Vacuum eutectic device, method and application thereof

Abstract

According to the vacuum eutectic device, the method and the application thereof, a closed environment is formed through the vacuum cover and the eutectic box, and the vacuum is pumped to the preset vacuum degree, so that the influence of oxygen and water vapor is effectively reduced, the damage to a crystal structure is avoided, and the purity of a sample and the integrity of the crystal structure are improved. After eutectic of a batch of chips is completed, the driving connecting rod can quickly drive the vacuum cover to the position above another vacuum box for eutectic of a next batch of chips, continuous eutectic of the vacuum eutectic device is achieved, and the production efficiency is further improved. In conclusion, according to the vacuum eutectic device, the vacuum eutectic method and the application of the vacuum eutectic device, the vacuum eutectic method and the application of the vacuum eutectic device, the vacuum eutectic method and the application of the vacuum eutectic device, the vacuum eutectic method and the application of the vacuum eutectic device are optimized in multiple aspects of eutectic treatment under high vacuum degree, efficient eutectic process, stable eutectic environment, convenient observation and operation, continuous eutectic production, wide application fields and the like; and a powerful technical support is provided for the preparation of the semiconductor device.

Description

Technical Field

[0001] The present invention relates to the field of eutectic patch, and in particular to a vacuum eutectic device, method and application thereof. Background Art

[0002] With the rapid development of microelectronics technology, the requirements for the connection between chips and substrates are constantly increasing. Traditional connection methods can no longer meet the performance requirements of modern electronic products, especially in terms of connection strength, stability and reliability. Therefore, eutectic connection technology came into being. It achieves the connection between chips and substrates by melting eutectic alloy materials, which has significant advantages. In order to meet the wide application of this technology, the eutectic machine was invented and continuously optimized and improved.

[0003] As an important equipment in the field of semiconductor packaging, the core function of the eutectic machine is to achieve electrical and mechanical connection between the chip and the substrate. Through a specific eutectic process, the eutectic machine can form a high-strength, high-stability and high-reliability connection between the chip and the substrate, thus meeting the needs of modern electronic products for high-performance connection technology.

[0004] However, traditional eutectic machines work in the air, which leads to contamination by impurities, oxides, etc. in the air during the welding process; and because traditional eutectics are greatly affected by the environment, the temperature, pressure and other parameters in the welding process fluctuate greatly, thus affecting the consistency and stability of the welding quality. Secondly, traditional eutectic machines have high requirements for materials, requiring the materials to have good welding performance and stability. However, due to differences in material composition, structure and other factors, there may be large differences in welding quality between different materials. During the eutectic process of traditional eutectic machines, the welding area is usually in a high temperature state, and the welding process is not visible, which makes real-time monitoring and evaluation of welding quality difficult. In addition, traditional eutectic machines usually require higher heating temperatures and longer heating times during eutecticization, which leads to greater energy consumption.

[0005] In summary, traditional eutectic machines have obvious defects in environmental control, welding quality, material requirements, welding process visibility and energy consumption. Summary of the invention

[0006] In order to solve the problems existing in the traditional eutectic machines in the prior art and meet the semiconductor industry's demand for high-precision, high-efficiency and low-cost eutectics, the present invention provides a vacuum eutectic device, method and application thereof.

[0007] The first aspect of the present application is to provide a vacuum eutectic device, comprising:

[0008] A eutectic box, comprising a first eutectic box and a second eutectic box arranged adjacent to each other, wherein a cavity is provided on the top of the eutectic box, and a heating platform is provided in the cavity for welding chips;

[0009] A vacuum cover, forming a closed environment with the first eutectic box or the second eutectic box, with a vacuum tube provided on one side;

[0010] At least two driving connecting rods, one end of each driving connecting rod is movably connected to the vacuum cover, and the other end is movably connected to the bottom of the eutectic box, driving the vacuum cover to move above the eutectic box to selectively cover the first eutectic box or the second eutectic box.

[0011] In a preferred embodiment, the first eutectic box is equipped with a first heating stage.

[0012] In a preferred embodiment, the second eutectic box is equipped with a second heating stage.

[0013] In a preferred embodiment, the heating platform is equipped with a plurality of baffles for dividing the heating platform into a plurality of heating zones, that is, the heating platform can heat a plurality of chips at the same time.

[0014] Preferably, the material of the baffle is a single material or an alloy of Fe, Co, and Ni.

[0015] In a preferred embodiment, the contact portion between the vacuum cover and the eutectic box is made of magnets.

[0016] In a preferred embodiment, the vacuum cover is provided with an observation window for observing the internal eutectic conditions.

[0017] Preferably, the observation window is made of organic glass.

[0018] In a preferred embodiment, the number of the driving connecting rods is four, including a first driving connecting rod, a second driving connecting rod, a third driving connecting rod and a fourth driving connecting rod; wherein,

[0019] The first driving connecting rod and the third driving connecting rod are arranged in parallel on both sides of the first eutectic box;

[0020] One end of the first driving connecting rod is connected to the middle position of the bottom edge of one side of the first eutectic box, and the other end is connected to the side of the vacuum cover away from the second eutectic box;

[0021] One end of the third driving connecting rod is connected to the middle position of the bottom edge of the other side of the first eutectic box, and the other end is connected to the side of the other side of the vacuum cover away from the second eutectic box;

[0022] The second driving connecting rod and the fourth driving connecting rod are arranged in parallel on both sides of the second eutectic box;

[0023] One end of the second driving connecting rod is connected to the middle position of the bottom edge of one side of the second eutectic box, and the other end is connected to the side of the vacuum cover close to the second eutectic box;

[0024] One end of the fourth driving connecting rod is connected to the middle position of the bottom edge of the other side of the second eutectic box, and the other end is connected to the other side of the vacuum cover close to the second eutectic box.

[0025] Preferably, the connection mode between the driving connecting rod and the eutectic box and the connection mode between the driving connecting rod and the vacuum cover may be the same or different.

[0026] Preferably, the movable connection includes one or more combinations of shaft-hole connection, pin connection, hinge connection and bearing connection.

[0027] More preferably, the connection between the driving connecting rod and the eutectic box, and the connection between the driving connecting rod and the vacuum cover are both ball bearing connections.

[0028] A second aspect of the present invention provides a vacuum eutectic method, comprising the following steps:

[0029] Provide a vacuum eutectic device as described in the first aspect of the present invention;

[0030] Place the chip, solder and substrate on a heating table and use a pressurizing device to ensure that the chip and substrate maintain a stable position during the eutectic process;

[0031] The driving connecting rod drives the vacuum cover to the top of the preset vacuum box to form a closed space, i.e., the eutectic cavity;

[0032] Connect the vacuum tube to the vacuum pump and evacuate the eutectic cavity to a preset vacuum degree;

[0033] Adjust the heating stage to a preset temperature so that the molten solder evenly fills the gap between the chip and the substrate; after the solder is completely solidified, turn off the heating stage and wait for the eutectic device to cool down;

[0034] The eutectic cavity is opened, and the connected chips and substrates are taken out. At the same time, the connecting rod is driven to drive the vacuum cover to the top of another vacuum box for eutectic of the next batch of chips, so as to realize continuous eutectic of the vacuum eutectic device.

[0035] In a preferred embodiment, the pressurizing device comprises a pneumatic or electric device.

[0036] Preferably, the pressurizing device comprises one or more of a pressing plate, a pressing block, and a pressing needle.

[0037] In a preferred embodiment, during the eutectic process, monitoring can be performed through an observation window provided on the vacuum hood, so that the eutectic parameters can be adjusted conveniently.

[0038] A third aspect of the present invention is to provide an application of a vacuum eutectic device, which can be used to prepare high-performance semiconductor devices.

[0039] Preferably, the vacuum eutectic device can be used for welding high-power lasers, high-power LEDs, and high-power IGB devices.

[0040] More preferably, the vacuum eutectic device can be used for packaging of microwave devices and radio frequency chips.

[0041] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0042] The present invention provides a vacuum eutectic device, method and application thereof, which forms a closed environment through a vacuum cover and a eutectic box, evacuates to a preset vacuum degree, effectively reduces the influence of oxygen and water vapor, avoids the destruction of the crystal structure, and improves the purity of the sample and the integrity of the crystal structure. After the eutectic of a batch of chips is completed, the driving connecting rod can quickly drive the vacuum cover to the top of another vacuum box for the eutectic of the next batch of chips, thereby realizing the continuous eutectic of the vacuum eutectic device and further improving the production efficiency. In addition, the vacuum eutectic device of the present application can be applied to the preparation of high-performance semiconductor devices, such as welding of high-power lasers, high-power LEDs, high-power IGBTs and other devices, as well as the packaging of microwave devices and radio frequency chips, and has broad application prospects. In summary, the vacuum eutectic device, method and application thereof provided by the present application provide strong technical support for the preparation of semiconductor devices by realizing the optimization of multiple aspects such as eutectic processing under high vacuum degree, efficient eutectic process, stable eutectic environment, easy observation and operation, continuous eutectic production and wide application fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the three-dimensional structure of the eutectic machine according to Example 1 of the present invention.

[0044] Figure 2 It is a schematic diagram of the three-dimensional structure of the eutectic machine after the vacuum cover is flipped over in Example 1 of the present invention.

[0045] Figure 3 It is a three-dimensional schematic diagram of the pressurized pick-and-place mechanism of Example 1 of the present invention.

[0046] The following are the descriptions of the reference numerals:

[0047] 1. Vacuum cover; 2. Driving connecting rod; 21. First driving connecting rod; 22. Second driving connecting rod; 23. Third driving connecting rod; 24. Fourth driving connecting rod; 3. First eutectic box; 4. Second eutectic box; 5. Heating table; 6. Magnet; 7. Observation window; 8. Baffle; 9. Pressurizing device. DETAILED DESCRIPTION

[0048] The present invention provides a vacuum eutectic device, method and application thereof. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the content of the present invention and are not used to limit the content of the present invention.

[0049] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0050] Embodiment 1:

[0051] This embodiment provides a vacuum eutectic device, such as Figure 1 As shown, including:

[0052] Eutectic box: The first eutectic box 3 and the second eutectic box 4 are arranged adjacent to each other, and a cavity is provided on the top of each eutectic box to accommodate components such as a heating platform 5 and a chip 6.

[0053] The first eutectic box 3 is equipped with a first heating platform, and the second eutectic box 4 is equipped with a second heating platform, so as to realize the simultaneous operation of two stations and improve the production efficiency.

[0054] Heating platform 5: The heating platform 5 is embedded in the cavity of the eutectic box and can be heated to a specified temperature as required.

[0055] The heating platform 5 is equipped with a plurality of baffles 8, which are made of Fe, Co, and Ni alloy materials. They are not only resistant to high temperatures but also have good thermal conductivity, and can effectively and evenly conduct heat to the chip. The design of the baffles 8 divides the heating platform 5 into a plurality of heating zones, so that a plurality of chips 6 can be eutectic treated at the same time (e.g. Figure 1 As shown, each eutectic box can process 9 chips simultaneously).

[0056] Vacuum cover 1: The vacuum cover 1 can selectively form a closed environment with the first eutectic box 3 and the second eutectic box 4, and the contact part thereof is made of magnet 6 material to ensure that a stable and closed eutectic cavity is formed during the eutectic process. A vacuum tube is provided on one side of the vacuum cover 1 for connecting to a vacuum pump to evacuate the eutectic cavity to a preset vacuum degree.

[0057] The vacuum cover 1 is provided with an observation window 7 made of highly transparent organic glass, which is convenient for observing the internal conditions during the eutectic process.

[0058] Driving connecting rods 2 : There are four driving connecting rods 2 , including a first driving connecting rod 21 , a second driving connecting rod 22 , a third driving connecting rod 23 and a fourth driving connecting rod 24 .

[0059] The first driving connecting rod 21 and the third driving connecting rod 23 are arranged in parallel on both sides of the first eutectic box 3;

[0060] One end of the first driving connecting rod 21 is connected to the middle position of the bottom edge of one side of the first eutectic box 3, and the other end thereof is connected to the side of the vacuum cover 1 away from the second eutectic box 4;

[0061] One end of the third driving connecting rod 23 is connected to the middle position of the bottom edge of the other side of the first eutectic box 3, and the other end thereof is connected to the other side of the vacuum cover 1 away from the second eutectic box 4;

[0062] The second driving connecting rod 22 and the fourth driving connecting rod 24 are arranged in parallel on both sides of the second eutectic box 4;

[0063] One end of the second driving connecting rod 22 is connected to the middle position of the bottom edge of one side of the second eutectic box 4, and the other end thereof is connected to the side of the vacuum cover 1 close to the second eutectic box 4;

[0064] One end of the fourth driving connecting rod 24 is connected to the middle position of the bottom edge of the other side of the second eutectic box 4 , and the other end thereof is connected to one side of the other side of the vacuum cover 1 close to the second eutectic box 4 .

[0065] The connection mode between the driving connecting rod 2 and the eutectic box is the same as the connection mode between the driving connecting rod 2 and the vacuum cover 1 , both of which are ball bearing connections.

[0066] Embodiment 2:

[0067] This embodiment provides a method for using the vacuum eutectic device according to Embodiment 1, the steps comprising:

[0068] like Figure 3 As shown, the chip, solder and substrate are placed in the heating zone of the heating stage 5, and a pressurizing device 9 is used to ensure that the chip and substrate maintain a stable position during the eutectic process.

[0069] The driving connecting rod 2 drives the vacuum cover 1 to above the preset vacuum box to form a closed eutectic cavity.

[0070] Connect the vacuum pump via a vacuum tube to evacuate the eutectic cavity to a preset vacuum degree.

[0071] The heating stage 5 is adjusted to a preset temperature so that the molten solder can evenly fill the gap between the chip and the substrate.

[0072] After the solder is completely solidified, the heating stage 5 is turned off and the eutectic device is allowed to cool down.

[0073] Open the eutectic cavity and take out the connected chip and substrate, such as Figure 2 As shown, the connecting rod 2 is driven to drive the vacuum cover 1 to the top of another vacuum box to perform eutectic crystal formation of the next batch of chips, thereby achieving continuous eutectic crystal formation.

[0074] Embodiment 3:

[0075] This embodiment provides an application of the vacuum eutectic device described in Embodiment 2. The vacuum eutectic device can be applied to the welding of high-power lasers, high-power LEDs, and high-power IGB devices, as well as the packaging of microwave devices and radio frequency chips.

[0076] Embodiments 1-3 of the present invention provide a vacuum eutectic device, method and application thereof, which forms a closed environment through a vacuum cover and a eutectic box, and evacuates to a preset vacuum degree, effectively reducing the influence of oxygen and water vapor, avoiding the destruction of the crystal structure, and improving the purity of the sample and the integrity of the crystal structure. The heating table is equipped with multiple baffles, which can divide the heating table into multiple heating zones, so that the vacuum eutectic device can heat and eutecticize multiple chips at the same time, thereby improving production efficiency. The contact part between the vacuum cover and the eutectic box is made of magnetic material, which can ensure that a stable and closed eutectic cavity is formed during the eutectic process, and the entry of external impurities is avoided. In addition, an observation window is provided on the vacuum cover, which is made of organic glass, so that it is convenient to observe the internal situation during the eutectic process, and it is convenient to monitor and adjust the eutectic parameters. After the eutectic of a batch of chips is completed, the driving connecting rod can quickly drive the vacuum cover to the top of another vacuum box for eutectic of the next batch of chips, realizing the continuous eutectic of the vacuum eutectic device and further improving production efficiency. In addition, the vacuum eutectic device of the present application can be applied to the preparation of high-performance semiconductor devices, such as welding of high-power lasers, high-power LEDs, high-power IGBTs and other devices, as well as packaging of microwave devices and radio frequency chips, and has broad application prospects. In summary, the vacuum eutectic device, method and application provided by the present application provide strong technical support for the preparation of semiconductor devices by optimizing multiple aspects such as eutectic processing under high vacuum, efficient eutectic process, stable eutectic environment, easy observation and operation, continuous eutectic production and a wide range of application fields.

[0077] The specific embodiments of the present invention are described in detail above, but they are only examples, and the present invention is not limited to the specific embodiments described above. For those skilled in the art, any equivalent modifications and substitutions made to the present invention are also within the scope of the present invention. Therefore, the equalization changes and modifications made without departing from the spirit and scope of the present invention should be included in the scope of the present invention.

Claims

1. A vacuum eutectic device, characterized in that: include: A eutectic box, comprising a first eutectic box and a second eutectic box arranged adjacent to each other, wherein a cavity is provided on the top of the eutectic box, and a heating platform is provided in the cavity for welding chips; A vacuum cover, forming a closed environment with the first eutectic box or the second eutectic box, with a vacuum tube provided on one side; At least two driving connecting rods, one end of each driving connecting rod is movably connected to the vacuum cover, and the other end is movably connected to the bottom of the eutectic box, driving the vacuum cover to move above the eutectic box to selectively cover the first eutectic box or the second eutectic box.

2. The vacuum eutectic device according to claim 1, characterized in that: The first eutectic box is equipped with a first heating stage; and / or The second eutectic box is equipped with a second heating stage.

3. The vacuum eutectic device according to claim 1, characterized in that: The heating platform is equipped with a plurality of baffles for dividing the heating platform into a plurality of heating zones, that is, the heating platform can heat a plurality of chips at the same time.

4. The vacuum eutectic device according to claim 1, characterized in that: The contact portion between the vacuum cover and the eutectic box is made of magnet.

5. The vacuum eutectic device according to claim 1, characterized in that: The vacuum cover is provided with an observation window for observing the internal eutectic condition.

6. The vacuum eutectic device according to claim 1, characterized in that: A eutectic box, comprising a first eutectic box and a second eutectic box arranged adjacent to each other, wherein a cavity is provided on the top of the eutectic box, and a heating platform is provided in the cavity for welding chips; A vacuum cover, forming a closed environment with the first eutectic box or the second eutectic box, with a vacuum tube provided on one side; At least two driving connecting rods, one end of each driving connecting rod is movably connected to the vacuum cover, and the other end is movably connected to the bottom of the eutectic box, driving the vacuum cover to move above the eutectic box to selectively cover the first eutectic box or the second eutectic box.

7. The vacuum eutectic device according to claim 1, characterized in that: The connection mode between the driving connecting rod and the eutectic box and the connection mode between the driving connecting rod and the vacuum cover are both ball bearing connections.

8. A method for vacuum eutectic formation, characterized in that the steps include: A vacuum eutectic device according to any one of claims 1 to 7; Place the chip, solder and substrate on a heating table and use a pressurizing device to ensure that the chip and substrate maintain a stable position during the eutectic process; The driving connecting rod drives the vacuum cover to the top of the preset vacuum box to form a closed space, i.e., the eutectic cavity; Connect the vacuum tube to the vacuum pump and evacuate the eutectic cavity to a preset vacuum degree; Adjust the heating stage to a preset temperature so that the molten solder evenly fills the gap between the chip and the substrate; After the solder is completely solidified, turn off the heating stage and wait for the eutectic device to cool down; The eutectic cavity is opened, and the connected chips and substrates are taken out. At the same time, the connecting rod is driven to drive the vacuum cover to the top of another vacuum box for eutectic of the next batch of chips, so as to realize continuous eutectic of the vacuum eutectic device.

9. The vacuum eutectic device according to claim 1, characterized in that: The pressurizing device includes a pneumatic or electric device.

10. An application of the vacuum eutectic device according to any one of claims 1 to 7, characterized in that: The vacuum eutectic device is used for preparing high-performance semiconductor devices.

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