Control method of slicing machine, medium and computer equipment

Abstract

The invention relates to the technical field of hard and brittle material processing, and particularly provides a control method of a slicing machine, a computer readable storage medium and computer equipment. The slicing machine aims at solving the technical problem of how to judge whether cutting lines are jumped in a line net formed by the cutting lines when an existing slicing machine achieves automatic operation planned by an inventor. The slicing machine comprises a cutting mechanism wound with a cutting line, and the control method comprises the steps that under the condition that the cutting mechanism operates, image data of the cutting mechanism and image data of a line net containing the cutting line are collected; analyzing the image data, and judging whether the cutting line is jumped or not; and when the cutting wire jumps, abnormal feedback information corresponding to the cutting wire jumps is given. By means of the structure, whether the cutting line jumps in the line net or not can be judged by replacing manual observation through a visual collection mode.

Description

Technical Field

[0001] The invention relates to the technical field of hard and brittle material processing, and specifically provides a control method for a slicer, a computer-readable storage medium, and a computer device. Background Art

[0002] Taking the silicon rod as an example, the processing equipment usually includes a cutter for cutting the rod (round rod) according to the length specification, a squarer for cutting the round rod of a certain length into a square rod, a grinder for grinding the square rod (grinding surface and chamfer) (such as usually including rough grinding and fine grinding), and a slicer for slicing the square rod with the precision reaching the standard after grinding. The working principle of the slicer is as follows: after the square rod is bonded to the wafer support, the cutting wire (such as diamond wire) is reciprocated at high speed to slice the square rod. Each complete slicing operation of the wire net is called a one-knife cutting operation of the slicer.

[0003] The slicing operation of the existing slicer is concentrated near the slicing station. Each cutting operation usually includes dozens of operation steps and is usually completed by one or two operators. This processing method often has the following problems: the operation of the slicer requires high professionalism and proficiency of the operator, and the labor cost is high; the large number of steps makes it easy for the operator to make mistakes, and once the operator makes a mistake, it may cause different degrees of cutting abnormalities. In view of this, after fully studying and analyzing the operation of the slicer, the inventor aims to propose a process flow that can realize automated slicing operations and a structural framework that is compatible with it.

[0004] Taking the current non-automated operation as an example, the process of silicon wafer slicing includes the following steps: During the slicing operation, each diamond wire segment of the wire mesh is wound in the wire groove at the corresponding position on the cutting main roller, so that the slicing operation of the silicon rod is completed by wire saw cutting accompanied by the reciprocating motion of the wire mesh. However, during the slicing process, there may be a jumper problem between adjacent diamond wire segments in the wire mesh. Specifically, the diamond wire corresponding to one or several wire grooves has crossed the groove and overlapped with the diamond wire in the adjacent wire groove. If the jumper problem is not handled in time, it will cause wire breakage, affecting the sustainability of the slicer's automated operation and also affecting the quality of the single crystal silicon wafer. Summary of the invention

[0005] The present invention aims to at least partially solve at least a part of the above-mentioned technical problems. Specifically, it aims to solve the technical problem faced by existing slicers during the process of realizing automated operation, that is, how to judge whether the diamond wire in the wire net wound on the cutting main roller jumps during the slicing operation.

[0006] In a first aspect, the present invention provides a control method for a slicer, wherein the slicer includes a cutting mechanism around which a cutting line is wound, and the control method includes: when the cutting mechanism is in operation, collecting image data of the cutting mechanism and a wire network including the cutting line; analyzing the image data to determine whether the cutting line is jumped; and when the cutting line is jumped, providing abnormal feedback information corresponding to the cutting line jump.

[0007] Through such a structure, it is possible to determine whether there are cutting wire jumps in the wire network by replacing manual observation with a visual acquisition method, and on this basis, it is expected to achieve automation of the slicer.

[0008] In addition, it is understandable that those skilled in the art can process the image data in any reasonable image processing manner, so that after the image processing, it can be more accurately determined whether the cutting line jump occurs.

[0009] For the control method of the above-mentioned slicer, in a possible implementation manner, the "collecting image data of the cutting mechanism and the wire network including the cutting line when the cutting mechanism is in operation" includes: obtaining position data between adjacent cutting line segments in the wire network; accordingly, the "analyzing the image data to determine whether the cutting line jumps" includes: determining whether the cutting line jumps based on the position data.

[0010] Through such a structure, a possible method for judging whether a cutting line jumps is provided.

[0011] It is understandable that those skilled in the art can determine the specific form of the position data and its corresponding relationship with whether the cutting line is skipped according to actual needs. For example, the position data can be distance, projection length / height / distance, relative position relationship, angle, etc.

[0012] Regarding the control method of the slicer, in a possible implementation manner, the “determining whether the cutting line jumps according to the position data” includes: determining that the cutting line jumps when a jump value exists in the position data.

[0013] Through such a structure, a specific method for determining the cutting line jumper is provided.

[0014] Specifically, when the diamond wires of the wire mesh do not jump, the distance data between multiple groups of adjacent diamond wires obtained based on the image data are roughly equal. In the case of one or more diamond wires in the wire mesh jumping, there will be a jump in the distance data. Specifically, when jumping occurs, two diamond wires will appear in the same wire slot. At this time, the distance between the two diamond wires in the same wire slot is close to 0, and the distance between the diamond wire that jumps and the adjacent diamond wire farther away is twice the distance that should be between the two in the case of no jumping.

[0015] It is understandable that those skilled in the art can determine the specific quantization level of the jump value and the manner of judging the occurrence of the jump value according to the actual situation, such as according to the aforementioned difference and other manners such as ratio.

[0016] Regarding the control method of the slicer, in a possible implementation, in the step of "analyzing the image data to determine whether the cutting line is skipped", the "analyzing the image data" includes: binarizing the image data.

[0017] With such a configuration, it is possible to more clearly highlight two elements that are strongly related to the judgment: the cutting wire (such as a wire mesh usually including diamond wires) and the cutting mechanism (such as mainly including a cutting main roller).

[0018] Regarding the control method of the slicer, in a possible implementation manner, before binarizing the image data, the control method includes: sharpening the image data.

[0019] With such a configuration, it is possible to more accurately identify the wire mesh.

[0020] Specifically, since the jumper needs to clearly identify the cutting lines in the wire network (for example, the cutting line after crossing the slot will be in the same slot with the original cutting line of another slot, then two cutting lines can be identified in the same slot), it has higher recognition requirements. By sharpening the image data, the characteristics of the cutting lines in the wire network can be highlighted, which is more conducive to further processing of the image data later.

[0021] Regarding the control method of the slicer, in a possible implementation manner, after binarization processing is performed on the image data, the control method includes: performing threshold segmentation on the image data.

[0022] With such a configuration, it is possible to more effectively identify the area corresponding to the dicing line and the area corresponding to the wafer support.

[0023] Regarding the control method of the slicer, in a possible implementation manner, the control method further includes: performing feature extraction on the image data.

[0024] With such a configuration, it is possible to extract information meaningful for analysis from image data and perform more effective analysis.

[0025] With respect to the control method of the slicer described above, in one possible implementation, the “collecting image data of the cutting mechanism and the wire mesh including the cutting line while the cutting mechanism is operating” includes: collecting image data of the cutting mechanism and the wire mesh including the cutting line while the cutting mechanism is operating and after the slicer has finished warming up.

[0026] This configuration provides the possibility of selecting the timing of the jumper detection, such as triggering the automatic jumper detection when the warm-up program is completed.

[0027] For the control method of the above-mentioned slicer, in a possible implementation manner, the slicer includes a feed mechanism, and the "collecting image data of the cutting mechanism and the wire mesh including the cutting line when the cutting mechanism is in operation" includes: collecting image data of the cutting mechanism and the wire mesh including the cutting line according to the cutting time of the slicer and / or according to the feed depth of the feed mechanism when the cutting mechanism is in operation.

[0028] This configuration provides the possibility of selecting the timing for performing the wire jump detection.

[0029] For example, when the cutting of the single crystal silicon wafer reaches a specific time point or the feed mechanism moves to a specific feed depth (also called cutting depth), the automatic line jumper detection is triggered. Together with the automatic line jumper detection corresponding to the thermal engine program mentioned above, the automatic line jumper detection is usually performed 1 to 4 times during the cutting process.

[0030] For the control method of the above-mentioned slicer, in a possible implementation manner, the "in the case of a cutting line jumper, providing abnormal feedback information corresponding to the cutting line jumper" includes: in the case of a cutting line jumper, issuing a reminder message and / or adjusting the operating parameters of the cutting mechanism.

[0031] Through such a structure, a possible form of abnormal feedback information is provided. For example, after determining that a jumper abnormality occurs, an alarm is issued to remind the relevant maintenance personnel to eliminate the jumper problem in time to ensure the operation quality of the slicer.

[0032] For the control method of the above-mentioned slicer, in a possible implementation manner, the slicer includes a cutting chamber, and the cutting chamber is provided with an operating door, and the "collecting image data of the cutting mechanism and the wire mesh including the cutting line" includes: collecting the image data of the cutting mechanism and the wire mesh including the cutting line by at least one of the image acquisition devices; wherein the image acquisition device is arranged at a position of the slicer close to the operating door.

[0033] This configuration provides the possibility of arranging the image acquisition device on the microtome.

[0034] It is understandable that those skilled in the art can determine the number of image acquisition devices, their arrangement on the slicer, and their relative positions relative to the area where the image to be acquired is located, etc., according to actual needs. In order to determine whether there is a problem of cutting line jumper, the key position of image acquisition should be the position where the diamond wire contacts the cutting mechanism. In view of this, if the image acquisition device (such as a camera, etc.) can include one or more, the image acquisition device can be on the left and / or right side of the frame of the cutting chamber, facing the silicon rod or at a certain angle to the silicon rod, to capture images including the cutting line and the cutting main roller of the cutting mechanism. For example, the image acquisition device may include but is not limited to a camera, an industrial camera, an image sensor, etc.

[0035] Regarding the control method of the slicer, in a possible implementation, the cutting mechanism includes a plurality of main cutting rollers, and at least one main cutting roller is configured with at least one of the image acquisition devices.

[0036] Through such a configuration, a specific configuration mode of the image acquisition device is provided, such as multiple cutting main rollers can share one or more image acquisition devices, or each cutting main roller can be configured with one or more image acquisition devices.

[0037] For the control method of the above-mentioned slicer, in a possible implementation, the image acquisition device includes one or more image acquisition devices arranged along the axial direction of the wire mesh of the cutting line; and / or the image acquisition device is arranged on the slicer in a movable manner along the axial direction of the wire mesh of the cutting line; and / or the image acquisition device is rotatably arranged on the slicer; and / or the image acquisition device is arranged at a set angle relative to the cutting mechanism.

[0038] Through such a configuration, a possible configuration mode of the image acquisition device on the microtome is provided.

[0039] Specifically, by setting multiple or movable devices along the axial direction of the wire mesh of the cutting line, more complete image information can be collected. Based on the rotatable setting method, it can be ensured that the image acquisition device obtains complete image data related to the judgment logic. By setting it at an angle, it is possible to seek to ensure the alignment effect through reasonable azimuth matching to ensure the integrity of the image data. For example, those skilled in the art can determine the number of image acquisition devices set along the axial direction of the wire mesh, the way the image acquisition device moves along the axial direction of the wire mesh, the range of rotation, the angle range, etc. according to actual needs.

[0040] In a second aspect, the present invention provides a computer-readable storage medium, the storage medium comprising a memory, the memory being suitable for storing a plurality of program codes, the program codes being suitable for being loaded and run by a processor to execute any of the aforementioned control methods for a slicer.

[0041] It can be understood that the computer-readable storage medium has all the technical effects of the control method of the slicer described in any of the above items, which will not be repeated here.

[0042] It is understood by those skilled in the art that the present invention implements all or part of the processes in the control method of the slicer, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and it can be understood that the program code includes but is not limited to the program code for executing the control method of the slicer. For the convenience of explanation, only the part related to the present invention is shown. The computer program code can be in the form of source code, object code, executable file or some intermediate form. The computer-readable storage medium may include: any entity or device, medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory, random access memory, electric carrier signal, telecommunication signal and software distribution medium that can carry the computer program code. It should be noted that the content contained in the computer-readable storage medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable storage medium does not include electric carrier signal and telecommunication signal.

[0043] In a third aspect, the present invention provides a computer device, comprising a memory and a processor, wherein the memory is suitable for storing a plurality of program codes, and the program codes are suitable for being loaded and run by the processor to execute any of the aforementioned control methods for a slicer.

[0044] It is understandable that the device has all the technical effects of any of the aforementioned control methods for slicers, which will not be described in detail herein. The device may be a computer-controlled device formed by various electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The following takes a workpiece as a silicon rod to be sliced ​​(hereinafter referred to as a silicon rod, and the product after processing is a single crystal silicon wafer) as an example, and describes a preferred embodiment of the present invention with reference to the accompanying drawings, in which:

[0046] Figure 1 A schematic structural diagram of a slicer according to an embodiment of the present invention is shown;

[0047] Figure 2 A schematic diagram showing the judgment conditions of jumpers in a control method for a slicer according to an embodiment of the present invention; and

[0048] Figure 3 A schematic flow chart of a method for controlling a slicer according to an embodiment of the present invention is shown.

[0049] Reference numerals:

[0050] 100. Slicer; 1. Wire mesh; 2. Silicon rod; 3. Pad; 4. Feed mechanism; 5. Cutting main roller; 6. Cutting chamber frame; 71. Left operating door; 72. Right operating door; 8. Camera. DETAILED DESCRIPTION

[0051] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. For example, although the present embodiment is introduced in combination with a specific combination of operating steps, it is obvious that those skilled in the art can adjust the steps such as adding, reducing, replacing, etc. according to actual needs.

[0052] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] In addition, in order to better illustrate the present invention, numerous specific details are provided in the following specific embodiments, and those skilled in the art should understand that the present invention can also be implemented without certain specific details. In some examples, the principles of slicers, etc., which are well known to those skilled in the art, are not described in detail in order to highlight the main purpose of the present invention.

[0054] Main reference Figure 1 In a possible implementation, the slicer 100 is mainly used to use the wire mesh 1 of the wire cutting machine (such as diamond wire, etc.) to grind the silicon rod 2 (usually called square rod) with qualified grinding accuracy along its radial direction to obtain a single crystal silicon wafer. Under normal circumstances, the slicing operation is as follows: after completing the sticking (sticking the square rod to be sliced ​​to the pad 3, and then sticking the pad to the crystal support. For example, the pad can be a plastic plate, a resin plate, a glass plate, etc., such as in this example, the pad is a plastic plate), the crystal support is fixed on the feed mechanism 4. During the reciprocating movement of the wire mesh between the three cutting main rollers 5 of the wire cutting machine, the feed mechanism drives the silicon rod to approach the wire mesh, and the wire mesh can slice the square rod by wire sawing. In the process of slicing the silicon rod, the liquid supply system needs to continuously spray the cutting liquid to the slicing operation area of ​​the slicing station. The main function of the cutting liquid is to cool, lubricate and take away the silicon powder generated at the cutting seam.

[0055] In a possible embodiment, the slicer includes a cutting chamber frame 6 in which a cutting chamber is formed, and an operating door (respectively recorded as a left operating door 71 and a right operating door 72) is respectively provided on the left and right sides of the cutting chamber frame, and two cameras 8 as image acquisition devices are arranged at an angle near the left operating door in the cutting chamber (corresponding to the upper left main cutting roller and the lower cutting main roller, respectively), and a camera 8 (corresponding to the upper right main cutting roller) is arranged near the right operating door. For example, the image acquisition device can be arranged inside the cutting chamber or outside the cutting chamber. Taking the arrangement outside the cutting chamber as an example, in the case where relevant image data needs to be collected, the camera can be moved into the corresponding collection position in a movable manner. On this basis, the present invention provides an automated operation implementation method based on visual observation for whether the diamond wire jump phenomenon occurs during the operation of the slicer online.

[0056] Main reference Figure 2 and Figure 3 In a possible implementation, the control method of the slicer includes:

[0057] S301, collecting image data of each cutting main roller of the cutting mechanism and the wire web wound thereon through a camera.

[0058] Among them, after the slicer is heated up and during the cutting process, it is usually necessary to perform 1-4 automatic jumper detections according to the cutting time or the feed position. The automatic jumper detection triggers the image data acquisition signal so that the controller of the slicer or the control end such as the server can adjust the working condition of the slicer after receiving the image acquisition trigger signal, such as but not limited to opening the operating doors on both sides of the cutting chamber, adjusting the circulation state of the cutting liquid (adjusting the water outlet state of the spray pipe, closing the spray pipe above the cutting main roller), and rotating or stopping the cutting main roller at a low speed (main roller speed ≤ 100m / min). After the working condition adjustment of the slicer is completed, the image acquisition device is in place, such as being sent to a station that can automatically acquire the image data of the cutting line jumper by means of a corresponding mechanism, such as placing the three image acquisition devices in the corresponding positions of the operating doors on the left side, right side, or both sides of the cutting chamber. After it is in place, image data can also be acquired in a movable manner, such as by a specific path (such as moving along the axial direction of the cutting main roller, the moving distance should be ≥ the maximum load-camera field of view) and angle (0°<the angle between the camera and the wire mesh≤a certain angle within the range of 70°, at which the image acquisition device should be able to clearly capture the image data containing the diamond wire), and the number of image data collected should be ≥ the maximum load / camera field of view. After the acquisition is completed, the image acquisition device can be returned to its original position.

[0059] S303: sharpen the image data.

[0060] Since it is necessary to accurately identify each diamond wire segment in the wire mesh to solve the wire jump problem, the features of the diamond wire in the wire mesh can be highlighted by introducing a sharpening process to the image data.

[0061] In this example, the collected image data can be sharpened by using Gaussian filtering plus Laplace operator. Gaussian filtering is a smoothing filter that can remove noise from image data. Its basic idea is to use Gaussian kernel to convolve the image to reduce high-frequency noise; Laplace operator can extract high-frequency parts, namely edges and details, from image data. Its basic idea is to calculate the difference between pixels around pixels in the image data, and then convolve these differences with a template to produce an enhanced image. This method calculates the difference between pixels around pixels and weights them to produce an enhanced image data to highlight the edges and details of the image data. In this way, the quality of the image data can be improved, making the image data clearer and brighter.

[0062] S305: Binarize the image data.

[0063] Among them, the binarization process is to convert the collected grayscale or color image data into image data containing only two colors (usually black and white) through image binarization. By binarizing the image data, the image analysis process can be simplified, the calculation speed can be improved, the storage requirements can be reduced, and the recognition and shape analysis of the image data can be facilitated. Specifically, in order to improve the processing efficiency of the image data in the processing stage, it is necessary to binarize the image data collected by the image acquisition device. The image data after binarization becomes black and white image data, so that the wire mesh and the cutting main roller of the cutting mechanism, which are strongly related to the judgment, can be more clearly highlighted.

[0064] S307 , performing threshold segmentation on the image data after the binarization process.

[0065] Among them, threshold segmentation is to divide the image data into different areas based on grayscale value or color information. The goal of threshold segmentation is to distinguish the object of interest from the background in the image data in order to conduct targeted analysis. Taking the double threshold method threshold segmentation as an example, by setting two thresholds (upper threshold and lower threshold) to segment the image data, the noise of the image data can be effectively eliminated and the edge information of the image data can be retained. After the image data is subjected to the aforementioned binarization processing, the difference in the characteristic grayscale values ​​of the wire mesh and the cutting main roller in the black and white image data is more obvious. Based on this, through reasonable threshold setting, the threshold segmentation method can be used to effectively identify the wire mesh area and the cutting main roller area.

[0066] S309: extracting data related to this analysis from the image data.

[0067] The image data is to extract the information meaningful for analysis from the original image data for further analysis, classification or other related processing. After threshold segmentation, the wire mesh image data can be extracted by limiting the information including but not limited to the length condition and width condition corresponding to the wire mesh area in the identified diamond wire mesh area. Similarly, the image data of the cutting main roller area can be extracted by limiting the information including but not limited to the length condition and width condition corresponding to the cutting main roller in the identified cutting main roller area.

[0068] S311, obtaining the distance between adjacent diamond wire segments in the wire mesh.

[0069] Specifically, when one of the diamond wire segments jumps, the distance between the remaining adjacent diamond wires will be greater than the distance between the other two diamond wire segments that have not jumped. Specifically, assuming that the distance (slot distance) between two adjacent wire grooves on the cutting main roller is m, the distance between two diamond wire segments wound in two adjacent wire grooves on the cutting main roller is b (m≈b). When the diamond wire of the wire mesh does not jump, the multiple bs obtained based on the image data are roughly equal. When one or more diamond wire segments in the wire mesh jump, m≠b will occur.

[0070] Exemplarily, if the distance of the corresponding diamond wires is recorded as a, by comparing the distance data between two adjacent diamond wires as position data, for example, in the case of 0.1≤|ab|≤m, it can be determined that the diamond wire jump has occurred.

[0071] S313, judging whether there is a jump value in the distance between multiple adjacent diamond wire segments in the wire mesh, in this example, judging whether there is a in the distance that satisfies the aforementioned 0.1≤|ab|≤m. If so, it is determined that a diamond wire jump problem occurred during this retraction and the process proceeds to S315; if not, the slicing operation continues.

[0072] S315. In a possible implementation, in the event of a diamond wire jump, the device (corresponding to the location of the cutting room or the central control room) sends out an alarm to call the relevant operators to perform manual intervention to eliminate the jump problem in time. After the jump problem is resolved, the slicing is restored to a normal automated operation state.

[0073] It can be seen that in the control method of the slicer of the present invention, visual observation through an image acquisition device is used instead of manual observation. On this basis, whether the problem of diamond wire jumper occurs is determined based on the distance data between adjacent diamond wires in the wire network. Furthermore, in the case of a diamond wire jumper problem, the relevant operator can be prompted to eliminate the diamond wire jumper problem of the slicer in a timely manner by sending feedback information such as an alarm. Therefore, based on the control method of the slicer of the present invention, it is expected to realize the automated operation of the slicer in judging whether the diamond wire jumper link occurs during the operation of the cutting mechanism.

[0074] It should be pointed out that although the various steps in the above embodiments are described in a specific order, those skilled in the art can understand that in order to achieve the effects of the present invention, different steps do not have to be performed in such an order. They can be performed simultaneously or in other orders, and some steps can also be added, replaced or omitted.

[0075] It should be noted that, although the control method of the slicer constructed in the above specific manner is introduced as an example, those skilled in the art will appreciate that the present invention should not be limited thereto. In fact, the user can flexibly adjust the relevant steps and parameters in the steps according to the actual application scenario and other situations.

[0076] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A control method for a slicer, characterized in that: The slicer includes a cutting mechanism with a cutting line wound around it, and the control method includes: When the cutting mechanism is in operation, collecting image data of the cutting mechanism and the wire web including the cutting wire; Analyze the image data to determine whether the cutting line is skipped; In the case of a cutting line jumper, abnormal feedback information corresponding to the cutting line jumper is given.

2. The control method according to claim 1, characterized in that: The “collecting image data of the cutting mechanism and the wire mesh including the cutting wire when the cutting mechanism is in operation” includes: Obtaining position data between adjacent cutting line segments in the wire mesh; Accordingly, the “analyzing the image data to determine whether the cutting line is skipped” includes: According to the position data, it is determined whether the cutting line is skipped.

3. The control method according to claim 2, characterized in that: The “determining whether the cutting line is skipped according to the position data” includes: In the event of a jump value in the position data, a cutting line jump is determined.

4. The control method according to claim 1, characterized in that: In the step of "analyzing the image data to determine whether the cutting line is skipped", the "analyzing the image data" includes: The image data is binarized.

5. The control method according to claim 4, characterized in that: Before binarizing the image data, the control method includes: The image data is sharpened.

6. The control method according to claim 4, characterized in that: After binarization of the image data, the control method includes: The image data is subjected to threshold segmentation.

7. The control method according to claim 1, characterized in that: The control method further comprises: Feature extraction is performed on the image data.

8. The control method according to claim 1, characterized in that: The “collecting image data of the cutting mechanism and the wire mesh including the cutting wire when the cutting mechanism is in operation” includes: When the cutting mechanism is in operation and after the microtome has been warmed up, image data of the cutting mechanism and the wire web including the cutting wires are acquired.

9. The control method according to claim 1, characterized in that: The slicer includes a cutting mechanism, and the "collecting image data of the cutting mechanism and the wire mesh including the cutting line when the cutting mechanism is in operation" includes: When the cutting mechanism is in operation, image data of the cutting mechanism and the wire web including the cutting wires are acquired according to the cutting time of the slicer and / or according to the feeding depth of the feed mechanism.

10. The control method according to claim 1, characterized in that: The “in the case of a cutting line jumper, providing abnormal feedback information corresponding to the cutting line jumper” includes: In the event of a wire jump in the cutting line, a reminder message is issued and / or the operating parameters of the cutting mechanism are adjusted.

11. The control method according to claim 1, characterized in that: The slicer comprises a cutting chamber, wherein the cutting chamber is provided with an operating door. The “collecting image data of the cutting mechanism and the wire mesh including the cutting wire” includes: Acquiring image data of the cutting mechanism and the wire web including the cutting wire by at least one image acquisition device; Wherein, the image acquisition device is arranged at a position of the slicer close to the operating door.

12. The control method according to claim 11, characterized in that: The cutting mechanism comprises a plurality of main cutting rollers, and at least one main cutting roller is provided with at least one image acquisition device.

13. The control method according to claim 12, characterized in that: The image acquisition device comprises one or more image acquisition devices arranged along the axial direction of the wire web of the cutting line; and / or The image acquisition device can be arranged on the slicer in a movable manner along the axial direction of the wire web of the cutting wire; and / or The image acquisition device is rotatably arranged on the slicer; and / or The image acquisition device is arranged at a set angle relative to the cutting mechanism.

14. A computer-readable storage medium, the storage medium comprising a memory, the memory being adapted to store a plurality of program codes, characterized in that: The program code is suitable for being loaded and run by a processor to execute the control method of the microtome according to any one of claims 1 to 13.

15. A computer device, comprising a memory and a processor, wherein the memory is suitable for storing a plurality of program codes, wherein: The program code is suitable for being loaded and run by the processor to execute the control method of the microtome according to any one of claims 1 to 13.

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