Piezoelectric quartz wafer automatic material bonding device and use method thereof
By using the combination of rolling rollers and moving modules that can move along the '√' trajectory in the piezoelectric quartz wafer automatic adhesive device, the problem of unsolid adhesive tape is solved, and the tight bonding of tape and quartz sheet is achieved , improves processing quality.
Patent Information
- Application Number
- CN202411140864.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2024-12-27
AI Technical Summary
The existing piezoelectric quartz wafer automatic adhesive machine drives the tape to directly adhere to the quartz wafer, resulting in the tape being unstable, lifting and falling off, affecting subsequent processing.
Design a piezoelectric quartz wafer automatic adhesive device, adopting a rolling roller that can move along the '√' shape to crush the tape body bonded to the bottom surface of the quartz sheet, through the cooperation of the X-moving module and the Y-moving module, Electric telescopic rods, suction cups and pressure plates ensure that the tape is tightly bonded.
It effectively improves the bonding strength between the tape and the quartz sheet, ensures that the tape is complete and tightly bonded, and improves the effectiveness of the device.
Smart Images
Figure CN119190948A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of piezoelectric quartz wafer production, in particular to a piezoelectric quartz wafer automatic bonding device and a use method thereof. Background Art
[0002] Existing quartz sheets need to be manually sorted during processing and arranged in order according to production rules. The quartz sheets are then connected with manual adhesive tape and torn off after processing. The on-site production has high fatigue strength, and the manual method is prone to errors. The size and consistency cannot be well guaranteed, and the quality of the quartz sheets cannot guarantee a good yield rate.
[0003] In this regard, China applied for patent number: CN201911317828.9, which discloses a piezoelectric quartz sheet automatic bonding machine, including a base for fixing other mechanisms and parts on the bonding machine; a tape feeding mechanism, including a base, a bonding lifting platform and a fixed roller arranged on the feeding base; a feeding turntable; a quartz sheet grabbing module; wherein, the quartz sheet grabbing module of the tape includes a mobile suction cup frame and a recognition camera that can identify the position and front and back information of the quartz stone, the recognition camera is connected to a control system, and the mobile suction cup frame is arranged above the feeding turntable. The advantages of this invention are: by setting a combination of a recognition camera and a mobile suction cup frame, the traditional manual sorting and pasting process of quartz sheets is replaced, the labor intensity of workers is reduced, the recognition camera can not only identify the position of the quartz stone, but also analyze the front and back information, and then the quartz sheet is pasted after the front and back are aligned through the quartz sheet flipping mechanism, no errors will be generated, the accuracy of bonding is improved, and the bonding machine is more reliable.
[0004] The bonding machine drives the lifting platform through the lifting cylinder so that the sticky side of the tape touches the quartz sheet to complete the bonding step. However, since the lifting platform drives the tape to directly adhere to the quartz sheet, the contact area is large, during use, the tape will be partially loosely bonded to the ground of the quartz sheet, and during the subsequent transportation and processing of the quartz sheet, the loosely bonded part of the tape will curl up and adhere to the device, causing the tape to fall off the quartz sheet, which will affect the subsequent processing of the quartz sheet.
[0005] Therefore, in order to solve the above problems, a piezoelectric quartz wafer automatic bonding device and a method for using the same are proposed. Summary of the invention
[0006] The object of the present invention is to provide a piezoelectric quartz wafer automatic adhesive material device and its usage method, so as to solve the problem in the prior art proposed in the above background technology that the adhesive material machine in the prior art drives the material pushing platform through the material pushing cylinder, so that the sticky side of the tape touches the quartz wafer to complete the pasting step. However, since the material pushing platform drives the tape to directly fit the quartz wafer, due to the large contact area, during the use process, local bonding failure will occur in the bonding of the tape on the ground of the quartz wafer, and during the subsequent conveying and processing of the quartz wafer, the unbonded part of the tape will warp and adhere to the device, causing the tape to fall off the quartz wafer, which will affect the subsequent processing of the quartz wafer.
[0007] To achieve the above object, the present invention provides the following technical solution: A piezoelectric quartz wafer automatic adhesive material device, comprising: an X moving module, a Y moving module is arranged on the X moving module, an electric telescopic rod is arranged on the Y moving module, a suction cup and a pressing plate are fixedly connected to the extending end of the electric telescopic rod, a support plate is installed on one side of the X moving module, a tape extending structure is installed on the support plate, and a tape main body is placed on the tape extending structure; An auxiliary structure is installed on the surface of the support plate. The auxiliary structure includes a U-shaped shell, the U-shaped shell is fixedly connected to the side wall of the support plate, a short groove is opened on the surface of the U-shaped shell, a long groove is opened at the upper end of the short groove, a reset groove is opened at the upper end of the long groove, a fixing plate is fixedly connected to the upper end of the inner wall of the U-shaped shell, a groove is opened on the top surface of the fixing plate, a movable frame is movably installed inside the U-shaped shell, a strip-shaped groove is opened on the surface of the movable frame, a guide rod is fixedly connected to the inner wall of the movable frame, a first magnetic ring is sleeved on the surface of the guide rod, a sliding frame is slidably installed on the guide rod, a second magnetic ring is arranged on the bottom surface of the sliding frame, a sliding rod is integrally formed on the bottom surface of the sliding frame, a rolling roller is rotatably connected to the upper end of the sliding frame, an electric push rod is fixedly installed on the surface of the fixing plate, and a blade is fixedly connected to the ejecting end of the electric push rod.
[0008] Preferably, a linkage structure is installed outside the auxiliary structure. The linkage structure includes a connecting rod, the connecting rod is inserted into the bottom surface of the U-shaped shell, a movable plate is fixedly connected to the bottom end of the connecting rod, a first spring is fixedly connected to the outside of the connecting rod, fixing cylinders are fixedly connected to both ends of the movable plate, a second spring is fixedly connected to the inside of the fixing cylinder, a magnetic block is fixedly installed on the top surface of the fixing cylinder, and a linkage rod is inserted into the top end of the fixing cylinder.
[0009] Preferably, the pressing plate is arranged above the suction cup, and the pressing plate cooperates with the two linkage rods.
[0010] Preferably, the short groove, the long groove and the reset groove form a right triangle structure, and the short groove and the long groove form a "√" shape.
[0011] Preferably, the sliding frame is vertically installed, the first magnetic ring is arranged at the left position of the guide rod, the second magnetic ring is arranged on the left side wall of the sliding frame, and the first magnetic ring and the second magnetic ring cooperate with each other.
[0012] Preferably, the sliding rod passes through the movable frame via the strip-shaped groove and passes through the C-shaped shell via the short groove, and the rolling roller is received inside the groove.
[0013] Preferably, the top end of the connecting rod is fixedly connected to the bottom surface of the movable frame, one end of the first spring is fixedly connected to the bottom surface of the C-shaped shell, one end of the second spring is fixedly connected to the bottom surface of the linkage rod, and the magnetic block cooperates with the pressing plate.
[0014] A using method of a piezoelectric quartz wafer automatic adhesive device: S1. Adsorb the quartz wafer on the suction cup, start the electric telescopic rod, lower the suction cup, the pressing plate and the quartz wafer, the pressing plate fits against the top end of the linkage rod, the pressing plate presses on the top end of the linkage rod, drives the movable plate and the connecting rod to descend, the connecting rod drives the movable frame to descend, the movable frame moves downward inside the C-shaped shell, the movable frame drives the sliding frame to descend, the sliding frame drives the rolling roller to be received inside the groove, and the sliding frame drives the sliding rod to move from the connection of the long groove and the reset groove to the connection of the reset groove and the short groove, and the sliding rod drives the sliding frame to move on the guide rod; S2. The feeding structure transports the end of the tape body to the top surface of the fixing plate, start the electric telescopic rod to drive the suction cup, the pressing plate and the quartz wafer to continue to descend, the linkage rod descends relative to the movable plate, the linkage rod presses the second spring, the pressing plate is magnetically connected to the magnetic block, the suction cup drives the quartz wafer to press on the tape body on the top surface of the fixing plate, the tape body pre-bonds to the bottom surface of the quartz wafer, start the electric push rod to drive the blade to rise, and cut off the tape body; S3. Start the electric telescopic rod, drive the suction cup, the pressing plate, the quartz wafer and the tape body to rise, the movable plate rises, the movable plate drives the connecting rod to rise, the connecting rod drives the movable frame to rise, the movable frame drives the sliding frame to rise, the sliding rod moves from the connection of the reset groove and the short groove to the short groove, and moves along the long groove from the connection of the short groove and the long groove to the connection of the long groove and the reset groove, the sliding frame drives the rolling roller to rise against the bottom surface of the tape body, and the rolling roller rolls the bottom surface of the tape body to improve the bonding strength between the tape body and the quartz wafer; S4. The suction cup, the pressing plate, the quartz wafer and the tape body continue to rise, the pressing plate is separated from the magnetic block, the top end of the linkage rod loses the oppression of the pressing plate, and rises and resets from the inside of the fixed cylinder under the action of the second spring.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: By providing a rolling roller that can move along a "√" - shaped trajectory, the adhesive device of the present invention can roll the main body of the tape adhered to the bottom surface of the quartz wafer, enabling the main body of the tape to be adhered to the bottom surface of the quartz wafer completely and tightly, effectively improving the adhesive strength between the main body of the tape and the quartz wafer, and enhancing the use effect of the device.
[0016] An auxiliary structure and a linkage structure are provided. The quartz wafer is adsorbed on the suction cup. Through the movement of the X - moving module and the Y - moving module, the suction cup and the quartz wafer can be moved to the upper side of the auxiliary structure. The electric telescopic rod is started to lower the suction cup, the pressing plate and the quartz wafer. The pressing plate fits with the top end of the linkage rod. When the pressing plate descends, it presses on the top end of the linkage rod. The linkage rod drives the movable plate and the connecting rod to descend through the second spring. When the connecting rod descends, it drives the movable frame to descend. The movable frame moves from the upper end inside the C - shaped shell to the lower end. When the movable frame moves, it drives the sliding frame to descend through the guide rod. The sliding frame drives the rolling roller to retract into the inner side of the groove. And when the sliding frame moves, it drives the sliding rod to move from the connection of the long groove and the reset groove, through the reset groove to the connection of the reset groove and the short groove. And when the sliding rod moves, it drives the sliding frame to move on the guide rod. The first magnetic ring and the second magnetic ring repel each other, giving the sliding rod a tendency to move into the short groove at the connection of the reset groove and the short groove; At this time, the quartz wafer on the suction cup is located above the fixed plate. Through the lengthening structure, the end of the main body of the tape is conveyed to the top surface of the fixed plate, and the end of the main body of the tape covers the upper side of the rolling roller. The electric telescopic rod is started to drive the suction cup, the pressing plate and the quartz wafer to continue descending. The linkage rod continues to descend under the pressure of the pressing plate. While the movable frame moves to the lowermost side inside the C - shaped shell and cannot move further, the linkage rod descends relative to the movable plate. The linkage rod descends inside the fixed cylinder, squeezing the second spring. And the pressing plate is magnetically connected to the magnetic block. At this time, the suction cup drives the quartz wafer to press on the main body of the tape on the top surface of the fixed plate. At this time, the main body of the tape is pre - adhered to the bottom surface of the quartz wafer. Then the electric push rod is started, and the electric push rod drives the blade to rise, and the main body of the tape can be cut off; Start the electric telescopic rod to drive the suction cup, pressing plate, quartz sheet and tape body to rise. The pressing plate drives the movable plate to rise under the restoring action of the first spring through the magnetic block. The movable plate drives the connecting rod to rise from the bottom surface into the inside of the C-shaped shell. The connecting rod drives the movable frame to rise inside the C-shaped shell. The movable frame drives the sliding frame to rise through the guide rod. Under the mutual repulsion of the first magnetic ring and the second magnetic ring, the sliding rod moves from the connection of the reset groove and the short groove to the short groove, and then moves along the long groove from the connection of the short groove and the long groove to the connection of the long groove and the reset groove, making the sliding rod move in a "√" shaped trajectory. Since the movable frame rises together with the suction cup, pressing plate, quartz sheet and tape body, the rolling roller is driven by the sliding frame to rise along with the bottom surface of the tape body. And because the sliding rod moves inside the short groove and the inner side of the short groove, the sliding frame moves inside the C-shaped shell, that is, drives the rolling roller to make a reciprocating movement on the bottom surface of the quartz sheet and the tape body. The rolling roller presses the bottom surface of the tape body, so that the tape body can be completely and tightly adhered to the bottom surface of the quartz sheet, effectively improving the adhesion strength between the tape body and the quartz sheet and enhancing the use effect of the device; As the suction cup, pressing plate, quartz sheet and tape body continue to rise, the movable frame moves to the limit inside the C-shaped shell and cannot rise further. At this time, the pressing plate separates from the magnetic block, and the top of the linkage rod loses the oppression of the pressing plate, and then rises and resets from the inside of the fixed cylinder under the action of the second spring, preparing for bonding the tape body to the next group of quartz sheets. Description of the Drawings
[0017] Figure 1 It is a schematic rear view of the structure of the support plate of the present invention; Figure 2 It is a schematic front view of the structure of the lengthening structure of the present invention; Figure 3 It is an exploded schematic view of the structure of the X-moving module of the present invention; Figure 4 It is a schematic side view of the structure of the auxiliary structure of the present invention; Figure 5 It is an exploded schematic view of the structure of the C-shaped shell of the present invention; Figure 6 It is an exploded schematic view of the structure of the movable frame of the present invention; Figure 7 It is a schematic side sectional view of the structure of the linkage structure of the present invention; Figure 8 It is a schematic front view of the structure of the short groove of the present invention; Fig. 9 It is a schematic front sectional view of the structure of the first magnetic ring and the sliding frame of the present invention.
[0018] In the figure: 1. X moving module; 11. Y moving module; 12. Electric telescopic rod; 13. Suction cup; 14. Pressing plate; 15. Support plate; 16. Tape lengthening structure; 17. Tape body; 2. Auxiliary structure; 21. C-shaped shell; 22. Short groove; 221. Long groove; 222. Reset groove; 23. Fixed plate; 24. Groove; 25. Movable frame; 26. Strip-shaped groove; 27. Guide rod; 28. First magnetic ring; 29. Sliding frame; 210. Second magnetic ring; 211. Slide bar; 212. Rolling roller; 213. Electric push rod; 214. Blade; 3. Linkage structure; 31. Connecting rod; 32. Movable plate; 33. First spring; 34. Fixed cylinder; 35. Second spring; 36. Magnet; 37. Linkage rod. Detailed implementation manner
[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0020] Please refer to Figure 1-9 , an embodiment provided by the present invention: The X moving module 1, Y moving module 11, electric telescopic rod 12, suction cup 13 and electric push rod 213 used in this application are products that can be directly purchased on the market. Their principles and connection methods are all prior arts well-known to those skilled in the art, so they will not be elaborated here.
[0021] A piezoelectric quartz wafer automatic adhesive device includes: an X moving module 1, a Y moving module 11 is arranged on the X moving module 1, an electric telescopic rod 12 is arranged on the Y moving module 11, the extending end of the electric telescopic rod 12 is fixedly connected with a suction cup 13 and a pressing plate 14, a support plate 15 is installed on one side of the X moving module 1, a tape lengthening structure 16 is installed on the support plate 15, and a tape body 17 is placed on the tape lengthening structure 16; An auxiliary structure 2 is mounted on the surface of the support plate 15. The auxiliary structure 2 includes a U-shaped shell 21 which is fixedly connected to the side wall of the support plate 15. A short groove 22 is formed on the surface of the U-shaped shell 21. A long groove 221 is formed at the upper end of the short groove 22. A reset groove 222 is formed at the upper end of the long groove 221. The upper end inner wall of the U-shaped shell 21 is fixedly connected with a fixing plate 23. A groove 24 is formed on the top surface of the fixing plate 23. An activity frame 25 is movably installed inside the U-shaped shell 21. A strip-shaped groove 26 is formed on the surface of the activity frame 25. A guide rod 27 is fixedly connected to the inner wall of the activity frame 25. A first magnetic ring 28 is sleeved on the surface of the guide rod 27. A sliding frame 29 is slidably installed on the guide rod 27. A second magnetic ring 210 is arranged on the bottom end surface of the sliding frame 29. A sliding rod 211 is integrally formed on the bottom end surface of the sliding frame 29. A rolling roller 212 is rotatably connected to the upper end of the sliding frame 29. An electric push rod 213 is fixedly installed on the surface of the fixing plate 23. The ejecting end of the electric push rod 213 is fixedly connected with a blade 214. By providing the rolling roller 212 that can move along a "√"-shaped track, the tape body 17 adhered to the bottom surface of the quartz sheet can be rolled, so that the tape body 17 can be adhered to the bottom surface of the quartz sheet completely and tightly, effectively improving the adhesion strength between the tape body 17 and the quartz sheet and enhancing the use effect of the device.
[0022] Furthermore, a linkage structure 3 is installed outside the auxiliary structure 2. The linkage structure 3 includes a connecting rod 31 which is inserted into the bottom surface of the U-shaped shell 21. The bottom end of the connecting rod 31 is fixedly connected with an activity plate 32. A first spring 33 is fixedly connected to the outside of the connecting rod 31. The two ends of the activity plate 32 are fixedly connected with fixing cylinders 34. A second spring 35 is fixedly connected to the inside of the fixing cylinders 34. A magnetic block 36 is fixedly installed on the top surface of the fixing cylinders 34. A linkage rod 37 is inserted into the top end of the fixing cylinders 34. The setting of the linkage structure 3 can drive the auxiliary structure 2 to move when the electric telescopic rod 12 drives the suction cup 13 to descend, improving the adhesion strength of the tape body 17 on the bottom surface of the quartz sheet.
[0023] Furthermore, the pressing plate 14 is arranged above the suction cup 13. The pressing plate 14 cooperates with the two linkage rods 37. When the electric telescopic rod 12 drives the quartz sheet to fit the tape body 17, the pressing plate 14 can press down the linkage rods 37 to retract into the inside of the fixing cylinders 34.
[0024] Furthermore, the short groove 22, the long groove 221 and the reset groove 222 form a right triangle structure. The short groove 22 and the long groove 221 form a "√" shape. The sliding rod 211 can move cyclically in the short groove 22, the long groove 221 and the reset groove 222. The movement of the sliding rod 211 in the short groove 22 and the long groove 221 can drive the rolling roller 212 to roll the tape body 17 on the bottom surface of the quartz sheet reciprocally.
[0025] Further, the sliding frame 29 is vertically installed. The first magnetic ring 28 is arranged at a position on the left side of the guide rod 27, and the second magnetic ring 210 is arranged on the left side wall of the sliding frame 29. The first magnetic ring 28 and the second magnetic ring 210 cooperate with each other. When the sliding rod 211 is located at the connection of the reset groove 222 and the short groove 22, when the movable frame 25 rises, the sliding rod 211 can move into the short groove 22 along with the trend.
[0026] Further, the sliding rod 211 passes through the movable frame 25 via the strip-shaped groove 26 and passes through the U-shaped shell 21 via the short groove 22. The rolling roller 212 is received inside the groove 24. The strip-shaped groove 26 cooperates with the short groove 22 to limit the movement track of the sliding frame 29.
[0027] Further, the top end of the connecting rod 31 is fixedly connected to the bottom surface of the movable frame 25. One end of the first spring 33 is fixedly connected to the bottom surface of the U-shaped shell 21. One end of the second spring 35 is fixedly connected to the bottom surface of the linkage rod 37. The magnetic block 36 cooperates with the pressing plate 14. The movement of the connecting rod 31 can drive the movable frame 25 to move inside the U-shaped shell 21. The first spring 33 provides power for the reset of the movable plate 32. The second spring 35 provides power for the reset of the linkage rod 37, and ensures that the first spring 33 deforms before the second spring 35 when the pressing plate 14 presses down the linkage rod 37. When the pressing plate 14 rises, under the cooperation of the magnetic block 36 and the pressing plate 14, the first spring 33 can deform before the second spring 35.
[0028] A usage method of a piezoelectric quartz wafer automatic adhesive device: S1. Adsorb the quartz wafer on the suction cup 13, start the electric telescopic rod 12, lower the suction cup 13, the pressing plate 14 and the quartz wafer. The pressing plate 14 fits against the top end of the linkage rod 37. The pressing plate 14 presses on the top end of the linkage rod 37, driving the movable plate 32 and the connecting rod 31 to descend. The connecting rod 31 drives the movable frame 25 to descend. The movable frame 25 moves downward inside the U-shaped shell 21. The movable frame 25 drives the sliding frame 29 to descend. The sliding frame 29 drives the rolling roller 212 to be received inside the groove 24, and the sliding frame 29 drives the sliding rod 211 to move from the connection of the long groove 221 and the reset groove 222 to the connection of the reset groove 222 and the short groove 22, and the sliding rod 211 drives the sliding frame 29 to move on the guide rod 27; S2. The lengthening structure 16 conveys the end of the tape body 17 to the top surface of the fixing plate 23. Start the electric telescopic rod 12 to drive the suction cup 13, the pressing plate 14 and the quartz wafer to continue to descend. The linkage rod 37 descends relative to the movable plate 32. The linkage rod 37 squeezes the second spring 35. The pressing plate 14 is magnetically attracted to the magnetic block 36. The suction cup 13 drives the quartz wafer to press on the tape body 17 on the top surface of the fixing plate 23. The tape body 17 pre-bonds the bottom surface of the quartz wafer. Start the electric push rod 213 to drive the blade 214 to rise and cut off the tape body 17; S3. Activate the electric telescopic rod 12 to drive the suction cup 13, the pressing plate 14, the quartz sheet and the tape body 17 to rise. The movable plate 32 rises, the movable plate 32 drives the connecting rod 31 to rise, the connecting rod 31 drives the movable frame 25 to rise, the movable frame 25 drives the sliding frame 29 to rise, the sliding rod 211 moves from the connection of the reset groove 222 and the short groove 22 to the short groove 22, and moves along the long groove 221 through the connection of the short groove 22 and the long groove 221 to the connection of the long groove 221 and the reset groove 222. The sliding frame 29 drives the rolling roller 212 to rise along the bottom surface of the tape body 17, and the rolling roller 212 rolls the bottom surface of the tape body 17 to improve the bonding strength between the tape body 17 and the quartz sheet; S4. The suction cup 13, the pressing plate 14, the quartz sheet and the tape body 17 continue to rise, the pressing plate 14 separates from the magnet 36, the top of the linkage rod 37 loses the oppression of the pressing plate 14, and rises and resets from the inside of the fixed cylinder 34 under the action of the second spring 35. Working principle: During use, the quartz sheet is adsorbed on the suction cup 13. The suction cup 13 and the quartz sheet can be moved to the upper side of the auxiliary structure 2 through the movement of the X movement module 1 and the Y movement module 11. Activate the electric telescopic rod 12 to lower the suction cup 13, the pressing plate 14 and the quartz sheet. The pressing plate 14 fits with the top of the linkage rod 37. When the pressing plate 14 descends, it presses on the top of the linkage rod 37. The linkage rod 37 drives the movable plate 32 and the connecting rod 31 to descend through the second spring 35. When the connecting rod 31 descends, it drives the movable frame 25 to descend. The movable frame 25 moves from the upper end inside the U-shaped shell 21 to the lower end. When the movable frame 25 moves, it drives the sliding frame 29 to descend through the guide rod 27. The sliding frame 29 drives the rolling roller 212 to retract into the inside of the groove 24. When the sliding frame 29 moves, it drives the sliding rod 211 from the connection of the long groove 221 and the reset groove 222, through the reset groove 222 to the connection of the reset groove 222 and the short groove 22. When the sliding rod 211 moves, it drives the sliding frame 29 to move on the guide rod 27. The first magnetic ring 28 and the second magnetic ring 210 repel each other, which can give the sliding rod 211 a tendency to move into the short groove 22 at the connection of the reset groove 222 and the short groove 22; At this time, the quartz sheet on the suction cup 13 is located above the fixed plate 23. Through the lengthening structure 16, the end of the tape body 17 is conveyed to the top surface of the fixed plate 23, and the end of the tape body 17 covers the upper side of the rolling roller 212. Start the electric telescopic rod 12 to drive the suction cup 13, the pressing plate 14 and the quartz sheet to continue to descend. The linkage rod 37 continues to descend under the pressure of the pressing plate 14. The movable frame 25 moves to the lowest side inside the C-shaped shell 21 and cannot move further. The linkage rod 37 descends relative to the movable plate 32, and the linkage rod 37 descends inside the fixed cylinder 34, squeezing the second spring 35, and the pressing plate 14 is magnetically connected to the magnet 36. At this time, the suction cup 13 drives the quartz sheet to press on the tape body 17 on the top surface of the fixed plate 23. At this time, the tape body 17 pre-bonds to the bottom surface of the quartz sheet. Then start the electric push rod 213, and the electric push rod 213 drives the blade 214 to rise, and the tape body 17 can be cut off; Start the electric telescopic rod 12 to drive the suction cup 13, the pressing plate 14, the quartz sheet and the tape body 17 to rise. The pressing plate 14 drives the movable plate 32 to rise under the restoring action of the first spring 33 through the magnet 36. The movable plate 32 drives the connecting rod 31 to rise from the bottom surface into the C-shaped shell 21. The connecting rod 31 drives the movable frame 25 to rise inside the C-shaped shell 21. The movable frame 25 drives the sliding frame 29 to rise through the guide rod 27. Under the mutual repulsion of the first magnetic ring 28 and the second magnetic ring 210, the sliding rod 211 moves from the connection of the reset groove 222 and the short groove 22 to the short groove 22, and then moves along the long groove 221 through the connection of the short groove 22 and the long groove 221 to the connection of the long groove 221 and the reset groove 222, making the sliding rod 211 move in a "√" shaped trajectory. Since the movable frame 25 rises together with the suction cup 13, the pressing plate 14, the quartz sheet and the tape body 17, the rolling roller 212 is driven by the sliding frame 29 to rise along with the bottom surface of the tape body 17. And because the sliding rod 211 moves inside the short groove 22 and the short groove 22, the sliding frame 29 moves inside the C-shaped shell 21, that is, drives the rolling roller 212 to make a reciprocating movement on the bottom surface of the quartz sheet and the tape body 17. The rolling roller 212 rolls the bottom surface of the tape body 17, so that the tape body 17 can be completely and tightly bonded to the bottom surface of the quartz sheet, effectively improving the bonding strength between the tape body 17 and the quartz sheet and improving the use effect of the device; As the suction cup 13, the pressing plate 14, the quartz sheet and the tape body 17 continue to rise, the movable frame 25 moves in place inside the C-shaped shell 21 and cannot rise further. At this time, the pressing plate 14 is separated from the magnet 36, and the top of the linkage rod 37 loses the pressure of the pressing plate 14, and rises and resets from inside the fixed cylinder 34 under the action of the second spring 35, preparing for bonding the tape body 17 to the next group of quartz sheets.
[0029] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.
Claims
1. A piezoelectric quartz wafer automatic bonding device, comprising: X moving module (1), on which a Y moving module (11) is arranged, on the Y moving module (11) an electric telescopic rod (12) is arranged, the extending end of the electric telescopic rod (12) is fixedly connected with a suction cup (13) and a pressing plate (14), on one side of the X moving module (1) a support plate (15) is installed, on the support plate (15) a tape lengthening structure (16) is installed, and a tape body (17) is placed on the tape lengthening structure (16); It is characterized in that: On the surface of the support plate (15) an auxiliary structure (2) is installed, the auxiliary structure (2) includes a U-shaped shell (21), the U-shaped shell (21) is fixedly connected to the side wall of the support plate (15), on the surface of the U-shaped shell (21) a short groove (22) is opened, at the upper end of the short groove (22) a long groove (221) is opened, at the upper end of the long groove (221) a reset groove (222) is opened, at the upper end of the inner wall of the U-shaped shell (21) a fixed plate (23) is fixedly connected, on the top surface of the fixed plate (23) a groove (24) is opened, inside the U-shaped shell (21) a movable frame (25) is movably installed, on the surface of the movable frame (25) a strip-shaped groove (26) is opened, on the inner wall of the movable frame (25) a guide rod (27) is fixedly connected, on the surface of the guide rod (27) a first magnetic ring (28) is sleeved, on the guide rod (27) a sliding frame (29) is slidably installed, on the bottom surface of the sliding frame (29) a second magnetic ring (210) is arranged, on the bottom surface of the sliding frame (29) a sliding rod (211) is integrally formed, on the upper end of the sliding frame (29) a rolling roller (212) is rotatably connected, on the surface of the fixed plate (23) an electric push rod (213) is fixedly installed, and the ejecting end of the electric push rod (213) is fixedly connected with a blade (214).
2. The piezoelectric quartz wafer automatic bonding device according to claim 1, characterized in that: On the outside of the auxiliary structure (2) a linkage structure (3) is installed, the linkage structure (3) includes a connecting rod (31), the connecting rod (31) is inserted into the bottom surface of the U-shaped shell (21), at the bottom end of the connecting rod (31) a movable plate (32) is fixedly connected, on the outside of the connecting rod (31) a first spring (33) is fixedly connected, at both ends of the movable plate (32) fixed cylinders (34) are fixedly connected, inside the fixed cylinders (34) second springs (35) are fixedly connected, on the top surface of the fixed cylinders (34) magnetic blocks (36) are fixedly installed, and inside the top ends of the fixed cylinders (34) linkage rods (37) are inserted.
3. The piezoelectric quartz wafer automatic bonding device according to claim 1, characterized in that: The pressing plate (14) is arranged above the suction cup (13), and the pressing plate (14) cooperates with the two linkage rods (37).
4. The piezoelectric quartz wafer automatic bonding device according to claim 1, characterized in that: The short groove (22), the long groove (221) and the reset groove (222) form a right triangle structure, and the short groove (22) and the long groove (221) form a "√" shape.
5. The piezoelectric quartz wafer automatic bonding device according to claim 1, characterized in that: The sliding frame (29) is vertically installed. The first magnetic ring (28) is arranged at the left position of the guide rod (27). The second magnetic ring (210) is arranged on the left side wall of the sliding frame (29). The first magnetic ring (28) and the second magnetic ring (210) cooperate with each other.
6. The piezoelectric quartz wafer automatic bonding device according to claim 1, characterized in that: The sliding rod (211) passes through the movable frame (25) via the strip-shaped groove (26) and passes through the U-shaped shell (21) via the short groove (22). The rolling roller (212) is received inside the groove (24).
7. The piezoelectric quartz wafer automatic bonding device according to claim 2, characterized in that: The top end of the connecting rod (31) is fixedly connected to the bottom surface of the movable frame (25). One end of the first spring (33) is fixedly connected to the bottom surface of the U-shaped shell (21). One end of the second spring (35) is fixedly connected to the bottom surface of the linkage rod (37). The magnetic block (36) cooperates with the pressing plate (14).
8. A method for using a piezoelectric quartz wafer automatic material sticking device according to any one of claims 1-7: S1. Adsorb a quartz wafer on the suction cup (13). Start the electric telescopic rod (12) to lower the suction cup (13), the pressing plate (14), and the quartz wafer. The pressing plate (14) fits against the top end of the linkage rod (37). The pressing plate (14) presses on the top end of the linkage rod (37), driving the movable plate (32) and the connecting rod (31) to descend. The connecting rod (31) drives the movable frame (25) to descend. The movable frame (25) moves downward inside the U-shaped shell (21). The movable frame (25) drives the sliding frame (29) to descend. The sliding frame (29) drives the rolling roller (212) to be received inside the groove (24). And the sliding frame (29) drives the sliding rod (211) to move from the connection between the long groove (221) and the reset groove (222) to the connection between the reset groove (222) and the short groove (22). And the sliding rod (211) drives the sliding frame (29) to move on the guide rod (27). S2. The feeding structure (16) transports the end of the tape body (17) to the top surface of the fixing plate (23). Start the electric telescopic rod (12) to drive the suction cup (13), the pressing plate (14), and the quartz wafer to continue descending. The linkage rod (37) descends relative to the movable plate (32). The linkage rod (37) compresses the second spring (35). The pressing plate (14) is magnetically attracted to the magnetic block (36). The suction cup (13) drives the quartz wafer to press on the tape body (17) on the top surface of the fixing plate (23). The tape body (17) pre-bonds to the bottom surface of the quartz wafer. Start the electric push rod (213) to drive the blade (214) to rise and cut off the tape body (17). S3. Start the electric telescopic rod (12), drive the suction cup (13), the pressure plate (14), the quartz plate and the tape body (17) to rise, the movable plate (32) to rise, the movable plate (32) drives the connecting rod (31) to rise, the connecting rod (31) drives the movable frame (25) to rise, the movable frame (25) drives the sliding frame (29) to rise, the sliding rod (211) moves from the connection between the reset groove (222) and the short groove (22) to the short groove (22), and moves along the long groove (221) to the connection between the long groove (221) and the reset groove (222) via the connection between the short groove (22) and the long groove (221), the sliding frame (29) drives the rolling roller (212) to rise along the bottom surface of the tape body (17), the rolling roller (212) rolls the bottom surface of the tape body (17), and improves the bonding strength between the tape body (17) and the quartz plate; S4. The suction cup (13), the pressure plate (14), the quartz plate and the tape body (17) continue to rise, the pressure plate (14) separates from the magnetic block (36), and the top end of the linkage rod (37) loses the pressure of the pressure plate (14) and rises from the inside of the fixed tube (34) and resets under the action of the second spring (35).