Etching device for semiconductor chip production

Abstract

The invention discloses an etching device for semiconductor chip production, and relates to the related technical field of semiconductor chip production. The etching device for semiconductor chip production comprises an etching box, a partition plate is fixedly connected in the etching box, and a rotary etching mechanism is arranged at the bottom of the partition plate. According to the etching device for semiconductor chip production, semiconductors are poured down through a feeding pipe through the arrangement of the rotary etching mechanism, a rotary door and a spring are arranged on the outer side of a filter cylinder, when all the semiconductors enter the filter cylinder, a second motor is started to drive the filter cylinder to rotate, and a check block is arranged on the outer wall of the filter cylinder, so that the rotary door cannot be opened towards the outer side; therefore, the semiconductor does not flow out from the filter cartridge when rotating, the etching liquid performs all-directional etching on the semiconductor in the filter cartridge along with the rotating process of the filter cartridge, and the condition that a certain surface or a certain part is in contact with the inner wall of the etching box and cannot be etched is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor chip production, and in particular to an etching device used for semiconductor chip production. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. The invention of semiconductor chips was a pioneering work in the 20th century, which pioneered the information age. As one of the most important processes frequently used in the manufacturing process of semiconductor chips, semiconductor chip etching is particularly important. The cited patent number is CN217903080U, which discloses an etching device for semiconductor chip production; When the existing etching device is used in the production and processing of semiconductor chips, the semiconductor chips are manually placed in the etching box for etching, which can easily cause the semiconductor chips to fall to the bottom of the etching box, making it impossible to fully etch the semiconductor chips. In addition, when taking out the semiconductor chips that have been etched, the fingers of the staff will easily touch the etching liquid, which will affect the health of the staff. Summary of the invention

[0003] In view of the deficiencies of the prior art, the present invention provides an etching device for semiconductor chip production to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: an etching device for semiconductor chip production, comprising an etching box, the top of the etching box is fixedly connected with a slide rail 1, the top of the slide rail 1 is slidably connected with a box cover, the inside of the etching box is fixedly connected with a partition, the top of the partition is fixedly connected with a through pipe, the bottom of the through pipe is provided with a transfer mechanism, the side of the transfer mechanism is provided with a conveying mechanism, and the top of the conveying mechanism is provided with a rotating etching mechanism; the rotating etching mechanism comprises a second motor, the output end of the second motor is fixedly connected with a second rotating shaft, the outer side of the second rotating shaft is fixedly connected with a connecting rod 1, the end of the connecting rod 1 away from the second rotating shaft is fixedly connected with a filter cartridge, the top of the filter cartridge is provided with a feeding pipe, the outer side of the filter cartridge is slidably connected with an annular slide rail, the bottom of the annular slide rail is fixedly connected with a bracket, the filter cartridge A second connecting rod is fixedly connected inside, a spring is fixedly connected to the top of the second connecting rod, and a revolving door is fixedly connected to one end of the spring away from the second connecting rod. A third rotating shaft is rotatably connected to the inside of the revolving door, and a stopper is fixedly connected to the outside of the filter cartridge. Two connecting rods are provided. The semiconductor is poured into the filter cartridge through the feed pipe. Since a revolving door and a spring are provided on the outside of the filter cartridge, the spring can be compressed when the semiconductor falls down to open the revolving door. When all the semiconductors enter the filter cartridge, the second motor is started, and the second motor drives the filter cartridge to rotate. Since a stopper is provided on the outer wall of the filter cartridge, the revolving door cannot be opened to the outside, so that the semiconductor will not flow out of the filter cartridge when it rotates. The etching liquid can etch the semiconductor in all directions as the filter cartridge rotates in the filter cartridge, and there will be no situation where one side or one place contacts the inner wall of the etching box and cannot be etched.

[0005] Preferably, the transfer mechanism includes a motor 1, the output end of the motor 1 is fixedly connected to a rotating shaft 1, the end of the rotating shaft 1 away from the motor 1 is fixedly connected to a lifting rod, the lifting rod is fixedly connected to a lever on the side close to the motor 1, a mounting block is provided at the end of the lifting rod away from the rotating shaft 1, a round table is provided on the side of the mounting block close to the motor 1, a mounting plate is fixedly connected to the side of the round table close to the motor 1, a slide rail 2 is fixedly connected to the side of the mounting plate, a stop rod is fixedly connected to the side of the mounting plate close to the motor 1, and a rotating The mounting block is connected with a clamp, the top of the mounting block is fixedly connected with an inclined plate, the side of the inclined plate is fixedly connected with a filter plate, and two filter plates are provided. The inclined block and the filter plate can form a box body, so as to realize the loading of semiconductors. At the same time, after the bottom of the inclined block extends out of the through pipe, it can drive the semiconductor to slide down to the partition. Since water is injected above the partition, the semiconductor falls into the water through the inclined block to clean the semiconductor. The filter plate can flow out the etching liquid in the box body during the rising process to prevent the etching liquid from flowing into the partition together with the semiconductor, thereby reducing the waste of the etching liquid and also avoiding The etching liquid adheres to the semiconductor and causes damage to human health. The side of the mounting block close to the motor one is fixedly connected with a fixing block one, the side of the mounting block away from the motor one is fixedly connected with a fixing block three, and the bottom of the mounting block is fixedly connected with a fixing block two. When the etched semiconductor chip is transported to the box body of the inclined plate, the filter plate and the mounting plate, the motor one is started, and the motor one drives the lifting rod and the lever to rotate. When the lifting rod rotates to the vicinity of the mounting block, the mounting block is dragged upward, so that the semiconductor in the box composed of the filter plate and the inclined block can be transported upward. When the bottom of the inclined block When it exceeds the through pipe, the clamp on the mounting plate will clamp the fixed block 2 at this position, so that the inclined block and the filter plate will stop at this position, and the motor 1 will continue to rotate. When the lever rotates to contact the clamp, the clamp is pushed to make it leave the fixed block 2, so that the inclined block and the filter plate fall to the bottom. In this way, the semiconductor can be taken out of the etching solution mechanically, avoiding the discharge of toxic gases when the staff opens the etching box by themselves, which will not cause damage to the health of the staff, and there is no need to use tools to clamp the semiconductors out one by one, which can save time and avoid damage to the tools.

[0006] Preferably, the conveying mechanism includes a connecting rod three, the bottom end of the connecting rod three is fixedly connected to a feeding tube, a baffle is provided on the top of the feeding tube, a connecting rod four is fixedly connected to the side of the baffle, the end of the connecting rod four away from the baffle is fixedly connected to a rotating rod, the end of the rotating rod away from the connecting rod four is fixedly connected to a connecting rod five, the end of the connecting rod five away from the rotating rod is fixedly connected to a holding rod, and two connecting rods are provided. When the semiconductor etching is completed, the holding rod is rotated, and the holding rod drives the baffle to rotate. Since a notch is provided at the bottom of the filter cartridge, the semiconductor falls into the feeding tube through the notch after the baffle is removed. The feeding tube is an inclined surface, so the semiconductor will slide down into the subsequent mechanism along with the feeding tube.

[0007] The present invention provides an etching device for semiconductor chip production, which has the following beneficial effects: 1. The etching device for semiconductor chip production, through the setting of the transfer mechanism, when the etched semiconductor chip is transported to the box body of the inclined plate, the filter plate and the mounting plate, the motor 1 is started, and the motor 1 drives the lifting rod and the lever to rotate. When the lifting rod rotates to the vicinity of the mounting block, the mounting block is dragged upward, so that the semiconductor in the box composed of the filter plate and the inclined block can be transported upward. When the bottom of the inclined block exceeds the through pipe, the clamp on the mounting plate will clamp the fixed block 2 at this position, so that the inclined block and the filter plate stop at this position, and the motor 1 continues to rotate. When the lever rotates to contact with the clamp, the clamp is pushed to make the clamp leave the fixed block 2, so that the inclined block and the filter plate fall to the bottom, so that the semiconductor can be taken out of the etching solution by machinery, avoiding the discharge of toxic gases when the staff opens the etching box by themselves, and will not cause damage to the health of the staff. There is no need to use tools to clamp the semiconductors out one by one, which can save time and avoid damage to the tools.

[0008] 2. The etching device for semiconductor chip production can form a box body through the arrangement of the filter plate and the inclined block, so as to realize the loading of the semiconductor. At the same time, the bottom of the inclined block can drive the semiconductor to slide down to the partition after the through pipe is extended. Since water is injected above the partition, the semiconductor can be cleaned by falling into the water through the inclined block. The filter plate can flow out the etching liquid in the box body during the rising process to prevent the etching liquid from flowing into the partition together with the semiconductor, thereby reducing the waste of the etching liquid and preventing the etching liquid from adhering to the semiconductor and causing damage to human health.

[0009] 3. The etching device for semiconductor chip production pours the semiconductor into the filter cartridge through the feed pipe by setting a rotating etching mechanism. Since a rotating door and a spring are arranged on the outside of the filter cartridge, the semiconductor can compress the spring when it falls to open the rotating door. When all the semiconductors enter the filter cartridge, the second motor is started, and the second motor drives the filter cartridge to rotate. Since a block is arranged on the outer wall of the filter cartridge, the rotating door cannot be opened to the outside, so that the semiconductor will not flow out of the filter cartridge when it rotates. The etching liquid can etch the semiconductor in all directions as the filter cartridge rotates in the filter cartridge, and there will be no situation where a certain side or a certain place contacts the inner wall of the etching box and cannot be etched.

[0010] 4. The etching device for semiconductor chip production is provided with a conveying mechanism. When the semiconductor etching is completed, the grip rod is rotated, and the grip rod drives the baffle to rotate. Since there is a notch at the bottom of the filter cartridge, the semiconductor falls into the feeding tube through the notch after the baffle is removed. The feeding tube is an inclined surface, so the semiconductor will slide down into the subsequent mechanism along with the feeding tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall internal structure of the present invention; Figure 3 It is a schematic diagram of the transfer mechanism structure of the present invention; Figure 4 It is a schematic diagram of the back structure of the transfer mechanism of the present invention; Figure 5 It is a schematic diagram of the structure of the rotary etching mechanism of the present invention; Figure 6 It is a schematic diagram of the internal structure of the rotary etching mechanism of the present invention; Figure 7 For the present invention Figure 6 A magnified view of middle; Figure 8 It is a schematic diagram of the structure of the conveying mechanism of the present invention.

[0012] In the figure: 1, etching box; 2, slide rail 1; 3, box cover; 4, partition; 5, through pipe; 6, transfer mechanism; 601, slide rail 2; 602, mounting plate; 603, round table; 604, motor 1; 605, rotating shaft 1; 606, lifting rod; 607, lever; 608, clamp; 609, fixing block 1; 610, fixing block 2; 611, mounting block; 612, fixing block 3; 613, stop rod; 614, filter plate; 615, inclined plate; 7, rotating etching machine Structure; 701, motor two; 702, rotating shaft two; 703, filter cartridge; 704, annular slide rail; 705, bracket; 706, feed pipe; 707, rotating door; 708, rotating shaft three; 709, block; 710, spring; 711, connecting rod two; 712, connecting rod one; 8, conveying mechanism; 801, connecting rod three; 802, feed pipe; 803, baffle; 804, connecting rod four; 805, rotating rod; 806, connecting rod five; 807, grip rod. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0014] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0015] See also Figure 1-8The present invention provides a technical solution: an etching device for semiconductor chip production, comprising an etching box 1, a slide rail 2 is fixedly connected to the top of the etching box 1, a box cover 3 is slidably connected to the top of the slide rail 2, a partition 4 is fixedly connected to the inside of the etching box 1, a through pipe 5 is fixedly connected to the top of the partition 4, a transfer mechanism 6 is provided at the bottom of the through pipe 5, a conveying mechanism 8 is provided on the side of the transfer mechanism 6, and a rotating etching mechanism 7 is provided on the top of the conveying mechanism 8; the rotating etching mechanism 7 includes a motor 701, the motor 701 The output end is fixedly connected to the second rotating shaft 702, the outer side of the second rotating shaft 702 is fixedly connected to the first connecting rod 712, the end of the first connecting rod 712 away from the second rotating shaft 702 is fixedly connected to the filter cartridge 703, the top of the filter cartridge 703 is provided with a feed pipe 706, the outer side of the filter cartridge 703 is slidably connected to the annular slide rail 704, the bottom of the annular slide rail 704 is fixedly connected to the bracket 705, the inside of the filter cartridge 703 is fixedly connected to the second connecting rod 711, the top of the second connecting rod 711 is fixedly connected to the spring 710, the spring 710 is fixedly connected to the spring 710, and the spring 710 is fixedly connected to the spring 710. The end away from the second connecting rod 711 is fixedly connected with a rotating door 707, and the interior of the rotating door 707 is rotatably connected with a rotating shaft 3 708. The outer side of the filter cartridge 703 is fixedly connected with a stopper 709. The second connecting rod 711 is provided with two. The semiconductor is poured into the filter cartridge 703 through the feed pipe 706. Since the outer side of the filter cartridge 703 is provided with a rotating door 707 and a spring 710, the semiconductor can compress the spring 710 when it falls, so as to open the rotating door 707. When all the semiconductors enter the filter cartridge 703, the motor 2 is started. 701, the motor 2 701 drives the rotating shaft 2 702 to rotate, and the rotating shaft 2 702 drives the filter cartridge 703 to rotate through the connecting rod 1 712. Since a stopper 709 is provided on the outer wall of the filter cartridge 703, the rotating door 707 cannot be opened to the outside, so that the semiconductor will not flow out of the filter cartridge 703 when it rotates. The etching liquid can etch the semiconductor in all directions as the filter cartridge 703 rotates in the filter cartridge 703, and there will be no situation where one side or one place contacts the inner wall of the etching box 1 and cannot be etched.

[0016] The transfer mechanism 6 includes a motor 1 604, the output end of the motor 1 604 is fixedly connected to a rotating shaft 1 605, the end of the rotating shaft 1 605 away from the motor 1 604 is fixedly connected to a lifting rod 606, the lifting rod 606 is fixedly connected to a lever 607 on the side close to the motor 1 604, a mounting block 611 is provided at the end of the lifting rod 606 away from the rotating shaft 1 605, a round table 603 is provided on the side close to the motor 1 604, the round table 603 is fixedly connected to a mounting plate 602 on the side close to the motor 1 604, the side of the mounting plate 602 is fixedly connected to a slide rail 2 601, the round table 603 is fixedly connected to a stopper 613 on the side close to the motor 1 604, and the mounting plate 602 is rotatably connected to the side close to the motor 1 604. There is a clamp 608, and the top of the mounting block 611 is fixedly connected with an inclined plate 615, and the side of the inclined plate 615 is fixedly connected with a filter plate 614. There are two filter plates 614. The inclined block and the filter plate 614 can form a box body, so as to realize the loading of semiconductors. At the same time, after the bottom of the inclined block extends out of the through pipe 5, it can drive the semiconductor to slide down onto the partition 4. Since water is injected above the partition 4, the semiconductor falls into the water through the inclined block, which can clean the semiconductor. The filter plate 614 can flow out the etching liquid in the box body during the rising process, so as to prevent the etching liquid from flowing into the partition 4 together with the semiconductor, thereby reducing the waste of the etching liquid and preventing the etching liquid from adhering to the semiconductor and causing damage to human health. The mounting block 611 is close to the motor 604. The side of the mounting block 611 is fixedly connected with a fixing block 609, the side of the mounting block 611 away from the motor 1 604 is fixedly connected with a fixing block 3 612, and the bottom of the mounting block 611 is fixedly connected with a fixing block 2 610. When the etched semiconductor chip is transported to the box body of the inclined plate 615, the filter plate 614 and the mounting plate 602, the motor 1 604 is started, and the motor 1 604 drives the rotating shaft 1 605 to rotate, and the rotating shaft 1 605 drives the lifting rod 606 and the lever 607 to rotate. When the lifting rod 606 rotates to the vicinity of the mounting block 611, the mounting block 611 is dragged upward through the fixing block 1 609, so that the semiconductor in the box composed of the filter plate 614 and the inclined block can be transported upward. When the bottom of the inclined block exceeds the through pipe 5, the mounting plate 602 on the mounting plate The clamping member 608 will clamp the second fixed block 610 at this position, so that the inclined block and the filter plate 614 will stop at this position, and the motor 1 604 will continue to rotate. When the lever 607 rotates to contact the clamping member 608, the clamping member 608 is pushed to make the clamping member 608 leave the second fixed block 610, so that the inclined block and the filter plate 614 fall to the bottom, and the third fixed block 612 will be stuck on the blocking rod 613, so that the mounting block 611 will stop at this position, so that the semiconductor can be taken out of the etching solution by machinery, avoiding the discharge of toxic gases when the staff opens the etching box 1 by themselves, and will not cause damage to the health of the staff. There is no need to use tools to clamp out the semiconductors one by one, which can save time and avoid damage to the tools.

[0017] The conveying mechanism 8 includes a connecting rod three 801, the bottom end of the connecting rod three 801 is fixedly connected to a feeding tube 802, a baffle 803 is provided on the top of the feeding tube 802, a connecting rod four 804 is fixedly connected to the side of the baffle 803, the end of the connecting rod four 804 away from the baffle 803 is fixedly connected to a rotating rod 805, the end of the rotating rod 805 away from the connecting rod four 804 is fixedly connected to a connecting rod five 806, the end of the connecting rod five 806 away from the rotating rod 805 is fixedly connected to a gripping rod 807, and two connecting rods three 801 are provided. When the semiconductor etching is completed, the gripping rod 807 is rotated, and the gripping rod 807 drives the baffle 803 to rotate. Since a notch is provided at the bottom of the filter cartridge 703, the semiconductor falls into the feeding tube 802 through the notch after the baffle 803 is removed. The feeding tube 802 is an inclined surface, so the semiconductor will slide down into the subsequent mechanism along with the feeding tube 802.

[0018] When in use, the semiconductor is poured into the filter cartridge 703 through the feed pipe 706. Since the outer side of the filter cartridge 703 is provided with a rotating door 707 and a spring 710, the semiconductor can compress the spring 710 when it falls, thereby opening the rotating door 707. When all the semiconductors enter the filter cartridge 703, the motor 2 701 is started, and the motor 2 701 drives the rotating shaft 2 702 to rotate. The rotating shaft 2 702 drives the filter cartridge 703 to rotate through the connecting rod 1 712. Since a stopper 709 is provided on the outer wall of the filter cartridge 703, the rotating door 707 cannot be opened to the outside, so that the semiconductor will not flow out of the filter cartridge 703 when it rotates. The etching liquid can immerse the semiconductor in all directions in the filter cartridge 703 as the filter cartridge 703 rotates. Etching will not occur on one side or one place that contacts the inner wall of the etching box 1, resulting in a situation where etching cannot be performed. When the semiconductor etching is completed, the grip 807 is rotated, and the grip 807 drives the baffle 803 to rotate. Since a notch is arranged at the bottom of the filter cartridge 703, after the baffle 803 is removed, the semiconductor passes through the notch and falls into the feeding tube 802. The feeding tube 802 is an inclined surface, so the semiconductor will slide down into the subsequent mechanism along with the feeding tube 802. When the etched semiconductor chip is transported to the box body of the inclined plate 615, the filter plate 614 and the mounting plate 602, the motor 604 is started, and the motor 604 drives the rotating shaft 605 to rotate, and the rotating shaft 605 drives the lifting rod 606 and the lever 607 to rotate. When the lifting rod 606 rotates to the vicinity of the mounting block 611, When the mounting block 611 is near, it is dragged upward through the fixing block 1 609, so that the semiconductor in the box composed of the filter plate 614 and the inclined block can be transported upward. When the bottom of the inclined block exceeds the through pipe 5, the clamp 608 on the mounting plate 602 will clamp the fixing block 2 610 at this position, so that the inclined block and the filter plate 614 are stopped at this position, and the motor 1 604 continues to rotate. When the lever 607 rotates to contact the clamp 608, the clamp 608 is pushed to make the clamp 608 leave the fixing block 2 610, so that the inclined block and the filter plate 614 fall to the bottom, and the fixing block 3 612 is clamped on the stop rod 613, so that the mounting block 611 is stopped at this position, so that the semiconductor can be taken out of the etching solution by machinery to avoid the staff from self- When the etching box 1 is opened, the toxic gas is discharged without causing damage to the health of the staff, and there is no need to use tools to clamp out the semiconductors one by one, which can save time and avoid damage to the tools. Since the inclined block and the filter plate 614 can form a box body, the loading of the semiconductor can be achieved. At the same time, the bottom of the inclined block extends out of the through pipe 5, which can drive the semiconductor to slide down onto the partition 4. Since water is injected above the partition 4, the semiconductor falls into the water through the inclined block to clean the semiconductor. The filter plate 614 can make the etching solution in the box body flow out during the rising process, so as to avoid the etching solution flowing into the partition 4 together with the semiconductor, thereby reducing the waste of the etching solution and avoiding the etching solution adhering to the semiconductor and causing damage to human health.

[0019] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An etching device for semiconductor chip production, comprising an etching box (1), characterized in that: The top of the etching box (1) is fixedly connected to a slide rail (2), the top of the slide rail (2) is slidably connected to a box cover (3), the interior of the etching box (1) is fixedly connected to a partition (4), the top of the partition (4) is fixedly connected to a through pipe (5), a transfer mechanism (6) is provided at the bottom of the through pipe (5), a conveying mechanism (8) is provided on the side of the transfer mechanism (6), and a rotating etching mechanism (7) is provided on the top of the conveying mechanism (8); The rotary etching mechanism (7) comprises a second motor (701), the output end of the second motor (701) is fixedly connected to a second rotating shaft (702), the outer side of the second rotating shaft (702) is fixedly connected to a first connecting rod (712), the end of the first connecting rod (712) away from the second rotating shaft (702) is fixedly connected to a filter cartridge (703), a feed pipe (706) is provided at the top of the filter cartridge (703), the outer side of the filter cartridge (703) is slidably connected to an annular slide rail (704), and the bottom of the annular slide rail (704) is fixedly connected to a bracket (705); The interior of the filter cartridge (703) is fixedly connected to a second connecting rod (711), the top of the second connecting rod (711) is fixedly connected to a spring (710), one end of the spring (710) away from the second connecting rod (711) is fixedly connected to a rotating door (707), the interior of the rotating door (707) is rotatably connected to a third rotating shaft (708), and the outer side of the filter cartridge (703) is fixedly connected to a stopper (709); The transfer mechanism (6) comprises a motor 1 (604), the output end of the motor 1 (604) is fixedly connected to a rotating shaft 1 (605), the end of the rotating shaft 1 (605) away from the motor 1 (604) is fixedly connected to a lifting rod (606), the side of the lifting rod (606) close to the motor 1 (604) is fixedly connected to a shifting rod (607), and the end of the lifting rod (606) away from the rotating shaft 1 (605) is provided with a mounting block (611), and the mounting block (611) is provided with a mounting block (612). 11) A round platform (603) is provided on a side close to motor one (604); a mounting plate (602) is fixedly connected to the side of the round platform (603) close to motor one (604); a slide rail two (601) is fixedly connected to the side of the mounting plate (602); a stop rod (613) is fixedly connected to the side of the round platform (603) away from motor one (604); and a clamp (608) is rotatably connected to the side of the mounting plate (602) close to motor one (604); A side of the mounting block (611) close to the motor one (604) is fixedly connected to a fixing block one (609), a side of the mounting block (611) away from the motor one (604) is fixedly connected to a fixing block three (612), and a bottom of the mounting block (611) is fixedly connected to a fixing block two (610); The conveying mechanism (8) comprises a connecting rod three (801), the bottom end of the connecting rod three (801) is fixedly connected to a feeding tube (802), a baffle (803) is provided on the top of the feeding tube (802), a connecting rod four (804) is fixedly connected to the side of the baffle (803), an end of the connecting rod four (804) away from the baffle (803) is fixedly connected to a rotating rod (805), an end of the rotating rod (805) away from the connecting rod four (804) is fixedly connected to a connecting rod five (806), and an end of the connecting rod five (806) away from the rotating rod (805) is fixedly connected to a gripping rod (807).

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