Assembling method of all-quartz split type vibrating beam accelerometer

Abstract

The invention discloses an all-quartz split type vibrating beam accelerometer assembling method, which is characterized in that components made of amorphous or single crystal quartz are combined together through a bonding process, chemical bonds are formed among the components through the bonding process, the chemical bonds cannot creep, and the connected parts are made of the same material, so that the whole process is simple, and the cost is low. Thermal expansion mismatching does not exist between bonding connection parts, and the resolution ratio and the precision can be kept in the use process.

Description

Technical Field

[0001] The invention relates to the technical field of quartz vibration beam accelerometers, in particular to a method for manufacturing a full quartz split accelerometer. Background Art

[0002] At present, the adhesives and solders used to connect the components of the all-quartz split-beam accelerometer will creep during long-term use, resulting in reduced resolution of the accelerometer. At the same time, the mismatch of thermal expansion coefficients of the damping plate, beam, mass pendulum, and adhesive materials will also lead to reduced accuracy. Summary of the invention

[0003] In order to solve the problem that the all-quartz split accelerometer is prone to creep resolution and reduced accuracy after assembly, the technical solution adopted by the present invention is:

[0004] A method for assembling a full-quartz split-type vibration beam accelerometer, wherein the components of the accelerometer are all made of amorphous or single-crystal quartz, and the components include: a damping plate, a base, a mass pendulum, a flexible beam and a vibration beam; the above components are combined together according to the accelerometer structure and the components are bonded together through a bonding process.

[0005] Furthermore, the surfaces of the components are polished and cleaned before the bonding process.

[0006] Furthermore, the bonding process conditions are: a temperature above 200° C., a pressure of 0.2-40 atmospheres, and a period of more than one hour.

[0007] Furthermore, polishing uses a mechanical glass polishing technique, and cleaning uses a solution containing water, hydrogen peroxide, and ammonium hydroxide.

[0008] In the above scheme, since the accelerometer components are assembled together by bonding process, the atoms of the component materials will diffuse with each other and form chemical bonds. This chemical bond will not creep, and the connected parts are made of the same material, so there will be no thermal expansion mismatch between the bonded parts, and the resolution and accuracy can be maintained during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 Schematic diagram of accelerometer bonding. DETAILED DESCRIPTION

[0010] In order to better understand the concept of the present invention, the technical solution of the present invention is further described in detail below with reference to the accompanying drawings.

[0011] like Figure 1The split-type vibration beam accelerometer shown includes the following components: a damping plate 1, a base 2, a mass pendulum 3, a flexible beam 4 and a vibration beam 5; the above components in the accelerometer are all made of amorphous or single crystal quartz materials. The base 2 and the damping plate 1 are connected, and the base 2 and the mass pendulum 3 are connected through the flexible beam 4 and the vibration beam 5, wherein the base 2 and the mass pendulum 3 are both composed of two components, and the flexible beam 4 is sandwiched in the middle to form a connection.

[0012] The above components are combined together through a bonding process to form an accelerometer.

[0013] The specific process method is to polish the surfaces of the above-mentioned components using standard mechanical glass polishing technology after the components are manufactured, and then clean them with a solution containing water, hydrogen peroxide and ammonium hydroxide and dry them to obtain a surface finish that meets the bonding requirements.

[0014] Then the above parts are Figure 1 The structure shown is assembled together by a fixture, and the bonding process is carried out for more than one hour at a temperature above 200°C and a pressure of 0.2-40 atmospheres. The atoms of the materials in the contact parts of each component will diffuse with each other and form chemical bonds. This chemical bond will not creep. If the connected parts are made of the same material, there will be no thermal expansion mismatch between the bonded parts. Figure 1 Schematic bonding layer a.

Claims

1. A method for assembling a full-quartz split-type vibrating beam accelerometer, wherein the accelerometer components are all made of amorphous or single-crystal quartz, and the components include: Damping plate (1), base (2), mass pendulum (3), flexible beam (4) and vibration beam (5); The above components are combined together according to the accelerometer structure and bonded together through a bonding process.

2. The method for assembling a full quartz split vibrating beam accelerometer according to claim 1, characterized in that: The surfaces of each component are polished and cleaned before the bonding process.

3. The method for assembling a full quartz split vibrating beam accelerometer according to claim 1 or 2, characterized in that: The bonding process conditions are: a temperature above 200°C, a pressure of 0.2-40 atmospheres, and a period of more than one hour.

4. The method for assembling a full quartz split-type vibrating beam accelerometer according to claim 2, characterized in that: Polishing was performed using mechanical glass polishing techniques, and cleaning was performed using a solution containing water, hydrogen peroxide, and ammonium hydroxide.

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