Circuit board device having circuit board pivotable from mounted position to intermediate position

Abstract

The invention relates to a printed circuit board arrangement (10) having at least one housing (12), in which a plurality of printed circuit boards (14) are arranged, and at least one cooling device (16), through which a cooling fluid can pass, and which is designed to dissipate heat from the at least one printed circuit board (14). The circuit board (14) is thermally coupled to the cooling device (16) via a heat transfer element. The respective circuit board (14) can be pivoted about a pivot axis (44) from a mounted position, in which the heat transfer element rests against the cooling device (16) and the circuit board (14), to an intermediate position. In the intermediate position, an edge region (50) of the circuit board (14), which is remote from the pivot axis (44), is spaced further from the cooling device (16) than in the mounted position. The housing (12) comprises at least one guide element (38), along which the respective circuit board (14) can be moved into an intermediate position when the circuit board (14) is introduced into the housing (12).

Description

Technical Field

[0001] The invention relates to a circuit board device, the circuit board device having at least one housing and at least one cooling device, in which a plurality of circuit boards are arranged, through which a cooling fluid can pass, and which is formed for dissipating heat from at least one circuit board. At least one circuit board is thermally coupled to the at least one cooling device via at least one heat transfer element. Background Art

[0002] In particular, if there are a plurality of powerful electronic control devices or electronic control units in a vehicle, these control devices can be arranged one above the other in a housing or a support. During operation, the circuit boards of the control devices or electronic control units release heat, which should be dissipated. To dissipate the heat, the circuit boards can be thermally coupled to at least one cooling device, which is supplied with a cooling fluid during cooling operation via corresponding heat transfer elements.

[0003] For example, US 10 085 364 B2 describes a device having a housing and circuit boards, which are arranged one above the other in the housing. The circuit boards are coupled to a heat sink element via a corresponding thermal interface material. An air gap is formed between the two heat sink elements connected to each other to allow air or another fluid to pass through the gap.

[0004] In such devices, it is considered disadvantageous that, for example, replacing a single circuit board therein within the scope of repair or renewal etc. is relatively difficult and expensive.

[0005] For example, electronic control devices which are cooled using a coolant are further described in DE 10 2020 105 683 A1 and US 2021 / 0222608 A1. Summary of the invention

[0006] The object of the present invention is to provide a circuit board device of the initially mentioned type in which the replacement of individual circuit boards can be realized particularly easily.

[0007] This object is achieved by a circuit board arrangement having the features of claim 1. Advantageous configurations of expedient developments of the invention are indicated in the dependent claims and in the following description.

[0008] The circuit board device according to the invention comprises at least one housing, in which a plurality of circuit boards are arranged, and at least one cooling device through which a cooling fluid can pass. The at least one cooling device is formed for dissipating heat from the at least one circuit board. The at least one circuit board is thermally coupled to the at least one cooling device via at least one heat transfer element. The respective circuit board can be pivoted about a pivot axis from a mounting position to an intermediate position; in the mounting position, the heat transfer element rests against the at least one cooling device and the circuit board; in the intermediate position, an edge region of the circuit board remote from the pivot axis is spaced further apart from the at least one cooling device than in the mounting position. The housing comprises at least one guide element, wherein the respective circuit board can be moved along the at least one guide element to the intermediate position when the circuit board is introduced into the housing.

[0009] In such a circuit board device, the replacement of individual circuit boards can be realized particularly simply. Because for replacement, the circuit board can be pivoted about the pivot axis from the mounting position to the intermediate position. When the circuit board is in this intermediate position, the heat transfer element is no longer in contact with the cooling device and the circuit board. Instead, when the circuit board is pivoted to the intermediate position, the heat transfer element at least largely remains adjacent to the circuit board. Accordingly, in the intermediate position, the heat transfer element is also spaced apart from the cooling device. As a result, the heat transfer element does not hinder or hinder the removal of the circuit board from the housing starting from the intermediate position of the circuit board.

[0010] Furthermore, a replacement circuit board intended to replace a circuit board originally arranged in the housing can be moved along at least one guide element into the intermediate position without the heat transfer element arranged on the replacement circuit board coming into contact with the cooling device there. Thus, moving the replacement or updated circuit board into the intermediate position also proves to be particularly simple.

[0011] In particular, no undesired shear stresses occur in the heat transfer element when the circuit board is introduced into the housing. This is due to the fact that the heat transfer element applied to the replaced circuit board comes into contact with the cooling device only when the circuit board is pivoted about the pivot axis from the intermediate position into the installation position.

[0012] When replacing or substituting a circuit board, in particular when the replaced circuit board is already in the intermediate position, the heat transfer element can be applied to the replaced circuit board. However, even if the heat transfer element is already on the circuit board, the heat transfer element does not or hardly interferes with or hinders this installation step when the circuit board is introduced into the housing and moved along at least one guide element into the intermediate position.

[0013] However, since the heat transfer element bears against the at least one cooling device and the circuit board in the mounted position, the heat transfer element ensures a very effective heat dissipation from the circuit board to the cooling device, which heat dissipation is transferred by the cooling fluid, which is preferably formed as a coolant in operation or cooling operation. Thus, even if a plurality of circuit boards are arranged in the housing, a very effective heat dissipation from the circuit boards can be achieved.

[0014] In particular, within the scope of updating and / or repair, a very rapid replacement of individual circuit boards can be achieved. However, the circuit boards of the circuit board arrangement are advantageously accommodated in their respective installation locations in the housing, thereby achieving a very compact arrangement of the circuit boards in the housing. This is particularly advantageous if the circuit board arrangement is used, for example, in a vehicle, wherein the circuit boards are components of one or more electronic control devices or electronic control units of the vehicle.

[0015] Thus, the case can be considered in particular in which a plurality of electronic control devices or electronic control units are usually arranged in a vehicle, for example an autonomous vehicle and / or an electrically driven, in particular a purely electrically driven, vehicle. In this case, the control device can in particular take over the tasks of at least one driver assistance function of the vehicle. Therefore, the arrangement of a circuit board, which is preferably formed as a component of such a control device for a vehicle, in the housing of a circuit board device is advantageous.

[0016] This is particularly applicable if the corresponding electronic control devices or electronic control units have high performance capabilities and therefore the circuit boards of these control devices release relatively much heat during operation. Since the circuit boards can be arranged in a stack in the housing, they are easily accessible. This is advantageous for simple replacement of individual circuit boards. Nevertheless, at least one cooling device ensures effective heat dissipation of the circuit boards when they are brought into the installed position.

[0017] Preferably, during the removal of the circuit board from the housing, the respective circuit board can be moved out of the housing starting from a central position along at least one guide element. As a result, the removal or extraction of the circuit board from the housing proves to be particularly simple within the context of replacing the circuit board to be replaced. This is because at least one guide element arranged laterally on the housing can be used for such extraction. Furthermore, clearly defined movements of the circuit board when introducing it into the housing and when removing it from the housing are thereby ensured.

[0018] The heat transfer element can be formed as a heat conducting paste. This is particularly advantageous for simple application of the heat transfer element to the circuit board when installing a circuit board arrangement and / or within the scope of replacing or replacing at least one circuit board with a new one. In addition, the heat conducting paste ensures very good thermal coupling of the circuit board to the associated cooling device.

[0019] Preferably, the thermally conductive paste is spaced apart from the at least one cooling device in a middle position of the circuit board, wherein the thermally conductive paste rests against the circuit board. In this way, it is ensured that the thermally conductive paste is not exposed to undesired shear forces, in particular when the circuit board is introduced into the housing, and that the thermally conductive paste is not smeared at least until the middle position of the circuit board is reached. On the one hand, this facilitates the correct positioning of the thermally conductive paste on the circuit board. On the other hand, during the movement of the circuit board along the at least one guide element, undesired smearing or spreading of the thermally conductive paste does not hinder or impede the introduction of the circuit board into the housing.

[0020] Preferably, the respective circuit board is arranged on a support plate which can be moved along at least one guide element. On the one hand, such a support plate formed in the manner of a drawer ensures that the circuit board is particularly easy to handle when introducing the circuit board into the housing and removing the circuit board from the housing. In addition, the provision of the support plate increases the stability of the assembly comprising the support plate and the circuit board arranged on the support plate.

[0021] In particular, the support plate can be formed as a sheet metal component, on which the circuit board is held, for example by screwing and / or clamping and / or the like to fix the circuit board to the support plate. With the support plate formed as a sheet metal component, the support plate is very strong and at the same time advantageously lightweight. Moreover, by fixing the circuit board to the support plate, the circuit board is prevented from sliding on the support plate.

[0022] Preferably, the support plate comprises at least one locking element, which engages with a counterpart provided on the housing side in the mounted position of the circuit board. By engaging the locking element with the counterpart, a clearly defined and process-reliable mounting position can be easily achieved.

[0023] Furthermore, by arranging the locking element on the support plate, the locking element can be formed particularly strong. This is advantageous for the high durability of the locking mechanism, which is provided by the engagement of the locking element with the counterpart.

[0024] For example, the locking element can be formed as a locking lug, which engages with a groove formed in the housing. Yet, in a similar manner, the locking element can also be formed as a recess, which engages with a mating piece formed as a projection in the mounting position of the circuit board.

[0025] Preferably, the support plate comprises at least one stud element, by which the pivot axis is formed. In this way, the pivot axis can be provided locally precisely, simply and functionally reliably.

[0026] Preferably, in the mounting position and in the intermediate position of the circuit board, at least one stud element is received in a locking recess provided on the side of the housing. Thus, when inserting the support plate into the housing, a person involved in introducing the circuit board into the housing can very easily, preferably by touch and / or hearing, determine that the intermediate position of the circuit board has been reached. Furthermore, by providing the locking recess, the circuit board is particularly well secured against sliding along the at least one guide element in the intermediate position.

[0027] Preferably, the locking recess is formed in the end region of at least one guide element.Thereby, a very compact structure of the circuit board device is produced.

[0028] Preferably, the circuit board arrangement comprises a holding device, which is formed for holding the at least one cooling device when the circuit board is pivoted into the intermediate position. By providing the holding device, it can be ensured that the cooling device remains stationary, even if the circuit board is pivoted into the intermediate position, in particular subsequently removed from the housing. Furthermore, the at least one cooling device can thus be mounted or arranged in the housing independently of the at least one circuit board, and the at least one circuit board can be cooled by the cooling device with the intervention of the heat transfer element. This is advantageous for a high flexibility when installing the circuit board arrangement.

[0029] In particular, the housing can include a retaining device, which is formed for retaining at least one cooling device when the circuit board is pivoted into the intermediate position. Such a retaining device, for example a retaining rod or a similar web, can be formed on the housing, on which the cooling device rests. Additionally or alternatively, the circuit board device can be fixed to the housing by a threaded connection and / or by locking or the like. Therefore, the retaining device can be provided additionally or alternatively by corresponding locking elements and / or screws and / or similar fixing devices, which ensure that the cooling device is fixed to the housing when the circuit board is pivoted into the intermediate position or is in the intermediate position.

[0030] Preferably, at least one guiding element is provided by a corresponding guide rail, which is formed on mutually opposite side walls of the housing. Thus, a particularly reliable guidance of the circuit board and the support plate holding the circuit board, respectively, can be achieved when moving along the guide rail. Furthermore, the provision of the guide rail facilitates the handling of the circuit board and the support plate, respectively, during the movement.

[0031] Preferably, the guide rails are oriented obliquely relative to the bottom wall of the housing. Because of this, a movement of the circuit board along these inclined guide rails into or out of the intermediate position can be achieved particularly simply by arranging at least one cooling device at least substantially parallel to the bottom wall of the housing.

[0032] Preferably, the circuit boards arranged one above the other in the vertical direction of the housing in the installation position are connected to a further circuit board via corresponding connecting elements, wherein the further circuit board is arranged on the rear side of the housing. The rear side is opposite to the front side entrance of the housing. In this way, by bringing the circuit board to the installation position, the connection of the circuit board to the further circuit board can be achieved at the same time. This is advantageous for simplifying the installation of the circuit board device.

[0033] Preferably, the circuit board arrangement comprises a plurality of components, wherein a respective component comprises a cooling device and at least one circuit board which can be cooled by the cooling device. In this case, gaps are formed between adjacent components. Thus, on the one hand, there is space between the components in order to pivot the circuit board from a mounted position to an intermediate position. On the other hand, the gaps allow simple access to the respective components and ensure improved heat dissipation.

[0034] The components can be introduced into the housing and / or removed from the housing independently of one another. In this way, in particular within the scope of the first device having a housing with a cooling device and a circuit board, already pre-installed components can be introduced into the housing. This facilitates efficient and rapid installation. And if the component including the cooling device can be removed from the housing together with the circuit board, the cooling device can be replaced together with the circuit board as required. This is also advantageous, for example, for maintenance or repairs.

[0035] Preferably, at least one cooling device comprises a first side facing the first circuit board and a second side facing the second circuit board. Here, the first circuit board and the second circuit board are thermally coupled to the same cooling device via corresponding heat transfer elements. By arranging the two circuit boards on mutually opposite sides of the at least one cooling device in this way, the cooling performance of the cooling device can be used very effectively to cool a plurality of circuit boards.

[0036] Preferably, the corresponding structural elements are arranged on mutually opposite side walls of the housing in the transverse direction of the housing, wherein the corresponding structural elements at least include a support area for at least one cooling device. Here, the distance between the supporting areas located at the bottom in the vertical direction of the housing in the transverse direction is smaller than the distance between the supporting areas located at the top in the vertical direction of the housing. Thus, it can be ensured that only cooling devices that fit precisely or cooling devices whose dimensions correspond to the distance between the supporting areas can be arranged at the corresponding height positions of the housing. In particular, the order in which the cooling devices are installed in the housing can be preset very simply in this way.

[0037] In this way, according to the poka-yoke principle, it can be additionally ensured that the corresponding cooling device can only be arranged at a predetermined position in the housing. This is advantageous for the correct installation sequence of the components of the circuit board arrangement and the overall correct installation of the circuit board arrangement.

[0038] The bearing region may comprise threaded openings and / or receptacles for retaining pins or the like, to allow fixing of at least one cooling device in the bearing region at the structural element. Thus, a safe and simple fixing of the cooling device in the housing may be achieved.

[0039] In a manner similar to that described for the cooling device, the structural elements can have a distance between each other in the lateral direction in the corresponding height position, which allows only one circuit board to be arranged at this height position exactly corresponding to the corresponding distance. In this way, it can be ensured that the circuit boards associated with the corresponding cooling device can only be arranged in a predetermined installation sequence and / or in a predetermined position in the housing. This also facilitates correct and process-reliable installation when manufacturing the circuit board device.

[0040] Further advantages are obtained by installing the cooling device and / or the circuit board from above the housing in a sequence predetermined by the structural elements in the vertical direction of the housing. This installation sequence, in which the components are introduced into the housing from above, ensures in particular that the corresponding heat transfer element can be placed simply and purposefully between the corresponding cooling device and at least one circuit board associated with the cooling device.

[0041] The circuit board device can include a plurality of housings. Thus, the scaling of the circuit board device can be realized very simply. In particular, the housings of the circuit board device can be fixed to each other. Thus, on the one hand, a modular structure of the circuit board device can be realized very simply. In addition, a fixed positioning of the corresponding housing is realized in this way.

[0042] The housings can be arranged relative to one another in such a way that the side walls of adjacent housings abut against one another. Additionally or alternatively, at least one side wall of a first housing can abut against a bottom wall and / or a top wall of at least a second housing. In this way, the installation space conditions to be considered for accommodating the housings can be taken into account in a simple and very large manner.

[0043] If the circuit board arrangement comprises a plurality of housings, in particular housings which are fixed to one another, the housings can be stacked one on top of the other so that the side walls of adjacent housings are aligned with one another. This allows good access to the circuit board and the components comprising the circuit board, respectively, so that in particular the circuit board and / or the components can be replaced easily.

[0044] By means of such a modular construction of a circuit board device comprising a plurality of housings, any arrangement of the circuit boards in the housings and any arrangement of components comprising the circuit boards within the housings, respectively, can be realized in a simple and flexible manner.

[0045] In the housing, at least two circuit boards arranged one above the other can be arranged in a sandwich-like configuration between two cooling devices. This allows very good heat dissipation from the circuit boards via the two cooling devices. Additionally or alternatively, two cooling devices arranged one above the other can be arranged in a sandwich-like configuration between two circuit boards. This also facilitates effective heat dissipation from the circuit boards.

[0046] The features and feature combinations mentioned in the above description and in the following description of the figures and / or shown individually in the figures can be used not only in the respectively specified combination but also in other combinations without departing from the scope of the invention. Therefore, embodiments are also considered to be included and disclosed by the present invention, which are not explicitly shown and explained in the figures, but are derived from and can be derived from separate feature combinations from the explained embodiments. Embodiments and feature combinations are also considered to be public and therefore do not include all features of the originally formulated independent claims. In addition, embodiments and feature combinations should be considered to be public, in particular through the embodiments explained above, which extend beyond or deviate from the feature combinations explained in the claim relationship. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Further features of the invention are apparent from the claims, the drawings and the description of the drawings. In the drawings:

[0048] Figure 1 : A circuit board device during installation in a schematic perspective view, wherein inclined guide rails are formed on a side wall of a housing of the circuit board device;

[0049] Figure 2 :according to Figure 1 A side view of a circuit board device;

[0050] Figure 3 : Schematically shows the Figure 1 A circuit board device, wherein the cooling device is located at its expected assembly position or installation position in the housing, and the circuit board arranged on the support plate moves exactly along the guide rail;

[0051] Figure 4 :according to Figure 1 An exploded view of the circuit board device;

[0052] Figure 5 :according to Figure 1 A perspective view of a housing of a circuit board device;

[0053] Figure 6 :according to Figure 1 A cross-sectional view of a circuit board device, wherein the individual circuit boards and the cooling device are in their respective installed positions;

[0054] Figure 7 :according to Figure 6 A perspective view of a circuit board device;

[0055] Figure 8 : An exploded schematic diagram of a variant of the circuit board device, wherein a structural element is arranged on a side wall of the housing, the structural element predetermines the installation sequence of the circuit board and the cooling device when they are introduced into the housing from above and the installation position in the housing;

[0056] Fig. 9 :according to Figure 8 A perspective view of a housing of a circuit board device;

[0057] Fig.10 :according to Figure 8 Circuit board equipment in an assembled state;

[0058] Fig.11 : Circuit board equipment, where according to Figure 8 The two shells are arranged adjacent to each other, with the side walls of the shells abutting against each other;

[0059] Fig.12 :Circuit board equipment basis Figure 8 A variation of the arrangement of two shells is formed in which the side wall of the first shell abuts against the top wall of the second shell;

[0060] Fig.13 : A further variant of a housing of a circuit board device, wherein the components including the circuit board are arranged in different orientations relative to each other in the respective housing; and

[0061] Fig.14 :according to Fig.13 The housings of the circuit board device are in a state of being coupled to each other, wherein side walls of adjacent housings of the circuit board device are arranged to be aligned with each other.

[0062] In the figures, identical or functionally identical elements are provided with the same reference symbols. DETAILED DESCRIPTION

[0063] Figure 1 A circuit board arrangement 10 is shown schematically and in perspective with a housing 12 in which a plurality of circuit boards 14 are arranged. The circuit boards 14 are arranged one above the other in the housing 12, viewed in a vertical direction z of the housing 12. The circuit boards 14 can be components of one or more electronic control devices or electronic control units of a vehicle equipped with the circuit board arrangement 10.

[0064] Figure 1Two of the circuit boards 14 shown exemplarily and schematically in FIG. 1 are shown in their assembled or installed positions in the housing 12, i.e., the two circuit boards 14 are located at the bottom in the vertical direction z. In contrast, Figure 1 The third of the three circuit boards 14 shown in the figure is being pushed into the housing 12, that is, substantially in the depth direction x of the housing 12. The depth direction x of the housing 12 as well as the vertical direction z and the lateral direction y are defined by Figure 1 The coordinate system in is shown schematically.

[0065] exist Figure 1 In the illustrated design of the circuit board arrangement 10, each circuit board 14 is provided with its own cooling device 16, through which a cooling fluid can be passed, in particular in the form of a liquid coolant or cooling liquid. For this purpose, the respective cooling device 16, which is formed in the form of a cooling plate, comprises a coolant inlet 18 and a coolant outlet 20, wherein in order to Figure 1 For the sake of clarity, not every coolant inlet 18 and not every coolant outlet 20 is provided with a reference symbol.

[0066] Especially from Figure 3 , Figure 7 and according to Figure 6 It can be seen from the cross-sectional view of the circuit board device 10 that when the cooling device 16 is in its installed position (where the cooling devices 16 are arranged one above the other in the housing 12 in the vertical direction z of the housing), the corresponding coolant inlet 18 and the corresponding coolant outlet 20 can be entered through the front side inlet 22 of the housing 12. Here, the corresponding coolant inlet 18 and the corresponding coolant outlet 20 protrude beyond the front side edge of the side walls 24, 26 of the housing 12. The side walls 24, 26 of the housing 12 are opposite to each other in the transverse direction y of the housing 12.

[0067] Especially from Figure 2 and Figure 6 , the respective circuit board 14 does not directly and extensively rest on the respective bottom side 28 of the cooling device 16 which is associated with the respective circuit board 14. Instead, the respective circuit board 14 is thermally coupled to the respective cooling device 16 via at least one heat transfer element 30. The at least one heat transfer element 30 is currently formed as a heat conducting paste.

[0068] from Figure 4It can also be seen from the exploded view of the circuit board device 10 in FIG. 1 that respective heat transfer elements 30 are formed in the form of respective portions of heat-conducting paste between the bottom sides 28 of the respective cooling devices 16 and the top sides 32 of the respective circuit boards 14 facing these bottom sides 28. The heat transfer elements 30 in the form of heat-conducting paste ensure good thermal coupling of the circuit boards 14 to the respective cooling devices 16. As a result, the heat released in operation of the circuit boards 14 can be dissipated well via the coolant, which flows through the cooling devices 16 in operation or cooling operation of the cooling devices 16.

[0069] In the manufacture of the circuit board device 10, the housing 12 can be equipped with the circuit boards 14 and the corresponding cooling device 16 associated with at least one circuit board 14, such as from Figure 1 and Figure 2 Therefore, the corresponding circuit board 14 can be arranged on the support plate 34 formed in the manner of a drawer, wherein the cooling device 16 is arranged on the corresponding circuit board 14, and the heat transfer element 30 is inserted therebetween. Preferably, the corresponding circuit board 14 is fixed to the corresponding support plate 34, for example by screw connection and / or locking, etc.

[0070] The respective support plate 34 comprises on its narrow side a respective stud element 36 which serves as a guide stud or guide pin, which lies opposite the side walls 24, 26 of the housing 12 in the transverse direction y of the housing 12 (see in particular Figure 2 and Figure 3 ). These stud elements 36 can be moved along guide elements of the housing 12, which are provided by guide rails 38. Here, the guide rails 38 are formed on the side walls 24, 26 of the housing 12, which are opposite to each other in the transverse direction y of the housing 12 (see Figure 5 ). In particular, Figure 5 It can be clearly seen in FIG. 1 that the guide rails 38 are oriented obliquely relative to the bottom wall 40 of the housing 12 .

[0071] The screw elements 36 can be moved along these guide rails 38 until the respective screw element 36 is received in a locking recess 42 formed in the end region of the respective guide rail 38. The locking recess 42 formed in the rear end region of the guide rail 38 is particularly formed from Figure 5 The perspective view of the housing 12 is clearly visible.

[0072] When the support plate 34 is introduced into the housing 12, the circuit board 14 is also moved along the guide element, which is now formed as a guide rail 38. When the stud element 36 is then received in the locking recess 42, the respective support plate 34 and the respective circuit board 14 are in an intermediate position. In this intermediate position of the circuit board 14, the respective circuit board 14 (now also the support plate 34) is oriented obliquely relative to the bottom wall 40 of the housing 12.

[0073] In contrast, in the mounted position of the respective circuit board 14, the circuit board 14 is oriented substantially parallel to the base plate or bottom wall 40 (see Figure 2 and Figure 6 ). In order to move the respective circuit board 14 from the intermediate position into the mounting position, the support plate 34 and also the respective circuit board 14 can be pivoted simultaneously about a pivot axis 44 which is formed by the stud element 36 and which is approximately located at Figure 1 Schematically shown in FIG. 1 is the region of two locking recesses 42 which are opposite one another in the transverse direction y of the housing.

[0074] Pivoting the support plate 34 and the circuit board 14 together from the intermediate position into the mounting position causes the locking elements, now formed as locking pins 46, to engage with the counterparts, formed as locking openings 48. The locking openings 48 corresponding to the locking pins 46 of the respective support plate 34 are formed in the respective side walls 24, 26 of the housing 12. Figure 5 The locking opening 48 formed in the left side wall 24 is Figure 5 This is especially evident in .

[0075] Thus, when the locking pin 46 of the respective support plate 34 is accommodated in the associated or corresponding locking opening 48, the respective circuit board 14 is in its mounted position. When the respective circuit board 14 is in the mounted position, at least one heat transfer element 30 arranged on the respective circuit board 14 rests against the bottom side 28 of the respective cooling device 16. From this mounted position, the support plate 34 and the circuit board 14 arranged on the support plate 34 can be pivoted about the pivot axis 44 into an intermediate position, while the cooling device 16 remains stationary. This Figure 3 Shown in.

[0076] In the intermediate position of the support plate 34 and therefore of the circuit board 14, the edge region 50 of the circuit board 14 remote from the pivot axis 44 is spaced further away from the cooling device 16 than in the installed position. Thus, in the intermediate position, the circuit board 14 is now slightly pivoted downwards about the pivot axis 44 together with the support plate 34. Thus, there is a gap between the top side 32 of the circuit board 14 and the bottom side 28 of the cooling device 16. This gap increases gradually from the pivot axis 44 towards the inlet 22 of the housing 12.

[0077] Due to the gap formed between the top side 32 of the circuit board 14 and the bottom side 28 of the cooling device 16, when replacing the circuit board 14, the heat transfer element 30, which is now in the form of a heat conductive paste, can be arranged on the top side 32 of the circuit board 14 and then the circuit board 14 can be moved to the intermediate position without the heat transfer element 30 coming into contact with the bottom side 28 of the cooling device 16. Figure 3 This is especially evident in .

[0078] That is to say, Figure 3 1 shows a step during the assembly of the housing 12 with a replacement or updated circuit board 14. In this assembly step, the cooling device 16 can remain in its installed position, wherein the bottom side 28 of the cooling device 16 is oriented substantially parallel to the bottom wall 40. The stud element 36 moves in the installation direction along the guide element, which is now in the form of a guide rail 38. Figure 4 This is indicated by arrow 52 . The mounting direction currently extends parallel to the guide rail 38 .

[0079] During the movement of the circuit board 14 in the mounting direction along the guide rails 38 into the intermediate position, the heat transfer element 30 , now in the form of a heat conducting paste, is prevented from coming into contact with the bottom side 28 of the cooling device 16 before the support plate 34 and the circuit board 14 together reach the intermediate position.

[0080] When the support plate 34 is subsequently pivoted together with the circuit board 14 arranged thereon from the intermediate position into the installed position, the heat transfer element 30 thus comes to bear against the bottom side 28 of the cooling device 16 (see Figure 3 ). Thus, in the mounted position of the corresponding circuit board 14, the heat transfer element 30 abuts against the cooling device 16 and the circuit board 14 (see Figure 6 ).

[0081] Therefore, if at least one circuit board 14 is to be replaced, the circuit board 14 can first be pivoted about the pivot axis 44 into a corresponding intermediate position in which the heat transfer element 30 is spaced apart from the bottom side 28 of the cooling device 16 .

[0082] However, when the circuit board 14 is removed or removed from the housing 12 and a replacement (e.g. newer) circuit board 14 is subsequently introduced into the housing 12, it is possible to prevent the heat transfer element 30, which is currently formed as a heat-conducting paste and is arranged on the top side 32 of the circuit board 14, from being smeared or spread. As a result, the replacement of the individual circuit boards 14 can be accomplished particularly simply.

[0083] Even during the movement of the support plate 34 and the circuit board 14 from the installation position to the intermediate position, a portion or remainder of the thermal conductive paste should remain on the bottom side 28 of the cooling device 16, and the thermal conductive paste remaining in the housing 12 neither hinders the removal of the circuit board 14 from the housing 12 nor hinders the housing 12 from being equipped with a replacement and / or updated and / or repaired circuit board 14, on which a new portion or a new amount of thermal conductive paste is preferably arranged.

[0084] In particular, when the housing 12 is equipped with the cooling device 16 and the circuit board 14 for the first time, it is possible to Figure 1 and Figure 2Here, the assembly 54, which now includes the circuit board 14 and the cooling device 16 associated with the circuit board 14, can be pushed into the housing 12. Here, the circuit board 14 has been Figure 2 The heat transfer element 30 is thermally coupled to a cooling device 16 associated with the corresponding circuit board 14 .

[0085] according to Figure 1 and Figure 2 , the assembly 54 can also include a support plate 34, which is formed in the form of a drawer, in particular formed by a metal sheet. When the circuit board 14 is replaced, for example, in order to maintain and / or update in particular the circuit board 14, the entire assembly 54 can therefore also be removed or taken out from the housing 12.

[0086] However, it is particularly possible that when replacing at least one circuit board 14, Figure 3 Thus, the cooling device 16 associated with the respective circuit board 14 can remain stationary in the housing 12 , and only the circuit board 14 arranged on the support plate 34 can be removed or taken out of the housing 12 together with the support plate 34 .

[0087] During the process of removing the circuit board 14 from the housing 12, the support plate 34 and the corresponding circuit board 14 together with the support plate 34 are moved out of the housing 12 along the guide elements currently provided by the guide rails 38, i.e. Figure 4 The direction indicated by the arrow 52 is opposite.

[0088] When introducing the replacement circuit board 14 into the housing 12 , the circuit board 14 can then be moved along the guide elements in the form of the guide rails 38 into an intermediate position, since the stud elements 36 slide on the guide rails 38 until entering the locking recesses 42 formed in the end region of the respective guide rails 38 .

[0089] Simply by pivoting the support plate 34 and the circuit board 14 into the installed position, the contact of the heat transfer element 30 arranged on the top side 32 of the circuit board 14 with the bottom side 28 of the cooling device 16 already arranged in the housing 12 can be established.

[0090] Due to the inclined orientation of the guide rails 38 of the circuit board device 10, this type of installation, in particular the installation of a replacement and / or updated and / or repaired circuit board 14, can be realized particularly easily. Figure 5 It is particularly obvious in.

[0091] If the support plate 34 is not moved into the housing 12 along the obliquely oriented guide rails 38 , but parallel to the bottom side 28 of the cooling device 16 or perpendicular to the vertical, this would lead to undesired smearing of the thermal paste, which is now advantageously prevented.

[0092] However, the circuit boards 14 are stacked one on top of the other and are arranged in a mounted position so as to be easily accessible in the housing 12 formed in the manner of a bracket. Furthermore, by providing a cooling device 16, a good heat dissipation of the circuit board 14 during its operation can be achieved. The circuit board 14 can be associated with a corresponding control entity or control device. By arranging a plurality of such electronic control devices or electronic control units in the housing 12, a compact construction of the circuit board device 10 comprising a plurality of such control devices is advantageously achieved.

[0093] Especially from Figure 2 and from Figure 3 As can be clearly seen in FIG. 1 , both in the mounted position of the circuit board 14 and in the intermediate position of the circuit board 14 , the stud element 36 is received in a locking recess 42 formed in the end region of the guide rail 38 .

[0094] Especially from Figure 1 and Figure 5 As can be clearly seen in FIG. 1 , the circuit board device 10 (currently the housing 12 ) comprises a holding device which is formed for holding the cooling device 16 when the circuit board 14 is pivoted into the intermediate position. Figure 5 The holding device includes a holding rod 56, on which the cooling device 16 can rest when the cooling device 16 is pushed into the housing 12 in the depth direction x. Figure 5 In, according to Figure 5 The retaining rod 56 arranged on the left side wall 24 is easily recognizable.

[0095] In addition to or as an alternative to the holding rods 56, other and / or further holding means can fix the respective cooling device 16 in its position in the housing 12. For example, when the circuit board 14 is removed from the mounting position (see Figure 6 ) is pivoted into the intermediate position, the cooling device 16 can be connected to the side walls 24, 26 by screwing and / or by locking and thus retained in the housing 12. For the sake of clarity, corresponding locking elements and / or bolts for providing retaining means are not currently shown in greater detail.

[0096] from Figure 1 It is also evident from the figure that a further circuit board 58 can be arranged on the rear side of the housing 12, which is now oriented substantially parallel to a plane spanned by the vertical direction z and the transverse direction y, the rear side being opposite the front side inlet 22. Figure 4 The arrangement of a further circuit board 58 which is preferably used as a main circuit board on the rear side of the housing 12 , which is opposite the front side access 22 in the depth direction x of the housing 12 , can also be clearly seen in the exploded view of the circuit board device 10 in .

[0097] At the rear end of the respective circuit board 14, the circuit board 14 now comprises a connecting element 60. Thus, when the respective circuit board 14 is in its mounted position (see Figure 6 and Figure 7 ), the circuit board 14 is connected to another circuit board 58 via these rear connecting elements 60.

[0098] In contrast, further connection elements 62 of the circuit board 14 are accessible from the front access 22 of the housing 12, via which connection elements 62 data and / or electrical energy can be supplied to or from corresponding components (not shown in greater detail at present) of the circuit board 14. These front connection elements 62 are either connected in accordance with Figure 7 This is particularly evident in the perspective view of the circuit board arrangement 10 .

[0099] from Figure 6 The cross-sectional view and Figure 7 As can be clearly seen in the perspective view of FIG. 5 , gaps are formed between the individual components 54, which include the corresponding cooling device 16 and at least one circuit board 14 that can be cooled by the cooling device 16. Due to the size of the gaps, it has been proven that the circuit board 14 can be moved from the installation position (see FIG. 5 ) about the pivot axis 44. Figure 7 ) is particularly simple to pivot into an intermediate position in which the edge region 50 of the respective circuit board 14 is spaced further from the cooling device 16 than in the installed position.

[0100] In a variant of the circuit board device 10 that is not currently shown in detail, not only the bottom side 28 and the first side of the cooling device 16 are used to cool the corresponding circuit board 14, but also the second side that is currently present in the form of the top side 64 of the corresponding cooling device 16 or at least one cooling device 16 is used to cool the corresponding circuit board 14.

[0101] Will refer to Figure 8 This use of a cooling device 16 to cool two circuit boards 14 is explained. Here, a further circuit board 58 serving as a main circuit board is also arranged on the rear side of the housing 12. However, one of the circuit boards 14 is thermally coupled to the cooling device 16 via a heat transfer element 30 that is not only arranged on the bottom side 28 of the respective cooling device 16. Rather, at least one further heat transfer element 30, preferably in the form of a heat-conducting paste, is arranged between the top side circuit board 14 and the top side 64 of the respective cooling device 16.

[0102] according to Figure 8 , the circuit board 14 and the cooling device 16 can be introduced into the housing 12 together with the heat transfer element 30 respectively placed therebetween in a direction opposite to the vertical direction z of the housing 12. The corresponding installation direction is Figure 8Here, it is also shown that it is very simple to arrange the heat transfer element 30 between the corresponding sides in the form of the bottom side 28 and the top side 64 of the circuit board 14 and the cooling device 16. This is because the circuit board 14, the heat transfer element 30 and the cooling device 16 can be introduced into the housing 12 successively from above in the direction indicated by the arrow 66.

[0103] In addition, Figure 8 In the variant of the circuit board arrangement 10 shown, each cooling device 16 comprises a coolant inlet 18 and a coolant outlet 20 , via which a coolant, in particular in the form of a cooling liquid, can pass through the respective cooling device 16 .

[0104] Figure 8 Also shown is a cover 68 which is now L-shaped in cross section and by which a rear wall 70 and a top wall 72 of the housing 12 are formed in the installed state of the circuit board device 10 (see Fig.10 ).

[0105] Especially from Fig. 9 As can be clearly seen in FIG. 1 , the structural elements 74 can be arranged on the side walls 24, 26 of the housing 12 opposite to each other in the transverse direction y, thereby presetting the installation sequence of the circuit board 14 and the cooling device 16 introduced into the housing 12 from above, namely: in the direction of the arrow 66 (see Figure 8 ).

[0106] The columnar structural element 74 ensures the error-proof principle of the correct arrangement of the circuit board 14 and the cooling device 16 in the housing 12. For this purpose, on the one hand, the structural element 74 comprises a support area 76 for the respective circuit board 14, which is formed in the manner of the top side of a respective step of the structural element 74. In a similar manner, the columnar structural element 74 comprises a further support area 78, on which the bottom side 28 of the respective cooling device 16 rests when the circuit board 14 and the cooling device 16 are arranged in the housing 12.

[0107] In the vertical direction z of the housing 12, the distance between the lower support areas 78 for the respective cooling devices 16 is smaller than the distance between the upper support areas 78 in the vertical direction z of the housing 12. Here, the distance is measured in the transverse direction y of the housing 12. Figure 8 The lower cooling device in the cooling device 16 can only be placed on the lower support area 78. In contrast, the cooling device 16 ( Figure 8 The upper cooling device in the housing 12 can only be placed on the upper support area 78. Therefore, the installation position and installation sequence of the corresponding cooling device 16 in the housing 12 are preset by the distance between the support areas 78 in the transverse direction y.

[0108] In a similar manner, the support areas 76 for the respective circuit boards 14 can have a gradually increasing distance from one another in the vertical direction z of the housing 12, wherein the distance is measured in the transverse direction y of the housing 12. This ensures that the respective circuit boards 14 can also be arranged only at predetermined height positions in the housing 12.

[0109] In order to fix the components, in the present case in the form of the circuit board 14 and the cooling device 16, at a corresponding height of the housing 12 or the structural element 74, threaded openings and / or insertion openings etc. can be provided in the support areas 76, 78, for example. By introducing screws into the threaded openings or threaded holes or pins into the insertion openings, a simple, detachable fixing of the circuit board 14 and the cooling device 16 in the housing 12 can be achieved.

[0110] Due to the assembly sequence when introducing the circuit board 14 and the cooling device 16 into the housing 12 which is predetermined by the structural element 74 , the replacement of the circuit board 14 and the introduction of the heat transfer element 30 between the circuit board 14 and the corresponding cooling device 16 can also be easily realized.

[0111] from Fig.10 The sandwich-like construction of the arrangement of the respective cooling device 16 between the respective lower circuit board 14 and the respective upper circuit board 14 in the housing 12 can be clearly seen in FIG.

[0112] from Fig.11 As can be seen in FIG. 1 , the circuit board device 10 can include a plurality of housings 12 , wherein the housings 12 can be fixed to each other in particular. Fig.11 , the side walls 24, 26 of adjacent shells 12 can abut against each other. Fig.11 The side wall 26 ( Fig.11 The right side of the housing 12 ( Fig.11 The side wall 24 (on the right side) Fig.11 on the left side of the image).

[0113] However, other types of arrangements and / or fixings of the housings 12 to one another are also possible. Fig.12 Explain. Fig.12 In the arrangement of the first housing 12, the side wall 26 ( Fig.12 The side wall (the right side wall in the figure) abuts against the top wall 72 of the second shell 12. Additionally or alternatively, the first shell 12 or the shell 12 ( Fig.12 One of the side walls 24, 26 of the housing (the left housing) abuts against the housing 12 ( Fig.12 On the bottom wall 40 of the shell (the right side in the middle).

[0114] In this circuit board device 10, the cooling device 16 and the circuit board 14 are arranged horizontally (see Fig.11 ) and / or the vertical arrangement of the cooling device 16 and / or the circuit board 14 (see Fig.12 ) can in particular be provided in the respectively desired combination.

[0115] Additionally or alternatively, the circuit board device 10 may include a double housing or a similar multiple housing, wherein Fig.11 or Fig.12 The housings 12 are shown as being integrally formed with one another.

[0116] In accordance with Fig.11 and Fig.12 The corresponding housing 12, as shown in reference Figures 8 to 10 As explained for one of the housings 12 , a sandwich-like construction is achieved in which the cooling device 16 is arranged between the respective circuit boards 14 .

[0117] Reference Fig.13 and Fig.14 Further possibilities for arranging the printed circuit board 14 in the housing 12 , in particular together with at least one cooling device 16 (which may be coupled to one another), are explained.

[0118] Fig.13 The circuit board device 10 shown in FIG. 1 includes a first housing 12 (which is Fig.13 The upper shell), the second shell 12 (which is Fig.13 The middle shell) and the third shell 12 (which is in Fig.13 Here, the housings 12 are stacked one on top of the other so that the corresponding side walls 24, 26 of adjacent housings 12 are aligned with each other. Fig.13 In FIG. 1 , the individual housings 12 are shown as not yet connected to each other, whereas in FIG. Fig.14 The middle housings 12 are fixed to each other.

[0119] In this circuit board device 10 as well, guide elements in the form of guide rods 80 are arranged on the side walls 24, 26 opposite to each other in the transverse direction y, only some of which have reference numerals for the sake of clarity. Here, the entire assembly 54 can be moved or displaced along the guide rods 80 in the depth direction x of the housing 12 in order to introduce the corresponding assembly 54 into the corresponding housing 12.

[0120] exist Fig.13 In the configuration of the assembly 54 shown at the top, the cooling device 16 ( Fig.13 14) can be arranged between the upper circuit board 14 and the lower circuit board 14, wherein these circuit boards 14 are also not shown in detail. Fig.13 It is clearly shown in Fig.13In the embodiment, only the assembly housing 82 is shown, in which the common cooling device 16 and the two circuit boards 14 are arranged. Here, the assembly housing 82 comprises a coolant inlet 18 and a coolant outlet 20. With this arrangement, effective cooling of both circuit boards 14 can be achieved by the centrally arranged cooling device 16. At the same time, the entire assembly 54 can be easily removed from the housing 12 and thus replaced.

[0121] exist Fig.13 In the housing 12 arranged centrally in the middle, two component housings 82 are arranged one above the other. Here, the two component housings 82 can rest on one another or against one another, wherein only the lower of the two component housings 82 rests on guide rods 80, which are formed on the mutually opposite side walls 24, 26 of the housing 12. In addition, the upper component housing 82 comprises its own coolant inlet 18 and its own coolant outlet 20, and the lower component housing 82 also comprises its own coolant inlet 18 and its own coolant outlet 20.

[0122] In this arrangement, the circuit board 14 ( Fig.13 The two circuit boards 14 of the two component housings 82 stacked one above the other are arranged in a sandwich-like structure between the upper cooling device 16 and the lower cooling device 16. Fig.13 Here, the upper cooling device 16 is associated with the upper component shell 82, and the lower cooling device 16 is associated with the lower component shell 82.

[0123] Thus, the two component housings 82 can be arranged mirror-image to each other relative to a plane parallel to the plane spanned by the depth direction x and the lateral direction y. However, the two component housings 82 can also be arranged separately from each other so that the circuit boards 14 and the cooling devices 16 are arranged alternately in the stacking direction. Here, the two component housings 82 can also abut against each other.

[0124] exist Fig.13 In the arrangement of the component housings 82 shown at the bottom, corresponding gaps 84 are formed between the corresponding component housings 82 in the housing 12 of the circuit board device 10 (see Fig.14 ). Here, the circuit board 14 (not shown) and the cooling device 16 (also not shown) are arranged in each component housing 82. Fig.13 In the top-to-bottom arrangement of the modules 54 shown at the bottom, each module housing 82 includes its own coolant inlet 18 and its own coolant outlet 20 .

[0125] Fig.13The lowermost component 54 can be pushed into the housing 12 along the bottom wall 40 , and the components 54 arranged above can be pushed into the housing 12 along the guide rods 80 .

[0126] exist Fig.14 , components 54 arranged in corresponding housings 12 are shown in a front view of a circuit board device 10, wherein the individual housings 12 are connected to one another. In this case, in the lower region of the circuit board device 10, the individual components 54 are arranged one above the other, while a gap 84 is formed, and two individual components 54 are arranged to rest one above the other in the upper housing 12. In contrast, in Fig.14 In the uppermost housing 12 in FIG. 1 , an inverted arrangement is shown, wherein a cooling device 16 (not shown) is arranged between circuit boards 14 (also not shown) in the vertical direction z.

[0127] Fig.13 and Fig.14 The modular design of the housing 12 shown in FIG. 1 allows a particularly flexible design of the circuit board arrangement 10 and a simple replacement of the components 54 and the corresponding control devices or electronic control units of the circuit board arrangement 10 .

Claims

1. A circuit board device (10), comprising: at least one housing (12) in which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass and which is formed to dissipate heat from at least one of the circuit boards (14), in, At least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), Features The corresponding circuit board (14) is capable of pivoting about a pivot axis (44) from an installed position to an intermediate position, in which the heat transfer element (30) abuts against the at least one cooling device (16) and the circuit board (14), and in which the edge area (50) of the circuit board (14) away from the pivot axis (44) is spaced further from the at least one cooling device (16) than in the installed position, wherein the housing (12) includes at least one guide element (38), and wherein when the circuit board (14) is introduced into the housing (12), the corresponding circuit board (14) is capable of moving along the at least one guide element (38) to the intermediate position.

2. The circuit board device (10) according to claim 1, It is characterized in that When removing the circuit board (14) from the housing (12), the respective circuit board (14) can be moved out of the housing (12) starting from the intermediate position along the at least one guide element (38).

3. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The heat transfer element (30) is formed as a heat conductive paste which is spaced apart from the at least one cooling device (16) and abuts against the circuit board (14) at a central position of the circuit board (14).

4. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The respective circuit board (14) is arranged on a support plate (34) which is movable along the at least one guide element (38).

5. The circuit board device (10) according to claim 4, It is characterized in that The support plate (34) comprises at least one locking element (46) which, in the mounted position of the circuit board (14), engages with a counterpart (48) arranged on a side surface of the housing (12).

6. The circuit board device (10) according to claim 4 or 5, It is characterized in that The support plate (34) comprises at least one stud element (36), the pivot axis (44) being formed by the stud element, wherein the at least one stud element (36) is received in a locking recess (42) provided on a side surface of the housing (12), in particular a locking recess formed in an end region of the at least one guide element (38), both in a mounted position and in an intermediate position on the circuit board (14).

7. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The circuit board arrangement (10), in particular the housing (12), comprises a holding device (56) which is formed for holding the at least one cooling device (16) when the circuit board (14) is pivoted into the intermediate position.

8. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The at least one guide element is provided by a respective guide rail (38), which is particularly oriented obliquely with respect to a bottom wall (40) of the housing (12), and is formed on mutually opposing side walls (24, 26) of the housing (12).

9. The circuit board device (10) according to any one of the preceding claims, It is characterized in that In the installed position, the circuit boards (14) arranged one above the other in the vertical direction (z) of the housing (12) are connected to another circuit board (58) arranged on the rear side of the housing (12) via corresponding connecting elements (60), wherein the rear side is opposite to the front side inlet (22) of the housing (12).

10. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The circuit board device (10) comprises a plurality of components (54), in particular components which can be introduced into the housing (12) and / or removed from the housing (12) independently of one another, wherein a respective component (54) comprises a cooling device (16) and at least one circuit board (14) which can be cooled by the cooling device (16), wherein gaps are formed between adjacent components (54).

11. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The at least one cooling device (16) comprises a first side (28) facing the first circuit board (14) and a second side (64) facing the second circuit board (14), wherein the first circuit board (14) and the second circuit board (14) are thermally coupled to the same cooling device (16) via respective heat transfer elements (30).

12. The circuit board device (10) according to any one of the preceding claims, It is characterized in that Corresponding structural elements (74) are arranged on side walls (24, 26) of the shell (12) that are opposite to each other in a transverse direction (y) of the shell (12), and the structural elements at least include a support area (78) for at least one cooling device (16), wherein the distance between the support areas (78) located below in a vertical direction (z) of the shell (12) is smaller than the distance between the support areas (78) located above in the vertical direction (z) of the shell (12) in a transverse direction (y).

13. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The circuit board device (10) comprises a plurality of housings (12), in particular housings fixed to each other, wherein the side walls (24, 26) of adjacent housings (12) abut against each other, and / or at least one side wall (24, 26) of a first housing (12) abuts against a bottom wall (40) and / or a top wall (72) of at least a second housing (12).

14. The circuit board device (10) according to any one of the preceding claims, It is characterized in that The circuit board device (10) comprises a plurality of housings (12), in particular housings fixed to each other, wherein the housings (12) are stacked one on top of the other so that side walls (24, 26) of adjacent housings (12) are arranged in alignment with each other.

15. The circuit board device (10) according to any one of the preceding claims, It is characterized in that In the housing (12), at least two circuit boards (14) arranged one above the other are arranged in a sandwich-like structure between two cooling devices (16), and / or two cooling devices (16) arranged one above the other are arranged in a sandwich-like structure between two circuit boards (14).

Images