Bimetal structure probe

Abstract

The invention discloses a bimetallic structure probe, and belongs to the technical field of chip detection. The device mainly comprises a probe mechanism, the probe mechanism is provided with a PCB, the PCB is provided with a probe seat, and the probe seat is provided with a plurality of groups of installation grooves; the probe group comprises a first metal probe, one end of the first metal probe protrudes out of the surface of the probe seat and forms an arc-shaped part, and a detection head is arranged on the arc-shaped part; an arc-shaped elongated slot is formed in the arc-shaped part of the first metal probe, a second metal probe is arranged in the elongated slot, and the first metal probe and the second metal probe are made into strip materials by adopting metals with different thermal expansion coefficients through a special calendering process. According to the bimetal structure probe, the touch sensor is moved to the designated position to detect whether the touch sensor makes contact with the detection head of the first metal probe or not, and whether the detection head of the first metal probe is abraded or deformed or not is judged according to the sensing result.

Description

Technical Field

[0001] The present application relates to the field of chip detection technology, and specifically to a bimetallic structure probe. Background Art

[0002] The probe is usually a very small metal needle-like structure. During the chip production process, the detection probe can contact the pins or internal test points of the chip to transmit electrical signals to detect whether the chip can work normally, such as whether the input and output signals of the chip meet expectations, and whether there are short circuits or open circuits in the circuit. In chip testing, the probe is usually installed on a test fixture (also called a test socket). The test socket is a key component that connects the chip and the test equipment during chip testing. It is used in conjunction with automatic test equipment (ATE). ATE can send various stimulus signals and transmit them to the chip through the probe, while receiving the chip feedback signal, so as to test the chip's functions, performance parameters, etc., such as whether the chip's logical function is correct, whether the operating speed meets the standard, and many other key indicators; In the existing test of contact between the probe on the test socket and the integrated chip, the probe is moved to the corresponding contact point of the chip through an external auxiliary device, and then a certain contact pressure is applied to the probe. After that, the test equipment sends a signal to the chip through the probe to detect the electrical characteristics of the chip. However, the contact between the probe and the integrated chip requires the help of external equipment, and after the test, the probe and the chip are in a connected state for a long time, which may affect the performance of the chip and the probe due to environmental, static electricity and other factors, making it difficult to achieve a quick response, reducing the flexibility of the test. At the same time, the existing probes often cannot meet the test requirements of achieving different connection states at different temperatures, so it is necessary to provide a bimetallic structure probe to solve the above problems.

[0003] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0004] Based on the above-mentioned problems existing in the prior art, the problem to be solved by the present application is: to provide a bimetallic structure probe to meet the testing requirements of different connection states of the chip at different temperatures, and at the same time to realize deformation or wear detection of the detection head of the first metal probe to ensure accurate connection when contacting with the integrated chip.

[0005] The technical solution adopted by the present application to solve its technical problems is: a probe mechanism, which has a PCB board, on which a probe seat is installed, and a plurality of mounting grooves are provided on the probe seat; a probe group, which is installed in the mounting groove, and the probe group includes: a first metal probe, which is installed in the mounting groove, one end of the first metal probe protrudes from the surface of the probe seat and forms an arc-shaped portion, and a detection head is arranged on the arc-shaped portion; an arc-shaped long groove is arranged on a side of the arc-shaped portion of the first metal probe away from the detection head, and a second metal probe is arranged in the long groove, and the first metal probe and the second metal probe are made of metals with different thermal expansion coefficients using a special calendering process to form strips.

[0006] Further, the probe seat is equipped with multiple detection mechanisms, and the detection mechanisms include mounting plates installed on both sides of the probe seat, the mounting plates have an open slot, a slider is slidably installed in the open slot, a first spring is installed on the side of the slider, and the other end of the first spring is connected to the top of the inner wall of the open slot; A support plate is connected and installed between the two groups of sliders, a vertical plate is installed on the support plate, a storage bin is installed through the vertical plate, the storage bin is a hollow structure, two groups of bin doors are hinged at the opening of the storage bin, a touch sensor is installed on one group of bin doors, a first cylinder is installed at one end of the probe seat, and the telescopic end of the first cylinder is connected to the slider Furthermore, a third cylinder is installed on both sides of the storage bin, a hinged joint is installed on the telescopic shaft of the third cylinder, two sets of connecting plates are hingedly installed on the hinged joint, and one end of the connecting plate is movably connected to the side end of the bin door.

[0007] Furthermore, a fixed seat is installed in the storage bin, and the fixed seat has a T-shaped slide groove. Two groups of clamp seats are slidably installed in the T-shaped slide groove. A second spring is connected between the clamp seat and the inner wall of the storage bin. A chuck sleeve is clamped between the two groups of the clamp seats, and the chuck sleeve is made of the same metal material as the first metal probe.

[0008] Furthermore, a buckle rod is movably inserted into the upper and lower ends of the inner wall of the chuck sleeve, one end of the buckle rod has a hemispherical protrusion, the first metal probe is provided with a groove adapted to the protrusion, a third spring is movably sleeved on the buckle rod, one end of the third spring is connected to the inner wall of the chuck sleeve, and the other end of the third spring is connected to the protrusion.

[0009] Furthermore, a connecting seat is installed on a side of the slider away from the supporting plate, a square groove matching the width of the connecting seat is opened on the bottom surface of the mounting plate, a control board is installed at one end of the connecting seat, and the control board has a first slideway opened vertically; A mounting seat is installed on the side of the probe seat, a control rod is hinged on the mounting seat, one end of the control rod has a control ball, the control ball is an elastic ball, the control ball is in the first slide in a default state, the first slide is connected to a second slide, the bottom position of the second slide is lower than the bottom position of the first slide.

[0010] Furthermore, a third slide is connected to the second slide, the bottom of the third slide is lower than the bottom of the second slide, there is a first step between the third slide and the second slide, and a first vertex is provided at the connection between the third slide and the second slide, and the first vertex is in the third slide.

[0011] Furthermore, a fourth slide is connected to the third slide, the bottom of the fourth slide is lower than the bottom of the third slide, and a second step is provided between the fourth slide and the third slide; A fifth slide is connected to the fourth slide, the bottom height of the fifth slide is lower than the bottom height of the fourth slide, a third step is provided between the fourth slide and the fifth slide, a second vertex is provided at the connection between the fourth slide and the fifth slide, the second vertex is located in the fifth slide, and the height of the second vertex is different from that of the first vertex.

[0012] Furthermore, a second cylinder is installed on the control panel, and a block is installed at the telescopic end of the second cylinder. The upper surface of the block is in an inclined state, and the transition between the third slide and the fifth slide is smooth. The block is suitable for rising and falling with the telescopic end of the second cylinder to form a staying point for the control ball to stay between the third slide or to form a sixth slide for the control ball to pass through. A second switch is also provided at the side position of the block at the staying point.

[0013] Furthermore, the elastic force of the third spring is greater than the elastic force of the second spring.

[0014] The beneficial effect of the present application is as follows: a bimetallic structure probe provided by the present application, through the setting of a probe mechanism and a detection mechanism, thereby moving a touch sensor to a specified position to detect whether it is in contact with the detection head of a first metal probe, and judging whether the detection head of the first metal probe is worn or deformed according to the sensing result, so as to install a chuck cover on the detection head of the first metal probe, so that the connection point of the first metal probe and the integrated chip is in close contact.

[0015] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 This is an overall schematic diagram of a bimetallic structure probe in this application; Figure 2 for Figure 1 Schematic diagram of the local structure in; Figure 3 for Figure 1 Schematic diagram of the probe mechanism structure in FIG. Figure 4 for Figure 2 Schematic diagram of the detection mechanism structure in ; Figure 5 for Figure 4 A magnified schematic diagram of region A; Figure 6 for Figure 4 A magnified schematic diagram of region B; Figure 7 for Figure 5 Schematic diagram of the enlarged C region; Figure 8 for Figure 6 Schematic diagram of the bottom structure of the middle control panel; Among them, the reference numerals in the figure are: 1. Probe mechanism; 101. PCB board; 102. Probe seat; 103. Mounting slot; 104. First metal probe; 105. Second metal probe; 106. Detection head; 107. Long slot; 108. Groove; 201, integrated chip; 202, solder ball; 3. Detection mechanism; 301. Mounting plate; 302. Sliding block; 303. First spring; 304. Extending rod; 305. First cylinder; 306. Support plate; 307. Vertical plate; 308. Control board; 309. Connecting seat; 310. Mounting seat; 311. Control rod; 312. First slideway; 313. Second slideway; 314. First vertex; 315. Third slideway; 316. Fourth slideway; 317. The second vertex; 318, the fifth slide; 319, the second cylinder; 320, the stopper; 321, the sixth slide; 322, the storage bin; 323, the bin door; 324, the touch sensor; 325, the third cylinder; 326, the hinge head; 327, the connecting plate; 328, the fixing seat; 329, the clamping plate seat; 330, the second spring; 331, the chuck sleeve; 332, the buckle rod; 333, the third spring; 334, the bump. DETAILED DESCRIPTION

[0017] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0018] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0019] Embodiment 1: In order to test the chip in a high temperature environment, to detect the test requirements of the chip to achieve different connection states at different temperatures, such as Figure 1-Figure 3 As shown, the present application provides a bimetallic structure probe, including a probe mechanism 1, the probe mechanism 1 is used to perform performance testing on an integrated chip 201, it should be noted that a solder ball 202 is provided on the integrated chip 201, the solder ball 202 is suitable for contacting with the probe mechanism 1 and forming an electrical connection; The probe mechanism 1 includes a PCB board 101, and a probe seat 102 is fixedly installed on the PCB board 101, and a plurality of mounting grooves 103 are opened on the probe seat 102, and probe groups are installed in the mounting grooves 103; The probe assembly includes a first metal probe 104 fixedly mounted in a mounting groove 103, and one end of the first metal probe 104 protrudes from the surface of the probe seat 102 to form an arc-shaped portion, and a detection head 106 is arranged on the arc-shaped portion, and the detection head 106 is suitable for contacting with the solder ball 202 on the integrated chip 201, thereby forming a conductive circuit, and then detecting the performance of the integrated chip 201; At the same time, an arc-shaped long groove 107 is provided on a side of the arc-shaped portion of the first metal probe 104 away from the detection head 106, and a second metal probe 105 is provided in the long groove 107. It should be noted that the first metal probe 104 and the second metal probe 105 are made of metals with different thermal expansion coefficients by a special rolling process, and the thermal expansion coefficient of the second metal probe 105 is greater than the thermal expansion coefficient of the first metal probe 104; It should be noted that when the integrated chip 201 is tested, the probe mechanism 1 and the integrated chip 201 are both in a closed environment to control the temperature of the first metal probe 104 and the second metal probe 105; In summary: when the integrated chip 201 needs to be tested in a high temperature environment, the integrated chip 201 is moved to the top of the probe group by an external lifting device, so that the solder ball 202 on the integrated chip 201 is located on one side of the first metal probe 104. At this time, the system is at room temperature, and the detection head 106 on the first metal probe 104 does not contact the solder ball 202, thereby achieving a circuit-breaking state at room temperature; Then, the probe group is heated to a specified temperature by an external heating device. As the temperature gradually rises, the second metal probe 105 is greatly thermally deformed, causing the first metal probe 104 to bend, so that the detection head 106 contacts the solder ball 202 on the integrated chip 201, thereby achieving conduction, so as to transmit current and signals in the loop, and realize the test of the integrated chip 201 at high temperature; After the test is completed, the detection head 106 and the solder ball 202 can be separated by simply lowering the temperature.

[0020] Embodiment 2: Since the probes on the test probe seat 102 of the above embodiment are frequently in close contact with the solder balls 202 on the chip under temperature control and are energized, the probe detection head 106 may be worn or even severely bent during long-term testing operations; In order to detect the state of the detection head 106, Figure 4-Figure 6 As shown, multiple detection mechanisms 3 are installed on the probe seat 102, and the detection mechanism 3 is used to detect the first metal probe 104 used for a long time, and the detection mechanism 3 includes a mounting plate 301 fixedly mounted on both sides of the probe seat 102, and the mounting plate 301 has an open slot (not marked in the figure); A slider 302 is slidably installed in the open slot, and a first spring 303 is fixedly installed on the side of the slider 302, the other end of the first spring 303 is connected to the top of the inner wall of the open slot, and the first spring 303 is suitable for limiting the position of the slider 302 in the open slot, and a protruding rod 304 is fixedly installed on the side of the slider 302, the protruding rod 304 sequentially movably penetrates the first spring 303 and the mounting plate 301, and the protruding rod 304 is suitable for linearly limiting the expansion and contraction of the first spring 303; Meanwhile, a support plate 306 is connected and installed between the two groups of sliders 302, a vertical plate 307 is fixedly installed on the support plate 306, and a storage bin 322 is installed through the vertical plate 307. The storage bin 322 is a hollow structure, and two groups of bin doors 323 are hinged at the opening of the storage bin 322, and a touch sensor 324 is fixedly installed on one group of bin doors 323. The touch sensor 324 is a device for detecting whether an object is in contact with it, which is mainly realized by mechanical structure or electronic induction; A first cylinder 305 is fixedly installed at one end of the probe seat 102, and the telescopic end of the first cylinder 305 is connected to the slider 302. The first cylinder 305 is suitable for pushing the slider 302 to move in the open groove and squeeze the first spring 303, so as to drive the storage bin 322 on the vertical plate 307 to gradually approach the detection head 106, and in the initial state, the two groups of bin doors 323 are in a closed state, so that when the bin door 323 is close to the detection head 106, the touch sensor 324 will contact the detection head 106 to detect the position of the detection head 106, and then determine whether the detection head 106 is worn during multiple detection processes: When the detection head 106 can contact with the touch sensor 324 in a free state, it means that during the detection, the detection head 106 can contact with the solder ball 202 for electrical conduction, and then the detection head 106 is judged to be in a qualified state. When the detection head 106 cannot contact with the touch sensor 324 in a free state, it means that during the detection, the detection head 106 cannot contact with the solder ball 202 for electrical conduction, and then the detection head 106 is judged to be in an unqualified state, that is, the detection head 106 is judged to be in a worn state, and the detection head 106 needs to be replaced at this time. In order to automatically process the worn detection head 106 to solve the problem of affecting the detection accuracy when the detection head 106 is worn or deformed, continue to refer to Figure 4-Figure 6 , a third cylinder 325 is fixedly installed on both sides of the storage bin 322, and a hinge head 326 is fixedly installed on the telescopic shaft of the third cylinder 325, and two groups of connecting plates 327 are hingedly installed on the hinge head 326, one end of the connecting plate 327 is movably connected to the side end of the bin door 323, and the third cylinder 325 is suitable for driving the two groups of bin doors 323 away from each other in the extended state to open the opening of the storage bin 322, and the third cylinder 325 is suitable for driving the two groups of bin doors 323 towards each other in the retracted state to close the opening of the storage bin 322; like Figure 5-Figure 7 As shown, a fixing seat 328 is fixedly installed in the storage bin 322, and the fixing seat 328 has a T-shaped slide groove (not shown in the figure), and two groups of clamping plate seats 329 are slidably installed in the T-shaped slide groove, and a second spring 330 is connected between the clamping plate seat 329 and the inner wall of the storage bin 322, and the two groups of clamping plate seats 329 are suitable for being close to each other under the action of the second spring 330, and a chuck sleeve 331 is clamped between the two groups of clamping plate seats 329, and the chuck sleeve 331 and the first metal probe 104 are made of the same metal material to ensure the electrical connection between the first metal probe 104 and the integrated chip 201; A buckle rod 332 is movably inserted between the upper and lower ends of the inner wall of the chuck sleeve 331, and one end of the buckle rod 332 has a hemispherical protrusion 334. At the same time, a groove 108 (such as Figure 2), and a third spring 333 is movably sleeved on the buckle rod 332, one end of the third spring 333 is connected to the inner wall of the chuck sleeve 331, and the other end of the third spring 333 is connected to the protrusion 334, and the two groups of protrusions 334 are suitable for being close to each other under the action of the third spring 333; It should be noted that the elastic force of the third spring 333 is greater than the elastic force of the second spring 330; Therefore, when the touch sensor 324 detects that the detection head 106 is in a worn state, the third cylinder 325 is controlled to extend so that the two groups of warehouse doors 323 are opened. At this time, the chuck cover 331 is facing the detection head 106, and driven by the first cylinder 305, the chuck cover 331 gradually approaches the detection head 106 of the first metal probe 104, and as the telescopic end of the first cylinder 305 reaches the limit position, the chuck cover 331 is completely fitted on the detection head 106, and the protrusion 334 in the inner cavity of the chuck cover 331 is fastened in the groove 108 under the action of the third spring 333, and as the third cylinder 325 is reset, the chuck cover 331 is still fitted on the detection head 106, so that the detection head 106 is put into use again; In order to automatically control the above detection process and the repair process of the above detection head 106, as Figure 6 and Figure 8 As shown, a connecting seat 309 is fixedly installed on a side of the slider 302 away from the supporting plate 306, and a square groove (not shown in the figure) adapted to the width of the connecting seat 309 is opened on the bottom surface of the mounting plate 301, and a control board 308 is fixedly installed at one end of the connecting seat 309, and the control board 308 has a first slideway 312 opened vertically, and a mounting seat 310 is fixedly installed on the side of the probe seat 102, and a control rod 311 is hinged on the mounting seat 310, and one end of the control rod 311 has a control ball, which is an elastic ball, and the control ball is in the first slideway 312 in the default state; A second slideway 313 is connected to the first slideway 312, and the bottom of the second slideway 313 is lower than the bottom of the first slideway 312, so that after the control ball slides from the first slideway 312 into the second slideway 313, it cannot return from the second slideway 313 to the first slideway 312; A third slide 315 is connected to the second slide 313, the bottom of the third slide 315 is lower than the bottom of the second slide 313, and a first step is provided between the third slide 315 and the second slide 313, so that after the control ball slides from the second slide 313 into the third slide 315, it cannot return from the third slide 315 to the second slide 313, and a first vertex 314 is provided at the connection between the third slide 315 and the second slide 313, and the first vertex 314 is in the third slide 315; It should be noted that, in the default state, when the first cylinder 305 drives the slider 302 to move to the specified stroke, that is, when the ball is controlled to slide and abut against the first vertex 314, the touch sensor 324 on the storage bin 322 just contacts the detection head 106 of the first metal probe 104; When the integrated chip 201 is tested, the first cylinder 305 is started to push the slider 302, and the slider 302 drives the vertical plate 307 to move and squeezes the first spring 303. At this time, the vertical plate 307 synchronously drives the touch sensor 324 on the storage bin 322 to approach the detection head 106 of the first metal probe 104, and the control ball synchronously slides from the first slideway 312 to the second slideway 313. When the telescopic end of the first cylinder 305 reaches the specified stroke, the control ball is held at the first vertex 314. At this time, the touch sensor 324 on the storage bin 322 approaches the detection head 106 of the first metal probe 104 and detects whether it is in contact with it, so as to determine whether it is deformed or worn. A fourth slide 316 is connected to the third slide 315. The bottom of the fourth slide 316 is lower than the bottom of the third slide 315. A second step (not shown) is provided between the fourth slide 316 and the third slide 315. Therefore, after the control ball slides from the third slide 315 into the fourth slide 316, it cannot return from the fourth slide 316 to the third slide 315. A fifth slide 318 is connected to the fourth slide 316, the bottom height of the fifth slide 318 is lower than the bottom height of the fourth slide 316, and a third step (not shown in the figure) is provided between the fourth slide 316 and the fifth slide 318, so that after the control ball slides from the fourth slide 316 into the fifth slide 318, it cannot return from the fifth slide 318 to the fourth slide 316, and a second vertex 317 is provided at the connection between the fourth slide 316 and the fifth slide 318, the second vertex 317 is in the fifth slide 318, and the second vertex 317 is at a different height from the first vertex 314; like Figure 6-Figure 8 As shown, a second cylinder 319 is fixedly mounted on the control panel 308, and a stopper 320 is fixedly mounted on the telescopic end of the second cylinder 319. The upper surface of the stopper 320 is in an inclined state, so that the transition between the third slideway 315 and the fifth slideway 318 is smooth, and the stopper 320 is suitable for rising and falling with the telescopic end of the second cylinder 319, so as to form a stop point (not shown in the figure) for the control ball to stay between the third slideway 315, or to form a sixth slideway 321 (as shown in the figure) for the control ball to pass through. Figure 6 ), and a second switch (not shown in the figure) is provided at the stop point, i.e., the side position of the stopper 320, and the second switch is used to control the third cylinder 325 to be in the starting state; In a default state, the second cylinder 319 is in a closed state, so that the stopper 320 does not rise to form the sixth slideway 321; Therefore, when the first cylinder 305 is started to drive the touch sensor 324 to approach the detection head 106 of the first metal probe 104 and detect whether it is in contact with it to determine whether it is deformed or worn, when the touch sensor 324 senses, it means that the detection head 106 of the first metal probe 104 is not worn. As the first cylinder 305 is reset, the slider 302 drives the vertical plate 307 to reset under the action of the first spring 303, and the vertical plate 307 drives the touch sensor 324 away from the detection head 106 of the first metal probe 104. At this time, the control ball synchronously slides from the first vertex 314 into the third slide 315, and slides from the third slide 315 into the sixth slide 321, and finally slides from the sixth slide 321 into the fifth slide 318 and returns to the first slide 312. At this time, the detection of the detection head 106 of the first metal probe 104 is completed to prevent the first metal probe 104 from being used multiple times, causing the detection head 106 of the first metal probe 104 to be worn or deformed, thereby resulting in a decrease in detection accuracy. When the touch sensor 324 does not sense, it means that the detection head 106 of the first metal probe 104 is worn or deformed. At this time, the touch sensor 324 sends a signal to the second cylinder 319, and the second cylinder 319 drives the stopper 320 to move up and form a stop point. As the first cylinder 305 is reset, the slider 302 drives the vertical plate 307 to reset under the action of the first spring 303, and the vertical plate 307 drives the touch sensor 324 away from the detection head 106 of the first metal probe 104. At this time, the control ball synchronously slides from the first vertex 314 into the third slideway 315, and slides from the third slideway 315 to the position of the stop point, and presses the second switch. At this time, the third cylinder 325 is synchronously started, and the telescopic end of the third cylinder 325 extends out and drives one end of the two groups of warehouse doors 323 to move away from each other, so that one end of the storage bin 322 is in an open state; A first switch (not shown in the figure) is disposed in the first slideway 312, and the first switch is used to control the third cylinder 325 and the second cylinder 319 to be in a closed state; Then the first cylinder 305 is started again to drive the vertical plate 307 to move and squeeze the first spring 303 again. At this time, the control ball slides into the fourth slideway 316 through the stop point, and as the first cylinder 305 reaches the limit stroke, the control ball gradually approaches and abuts against the second vertex 317. At this time, the vertical plate 307 synchronously drives the storage bin 322 in the open state to approach the detection head 106 of the first metal probe 104. When the control ball completely abuts against the second vertex 317, the chuck cover 331 is fitted on the detection head 106 of the first metal probe 104. At the same time, the chuck cover 331 is engaged in the groove 108 through the protrusion 334 under the action of the third spring 333, so as to fix the chuck cover 331 on the detection head 106 of the first metal probe 104. As the first cylinder 305 is reset, the vertical plate 307 is driven by the first spring 303 to drive the storage bin 322 gradually away from the first metal probe 104. At this time, the control ball synchronously slides from the second vertex 317 into the fifth slide 318, and then slides from the fifth slide 318 into the first slide 312, and presses the first switch, thereby controlling the third cylinder 325 and the second cylinder 319 to reset, so that the bin door 323 is closed, and the sixth slide 321 is opened to restore the initial state; Thus, by moving the touch sensor 324 to the specified position, it is detected whether it is in contact with the detection head 106 of the first metal probe 104, and according to the sensing result, it is determined whether the detection head 106 of the first metal probe 104 is worn or deformed, so that the chuck sleeve 331 is installed on the detection head 106 of the first metal probe 104, so that the connection point between the first metal probe 104 and the integrated chip 201 is in close contact, so as to transmit the current signal in the loop, realize the testing of the integrated chip 201 at high temperature, and thus avoid the wear or deformation of the first metal probe 104 affecting the contact effect of the connection point with the integrated chip 201, thereby affecting the accuracy of the test.

[0021] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A bimetallic structure probe, characterized in that: include: A probe mechanism (1) comprises a PCB board (101), a probe seat (102) being mounted on the PCB board (101), and a plurality of mounting grooves (103) being provided on the probe seat (102); a probe group, the probe group being mounted in the mounting groove (103), the probe group comprising: a first metal probe (104), the first metal probe (104) being mounted in the mounting groove (103), one end of the first metal probe (104) protruding from the surface of the probe seat (102) and forming an arc-shaped portion, and a detection head (106) being arranged on the arc-shaped portion; an arc-shaped long groove (107) being arranged on a side of the arc-shaped portion of the first metal probe (104) away from the detection head (106), and a second metal probe (105) being arranged in the long groove (107), and the first metal probe (104) and the second metal probe (105) being made of metals with different thermal expansion coefficients by a special calendering process to form strips.

2. A bimetallic structure probe according to claim 1, characterized in that: The probe seat (102) is provided with a plurality of detection mechanisms (3), wherein the detection mechanisms (3) include mounting plates (301) mounted on both sides of the probe seat (102), wherein the mounting plates (301) have an open slot, wherein a slider (302) is slidably mounted in the open slot, wherein a first spring (303) is mounted on the side of the slider (302), wherein the first spring (303) is mounted on the side of the slider (302), wherein the other end of the first spring (303) is connected to the top end of the inner wall of the open slot; and wherein the two sets of sliders (3 02) is connected and installed with a support plate (306), a vertical plate (307) is installed on the support plate (306), a storage bin (322) is installed through the vertical plate (307), the storage bin (322) is a hollow structure, two groups of bin doors (323) are hinged at the opening of the storage bin (322), a touch sensor (324) is installed on one group of the bin doors (323), a first cylinder (305) is installed at one end of the probe seat (102), and the telescopic end of the first cylinder (305) is connected to the slider (302).

3. A bimetallic structure probe according to claim 2, characterized in that: A third cylinder (325) is installed on both sides of the storage bin (322), a hinge joint (326) is installed on the telescopic shaft of the third cylinder (325), two groups of connecting plates (327) are hingedly installed on the hinge joint (326), and one end of the connecting plate (327) is movably connected to the side end of the bin door (323).

4. A bimetallic structure probe according to claim 3, characterized in that: A fixed seat (328) is installed in the storage bin (322), and the fixed seat (328) has a T-shaped slide groove. Two groups of clamping seats (329) are slidably installed in the T-shaped slide groove. A second spring (330) is connected between the clamping seat (329) and the inner wall of the storage bin (322). A chuck sleeve (331) is clamped between the two groups of the clamping seats (329), and the chuck sleeve (331) and the first metal probe (104) are made of the same metal material.

5. A bimetallic structure probe according to claim 4, characterized in that: A buckle rod (332) is movably inserted into the upper and lower ends of the inner wall of the chuck sleeve (331), and one end of the buckle rod (332) has a hemispherical protrusion (334). The first metal probe (104) is provided with a groove (108) adapted to the protrusion (334). A third spring (333) is movably sleeved on the buckle rod (332), and one end of the third spring (333) is connected to the inner wall of the chuck sleeve (331), and the other end of the third spring (333) is connected to the protrusion (334).

6. A bimetallic structure probe according to claim 5, characterized in that: A connecting seat (309) is installed on a side of the slider (302) away from the support plate (306), and a square groove matching the width of the connecting seat (309) is opened on the bottom surface of the mounting plate (301). A control board (308) is installed on one end of the connecting seat (309), and the control board (308) has a first slideway (312) opened vertically; a mounting seat (310) is installed on the side of the probe seat (102), and a control rod (311) is hinged on the mounting seat (310), and a control ball is provided at one end of the control rod (311), and the control ball is an elastic ball. In a default state, the control ball is in the first slideway (312), and a second slideway (313) is opened on the first slideway (312), and the bottom position of the second slideway (313) is lower than the bottom position of the first slideway (312).

7. A bimetallic structure probe according to claim 6, characterized in that: The second slide (313) is connected to a third slide (315), the bottom of the third slide (315) is lower than the bottom of the second slide (313), a first step is provided between the third slide (315) and the second slide (313), a first vertex (314) is provided at the connection between the third slide (315) and the second slide (313), and the first vertex (314) is located in the third slide (315).

8. A bimetallic structure probe according to claim 7, characterized in that: The third slide (315) is connected to a fourth slide (316), the bottom of the fourth slide (316) is lower than the bottom of the third slide (315), and a second step is provided between the fourth slide (316) and the third slide (315); the fourth slide (316) is connected to a fifth slide (318), the bottom of the fifth slide (318) is lower than the bottom of the fourth slide (316), and a third step is provided between the fourth slide (316) and the fifth slide (318), and a second vertex (317) is provided at the connection between the fourth slide (316) and the fifth slide (318), the second vertex (317) is located in the fifth slide (318), and the height of the second vertex (317) is different from that of the first vertex (314).

9. A bimetallic structure probe according to claim 8, characterized in that: A second cylinder (319) is installed on the control panel (308), and a stopper (320) is installed at the telescopic end of the second cylinder (319). The upper surface of the stopper (320) is in an inclined state. The transition between the third slideway (315) and the fifth slideway (318) is smooth. The stopper (320) is suitable for being raised and lowered along with the telescopic end of the second cylinder (319) to form a stop point for the control ball to stay between the third slideway (315) or to form a sixth slideway (321) for the control ball to pass through. A second switch is also provided at the stop point at the side of the stopper (320).

10. A bimetallic structure probe according to claim 9, characterized in that: The elastic force of the third spring (333) is greater than the elastic force of the second spring (330).

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