A LED driver chip testing system and method

Abstract

The present invention provides a LED driver chip test system and method, and relates to the field of chip testing technology. The method includes: collecting first electrical data in a steady-state load test process and second electrical data in a transient load test process; extracting steady-state index parameters and transient index parameters of multiple load points and determining multiple target load points; constructing an electrical characteristic correlation matrix and an electrical fluctuation correlation matrix corresponding to multiple target load points; performing feature fusion on the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix to generate a target correlation matrix, determining multiple electrical parameter linkage combinations based on the target key matrix, generating a first linkage test scheme for each electrical parameter linkage combination, and performing linkage testing on the LED driver chip based on multiple first linkage test schemes. The present invention achieves the improvement of the effectiveness and comprehensiveness of LED driver chip testing.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a system and method for testing an LED driver chip. Background Art

[0002] Some LED driver chip test systems usually use simulation test methods in different scenarios to evaluate the performance of the chip under various load conditions. Specifically, these tests focus on the steady-state or transient response of the driver chip in different load, voltage and temperature scenarios. However, these test methods usually treat the performance of various electrical parameters such as current, voltage, power, etc. as independent individuals, lacking comprehensive consideration of the correlation and linkage characteristics between these electrical parameters. Although it can capture the performance of the chip in a single scenario, it cannot fully reveal the complex relationship between the different electrical parameters. As a result, when using the designed test scenarios to test LED driver chips, the potential performance bottlenecks are not accurately explored, and the effectiveness and accuracy of the test need to be improved. Summary of the invention

[0003] In order to solve the above technical problems, the present invention proposes a LED driver chip testing system and method, which incorporates the correlation between different electrical parameters into the test scheme to more realistically simulate the working performance of the chip under complex conditions, facilitate more accurate discovery of potential performance bottlenecks, and improve the effectiveness and comprehensiveness of the test.

[0004] A first aspect of the present invention provides a method for testing an LED driver chip, comprising:

[0005] Determine a steady-state load test scenario for performing a load fluctuation test on an LED driver chip, perform a steady-state load test on the LED driver chip based on the steady-state load test scenario, and collect first electrical data during the steady-state load test;

[0006] Determine a transient load test scenario for performing a load fluctuation test on an LED driver chip, perform a transient load test on the LED driver chip based on the transient load test scenario, and collect second electrical data during the transient load test;

[0007] Extracting steady-state index parameters of multiple load points in the first electrical data and transient index parameters of multiple load points in the second electrical data, constructing a first electrical parameter feature vector and a second electrical parameter feature vector for each load point and determining multiple target load points;

[0008] Performing feature correlation analysis on a plurality of target load points according to a first electrical parameter feature vector and a second electrical parameter feature vector of the load point, and constructing an electrical feature correlation matrix corresponding to the plurality of target load points;

[0009] Extracting first electrical parameter fluctuation vectors and second electrical parameter fluctuation vectors of multiple target load points from the steady-state index parameters and transient index parameters of the load points, performing fluctuation correlation analysis on the multiple target load points, and constructing an electrical fluctuation correlation matrix corresponding to the multiple target load points;

[0010] The electrical fluctuation correlation matrix and the electrical characteristic correlation matrix are feature fused to generate a target correlation matrix, which includes a target correlation factor between any two electrical parameters. Based on the target correlation matrix, multiple electrical parameter linkage combinations are determined, and a first linkage test scheme is generated for each electrical parameter linkage combination. Based on the multiple first linkage test schemes, a linkage test is performed on the LED driver chip.

[0011] Preferably, a plurality of electrical parameter linkage combinations are determined based on the target association matrix, and a first linkage test scheme for each electrical parameter linkage combination is generated, including:

[0012] Selecting multiple first parameter combinations whose target correlation factors are greater than a preset correlation threshold based on the target correlation matrix, and if there is an electrical parameter whose target correlation factor with multiple electrical parameters in the first parameter combination is greater than the preset correlation threshold, adding the electrical parameter to the first parameter combination to generate a second parameter combination corresponding to the first parameter combination;

[0013] Traversing multiple first parameter combinations to determine multiple second parameter combinations, recording the second parameter combinations as electrical parameter linkage combinations, and determining main driving parameters of each electrical parameter linkage combination;

[0014] Wherein, for any electrical parameter linkage combination, a plurality of electrical parameters included in the first parameter combination belonging to the electrical parameter linkage combination in the electrical parameter linkage combination are recorded as reference driving parameters, the sum of target correlation factors between each reference driving parameter and the remaining electrical parameters in the electrical parameter linkage combination is calculated, and the reference driving parameter with the largest sum of target correlation factors is selected as the main driving parameter;

[0015] Determine multiple sampling thresholds for testing the electrical parameter linkage combination according to the main drive parameters, and determine a first linkage test scheme corresponding to the electrical parameter linkage combination according to the multiple sampling thresholds for testing the electrical parameter linkage combination;

[0016] Among them, for the electrical parameters other than the main drive parameters in the electrical parameter linkage combination, the sampling threshold is determined in the following way:

[0017] ;

[0018] In the formula, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The sampling threshold of the electrical parameters, is the reference threshold of the electrical parameter linkage combination, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The target correlation factor between the electrical parameters and the main drive parameters.

[0019] Preferably, after determining a plurality of electrical parameter linkage combinations based on the target association matrix, the method further includes:

[0020] For any electrical parameter linkage combination, extract the first load characteristic vector and the second load characteristic vector of each electrical parameter of the electrical parameter linkage combination according to the first electrical data and the second electrical data, and fuse the first load characteristic vector and the second load characteristic vector of each electrical parameter to generate a target load characteristic vector;

[0021] According to the target load characteristic vector, the observation points between the main driving parameters and multiple electrical parameters in the electrical parameter linkage combination are determined; according to the observation points between the main driving parameters and the multiple electrical parameters, the linkage observation conditions of each electrical parameter linkage combination are determined; according to the linkage observation conditions, the second linkage test scheme corresponding to each electrical parameter linkage combination is determined; and the LED driver chip is linked to the test based on the multiple second linkage test schemes.

[0022] Preferably, constructing a first electrical parameter characteristic vector and a second electrical parameter characteristic vector for each load point and determining a plurality of target load points comprises:

[0023] Extracting the steady-state value of each electrical parameter at each load point from the steady-state index parameter, and constructing a first electrical parameter fluctuation vector including the steady-state values ​​of multiple electrical parameters at each load point;

[0024] Extracting the transient value of each electrical parameter at each load point from the transient index parameter, and constructing a second electrical parameter fluctuation vector including the transient values ​​of multiple electrical parameters at each load point;

[0025] An electrical parameter difference feature vector is generated for each load point according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, and a weighted sum is performed on multiple eigenvalues ​​in the electrical parameter difference feature vector to generate an electrical parameter difference score for each load point, and multiple load points whose electrical parameter difference scores are greater than a preset screening threshold are recorded as target load points.

[0026] Preferably, the electrical characteristic correlation matrix and the electrical fluctuation correlation matrix further include:

[0027] Performing feature correlation analysis on multiple target load points according to the electrical parameter difference feature vector of each load point generated by the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, including calculating a first correlation factor of the electrical parameter difference feature vector between any two target load points, and constructing an electrical fluctuation correlation matrix corresponding to the multiple target load points according to the multiple first correlation factors;

[0028] An electrical parameter difference fluctuation vector is generated for each target load point according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of the target load point, and fluctuation correlation analysis is performed on multiple target load points according to the electrical parameter difference fluctuation vector, including calculating the second correlation factor of the electrical parameter difference fluctuation vector between any two target load points, and constructing an electrical fluctuation correlation matrix corresponding to multiple target load points according to the multiple second correlation factors.

[0029] Preferably, the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix are subjected to feature fusion to generate a target correlation matrix, including:

[0030] A first correlation factor and a second correlation factor corresponding to each electrical parameter pair are determined, the first correlation factor is corrected based on the second correlation factor, a target correlation factor corresponding to each electrical parameter pair is obtained, and a target correlation matrix including multiple target correlation factors is generated.

[0031] A second aspect of the present invention provides an LED driver chip testing system, which is used to implement the above-mentioned LED driver chip testing method, including:

[0032] A steady-state load test module, used to determine a steady-state load test scenario for performing a load fluctuation test on the LED driver chip, perform a steady-state load test on the LED driver chip based on the steady-state load test scenario, and collect first electrical data during the steady-state load test;

[0033] A transient load test module, used to determine a transient load test scenario for performing a load fluctuation test on an LED driver chip, perform a transient load test on the LED driver chip based on the transient load test scenario, and collect second electrical data during the transient load test process;

[0034] A load point analysis module, used to extract steady-state index parameters of multiple load points in the first electrical data and transient index parameters of multiple load points in the second electrical data, construct a first electrical parameter feature vector and a second electrical parameter feature vector for each load point and determine multiple target load points;

[0035] A characteristic correlation analysis module, used to perform characteristic correlation analysis on a plurality of target load points according to a first electrical parameter characteristic vector and a second electrical parameter characteristic vector of the load point, and construct an electrical characteristic correlation matrix corresponding to the plurality of target load points;

[0036] A fluctuation correlation analysis module is used to extract the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of multiple target load points from the steady-state index parameters and transient index parameters of the load points, perform fluctuation correlation analysis on the multiple target load points, and construct an electrical fluctuation correlation matrix corresponding to the multiple target load points;

[0037] The electrical parameter linkage analysis module is used to generate a target correlation matrix by performing feature fusion on the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix. The target correlation matrix includes the target correlation factor between any two electrical parameters, and determines multiple electrical parameter linkage combinations based on the target correlation matrix.

[0038] The linkage test module is used to generate a first linkage test scheme for each electrical parameter linkage combination, and perform linkage test on the LED driver chip based on multiple first linkage test schemes.

[0039] Preferably, the load point analysis module constructs a first electrical parameter characteristic vector and a second electrical parameter characteristic vector for each load point and determines a plurality of target load points, including:

[0040] Extracting the steady-state value of each electrical parameter at each load point from the steady-state index parameter, and constructing a first electrical parameter fluctuation vector including the steady-state values ​​of multiple electrical parameters at each load point;

[0041] Extracting the transient value of each electrical parameter at each load point from the transient index parameter, and constructing a second electrical parameter fluctuation vector including the transient values ​​of multiple electrical parameters at each load point;

[0042] An electrical parameter difference feature vector is generated for each load point according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, and a weighted sum is performed on multiple eigenvalues ​​in the electrical parameter difference feature vector to generate an electrical parameter difference score for each load point, and multiple load points whose electrical parameter difference scores are greater than a preset screening threshold are recorded as target load points.

[0043] The present invention has the following beneficial effects:

[0044] The present invention constructs an electrical characteristic correlation matrix and an electrical fluctuation correlation matrix by analyzing steady-state test data and transient test data, and fuses them to generate a target correlation matrix. According to the target correlation matrix, a high-correlation parameter combination is screened and a test scheme is designed, so that more realistic linkage characteristics between electrical parameters can be captured during the test process; determining the main driving parameters based on the target correlation factor ensures that the main driving parameters have high influence and linkage, and by reasonably selecting the main driving parameters, the test scope can be effectively narrowed to focus the test on the main parameters that have a greater impact on other parameters, so as to improve the test efficiency; dynamically adjusting the sampling threshold according to the correlation strength of different parameters in the target correlation matrix can more flexibly capture the changes of each parameter, so as to accurately sample the changes of key linkage parameters; generating a target load characteristic vector by fusing the first load characteristic vector and the second load characteristic vector and determining the observation point of each electrical parameter, so that the collected data can more accurately reflect the steady-state and transient characteristics of the electrical parameters at different load points. This setting of observation points ensures that the focus of the test is concentrated on the load points where the electrical parameters change most significantly, thereby improving the targetedness of data collection; by fusing the data of steady-state characteristics and transient response, it can gain deeper insight into the linkage characteristics of electrical parameters from both the steady-state and dynamic aspects of the system, help identify potential problems of the chip under complex load conditions, and facilitate a more comprehensive evaluation of the chip's performance under actual working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic flow chart of a method for testing an LED driver chip provided by an embodiment of the present invention.

[0046] Figure 2 A schematic diagram of the structure of an LED driver chip testing system provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0047] In order to make the technical solutions in the present invention better understood by the persons skilled in the art, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0048] See also Figure 1 , which shows a schematic flow chart of a method for testing an LED driver chip provided by an embodiment of the present invention, the method specifically comprises the following steps:

[0049] Step S1, determining a steady-state load test scenario for performing a load fluctuation test on an LED driver chip, performing a steady-state load test on the LED driver chip based on the steady-state load test scenario, and collecting first electrical data during the steady-state load test.

[0050] Specifically, the steady-state load test scenario for the load fluctuation test of the LED driver chip covers the working state of the LED driver chip under different constant load conditions. In the steady-state load test scenario, different load intensities are applied to the LED driver chip to keep it running stably under each load condition to capture the performance of the chip in a steady state. During the steady-state test, the relevant data on different electrical parameters of the LED driver chip under each load condition are continuously collected to collect the first electrical data, including but not limited to the monitoring results of multiple key parameters such as current, voltage, and power in the LED driver chip.

[0051] Step S2: determining a transient load test scenario for performing a load fluctuation test on the LED driver chip, performing a transient load test on the LED driver chip based on the transient load test scenario, and collecting second electrical data during the transient load test.

[0052] Specifically, the transient load test scenario for the load fluctuation test of the LED driver chip is used to simulate the working performance of the LED driver chip under load mutation conditions, such as multiple test schemes under test conditions such as rapid load jump and pulse load change, so as to simulate the load fluctuation that the chip may face in actual application. The LED driver chip is tested in the transient load test scenario, and relevant electrical data is collected in real time under transient conditions, recorded as the second electrical data, corresponding to the monitoring data of multiple electrical parameters.

[0053] Step S3, extracting steady-state index parameters of multiple load points in the first electrical data and transient index parameters of multiple load points in the second electrical data, constructing a first electrical parameter feature vector and a second electrical parameter feature vector for each load point and determining multiple target load points.

[0054] Specifically, the collected first electrical data and second electrical data are further processed to extract the key electrical parameters of each load point in steady-state and transient tests. For example, the steady-state index parameters of multiple load points are extracted from the first electrical data, including the steady-state value and steady-state fluctuation value of each electrical parameter, such as the average current value reflecting the current output capability of the chip under load stability conditions, the fluctuation amplitude reflecting the voltage fluctuation range of the chip under load stability conditions, etc. The transient index parameters of multiple load points are extracted from the second electrical data, including the transient value and transient fluctuation value of each electrical parameter, such as the transient peak value and minimum value of the output current reflecting the overshoot and undershoot phenomena of the current in the jump process when the load suddenly changes, and the rise time and fall time of the response level of the electrical parameters under transient conditions. Then, the characteristic vectors of the electrical parameters are constructed according to the steady-state and transient data of each load point, namely the first electrical parameter characteristic vector and the second electrical parameter characteristic vector. By analyzing the characteristic vectors of the electrical parameters of different load points, multiple target load points that are representative and typical of the chip performance can be determined, so as to conduct in-depth parameter linkage analysis on these load points.

[0055] Step S4: performing feature correlation analysis on a plurality of target load points according to the first electrical parameter feature vector and the second electrical parameter feature vector of the load point, and constructing an electrical feature correlation matrix corresponding to the plurality of target load points.

[0056] Specifically, the purpose of performing characteristic correlation analysis on the selected target load point is to analyze the correlation between the characteristic values ​​of each electrical parameter under steady-state and transient conditions to construct an electrical characteristic correlation matrix. Each element in the electrical characteristic correlation matrix represents the characteristic correlation between two electrical parameters at the characteristic value level in the characteristic analysis, reflecting the degree of characteristic correlation between the electrical parameters.

[0057] Step S5, extracting the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of multiple target load points from the steady-state index parameters and transient index parameters of the load points, performing fluctuation correlation analysis on the multiple target load points, and constructing an electrical fluctuation correlation matrix corresponding to the multiple target load points.

[0058] Specifically, the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of each load point extracted from the steady-state and transient test data of the target load point reflect the characteristic fluctuation characteristics of the electrical parameters in the steady state and transient state, respectively. For the construction of the electrical parameter fluctuation vector, in the steady state, the steady-state fluctuation value can be selected for construction, such as the fluctuation amplitude reflecting the fluctuation range of different electrical parameters in the steady state, and in the transient state, the transient fluctuation value can be selected for construction, such as the difference between the transient peak value and the minimum value of different electrical parameters. The technicians in this field can reasonably select the parameters that can characterize the fluctuation characteristics of the electrical parameters in the steady state and transient state based on the actual situation to construct the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector. Then, these fluctuation vectors are subjected to fluctuation correlation analysis to identify the minute fluctuation relationship of the electrical parameters at different load points, and an electrical fluctuation correlation matrix is ​​constructed, in which the elements represent the degree of correlation of the characteristic fluctuations of the two electrical parameters, which is used to reveal the correlation of the characteristics of the electrical parameters in the steady state and transient state during the load fluctuation process.

[0059] Step S6, perform feature fusion on the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix to generate a target correlation matrix, determine multiple electrical parameter linkage combinations based on the target correlation matrix, generate a first linkage test scheme for each electrical parameter linkage combination, and perform linkage testing on the LED driver chip based on the multiple first linkage test schemes.

[0060] Specifically, after obtaining the electrical characteristic correlation matrix and the electrical fluctuation correlation matrix, a feature fusion operation is performed to combine the data results of the two to generate a target correlation matrix. Each element in the target correlation matrix represents the target correlation factor between the two electrical parameters, covering the overall correlation between the steady-state characteristics and transient fluctuations. Then, according to the target correlation matrix, multiple linkage combinations of electrical parameters with strong correlation are determined, and the first linkage test scheme for each linkage combination is designed. The design of the test scheme takes into account the correlation information between the electrical parameters, and can more comprehensively perform linkage tests on the LED driver chip, evaluate the stability, efficiency and transient response characteristics of the chip under multi-parameter linkage conditions, so as to more realistically simulate the performance of the chip under complex working conditions, better discover the potential performance bottlenecks of the LED driver chip, and improve the effectiveness and comprehensiveness of the LED driver chip test.

[0061] In the above solution, for step S3, constructing a first electrical parameter characteristic vector and a second electrical parameter characteristic vector for each load point and determining a plurality of target load points specifically includes:

[0062] The steady-state value of each electrical parameter at each load point is extracted from the steady-state index parameter, and a first electrical parameter fluctuation vector containing the steady-state values ​​of multiple electrical parameters at each load point is constructed. The steady-state value selected for constructing the first electrical parameter fluctuation vector is specifically a parameter average value reflecting the electrical parameter under different load conditions, such as a current average value, a voltage average value, etc.

[0063] The transient value of each electrical parameter at each load point is extracted from the transient index parameter, and a second electrical parameter fluctuation vector containing the transient values ​​of multiple electrical parameters at each load point is constructed. The transient values ​​selected for constructing the second electrical parameter fluctuation vector are specifically the transient values ​​of the electrical parameters under different load conditions, such as the transient peak value of voltage, the transient peak value of temperature, etc.

[0064] The electrical parameter difference characteristic vector of each load point is generated according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, which is used to characterize the difference characteristics of the electrical parameters under load changes. In this embodiment, the electrical parameter difference characteristic vector specifically includes the difference between the transient value and the steady-state value of multiple load points. Then, the multiple characteristic values ​​in the electrical parameter difference characteristic vector are weighted and summed to generate the electrical parameter difference score of each load point, wherein, the weighted summation process can be performed in an equal weighted manner, or the importance of the influence of different electrical parameters on the LED driver chip test can be reasonably set based on empirical knowledge, and finally the electrical parameter difference score that characterizes the comprehensive difference of the electrical parameters of each load point in steady state and transient state is determined. Through the preset screening threshold set in advance, multiple load points with electrical parameter difference scores greater than the preset screening threshold are recorded as target load points. These target load points represent load test conditions with large electrical parameter fluctuations, which can be used for linkage response analysis and further optimization.

[0065] In the above scheme, for the electrical characteristic correlation matrix in step S4 and the electrical fluctuation correlation matrix in step S5, the construction process includes:

[0066] A characteristic correlation analysis is performed on multiple target load points based on the electrical parameter difference characteristic vector of each load point generated by the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, including calculating the first correlation factor of the electrical parameter difference characteristic vector between any two target load points. The first correlation factor measures the similarity and linkage degree between the electrical parameter characteristics of different load points. The calculation of the correlation factor can be based on the Pearson correlation coefficient or cosine similarity. In this embodiment, cosine similarity is taken as an example, and the absolute value is taken as the first correlation factor. The same is true for the second correlation factor described below. Finally, an electrical fluctuation correlation matrix corresponding to multiple target load points is constructed based on multiple first correlation factors to display the similarity between the electrical characteristics of each load point.

[0067] An electrical parameter difference fluctuation vector of each target load point is generated according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of the target load point, reflecting the difference in characteristic fluctuation degree of different electrical parameters in steady state and transient state. Then, fluctuation correlation analysis is performed on multiple target load points according to the electrical parameter difference fluctuation vector, including calculating the second correlation factor of the electrical parameter difference fluctuation vector between any two target load points, which is used to measure the similarity between the load points at the characteristic fluctuation level. Finally, an electrical fluctuation correlation matrix corresponding to multiple target load points is constructed according to multiple second correlation factors to intuitively display the similarity of the fluctuation characteristics between the load points.

[0068] After determining the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix, the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix are subjected to a feature fusion process, and the first correlation factor and the second correlation factor corresponding to each electrical parameter pair are determined. The first correlation factor is corrected based on the second correlation factor, that is, the influence of the characteristic fluctuation on the characteristic value is considered, so as to better reflect the comprehensive correlation of parameters of different electrical parameters in steady-state and dynamic characteristics regarding the difference in characteristic values. Specifically, the second correlation factor is used to adjust the weight of the first correlation factor, enhance or weaken the contribution of the first correlation factor to the target correlation matrix, so as to obtain the target correlation factor corresponding to each electrical parameter pair, and generate a target correlation matrix containing multiple target correlation factors. The high target correlation factor in the matrix represents that the electrical parameter pairs have high similarity in the transformation law of the characteristic values ​​in steady-state and transient state.

[0069] In the above scheme, for step S6, multiple electrical parameter linkage combinations are determined based on the target association matrix, and a first linkage test scheme for each electrical parameter linkage combination is generated, specifically including:

[0070] Based on the target correlation matrix, multiple first parameter combinations with target correlation factors greater than a preset correlation threshold are selected. In this process, a higher threshold (such as 0.8 or 0.9) can be selected to ensure that the linkage relationship of the selected first parameter combination in electrical characteristics is significant. Furthermore, if there are electrical parameters with a target correlation factor greater than the preset correlation threshold between the multiple electrical parameters in the first parameter combination, the electrical parameters are added to the first parameter combination to generate a second parameter combination corresponding to the first parameter combination, so as to ensure that the electrical parameter linkage combination can cover a more comprehensive association combination.

[0071] After traversing multiple first parameter combinations in the above manner, multiple second parameter combinations can be determined, and finally the determined multiple second parameter combinations are all recorded as electrical parameter linkage combinations, and the main driving parameters of each electrical parameter linkage combination are determined as the main trigger parameters in chip testing.

[0072] Among them, for the determination scheme of the main driving parameters, taking any electrical parameter linkage combination as an example, multiple electrical parameters contained in the first parameter combination belonging to the electrical parameter linkage combination in the electrical parameter linkage combination are recorded as reference driving parameters, that is, the electrical parameters derived from the first parameter combination belonging to the gas in each second parameter combination are recorded as reference driving parameters, and then these reference driving parameters are further analyzed, including calculating the sum of target correlation factors between each reference driving parameter and the remaining electrical parameters in the electrical parameter linkage combination, and finally selecting the reference driving parameter with the largest sum of target correlation factors as the main driving parameter, so that the determined main driving parameter has a higher influence and is suitable as the main trigger condition in the test.

[0073] A plurality of sampling thresholds for testing the electrical parameter linkage combination are determined according to the main drive parameters, wherein for electrical parameters other than the main drive parameters in the electrical parameter linkage combination, the sampling thresholds are determined in the following manner:

[0074] ;

[0075] In the formula, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The sampling threshold of the electrical parameters, is the reference threshold of the electrical parameter linkage combination, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The target correlation factor between the electrical parameters and the main drive parameters.

[0076] It is worth noting that the reference threshold is a basic setting value, which is used to measure the reference benchmark of the data. The sampling threshold is that after reaching this threshold, the electrical parameter needs to be sampled. The relationship between the main drive parameter and the remaining electrical parameters in the electrical parameter linkage combination is to analyze how the remaining parameters change when the main drive parameter changes. For different main drive parameters, the corresponding reference threshold can be reasonably set based on actual conditions, and then for the observation of the remaining electrical parameters, such as voltage as the main drive parameter, the influence of voltage on temperature in the electrical parameter linkage combination is analyzed. Then, after observing that the voltage reaches the sampling threshold of the temperature, the linkage monitoring analysis between the voltage and the temperature is triggered. The sampling threshold is specifically the load at a certain stage. For example, the sampling threshold of the temperature is 20%. After observing that the voltage reaches 20% of the load, the linkage monitoring analysis between the voltage and the temperature is triggered. The linkage monitoring analysis can be, for example, using a higher sampling frequency to record the subsequent voltage and temperature change data, so as to further analyze the relationship between the voltage and the temperature based on the collected data to obtain more detailed test results. According to multiple sampling thresholds for testing the electrical parameter linkage combination, the first linkage test scheme corresponding to the electrical parameter linkage combination can be determined. Compared with the traditional test method designed based on empirical knowledge for different scenarios, generating the first linkage test scheme in the above manner can optimize the test process to obtain test sampling results containing rich information.

[0077] Furthermore, after determining the linkage combination of multiple electrical parameters based on the target correlation matrix, it also includes:

[0078] For any electrical parameter linkage combination, extract the first load characteristic vector and the second load characteristic vector of each electrical parameter of the electrical parameter linkage combination according to the first electrical data and the second electrical data, and fuse the first load characteristic vector and the second load characteristic vector of each electrical parameter to generate a target load characteristic vector;

[0079] Specifically, the first load characteristic vector and the second load characteristic vector respectively characterize the stable performance of the characteristic values ​​in the steady-state data and transient data of the electrical parameters under different load conditions. For example, the first load characteristic vector is constructed based on multiple steady-state values ​​of the electrical parameters, which describes the stable performance of each electrical parameter under different load conditions. The second load characteristic vector is constructed based on multiple transient values ​​of the electrical parameters, which reflects the dynamic response characteristics of each electrical parameter when the load changes. The first load characteristic vector and the second load characteristic vector of each electrical parameter are then fused by feature subtraction to generate a target load characteristic vector containing the steady-state response and transient response of the load point, which reflects the comprehensive performance of each load point in the change of electrical parameters.

[0080] According to the target load characteristic vector, the observation points between the main drive parameters and multiple electrical parameters in the electrical parameter linkage combination can be determined. The observation points are specifically the load points corresponding to the electrical parameter mutation state. Each electrical parameter corresponds to an observation point. The linkage observation conditions of each electrical parameter linkage combination are determined according to the observation points between the main drive parameters and the multiple electrical parameters. Specifically, the conditions that simultaneously meet multiple observation points are recorded as the linkage observation conditions of the electrical parameter linkage combination. That is, after the linkage observation conditions are met, data is recorded on the influence between the main drive parameters and the multiple electrical parameters, that is, the rules between the changes in the main drive parameters and the changes in other electrical parameters are recorded. According to the linkage observation conditions, the second linkage test scheme corresponding to each electrical parameter linkage combination is determined. Specifically, a higher sampling frequency may be used for data collection to achieve linkage testing of the LED driver chip based on multiple second linkage test schemes.

[0081] It is worth noting that in the above process, compared with the subjective design based on experience, the target correlation matrix is ​​used to screen the combination of highly correlated parameters and design the test scheme, so that more realistic linkage characteristics between electrical parameters can be captured during the test process; determining the main driving parameters based on the target correlation factor ensures that the main driving parameters have a higher influence and linkage. By reasonably selecting the main driving parameters, the test scope can be effectively narrowed to focus the test on the main parameters that have a greater impact on other parameters, so as to improve the test efficiency; dynamically adjusting the sampling threshold according to the correlation strength of different parameters in the target correlation matrix can more flexibly capture the changes of each parameter, thereby accurately sampling the changes of key linkage parameters; generating the target load characteristic vector by fusing the first load characteristic vector and the second load characteristic vector and determining the observation points of each electrical parameter, so that the collected data can more accurately reflect the steady-state and transient characteristics of the electrical parameters at different load points. This setting of observation points ensures that the focus of the test is concentrated on the load points where the electrical parameters change most significantly, thereby improving the targetedness of data collection; by fusing the data of steady-state characteristics and transient response, it can gain deeper insight into the linkage characteristics of electrical parameters from both the steady-state and dynamic aspects of the system, help identify potential problems of the chip under complex load conditions, and facilitate a more comprehensive evaluation of the chip's performance under actual working conditions.

[0082] See also Figure 2 , which shows a schematic structural diagram of an LED driver chip testing system provided by an embodiment of the present invention, the system comprising:

[0083] A steady-state load test module, used to determine a steady-state load test scenario for performing a load fluctuation test on the LED driver chip, perform a steady-state load test on the LED driver chip based on the steady-state load test scenario, and collect first electrical data during the steady-state load test;

[0084] A transient load test module, used to determine a transient load test scenario for performing a load fluctuation test on an LED driver chip, perform a transient load test on the LED driver chip based on the transient load test scenario, and collect second electrical data during the transient load test process;

[0085] A load point analysis module, used to extract steady-state index parameters of multiple load points in the first electrical data and transient index parameters of multiple load points in the second electrical data, construct a first electrical parameter feature vector and a second electrical parameter feature vector for each load point and determine multiple target load points;

[0086] The first electrical parameter characteristic vector and the second electrical parameter characteristic vector of each load point are constructed and a plurality of target load points are determined, including:

[0087] Extracting the steady-state value of each electrical parameter at each load point from the steady-state index parameter, and constructing a first electrical parameter fluctuation vector including the steady-state values ​​of multiple electrical parameters at each load point;

[0088] Extracting the transient value of each electrical parameter at each load point from the transient index parameter, and constructing a second electrical parameter fluctuation vector including the transient values ​​of multiple electrical parameters at each load point;

[0089] An electrical parameter difference feature vector is generated for each load point according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, and a weighted sum is performed on multiple eigenvalues ​​in the electrical parameter difference feature vector to generate an electrical parameter difference score for each load point, and multiple load points whose electrical parameter difference scores are greater than a preset screening threshold are recorded as target load points.

[0090] A characteristic correlation analysis module, used to perform characteristic correlation analysis on a plurality of target load points according to a first electrical parameter characteristic vector and a second electrical parameter characteristic vector of the load point, and construct an electrical characteristic correlation matrix corresponding to the plurality of target load points;

[0091] A fluctuation correlation analysis module is used to extract the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of multiple target load points from the steady-state index parameters and transient index parameters of the load points, perform fluctuation correlation analysis on the multiple target load points, and construct an electrical fluctuation correlation matrix corresponding to the multiple target load points;

[0092] The electrical parameter linkage analysis module is used to generate a target correlation matrix by performing feature fusion on the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix. The target correlation matrix includes the target correlation factor between any two electrical parameters, and determines multiple electrical parameter linkage combinations based on the target correlation matrix.

[0093] Specifically, multiple first parameter combinations whose target correlation factors are greater than a preset correlation threshold are selected based on the target correlation matrix, and if there is an electrical parameter whose target correlation factor with multiple electrical parameters in the first parameter combination is greater than the preset correlation threshold, the electrical parameter is added to the first parameter combination to generate a second parameter combination corresponding to the first parameter combination;

[0094] Traversing multiple first parameter combinations to determine multiple second parameter combinations, recording the second parameter combinations as electrical parameter linkage combinations, and determining main driving parameters of each electrical parameter linkage combination;

[0095] The linkage test module is used to generate a first linkage test scheme for each electrical parameter linkage combination, and perform linkage test on the LED driver chip based on multiple first linkage test schemes.

[0096] Specifically, for any electrical parameter linkage combination, a plurality of electrical parameters included in a first parameter combination belonging to the electrical parameter linkage combination in the electrical parameter linkage combination are recorded as reference driving parameters, a sum of target correlation factors between each reference driving parameter and the remaining electrical parameters in the electrical parameter linkage combination is calculated, and a reference driving parameter with the largest sum of target correlation factors is selected as a main driving parameter;

[0097] Determine multiple sampling thresholds for testing the electrical parameter linkage combination according to the main drive parameters, and determine a first linkage test scheme corresponding to the electrical parameter linkage combination according to the multiple sampling thresholds for testing the electrical parameter linkage combination;

[0098] Among them, for the electrical parameters other than the main drive parameters in the electrical parameter linkage combination, the sampling threshold is determined in the following way:

[0099] ;

[0100] In the formula, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The sampling threshold of the electrical parameters, is the reference threshold of the electrical parameter linkage combination, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The target correlation factor between the electrical parameters and the main drive parameters.

[0101] The above is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. Parts not described in detail in this specification belong to the prior art known to those skilled in the art.

Claims

1. A method for testing an LED driver chip, characterized in that: include: Determine a steady-state load test scenario for performing a load fluctuation test on an LED driver chip, perform a steady-state load test on the LED driver chip based on the steady-state load test scenario, and collect first electrical data during the steady-state load test; Determine a transient load test scenario for performing a load fluctuation test on an LED driver chip, perform a transient load test on the LED driver chip based on the transient load test scenario, and collect second electrical data during the transient load test; Extracting steady-state index parameters of multiple load points in the first electrical data and transient index parameters of multiple load points in the second electrical data, constructing a first electrical parameter feature vector and a second electrical parameter feature vector for each load point and determining multiple target load points; Performing feature correlation analysis on a plurality of target load points according to a first electrical parameter feature vector and a second electrical parameter feature vector of the load point, and constructing an electrical feature correlation matrix corresponding to the plurality of target load points; Extracting first electrical parameter fluctuation vectors and second electrical parameter fluctuation vectors of multiple target load points from the steady-state index parameters and transient index parameters of the load points, performing fluctuation correlation analysis on the multiple target load points, and constructing an electrical fluctuation correlation matrix corresponding to the multiple target load points; Performing feature fusion on the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix to generate a target correlation matrix, the target correlation matrix includes a target correlation factor between any two electrical parameters, determining multiple electrical parameter linkage combinations based on the target correlation matrix, generating a first linkage test scheme for each electrical parameter linkage combination, and performing linkage testing on the LED driver chip based on the multiple first linkage test schemes; Determine multiple electrical parameter linkage combinations based on the target association matrix, and generate a first linkage test scheme for each electrical parameter linkage combination, including: Selecting multiple first parameter combinations whose target correlation factors are greater than a preset correlation threshold based on the target correlation matrix, and if there is an electrical parameter whose target correlation factor with multiple electrical parameters in the first parameter combination is greater than the preset correlation threshold, adding the electrical parameter to the first parameter combination to generate a second parameter combination corresponding to the first parameter combination; Traversing multiple first parameter combinations to determine multiple second parameter combinations, recording the second parameter combinations as electrical parameter linkage combinations, and determining main driving parameters of each electrical parameter linkage combination; Wherein, for any electrical parameter linkage combination, a plurality of electrical parameters included in the first parameter combination belonging to the electrical parameter linkage combination in the electrical parameter linkage combination are recorded as reference driving parameters, the sum of target correlation factors between each reference driving parameter and the remaining electrical parameters in the electrical parameter linkage combination is calculated, and the reference driving parameter with the largest sum of target correlation factors is selected as the main driving parameter; Determine multiple sampling thresholds for testing the electrical parameter linkage combination according to the main drive parameters, and determine a first linkage test scheme corresponding to the electrical parameter linkage combination according to the multiple sampling thresholds for testing the electrical parameter linkage combination; Among them, for the electrical parameters other than the main drive parameters in the electrical parameter linkage combination, the sampling threshold is determined in the following way: ； In the formula, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The sampling threshold of the electrical parameters, is the reference threshold of the electrical parameter linkage combination, It is the first parameter in the electrical parameter linkage combination except the main drive parameters. The target correlation factor between the electrical parameters and the main drive parameters.

2. A method for testing an LED driver chip according to claim 1, characterized in that: After determining multiple electrical parameter linkage combinations based on the target correlation matrix, it also includes: For any electrical parameter linkage combination, extract the first load characteristic vector and the second load characteristic vector of each electrical parameter of the electrical parameter linkage combination according to the first electrical data and the second electrical data, and fuse the first load characteristic vector and the second load characteristic vector of each electrical parameter to generate a target load characteristic vector; According to the target load characteristic vector, the observation points between the main driving parameters and multiple electrical parameters in the electrical parameter linkage combination are determined; according to the observation points between the main driving parameters and the multiple electrical parameters, the linkage observation conditions of each electrical parameter linkage combination are determined; according to the linkage observation conditions, the second linkage test scheme corresponding to each electrical parameter linkage combination is determined; and the LED driver chip is linked to the test based on the multiple second linkage test schemes.

3. A method for testing an LED driver chip according to claim 2, characterized in that: Constructing a first electrical parameter characteristic vector and a second electrical parameter characteristic vector for each load point and determining a plurality of target load points, including: Extracting the steady-state value of each electrical parameter at each load point from the steady-state index parameter, and constructing a first electrical parameter fluctuation vector including the steady-state values ​​of multiple electrical parameters at each load point; Extracting the transient value of each electrical parameter at each load point from the transient index parameter, and constructing a second electrical parameter fluctuation vector including the transient values ​​of multiple electrical parameters at each load point; An electrical parameter difference feature vector is generated for each load point according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, and a weighted sum is performed on multiple eigenvalues ​​in the electrical parameter difference feature vector to generate an electrical parameter difference score for each load point, and multiple load points whose electrical parameter difference scores are greater than a preset screening threshold are recorded as target load points.

4. A method for testing an LED driver chip according to claim 3, characterized in that: For the electrical characteristics correlation matrix and electrical fluctuation correlation matrix, it also includes: Performing feature correlation analysis on multiple target load points according to the electrical parameter difference feature vector of each load point generated by the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, including calculating a first correlation factor of the electrical parameter difference feature vector between any two target load points, and constructing an electrical fluctuation correlation matrix corresponding to the multiple target load points according to the multiple first correlation factors; An electrical parameter difference fluctuation vector is generated for each target load point according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of the target load point, and fluctuation correlation analysis is performed on multiple target load points according to the electrical parameter difference fluctuation vector, including calculating the second correlation factor of the electrical parameter difference fluctuation vector between any two target load points, and constructing an electrical fluctuation correlation matrix corresponding to multiple target load points according to the multiple second correlation factors.

5. A method for testing an LED driver chip according to claim 4, characterized in that: The electrical fluctuation correlation matrix and the electrical characteristic correlation matrix are fused to generate the target correlation matrix, including: A first correlation factor and a second correlation factor corresponding to each electrical parameter pair are determined, the first correlation factor is corrected based on the second correlation factor, a target correlation factor corresponding to each electrical parameter pair is obtained, and a target correlation matrix including multiple target correlation factors is generated.

6. A LED driver chip testing system, characterized in that: The system is used to implement a LED driver chip testing method as described in any one of claims 1 to 5, comprising: A steady-state load test module, used to determine a steady-state load test scenario for performing a load fluctuation test on the LED driver chip, perform a steady-state load test on the LED driver chip based on the steady-state load test scenario, and collect first electrical data during the steady-state load test; A transient load test module, used to determine a transient load test scenario for performing a load fluctuation test on an LED driver chip, perform a transient load test on the LED driver chip based on the transient load test scenario, and collect second electrical data during the transient load test process; A load point analysis module, used to extract steady-state index parameters of multiple load points in the first electrical data and transient index parameters of multiple load points in the second electrical data, construct a first electrical parameter feature vector and a second electrical parameter feature vector for each load point and determine multiple target load points; A characteristic correlation analysis module, used to perform characteristic correlation analysis on a plurality of target load points according to a first electrical parameter characteristic vector and a second electrical parameter characteristic vector of the load point, and construct an electrical characteristic correlation matrix corresponding to the plurality of target load points; A fluctuation correlation analysis module is used to extract the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector of multiple target load points from the steady-state index parameters and transient index parameters of the load points, perform fluctuation correlation analysis on the multiple target load points, and construct an electrical fluctuation correlation matrix corresponding to the multiple target load points; The electrical parameter linkage analysis module is used to generate a target correlation matrix by performing feature fusion on the electrical fluctuation correlation matrix and the electrical characteristic correlation matrix. The target correlation matrix includes the target correlation factor between any two electrical parameters, and determines multiple electrical parameter linkage combinations based on the target correlation matrix. The linkage test module is used to generate a first linkage test scheme for each electrical parameter linkage combination, and perform linkage test on the LED driver chip based on multiple first linkage test schemes.

7. The LED driver chip testing system according to claim 6, characterized in that: The load point analysis module constructs a first electrical parameter characteristic vector and a second electrical parameter characteristic vector for each load point and determines a plurality of target load points, including: Extracting the steady-state value of each electrical parameter at each load point from the steady-state index parameter, and constructing a first electrical parameter fluctuation vector including the steady-state values ​​of multiple electrical parameters at each load point; Extracting the transient value of each electrical parameter at each load point from the transient index parameter, and constructing a second electrical parameter fluctuation vector including the transient values ​​of multiple electrical parameters at each load point; An electrical parameter difference feature vector is generated for each load point according to the first electrical parameter fluctuation vector and the second electrical parameter fluctuation vector, and a weighted sum is performed on multiple eigenvalues ​​in the electrical parameter difference feature vector to generate an electrical parameter difference score for each load point, and multiple load points whose electrical parameter difference scores are greater than a preset screening threshold are recorded as target load points.

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