Method and apparatus for vapor pressure monitoring

By using heater rods and thermocouples to surround the gas pipeline in semiconductor manufacturing systems, the problem of inaccurate condensation and low pressure measurements of gas pipelines is solved, and more accurate and uniform vapor pressure monitoring is achieved, improving deposition quality.

CN119197875APending Publication Date: 2024-12-27ASM IP HLDG BV
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Patent Information

Application Number
CN202410776069.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-06-20
Filing Date
2024-06-17
Publication Date
2024-12-27

AI Technical Summary

Technical Problem

Gas lines in traditional semiconductor manufacturing systems are prone to condense, resulting in uneven deposition on the wafer, and inaccurate measurement of vapor pressure through the gas lines at low vapor pressure.

Method used

A device is designed where the gas line includes a heater rod embedded in the metal body and a thermocouple connected to the metal body, which surrounds the gas line through the heater rod and insulator, ensuring that the gas line remains heated and the vapor pressure is monitored by a pressure sensor.

Benefits of technology

It effectively avoids condensation of gas pipelines, improves the accuracy and uniformity of vapor pressure measurement, and ensures the deposition quality during semiconductor manufacturing.

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Abstract

Various embodiments of the present technology may provide methods and apparatus for vapor pressure monitoring in a semiconductor manufacturing tool. The apparatus may include a container containing a chemical substance and an outlet connected to a gas line, wherein the gas line includes a first portion connected to a reactor and a second portion connected to an exhaust port. The gas line may also include a third portion connected to the pressure sensor.
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Description

Technical Field

[0001] The present disclosure generally relates to methods and apparatus for vapor pressure monitoring. More specifically, the present disclosure relates to an enclosure having a through hole that accommodates a feed-through gas line, wherein the feed-through gas line has an internal heating element and is coupled to a pressure sensor located outside the enclosure. Background Art

[0002] Conventional semiconductor manufacturing systems experience gas lines with cold spots, resulting in condensation, which can cause uneven deposition on the wafer. In addition, measuring vapor pressure through the gas line is inaccurate when the vapor pressure is low. Summary of the invention

[0003] Various embodiments of the present technology can provide methods and apparatus for vapor pressure monitoring in semiconductor manufacturing tools. The apparatus can include a container containing a chemical substance and an outlet connected to a gas line, wherein the gas line includes a first portion connected to a reactor and a second portion connected to an exhaust port. The gas line can also include a third portion connected to a pressure monitor.

[0004] In one aspect, an apparatus includes: a gas pipeline; a metal body surrounding a section of the gas pipeline, wherein the metal body includes: a heater rod embedded in the metal body; and a first thermocouple connected to the metal body; and an insulator surrounding a portion of the metal body.

[0005] In one embodiment, a portion of the heater rod extends outside the metal body.

[0006] In one embodiment, an insulator surrounds the portion of the heater rod that extends outside the metal body.

[0007] In one embodiment, the insulator is separated from the metal body by an air gap.

[0008] In one embodiment, the gas line extends through the insulator.

[0009] In one embodiment, the metal body is formed of stainless steel.

[0010] In one embodiment, the metal body further includes a second thermocouple.

[0011] In one embodiment, the metal body further comprises a second thermocouple, and wherein the first thermocouple is arranged on a first side of the metal body, and the second thermocouple is arranged on a second side of the metal body opposite to the first side.

[0012] On the other hand, an apparatus includes: a first cabinet including a first wall having a first through hole; a second cabinet disposed within the first cabinet and including a second wall parallel to the first wall, wherein the second wall includes a second through hole aligned with the first through hole; a gas pipeline system including a feed-through device disposed and extending through the first and second through holes, the feed-through device including: a gas pipeline; a metal body surrounding a section of the gas pipeline, wherein the metal body includes: a heater rod including a first portion embedded in the metal body and a second portion extending outside the metal body; and a first thermocouple connected to the metal body; and an insulator surrounding a portion of the metal body and the second portion of the heater rod.

[0013] In one embodiment, the metal body further includes a second thermocouple.

[0014] In one embodiment, the metal body is formed of stainless steel.

[0015] In one embodiment, the insulator comprises polyetheretherketone (PEEK).

[0016] In one embodiment, the second cabinet is separated from the first cabinet by an air gap.

[0017] In one embodiment, the apparatus further includes a pressure sensor coupled to the gas line and disposed outside the first cabinet.

[0018] In yet another aspect, a system includes: a reactor; a first cabinet including a first wall having a first through hole; a second cabinet disposed within the first cabinet and including a second wall parallel to the first wall, wherein the second wall includes a second through hole aligned with the first through hole, wherein the second cabinet is separated from the first cabinet by an air gap; a container disposed within the second cabinet; a gas pipeline connected to the container and disposed within the first and second through holes, the gas pipeline including: a first portion connected to the reactor; a second portion connected to an exhaust port; and a third portion connected to a pressure sensor, wherein the third portion extends through the first and second housings, and the pressure sensor is disposed outside the second housing.

[0019] In one embodiment, the third portion includes a feed-through disposed and extending through the first through hole and the second through hole, the feed-through including: a gas line; and a metal body surrounding a section of the gas line.

[0020] In one embodiment, a metal body includes: a heater rod including a first portion embedded in the metal body and a second portion extending outside the metal body; and a first thermocouple connected to the metal body.

[0021] In one embodiment, the system further includes an insulator surrounding a portion of the metal body and the second portion of the heater rod, wherein the insulator includes polyetheretherketone.

[0022] In one embodiment, the metal body further includes a second thermocouple opposite to the first thermocouple.

[0023] In one embodiment, the metal body is formed of stainless steel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] A more complete understanding of the present technology may be obtained by referring to the detailed description when considered in conjunction with the following illustrative drawings.In the following drawings, like reference numerals refer to like elements and steps throughout the drawings.

[0025] Figure 1 Representatively illustrating systems according to various embodiments of the present technology;

[0026] Figure 2A representatively illustrating a perspective view of a housing of a system according to various embodiments of the present technology;

[0027] Figure 2B representatively illustrating a side view of a housing according to various embodiments of the present technology;

[0028] Figure 3 shows a feed-through portion of a gas line according to various embodiments of the present technology;

[0029] Figure 4 shows a cross-sectional view of a feed-through portion according to various embodiments of the present technology;

[0030] Figure 5 is a cross-sectional view of a feedthrough portion according to various embodiments of the present technology; and

[0031] Figure 6 is a schematic diagram of a system according to various embodiments of the present technology. DETAILED DESCRIPTION

[0032] The present technology may be described in terms of functional block components and various processing steps. Such functional blocks may be implemented by any number of components configured to perform the specified functions and achieve various results.

[0033] In various embodiments, reference Figure 12, the system 100 may include a first housing 105 (e.g., a cabinet) and a second housing 200 (e.g., a cabinet). Each housing 105, 200 may include a plurality of side walls, a bottom, and a top. The first housing 105 may surround the second housing 200, and the second housing 200 may be separated from the first housing 105 by an air gap 210. The first and second housings 105, 200 may be formed of a metal material, such as stainless steel, etc. The first housing 105 may include a first through hole 135 in a vertically oriented side wall of the first housing 105. Similarly, the second housing 200 may include a second through hole 205 in a vertically oriented side wall of the second housing, such that the first through hole 135 is horizontally aligned with the second through hole 205.

[0034] For example, the system 100 may include a heating system (not shown) disposed in or near the second housing 200, such as a radiant heat source, a convection heat source, a conductive heat source, or other suitable heat source to heat the interior of the second housing 200.

[0035] In various embodiments, the system 100 may further include a container 110 disposed within the second housing 200. The container 110 may be configured to hold or otherwise contain a chemical; the chemical may be a solid chemical or a liquid chemical. The container 110 may include an outlet port, and the outlet port may be connected to a gas pipeline system. In various embodiments, the container 110 may further include an inlet (not shown) configured to deliver an inert gas (not shown) such as argon into the container. The inert gas may be used as a carrier gas to help the chemical vapor flow to the reactor 160.

[0036] In various embodiments, the gas line system may include a first portion 140, a second portion 145, and a third portion 150. The first, second, and third portions 140, 145, 150 may be in fluid communication with each other. The first portion 140 may be connected to the reactor 160. In particular, the first portion 140 may fluidly connect the container 110 to the reactor 160. The second portion 145 may be connected to the exhaust system 125. The exhaust system 125 may include a pump (not shown) configured to exhaust gas from the gas line.

[0037] The third portion 150 can extend out and through the first and second housings 105, 200 and can be connected to a pressure sensor 115, such as a pressure transducer. For example, the pressure sensor 115 can include a pressure transducer or other device or system suitable for measuring vapor pressure. In an exemplary embodiment, the pressure sensor 115 is disposed outside the first housing 105. The pressure sensor 115 can be configured to monitor the vapor pressure of the chemical in the container 110.

[0038] In various embodiments, referring to FIGS. 2-5 , the third portion 150 can include a feedthrough 135 extending through the through hole of the first and second housings 105 , 200 . The feedthrough 135 can include a gas line 325 . The feedthrough 135 can also include a metal body 305 surrounding a section of the gas line 325 . Specifically, the metal body 305 can be in direct contact with the gas line 325 and radially surround the gas line 325 . In an exemplary embodiment, the metal body 305 is formed of stainless steel. In an exemplary embodiment, the metal body 305 extends from the interior of the second housing 200 , through the air gap 210 , to the exterior of the first housing 105 . A larger portion of the metal body 305 can extend outward from the exterior of the first housing 105 .

[0039] In various embodiments, the metal body 305 may include a heater rod 310 configured to heat the metal body 305 and the gas line 325. The heater rod 310 may be embedded within the metal body 305, and a first portion 400 of the heater rod 310 may extend substantially through the length of the metal body 305. A portion of the heater rod 310 may extend outside the metal body 305. In an exemplary embodiment, a second portion 405 of the heater rod 310 is exposed (i.e., not embedded within the metal body) and extends outwardly from the metal body 305 and outwardly from the exterior of the first housing 105. The heater rod 310 may include a resistive heater or any other suitable heating element.

[0040] In various embodiments, the metal body 305 may further include a temperature sensor, such as a first thermocouple 315 and a second thermocouple 320. The first thermocouple 315 may be attached (e.g., using a lug) to a first side of the metal body 305, and the second thermocouple 320 may be attached (e.g., using a lug) to a second side of the metal body 305 opposite the first side.

[0041] In various embodiments, the system 100 may further include an insulator 500 disposed outside the first housing 105 and encapsulating a portion of the feedthrough 135. For example, the insulator 500 may surround a portion of the metal body 305 containing the heater rod 310 and the exposed second portion 405 of the heater rod 310. The insulator 500 may include a through hole for receiving at least a portion of the feedthrough 130, such as the gas line 325, the second portion 405 of the heater rod 310, and the thermocouples 315, 320. In an exemplary embodiment, the insulator 500 is formed of PEEK (polyetheretherketone). The insulator 500 may include a two-piece system coupled together. The surface of the insulator 500 may directly contact the side wall of the first housing 105.

[0042] In various embodiments, the system 100 can further include a collector 120 disposed between the container 110 and the reactor 160. The collector 120 can operate to temporarily contain the vapor before the vapor is released into the reactor 160.

[0043] In various embodiments, the system 100 may further include a plurality of valves. For example, the system 100 may include a first valve 605, a second valve 615, a third valve 610, a third valve 620, a fourth valve 640, a fifth valve 645, and a sixth valve 650, a seventh valve 625, and an eighth valve 630, a ninth valve 635, and a tenth valve 610. Some valves may be disposed in the first and second housings 105, 200, such as the second valve 615, the fourth valve 640, the fifth valve 645, and the sixth valve 650. The fourth and sixth valves 640, 650 may be disposed along a gas line connecting the container 110 to the reactor 160 and the pressure sensor 115. The fifth valve may be disposed to be coupled to the inlet of the container 110. The valve 620 may be disposed upstream of the exhaust system 125. The tenth valve 610 may be disposed along a first portion of the gas line and upstream of the valves 640 and 650. The plurality of valves may communicate with and be operated by a control system (not shown), such as a controller or a processor. Thus, the control system can manipulate the position of the valve to be open or closed.

[0044] In operation, the vapor pressure of the chemical in the container can be measured using the pressure sensor 115. During the vapor pressure measurement, valves 645, 615, 605, 610 and 620 will be closed, while valves 640 and 650 will be opened. This will allow the vapor / gas to flow through the feedthrough 130 and into the pressure sensor 115.

[0045] The measured vapor pressure may be transmitted to the control system. The measured pressure may be displayed on a user interface connected to or integrated in the control system. In some cases, the control system may automatically respond to the measured vapor pressure and start other systems to achieve an increase or decrease in vapor pressure to reach a desired pressure. For example, if the measured vapor pressure is less than the desired pressure, the control system may increase the temperature of the second housing 200, and thus increase the temperature of the container 110. On the contrary, if the measured vapor pressure is higher than the desired pressure, the control system may reduce the temperature of the second housing and the container 110. Increasing the temperature of the second housing 200 and the container 110 will increase the vapor pressure of the chemical in the container 110, and on the contrary, reducing the temperature of the second housing 200 and the container 110 will reduce the vapor pressure of the chemical in the container 110. The temperature of the second housing 200 and the container 110 may be increased until the desired vapor pressure is reached. In other cases, the adjustment of other systems (e.g., a heating system for the second housing 200 and the container 110) may be performed manually by the user.

[0046] Once the vapor pressure has been measured, the system 100 can remove / evacuate the chemicals in the gas line by operating the pump and closing valves 615, 645, 640, and 605. During this removal / evacuation process, valve 620 will be open.

[0047] Once the gas lines are evacuated, the system 100 can return to the normal deposition process of pulsing and purging. For example, during a pulse, vapor can flow from the vessel 110 to the reactor 160 for a predetermined time. During a purge, an inert gas can flow into the reactor 160 and to the exhaust system 125 for a predetermined time. The pulse and purge sequence can be repeated any number of times.

[0048] The vapor pressure of the chemical can also be increased or decreased by changing the length of the pulse time. Thus, if the measured vapor pressure is higher or lower than the desired pressure, the system 100 (or the user) can increase or decrease the pulse time to increase or decrease the vapor pressure.

[0049] The vapor pressure of the chemical can also be increased or decreased by changing the dilution of the chemical vapor. This can be accomplished by increasing or decreasing the amount of inert gas (carrier gas) flowing into the container. Thus, if the measured vapor pressure is higher or lower than the desired pressure, the system 100 (or the user) can increase or decrease the amount of inert gas flowing into the container.

[0050] In the foregoing description, the technology has been described with reference to specific exemplary embodiments. The specific embodiments shown and described are illustrations of the technology and its best mode and are not intended to limit the scope of the technology in any way. In fact, for the sake of brevity, the conventional manufacturing, connection, preparation and other functional aspects of the method and system may not be described in detail. In addition, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or steps between the various elements. In actual systems, there may be many alternative or additional functional relationships or physical connections.

[0051] The technology has been described with reference to specific exemplary embodiments. However, various modifications and changes may be made without departing from the scope of the technology. The description and drawings are to be regarded as illustrative rather than restrictive, and all such modifications are intended to be included within the scope of the technology. Therefore, the scope of the technology should be determined by the general embodiments described and their legal equivalents, rather than solely by the specific examples described above. For example, the steps described in any method or process embodiment may be performed in any order unless otherwise expressly specified, and are not limited to the explicit order presented in the specific examples. In addition, the components and / or elements described in any device embodiment may be assembled or otherwise operably configured in various arrangements to produce substantially the same results as the technology, and are therefore not limited to the specific configurations described in the specific examples.

[0052] Benefits, other advantages, and solutions to problems have been described above with respect to specific embodiments. However, any benefit, advantage, solution to a problem, or any element that may cause any particular benefit, advantage, or solution to occur or become more significant should not be construed as a critical, required, or essential feature or component.

[0053] The terms "comprises," "comprising," or any variations thereof, are intended to refer to non-exclusive inclusion, such that a process, method, article, composition, or apparatus that includes a list of elements includes not only those elements listed, but may also include other elements not expressly listed or inherent to such process, method, article, composition, or apparatus. Other combinations and / or modifications of the above-described structures, arrangements, applications, proportions, elements, materials, or components used in the practice of the present technology, except those not specifically recited, may be changed or otherwise specially adapted to a particular environment, manufacturing specifications, design parameters, or other operating requirements without departing from the general principles thereof.

[0054] The present technology has been described above with reference to exemplary embodiments. However, changes and modifications may be made to the exemplary embodiments without departing from the scope of the present technology. These and other changes or modifications are intended to be included within the scope of the present technology, as expressed in the following claims.

Claims

1. A device comprising: Gas pipelines; A metal body surrounding a section of a gas pipeline, wherein the metal body comprises: A heater rod embedded in a metal body; and a first thermocouple connected to the metal body; and An insulator surrounding a portion of a metal body.

2. The device according to claim 1, wherein: A portion of the heater rod extends outside the metal body.

3. The device according to claim 2, wherein: The insulator surrounds the portion of the heater rod extending outside the metal body.

4. The device according to claim 1, wherein: The insulator is separated from the metal body by an air gap.

5. The device according to claim 1, wherein: The gas line extends through the insulator.

6. The device according to claim 1, wherein: The metal body is formed of stainless steel.

7. The device according to claim 1, wherein: The metal body also includes a second thermocouple.

8. The device according to claim 1, wherein: The metal body further includes a second thermocouple, and wherein the first thermocouple is arranged on a first side of the metal body and the second thermocouple is arranged on a second side of the metal body opposite to the first side.

9. An apparatus comprising: A first cabinet including a first wall having a first through hole; a second cabinet disposed within the first cabinet and comprising a second wall parallel to the first wall, wherein the second wall comprises a second through hole aligned with the first through hole; A gas line system comprising a feed-through disposed and extending through first and second through holes, the feed-through comprising: Gas pipelines; A metal body surrounding a section of a gas pipeline, wherein the metal body comprises: A heater rod including a first portion embedded in the metal body and a second portion extending outside the metal body; and a first thermocouple connected to the metal body; and An insulator surrounds a portion of the metal body and a second portion of the heater rod.

10. The device according to claim 9, wherein: The metal body also includes a second thermocouple.

11. The device according to claim 9, wherein: The metal body is formed of stainless steel.

12. The device according to claim 9, wherein: The insulator includes polyetheretherketone (PEEK).

13. The device according to claim 9, wherein: The second cabinet is separated from the first cabinet by an air gap.

14. The apparatus of claim 9, further comprising a pressure sensor coupled to the gas line and disposed outside the first cabinet.

15. A system comprising: Reactor; A first cabinet including a first wall having a first through hole; a second cabinet disposed within the first cabinet and comprising a second wall parallel to the first wall, wherein the second wall comprises a second through hole aligned with the first through hole, wherein the second cabinet is separated from the first cabinet by an air gap; a container disposed within the second cabinet; as well as A gas pipeline connected to the container and disposed in the first and second through holes, the gas pipeline comprising: connected to a first portion of a reactor; a second portion connected to the exhaust port; and A third portion is connected to the pressure sensor, wherein the third portion extends through the first and second housings, and the pressure sensor is disposed outside of the second housing.

16. The system of claim 15, wherein: The third portion includes a feedthrough disposed and extending through the first and second through holes, the feedthrough comprising: Gas pipelines; and A metal body that surrounds a section of a gas line.

17. The system of claim 16, wherein: The metal body comprises: a heater rod including a first portion embedded in the metal body and a second portion extending outside the metal body; and Connect a first thermocouple to the metal body.

18. The system of claim 17, further comprising an insulator surrounding a portion of the metal body and a second portion of the heater rod, wherein The insulator includes polyetheretherketone.

19. The system of claim 17, wherein: The metal body further includes a second thermocouple opposite to the first thermocouple.

20. The system of claim 15, wherein: The metal body is formed of stainless steel.