Model-based spacecraft thermal control multi-layer grounding point generation method and device

Abstract

The embodiment of the invention provides a model-based spacecraft thermal control multi-layer grounding point generation method and device, and the method comprises the steps: obtaining an initial grounding hole two-dimensional drawing, carrying out the preprocessing of the initial grounding hole two-dimensional drawing, and determining a target grounding hole two-dimensional drawing; determining a whole-satellite grounding model based on the target grounding hole two-dimensional drawing and the whole-satellite model; thermal control multi-layer information is determined based on a whole satellite grounding model; ground point information is determined based on the thermal control multilayer information and a ground point setting rule, and a ground point identifier is determined based on the ground point information. According to the invention, the consistency design under the principle of unified grounding requirements is realized, the reasonable distribution of the multi-layer grounding points on the satellite grounding holes is realized, the reasonable design of the lengths of the multi-layer grounding wires is realized, and the rapid positioning of the connecting wires of the multi-layer grounding points is realized, so that the final assembly production efficiency is improved.

Description

Technical Field

[0001] The embodiments of this specification relate to the field of spacecraft technology, and in particular to a model-based method for generating multi-layer grounding points for thermal control of spacecraft. Background Art

[0002] Thermal control multilayers are a type of flexible product on spacecraft, installed on the surface of spacecraft and equipment, which directly affects the temperature control and on-orbit operation of spacecraft. The grounding wire for thermal control multilayers can ensure that the thermal control multilayers are at the same potential as the spacecraft, preventing discharge damage to the spacecraft due to potential differences. As the requirements for multilayer grounding become more and more stringent, the number and difficulty of multilayer manufacturing of spacecraft are also increasing. The number of grounding points of a high-orbit satellite can reach more than 300. In the past, the installation of multilayer grounding wires required operators to select the location of the grounding holes on the satellite based on experience, and select the appropriate length of grounding wires through trial fitting, which made the assembly implementation inefficient. Therefore, a better solution is urgently needed. Summary of the invention

[0003] In view of this, the embodiments of this specification provide a model-based spacecraft thermal control multi-layer grounding point generation method. One or more embodiments of this specification also relate to a model-based spacecraft thermal control multi-layer grounding point generation device, a computing device, a computer-readable storage medium and a computer program to solve the technical defects existing in the prior art.

[0004] According to a first aspect of an embodiment of this specification, a model-based method for generating multi-layer grounding points for thermal control of a spacecraft is provided, comprising: Obtaining an initial grounding hole two-dimensional drawing, preprocessing the initial grounding hole two-dimensional drawing, and determining a target grounding hole two-dimensional drawing; Determine the whole satellite grounding model based on the two-dimensional drawing of the target grounding hole and the whole satellite model; Determine the thermal control multi-layer information based on the whole satellite grounding model; The grounding point information is determined based on the thermal control multi-layer information and the grounding point setting rule, and the grounding point identifier is determined based on the grounding point information.

[0005] In a possible implementation, preprocessing the initial grounding hole two-dimensional drawing to determine the target grounding hole two-dimensional drawing includes: Delete the dimensioning lines, the center line of the axis of symmetry, the dotted lines of the folded edges and the text annotations in the initial grounding hole two-dimensional drawing, and determine the target grounding hole two-dimensional drawing; wherein the target grounding hole two-dimensional drawing includes the structural contour line and the grounding hole marking line.

[0006] In a possible implementation, determining the whole satellite grounding model based on the target grounding hole two-dimensional drawing and the whole satellite model includes: Determine the drawing scale, import the target grounding hole 2D drawing into the whole satellite model based on the drawing scale, and determine the initial whole satellite grounding model; Determine the grounding parts, and determine the typical characteristic structure based on the grounding parts; The whole satellite grounding model is determined based on the typical characteristic structure and the initial whole satellite grounding model.

[0007] In a possible implementation, the thermal control multi-layer information is determined based on the whole satellite grounding model, including: Analyze the ground model of the entire satellite to determine the surface area of ​​the thermal control multilayer; Determine the installation location, contour form and equipment layout of thermal control multilayer; Determine thermal control multi-layer information based on surface area, mounting location, contour form and equipment layout.

[0008] In a possible implementation, determining the grounding point information based on the thermal control multi-layer information and the grounding point setting rule includes: Determine the number of grounding points based on surface area and grounding point setting rules; Determine the initial grounding point location based on the number of grounding points, installation location, contour form, and equipment layout; The grounding hole layout is determined based on the two-dimensional drawing of the target grounding hole, and the initial grounding point position is adjusted based on the grounding hole layout and the installation position to determine the grounding point information.

[0009] In a possible implementation, determining the grounding point identifier based on the grounding point information includes: Determine coordinate information based on the grounding point information, and determine distance information based on the coordinate information; determining grounding line information based on the distance information; Generate a grounding point identifier based on the grounding wire information.

[0010] In a possible implementation, determining ground wire information based on distance information includes: Determine the length of the ground wire based on the distance information; Determine the grounding type based on the satellite grounding layout; The ground wire information is determined based on the ground type and ground wire length.

[0011] According to a second aspect of an embodiment of this specification, a model-based spacecraft thermal control multi-layer ground point generation device is provided, comprising: A drawing determination module is configured to obtain an initial grounding hole two-dimensional drawing, pre-process the initial grounding hole two-dimensional drawing, and determine a target grounding hole two-dimensional drawing; A model determination module is configured to determine a whole-satellite grounding model based on a two-dimensional drawing of a target grounding hole and a whole-satellite model; An information determination module is configured to determine thermal control multi-layer information based on a whole-satellite grounding model; The identification generating module is configured to determine the grounding point information based on the thermal control multi-layer information and the grounding point setting rule, and determine the grounding point identification based on the grounding point information.

[0012] According to a third aspect of an embodiment of this specification, a computing device is provided, including: Memory and processor; The memory is used to store computer executable instructions, and the processor is used to execute the computer executable instructions. When the computer executable instructions are executed by the processor, the steps of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method are implemented.

[0013] According to a fourth aspect of the embodiments of this specification, a computer-readable storage medium is provided, which stores computer-executable instructions, and when the instructions are executed by a processor, the steps of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method are implemented.

[0014] According to a fifth aspect of the embodiments of this specification, a computer program is provided, wherein when the computer program is executed in a computer, the computer is caused to execute the steps of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method.

[0015] The embodiments of this specification provide a model-based method and device for generating multi-layer grounding points for thermal control of spacecraft, wherein the model-based method for generating multi-layer grounding points for thermal control of spacecraft includes: obtaining a two-dimensional drawing of an initial grounding hole, preprocessing the two-dimensional drawing of the initial grounding hole, and determining a two-dimensional drawing of a target grounding hole; determining a whole-satellite grounding model based on the two-dimensional drawing of the target grounding hole and the whole-satellite model; determining thermal control multi-layer information based on the whole-satellite grounding model; determining grounding point information based on the thermal control multi-layer information and grounding point setting rules, and determining a grounding point identifier based on the grounding point information. This achieves a consistent design under the principle of unified grounding requirements, a reasonable allocation of multi-layer grounding points to grounding holes on the satellite, a reasonable design of the length of multi-layer grounding wires, and rapid positioning of multi-layer grounding point connections. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a flow chart of a model-based method for generating multi-layer grounding points for thermal control of a spacecraft provided by an embodiment of this specification; Figure 2 is a schematic diagram of a model-based spacecraft thermal control multi-layer ground point generation method provided by an embodiment of this specification; Figure 3 It is a structural schematic diagram of a model-based spacecraft thermal control multi-layer grounding point generation device provided by an embodiment of this specification; Figure 4It is a structural block diagram of a computing device provided by an embodiment of this specification. DETAILED DESCRIPTION

[0017] Many specific details are described in the following description to facilitate a full understanding of this specification. However, this specification can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of this specification, so this specification is not limited to the specific implementation disclosed below.

[0018] The terms used in one or more embodiments of this specification are only for the purpose of describing specific embodiments, and are not intended to limit one or more embodiments of this specification. The singular forms of "a" and "the" used in one or more embodiments of this specification and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0019] It should be understood that although the terms first, second, etc. may be used to describe various information in one or more embodiments of this specification, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of one or more embodiments of this specification, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0020] See also Figure 1 , Figure 1 A flow chart of a model-based method for generating multi-layer grounding points for thermal control of a spacecraft provided according to an embodiment of the present specification is shown, which specifically includes the following steps.

[0021] Step 101: obtaining an initial grounding hole two-dimensional drawing, preprocessing the initial grounding hole two-dimensional drawing, and determining a target grounding hole two-dimensional drawing.

[0022] In a possible implementation, the initial grounding hole two-dimensional drawing is preprocessed to determine the target grounding hole two-dimensional drawing, including: deleting the dimension annotation lines, the center line of the axis of symmetry, the folded edge dashed line and the text annotation in the initial grounding hole two-dimensional drawing to determine the target grounding hole two-dimensional drawing; wherein the target grounding hole two-dimensional drawing includes a structural contour line and a grounding hole marking line.

[0023] In practical applications, see Figure 2,First, process the two-dimensional drawing of the whole satellite grounding hole, delete the dimension ,line, the center line of the symmetry axis, the folded edge dotted line, and text annotation in the ,two-dimensional drawing of the whole satellite grounding hole, and only retain the structural ,contour line and the grounding circular hole line.

[0024] Step 102: Determine the whole satellite grounding model based on the target grounding hole two-dimensional drawing and the whole satellite model.

[0025] In a possible implementation, the whole satellite grounding model is determined based on the two-dimensional drawing of the target grounding hole and the whole satellite model, including: determining the drawing scale, importing the two-dimensional drawing of the target grounding hole into the whole satellite model based on the drawing scale, and determining the initial whole satellite grounding model; determining the grounding parts, and determining the typical characteristic structure based on the grounding parts; and determining the whole satellite grounding model based on the typical characteristic structure and the initial whole satellite grounding model.

[0026] In practical applications, see Figure 2 , create a new grounding part in the model, select Sketch in this part, then select the typical feature structure as the reference, import the 2D drawing of the whole star grounding hole processed in step 102, specify the drawing scale, select the typical feature points in the drawing and move them to the appropriate position in the model, and after observing that the 2D drawing is completely consistent with the 3D model, confirm to save, and the operation of importing the 2D grounding hole drawing into the 3D model is completed.

[0027] Step 103: Determine thermal control multi-layer information based on the whole satellite grounding model.

[0028] In one possible implementation, the thermal control multi-layer information is determined based on the whole-satellite grounding model, including: analyzing based on the whole-satellite grounding model to determine the surface area of ​​the thermal control multi-layer; determining the installation position, contour form and equipment layout of the thermal control multi-layer; determining the thermal control multi-layer information based on the surface area, installation position, contour form and equipment layout.

[0029] In practical applications, see Figure 2 , select the outer surface of the multi-layer that needs to set the grounding point, and calculate the surface area of ​​this multi-layer through model analysis measurement. And determine the installation position, contour form and equipment layout of the thermal control multi-layer according to the model.

[0030] Step 104: determining grounding point information based on the thermal control multi-layer information and the grounding point setting rule, and determining a grounding point identifier based on the grounding point information.

[0031] In one possible implementation, the grounding point information is determined based on the thermal control multi-layer information and the grounding point setting rules, including: determining the number of grounding points based on the surface area and the grounding point setting rules; determining the initial grounding point position based on the number of grounding points, installation positions, contour forms and equipment layout; determining the grounding hole layout based on the two-dimensional drawing of the target grounding hole, and adjusting the initial grounding point position based on the grounding hole layout and installation position to determine the grounding point information.

[0032] In practical applications, refer to Figure 2 , and preset the unified principle for setting the number of grounding points in advance: when the multi-layer area S < 100 cm², at least one grounding point should be set; when the multi-layer area is 100 cm² < S < 400 cm², at least two grounding points should be set; when the multi-layer area is 400 cm² < S < 1600 cm², at least three grounding points should be set; when the multi-layer area S > 1600 cm², at least four grounding points should be set. Determine the number of grounding points required for this multi-layer based on the multi-layer surface area data calculated in step 103.

[0033] Furthermore, according to the multi-layer contour form, installation position, and layout of surrounding equipment, refer to Figure 2 , select the contour edge suitable for placing the grounding point, and select the number of grounding points to be placed on this edge, either 1 or 2. According to the installation position of the multi-layer on the satellite and the layout of the grounding holes on the overall satellite grounding model, select a grounding hole that is relatively close to the multi-layer grounding point. When it is found that the number of grounding wires connected to a certain grounding hole exceeds five, the selected grounding hole needs to be adjusted to ensure that the number of grounding points connected to each grounding hole does not exceed five.

[0034] In a possible implementation manner, determining the grounding point identifier based on the grounding point information includes: determining the coordinate information based on the grounding point information, determining the distance information based on the coordinate information; determining the grounding wire information based on the distance information; and generating the grounding point identifier based on the grounding wire information.

[0035] Specifically, determining the grounding wire information based on the distance information includes: determining the grounding wire length based on the distance information; determining the grounding type based on the satellite grounding layout; and determining the grounding wire information based on the grounding type and the grounding wire length.

[0036] In practical applications, refer to Figure 2 , after specifying the position of the multi-layer grounding point, its coordinate position (x1, y1, z1) can be obtained. After selecting the grounding hole, its coordinate position (x2, y2, z2) can also be obtained. According to the distance formula between two points, the distance between the multi-layer grounding point and the on-satellite grounding hole can be calculated, and thus the length of the multi-layer grounding wire can be obtained.

[0037] Furthermore, a suitable grounding type is selected according to the actual grounding layout of the satellite. The grounding wire component product library includes grounding wires of various specifications, such as 0.5-meter copper foil tape type grounding wire, 1.5-meter copper foil tape type grounding wire, 1.5-meter pinhole type grounding wire, 0.5-meter solder lug type grounding wire, 0.8-meter solder lug type grounding wire, and 1.5-meter solder lug type grounding wire. A suitable grounding type is selected according to the actual grounding layout of the satellite. For example, if a conductive copper foil mesh is arranged on the satellite body, a copper foil tape type grounding wire of suitable length can be selected according to the multi-layer position; if grounding poles are arranged on the satellite body, a solder lug type grounding wire of suitable length can be selected for multiple layers; after determining the type, the distance between the grounding point and the grounding hole described in step 8 must be used to finally select a grounding wire specification of a certain type and length.

[0038] Finally, a grounding point mark with characteristic information is generated at a specified position of the specified contour edge, such as A1-1, where the first 1 represents the A1 grounding hole, and the second 1 represents the first grounding wire on the grounding hole. The embodiments of this specification can not only help designers quickly complete the setting of the grounding point position, and the length of the grounding wire is reasonable, and can avoid the problem of excessive number of grounding wires connected to the same grounding hole, but also help operators quickly locate the grounding hole position on the star when connecting the grounding wire, accurately and efficiently complete the grounding wire installation work, and improve the assembly production efficiency.

[0039] The embodiments of this specification provide a model-based method and device for generating multi-layer grounding points for thermal control of spacecraft, wherein the model-based method for generating multi-layer grounding points for thermal control of spacecraft includes: obtaining a two-dimensional drawing of an initial grounding hole, preprocessing the two-dimensional drawing of the initial grounding hole, and determining a two-dimensional drawing of a target grounding hole; determining a whole-satellite grounding model based on the two-dimensional drawing of the target grounding hole and the whole-satellite model; determining thermal control multi-layer information based on the whole-satellite grounding model; determining grounding point information based on the thermal control multi-layer information and grounding point setting rules, and determining a grounding point identifier based on the grounding point information. This achieves a consistent design under the principle of unified grounding requirements, a reasonable allocation of multi-layer grounding points to grounding holes on the satellite, a reasonable design of the length of multi-layer grounding wires, and rapid positioning of multi-layer grounding point connections.

[0040] Corresponding to the above method embodiment, this specification also provides an embodiment of a spacecraft thermal control multi-layer grounding point generation device based on a model, Figure 3 FIG. 1 shows a schematic diagram of a structure of a spacecraft thermal control multi-layer ground point generation device based on a model according to an embodiment of the present specification. Figure 3 As shown, the device comprises: The drawing determination module 301 is configured to obtain an initial grounding hole two-dimensional drawing, pre-process the initial grounding hole two-dimensional drawing, and determine a target grounding hole two-dimensional drawing; A model determination module 302 is configured to determine a whole-satellite grounding model based on a two-dimensional drawing of a target grounding hole and a whole-satellite model; The information determination module 303 is configured to determine the thermal control multi-layer information based on the whole satellite grounding model; The identification generating module 304 is configured to determine the grounding point information based on the thermal control multi-layer information and the grounding point setting rule, and determine the grounding point identification based on the grounding point information.

[0041] In a possible implementation, the drawing determination module 301 is further configured to: Delete the dimensioning lines, the center line of the axis of symmetry, the dotted lines of the folded edges and the text annotations in the initial grounding hole two-dimensional drawing, and determine the target grounding hole two-dimensional drawing; wherein the target grounding hole two-dimensional drawing includes the structural contour line and the grounding hole marking line.

[0042] In a possible implementation, the model determination module 302 is further configured to: Determine the drawing scale, import the target grounding hole 2D drawing into the whole satellite model based on the drawing scale, and determine the initial whole satellite grounding model; Determine the grounding parts, and determine the typical characteristic structure based on the grounding parts; The whole satellite grounding model is determined based on the typical characteristic structure and the initial whole satellite grounding model.

[0043] In a possible implementation, the information determination module 303 is further configured to: Analyze the ground model of the entire satellite to determine the surface area of ​​the thermal control multilayer; Determine the installation location, contour form and equipment layout of thermal control multilayer; Determine thermal control multi-layer information based on surface area, mounting location, contour form and equipment layout.

[0044] In a possible implementation, the identification generation module 304 is further configured to: Determine the number of grounding points based on surface area and grounding point setting rules; Determine the initial grounding point location based on the number of grounding points, installation location, contour form, and equipment layout; The grounding hole layout is determined based on the two-dimensional drawing of the target grounding hole, and the initial grounding point position is adjusted based on the grounding hole layout and the installation position to determine the grounding point information.

[0045] In a possible implementation, the identification generation module 304 is further configured to: Determine coordinate information based on the grounding point information, and determine distance information based on the coordinate information; determining grounding line information based on the distance information; Generate a grounding point identifier based on the grounding wire information.

[0046] In a possible implementation, the identification generation module 304 is further configured to: Determine the length of the ground wire based on the distance information; Determine the grounding type based on the satellite grounding layout; The ground wire information is determined based on the ground type and ground wire length.

[0047] The embodiments of this specification provide a model-based method and device for generating multi-layer grounding points for thermal control of spacecraft, wherein the model-based method for generating multi-layer grounding points for thermal control of spacecraft includes: obtaining a two-dimensional drawing of an initial grounding hole, preprocessing the two-dimensional drawing of the initial grounding hole, and determining a two-dimensional drawing of a target grounding hole; determining a whole-satellite grounding model based on the two-dimensional drawing of the target grounding hole and the whole-satellite model; determining thermal control multi-layer information based on the whole-satellite grounding model; determining grounding point information based on the thermal control multi-layer information and grounding point setting rules, and determining a grounding point identifier based on the grounding point information. This achieves a consistent design under the principle of unified grounding requirements, a reasonable allocation of multi-layer grounding points to grounding holes on the satellite, a reasonable design of the length of multi-layer grounding wires, and rapid positioning of multi-layer grounding point connections.

[0048] The above is a schematic scheme of a model-based spacecraft thermal control multi-layer grounding point generation device of this embodiment. It should be noted that the technical scheme of the model-based spacecraft thermal control multi-layer grounding point generation device and the technical scheme of the model-based spacecraft thermal control multi-layer grounding point generation method are of the same concept. The details not described in detail in the technical scheme of the model-based spacecraft thermal control multi-layer grounding point generation device can be found in the description of the technical scheme of the model-based spacecraft thermal control multi-layer grounding point generation method.

[0049] Figure 4 The block diagram of a computing device 400 according to one embodiment of the present specification is shown. The components of the computing device 400 include but are not limited to a memory 410 and a processor 420. The processor 420 is connected to the memory 410 via a bus 430, and the database 450 is used to store data.

[0050] The computing device 400 also includes an access device 440 that enables the computing device 400 to communicate via one or more networks 460. Examples of these networks include a public switched telephone network (PSTN), a local area network (LAN), a wide area network (WAN), a personal area network (PAN), or a combination of communication networks such as the Internet. The access device 440 may include one or more of any type of network interface (e.g., a network interface card (NIC)) that is wired or wireless, such as an IEEE 802.11 wireless local area network (WLAN) wireless interface, a world-wide interoperability for microwave access (Wi-MAX) interface, an Ethernet interface, a universal serial bus (USB) interface, a cellular network interface, a Bluetooth interface, and a near field communication (NFC).

[0051] In one embodiment of the present specification, the above components of the computing device 400 and Figure 4 Other components not shown in the figure may also be connected to each other, for example, via a bus. It should be understood that Figure 4 The computing device structure block diagram shown is only for the purpose of illustration, and is not intended to limit the scope of this specification. Those skilled in the art can add or replace other components as needed.

[0052] The computing device 400 may be any type of stationary or mobile computing device, including a mobile computer or mobile computing device (e.g., a tablet computer, a personal digital assistant, a laptop computer, a notebook computer, a netbook, etc.), a mobile phone (e.g., a smart phone), a wearable computing device (e.g., a smart watch, smart glasses, etc.), or other types of mobile devices, or a stationary computing device such as a desktop computer or a personal computer (PC). The computing device 400 may also be a mobile or stationary server.

[0053] The processor 420 is used to execute the following computer executable instructions, which, when executed by the processor, implement the steps of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method. The above is a schematic scheme of a computing device of this embodiment. It should be noted that the technical scheme of the computing device and the technical scheme of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method belong to the same concept. For details not described in detail in the technical scheme of the computing device, please refer to the description of the technical scheme of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method.

[0054] An embodiment of the present specification also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the steps of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method.

[0055] The above is a schematic scheme of a computer-readable storage medium of this embodiment. It should be noted that the technical scheme of the storage medium and the technical scheme of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method belong to the same concept, and the details not described in detail in the technical scheme of the storage medium can be referred to the description of the technical scheme of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method.

[0056] An embodiment of the present specification also provides a computer program, wherein when the computer program is executed in a computer, the computer is caused to execute the steps of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method.

[0057] The above is a schematic scheme of a computer program of this embodiment. It should be noted that the technical scheme of the computer program and the technical scheme of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method belong to the same concept, and the details not described in detail in the technical scheme of the computer program can be referred to the description of the technical scheme of the above-mentioned model-based spacecraft thermal control multi-layer grounding point generation method.

[0058] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0059] The computer instructions include computer program codes, which may be in source code form, object code form, executable files or some intermediate forms, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained in the computer-readable medium may be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0060] It should be noted that, for the above-mentioned method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the embodiments of this specification are not limited by the order of the actions described, because according to the embodiments of this specification, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the embodiments of this specification.

[0061] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0062] The preferred embodiments of this specification disclosed above are only used to help explain this specification. The optional embodiments do not describe all the details in detail, nor do they limit the invention to only the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of the embodiments of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the embodiments of this specification, so that technicians in the relevant technical field can well understand and use this specification. This specification is only limited by the claims and their full scope and equivalents.

Claims

1. A model-based method for generating multi-layer grounding points for spacecraft thermal control, characterized in that: include: Acquire an initial grounding hole two-dimensional drawing, pre-process the initial grounding hole two-dimensional drawing, and determine a target grounding hole two-dimensional drawing; Determine the whole satellite grounding model based on the target grounding hole two-dimensional drawing and the whole satellite model; Determining thermal control multi-layer information based on the whole-satellite grounding model; The grounding point information is determined based on the thermal control multi-layer information and the grounding point setting rule, and the grounding point identifier is determined based on the grounding point information.

2. The method according to claim 1, characterized in that: The preprocessing of the initial grounding hole two-dimensional drawing to determine the target grounding hole two-dimensional drawing includes: Delete the dimension marking lines, the center line of the axis of symmetry, the dotted line of the folded edge and the text marking in the initial grounding hole two-dimensional drawing to determine the target grounding hole two-dimensional drawing; wherein the target grounding hole two-dimensional drawing includes a structural contour line and a grounding hole marking line.

3. The method according to claim 1, characterized in that The determining of the whole satellite grounding model based on the target grounding hole two-dimensional drawing and the whole satellite model includes: Determine a drawing scale, import the target grounding hole two-dimensional drawing into the whole satellite model based on the drawing scale, and determine an initial whole satellite grounding model; determining a grounding part, and determining a typical characteristic structure based on the grounding part; A whole-star grounding model is determined based on the typical characteristic structure and the initial whole-star grounding model.

4. The method according to claim 1, characterized in that: The determining of thermal control multi-layer information based on the whole-satellite grounding model includes: Analyzing based on the whole-satellite grounding model, determining the surface area of ​​the thermal control multilayer; Determine the installation position, contour form and equipment layout of the thermal control multilayer; Thermal control multi-layer information is determined based on the surface area, installation location, contour form and equipment layout.

5. The method according to claim 4, characterized in that The determining of the grounding point information based on the thermal control multi-layer information and the grounding point setting rule includes: determining the number of grounding points based on the surface area and the grounding point setting rule; Determining initial grounding point locations based on the number of grounding points, the installation locations, the contour form, and the equipment layout; The grounding hole layout is determined based on the target grounding hole two-dimensional drawing, and the initial grounding point position is adjusted based on the grounding hole layout and the installation position to determine the grounding point information.

6. The method according to claim 1, characterized in that The determining of the grounding point identifier based on the grounding point information includes: Determine coordinate information based on the grounding point information, and determine distance information based on the coordinate information; determining ground wire information based on the distance information; A grounding point identifier is generated based on the grounding wire information.

7. The method according to claim 6, characterized in that The determining of ground wire information based on the distance information includes: determining the length of the ground wire based on the distance information; Determine the grounding type based on the satellite grounding layout; Grounding wire information is determined based on the grounding type and the grounding wire length.

8. A model-based spacecraft thermal control multi-layer grounding point generation device, characterized in that: include: A drawing determination module is configured to obtain an initial grounding hole two-dimensional drawing, pre-process the initial grounding hole two-dimensional drawing, and determine a target grounding hole two-dimensional drawing; A model determination module is configured to determine a whole-satellite grounding model based on the target grounding hole two-dimensional drawing and the whole-satellite model; An information determination module is configured to determine thermal control multi-layer information based on the whole satellite grounding model; The identification generating module is configured to determine the grounding point information based on the thermal control multi-layer information and the grounding point setting rule, and determine the grounding point identification based on the grounding point information.

9. A computing device, characterized in that include: Memory and processor; The memory is used to store computer executable instructions, and the processor is used to execute the computer executable instructions. When the computer executable instructions are executed by the processor, the steps of the model-based spacecraft thermal control multi-layer grounding point generation method described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the steps of the model-based spacecraft thermal control multi-layer grounding point generation method as described in any one of claims 1 to 7.

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