A semiconductor device chip mounting device

Abstract

The invention discloses a semiconductor device patch device, belonging to the technical field of semiconductor processing devices, comprising a supporting base plate, an outer shielding cover is fixedly connected to the supporting base plate, an upper cover plate is hinged on the outer shielding cover, a patch machine is fixedly connected to the upper cover plate, a patch outlet end of the patch machine passes through the outer wall of the upper cover plate, an air pump is installed at the bottom of the upper cover plate, an air outlet of the air pump is connected to a telescopic folding tube, two groups of vertical support rollers are rotatably connected to the supporting base plate, and a hollow conveyor belt is sleeved on the outside of each group of vertical support rollers. Because the hollow conveyor belt has gas inside as support, it can always abut against the PCB board during the transmission process to avoid loosening and falling. At the same time, the hollow conveyor belt supported by the gas can not only clamp and limit PCB boards of different sizes when clamping and limiting the hollow conveyor belt plate, but also avoid excessive squeezing of the PCB board, thereby reducing damage to the PCB board during the transmission process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a semiconductor device chip mounting device. Background Art

[0002] Semiconductor device placement machines are key equipment in the semiconductor manufacturing process. They are mainly responsible for accurately placing tiny electronic components (such as resistors, capacitors, chips, etc.) on printed circuit boards (PCBs) or other substrates to realize circuit assembly and connection. With the continuous upgrading of electronic products and the rapid development of semiconductor technology, placement machines are facing new challenges and opportunities. On the one hand, the market has put forward higher requirements on the accuracy, efficiency and stability of placement machines; on the other hand, the continuous emergence of new materials and new processes has also provided possibilities for technological innovation of placement machines. In the future, placement machines will develop in the direction of higher accuracy, higher efficiency and higher stability, and may integrate advanced technologies such as artificial intelligence and the Internet of Things to achieve a more intelligent and automated production process.

[0003] At the same time, most of the semiconductor device placement devices are highly integrated all-in-one equipment, which assembles and connects electronic components such as PCB boards during continuous transmission. The patent name is a semiconductor placement machine conveying device, and the patent publication number is: CN116782624B. It proposes that when the semiconductor board is subjected to external forces, it will deviate to a certain extent, resulting in poor conveying effect of the semiconductor board, affecting the subsequent processing steps of the semiconductor board. The PCB board will shake during the welding process of the components, and it is provided with a first telescopic rod, the first telescopic rod and the second telescopic rod are opened, and the movable ends of the two are retracted, so that the connected load-bearing long block performs the same movement, and the device above the load-bearing long block also performs the same movement. Because the slider provided at the bottom of the load-bearing long block can slide in the slide groove, the two The two carrying long blocks gradually approach each other. During this process, the thick rope connected to the first telescopic rod will gradually move, and the thick rope drives the vertical block to move. The limiting groove at the bottom of the vertical block limits the vertical block. In this process, the gradual approach of the two belts can clamp the PCB board more powerfully, making it more stable during transportation, and increasing the stability of the semiconductor device patch assembly and transportation process. However, the overall telescopic rod drives the conveyor belts on both sides to approach each other to clamp and limit the PCB board. However, during the transmission of the belts on both sides, the belts need to be always in a taut state. The belts only have internal transmission rollers at both ends, and there is not enough support at other positions. This makes it impossible to effectively clamp and limit the PCB board when the belts are not fully taut. Therefore, a semiconductor device patch device is proposed. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor device mounting device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor device patch device, comprising a supporting base plate, an outer shielding cover is fixedly connected to the supporting base plate, an upper cover plate is hinged on the outer shielding cover, a patch machine is fixedly connected to the upper cover plate, the patch outlet end of the patch machine passes through the outer wall of the upper cover plate, an air pump is installed at the bottom of the upper cover plate, the air outlet of the air pump is connected to a telescopic folding tube, two groups of vertical support rollers are rotatably connected to the supporting base plate, a hollow conveyor belt is sleeved on the outside of each group of vertical support rollers, a bidirectional rotary joint is rotatably connected to the hollow conveyor belt, a rotating air inlet end of the bidirectional rotary joint away from the hollow conveyor belt is connected to an end of the telescopic folding tube away from the air pump, a rotating drive structure is installed on the supporting base plate, the rotating drive structure is connected to the two groups of vertical support rollers, and both sides of the outer shielding cover are provided with inlet and outlet inclined openings.

[0006] Preferably, the cross section of the hollow conveyor belt is a right-angled trapezoid, and the outer portion of the right-angled trapezoidal hollow conveyor belt is integrally formed with an inclined portion and an upright extruded portion, and the expansion coefficient of the inclined portion is lower than that of the upright extruded portion.

[0007] Preferably, the upright extrusion portion on the outside of the hollow conveyor belt is an arc-shaped edge that is gradually inclined inward, and the bottom of the arc-shaped edge is an upright edge. The arc-shaped edge and the upright plate are used to guide the PCB board by utilizing the curvature of the arc-shaped edge during the process of clamping the PCB board, so as to avoid the situation where one side of the PCB board is warped during the process of clamping the PCB board by the hollow conveyor belt. The upright edge is located below the arc-shaped edge, and the arc-shaped edge guides the PCB to the position of the upright edge, ensuring that the upright edge stably clamps the PCB board.

[0008] Preferably, a supporting inner bag is integrally formed inside the hollow conveyor belt, a diverter valve is connected to the outside of the supporting inner bag, an end of the diverter valve away from the supporting inner bag is connected to a diverter pipe, an end of the diverter pipe away from the diverter valve is connected to an air outlet of a two-way rotary joint, and the expansion direction of the supporting inner bag is to gradually squeeze the arc edge position.

[0009] Preferably, a storage cavity is integrally formed between the arc-shaped edges of the supporting inner capsule and the upright extrusion portion, and the interior of the storage cavity is filled with magnetic fluid. The storage cavity will gradually deform as the supporting inner capsule and the upright extrusion portion extend, and the magnetic fluid inside the storage cavity will gradually fill the deformed interior of the storage cavity as the storage cavity deforms.

[0010] Preferably, two supporting slide plates are fixedly connected to the supporting bottom plate, and two ends of the supporting slide plates are respectively connected to two inlet and outlet inclined openings.

[0011] Preferably, the exterior of the hollow conveyor belt is integrally formed with a plurality of multi-section support plates.

[0012] Preferably, the rotary drive structure comprises a drive motor, the output shaft of the drive motor is fixedly connected to a driving pulley, the outside of the vertical support roller is fixedly connected to a driven pulley, and the driving pulley and the driven pulley are connected via a belt drive.

[0013] Preferably, an observation port is provided on the outside of the outer shielding cover, and a transparent observation window is clamped inside the observation port.

[0014] Preferably, the exterior of the upright extrusion portion is configured as a rough surface.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] In the present invention, during the transmission of the PCB board, gas is injected into the interior of the hollow conveyor belt to cause the hollow conveyor belt to expand. When the hollow conveyor belt expands, the PCB board can be clamped and limited. Because the hollow conveyor belt has gas as support, it can always abut the PCB board during the transmission process to avoid loosening and falling. At the same time, the gas-supported hollow conveyor belt can not only clamp and limit PCB boards of different sizes when clamping and limiting the hollow conveyor belt board, but also avoid excessive squeezing of the PCB board, thereby reducing damage to the PCB board during the transmission process.

[0017] In the present invention, the arcuate edges of the upright extrusion parts can enable the hollow conveyor belts on both sides to guide the warped PCB board through the arcuate edges when the PCB board is extruded and limited, thereby guiding the warped PCB to a flat state. When the warped PCB board is guided to a flat state, the arcuate edges can be actively driven by the supporting inner capsule to extrude the PCB board, thereby further accelerating the adjustment of the warped PCB board. At the same time, when the PCB board is adjusted, the supporting inner capsule can continuously enter the gas, thereby actively driving the arcuate edges to extrude and limit the PCB board, thereby ensuring the limited flat state of the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0019] Figure 2 This is a schematic structural diagram of a hollow conveyor belt in a normal state in an embodiment of the present invention;

[0020] Figure 3 It is a schematic diagram of the structure of the vacuum conveyor belt in an expanded state according to an embodiment of the present invention;

[0021] Figure 4It is a schematic diagram of the structure of the air pump and the telescopic folding tube in an embodiment of the present invention;

[0022] Figure 5 It is a schematic diagram of the structure of the driving motor and the driving pulley in the embodiment of the present invention;

[0023] Figure 6 It is a schematic diagram of the structure of a multi-segment support plate in an embodiment of the present invention;

[0024] Figure 7 It is a schematic structural diagram of an expanded state of a circular right-angled rectangular hollow conveyor belt in an embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram of the structure of the supporting inner capsule in an embodiment of the present invention;

[0026] Fig. 9 A schematic diagram of the structure of a magnetic fluid in an embodiment of the present invention;

[0027] Fig.10 For the embodiment of the present invention Figure 7 Schematic diagram of the enlarged structure of area A in .

[0028] In the figure: 100, supporting base plate; 101, outer shielding cover; 102, upper cover plate; 103, patch machine; 104, inlet and outlet inclined opening; 105, vertical supporting roller; 106, hollow conveyor belt; 107, two-way rotating joint; 108, telescopic folding tube; 109, air pump; 200, driving motor; 201, driving pulley; 202, driven pulley; 300, inclined part; 301, upright extrusion part; 400, supporting inner capsule; 401, diverter pipe; 402, diverter valve; 500, supporting slide plate; 501, multi-section supporting plate; 600, transparent observation window; 700, magnetic fluid. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Embodiment 1: Figure 1As shown, the present application discloses a semiconductor device chip mounting device, including a supporting base plate 100, an outer shielding cover 101 is fixedly connected to the supporting base plate 100, an upper cover plate 102 is hingedly connected to the outer shielding cover 101, a chip mounting machine 103 is fixedly connected to the upper cover plate 102, a chip mounting outlet of the chip mounting machine 103 passes through the outer wall of the upper cover plate 102, an air pump 109 is installed at the bottom of the upper cover plate 102, an air outlet of the air pump 109 is connected to a telescopic folding tube 108, and two sets of vertical mounting devices are rotatably connected to the supporting base plate 100. Support rollers 105, each set of vertical support rollers 105 is sleeved on the outside with a hollow conveyor belt 106, the hollow conveyor belt 106 is rotatably connected with a two-way rotary joint 107, the rotating air inlet end of the two-way rotary joint 107 away from the hollow conveyor belt 106 is connected with the end of the telescopic folding tube 108 away from the air pump 109, a rotary drive structure is installed on the support base plate 100, the rotary drive structure is connected to the two sets of vertical support rollers 105, and both sides of the outer shielding cover 101 are provided with inlet and outlet inclined openings 104.

[0031] Specifically, during use, a controller is installed on the outside of the outer shielding cover 101, and the controller is electrically connected to the placement machine 103, the rotation drive structure and the air pump 109. The two inlet and outlet inclined openings 104 opened on both sides of the outer side of the outer shielding cover 101 are used as a feed port on one side and a discharge port on the other side. The PCB board to be assembled with patches is put into the inner part of the outer shielding cover 101 from the inlet and outlet inclined opening 104 imported from one side, and the air pump 109 is turned on by the controller. When the air pump 109 is turned on, gas can be continuously injected into the interior of the telescopic folding tube 108. During the continuous injection of gas, the inside of the telescopic folding tube 108 will release gas. The gas is injected into the interior of the hollow conveyor belt 106 through the rotating two-way rotary joint 107. When the gas is continuously injected into the interior of the hollow conveyor belt 106, the hollow conveyor belt 106 will expand. When the hollow conveyor belts 106 on both sides expand, the PCB board located in the middle position can be gradually squeezed against each other through the outer walls of the expanded hollow conveyor belts 106. The PCB board is clamped by the two expanded hollow conveyor belts 106. After the PCB board is clamped, the vertical support roller 105 is driven to rotate through the rotating drive structure, thereby driving the hollow conveyor belt 106 in the expansion process to be transmitted, thereby realizing the clamping and transmission of the PCB board.

[0032] Furthermore, when the hollow conveyor belt 106 expands to clamp the PCB board, because the hollow conveyor belt 106 is filled with gas, no excessive hard collision will occur when the two hollow conveyor belts 106 clamp the PCB board, thereby reducing the phenomenon of damage to the PCB board due to hard collision. At the same time, during use, the expansion of the hollow conveyor belt 106 can adapt to the clamping and limited transmission of PCB boards of different sizes.

[0033] Furthermore, in the process of the hollow conveyor belt 106 being transmitted through the vertical support roller 105, the rotation setting of the two-way rotary joint 107 can prevent the telescopic folding tube 108 from being knotted. When the telescopic folding tube 108 and the two-way rotary joint 107 are driven to other positions by the hollow conveyor belt 106 during the transmission process, the rotation of the two-way rotary joint 107 itself can ensure that the telescopic folding tube 108 will not be excessively twisted. At the same time, the telescopic folding tube 108 can be telescopically folded as a whole and has a certain elasticity. During the continuous transmission of the hollow conveyor belt 106, its own length can be stretched to meet the pipe length requirements when the hollow conveyor belt 106 drives the two-way rotary joint 107 to move to different positions.

[0034] like Figure 2-Figure 5 As shown, the rotary drive structure includes a drive motor 200, the output shaft of the drive motor 200 is fixedly connected to a driving pulley 201, the outside of the vertical support roller 105 is fixedly connected to a driven pulley 202, and the driving pulley 201 and the driven pulley 202 are connected by belt transmission.

[0035] Specifically, in the rotary drive structure, the driving motor 200 is started to drive the driving pulley 201 to rotate, and the rotation of the driving pulley 201 drives the driven pulley 202 to rotate. The driven pulley 202 drives the vertical support roller 105 to rotate during the rotation. When the vertical support roller 105 rotates as a whole, the external hollow conveyor belt 106 can be driven for transmission, and when the hollow conveyor belt 106 rotates, the PCB board clamped between the two hollow conveyor belts 106 can be transmitted.

[0036] Furthermore, after the PCB board is transferred to a designated position via the expanded hollow conveyor belt 106 , other components can be assembled onto the PCB board by starting the placement machine 103 .

[0037] like Figure 2-Figure 6 As shown, two supporting slide plates 500 are fixedly connected to the supporting base plate 100 , and two ends of the supporting slide plates 500 are respectively connected to the two inlet and outlet inclined openings 104 .

[0038] Specifically, during the transmission process, the bottom of the PCB board can be supported by two supporting slide plates 500 to ensure that the PCB board does not fall.

[0039] like Figure 6 As shown, the exterior of the hollow conveyor belt 106 is integrally formed with a plurality of multi-segment support plates 501 .

[0040] Specifically, during the transmission process, the bottom of the PCB board can also be supported by multiple multi-section support plates 501. The multiple multi-section support plates 501 can move along with the hollow conveyor belt 106 during the transmission process of the hollow conveyor belt 106, thereby continuously supporting the bottom of the PCB board.

[0041] like Figure 1 As shown, an observation port is provided on the outside of the outer shielding cover 101, and a transparent observation window 600 is snapped into the inside of the observation port. Through the arrangement of the observation port and the transparent observation window 600, the staff can observe the inside of the outer shielding cover 101 without opening the upper cover 102 from the outside.

[0042] The technical solution in the above-mentioned embodiment of the present application has at least the following technical effects or advantages: relative to the prior art, in the present embodiment, during the transmission of the PCB board, gas is injected into the interior of the hollow conveyor belt 106 to cause the hollow conveyor belt 106 to expand, and the PCB board can be clamped and limited when the hollow conveyor belt 106 expands. Moreover, because the hollow conveyor belt 106 has gas inside as support, it can always abut against the PCB board during the transmission process to avoid loosening and falling. At the same time, the gas-supported hollow conveyor belt 106 can not only clamp and limit PCB boards of different sizes when clamping and limiting the hollow conveyor belt 106 board, but also avoid excessive squeezing of the PCB board, thereby reducing damage to the PCB board during transmission.

[0043] Embodiment 2: Considering that the outer wall of the hollow conveyor belt 106 will bulge out excessively when the gas enters the inner part, when the excessive bulge occurs, the bulging part of the hollow conveyor belt 106 will cause the PCB board to be blocked during the transmission process. When the blocking phenomenon occurs, the placement machine 103 will be unable to assemble the parts onto the PCB board, affecting the patch assembly process of the PCB board. In view of the above technical problems, the present application proposes the following technical solutions to solve the above technical problems, specifically:

[0044] like Figure 7 and Fig.10 As shown, the cross section of the hollow conveyor belt 106 is a right-angled trapezoid, and the outer portion of the right-angled trapezoidal hollow conveyor belt 106 is integrally formed with an inclined portion 300 and an upright extruded portion 301 , and the expansion coefficient of the inclined portion 300 is lower than that of the upright extruded portion 301 .

[0045] Specifically, during use, after the hollow conveyor belt 106 is set as a whole in a ring shape and the cross-section is a right-angled trapezoid, when gas continues to enter the hollow conveyor belt 106, the hollow conveyor belt 106 will continue to expand, and during the expansion process, the expansion coefficients of the inclined portion 300 and the upright extrusion portion 301 are different. The upright extrusion portion 301 will expand first, thereby clamping the bottom of both sides of the PCB board, and the inclined portion 300 will not be over-expanded due to the continuous entry of gas. When there is no over-expansion and the inclined portion 300 is an inclined surface, the overall convexity will not block the PCB board, thereby avoiding the phenomenon of affecting the fitting and assembly of the PCB board after blocking the PCB board.

[0046] Furthermore, the exterior of the upright extrusion portion 301 is set as a rough surface. By setting the side wall surface of the upright extrusion portion 301 as a rough surface, the connection stability of the PCB board can be ensured when the upright extrusion portion 301 is attached to the PCB board and the PCB board is extruded and limited.

[0047] The technical solution in the above-mentioned embodiment of the present application has at least the following technical effects or advantages: relative to the first embodiment, in the present embodiment, after the hollow conveyor belt 106 is set as a ring-shaped right-angled trapezoid as a whole, the upright extrusion portion 301 at the bottom of the hollow conveyor belt 106 can be used to clamp and limit the PCB board during the expansion of the hollow conveyor belt 106, and the inclined surface of the inclined portion 300 is set to reduce the phenomenon of excessive gas entering above the hollow conveyor belt 106 and causing excessive expansion to block the PCB.

[0048] Embodiment 3: Considering that the expansion of the hollow conveyor belt 106 when expanding and squeezing the PCB board is not exactly the same because the expansion speeds of the hollow conveyor belts 106 on both sides are not exactly the same, and the hollow conveyor belts 106 on both sides are soft, the expansion of the hollow conveyor belts 106 on both sides will cause the hollow conveyor belt 106 on the side with a faster expansion speed to squeeze the PCB board to move to the side with a slower expansion speed. During the expansion and squeezing movement, one side of the PCB board may warp. Once the PCB board warps on one side, the PCB board cannot be completely flat. When the PCB board cannot be flat, the PCB board cannot be flat for patching. In view of the above technical problems, the present application proposes the following technical solutions to solve the above technical problems, specifically:

[0049] like Figure 8As shown, the upright extrusion portion 301 outside the hollow conveyor belt 106 is an arc-shaped edge that is gradually inclined inward, and the bottom of the arc-shaped edge is an upright edge. The arc-shaped edge and the upright plate are used to guide the PCB board by utilizing the curvature of the arc-shaped edge during the process of clamping the PCB board, so as to avoid the situation where one side of the PCB board is warped during the process of clamping the PCB board by the hollow conveyor belt 106. The upright edge is located below the arc-shaped edge, and the arc-shaped edge guides the PCB to the position of the upright edge, ensuring that the upright edge stably clamps the PCB board.

[0050] Specifically, during use, the upright extrusion portion 301 is configured as an inwardly inclined arc edge, and the lower portion of the arc edge of the upright extrusion portion 301 is an upright edge. When the two hollow conveyor belts 106 are continuously expanding, the arc edge or the upright edge of the upright extrusion portion 301 will first contact the PCB board. Due to the existence of the arc edge, even if one side of the hollow conveyor belt 106 pushes the PCB board to move to the other side and warping occurs on the other side, when both sides of the PCB board contact the arc edge of the upright extrusion portion 301, the arc edge of the upright extrusion portion 301 will guide the PCB board and guide the position of the warped edge of the PCB board to the position of the upright edge, thereby making the entire PCB board in a flat state.

[0051] like Figure 8 As shown, the interior of the hollow conveyor belt 106 is integrally formed with a supporting inner bag 400, the outside of the supporting inner bag 400 is connected with a diverter valve 402, the end of the diverter valve 402 away from the supporting inner bag 400 is connected with a diverter pipe 401, the end of the diverter pipe 401 away from the diverter valve 402 is connected to the air outlet of the two-way rotary joint 107, and the expansion direction of the supporting inner bag 400 is to gradually squeeze the arc edge position.

[0052] Furthermore, in order to further ensure the flatness of the PCB board, the diverter valve 402 can also be opened to divert the airflow delivered by the two-way rotary joint 107 to the inside of the diverter tube 401, so that the gas is delivered to the inside of the supporting inner capsule 400 through the diverter tube 401 and the diverter valve 402. When the gas continues to enter the inside of the supporting inner capsule 400, the supporting inner capsule 400 will expand. When the supporting inner capsule 400 expands, it will gradually squeeze the arcuate edge of the upright extrusion part 301. When the supporting inner capsule 400 squeezes the arcuate edge of the upright extrusion part 301, it will drive the arcuate edge to move downward, thereby driving the arcuate edge of the upright extrusion part 301 to actively squeeze the PCB board. By actively squeezing the PCB board, the PCB board is actively adjusted to avoid the warping of the PCB board. When the supporting inner capsule 400 drives the arcuate edge to squeeze the PCB board, the PCB board can be further limited and squeezed to ensure the stability of the PCB during the assembly process.

[0053] The technical scheme in the above-mentioned embodiment of the present application has at least the following technical effects or advantages: relative to the second embodiment, in the present embodiment, the arc-shaped edges of the upright extrusion portion 301 can enable the hollow conveyor belts 106 on both sides to guide the warped PCB board through the arc-shaped edges when the PCB board is extruded and limited, thereby guiding the warped PCB to a flat state. When the warped PCB board is guided to a flat state, the arc-shaped edges can be actively driven by the supporting inner capsule 400 to extrude the PCB board, thereby further accelerating the adjustment of the warped PCB board. At the same time, when the PCB board is adjusted, when the gas continues to enter the inner capsule 400, the arc-shaped edges can also be actively driven to extrude and limit the PCB board, thereby ensuring the limited flat state of the PCB.

[0054] Embodiment 4: Considering that the supporting inner capsule 400 is entirely inside the hollow conveyor belt 106, and the downward pressure exerted by the supporting inner capsule 400 after being filled with gas comes entirely from its own expansion, the squeezing force of the supporting inner capsule 400 as a whole to drive the arc edge downward to squeeze the PCB board is relatively weak. When the PCB board is too seriously warped and the hollow conveyor belts 106 on both sides are too close to the PCB board, the independently inflated supporting inner capsule 400 cannot provide sufficient downward pressure to press the PCB board with seriously warped edges back to a flat bottom state. In view of the above technical problems, the present application proposes the following technical solutions to solve the above technical problems, specifically:

[0055] like Fig. 9 As shown, a storage cavity is integrally formed between the arc-shaped edges of the supporting inner capsule 400 and the upright extrusion portion 301, and the interior of the storage cavity is filled with magnetic fluid 700. The storage cavity will gradually deform as the supporting inner capsule 400 and the upright extrusion portion 301 extend, and the magnetic fluid 700 inside the storage cavity will gradually fill the deformed interior of the storage cavity as the storage cavity deforms.

[0056] Specifically, during use, when the gas gradually enters the inner support capsule 400 and the hollow conveyor belt 106, the inner support capsule 400 and the hollow conveyor belt 106 will gradually expand, and the storage cavity will also be gradually stretched when the inner support capsule 400 and the hollow conveyor belt 106 gradually expand. When the storage cavity is gradually stretched, the internal space of the storage cavity will gradually shrink, but the area will gradually increase. In this case, the magnetic fluid 700 located inside the storage cavity will gradually cover the deformed storage cavity as the storage space is deformed, and the support base plate 100 and The material of the magnetic fluid 700 is ferrous material, and the magnetic fluid 700 spread flat inside the storage cavity will adsorb the supporting base plate 100 and the magnetic fluid 700. In the process of the magnetic fluid 700 adsorbing the supporting base plate 100 and the magnetic fluid 700, the arc edge can be driven to actively move in the direction of the supporting base plate 100 and the magnetic fluid 700, thereby actively squeezing the PCB board, increasing the squeezing limit force on the PCB board, so that the arc edge can actively press the PCB board with severe warping downward to make it flat, thereby avoiding the PCB board with severe warping and unable to form a flat conveying state.

[0057] The technical scheme in the above-mentioned embodiment of the present application has at least the following technical effects or advantages: relative to the third embodiment, in the present embodiment, through the setting of the magnetic fluid 700, the position deformation can be generated together with the supporting inner capsule 400 during the expansion and extension of the hollow conveyor belt 106 and the supporting inner capsule 400, thereby expanding the overall adsorption area, and in the case of expanding the adsorption area, the arc edge of the upright extrusion portion 301 is driven to actively adsorb between the supporting bottom plate 100, thereby actively driving the arc edge to be pressed downward, and in the case of actively driving the arc edge to be pressed downward, it is ensured that the PCB is always in a flat state, avoiding the PCB board from being in a warped state, and at the same time, the PCB board can be limited by the arc edge.

[0058] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor device chip mounting device, comprising a supporting base plate (100), an outer shielding cover (101) fixedly connected to the supporting base plate (100), an upper cover plate (102) hingedly connected to the outer shielding cover (101), a chip mounting machine (103) fixedly connected to the upper cover plate (102), a chip mounting outlet end of the chip mounting machine (103) penetrating the outer wall of the upper cover plate (102), characterized in that: An air pump (109) is installed at the bottom of the upper cover plate (102); an air outlet of the air pump (109) is connected to a telescopic folding tube (108); two groups of vertical support rollers (105) are rotatably connected to the support base plate (100); a hollow conveyor belt (106) is sleeved on the outside of each group of vertical support rollers (105); a bidirectional rotary joint (107) is rotatably connected to the hollow conveyor belt (106); a rotating air inlet end of the bidirectional rotary joint (107) away from the hollow conveyor belt (106) is connected to an end of the telescopic folding tube (108) away from the air pump (109); a rotary drive structure is installed on the support base plate (100); the rotary drive structure is connected to the two groups of vertical support rollers (105); and both sides of the outer shielding cover (101) are provided with inlet and outlet inclined openings (104); The cross section of the hollow conveyor belt (106) is in the form of a right-angled trapezoid, and the outer portion of the right-angled trapezoidal hollow conveyor belt (106) is integrally formed with an inclined portion (300) and an upright extruded portion (301), and the expansion coefficient of the inclined portion (300) is lower than that of the upright extruded portion (301); The upright extrusion portion (301) outside the hollow conveyor belt (106) is in the form of an arc-shaped edge that is gradually inclined inwards, and the bottom of the arc-shaped edge is an upright edge. The arc-shaped edge and the upright edge are used to guide the PCB board by utilizing the curvature of the arc-shaped edge during the process of clamping the PCB board, thereby preventing the hollow conveyor belt (106) from warping one side of the PCB board during the process of clamping the PCB board. The upright edge is located below the arc-shaped edge, and the arc-shaped edge guides the PCB to the position of the upright edge, thereby ensuring that the upright edge stably clamps the PCB board. The hollow conveyor belt (106) is integrally formed with a supporting inner capsule (400), the supporting inner capsule (400) is connected to a diverter valve (402) on the outside, the diverter valve (402) is connected to a diverter pipe (401) at one end away from the supporting inner capsule (400), the diverter pipe (401) is connected to an air outlet of a bidirectional rotary joint (107) at one end away from the diverter valve (402), and the expansion direction of the supporting inner capsule (400) is to gradually squeeze the arc-shaped edge position; A storage cavity is integrally formed between the arc-shaped edges of the supporting inner capsule (400) and the upright extrusion portion (301), and the interior of the storage cavity is filled with a magnetic fluid (700). The storage cavity gradually deforms as the supporting inner capsule (400) and the upright extrusion portion (301) extend, and the magnetic fluid (700) located inside the storage cavity gradually fills the interior of the deformed storage cavity as the storage cavity deforms.

2. A semiconductor device mounting device according to claim 1, characterized in that: Two supporting slide plates (500) are fixedly connected to the supporting bottom plate (100), and two ends of the supporting slide plates (500) are respectively connected to two inlet and outlet inclined openings (104).

3. A semiconductor device mounting device according to claim 1, characterized in that: The exterior of the hollow conveyor belt (106) is integrally formed with a plurality of multi-segment support plates (501).

4. A semiconductor device mounting device according to claim 1, characterized in that: The rotary drive structure comprises a drive motor (200), the output shaft of the drive motor (200) is fixedly connected to a driving pulley (201), the exterior of the vertical support roller (105) is fixedly connected to a driven pulley (202), and the driving pulley (201) and the driven pulley (202) are connected via a belt drive.

5. A semiconductor device mounting device according to claim 1, characterized in that: An observation port is provided on the outside of the outer shielding cover (101), and a transparent observation window (600) is snap-connected to the inside of the observation port.

6. A semiconductor device mounting device according to claim 1, characterized in that: The exterior of the upright extrusion portion (301) is configured as a rough surface.

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