Integrated circuit production and processing equipment

Abstract

The present invention provides an integrated circuit production and processing device, which relates to the field of integrated circuit processing technology, including a base, a positioning mechanism for fixing an integrated circuit board, a gluing mechanism for gluing and packaging, and a collecting mechanism for recovering colloid. The positioning mechanism includes a vertical rod, the gluing mechanism includes a bracket, a first T-shaped slider, a glue storage barrel, and a valve plate, and the collecting mechanism includes a constant temperature box, a collection box, a second motor, an arc-shaped slide bar, and an arc-shaped scraper. This device is set up to stand up the integrated circuit board and apply glue from top to bottom. The glue naturally falls under the action of gravity, which can more accurately control the amount of glue and make the amount of glue at each point more uniform. Compared with the method of applying glue on a flat surface and waiting for the glue to naturally level, the glue can be applied on the upright circuit board. Under the action of gravity, the glue can quickly reach the designated position and form a uniform glue layer without the need for additional leveling time.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit processing, and more specifically, relates to an integrated circuit production and processing equipment. Background Art

[0002] Integrated circuit board packaging is the process of placing, attaching, fixing, and connecting chips and other components on a frame or substrate using film and micromachining technologies. Terminals are then introduced and fixed with a plastic insulating medium to form the overall structure. This is the final step in integrated circuit production. Its primary functions include protecting, supporting, connecting, and improving reliability of semiconductor device chips.

[0003] The Chinese patent publication number is: CN115295506A, which discloses a packaging device for integrated circuit production and processing. This invention reduces the thickness of the integrated circuit board packaging colloid by collecting excess overflow colloid, and cools the packaged integrated circuit board in the packaging cavity through a circulating cooling method. The cooling is uniform and fast, reducing defective products while improving the efficiency of packaging integrated circuit boards.

[0004] Existing integrated circuit board packaging equipment has the following disadvantages:

[0005] 1. Existing integrated circuit boards mostly use flat glue packaging. In flat glue packaging, glue is not easy to spread on the surface of the circuit board, which may cause uneven glue distribution, resulting in excessive glue in some areas and insufficient glue in others. After glue application, it is usually necessary to wait for the glue to level naturally or use additional tools to assist leveling. This process takes a certain amount of time and reduces production efficiency.

[0006] 2. The sizes of existing integrated circuit boards are different. It is difficult to accurately apply glue and control glue according to the sizes of different integrated circuit boards during actual glue application, resulting in insufficient or excessive glue, affecting the firmness after packaging, or causing waste of glue.

[0007] Therefore, in view of this, research and improvement are conducted on the existing structure and defects, and an integrated circuit production and processing equipment is provided to achieve the purpose of having more practical value. Summary of the Invention

[0008] In order to solve the above technical problems, the present invention provides an integrated circuit production and processing equipment to solve the above problems.

[0009] An integrated circuit production and processing equipment includes a base, the base is provided with a positioning mechanism for fixing the integrated circuit board, the base is provided with a gluing mechanism for gluing and packaging, the base is provided with a collecting mechanism for recovering the colloid, the positioning mechanism includes a vertical rod, the gluing mechanism includes a bracket, a first T-shaped slider, a glue storage barrel and a valve plate, the collecting mechanism includes a constant temperature box, a collection box, a second motor, an arc-shaped sliding rod and an arc-shaped scraper, the bracket is fixedly mounted on the two side ends of the base, the upper ends of the two brackets are fixedly mounted with the same cross bar, the upper ends of the two cross bars are penetrated by a first rectangular groove, the first T-shaped slider is slidably installed in the first rectangular groove, and the glue storage barrel is fixedly mounted on the first T-slider The two cams are connected by a plurality of L-shaped guide rails, each of which has a plurality of L-shaped guide rails, and a plurality of L-shaped guide rails are connected to the two cams to form a plurality of L-shaped guide rails. The vertical rod is fixedly installed on the upper end of the base, and the two side ends of the first rectangular groove are penetrated by a first circular groove, and the inner side walls of the two first circular grooves are rotatably installed with the same first reciprocating screw rod, the side end of the cross bar is fixedly installed with a first motor, and the first reciprocating screw rod is fixedly installed on the output end of the first motor, and the side end of the first T-shaped slider is penetrated by a first threaded groove, and the first reciprocating screw rod is threadedly rotatably installed on the inner side wall of the first threaded groove, the lower end of the glue storage barrel is fixedly installed with a valve, and the lower end of the valve is fixedly installed with a bellows, the inner side wall of the valve is provided with a valve plate, and the circumferential end of the valve is also fixedly installed with a fixed pipe, and the side end of the valve plate is fixedly installed with a round shaft, and the round shaft penetrates and is rotatably installed on the fixed The inner side wall of the tube, the first torsion spring is fixedly installed between the round shaft and the fixed tube, the side end portion of the round shaft is fixedly installed with a movable rod, the side end portions of the two vertical rods are penetrated with a second circular groove, the inner side walls of the two second circular grooves are penetrated with double-headed screws rotatably installed, the upper end portion of each mounting plate is penetrated with a second rectangular groove, the upper end portion of each third T-shaped slider is fixedly installed with a second T-shaped slider, each second T-shaped slider is penetrated and slidably installed on the inner side wall of the second rectangular groove, the side end portion of each second T-shaped slider is penetrated with a second threaded groove, the two double-headed screws are threadably rotatably installed on the inner side wall of each second threaded groove, and a spring is fixedly installed between each fourth T-shaped slider and each third T-shaped slider.A slide is fixedly installed on the side end of each fourth T-shaped slider, and a clamping plate is fixedly installed on the side end of each slide. The clamping plates on the two vertical rods face oppositely, and the upper ends of the two slides on one side of the glue storage barrel are fixedly installed with a push rod, and the upper ends of the two push rods are fixedly installed with the same arc-shaped telescopic rod. The side end of the constant temperature box is penetrated by a side groove, and the inner side wall of the side groove is installed with a collection box. The same second reciprocating screw is rotatably installed between the two fixed blocks, and the side end of the fixed block is fixedly installed with a second motor, and the second reciprocating screw is fixedly installed on the output end of the second motor. The same limit rod is also fixedly installed between the two fixed blocks.

[0010] Preferably, a third thread groove and a third circular groove are formed through the side end portion of the arc-shaped slide rod, the second reciprocating screw rod is threadably mounted on the inner side wall of the third thread groove, the arc-shaped slide rod is slidably mounted on the circumferential end portion of the limit rod through the third circular groove, a fixed shaft is fixedly mounted on the side end portion of the arc-shaped slide rod, and an arc-shaped scraper is also provided on one side of the arc-shaped slide rod.

[0011] Preferably, both side ends of the arc scraper are provided with glue guiding grooves, and the side ends of the arc scraper are penetrated by a fourth circular groove. The arc scraper is rotatably installed on the circumferential end of the fixed shaft through the fourth circular groove, and a second torsion spring is fixedly installed between the fixed shaft and the fourth circular groove.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] In the present invention, by setting up a method of standing the integrated circuit board upright and applying glue from top to bottom, the glue falls naturally under the action of gravity, and the amount of glue can be controlled more accurately. The excess glue will drip and be collected due to gravity, which can effectively avoid the problem of excessive glue and make the glue amount at each point more uniform. Compared with the method of applying glue on a flat surface and waiting for the glue to level naturally, when the circuit board is stood up for gluing, the glue can quickly reach the designated position under the action of gravity and form a uniform glue layer, without the need for additional leveling time, and the glue coating is uniform.

[0014] In the present invention, a method of vertically applying glue on the circuit board is adopted. The vertically applying glue method enables the glue to cover the parts that need to be packaged more evenly, and the thickness of the formed glue layer is more uniform and moderate, which helps to reduce the curing time and internal stress, and avoids the possibility of forming a thicker glue layer on the surface of the circuit board when applying glue on a flat surface. This will not only increase the curing time of the glue, but may also generate internal stress during the curing process, resulting in cracks, bubbles and other defects in the packaging layer, thereby ensuring the uniformity of the glue layer and the quality of subsequent fixed packaging.

[0015] In the present invention, by providing an adjustable fourth T-shaped slider, the sliding plate and the third T-shaped slider in combination, the spring has a certain deformation ability and can adapt to integrated circuit boards of different sizes. When the clamping force of the spring is not sufficient to firmly fix a larger or smaller integrated circuit board, additional support and clamping force can be provided by adjusting the two third T-shaped sliders. The third T-shaped slider can be adjusted according to the actual situation of the circuit board to ensure that the circuit board will not loosen or shift during the clamping process, avoiding the situation where the clamping force is too large or too small due to relying solely on the spring.

[0016] In the present invention, a movable rod, a round shaft, a first torsion spring and an adjustable arc-shaped telescopic rod are arranged to cooperate with each other. After adjustment, the length of the arc-shaped telescopic rod is equal to the width of the integrated circuit board. Only when the movable rod moves and contacts the arc-shaped telescopic rod will the movable rod drive the valve plate to rotate and open in the valve to discharge glue. After the movable rod leaves the arc-shaped telescopic rod, the first torsion spring will drive the valve plate to rotate and reset to close. Without the need for additional manual intervention, precise glue control is achieved, so that the amount of glue applied is adapted to the width of different integrated circuit boards, thereby avoiding extra waste of glue.

[0017] In the present invention, a constant temperature box, a collection box and an arc scraper are provided to cooperate with each other. The collection box can collect excess glue dripping on the integrated circuit board and overflow glue scraped by the arc scraper. The constant temperature box can ensure that the glue in the collection box maintains a certain temperature to prevent the glue from condensing, thereby realizing the recycling of the glue and avoiding the waste of glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the base of the present invention;

[0019] Figure 2 It is a schematic diagram of the exploded structure of the bracket of the present invention;

[0020] Figure 3 This is a schematic diagram of the explosion structure of the glue storage barrel of the present invention;

[0021] Figure 4 It is a schematic diagram of the exploded structure of the vertical pole of the present invention;

[0022] Figure 5 It is a schematic diagram of the exploded structure of the third T-shaped slider of the present invention;

[0023] Figure 6 It is a structural schematic diagram of the thermostat of the present invention;

[0024] Figure 7 It is a schematic diagram of the exploded structure of the arc scraper of the present invention;

[0025] Figure 8 It is a schematic diagram of the explosion structure of the thermostat of the present invention.

[0026] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 1. Base; 11. L-shaped side rod; 2. Bracket; 21. Crossbar; 22. First rectangular groove; 23. First circular groove; 24. First motor; 25. First reciprocating screw; 3. First T-shaped slider; 31. First thread groove; 32. Glue storage barrel; 33. Valve; 34. Bellows; 35. Valve plate; 36. First torsion spring; 37. Round shaft; 38. Movable rod; 39. Fixed tube; 4. Vertical rod; 41. Mounting plate; 42. T-shaped slide; 43. Second circular groove; 45. Second rectangular groove; 46. Second thread Groove; 47, second T-shaped slider; 48, third T-shaped slider; 49, double-headed screw; 5, fourth T-shaped slider; 51, spring; 52, slide plate; 53, clamping plate; 54, push rod; 55, arc-shaped telescopic rod; 6, constant temperature box; 61, collecting bucket; 62, side groove; 63, collecting box; 64, fixed block; 65, second reciprocating screw; 66, second motor; 67, limit rod; 7, arc-shaped slide rod; 71, third thread groove; 72, third circular groove; 73, arc-shaped scraper; 74, fourth circular groove; 75, glue guide groove; 76, second torsion spring; 77, fixed shaft. DETAILED DESCRIPTION

[0027] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0028] See also Figure 1 - Figure 8The present invention provides an integrated circuit production and processing device, including a base 1, a positioning mechanism for fixing an integrated circuit board, a gluing mechanism for gluing and packaging, and a collecting mechanism for recovering colloid. The positioning mechanism includes a vertical rod 4, the gluing mechanism includes a bracket 2, a first T-shaped slider 3, a glue storage barrel 32 and a valve plate 35, and the collecting mechanism includes a constant temperature box 6, a collection box 63, a second motor 66, an arc-shaped slide bar 7 and an arc-shaped scraper 73. The bracket 2 is fixedly mounted on both side ends of the base 1, and the upper ends of the two brackets 2 are fixedly mounted with the same cross bar 21. The upper ends of the two cross bars 21 are penetrated by a first rectangular groove 22, and the first T-shaped slider 3 is slidably mounted in the first rectangular groove 22. Inside, the glue storage barrel 32 is fixedly mounted on the lower end of the first T-shaped slider 3, and there are two vertical rods 4. Both side ends of the two vertical rods 4 are fixedly mounted with mounting plates 41, and the side ends of each mounting plate 41 are provided with a T-shaped slide 42. The inner side wall of each T-shaped slide 42 is slidably mounted with a third T-shaped slider 48, and the inner side wall of each T-shaped slide 42 is also slidably mounted with a fourth T-shaped slider 5. The thermostat 6 is fixedly mounted on the upper end of the base 1, and a collecting bucket 61 is fixedly mounted on the upper end of the thermostat 6. Two fixed blocks 64 are fixedly mounted on the side end of the thermostat 6. The arc-shaped slide rod 7 is located between the two fixed blocks 64. The side end of the base 1 is fixedly mounted with an L-shaped side rod 11, and the side end of the L-shaped side rod 11 is fixedly mounted with a bracket 2, which is located in the L-shaped The vertical rod 4 on one side of the side rod 11 is fixedly mounted on the side end of the bracket 2, and the vertical rod 4 on the side away from the L-shaped side rod 11 is fixedly mounted on the upper end of the base 1. The two side ends of the first rectangular groove 22 are penetrated by a first circular groove 23, and the inner side walls of the two first circular grooves 23 are rotatably mounted with the same first reciprocating screw rod 25. The side end of the cross bar 21 is fixedly mounted with a first motor 24, and the first reciprocating screw rod 25 is fixedly mounted on the output end of the first motor 24. The side end of the first T-shaped slider 3 is penetrated by a first threaded groove 31, and the first reciprocating screw rod 25 is threadedly mounted on the inner side wall of the first threaded groove 31. The lower end of the glue storage barrel 32 is fixedly mounted with a valve 33, and the lower end of the valve 33 is fixedly mounted with a bellows 34, and the inner side wall of the valve 33 is provided with The valve plate 35 and the circumferential end of the valve 33 are also fixedly installed with a fixed tube 39, and the side end of the valve plate 35 is fixedly installed with a circular shaft 37, which penetrates and is rotatably installed on the inner side wall of the fixed tube 39. A first torsion spring 36 is fixedly installed between the circular shaft 37 and the fixed tube 39, and a movable rod 38 is fixedly installed on the side end of the circular shaft 37. The user can stretch the bellows 34 so that the end of the bellows 34 is close to the upper end position of the integrated circuit board. At this time, the user can start the first motor 24, and the first motor 24 starts to drive the first reciprocating screw rod 25 to rotate. The rotation of the first reciprocating screw rod 25 will drive the first T-shaped slider 3 to move through the first threaded groove 31. The movement of the first T-shaped slider 3 will drive the glue storage barrel 32 to move, and the movement of the glue storage barrel 32 will drive the bellows 34 to move.When the valve 33 moves, it also drives the movable rod 38 at the side end of the valve 33 to move. After the movable rod 38 moves and contacts the end of the arc-shaped telescopic rod 55, the movable rod 38 is forced to rotate. The rotation of the movable rod 38 drives the circular shaft 37 to rotate. The rotation of the circular shaft 37 drives the valve plate 35 to rotate and open in the valve 33. At this time, the first torsion spring 36 is compressed. After the valve plate 35 opens, the glue in the glue storage barrel 32 flows through the valve 33 and the bellows 34 to the integrated circuit board. The bellows 34 will apply glue along the edge of the integrated circuit board when it moves horizontally.

[0029] The side ends of the two uprights 4 are penetrated by a second circular groove 43, and the inner side walls of the two second circular grooves 43 are penetrated by a double-headed screw 49 for rotation. The upper end of each mounting plate 41 is penetrated by a second rectangular groove 45, and the upper end of each third T-shaped slider 48 is fixedly installed with a second T-shaped slider 47, and each second T-shaped slider 47 is penetrated and slidably installed on the inner side wall of the second rectangular groove 45. The side end of each second T-shaped slider 47 is penetrated by a second threaded groove 46, and two double-headed screws 49 are threadedly installed on the inner side wall of each second threaded groove 46. A spring 51 is fixedly installed between each fourth T-shaped slider 5 and each third T-shaped slider 48, and a slide plate 52 is fixedly installed on the side end of each fourth T-shaped slider 5 , each side end of the slide 52 is fixedly installed with a clamping plate 53, and the clamping plates 53 on the two vertical rods 4 face oppositely. The user can rotate the double-headed screw 49 in the forward or reverse direction. The double-headed screw 49 rotates through the second thread groove 46 to drive the two second T-shaped sliders 47 to move closer to or away from each other. The movement of the second T-shaped slider 47 will drive the third T-shaped slider 48 to move. The movement of the third T-shaped slider 48 drives the fourth T-shaped slider 5 to move through the spring 51. The movement of the fourth T-shaped slider 5 drives the clamping plate 53 to move through the slide 52. After moving the two third T-shaped sliders 48 to the appropriate position, the user can stop rotating the double-headed screw 49, and the user can place the integrated circuit board between the two clamping plates 53 to clamp the integrated circuit board;

[0030] A push rod 54 is fixedly mounted on the upper end of each of the two slides 52 located on one side of the glue storage barrel 32. The upper end of each of the two push rods 54 is fixedly mounted with the same arc-shaped telescopic rod 55. When the two slides 52 and the clamping plate 53 are adjusted, the movement of the slides 52 will also drive the movement of the two push rods 54. The movement of the two push rods 54 will drive the arc-shaped telescopic rod 55 to extend or retract. At this time, the length of the arc-shaped telescopic rod 55 is adapted to the integrated circuit board.

[0031] A side groove 62 is formed through the side end of the thermostat box 6, and a collection box 63 is installed on the inner wall of the side groove 62. After one application of glue is completed, the excess glue on the integrated circuit board will drip into the collection box 63 inside the thermostat box 6;

[0032] A second reciprocating screw rod 65 is rotatably installed between the two fixed blocks 64, and a second motor 66 is fixedly installed on the side end of the fixed block 64. The second reciprocating screw rod 65 is fixedly installed on the output end of the second motor 66. A same limiting rod 67 is also fixedly installed between the two fixed blocks 64. The side end of the arc-shaped slide rod 7 is penetrated by a third thread groove 71 and a third circular groove 72. The second reciprocating screw rod 65 is threadedly rotatably installed on the inner side wall of the third thread groove 71. The arc-shaped slide rod 7 is slidably installed on the circumferential end of the limiting rod 67 through the third circular groove 72. The side end of the arc-shaped slide rod 7 is fixedly installed with a fixed shaft 77. A curved scraper 73 is also provided on one side of the curved slide rod 7. Both side ends of the curved scraper 73 are provided with a glue guide groove 75. The side end of the curved scraper 73 is penetrated by a fourth circular groove 74. The curved scraper 73 passes through the fourth circular groove 74. The four circular grooves 74 are rotatably mounted on the circumferential end of the fixed shaft 77. A second torsion spring 76 is fixedly mounted between the fixed shaft 77 and the fourth circular groove 74. The user can also drive the second motor 66. When the second motor 66 is started, the second reciprocating screw 65 is driven to rotate. The second reciprocating screw 65 rotates through the third threaded groove 71 to drive the arc slide 7 to move. The movement of the arc slide 7 will drive the arc scraper 73 on the fixed shaft 77 to move. The movement of the arc scraper 73 will scrape off the excess glue overflowing from the bottom of the integrated circuit board, and the glue can be collected through the glue guide grooves 75 on both sides, so that the excess glue drips into the collection box 63. A second torsion spring 76 is set between the fourth circular groove 74 and the fixed shaft 77, so that the arc scraper 73 can undergo a certain deformation when scraping, to avoid excessive friction and damage to the edge of the integrated circuit board.

[0033] Working principle:

[0034] The first step is to package the integrated circuit board and the base when processing the integrated circuit. The user can fix the integrated circuit board on the vertical pole 4 away from the side of the bracket 2, and place the integrated circuit board between the two clamping plates 53. The fourth T-shaped sliders 5 on both sides are driven to approach each other by the rebound thrust of the springs 51 on both sides, and the two clamping plates 53 are driven to clamp the integrated circuit board by the slide plate 52. The user can use the same method to fix the package base between the two clamping plates 53 on one side of the bracket 2. At this time, the user can start the first motor 24 to drive the first reciprocating screw 25 to rotate, and the first T-shaped slider 3 slides in the first rectangular groove 22 to drive the glue storage barrel 32 to move, and the glue storage barrel 32 moves to drive the glue storage barrel When the movable rod 38 on 32 contacts the arc-shaped telescopic rod 55, the movable rod 38 will rotate and drive the valve plate 35 to rotate and open in the valve 33. At this time, glue will flow out from the port of the bellows 34 and be coated on the integrated circuit board. The glue is covered on the integrated circuit board from top to bottom by gravity, and the excess glue will fall into the constant temperature box 6 by gravity. After the coating is completed, the bracket 2 can be started to drive the vertical rod 4 close to the vertical rod 4 on the other side, so that the integrated circuit board and the packaging base are attached together, and the second motor 66 is started to drive the second reciprocating screw 65 to rotate, driving the arc-shaped slide rod 7 to move. The movement of the arc-shaped slide rod 7 will drive the arc scraper 73 to move to scrape off the glue at the bottom of the integrated circuit board, and collect it in the constant temperature box 6 through the glue guide groove 75;

[0035] In the second step, when the user packages the integrated circuit board, the user can first fix the integrated circuit board. The user can adjust the position of the two third T-shaped sliders 48 according to the width of the integrated circuit board to compensate for the problem that the elastic force of the spring 51 is limited to a certain extent, so as to avoid the integrated circuit board being too wide and the resistance of the spring 51 being too large, which makes the clamping force too large and may cause damage to the integrated circuit board, or the integrated circuit board being too narrow and the clamping force of the spring 51 being insufficient, resulting in loose clamping. The user can rotate the double-headed screw 49 forward or reverse, and the double-headed screw 49 rotates through the second thread groove 46 to drive the two second T-shaped sliders 47 to move closer to or away from each other, and the second T-shaped slider 47 moves The third T-shaped slider 48 is driven to move. The movement of the third T-shaped slider 48 drives the fourth T-shaped slider 5 to move via the spring 51. The movement of the fourth T-shaped slider 5 drives the clamping plate 53 to move via the slide plate 52. After the two third T-shaped sliders 48 are moved to the appropriate position, the user can stop rotating the double-headed screw 49. The user can place the integrated circuit board between the two clamping plates 53 to clamp the integrated circuit board. The user can place the bottom end of the integrated circuit board on the position attached to the upper end of the arc-shaped scraper 73 to complete the fixing of the integrated circuit board. The user can fix the package base between the two clamping plates 53 on one side of the bracket 2 in the same way.

[0036] The present device is provided with an adjustable fourth T-shaped slider 5, a slide plate 52 and a third T-shaped slider 48, and the spring 51 has a certain deformation ability, which can adapt to integrated circuit boards of different sizes. When the clamping force of the spring 51 is not enough to firmly fix a larger or smaller integrated circuit board, the two third T-shaped sliders 48 can be adjusted to provide additional support and clamping force. The third T-shaped slider 48 can be adjusted according to the actual situation of the circuit board to ensure that the circuit board will not loosen or shift during the clamping process, and avoid the situation where the clamping force is too large or too low due to relying solely on the spring 51;

[0037] In the third step, when the two slides 52 and the clamping plate 53 are adjusted, the movement of the slide 52 will also drive the two push rods 54 to move, and the movement of the two push rods 54 will drive the arc-shaped telescopic rod 55 to extend and contract. At this time, the length of the arc-shaped telescopic rod 55 is adapted to the integrated circuit board. After the integrated circuit board is fixed, the integrated circuit board can be glued. The user can stretch the bellows 34 so that the port of the bellows 34 is close to the upper end position of the integrated circuit board. At this time, the user can start the first motor 24. The first motor 24 starts to drive the first reciprocating screw rod 25 to rotate. The rotation of the first reciprocating screw rod 25 will drive the first T-shaped slider 3 to move through the first thread groove 31. The movement of the first T-shaped slider 3 will drive the glue storage barrel 32 to move. The movement of the glue storage barrel 32 will drive the bellows 34 to move. When the valve 33 moves, it will also drive the movable rod 38 at the side end of the valve 33 to move. After the movable rod 38 moves and contacts the end of the arc-shaped telescopic rod 55, the movable rod 38 is forced to rotate, and the rotation of the movable rod 38 drives the circular shaft 37 to rotate. The rotation of the circular shaft 37 drives the valve plate 35 to rotate and open in the valve 33. At this time, the first torsion spring 36 is compressed. After the valve plate 35 is opened, the glue in the glue storage barrel 32 flows to the integrated circuit board through the valve 33 and the bellows 34. When the bellows 34 moves laterally, it will glue along the edge of the integrated circuit board. The glue will slide downward on the integrated circuit board under the force of gravity, so that the side of the integrated circuit board is evenly coated with glue. When the movable rod 38 moves away from the end of the arc-shaped telescopic rod 55, the bellows 34 also leaves the edge of the integrated circuit board. The first torsion spring 36 will rotate and drive the valve plate 35 on the circular shaft 37 to rotate and reset, so that the valve 33 is closed, completing one glue application. The user can choose whether to glue again according to the glue coating condition on the integrated circuit board.

[0038] This device sets up a method of applying glue from top to bottom by standing the integrated circuit board upright. The glue falls naturally under the action of gravity, which can more accurately control the amount of glue. The excess glue will drip and collect due to gravity, which can effectively avoid the problem of excessive glue and make the glue amount at each point more uniform. Compared with the method of applying glue on a flat surface and waiting for the glue to level naturally, the glue can be applied by standing the circuit board upright. Under the action of gravity, the glue can quickly reach the designated position and form a uniform glue layer, without the need for additional leveling time, and the glue coating is uniform.

[0039] This device adopts a method of vertically applying glue on the circuit board. The vertical application method enables the glue to be more evenly covered on the parts that need to be encapsulated. The thickness of the formed glue layer is more uniform and moderate, which helps to reduce the curing time and internal stress. It avoids the possibility of forming a thick glue layer on the surface of the circuit board when applying glue on a flat surface. This will not only increase the curing time of the glue, but also may generate internal stress during the curing process, resulting in defects such as cracks and bubbles in the encapsulation layer. The uniformity of the glue layer and the quality of subsequent fixed encapsulation are guaranteed.

[0040] This device is equipped with a movable rod 38, a circular shaft 37, a first torsion spring 36 and an adjustable arc-shaped telescopic rod 55. After adjustment, the length of the arc-shaped telescopic rod 55 is the width of the integrated circuit board. Only when the movable rod 38 moves and contacts the arc-shaped telescopic rod 55 will the movable rod 38 drive the valve plate 35 to rotate and open in the valve 33 to discharge glue. After the movable rod 38 leaves the arc-shaped telescopic rod 55, the first torsion spring 36 will drive the valve plate 35 to rotate and return to the closed position. In this way, precise glue control is achieved without additional manual intervention, so that the glue application amount is adapted to different integrated circuit board widths, avoiding extra glue waste.

[0041] In the fourth step, after completing one gluing operation, the excess glue on the integrated circuit board will drip into the collection box 63 in the constant temperature box 6. The user can drive the bracket 2 to drive the packaging base on the vertical rod 4 on one side of the bracket 2 to fit the integrated circuit board. The two sets of clamping plates 53 on the two vertical rods 4 are oriented in different directions. The clamping plates 53 on the vertical rod 4 on one side of the bracket 2 face upward, and the clamping plates 53 on the vertical rod 4 on the other side face downward, so that the two sets of clamping plates 53 can be staggered when they are close, so that the integrated circuit board and the packaging base can be fit and packaged. After fitting, the user can also drive the second motor 66. The second motor 66 starts to drive the second reciprocating screw rod 65 to rotate. The second reciprocating screw rod 65 rotates through the third thread groove 71 to drive the arc slide rod 7 to move, and the movement of the arc slide rod 7 will drive the fixed The curved scraper 73 on the fixed shaft 77 moves, and the curved scraper 73 will scrape off the excess glue overflowing from the bottom of the integrated circuit board, and the glue can be collected through the glue guide grooves 75 on both sides, so that the excess glue drips into the collection box 63. A second torsion spring 76 is provided between the fourth circular groove 74 and the fixed shaft 77, so that the curved scraper 73 can be deformed to a certain extent when scraping, thereby avoiding excessive friction and damage to the edge of the integrated circuit board. The constant temperature box 6 can keep the glue in the collection box 63 at a certain temperature to avoid glue coagulation. After the collection box 63 collects a certain amount of glue, the collection box 63 can be drawn out of the constant temperature box 6, and the glue can be refilled into the glue storage barrel 32 through the feeding port on the glue storage barrel 32, thereby realizing the recycling of glue.

[0042] The device is equipped with a constant temperature box 6, a collection box 63 and a curved scraper 73. The collection box 63 can collect excess glue dripping from the integrated circuit board and the overflow glue scraped by the curved scraper 73. The constant temperature box 6 can ensure that the glue in the collection box 63 maintains a certain temperature to prevent the glue from condensing, thereby realizing the recycling of the glue and avoiding the waste of glue.

[0043] The embodiments of the present invention are presented for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application and to enable those skilled in the art to understand the invention and design various embodiments with various modifications as suited for specific applications.

Claims

1. An integrated circuit production and processing device, comprising a base (1), characterized in that: The base (1) is provided with a positioning mechanism for facilitating fixing of the integrated circuit board, the base (1) is provided with a gluing mechanism for facilitating gluing and packaging, and the base (1) is provided with a collecting mechanism for facilitating recovery of the colloid; The positioning mechanism includes a vertical rod (4), the glue coating mechanism includes a bracket (2), a first T-shaped slider (3), a glue storage barrel (32) and a valve plate (35), the collecting mechanism includes a constant temperature box (6), a collecting box (63), a second motor (66), an arc-shaped slide bar (7) and an arc-shaped scraper (73), the bracket (2) is fixedly mounted on both side ends of the base (1), the upper ends of the two brackets (2) are fixedly mounted with a same cross bar (21), the upper ends of the two cross bars (21) are penetrated by a first rectangular groove (22), the first T-shaped slider (3) is penetrated and slidably mounted in the first rectangular groove (22), and the glue storage barrel (32) is fixedly mounted on the first T-shaped slider (3). The lower end portion of the vertical rod (4) is two, and both side ends of the two vertical rods (4) are fixedly installed with a mounting plate (41), and the side end portion of each mounting plate (41) is provided with a T-shaped slide (42), and the inner side wall of each T-shaped slide (42) is slidably installed with a third T-shaped slider (48), and the inner side wall of each T-shaped slide (42) is also slidably installed with a fourth T-shaped slider (5), and the thermostatic box (6) is fixedly installed on the upper end portion of the base (1), and the upper end portion of the thermostatic box (6) is fixedly installed with a collecting bucket (61), and the side end portion of the thermostatic box (6) is fixedly installed with two fixed blocks (64), and the arc-shaped slide rod (7) is located between the two fixed blocks (64); The first rectangular groove (22) is provided with a first circular groove (23) at both ends thereof, and the inner side walls of the two first circular grooves (23) are rotatably mounted with the same first reciprocating screw (25). The side end of the cross bar (21) is fixedly mounted with a first motor (24), and the first reciprocating screw (25) is fixedly mounted on the output end of the first motor (24). The side end of the first T-shaped slider (3) is provided with a first threaded groove (31), and the first reciprocating screw (25) is threadedly rotatably mounted on the inner side wall of the first threaded groove (31). The glue storage barrel (32) is provided with a first reciprocating screw (25). A valve (33) is fixedly mounted on the lower end portion, a bellows (34) is fixedly mounted on the lower end portion of the valve (33), a valve plate (35) is provided on the inner side wall of the valve (33), a fixed tube (39) is also fixedly mounted on the circumferential end portion of the valve (33), a circular shaft (37) is fixedly mounted on the side end portion of the valve plate (35), the circular shaft (37) penetrates and is rotatably mounted on the inner side wall of the fixed tube (39), a first torsion spring (36) is fixedly mounted between the circular shaft (37) and the fixed tube (39), and a movable rod (38) is fixedly mounted on the side end portion of the circular shaft (37); The side ends of the two vertical rods (4) are penetrated with a second circular groove (43), the inner side walls of the two second circular grooves (43) are penetrated with a double-headed screw (49) for rotational installation, the upper end of each mounting plate (41) is penetrated with a second rectangular groove (45), the upper end of each third T-shaped slider (48) is fixedly installed with a second T-shaped slider (47), each second T-shaped slider (47) is penetrated and slidably installed on the inner side wall of the second rectangular groove (45), the side end of each second T-shaped slider (47) is penetrated with a second threaded groove (46), the two double-headed screws (49) are threaded and rotated A spring (51) is fixedly mounted on the inner side wall of each second thread groove (46), and a slide plate (52) is fixedly mounted on the side end of each fourth T-shaped slide plate (5), and a clamping plate (53) is fixedly mounted on the side end of each slide plate (52). The clamping plates (53) on the two vertical rods (4) face oppositely, and the upper ends of the two slide plates (52) on one side of the glue storage barrel (32) are fixedly mounted with a push rod (54), and the upper ends of the two push rods (54) are fixedly mounted with the same arc-shaped telescopic rod (55); The side end of the constant temperature box (6) is provided with a side groove (62), the inner wall of the side groove (62) is provided with a collecting box (63), the same second reciprocating screw (65) is rotatably installed between the two fixed blocks (64), the side end of the fixed block (64) is fixedly provided with a second motor (66), the second reciprocating screw (65) is fixedly provided at the output end of the second motor (66), and the same reciprocating screw (65) is also fixedly provided between the two fixed blocks (64). A limiting rod (67), a side end portion of the arc-shaped slide rod (7) is penetrated by a third thread groove (71) and a third circular groove (72), the second reciprocating screw rod (65) is threadedly mounted on the inner side wall of the third thread groove (71), the arc-shaped slide rod (7) is slidably mounted on the circumferential end portion of the limiting rod (67) through the third circular groove (72), a fixed shaft (77) is fixedly mounted on the side end portion of the arc-shaped slide rod (7), and a curved scraper (73) is further provided on one side of the arc-shaped slide rod (7); Wherein, both side ends of the arc scraper (73) are provided with a rubber guide groove (75), and the side end of the arc scraper (73) is penetrated by a fourth circular groove (74). The arc scraper (73) is rotatably mounted on the circumferential end of the fixed shaft (77) through the fourth circular groove (74), and a second torsion spring (76) is fixedly mounted between the fixed shaft (77) and the fourth circular groove (74).

2. The integrated circuit production and processing equipment according to claim 1, characterized in that: An L-shaped side rod (11) is fixedly mounted on the side end of the base (1), a bracket (2) is fixedly mounted on the side end of the L-shaped side rod (11), the vertical rod (4) located on one side of the L-shaped side rod (11) is fixedly mounted on the side end of the bracket (2), and the vertical rod (4) located away from the L-shaped side rod (11) is fixedly mounted on the upper end of the base (1).

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