the contact element is less in external interference or is not interfered by an external signal.

Description

Technical Field

[0001] The invention belongs to the technical field of connectors, and in particular relates to a miniaturized BGA soldering type connector. Background Art

[0002] With the continuous improvement of the performance of special equipment, the use environment is becoming more and more complex, and the requirements for internal components are becoming higher and higher. Especially under the demand for higher and higher signal transmission rates and faster information processing, the requirements for connectors' low crosstalk, impedance matching, shielding performance and other indicators are constantly increasing.

[0003] As the density of components inside the chassis increases, mutual interference increases, which puts new requirements on the shielding ability of the components themselves. At present, many high-speed connectors between boards are shielded by shielding sheets, but at extremely high transmission rates, there will still be some mutual interference, such as interference between various signals inside the connector and interference from the connector to the outside.

[0004] In view of the above problems, a miniaturized BGA soldering type connector is designed. Summary of the invention

[0005] The present invention aims at solving the problems in the prior art and proposes the following technical solutions:

[0006] Miniaturized BGA soldering connectors, including pluggable socket connectors and pin connectors.

[0007] The jack connector comprises a metal base shell, a plurality of jack contact assemblies and a plurality of grounding pins. The metal base shell is provided with a rectangular seat cavity whose number is the same as that of the jack contact assemblies. The jack contact assemblies are press-fitted inside the rectangular seat cavity. The mounting surface A of the metal head shell is provided with mounting circular holes A whose number is the same as that of the grounding pins. The grounding pins are press-fitted inside the mounting circular holes A.

[0008] The pin connector comprises a metal head shell, a plurality of pin contact assemblies and a plurality of ground pins. The metal head shell is provided with a head rectangular cavity whose number is the same as the pin contact assemblies. The pin contact assemblies are press-fitted into the head rectangular cavity. The mounting surface B of the metal head shell is provided with mounting circular holes B whose number is the same as the ground pins. The ground pins are press-fitted into the mounting circular holes B.

[0009] Among them, the number of the jack contact assembly and the pin contact assembly is the same. When the jack connector and the pin connector are plugged in, the seat rectangular cavity and the head rectangular cavity form an independent conveying cavity. The jack contact assembly and the pin contact assembly cooperate inside the independent conveying cavity to form an independent high-speed signal transmission path.

[0010] As a preferred embodiment of the above technical solution, a plurality of the seat rectangular cavities are arranged in a staggered manner with respect to each other;

[0011] The plurality of head rectangular cavities are arranged in a staggered manner relative to each other.

[0012] As a preferred embodiment of the above technical solution, a plurality of isolation convex ribs A are provided on the mounting surface A of the metal seat shell, and the isolation convex ribs A are distributed at positions between adjacent row seat rectangular cavities;

[0013] A plurality of isolation convex ribs B are arranged on the mounting surface B of the metal head shell, and the isolation convex ribs B are distributed between adjacent row head rectangular cavities.

[0014] As a preferred embodiment of the above technical solution, the socket contact assembly comprises two parallel hole contacts, one seat base, and two oppositely distributed lower seat bases, wherein the seat base has two seat circular holes, and the tails of the two hole contacts pass through the seat circular holes and then pass between the two oppositely distributed lower seat bases;

[0015] The pin contact assembly includes two parallel distributed pin contacts, one head base, and two relatively distributed lower head bases. The head base has two head circular holes, and the tails of the two pin contacts pass through the head circular holes and then pass between the two relatively distributed lower head bases.

[0016] As a preferred embodiment of the above technical solution, the head of the hole contact is provided with a rigid circular hole, and the tail is provided with a solder ball A;

[0017] The head of the needle contact piece is provided with a spring pin, and the tail is provided with a solder ball B, and the spring pin matches the rigid circular hole.

[0018] As a preferred embodiment of the above technical solution, a narrow diameter area A is provided in the middle of the hole contact piece, and a lower base is sleeved on the narrow diameter area A;

[0019] A narrow diameter area B is arranged in the middle of the needle contact piece, and a head lower base is sleeved on the narrow diameter area B.

[0020] As a preferred embodiment of the above technical solution, a positioning step A is provided in the rectangular cavity of the seat, and a limiting surface is provided on the seat base, and the positioning step A and the limiting surface of the seat are in conflict with each other;

[0021] A positioning step B is provided in the head rectangular cavity, and a head limiting surface is provided on the head base, and the positioning step B is in conflict with the head limiting surface.

[0022] As a preferred embodiment of the above technical solution, an interference step is provided in the middle of the grounding pin, and a solder ball C is provided at the tail.

[0023] As a preferred embodiment of the above technical solution, a docking cavity is provided on the metal seat shell, and the docking surface on the metal head shell is inserted into the interior of the docking cavity;

[0024] A plurality of guide bosses are provided on the side wall of the docking cavity, and a guide groove matching the guide bosses is provided on the metal head shell;

[0025] The number of guide bosses on each side wall of the docking cavity is inconsistent.

[0026] As a preferred embodiment of the above technical solution, it also includes a PCB board, and the PCB board is provided with a circular pad;

[0027] The solder ball A, the solder ball B, and the solder ball C are arranged on the round solder pad by using high temperature reflow soldering technology.

[0028] The beneficial effects of the present invention are:

[0029] 1. In the technical solution of the miniaturized BGA soldering connector, when the socket connector and the pin connector are plugged in, the seat rectangular cavity and the head rectangular cavity form an independent transmission cavity, and the socket contact assembly and the pin contact assembly are matched inside the independent transmission cavity to form an independent high-speed signal transmission path;

[0030] The independent high-speed signal transmission paths formed by the jack contact assembly and the pin contact assembly are respectively assembled inside different independent transmission cavities, and are separated and shielded from each other by the metal shell, have good electromagnetic shielding performance, and are easy to obtain better characteristic impedance; because they are isolated from each other, the crosstalk generated between them is low or even no crosstalk is generated, and the transmission performance is stable; and due to the overall shielding characteristics of the metal shell, the contacts are less subject to external interference or are not subject to interference from external signals. This miniaturized BGA soldering connector can be used for high-speed signal interconnection between the internal pinch plate and the carrier board of the chassis.

[0031] 2. In the technical solution of this miniaturized BGA soldering connector, the base shell and the head shell are both made of metal materials, which solves the problem that the connector in the prior art uses a plastic shell and is damaged during multiple docking and plugging processes.

[0032] 3. In the technical solution of the miniaturized BGA soldering connector, the head of the hole contact piece adopts a rigid circular hole, and the head of the needle contact piece adopts a spring pin. When the connector is plugged in, the spring pin cooperates with the rigid circular hole to form a plurality of contact areas evenly distributed circumferentially inside the rigid circular hole. The plurality of contacts form a circumferential contact ring with reliable contact and low contact resistance, thereby realizing reliable interconnection of high-speed signals. At the same time, the contact between the spring pin and the rigid circular hole is reliable, making the connector in the technical solution more suitable for strong vibration and shock environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 The structure diagram of the miniaturized BGA soldering connector in Example 1 is shown;

[0034] Figure 2 The structure diagram of the jack connector in the first embodiment is shown;

[0035] Figure 3 Shown is an exploded schematic diagram of the jack connector in Example 1;

[0036] Figure 4 The figure shows a schematic diagram of the structure of the metal base housing in the first embodiment from a first viewing angle;

[0037] Figure 5 The figure shows a schematic diagram of the structure of the metal base housing in the embodiment 1 from a second viewing angle;

[0038] Figure 6 The structure diagram of the socket contact assembly in the first embodiment is shown;

[0039] Figure 7 The figure shows the matching state of the hole contact piece and the base under the seat in the embodiment 1;

[0040] Figure 8 The structure diagram of the pin connector in Example 1 is shown;

[0041] Fig. 9 Shown is an exploded schematic diagram of the pin connector in Example 1;

[0042] Fig.10 The figure shows a schematic diagram of the structure of the metal head housing in the first embodiment from a first viewing angle;

[0043] Fig.11 The figure shows a schematic diagram of the structure of the metal head housing in the first embodiment from a second viewing angle;

[0044] Fig.12 The figure shows a schematic diagram of the structure of the pin contact assembly in Embodiment 1;

[0045] Fig.13 The figure shows the matching state of the pin contact and the base under the head in the first embodiment;

[0046] Fig.14 The structure diagram of the ground pin in Example 1 is shown;

[0047] Fig.15 The diagram shows the structural state of the assembly of the jack connector, the pin connector and the PCB board in Example 1.

[0048] Reference numerals: jack connector 1; metal housing 10; docking cavity 100; guide boss 1001; rectangular cavity 101; positioning step A1011; mounting surface A102; mounting circular hole A1020; isolation rib A1021; hole contact 11; rigid circular hole 110; narrow diameter area A111; solder ball A112; seat base 12; seat limiting surface 121; seat circular hole 122; lower seat base 13;

[0049] Pin connector 2; metal head shell 20; docking surface 200; guide groove 2001; head rectangular cavity 201; positioning step B2011; mounting surface B202; mounting circular hole B2020; isolation rib B2021; pin contact 21; spring pin 210; narrow diameter area B211; solder ball B212; head base 22; head limiting surface 221; head circular hole 222; head lower base 23;

[0050] Ground pin 3; interference step 31; solder ball C32;

[0051] PCB board 4; round pad 41. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0053] Example 1

[0054] like Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 As shown, a miniaturized BGA soldering type connector includes a pluggable socket connector 1 and a pin connector 2.

[0055] The jack connector 1 comprises a metal base shell 10, a plurality of jack contact assemblies and a plurality of ground pins 3. The metal base shell 10 has a rectangular seat cavity 101 whose number is the same as that of the jack contact assemblies. The jack contact assemblies are press-fitted into the rectangular seat cavity 101. The mounting surface A102 of the metal head shell 20 is provided with mounting circular holes A1020 whose number is the same as that of the ground pins 3. The ground pins 3 are press-fitted into the mounting circular holes A1020.

[0056] The pin connector 2 includes a metal head shell 20, a plurality of pin contact parts and a plurality of ground pins 3. The metal head shell 20 is provided with a head rectangular cavity 201, the number of which is the same as that of the pin contact parts. The pin contact parts are press-fitted into the inside of the head rectangular cavity 201. The mounting surface B202 of the metal head shell 20 is provided with mounting circular holes B2020, the number of which is the same as that of the ground pins 3. The ground pins 3 are press-fitted into the inside of the mounting circular holes B2020.

[0057] Among them, the number of the jack contact assembly and the pin contact assembly is the same. When the jack connector 1 and the pin connector 2 are plugged in, the seat rectangular cavity 101 and the head rectangular cavity 201 form an independent conveying cavity, and the jack contact assembly and the pin contact assembly cooperate inside the independent conveying cavity to form an independent high-speed signal transmission path.

[0058] In the technical solution of the miniaturized BGA soldering type connector, independent high-speed signal transmission paths formed by the socket contact assembly and the pin contact assembly are respectively assembled inside different independent transmission cavities, and are separated and shielded from each other by the metal shell, so as to have good electromagnetic shielding performance and easily obtain better characteristic impedance; and because they are isolated from each other, the crosstalk generated between them is low or even no crosstalk is generated, and the transmission performance is stable; and due to the overall shielding characteristics of the metal shell, the contacts are less subject to external interference or are not subject to interference from external signals, and the miniaturized BGA soldering type connector can be used for high-speed signal interconnection between the internal buckle plate and the carrier board of the chassis.

[0059] At the same time, the seat shell and the head shell in the present technical solution are both made of metal, which solves the problem that the connector in the prior art uses a plastic shell and is damaged during multiple docking and plugging processes.

[0060] In order to reduce the impact between multiple signal transmission channels, such as Figure 3 , Figure 4 , Figure 5 As shown, a plurality of rectangular cavities 101 are arranged in a staggered manner relative to each other;

[0061] like Fig. 9 , Fig.10 , Fig.11 As shown, a plurality of head rectangular cavities 201 are arranged in a staggered manner relative to each other.

[0062] To further improve the shielding effect, such as Figure 4As shown, a plurality of isolating ribs A1021 are provided on the mounting surface A102 of the metal base housing 10, and the isolating ribs A1021 are distributed between adjacent rows of the seat rectangular cavities 101; the setting of the isolating ribs A1021 isolates adjacent rows of the socket contact assemblies, plays the role of lateral isolation between the socket contact assemblies, and at the same time can prevent the metal base housing 10 from being deformed in the length direction and other problems.

[0063] like Fig.10 As shown, a plurality of isolation ribs B2021 are provided on the mounting surface B202 of the metal head shell 20, and the isolation ribs B2021 are distributed between adjacent rows of head rectangular cavities 201; the setting of the isolation ribs B2021 isolates adjacent rows of pin contact assemblies, plays the role of lateral isolation between the pin contact assemblies, and at the same time can prevent the metal head shell 20 from being deformed in the length direction and other problems.

[0064] In order to meet the technical requirements of isolation between each other, the socket contact assembly and the pin contact assembly have the following specific performances, such as Figure 6 , Figure 7 As shown, the socket contact assembly includes two hole contacts 11 distributed in parallel, one seat base 12, and two lower seat bases 13 distributed opposite to each other. The seat base 12 is provided with two seat circular holes 122. The tail ends of the two hole contacts 11 pass through the seat circular holes 122 and then pass between the two lower seat bases 13 distributed opposite to each other.

[0065] like Fig.12 , Fig.13 As shown, the pin contact assembly includes two parallel distributed pin contacts 21, one head base 22, and two relatively distributed lower head bases 23. The head base 22 is provided with two head circular holes 222. The tail ends of the two pin contacts 21 pass through the head circular holes 222 and then pass between the two relatively distributed lower head bases 23.

[0066] The jack contact assembly consists of a hole contact 11, a seat base 12, and a lower seat base 13, which cover the middle part of the hole contact 11, and the seat base 12 and the lower seat base 13 are assembled inside the seat rectangular cavity 101; the pin contact assembly consists of a pin contact 21, a head base 22, and a lower head base 23, which cover the head and the middle part of the pin contact 21, and the head base 22 and the lower head base 23 are assembled inside the head rectangular cavity 201, that is, when the jack connector 1 and the pin connector 2 are plugged in, the hole contact 11 is inserted into the inside of the head circular hole 222, and the seat base 12 is in contact with the head base 22, that is, the signal transmission channel composed of the hole contact 11 and the pin contact 21 is completely isolated inside the independent transmission cavity, so that the multiple hole contacts 11 and the pin contacts 21 are isolated from each other and do not interfere with each other.

[0067] like Figure 6 , Figure 7 As shown, a rigid circular hole 110 is provided at the head of the hole contact 11 and a solder ball A112 is provided at the tail. The solder ball A112 is connected to the hole contact 11 by adopting a thermal high-temperature ball implantation technology.

[0068] like Fig.12 , Fig.13 As shown, the head of the needle contact 21 is provided with a spring pin 210 and the tail is provided with a solder ball B212 . The solder ball B212 is connected to the needle contact 21 by using a hot high-temperature ball implantation technology, and the spring pin 210 matches the rigid circular hole 110 .

[0069] The spring pin 210 in the present embodiment adopts a micro-twisted wire structure, which is composed of a plurality of copper wires wound together; the head of the hole contact 11 adopts a rigid circular hole 110, and the head of the needle contact 21 adopts a spring pin 210. When the connector is plugged in, the spring pin 210 cooperates with the rigid circular hole 110 to form a plurality of contact areas evenly distributed circumferentially inside the rigid circular hole 110. The plurality of contacts form a circumferential contact ring, which has reliable contact and low contact resistance, thereby realizing reliable interconnection of high-speed signals. At the same time, the contact between the spring pin 210 and the rigid circular hole 110 is reliable, making the connector in the present technical solution more suitable for strong vibration and shock environments.

[0070] like Fig.14 As shown, an interference step 31 is provided in the middle of the grounding pin 3, and a solder ball C32 is provided at the tail. The solder ball C32 is connected to the grounding pin 3 using a hot high-temperature ball planting technology; the setting of the interference step 31 enables the grounding pin 3 to be press-fitted into the inside of the mounting circular hole A1020.

[0071] The hole contact 11 is assembled into the seat rectangular cavity 101, the needle contact 21 is assembled into the head rectangular cavity 201, the grounding pin 3 is assembled into the mounting circular hole A1020 and the mounting circular hole B2020, the solder balls A112 are arranged in the same plane at the bottom of the metal seat shell 10 to form a BGA array arrangement, the solder balls B212 are arranged in the same plane at the bottom of the metal head shell 20 to form a BGA array arrangement, and the solder balls C32 are arranged in the same plane at the bottom of the metal seat shell 10 and the metal head shell 20 to form a BGA array arrangement. All the solder balls are arranged neatly and their heights are basically consistent, forming a regular ball grid array.

[0072] Among them, the ball grid array formed by the solder ball C32 is evenly distributed around the socket contact assembly, and cooperates with the isolation rib A1021. The ball grid array formed by the solder ball C32 is evenly distributed around the pin contact assembly, and cooperates with the isolation rib B2021, together forming a better shielding function.

[0073] like Figure 7 As shown, a narrow diameter area A111 is provided in the middle of the hole contact piece 11, and a lower base 13 is sleeved on the narrow diameter area A111. A groove matching the narrow diameter area A111 is provided on the lower base 13, so as to increase the contact area between the lower base 13 and the hole contact piece 11 and improve the installation stability; the narrow diameter area A111 of the hole contact piece 11 is sleeved with two identical lower bases 13 that are reversely buckled together.

[0074] like Fig.13 As shown, a narrow diameter area B211 is provided in the middle of the needle contact member 21, and a head base 23 is mounted on the narrow diameter area B211. A groove matching the narrow diameter area B211 is provided on the head base 23, so as to increase the contact area between the head base 23 and the needle contact member 21 and improve the installation stability. The narrow diameter area B211 of the needle contact member 21 is mounted with two identical head bases 23 that are reversely buckled together.

[0075] like Figure 4 , Figure 6 As shown, a positioning step A1011 is provided in the seat rectangular cavity 101, and a seat limiting surface 121 is provided on the seat base 12. When the socket contact assembly is assembled into the seat rectangular cavity 101, the positioning step A1011 and the seat limiting surface 121 are in contact with each other to achieve axial positioning of the socket contact assembly;

[0076] like Fig.10 , Fig.12 As shown, a positioning step B2011 is provided in the head rectangular cavity 201, and a head limiting surface 221 is provided on the head base 22. When the pin contact assembly is assembled into the interior of the head rectangular cavity 201, the positioning step B2011 and the head limiting surface 221 are in contact with each other to realize the axial positioning of the pin contact assembly.

[0077] In the technical solution of the miniaturized BGA soldering type connector, when assembling the socket contact assembly and the pin contact assembly, taking the socket contact assembly as an example, the two hole contacts 11 are inserted from the head position into the interior of the circular hole 122 of the seat portion of the seat base 12, and the two identical lower seat bases 13 are reversely buckled in the narrow diameter area A111. When the socket contact assembly is interference fit into the interior of the seat rectangular cavity 101, the positioning step A1011 and the seat limit surface 121 are in contact with each other to achieve axial positioning, and the two reversely buckled lower seat bases 13 are confined inside the seat rectangular cavity 101, thereby achieving the installation of the socket contact assembly.

[0078] like Figure 5 , Fig.11 As shown, a mating cavity 100 is provided on the metal base housing 10. When the jack connector 1 and the pin connector 2 are plugged in and matched, the mating surface 200 on the metal head housing 20 is inserted into the interior of the mating cavity 100 to protect the hole contact 11.

[0079] like Figure 5 , Fig.10 , Fig.11 As shown, a plurality of guide bosses 1001 are provided on the side wall of the docking cavity 100, and a guide groove 2001 matching the guide bosses 1001 is provided on the metal head shell 20; when the jack connector 1 and the pin connector 2 are plugged in and mated, the guide bosses 1001 are located inside the guide grooves 2001 and slidably fit therewith to prevent skewed insertion and removal.

[0080] The number of guide bosses 1001 on each side wall of the docking cavity 100 is inconsistent. Figure 5 In this embodiment, one is provided on one side and two are provided on the other side, so that when the jack connector 1 and the pin connector 2 are plugged in and matched, a fool-proof setting is achieved.

[0081] like Fig.15 As shown, the miniaturized BGA soldering type connector also includes a PCB board 4, on which a round solder pad 41 is provided;

[0082] The solder balls A112, B212 and C32 are arranged on the round pad 41 by high temperature reflow soldering technology, that is, the solder balls A112, B212 and C32 are melted and connected to the round pad 41, thereby connecting the contact parts to the traces on the PCB board 4, and reliably connecting to the PCB board 4 to form an electrical path and realize the function of signal transmission.

[0083] The structures of the jack connector 1 and the pin connector 2 are both straight structures, which are vertically mounted on the surface of the PCB board 4. They are fixed and soldered to the PCB board 4 through a lead or lead-free high-temperature reflow soldering process, thereby realizing the electrical connection between the connector and the PCB board 4. When the hole contact 11 and the pin contact 21 are docked with each other, high-speed signal interconnection between two parallel PCB boards 4 can be realized. In addition, the height of the hole contact 11 and the pin contact 21 can be designed into different size ranges according to the use requirements to meet the electrical interconnection between PCB boards 4 of different heights.

[0084] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. A miniaturized BGA soldering connector, comprising a pluggable socket connector (1) and a pin connector (2), characterized in that: The jack connector (1) comprises a metal base shell (10), a plurality of jack contact assemblies and a plurality of grounding pins (3); the metal base shell (10) is provided with a rectangular seat cavity (101) whose number is the same as the jack contact assemblies; the jack contact assemblies are press-fitted into the rectangular seat cavity (101); the mounting surface A (102) of the metal head shell (20) is provided with mounting circular holes A (1020) whose number is the same as the grounding pins (3); the grounding pins (3) are press-fitted into the mounting circular holes A (1020); The pin connector (2) comprises a metal head shell (20), a plurality of pin contact assembly parts and a plurality of ground pins (3); the metal head shell (20) is provided with a head rectangular cavity (201) whose number is the same as the pin contact assembly parts; the pin contact assembly parts are press-fitted into the interior of the head rectangular cavity (201); the mounting surface B (202) of the metal head shell (20) is provided with mounting circular holes B (2020) whose number is the same as the ground pins (3); the ground pins (3) are press-fitted into the interior of the mounting circular holes B (2020); The number of the jack contact assembly and the pin contact assembly is the same. When the jack connector (1) and the pin connector (2) are plugged in, the seat rectangular cavity (101) and the head rectangular cavity (201) form an independent transmission cavity. The jack contact assembly and the pin contact assembly cooperate inside the independent transmission cavity to form an independent high-speed signal transmission path.

2. The miniaturized BGA soldering type connector according to claim 1, characterized in that: The plurality of seat rectangular cavities (101) are arranged in a staggered manner relative to each other; The plurality of head rectangular cavities (201) are arranged in a staggered manner with respect to each other.

3. The miniaturized BGA soldering type connector according to claim 1, characterized in that: A plurality of isolation convex ribs A (1021) are provided on the mounting surface A (102) of the metal seat housing (10), and the isolation convex ribs A (1021) are distributed at positions between adjacent row seat rectangular cavities (101); A plurality of isolation convex ribs B (2021) are provided on the mounting surface B (202) of the metal head housing (20), and the isolation convex ribs B (2021) are distributed at positions between adjacent row head rectangular cavities (201).

4. The miniaturized BGA soldering type connector according to claim 1, characterized in that: The socket contact assembly comprises two parallel distributed hole contacts (11), one seat base (12), and two oppositely distributed lower seat bases (13); the seat base (12) is provided with two seat circular holes (122); the tails of the two hole contacts (11) pass through the seat circular holes (122) and then pass between the two oppositely distributed lower seat bases (13); The pin contact assembly comprises two pin contacts (21) arranged in parallel, one head base (22), and two head lower bases (23) arranged opposite to each other. The head base (22) is provided with two head circular holes (222). The tails of the two pin contacts (21) pass through the head circular holes (222) and then pass between the two head lower bases (23) arranged opposite to each other.

5. The miniaturized BGA soldering type connector according to claim 4, characterized in that: The hole contact piece (11) is provided with a rigid circular hole (110) at the head and a solder ball A (112) at the tail; The needle contact piece (21) is provided with a spring pin (210) at the head and a solder ball B (212) at the tail, and the spring pin (210) matches the rigid circular hole (110).

6. The miniaturized BGA soldering type connector according to claim 5, characterized in that: A narrow diameter area A (111) is provided in the middle of the hole contact member (11), and a lower base (13) is sleeved on the narrow diameter area A (111); A narrow diameter area B (211) is arranged in the middle of the needle contact member (21), and a lower head base (23) is sleeved on the narrow diameter area B (211).

7. The miniaturized BGA soldering type connector according to claim 6, characterized in that: A positioning step A (1011) is provided in the seat rectangular cavity (101), and a seat limiting surface (121) is provided on the seat base (12), and the positioning step A (1011) and the seat limiting surface (121) are in conflict with each other; A positioning step B (2011) is provided in the head rectangular cavity (201), and a head limiting surface (221) is provided on the head base (22), and the positioning step B (2011) is in abutment with the head limiting surface (221).

8. The miniaturized BGA soldering type connector according to claim 5, characterized in that: The grounding pin (3) is provided with an interference step (31) in the middle and a solder ball C (32) at the tail.

9. The miniaturized BGA soldering type connector according to claim 1, characterized in that: The metal seat shell (10) is provided with a docking cavity (100), and the docking surface (200) on the metal head shell (20) is inserted into the interior of the docking cavity (100); A plurality of guide bosses (1001) are provided on the side wall of the docking cavity (100), and a guide groove (2001) matching the guide bosses (1001) is provided on the metal head shell (20); The number of guide bosses (1001) on each side wall of the docking cavity (100) is inconsistent.

10. The miniaturized BGA soldering type connector according to claim 8, characterized in that: It also includes a PCB board (4), on which a circular pad (41) is provided; The solder ball A (112), the solder ball B (212), and the solder ball C (32) are arranged on the round solder pad (41) by using a high-temperature reflow soldering technology.

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