Primary and secondary ring wafer centering mechanism

Abstract

The invention belongs to the technical field of child-mother ring wafer positioning technology, and discloses a child-mother ring wafer centering mechanism, which comprises a bottom plate, a centering mechanism and a rotating mechanism are arranged on the bottom plate, and an edge searching positioning assembly is arranged on the bottom plate above the centering mechanism; the edge searching positioning assembly extends towards the rotating mechanism, and the rotating mechanism is located under the edge searching positioning assembly. The centering mechanism comprises a lifting air cylinder vertically connected to the bottom plate, a piston rod at the top of the lifting air cylinder is connected with a connecting base, a clamping air cylinder is arranged at the top of the connecting base, and positioning plates are symmetrically arranged on the clamping air cylinder through clamping fingers; through close cooperation and cooperative work of all the function modules, the automatic production process can be achieved, manual intervention is reduced, the production efficiency and the product quality are improved, the production requirements of different process stages are met, and higher economic benefits and competitiveness are brought to semiconductor manufacturing enterprises.

Description

Technical Field

[0001] The present application relates to the technical field of mother-and-child ring wafer positioning technology, and more specifically, to a mother-and-child ring wafer centering mechanism. Background Art

[0002] In the semiconductor industry, both mother-and-child ring wafers need to be oriented and centered for precise alignment and transfer during the manufacturing process.

[0003] According to the different requirements of wafers in the manufacturing process stages and the differences in wafer manufacturing process plans, the mother-and-child ring wafers require unique dedicated equipment during the transmission process to facilitate the production and manufacturing of the mother-and-child ring wafers at each process stage. Therefore, a dedicated positioning and centering equipment is required.

[0004] To this end, the present application proposes a mother-and-child ring wafer alignment mechanism to solve the above-mentioned problems.

[0005] Application Contents

[0006] In order to solve the above problems, the present application provides a mother-and-child ring wafer alignment mechanism.

[0007] The present application provides a mother-and-child ring wafer alignment mechanism that adopts the following technical solution:

[0008] A mother-and-child ring wafer centering mechanism, comprising:

[0009] A bottom plate, wherein a centering mechanism and a rotating mechanism are arranged on the bottom plate, and an edge-finding positioning assembly is arranged on the bottom plate above the centering mechanism; the edge-finding positioning assembly extends toward the rotating mechanism, and the rotating mechanism is located directly below the edge-finding positioning assembly;

[0010] The centering mechanism comprises a lifting cylinder vertically connected to the bottom plate, a piston rod at the top of the lifting cylinder is connected to a connecting seat, a clamping cylinder is arranged on the top of the connecting seat, and the clamping cylinder is symmetrically provided with a positioning plate through a clamping finger; a positioning sleeve is symmetrically provided on the arc segment of the positioning plate;

[0011] The rotating mechanism comprises a support plate 1 vertically symmetrically arranged on the bottom plate, a hollow rotating platform is arranged on the top of the support plate 1, a servo motor is arranged in the interval between adjacent support plates 1 and the output shaft passes through the central control rotating platform, and a vacuum suction cup is arranged on the top of the output shaft of the servo motor;

[0012] The edge-finding and positioning assembly includes a support plate 2 symmetrically arranged on the bottom plate, and the positioning mechanism is located within the spacing between the adjacent support plates 2; the edge-finding and positioning assembly is arranged on the upper half of the support plate 2; so the support plate 2 is respectively provided with a camera connecting plate and a barcode scanner fixing plate, and the camera connecting plate from top to bottom;

[0013] The camera connecting plate is symmetrically designed, and a camera fixing plate is further provided between adjacent camera connecting plates, and the camera fixing plate is provided with a lens fixing block, and a camera and a camera anti-rotation plate are respectively provided on the top and side of the lens fixing block, and the camera is also connected to the camera anti-rotation plate at the same time; a lens is connected to the bottom of the lens fixing block, and the camera is connected to the lens through the lens fixing block;

[0014] The barcode scanner fixing plate is provided with a barcode scanner.

[0015] Furthermore, the lifting cylinder and the clamping cylinder are respectively connected to a speed regulating valve 1 and a speed regulating valve 2, and the speed regulating valve 1 and the speed regulating valve 2 are both push-lock type speed regulating valves.

[0016] Through the above technical solution, the movement speed of the cylinder can be accurately controlled, so that when the wafer is centered, the movement speed of the cylinder can be flexibly adjusted according to the actual situation to avoid impact or damage to the wafer due to excessive speed, and to prevent the production efficiency from being affected by too slow speed. By accurately controlling the movement speed of the cylinder, the stability and accuracy of the centering operation are improved, ensuring that the position accuracy of the wafer during the centering process reaches a higher standard, laying a good foundation for subsequent processing technology.

[0017] Furthermore, the positioning plate is divided into a straight section and an arc section, and the arc sections of adjacent positioning plates are concentric circles; the straight section is fixedly connected to the fingers of the clamping cylinder, and the positioning sleeves are symmetrically arranged on the arc section of the positioning plate.

[0018] Through the above technical solution, the arc segment design of the concentric circles can better adapt to the circular shape of the wafer, making the positioning more closely fit the edge of the wafer and improving the accuracy of positioning. The setting of the positioning sleeve further enhances the fixing effect of the wafer, preventing the wafer from sliding or shifting during the centering process, ensuring that the wafer always remains in the correct position, thereby improving the positioning accuracy and providing precise positioning support for subsequent processing technology.

[0019] Furthermore, the vacuum suction cup is provided with two, namely a lower vacuum suction cup and an upper vacuum suction cup. The lower vacuum suction cup is fixedly connected to the output shaft of the servo motor, and a vacuum rotary joint is provided on the lower vacuum suction cup; the upper vacuum suction cup is connected to the upper surface of the lower vacuum suction cup; the upper vacuum suction cup is used to place the letter ring wafer.

[0020] Through the above technical solution, this structural design allows the wafer to be firmly adsorbed on the suction cup during rotation, and will not deviate or fall off due to the centrifugal force generated by the rotation. The setting of the vacuum rotary joint ensures the stable transmission of negative pressure, ensuring that the wafer always remains in an adsorbed state during the entire rotation process, ensuring the safety of the processing process, and avoiding equipment damage or product quality problems caused by wafer falling off.

[0021] Furthermore, a circle of air holes is provided on the upper surface of the upper vacuum suction cup, and the air holes are used to absorb the blue film of the letter ring wafer.

[0022] Through the above technical solution, the blue film plays a role in protecting the wafer surface during wafer processing. The adsorption of the blue film by the pores can ensure that the wafer remains stable during various operations and will not be separated from the wafer due to external forces. This design not only improves the fixation stability of the wafer, but also protects the surface quality of the wafer, reduces possible scratches or damage during processing, and ensures that the quality of the wafer meets the high standards of semiconductor manufacturing requirements.

[0023] Furthermore, the outer sides of the support plate 1 and the support plate 2 are respectively provided with a support block 1 and a support block 2 which form a T-shaped structure with themselves.

[0024] Through the above technical solution, the support blocks outside the support plates 1 and 2 enhance the structural stability of the equipment. The support blocks and the support plates form a T-shaped structure, which greatly improves the strength and rigidity of the support plates, allowing the equipment to withstand greater external forces and vibrations during operation. This enhanced structural stability improves the durability and reliability of the equipment, reduces the deformation or damage that may occur during long-term use of the equipment, reduces the maintenance cost of the equipment, and extends the service life of the equipment, providing semiconductor manufacturing companies with more stable and reliable production equipment.

[0025] Furthermore, a side plate connecting plate is connected to the top of the adjacent support plate 2, and the side plate connecting plate is used to strengthen the overall structure of the support plate 2.

[0026] Through the above technical solution, the side panel connecting plate strengthens the overall structure of the support plate 2 and reduces the vibration of the equipment during operation. The setting of the side panel connecting plate makes the various parts of the support plate 2 more tightly connected, forming a more stable overall structure. During the operation of the equipment, this strengthened structure can effectively reduce the transmission of vibration, reduce the impact of vibration on precision components such as cameras and barcode scanners, and improve the accuracy of positioning and detection. At the same time, reducing vibration can also reduce the noise during equipment operation, improve the working environment, and improve the working comfort of operators.

[0027] Furthermore, a light source fixing plate is symmetrically arranged on the connecting plate 2 below the barcode scanner fixing plate, a light source is fixedly arranged on the light source fixing plate, the light source is a ring-shaped light source with a hollow structure in the middle, and the vertical position of the lens is located within the hollow range of the light source.

[0028] Through the above technical solution, the ring light source and the specific setting method provide good lighting conditions for the camera. The hollow structure in the middle of the ring light source allows the vertical position of the lens to be located in it. This design can provide uniform and stable lighting for the camera, ensuring the accuracy and clarity of code scanning and camera positioning. Good lighting conditions can enable the camera to capture the barcode and feature points on the wafer more clearly, improve the success rate of code scanning and the accuracy of camera positioning, and provide accurate information for the industrial computer, thereby achieving more precise wafer centering operations and processing control.

[0029] Furthermore, a sensor fixing bracket is provided on any one of the support plates, and a sensor body is provided on the sensor fixing bracket; the sensor body is electrically connected to the camera, the lifting cylinder, the clamping cylinder, and the barcode scanner.

[0030] Through the above technical solution, the setting of sensors realizes the electronic control connection and real-time monitoring of various components, improving the automation of the equipment and the convenience of operation. The sensor can sense the position, status and operation of each component of the wafer in real time, and transmit this information to the industrial computer for processing. Through the electronic control connection, the industrial computer can automatically control the various components of the equipment according to the feedback information of the sensor, realize automatic centering, rotation, code scanning and positioning, reduce the need for manual intervention, and improve the automation of the equipment. At the same time, the real-time monitoring function allows operators to understand the operating status of the equipment at any time, discover and solve problems in time, and improve the convenience and safety of operation.

[0031] Furthermore, the head end and the tail end of the arc segment of each positioning plate are rotatably provided with bearings, and the positioning sleeve is sleeved on the bearings.

[0032] Through the above technical solution, the bearings at the ends of the arc segment of the positioning plate and the positioning sleeves mounted on the bearings make the wafer alignment process smoother. The setting of the bearings reduces the friction between the positioning sleeve and the wafer, allowing the wafer to move and adjust its position more smoothly during the alignment process. This design not only reduces the wear on the wafer, but also improves the speed and efficiency of the alignment operation; at the same time, the rotation of the positioning sleeve on the bearing is more flexible, which can better adapt to the shape changes of the wafer and improve the accuracy and stability of positioning.

[0033] In summary, the present application includes at least one of the following beneficial technical effects:

[0034] The mother-and-child ring wafer alignment mechanism of this application integrates multiple functions such as alignment, rotation, positioning, and detection, providing a comprehensive solution for the semiconductor manufacturing process. This highly integrated design not only improves the processing accuracy and efficiency of wafers in the semiconductor manufacturing process, but also reduces the number of equipment and floor space, and reduces the company's equipment investment costs. At the same time, the close cooperation and collaborative work between the various functional modules can realize automated production processes, reduce manual intervention, improve production efficiency and product quality, meet the production needs of different process stages, and bring higher economic benefits and competitiveness to semiconductor manufacturing companies. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of the structure of this application;

[0036] Figure 2 It is a structural schematic diagram of the edge-finding and positioning component;

[0037] Figure 3 It is a structural schematic diagram of the rotating mechanism;

[0038] Figure 4 It is a structural diagram of the centering mechanism.

[0039] Description of the numbers in the figure:

[0040] 1. Bottom plate;

[0041] 2. Edge-finding and positioning assembly; 201. Support plate 2; 202. Light source fixing plate; 203. Barcode scanner fixing plate; 204. Camera connecting plate; 205. Camera fixing plate; 206. Lens fixing block; 207. Side plate connecting plate; 208. Camera anti-rotation plate; 209. Support block 2; 210. Lens; 211. Camera; 212. Light source; 213. Barcode scanner;

[0042] 3. Rotating mechanism; 301. Support plate 1; 302. Lower vacuum suction cup; 303. Upper vacuum suction cup; 304. Support block 1; 305. Servo motor; 306. Hollow rotating table; 307. Vacuum rotary joint;

[0043] 4. Centering mechanism; 401. Lifting cylinder; 402. Connecting seat; 403. Clamping cylinder; 404. Positioning plate; 405. Positioning sleeve; 406. Bearing; 407. Speed ​​regulating valve 2; 408. Speed ​​regulating valve 1;

[0044] 5. Sensor fixing bracket; 6. Sensor body. DETAILED DESCRIPTION

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application; it is obvious that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0046] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0047] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] Example:

[0049] The following is combined with Figure 1 -4 Provide further details on this application.

[0050] The embodiment of the present application discloses a mother-child ring wafer centering mechanism 4, comprising:

[0051] A bottom plate 1 is provided with a centering mechanism 4 and a rotating mechanism 3, and an edge-finding and positioning assembly 2 is provided on the bottom plate 1 above the centering mechanism 4; the edge-finding and positioning assembly 2 extends toward the rotating mechanism 3, and the rotating mechanism 3 is located directly below the edge-finding and positioning assembly 2;

[0052] The centering mechanism 4 includes a lifting cylinder 401 vertically connected to the bottom plate 1, a piston rod at the top of the lifting cylinder 401 is connected to a connecting seat 402, a clamping cylinder 403 is arranged on the top of the connecting seat 402, and the clamping cylinder 403 is symmetrically provided with a positioning plate 404 through a clamping finger; a positioning sleeve 405 is symmetrically arranged on the arc segment of the positioning plate 404;

[0053] The rotating mechanism 3 includes a supporting plate 301 vertically symmetrically arranged on the bottom plate 1, a hollow rotating platform 306 is arranged on the top of the supporting plate 301, a servo motor 305 is arranged in the interval between adjacent supporting plates 301, and the output shaft passes through the central control rotating platform, and a vacuum suction cup is arranged on the top of the output shaft of the servo motor 305;

[0054] The edge-finding and positioning assembly 2 includes a support plate 201 symmetrically arranged on the bottom plate 1, and the positioning mechanism is located in the spacing between adjacent support plates 201; the edge-finding and positioning assembly 2 is arranged on the upper half of the support plate 201; so the support plate 201 is respectively provided with a camera connecting plate 204 and a barcode scanner fixing plate 203 and a camera connecting plate 204 from top to bottom;

[0055] The camera connecting plate 204 is symmetrically designed. A camera fixing plate 205 is further provided between adjacent camera connecting plates 204. The camera fixing plate 205 is provided with a lens fixing block 206. The top and side of the lens fixing block 206 are respectively provided with a camera 211 and a camera anti-rotation plate 208. The camera 211 is also connected to the camera anti-rotation plate 208. The bottom of the lens fixing block 206 is connected to a lens 210. The camera 211 is connected to the lens 210 through the lens fixing block 206.

[0056] A barcode scanner 213 is disposed on the barcode scanner fixing plate 203 .

[0057] See also Figure 1 and Figure 4 The lifting cylinder 401 and the clamping cylinder are connected to a speed regulating valve 1 408 and a speed regulating valve 2 407 respectively. Both the speed regulating valve 1 408 and the speed regulating valve 2 407 are push-lock type speed regulating valves. The cylinder movement speed can be precisely controlled, so that when the wafer is centered, the cylinder movement speed can be flexibly adjusted according to the actual situation to avoid impact or damage to the wafer due to excessive speed, and to prevent the production efficiency from being affected by too slow speed. By precisely controlling the cylinder movement speed, the stability and accuracy of the centering operation are improved, ensuring that the position accuracy of the wafer during the centering process reaches a higher standard, laying a good foundation for subsequent processing technology.

[0058] See also Figure 1 and Figure 4, the positioning plate 404 is divided into a straight section and an arc section, and the arc sections of adjacent positioning plates 404 are concentric circles; the straight section is fixedly connected to the fingers of the clamping cylinder 403, and the positioning sleeve 405 is symmetrically arranged on the arc section of the positioning plate 404; the concentric arc section design can better adapt to the circular shape of the wafer, so that the positioning is more closely aligned with the edge of the wafer, and the positioning accuracy is improved. The setting of the positioning sleeve 405 further enhances the fixing effect on the wafer, prevents the wafer from sliding or shifting during the centering process, and ensures that the wafer always remains in the correct position, thereby improving the positioning accuracy and providing accurate positioning support for subsequent processing technology.

[0059] See also Figure 1 and Figure 3 There are two vacuum suction cups, namely a lower vacuum suction cup 302 and an upper vacuum suction cup 303. The lower vacuum suction cup 302 is fixedly connected to the output shaft of the servo motor 305, and a vacuum rotary joint 307 is connected to the lower vacuum suction cup 302; the upper vacuum suction cup 303 is connected to the upper surface of the lower vacuum suction cup 302; the upper vacuum suction cup 303 is used to place the letter ring wafer.

[0060] See also Figure 1 and Figure 3 The upper surface of the upper vacuum chuck 303 is provided with a circle of air holes, which are used to absorb the blue film of the letter ring wafer; the blue film plays a role in protecting the wafer surface during wafer processing, and the adsorption of the blue film by the air holes can ensure that the wafer remains stable during various operations, and the blue film will not be separated from the wafer due to external forces. This design not only improves the fixing stability of the wafer, but also protects the surface quality of the wafer, reduces possible scratches or damage during processing, and ensures that the quality of the wafer meets the high standards of semiconductor manufacturing requirements.

[0061] See also Figure 1 and Figure 3 , the outer sides of the support plate 1 301 and the support plate 2 201 are respectively provided with support blocks 1 304 and support blocks 2 209 that form a T-shaped structure with themselves; the support blocks on the outer sides of the support plate 1 301 and the support plate 2 201 enhance the structural stability of the equipment. The support blocks and the support plates form a T-shaped structure, which greatly improves the strength and rigidity of the support plates, allowing the equipment to withstand greater external forces and vibrations during operation. This enhanced structural stability improves the durability and reliability of the equipment, reduces the deformation or damage that may occur in the equipment during long-term use, reduces the maintenance cost of the equipment, and extends the service life of the equipment, providing semiconductor manufacturing companies with more stable and reliable production equipment.

[0062] See also Figure 1 and Figure 2, the top of the adjacent support plate 201 is connected with a side plate connecting plate 207, and the side plate connecting plate 207 is used to strengthen the overall structure of the support plate 201; the side plate connecting plate 207 strengthens the overall structure of the support plate 201 and reduces the vibration of the equipment during operation. The setting of the side plate connecting plate 207 makes the various parts of the support plate 201 more closely connected, forming a more stable overall structure. During the operation of the equipment, this strengthened structure can effectively reduce the transmission of vibration, reduce the impact of vibration on precision components such as the camera 211 and the barcode scanner 213, and improve the accuracy of positioning and detection. At the same time, reducing vibration can also reduce the noise during the operation of the equipment, improve the working environment, and improve the working comfort of the operator.

[0063] See also Figure 1 and Figure 2 , a light source fixing plate 202 is symmetrically arranged on the connecting plate 2 below the barcode scanner fixing plate 203, and a light source 212 is fixedly arranged on the light source fixing plate 202. The light source 212 is an annular light source with a hollow structure in the middle, and the vertical position of the lens 210 is located within the hollow range of the light source 212; the annular light source 212 and the specific setting method provide good lighting conditions for the camera 211. The middle hollow structure of the annular light source 212 allows the vertical position of the lens 210 to be located therein. This design can provide uniform and stable lighting for the camera 211, ensuring the accuracy and clarity of the barcode scanning and the positioning of the camera 211. Good lighting conditions can enable the camera 211 to more clearly capture the barcode and feature points on the wafer, improve the success rate of the barcode scanning and the accuracy of the positioning of the camera 211, and provide accurate information for the industrial computer, thereby achieving more precise wafer centering operations and processing control.

[0064] See also Figure 1 and Figure 3 , a sensor fixing bracket 5 is provided on any support plate 301, and a sensor body 6 is provided on the sensor fixing bracket 5; the sensor body 6 is electrically connected to the camera 211, the lifting cylinder 401, the clamping cylinder 403, and the barcode scanner 213; the setting of the sensor realizes the electrical control connection and real-time monitoring of each component, improving the automation degree of the equipment and the convenience of operation. The sensor can sense the position, state and operation status of each component of the wafer in real time, and transmit this information to the industrial computer for processing. Through the electrical control connection, the industrial computer can automatically control the various components of the equipment according to the feedback information of the sensor, realize automatic centering, rotation, barcode scanning and positioning operations, reduce the need for manual intervention, and improve the automation degree of the equipment. At the same time, the real-time monitoring function allows the operator to understand the operating status of the equipment at any time, discover and solve problems in time, and improve the convenience and safety of operation.

[0065] See also Figure 1 and Figure 4, the beginning and the end of the arc segment of each positioning plate 404 are rotatably provided with bearings 406, and the positioning sleeve 405 is sleeved on the bearing 406; the bearings 406 at the beginning and the end of the arc segment of the positioning plate 404 and the positioning sleeve 405 sleeved on the bearing 406 make the wafer smoother during the centering process. The setting of the bearing 406 reduces the friction between the positioning sleeve 405 and the wafer, so that the wafer can move and adjust its position more smoothly during the centering process. This design not only reduces the wear on the wafer, but also improves the speed and efficiency of the centering operation; at the same time, the rotation of the positioning sleeve 405 on the bearing 406 is more flexible, which can better adapt to the shape changes of the wafer and improve the accuracy and stability of positioning.

[0066] The implementation principle of a mother-and-child ring wafer alignment mechanism in the embodiment of the present application is as follows:

[0067] When the mother-and-child ring wafer is placed on the rotating mechanism 3, the sensor 6 detects the presence of the mother-and-child ring wafer, and the industrial computer issues a command to make the lifting cylinder 401 of the centering mechanism 4 rise;

[0068] After the lifting cylinder 401 is in place, the industrial computer issues a centering command to the clamping cylinder 403. Under the action of the clamping cylinder 403, the position of the mother-and-child ring wafer is centered relative to the rotating mechanism 3. After the centering action is in place, the negative pressure control solenoid valve of the rotating mechanism 3 is energized, and the negative pressure enters the lower vacuum suction cup 302 and the upper vacuum suction cup 303 through the vacuum rotary joint 307. Under the action of the negative pressure, the mother-and-child ring wafer is sucked;

[0069] After detecting that the wafer is sucked, the clamping cylinder 403 is fed with air through the push-lock type speed regulating valve 407 on the other side, and the clamping cylinder 403 is opened from the centered state to the released state;

[0070] Next, positive pressure gas enters from the push-lock type speed regulating valve 408 on the other side of the lifting cylinder 401, and the lifting cylinder 401 returns to its initial state;

[0071] After the above actions are completed, the rotating mechanism 3 is connected to the hollow rotating table 306 under the drive of the motor to drive the mother-and-child ring wafer to rotate. At the same time, the barcode scanner 213 on the edge-finding and positioning component 2 starts to work. When the mother-and-child ring wafer rotates until the barcode appears in the field of view of the barcode scanner 213, it starts scanning the barcode and the data is transmitted to the industrial computer;

[0072] Next, the industrial computer issues the next instruction, and the camera 211 starts to work. When it rotates to a suitable position, the camera positioning is completed;

[0073] The industrial computer further issues instructions to the robot to take the wafer. When the robot clamps the mother-and-child ring wafer, the vacuum negative pressure is disconnected, the robot takes the wafer away, and the entire component action is completed.

[0074] The electronic control technologies such as industrial computers mentioned in this application are all public and mature technologies in the field and will not be described in detail in the application.

[0075] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A mother-and-child ring wafer centering mechanism (4), characterized in that: include: A base plate (1), wherein a centering mechanism (4) and a rotating mechanism (3) are arranged on the base plate (1); an edge-finding positioning component (2) is arranged on the base plate (1) above the centering mechanism (4); the edge-finding positioning component (2) extends in the direction of the rotating mechanism (3), and the rotating mechanism (3) is located directly below the edge-finding positioning component (2); The centering mechanism (4) comprises a lifting cylinder (401) vertically connected to the base plate (1); a piston rod at the top of the lifting cylinder (401) is connected to a connecting seat (402); a clamping cylinder (403) is arranged on the top of the connecting seat (402); and a positioning plate (404) is symmetrically arranged on the clamping cylinder (403) through clamping fingers; and a positioning sleeve (405) is symmetrically arranged on the arc segment of the positioning plate (404); The rotating mechanism (3) comprises a support plate (301) vertically symmetrically arranged on the bottom plate (1), a hollow rotating platform (306) is arranged on the top of the support plate (301), a servo motor (305) is arranged in the interval between adjacent support plates (301) and the output shaft passes through the central control rotating platform, and a vacuum suction cup is arranged on the top of the output shaft of the servo motor (305); The edge-finding and positioning assembly (2) comprises a second support plate (201) symmetrically arranged on the bottom plate (1), and the positioning mechanism is located within the spacing between adjacent second support plates (201); the edge-finding and positioning assembly (2) is arranged on the upper half of the second support plate (201); so the second support plate (201) is respectively provided with a camera connecting plate (204) and a barcode scanner fixing plate (203) from top to bottom. The camera connection plate (204) is of symmetrical design, a camera fixing plate (205) is further arranged between adjacent camera connection plates (204), the camera fixing plate (205) is provided with a lens fixing block (206), a camera (211) and a camera anti-rotation plate (208) are respectively arranged on the top and side of the lens fixing block (206), and the camera (211) is also connected to the camera anti-rotation plate (208); a lens (210) is connected to the bottom of the lens fixing block (206), and the camera (211) is connected to the lens (210) via the lens fixing block (206); The code scanner fixing plate (203) is provided with a code scanner (213).

2. The mother-child ring wafer centering mechanism according to claim 1, characterized in that: The lifting cylinder (401) and the clamping cylinder are respectively connected to a speed regulating valve 1 (408) and a speed regulating valve 2 (407), and the speed regulating valve 1 (408) and the speed regulating valve 2 (407) are both push-lock type speed regulating valves.

3. The mother-child ring wafer centering mechanism according to claim 1, characterized in that: The positioning plate (404) is divided into a straight section and an arc section, and the arc sections of adjacent positioning plates (404) are concentric circles; the straight section is fixedly connected to the fingers of the clamping cylinder (403), and the positioning sleeve (405) is symmetrically arranged on the arc section of the positioning plate (404).

4. The mother-child ring wafer centering mechanism according to claim 1, characterized in that: The vacuum suction cup is provided with two, namely a lower vacuum suction cup (302) and an upper vacuum suction cup (303); the lower vacuum suction cup (302) is fixedly connected to the output shaft of the servo motor (305); a vacuum rotary joint (307) is provided on the lower vacuum suction cup (302); the upper vacuum suction cup (303) is connected to the upper surface of the lower vacuum suction cup (302); the upper vacuum suction cup (303) is used to place the letter ring wafer.

5. The mother-and-child ring wafer centering mechanism according to claim 4, characterized in that: A circle of air holes is provided on the upper surface of the upper vacuum suction cup (303), and the air holes are used to absorb the blue film of the letter ring wafer.

6. The mother-child ring wafer centering mechanism according to claim 1, characterized in that: The outer sides of the support plate 1 (301) and the support plate 2 (201) are respectively provided with a support block 1 (304) and a support block 2 (209) forming a T-shaped structure with themselves.

7. The mother-and-child ring wafer centering mechanism according to claim 1, characterized in that: A side plate connecting plate (207) is connected to the top of the adjacent support plate 2 (201), and the side plate connecting plate (207) is used to strengthen the overall structure of the support plate 2 (201).

8. The mother-and-child ring wafer centering mechanism according to claim 1, characterized in that: A light source fixing plate (202) is symmetrically arranged on the second connecting plate below the barcode scanner fixing plate (203), a light source (212) is fixedly arranged on the light source fixing plate (202), the light source (212) is a ring-shaped light source (212) with a hollow structure in the middle, and the vertical position of the lens (210) is located within the hollow range of the light source (212).

9. The mother-and-child ring wafer centering mechanism according to claim 1, characterized in that: A sensor fixing bracket (5) is provided on any one of the support plates (301), and a sensor body (6) is provided on the sensor fixing bracket (5); the sensor body (6) is electrically connected to the camera (211), the lifting cylinder (401), the clamping cylinder (403), and the barcode scanner (213).

10. The mother-and-child ring wafer centering mechanism according to claim 1, characterized in that: The head end and the tail end of the arc segment of each positioning plate (404) are rotatably provided with bearings (406), and the positioning sleeve (405) is sleeved on the bearings (406).

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