Laser and laser projection equipment

Abstract

The invention discloses a laser and laser projection equipment, the laser comprises a tube shell and a bottom plate, the bottom surface of the tube shell is provided with an opening, and the bottom plate is located in the opening of the tube shell. The edges of the two sides of the bottom of the tube shell are respectively provided with a notch, and the two insulating blocks are located in the notches in the two sides of the tube shell respectively. And the insulating block is welded with the tube shell and the bottom plate. A plurality of conductive parts are arranged in the insulating block and used for being connected with the laser chip assembly in the tube shell, and a pin is led out of the bottom of the insulating block and can be connected with an external circuit in an inserted mode. Therefore, the electric connection mode of the laser and the external circuit is simplified, soldering tin is not needed, damage of soldering tin to the pins is reduced, meanwhile, the occupied space of the laser can be reduced, and miniaturization design of the whole system is facilitated.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic technology, and in particular to a laser and laser projection equipment. Background Art

[0002] At present, laser projection technology is developing very rapidly, and laser, as one of its core components, plays an irreplaceable role. Semiconductor lasers are produced by packaging chips after they are manufactured. Therefore, the packaging capability of lasers has a significant impact on the application, cost, performance and other indicators of lasers.

[0003] Current lasers are usually packaged in tube shells, with pins extending from the sides of the tube shell. The pins are then welded to the external circuit. The whole process is relatively complicated and requires high strength for the pins. There is a risk of the pins breaking after secondary welding, and this connection method also makes the laser occupy a larger space, which is not conducive to the miniaturization design of the entire system. Summary of the invention

[0004] According to a first aspect of an embodiment of the present invention, a laser is provided, comprising:

[0005] A tube shell; the bottom of the tube shell includes an opening;

[0006] A bottom plate is embedded in the opening of the tube shell; a notch is respectively provided on both side edges of the bottom of the tube shell;

[0007] A plurality of laser chip components are fixed on the base plate;

[0008] Two insulating blocks are respectively located in the gaps on both sides of the tube shell; a part of the insulating block is located inside the tube shell, and a plurality of mutually insulated conductive parts are arranged in the insulating block, one end of the conductive part is located on the surface of the insulating block inside the tube shell, and the other end of the conductive part is located on the bottom surface of the insulating block away from the tube shell;

[0009] A plurality of pins connected one by one to the plurality of conductive parts located on the bottom surface of the insulating block;

[0010] The bottom surface of the bottom plate is flush with the bottom surface of the tube shell, and at least a portion of the bottom surface of the insulating block where the plug pins are arranged is higher than the bottom surface of the bottom plate.

[0011] In some embodiments of the present invention, the bottom surface of the insulating block is a plane, and the bottom surface of the insulating block is higher than the bottom surface of the bottom plate;

[0012] Alternatively, the bottom surface of the insulating block is recessed inwardly in a partial area where the plug pins are arranged, and the rest of the bottom surface of the insulating block is flush with the bottom surface of the base plate.

[0013] In some embodiments of the present invention, the tube shell is made of Kovar alloy, the bottom plate is made of oxygen-free copper, and the insulating block is made of ceramic;

[0014] The insulating block, the tube shell and the bottom plate are welded to each other.

[0015] In some embodiments of the present invention, a surface of one side of the insulating block close to the bottom plate is stepped, and the stepped surface of the insulating block contacts the side wall of the bottom plate and overlaps the surface of the bottom plate.

[0016] In some embodiments of the present invention, a notch is respectively provided on both sides of the bottom plate relative to the position of the insulating block, and the two insulating blocks are respectively inserted into the two notches of the bottom plate to contact the side surfaces of the bottom plate.

[0017] In some embodiments of the present invention, a surface of the insulating block facing away from the bottom plate is a stepped surface, and a thickness of the insulating block on a side close to the bottom plate is smaller than a thickness on a side away from the bottom plate.

[0018] In some embodiments of the present invention, a plurality of pads are provided on a surface of the insulating block facing away from the bottom plate, the plurality of pads are arranged at intervals on the surface of the insulating block, and the plurality of pads are connected to the plurality of conductive parts in a one-to-one correspondence.

[0019] In some embodiments of the present invention, the length of the plug pin is 0.3 mm to 0.6 mm.

[0020] In some embodiments of the present invention, the plurality of laser chips are divided into a plurality of first laser chip assemblies, a plurality of second laser chip assemblies, and a plurality of third laser chip assemblies; the colors of lasers emitted by the first laser chip assemblies, the second laser chip assemblies, and the third laser chip assemblies are different;

[0021] The plurality of first laser chip assemblies are arranged in at least one row along the first direction and the second direction; the plurality of second laser chip assemblies are arranged in at least one row along the first direction and the second direction; the plurality of third laser chip assemblies are arranged in at least one row along the first direction and the second direction; the first direction and the second direction intersect;

[0022] The number of laser chip components in the same row is 3 to 5.

[0023] In some embodiments of the present invention, the laser chip assemblies in the same row are connected in series, and two ends of the laser chip assemblies in a row connected in series are electrically connected to one of the conductive parts on both sides respectively;

[0024] The rows of laser chip assemblies emitting laser beams of the same color are arranged adjacent to each other, and the rows of laser chip assemblies emitting laser beams of the same color are electrically connected to the same conductive part.

[0025] According to a second aspect of the embodiments of the present invention, there is provided a laser projection device, comprising any one of the above-mentioned lasers and a circuit board, wherein the laser is plugged into the circuit board.

[0026] In some embodiments of the present invention, the present invention further comprises:

[0027] A light combining component, located at the light output side of the laser;

[0028] A condenser lens, located on the light-emitting side of the light-combining component;

[0029] An illumination system, located at the light-emitting side of the condenser lens; the illumination system comprises a light modulator;

[0030] The projection lens is located at the light output side of the light modulator.

[0031] The laser and laser projection equipment provided by the embodiments of the present invention, the laser includes a tube shell and a base plate, the bottom surface of the tube shell is provided with an opening, and the base plate is located in the opening of the tube shell. A notch is respectively provided on the two side edges of the bottom of the tube shell, and two insulating blocks are respectively located in the notches on both sides of the tube shell. The insulating block is welded to the tube shell and the base plate. A plurality of conductive parts are provided in the insulating block for connecting the laser chip assembly in the tube shell, and pins are led out from the bottom of the insulating block for plugging with an external circuit. This simplifies the way the laser is electrically connected to the external circuit, eliminates the need for solder, and reduces the damage to the pins caused by solder. At the same time, the space occupied by the laser can be reduced, which is conducive to the miniaturized design of the entire system. The bottom surface of the tube shell is flush with the bottom surface of the base plate, and at least a portion of the bottom surface of the insulating block where the plug pins are provided is higher than the bottom surface of the base plate, so that the bottom surface of the insulating block where the plug pins are provided is recessed into the tube shell, thereby reducing the volume of the laser and protecting the plug pins during transportation of the laser; in addition, when the laser is installed on the circuit board, the problem of hard contact between the plug pins and the circuit board causing the plug pins to bend or break is avoided. During installation, the bottom surface of the laser can be made to contact with the circuit board to reduce the volume of the overall device composed of the laser and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings introduced below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0033] Figure 1 A top view of a laser provided by an embodiment of the present invention;

[0034] Figure 2One of the bottom views of the laser provided by the embodiment of the present invention;

[0035] Figure 3 One of the side views of the laser provided by the embodiment of the present invention;

[0036] Figure 4 A schematic diagram of the structure of a laser chip assembly provided by an embodiment of the present invention;

[0037] Figure 5 One of the cross-sectional views of a laser provided by an embodiment of the present invention;

[0038] Figure 6 A second cross-sectional view of a laser provided by an embodiment of the present invention;

[0039] Figure 7 The second bottom view of the laser provided by the embodiment of the present invention;

[0040] Figure 8 The second side view of the laser provided by the embodiment of the present invention;

[0041] Fig. 9 The third bottom view of the laser provided by the embodiment of the present invention;

[0042] Fig.10 A schematic diagram of the structure of a laser provided in an embodiment of the present invention;

[0043] Fig.11 For along Fig.10 Cross-sectional view along the a-a' direction;

[0044] Fig.12 One of the cross-sectional views of the insulating block provided by the embodiment of the present invention;

[0045] Fig.13 A second cross-sectional view of an insulating block provided in an embodiment of the present invention;

[0046] Fig.14 It is a schematic diagram of the arrangement structure of the laser chip assembly in the related art;

[0047] Fig.15 for Fig.14 Schematic diagram of the output light spot of the laser chip assembly array shown;

[0048] Fig.16 A schematic diagram of the arrangement structure of the laser chip assembly provided in an embodiment of the present invention;

[0049] Fig.17 A third cross-sectional view of a laser provided by an embodiment of the present invention;

[0050] Fig.18 A schematic structural diagram of a projection laser projection device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0051] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described below with reference to the accompanying drawings and examples. However, the exemplary embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concepts of the exemplary embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained using the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate the relative position relationship and do not represent the true proportions.

[0052] At present, laser projection technology is developing very rapidly, and laser, as one of its core components, plays an irreplaceable role. Semiconductor lasers are produced by packaging chips after they are manufactured. Therefore, the packaging capability of lasers has a significant impact on the application, cost, performance and other indicators of lasers.

[0053] Current lasers are usually packaged in tube shells, with pins extending from the sides of the tube shell. The pins are then welded to the external circuit. The whole process is relatively complicated and requires high strength for the pins. There is a risk of the pins breaking after secondary welding, and this connection method also makes the laser occupy a larger space, which is not conducive to the miniaturization design of the entire system.

[0054] In view of this, an embodiment of the present invention provides a laser, which can solve the problem of the large space occupied by the laser and is conducive to the miniaturization design of the entire system.

[0055] Figure 1 A top view of a laser provided by an embodiment of the present invention; Figure 2 One of the bottom views of the laser provided by the embodiment of the present invention; Figure 3 This is one of the side views of the laser provided by the embodiment of the present invention.

[0056] like Figure 1 to Figure 3 As shown, the laser includes: a tube shell 101, a base plate 102, a laser chip assembly 20, an insulating block 30 and a pin pin 40.

[0057] The tube shell 101 and the bottom plate 102 form a receiving space 10 for receiving the laser chip assembly 20, and the laser chip assembly 20 is packaged. In the embodiment of the present invention, the bottom of the tube shell 101 includes an opening, the bottom plate 102 is embedded in the opening, and a notch is respectively provided on both side edges of the bottom of the tube shell 101, and two insulating blocks 30 are respectively located in the notches on both sides of the tube shell 101, and the insulating blocks 30 are welded to the tube shell 101 and the bottom plate 102.

[0058] At present, the shell is usually made of metal materials. In order to adapt to the miniaturization of high-power semiconductor lasers in the visible light band, ceramic materials are gradually introduced to replace metals. However, due to the high requirements of high-power semiconductors for heat dissipation, the bottom heat dissipation medium needs to be a metal material with a high thermal conductivity. However, there is a mismatch in thermal expansion coefficients between metal and ceramic welding. The heat released during welding will cause ceramic cracks, which directly affects the airtightness of the shell.

[0059] In the embodiment of the present invention, the tube shell 101 can be made of Kovar alloy, the bottom plate 102 can be made of a metal material with a high thermal conductivity, such as oxygen-free copper, and the insulating block 30 can be made of a ceramic material. Kovar alloy is used as a transition material for welding ceramics and oxygen-free copper, the oxygen-free copper bottom plate is embedded in the Kovar alloy tube shell, and a gap for arranging the ceramic insulating block is left at the bottom of the Kovar ring alloy tube shell. Since the thermal expansion coefficient of Kovar alloy is compatible with that of ceramics, the welding stress can be effectively reduced, the risk of ceramic cracking can be effectively reduced, and the reliability and airtightness of the tube shell can be improved.

[0060] The welding between the insulating block 30 and the tube shell 101 and the bottom plate 102 is completed by a highly reliable welding process such as brazing, and the thermal expansion coefficients of the various materials are matched, so there is no risk in welding and the overall strength is guaranteed. In order to ensure uniform force during later use and installation, the insulating block 30 can be set in the middle of the side of the tube shell 101.

[0061] Figure 4 A schematic structural diagram of a laser chip assembly provided in an embodiment of the present invention.

[0062] like Figure 1 and Figure 4 As shown, a plurality of laser chip assemblies 20 are fixed on the base plate 102. The laser chip assembly 20 includes a laser chip 201 and a heat sink 202. The laser chip 201 and the heat sink 202 are welded by a high-precision eutectic welding machine to form a laser chip assembly, also known as a Cos (Chip on submount, referred to as Cos) assembly. The heat sink 202 is used to dissipate heat for the laser chip 201, and can also be generally made of metal materials, which is not limited here. In an embodiment of the present invention, the base plate 102 can be made of oxygen-free copper, and the laser chip assembly 20 is fixed on the base plate 102, which can quickly dissipate heat for the laser chip.

[0063] like Figure 1 and Figure 4 As shown, a plurality of reflectors 203 are also provided in the tube shell. Usually, one reflector 203 corresponds to one laser chip assembly 20. The reflector 203 is located at the light-emitting side of the corresponding laser chip assembly 20 and is used to receive the emitted light of the corresponding laser chip assembly 20 and reflect it in a set direction.

[0064] The reflector 203 is used to refract the emitted light of the laser chip assembly 20 . Usually, the angle between the reflective surface of the reflector 203 and the light emitting direction of the laser chip assembly 20 can be 45°.

[0065] Figure 5 This is one of the cross-sectional views of the laser provided by an embodiment of the present invention.

[0066] like Figure 1 to Figure 3 and Figure 5 As shown, a portion of the insulating block 30 located in the notch of the tube shell 101 is located inside the tube shell, and a plurality of mutually insulated conductive parts 301 are provided in the insulating block 30, one end of the conductive part 301 is located on the surface of the insulating block inside the tube shell, and the other end of the conductive part 301 is located on the bottom surface of the insulating block away from the tube shell. A plurality of pins 40 are connected to the plurality of conductive parts 301 located on the bottom surface of the insulating block in a one-to-one correspondence.

[0067] The current tube shell usually uses pins that are led out from the side of the tube shell, and then the pins are welded to the external circuit. This process requires a secondary welding process, which has high requirements on the strength of the pins. In addition, the pins are prone to bending after soldering, which may cause the risk of breaking, affecting reliability. In the embodiment of the present invention, the plug pins 40 are led out from the bottom of the insulating block 30, which can be plugged into the external circuit. This simplifies the way the laser is electrically connected to the external circuit, eliminates the need for soldering, and reduces the damage to the pins caused by soldering. At the same time, it can also reduce the space occupied by the laser, which is conducive to the miniaturization design of the entire system.

[0068] A plurality of conductive parts 301 are provided in the insulating block 30, one end of the conductive part 301 extends to the inside of the tube shell for connecting the laser chip assembly 20, and the other end of the conductive part 301 extends to the bottom of the insulating block 30 to connect the pin 40, and the pin 40 is plugged into the external circuit, thereby realizing the connection between the laser chip assembly 20 and the external circuit through the conductive part 301.

[0069] The conductive part in the insulating block 30 is prepared by high-temperature co-fired multilayer ceramic (HTCC), and the green ceramic sheet is printed with a metallized pattern, and a multilayer ceramic tube shell green body is formed by a lamination isostatic pressing process. The multilayer ceramic tube shell green body is hot cut to form a single multilayer ceramic tube shell green body unit. The green body unit with a side wall cavity is printed on the side and then sintered to form the insulating block 30 with the conductive part 301.

[0070] The insulating block 30 is made of ceramic, the conductive part 301 is made of a conductive medium such as metal, and the plug pin 10 can be made of a conductive material such as an alloy. In order to ensure the strength of the plug pin 10, its length can be set to 0.3mm to 0.6mm, which is not limited here.

[0071] Figure 6 A second cross-sectional view of a laser provided by an embodiment of the present invention; Figure 7 The second bottom view of the laser provided by the embodiment of the present invention; Figure 8 The second side view of the laser provided in the embodiment of the present invention.

[0072] like Figure 3 , Figure 5 , Figure 6 to Figure 8 As shown, in the embodiment of the present invention, the bottom surface of the tube shell 101 is flush with the bottom surface of the base plate 102, and at least a portion of the bottom surface of the insulating block 30 where the plug pins 40 are provided is higher than the bottom surface of the base plate 102, so that the bottom surface of the insulating block where the plug pins 40 are provided is recessed into the tube shell, thereby reducing the volume of the laser and protecting the plug pins 40 during transportation of the laser; in addition, when the laser is installed on the circuit board, the problem of hard contact between the plug pins 40 and the circuit board causing the plug pins 40 to bend or break is avoided. During installation, the bottom surface of the laser can be made to contact with the circuit board, thereby reducing the volume of the overall device composed of the laser and the circuit board.

[0073] In some embodiments, Figure 3 and Figure 5 As shown, the bottom surface of the insulating block 30 is a plane, and the bottom surface of the insulating block 30 is higher than the bottom surface of the bottom plate 102, that is, the thickness of the insulating block 30 is reduced so that the insulating block 30 as a whole is recessed into the tube shell, thereby simplifying the structure of the insulating block 30.

[0074] In some embodiments, Figure 6 to Figure 8As shown, the bottom surface of the insulating block 30 is recessed inwards in the partial area where the pin pins 40 are arranged, and the other areas of the bottom surface of the insulating block 30 are flush with the bottom surface of the bottom plate 102. In this way, the bottom surface of the insulating block 30 is still flush with the bottom surface of the tube shell 101, avoiding the edge of the bottom plate 102 from being exposed. The part where the pin pins 40 are arranged is recessed inwards to protect the pin pins.

[0075] like Figure 5 and Figure 6 As shown, the insulating block 30 can be set as a simple rectangular structure. The surface of the insulating block 30 in contact with the base plate 102 is the contact surface d, which is stepped. The contact surface d is in contact with the side wall of the base plate 102 and overlaps the surface of the base plate 102, so that the insulating block 30 can extend a certain distance above the base plate 102. On the one hand, the welding reliability between the insulating block 30 and the base plate 102 can be guaranteed. On the other hand, the distance between the laser chip assembly and the conductive part can be shortened, which is convenient for welding the laser chip assembly.

[0076] Fig. 9 The third bottom view of the laser provided in the embodiment of the present invention.

[0077] In some embodiments, Fig. 9 As shown, a notch k is respectively provided on both sides of the bottom plate 102 relative to the position of the insulating block 30, and the two insulating blocks 30 are respectively inserted into the two notches k of the bottom plate 102 to contact the side surfaces of the bottom plate 102. The notches are provided on the bottom plate 102 so that the insulating block 30 can extend into the tube shell by a certain distance, thereby reducing the distance between the insulating block 30 and the laser chip assembly and the conductive part on the insulating block 30, which is conducive to ensuring the welding reliability between the laser chip assembly and the conductive part. In addition, the notch k is provided on the bottom plate 102, and it is no longer necessary to change the shape of the insulating block 30, and a rectangular insulating block can be directly used, which is conducive to simplifying the manufacturing process of the insulating block.

[0078] In some embodiments, in order to ensure that the portion of the insulating block 30 located outside the tube shell 101 is consistent with the shape of the tube shell 101, the insulating block 30 can also be cut according to the outer contour of the tube shell 101 so that there is no protruding part on the surface of the tube shell 101, which is consistent with the shape of the tube shell currently used.

[0079] Fig.10 A schematic diagram of the structure of a laser provided in an embodiment of the present invention, Fig.11 For along Fig.10 The cross-sectional view along the a-a' direction, Fig.12 This is one of the cross-sectional views of the insulating block provided in the embodiment of the present invention.

[0080] In some embodiments, Figure 10 to Figure 12As shown, the cross section of the insulating block 30 is in the shape of a "convex" character. For the convenience of explanation, the surface of the insulating block 30 located under the tube shell and in contact with the tube shell is called the top surface a, the surface located outside the tube shell is called the outer surface b, the surface located inside the tube shell is called the inner surface c, the surface in contact with the bottom plate is called the contact surface d, and the surface where the pin pins 40 are provided is called the bottom surface e. In the embodiment of the present invention, the top surface a of the insulating block 30 is welded to the tube shell, and the top surface a is the surface with the highest height of the insulating block 30. The outer surface b of the insulating block 30 has the same profile as the tube shell, so that there is no protruding surface in the outer shape of the tube shell, which is consistent with the outer shape of the tube shell commonly used. The inner surface c of the insulating block 30 is a step surface, that is, the thickness of the insulating block 30 close to the bottom plate 102 is less than the thickness of the side away from the bottom plate 102, which is more conducive to the wire welding of the laser chip assembly to the conductive part of the insulating block 30. The bottom surface e of the insulating block 30 and the bottom surface of the bottom plate 102 are flush with each other, and the bottom surface of the bottom plate 102 is flush with the bottom surface of the tube shell, so that the bottom surface of the tube shell is a plane.

[0081] Fig.13 This is a second cross-sectional view of the insulating block provided in the embodiment of the present invention.

[0082] like Fig.13 As shown, a plurality of pads H are disposed on the surface of the insulating block 30 facing away from the bottom plate 102 . The plurality of pads H are arranged at intervals on the surface of the insulating block. The plurality of pads H are connected to the plurality of conductive parts 301 in a one-to-one correspondence.

[0083] The pad H is used to electrically connect the laser chip assembly. The pad H is usually a gold-plated area on the surface of the insulating block, which contacts the conductive part 301 to form an electrical connection. After the laser chip assembly is wire-bonded and welded to the gold-plated area, a circuit connection can be formed inside and outside the tube shell.

[0084] In an embodiment of the present invention, the laser includes a plurality of laser chip assemblies for emitting lasers of different colors, and specifically may include a plurality of first laser chip assemblies, a plurality of second laser chip assemblies, and a plurality of third laser chip assemblies; the first laser chip assembly, the second laser chip assembly, and the third laser chip assembly may respectively emit red laser, green laser, and blue laser, which is not limited here.

[0085] In the related art, the arrangement of laser chip components is shown in Fig.14 , Fig.14 is a schematic diagram of the arrangement structure of the laser chip assembly in the related art, Fig.15 for Fig.14 Schematic diagram of the output light spot of the laser chip component array shown in FIG. Fig.14As shown, taking the first laser chip assembly as a red laser chip assembly R, the second laser chip assembly as a green laser chip assembly G, and the third laser chip assembly as a blue laser chip assembly B as an example, the red laser chip assembly R is arranged in two rows, the green laser chip assembly G is arranged in one row, and the blue laser chip assembly B is arranged in one row, and each row of laser chip assemblies has 7 to 8 components. Fig.15 As shown, the size of the laser spot emitted by the laser along the fast axis is larger than the size along the slow axis, and the laser spot will be arranged along the slow axis. After the laser beams of different colors are combined, they will be incident on the focusing lens. The light collecting ability of the focusing lens is limited by the size L1 of the laser's output beam in the slow axis direction. Due to processing capacity limitations, the maximum size of the focusing lens can usually reach 1.5mm. Therefore, in order to make the laser's output beam easier to combine, shape and homogenize, an embodiment of the present invention provides an optimized arrangement of laser chip components.

[0086] Fig.16 A schematic diagram of the arrangement structure of the laser chip assembly provided in an embodiment of the present invention.

[0087] like Fig.16 As shown, taking the first laser chip assembly as a red laser chip assembly R, the second laser chip assembly as a green laser chip assembly G, and the third laser chip assembly as a blue laser chip assembly B as an example, a plurality of red laser chip assemblies R are arranged in at least one row along a first direction and a second direction, a plurality of green laser chip assemblies G are arranged in at least one row along the first direction and the second direction, and a plurality of blue laser chip assemblies B are arranged in at least one row along the first direction and the second direction; wherein the first direction and the second direction intersect.

[0088] In an embodiment of the present invention, the spacing between two adjacent rows of laser chip assemblies is reduced, and the number of laser chip assemblies in each row is 3 to 5. This reduces the size of the laser's output light beam on the slow axis without affecting the brightness. Compared with the related art, the size of the laser's output light beam on the slow axis is reduced from L1 to L2, which is compatible with the current back-end optical architecture, making light combination simpler and allowing the light beams after light combination to be incident on the focusing lens.

[0089] like Fig.16 As shown, the red laser chip assembly R, the green laser chip assembly G and the blue laser chip assembly B are arranged in two rows, respectively, and the laser chip assemblies of each row with the same laser emission color are arranged adjacent to each other. The laser chip assemblies 20 of the same row are connected in series with each other, and the two ends of a row of laser chip assemblies 20 connected in series are electrically connected to a pad H on both sides, respectively, and the laser chip assemblies of each row with the same laser emission color are electrically connected to the same pad H. In this way, the number of conductive parts and pads can be reduced, and the structure of the insulating block can be simplified.

[0090] Fig.17 This is the third cross-sectional view of the laser provided in the embodiment of the present invention.

[0091] like Fig.17 As shown, the laser also includes a cover plate not shown in the figure, and a metal frame is arranged around the cover plate for welding with the tube shell. Specifically, the cover plate can be welded to the tube shell by using a parallel sealing welding technology. The sealing glass is fixed on the cover plate by a green glue, and the collimating lens 50 is located on the side of the sealing glass away from the tube shell 101. In the specific implementation, the collimating lens 50 can be an aspheric lens. Through the alignment process control, the aspheric collimating lens 50 is collimated and debugged, and fixed on the cover plate by UV glue.

[0092] Based on the same inventive concept, an embodiment of the present invention further provides a laser projection device, Fig.18 A schematic structural diagram of a projection laser projection device provided in an embodiment of the present invention.

[0093] like Fig.18 As shown, the laser projection device includes: a laser 1, a circuit board 2, a light combining component 3, a focusing lens 4, an illumination system 5 and a projection lens 6.

[0094] Laser 1 can use any of the above lasers. The laser includes a tube shell and a base plate. The bottom surface of the tube shell is provided with an opening, and the base plate is located in the opening of the tube shell. A notch is provided on the two side edges of the bottom of the tube shell, and two insulating blocks are respectively located in the notches on both sides of the tube shell. The insulating block is welded to the tube shell and the base plate. The tube shell can be made of Kovar alloy, the base plate can be made of metal materials with high thermal conductivity, such as oxygen-free copper, and the insulating block can be made of ceramic material. Kovar alloy is used as a transition material for welding ceramics and oxygen-free copper, and the oxygen-free copper base plate is embedded in the Kovar alloy tube shell. A notch for setting the ceramic insulating block is left at the bottom of the Kovar ring alloy tube shell. Since the thermal expansion coefficient of Kovar alloy is compatible with that of ceramics, the welding stress can be effectively reduced, the risk of ceramic cracking can be effectively reduced, and the reliability and airtightness of the tube shell can be improved. A plurality of conductive parts are provided in the insulating block for connecting the laser chip assembly in the tube shell. Pins are led out from the bottom of the insulating block, which can be plugged into an external circuit.

[0095] Accordingly, the circuit board 2 is provided with a plurality of connection holes, and the pins of the laser 1 are inserted into the corresponding connection holes of the circuit board 2 to realize electrical connection with the circuit board. This simplifies the way of electrical connection between the laser and the external circuit, eliminates the need for solder, reduces the damage to the pins caused by solder, and at the same time reduces the space occupied by the laser, which is conducive to the miniaturization design of the entire system. In specific implementation, the circuit board 2 can adopt a component with specific circuits or driving functions such as a printed circuit board (PCB), which is not limited here.

[0096] The light combining component 3 is located at the light output side of the laser 1. Specifically, Fig.18 As shown, when the laser 1 includes a red laser chip assembly R, a green laser chip assembly G and a blue laser chip assembly B, the light combining assembly 3 may include a reflector 31 , a first light combining mirror 32 and a second light combining mirror 33 .

[0097] Among them, the reflector 31 is located at the light-emitting side of the blue laser chip assembly B; the first light-combining mirror 32 is located at the intersection of the output light of the reflector 31 and the output light of the green laser chip assembly G; the second light-combining mirror 33 is located at the intersection of the output light of the first light-combining mirror 32 and the output light of the red laser chip assembly R.

[0098] The reflector 31 is used to reflect the blue laser beam emitted by the blue laser chip assembly B to the first light combining mirror 32; the first light combining mirror 32 is used to transmit the blue laser beam emitted by the blue laser chip assembly B, and reflect the green laser beam emitted by the green laser chip assembly G; the second light combining mirror 33 is used to transmit the blue laser beam and the green laser beam emitted by the blue laser chip assembly B and the green laser chip assembly G, and reflect the red laser beam emitted by the red laser chip assembly R. Thus, the red, green and blue laser beams are combined, and the combined beam is emitted from the side of the second light combining mirror 33.

[0099] The focusing lens 4 is located on the light-emitting side of the light-combining component 3. Since the laser chip components of the laser in the embodiment of the present invention are arranged in an array, the laser chip components originally arranged in one row can be arranged into at least two rows by reducing the spacing between two adjacent rows of laser chip components, thereby reducing the size of the laser output light beam along the slow axis direction, so that the light beam after light combination can be completely incident on the focusing lens 4 to converge the laser beam.

[0100] The illumination system 5 is located at the light-emitting side of the focusing lens 4, and is used to shape and homogenize the incident light beam. The illumination system may include a light pipe 51 and a light modulator 52, and the light pipe is used to homogenize the incident light beam, so that the intensity distribution of the outgoing light beam is more uniform, satisfying the conditions of the incident light modulator 52. The light modulator 52 may use a digital micromirror device (DMD for short), which is a reflective light valve device. The surface of the DMD includes thousands of tiny reflectors, each of which can be driven to deflect individually, and the brightness of the outgoing light can be modulated by controlling the deflection angle of the DMD.

[0101] A reflection component 53 can also be provided before the optical path of the light modulator 52, and the reflection component 53 can be a total reflection prism. Generally, the reflection component 53 includes two total reflection prisms arranged opposite to each other. When the laser beam is incident on one of the total reflection prisms at a set angle, the incident angle satisfies the total reflection condition of the total reflection prism, and the total reflection prism can reflect all the light to the light modulator 52. After being modulated by the light modulator 52, the light is emitted to the total reflection prism again. At this time, the light no longer satisfies the total reflection condition and can be emitted smoothly; after the light is refracted by another total reflection prism, the modulated light can be vertically incident on the projection lens 6.

[0102] In addition, the reflective component 53 can also be a reflector. After the laser beam is incident on the reflector at a set angle, the reflector reflects the light to the light modulator 52 in a direction that satisfies the incident angle of the light modulator 52. The light modulator 52 modulates the light and then emits it to the projection lens 6.

[0103] The outgoing light modulated by the light modulator 52 needs to be imaged by the projection lens 6 so as to project the image on the projection screen or at a set position. The viewer can view the display image by viewing the projection screen.

[0104] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0105] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A laser, characterized in that: include: A tube shell; the bottom of the tube shell includes an opening; A bottom plate, embedded in the opening of the tube shell; A notch is respectively provided on both side edges of the bottom of the tube shell; A plurality of laser chip components are fixed on the base plate; Two insulating blocks are respectively located in the gaps on both sides of the tube shell; a part of the insulating block is located inside the tube shell, and a plurality of mutually insulated conductive parts are arranged in the insulating block, one end of the conductive part is located on the surface of the insulating block inside the tube shell, and the other end of the conductive part is located on the bottom surface of the insulating block away from the tube shell; A plurality of pins connected one by one to the plurality of conductive parts located on the bottom surface of the insulating block; The bottom surface of the bottom plate is flush with the bottom surface of the tube shell, and at least a portion of the bottom surface of the insulating block where the plug pins are arranged is higher than the bottom surface of the bottom plate.

2. The laser according to claim 1, characterized in that The bottom surface of the insulating block is a plane, and the bottom surface of the insulating block is higher than the bottom surface of the bottom plate; Alternatively, the bottom surface of the insulating block is recessed inwardly in a partial area where the plug pins are arranged, and the rest of the bottom surface of the insulating block is flush with the bottom surface of the base plate.

3. The laser according to claim 1, characterized in that The tube shell is made of Kovar alloy, the bottom plate is made of oxygen-free copper, and the insulating block is made of ceramic; The insulating block, the tube shell and the bottom plate are welded to each other.

4. The laser according to claim 2, characterized in that A surface of one side of the insulating block close to the bottom plate is in a stepped shape, and the stepped surface of the insulating block contacts the side wall of the bottom plate and overlaps the surface of the bottom plate.

5. The laser according to claim 2, characterized in that A notch is respectively arranged on both sides of the bottom plate relative to the position of the insulating block, and the two insulating blocks are respectively inserted into the two notches of the bottom plate to contact the side surfaces of the bottom plate.

6. The laser according to claim 4 or 5, characterized in that The surface of the insulating block facing away from the bottom plate is a step surface, and the thickness of the insulating block on the side close to the bottom plate is smaller than the thickness on the side away from the bottom plate.

7. The laser according to claim 6, characterized in that A plurality of pads are disposed on a surface of the insulating block facing away from the bottom plate. The plurality of pads are arranged at intervals on the surface of the insulating block, and the plurality of pads are connected to the plurality of conductive parts in a one-to-one correspondence.

8. The laser according to claim 1, characterized in that The length of the plug pin is 0.3 mm to 0.6 mm.

9. The laser according to any one of claims 1 to 5, characterized in that: The plurality of laser chips are divided into a plurality of first laser chip assemblies, a plurality of second laser chip assemblies and a plurality of third laser chip assemblies; the colors of lasers emitted by the first laser chip assemblies, the second laser chip assemblies and the third laser chip assemblies are different; The plurality of first laser chip assemblies are arranged in at least one row along the first direction and the second direction; the plurality of second laser chip assemblies are arranged in at least one row along the first direction and the second direction; the plurality of third laser chip assemblies are arranged in at least one row along the first direction and the second direction; the first direction and the second direction intersect; The number of laser chip assemblies in the same row is 3 to 5, and the laser chip assemblies in the same row are connected in series, and both ends of the laser chip assemblies in a row connected in series are electrically connected to one of the conductive parts on both sides respectively; The rows of laser chip assemblies emitting laser beams of the same color are arranged adjacent to each other, and the rows of laser chip assemblies emitting laser beams of the same color are electrically connected to the same conductive part.

10. A laser projection device, characterized in that: It comprises a laser and a circuit board as claimed in any one of claims 1 to 9, wherein the laser is plugged into the circuit board; The laser projection device also includes: A light combining component, located at the light output side of the laser; A condenser lens, located on the light-emitting side of the light-combining component; An illumination system, located at the light-emitting side of the condenser lens; the illumination system comprises a light modulator; The projection lens is located at the light output side of the light modulator.

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